Sensor

MPX2102A

Motorola, Inc

Sensor

Manufacturer: Motorola, Inc

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WWW.MOTOROLA.COM/SEMICONDUCTORS DL200/D Rev. 5, 01/2003 Sensor Device Data Book Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

This heading on a data sheet indicates that the device is in the formative stages or in design (under development). The disclaimer at the bottom of the first page reads: “This document contains information on a product under develop- ment. Motorola reserves the right to change or discontinue this product without notice.” Advance or Preliminary Information This heading on a data sheet indicates that the device is in sampling, preproduction, or first production stages. The disclaimer at the bottom of the first page reads: “This document contains information on a new product. Specifications and information herein are subject to change without notice.” Fully Released A fully released data sheet contains neither a classification heading nor a disclaimer at the bottom of the first page. This document contains information on a product in full production. Guaranteed limits will not be changed without written notice to your local Motorola Semiconductor Sales Office. MOTOROLA DEVICE CLASSIFICATIONS In an effort to provide up-to-date information to the customer regarding the status of any given device, Motorola has classified all devices into three categories: Preferred devices, Current products and Not Recommended for New Design products. A Preferred type is a device which is recommended as a first choice for future use. These devices are “preferred” by virtue of their performance, price, functionality, or combination of attributes which offer the overall “best” value to the customer. This category contains both advanced and mature devices which will remain available for the fore- seeable future. Preferred devices in the Data Sheet sections are identified as a “Motorola Preferred Device.’’ Device types identified as “current” may not be a first choice for new designs, but will continue to be available because of the popularity and/or standardization or volume usage in current production designs. These products can be acceptable for new designs but the preferred types are considered better alternatives for long term usage. Any device that has not been identified as a “preferred device” is a “current” device. Products designated as “Not Recommended for New Design” may become obsolete as dictated by poor market acceptance, or a technology or package that is reaching the end of its life cycle. Devices in this category have an uncertain future and do not represent a good selection for new device designs or long term usage. The Sensor Data Book does not contain any “Not Recommended for New Design” devices. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0083/C0101/C0110/C0115/C0111/C0114 Device Data Book The information in this book has been carefully reviewed and is believed to be accurate; however, no responsibility is assumed for inaccuracies. Furthermore, this information does not convey to the purchaser of semiconductor devices any license under the patent rights to the manufacturer. Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no war- ranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Motoro- la assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”, must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or un- authorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and the Stylized M Logo are registered in the US Patent & Trademark Office. All other product or service names are the property of their respective owners. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. 5th Edition  Motorola, Inc. 2003 “All Rights Reserved” Printed in U.S.A. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

v TABLE OF CONTENTS SECTION ONE — General Information SECTION TWO — Acceleration Sensor Products Data Sheets Application Notes AN1611 Impact and Tilt Measurement AN1612 Shock and Mute Pager Applications AN1632 MMA1201P Product Overview AN1640 Reducing Accelerometer AN1925 Using the Motorola Accelerometer SECTION THREE — Pressure Sensor Products Pressure Sensor Overview Data Sheets MPX4101A MPXA4101A, MPXH6101A Series 3–70. . . . Application Notes AN935 Compensating for Nonlinearity in the MPX10 Series Pressure Transducer 3–188. . . AN936 Mounting Techniques, Lead Forming and Testing of Motorola’s MPX Series AN1082 Simple Design for a 3–20 mA Transmitter Interface Using a Motorola (continued — next page) Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

Table of Contents (continued) SECTION THREE (continued) AN1097 Calibration–Free Pressure AN1100 Analog to Digital Converter Resolution Extension Using a Motorola AN1303 A Simple 3–20 mA Pressure AN1304 Integrated Sensor Simplifies Bar AN1305 An Evaluation System for Direct Interface of the MPX5100 Pressure AN1309 Compensated Sensor Bar Graph AN1315 An Evaluation System Interfacing the MPX2000 Series Pressure Sensors AN1316 Frequency Output Conversion for MPX2000 Series Pressure Sensors 3–263. . . . AN1318 Interfacing Semiconductor Pressure AN1322 Applying Semiconductor Sensors to AN1325 Amplifiers for Semiconductor AN1326 Barometric Pressure Measurement Using Semiconductor AN1513 Mounting Techniques and Plumbing Options of Motorola’s MPX Series AN1516 Liquid Level Control Using a AN1517 Pressure Switch Design with AN1518 Using a Pulse Width Modulated Output with Semiconductor AN1525 The A–B–C’s of Signal–Conditioning Amplifier Design for AN1551 Low Pressure Sensing with the AN1556 Designing Sensor Performance Specifications for AN1573 Understanding Pressure AN1586 Designing a Homemade Digital Output AN1636 Implementing Auto Zero for AN1646 Noise Considerations for Integrated AN1660 Compound Coefficient Pressure Sensor AN4007 New Small Amplified Automotive Vacuum Sensors A Single Chip Sensor Solution AN4010 Low–Pressure Sensing Using MPX2010 Series Pressure Sensors 3–418. . . . Reference Information SECTION FOUR — Safety and Alarm Integrated Circuits Data Sheets Application Notes AN1690 Alarm IC General Applications SECTION FIVE — Alphanumeric Device Index Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

