MPX4101A FREESCALE | Alldatasheet

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Technical content

Features

• 1.72% Maximum Error Over 0 ° to 85°C • Specifically Designed for Intake Manifold Absolute Pressure Sensing in Engine Control Systems • Temperature Compensated Over –40 °C to +125°C • Durable Epoxy Unibody Element or Ther moplastic (PPS) Surface Mount Package Typical Applications • Manifold Sensing for Automotive Systems • Ideally Suited for Mi croprocessor or Microcontroller-Based Systems • Also Ideal for Non-Automotive Applications UNIBODY PACKAGE PIN NUMBERS(1) 1. Pins 4, 5, and 6 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead.

1 VOUT 4 N/C

2 GND 5 N/C

3 VS 6 N/C

PIN NUMBERS(1) 1. Pins 1, 5, 6, 7, and 8 are internal dev ice connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead. SUPER SMALL OUTLINE PACKAGE PIN NUMBERS(1)

1 N/C 5 N/C 1 N/C 5 N/C

2 VS 6 N/C 2 VS 6 N/C

3 GND 7 N/C 3 GND 7 N/C

4 VOUT 8 N/C 4 VOUT 8 N/C

ORDERING INFORMATION

Device Type Options Case No. MPX Series Order No. Packing Options Device Marking UNIBODY PACKAGE (MPX4101A SERIES) Basic Element Absolute, Element Only 867 MPX4101A — MPX4101A SMALL OUTLINE PACKAGE (MPXA4101A SERIES) Ported Element Absolute, Axial Port 482A MPXA4101AC6U Rails MPXA4101A SUPER SMALL OUTLINE PACKAGE (MPXA6101A SERIES) Basic Element Absolute, Element Only 1317 MPXH6101A6U Rails MPXH6101A MPX4101A MPXA4101A MPXH6101A SERIES INTEGRATED PRESSURE SENSOR

15 TO 102 kPA

(2.18 TO 14.8 psi) 0.25 TO 4.95 V OUTPUT SMALL OUTLINE PACKAGE MPXA4101AC6U CASE 482A-01 UNIBODY PACKAGE MPX4101A CASE 867-O8 SUPER SMALL OUTLINE PACKAGE MPXH6101A6U/6T1 CASE 1317-04

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Figure 1. Temperature Compensated and Calibrated Pressure Sensor Schematic Table 1. Maximum Ratings(1)

  1. Exposure beyond the specified limits may c ause permanent damage or degradation to the device.

for small outline package devices.

Table 2. Operating Characteristics (VS = 5.1 Vdc, TA = 25°C unless otherwise noted, P1 > P2.

  1. 1.0 kPa (kiloPascal) equals 0.145 psi.
  2. Device is ratiometric within this specified excitation range.
  3. Offset (V off) is defined as the output voltage at the minimum rated pressure.
  4. Full Scale Output (V FSO) is defined as the output voltage at the maximum or full rated pressure.
  5. Full Scale Span (V FSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
  6. Accuracy (error budget) c onsists of the following:

• Linearity: Output deviation from a straight line relations hip with pressure over the specified pressure range. and from the minimum or maximum operating temperature points, with zero differential pressure applied. minimum or maximum rated pressure, at 25°C. • TcSpan: Output deviation over the temperature range of 0 to 85 °C, relative to 25°C. • TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C. • Variation from Nominal: T he variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C.

  1. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a

specified step change in pressure.

  1. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.
  2. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.

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small outline package (Case 1317). information regarding media compatibility in your application. the power supply is recommended. Figure 2. Cross Sectional Diagram SSOP (not to scale) Figure 3. Recommended Power Supply Decoupling and Figure 4. Output versus Absolute Pressure

51 K47 pF

PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluorosilicone gel which protects the die from harsh media. The Freescale pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below: Nominal Transfer Value: Vout = VS (P x 0.01059 - 0.10941) ± (Pressure Error x Temp. Factor x 0.01059 x VS) VS = 5.1 V ± 0.25 Vdc Transfer Function (MPX4101A, MPXA4101A, MPXH6101A) MPX4101A, MPXA4101A MPXH6101A SERIES Temp Multiplier -40 3 0 to 85 1 +125 3 Temperature in °C 4.0 3.0 2.0 0.0 1.0 –40 –20 0 20 40 60 14012010080 Temperature Error Factor NOTE: The Temperature Multiplier is a linear response from 0°C to –40°C and from 85°C to 125°C. Temperature Error Band Error Limits for Pressure3.0 2.0 1.0 –1.0 –2.0 –3.0

0.0 Pressure (in kPa)

Pressure Error (kPa) Pressure Error (Max) Pressure Error Band 15 to 102 (kPa) ±1.5 (kPa) 0 15 30 45 60 75 90 105 120 Part Number Case Type Pressure (P1) Side Identifier MPX4101A 867 Stainless Steel Cap MPXA4101AC6U 482A Side with Port Attached MPXH6101A6U 1317 Stainless Steel Cap MPXH6101A6T1 1317 Stainless Steel Cap

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shorting between solder pads. Figure 5. SOP Footprint (Case 482) Figure 6. SSOP Footprint (Case 1317)

0.060 TYP 8X

0.100 TYP 8X

0.027 TYP 8X

0.053 TYP 8X

H SEATING PLANE -T- W C M J K V DIM MIN MAX MIN MAX MILLIMETERSINCHES A 10.540.4250.415 10.79 B 10.540.4250.415 10.79 C 12.700.5200.500 13.21 D 0.960.0420.038 1.07 G 0.100 BSC 2.54 BSC H 0.002 0.010 0.05 0.25 J 0.009 0.011 0.23 0.28 K 0.061 0.071 1.55 1.80 M 0˚ 7˚ 0˚ 7˚ N 0.444 0.448 11.28 11.38 S 0.709 0.725 18.01 18.41 V 0.245 0.255 6.22 6.48 W 0.115 0.125 2.92 3.17 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT .S D 8 PL G SBM0.25 (0.010) A T -A- -B-N S CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE PIN 1 F G N L R 123456

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MAM0.136 (0.005) T POSITIVE PRESSURE (P1) C B M J S -A- STYLE 1: PIN 1. VOUT 2. GROUND 3. VCC 4. V1 5. V2 6. VEX STYLE 3: PIN 1. OPEN 2. GROUND 3. +VOUT 4. +VSUPPL Y 5. -VOUT 6. OPEN STYLE 2: PIN 1. OPEN 2. GROUND 3. -VOUT 4. VSUPPL Y 5. +VOUT 6. OPEN MAX MILLIMETERSINCHES 16.00 13.56 5.59 0.84 1.63 0.100 BSC 2.54 BSC 0.40 18.42 30˚ NOM 30˚ NOM 12.57 11.43 DIM A B C D F G J L M N R S MIN 0.595 0.514 0.200 0.027 0.048 0.014 0.695 0.475 0.430 0.090 MAX 0.630 0.534 0.220 0.033 0.064 0.016 0.725 0.495 0.450 0.105 MIN 15.11 13.06 5.08 0.68 1.22 0.36 17.65 12.07 10.92 2.29 2.66 NOTES: DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). CASE 867-08 ISSUE N UNIBODY PACKAGE

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Freescale Semiconductor 11 NOTES

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