MPX4250 NXP | Alldatasheet

Document overview

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  • PDF pages: 9

Technical content

Features

  • Differential and Gauge Applications Available
  • 1.4% Maximum Error Over 0 ° to 85°C
  • Patented Silicon Shear Stress Strain Gauge
  • Temperature Compensated Over –40 ° to +125°C
  • Offers Reduction in Weight and Volume Compared to Existing Hybrid Modules
  • Durable Epoxy Unibody Element

ORDERING INFORMATION

No. # of Ports Pressure Type Device MarkingNone Single Dual Gauge Differential Absolute Unibody Package (MPX4250 Series) MPX4250D Tray 867 • • MPX4250D MPX4250GP Tray 867B • • MPX4250GP MPX4250DP Tray 867C • • MPX4250DP MPX4250 Series 0 to 250 kPa (0 to 36.3 psi) 0.2 to 4.9 V Output MPX4250D CASE 867 UNIBODY PACKAGES MPX4250DP CASE 867C MPX4250GP CASE 867B Application Examples

  • Ideally Suited for Microprocessor or Microcontroller-Based Systems

2 Freescale Semiconductor

Table 1. Operating Characteristics (VS = 5.1 Vdc, TA = 25°C unless otherwise noted, P1 > P2.

  1. 1.0 kPa (kiloPascal) equals 0.145 psi.
  2. Device is ratiometric within this specified excitation range.
  3. Offset (V off) is defined as the output voltage at the minimum rated pressure.
  4. Full Scale Output (V FSO) is defined as the output voltage at the maximum or full rated pressure.
  5. Full Scale Span (V FSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
  6. Accuracy (error budget) consists of the following:

Linearity: Output deviation from a stra ight line relationship with pressure over the specified pressure range. and from the minimum or maximum operating temperature points, with zero differential pressure applied. minimum or maximum rated pressure, at 25°C. TcSpan: Output deviation over the temperature range of 0 to 85 °C, relative to 25°C. TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C. Variation from Nominal: The variation from nominal values , for Offset or Full Scale Span, as a percent of VFSS, at 25°C.

  1. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a

specified step change in pressure.

  1. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.
  2. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.

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information regarding media compatibility in your application. of a microprocessor or microcontroller. Figure 2. Cross Sectional Diagram (not to scale) Figure 3. Recommended Power Supply Decoupling and Output Filtering Figure 4. Output versus Absolute Pressure

Nominal Transfer Value: Vout = VS x (0.00369 x P + 0.04) ± (Pressure Error x Temp. Factor x 0.00369 x VS) VS = 5.1 ± 0.25 Vdc Transfer Function (MPX4250) Temp Multiplier –40 3 0 to 85 1 +125 3 Temperature in °C 4.0 3.0 2.0 0.0 1.0 –40 –20 0 20 40 60 14012010080 Temperature Error Factor NOTE: The Temperature Multiplier is a linear response from 0°C to –40°C and from 85°C to 125°C. Temperature Error Band Pressure (kPa) Pressure Error (Max) Pressure Error Band 0 to 250 kPa ±3.45 kPa 75 100 125 150 175 200 22525 50 250 4.0 3.0 2.0 1.0 –1.0 –2.0 –3.0 –4.0 5.0 Pressure Error (kPa) –5.0

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F G N L R 123456

6 PLD

MAM0.136 (0.005) T POSITIVE PRESSURE (P1) C B M J S -A- STYLE 1: PIN 1. VOUT 2. GROUND 3. VCC 4. V1 5. V2 6. VEX STYLE 3: PIN 1. OPEN 2. GROUND 3. +VOUT 4. +VSUPPL Y 5. -VOUT 6. OPEN STYLE 2: PIN 1. OPEN 2. GROUND 3. -VOUT 4. VSUPPL Y 5. +VOUT 6. OPEN MAX MILLIMETERSINCHES 16.00 13.56 5.59 0.84 1.63 0.100 BSC 2.54 BSC 0.40 18.42 30˚ NOM 30˚ NOM 12.57 11.43 DIM A B C D F G J L M N R S MIN 0.595 0.514 0.200 0.027 0.048 0.014 0.695 0.475 0.430 0.090 MAX 0.630 0.534 0.220 0.033 0.064 0.016 0.725 0.495 0.450 0.105 MIN 15.11 13.06 5.08 0.68 1.22 0.36 17.65 12.07 10.92 2.29 2.66 NOTES: DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). BASIC ELEMENT (D) CASE 867-08 ISSUE N NOTES: DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. CONTROLLING DIMENSION: INCH.R X 123 456 PORT #2 VACUUM (P2) PORT #1 POSITIVE PRESSURE (P1) PORT #1 POSITIVE PRESSURE (P1) PIN 1 PORT #2 VACUUM (P2) SEATING PLANESEATING PLANE -T- -T- P G C J N B F D 6 PL W V L U S K -Q- -A-MQM0.25 (0.010) T MAM0.13 (0.005) STYLE 1: PIN 1. VOUT 2. GROUND 3. VCC 4. V1 5. V2 6. VEX DIM MIN MAX MIN MAX MILLIMETERSINCHES A 1.145 1.175 29.08 29.85 B 0.685 0.715 17.40 18.16 C 0.405 0.435 10.29 11.05 D 0.027 0.033 0.68 0.84 F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC J 0.014 0.016 0.36 0.41 K 0.695 0.725 17.65 18.42 L 0.290 0.300 7.37 7.62 N 0.420 0.440 10.67 11.18 P 0.153 0.159 3.89 4.04 Q 0.153 0.159 3.89 4.04 R 0.063 0.083 1.60 2.11 S U 0.910 BSC 23.11 BSC V 0.182 0.194 4.62 4.93 W 0.310 0.330 7.87 8.38 X 0.248 0.278 6.30 7.06 0.220 0.240 5.59 6.10 PRESSURE AND VACUUM SIDE DUAL PORTED (DP) CASE 867C-05 ISSUE F

PRESSURE SIDE PORTED (GP) CASE 867B-04 ISSUE G

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PRESSURE SIDE PORTED (GP) CASE 867B-04 ISSUE G PAGE 2 OF 2

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