1–1Motorola Sensor Device Data www.motorola.com/semiconductors /C0071/C0101/C0110/C0101/C0114/C0097/C0108 /C0073/C0110/C0102/C0111/C0114/C0109/C0097/C0116/C0105/C0111/C0110 Section One Introduction: This version of the Sensor Products Device Data Hand- book is organized to provide easy reference to sensor device information. We have reorganized the book based upon your recommendations with our goal to make designing in pres- sure, acceleration and safety and alarm ICs easy, and if you do have a question, you will have access to the technical support you need. The handbook is organized by product line, acceleration, pressure and safety and alarm ICs. Once in a section, you will find a glossary of terms, a list of frequently asked ques- tions or other relevant data. If you have recommendations for improvement, please complete the comment card and return it to us or, feel free to call our Sensor Device Data Handbook hot line and we will personally record your comments. The hot line number is 480/413–3333. We look forward to hear- ing from you! Reliability Issues for Silicon Pressure Sensors 1–3. . . . Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

1–2 Motorola Sensor Device Datawww.motorola.com/semiconductors Quality and Reliability — Overview A Major Objective of the Production Cycle From rigid incoming inspection of piece parts and materials, to stringent outgoing quality verification, the Motorola assembly and process flow is encompassed by an elaborate system of test and inspection stations; stations to ensure a step-by-step adherence to prescribed procedure. This produces the high level of quality for which Motorola is known . . . from start to finish. As illustrated in the process flow overview, every major manufacturing step is followed by an appropriate in-process quality inspection to insure product conformance to specification. In addition, Statistical Process Control (S.P.C.) techniques are utilized on all critical processes to insure processing equipment is capable of producing the product to the target specification while minimizing the variability. Quality control in wafer processing, assembly, and final test impart Motorola sensor products with a level of reliability that easily exceeds almost all industrial, consumer, and military requirements. Compensated Sensor Flow Chart LASER I.D. BINNING CHECK INITIAL OXIDATION P+ PHOTO RESIST DIFFUSION RESISTOR PHOTO RESIST CAVITY PHOTO RESIST DIE SORT AND LOAD GEL FILL AND CURE RESISTOR IMPLANT THIN-FILM METAL DEP. WAFER FINAL VISUAL CELL MARKING 100% FUNCTIONAL TEST EMITTER PHOTO RESIST THIN-FILM METAL P.R. CLASS PROBE DIE BOND AND CURE FINAL VISUAL EMITTER DIFFUSION CONTACT PHOTO RESIST WAFER TO WAFER BOND WIREBOND PACK AND SHIP FINAL OXIDATION FRONT METAL 12 3 4 5 67 9 10 11 13 15 16 17 18 19 20 21 22 23 METAL PHOTO RESIST CAVITY ETCH SAW AND WASH LASER TRIM Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

1–3Motorola Sensor Device Data www.motorola.com/semiconductors Reliability Issues for Silicon Pressure Sensors by Theresa Maudie and Bob Tucker Sensor Products Division Revised June 9, 1997 ABSTRACT Reliability testing for silicon pressure sensors is of greater importance than ever before with the dramatic increase in sensor usage. This growth is seen in applica- tions replacing mechanical systems, as well as new designs. Across all market segments, the expectation for the highest reliability exists. While sensor demand has grown across all of these segments, the substantial increase of sensing applications in the automotive arena is driving the need for improved reliability and test capability. The purpose of this paper is to take a closer look at these reli- ability issues for silicon pressure sensors. INTRODUCTION Discussing reliability as it pertains to semiconductor elec- tronics is certainly not a new subject. However, when devel- oping new technologies like sensors how reliability testing will be performed is not always obvious. Pressure sensors are an intriguing dilemma. Since they are electromechanical devices, different types of stresses should be considered to insure the different elements are exercised as they would be in an actual application. In addition, the very different package outlines relative to other standard semiconductor packages require special fixtures and test set-ups. However, as the sensor marketplace continues to grow, reliability testing becomes more important than ever to insure that products being used across all market segments will meet reliability lifetime expectations. RELIABILITY DEFINITION Reliability is [1] the probability of a product performing its intended function over its intended lifetime and under the operating conditions encountered. The four key elements of the definition are probability, performance, lifetime, and operating conditions. Probability implies that the reliability lifetime estimates will be made based on statistical tech- niques where samples are tested to predict the lifetime of the manufactured products. Performance is a key in that the sample predicts the performance of the product at a given point in time but the variability in manufacturing must be controlled so that all devices perform to the same functional level. Lifetime is the period of time over which the product is intended to perform. This lifetime could be as small as one week in the case of a disposable blood pressure transducer or as long as 15 years for automotive applications. Environ- ment is the area that also plays a key role since the oper- ating conditions of the product can greatly influence the reliability of the product. Environmental factors that can be seen during the lifetime of any semiconductor product include temperature, humidity, electric field, magnetic field, current density, pressure differ- ential, vibration, and/or a chemical interaction. Reliability testing is generally formulated to take into account all of these potential factors either individually or in multiple combinations. Once the testing has been completed predic- tions can be made for the intended product customer base. If a failure would be detected during reliability testing, the cause of the failure can be categorized into one of the following: design, manufacturing, materials, or user. The possible impact on the improvements that may need to be made for a product is influenced by the stage of product development. If a product undergoes reliability testing early in its development phase, the corrective action process can generally occur in an expedient manner and at minimum cost. This would be true whether the cause of failure was attributed to the design, manufacturing, or materials. If a reliability failure is detected once the product is in full production, changes can be very difficult to make and generally are very costly. This scenario would sometimes result in a total redesign. The potential cause for a reliability failure can also be user induced. This is generally the area that the least information is known, especially for a commodity type manufacturer that achieves sales through a global distribu- tion network. It is the task of the reliability engineer to best anticipate the multitudes of environments that a particular product might see, and determine the robustness of the product by measuring the reliability lifetime parameters. The areas of design, manufacturing, and materials are generally well understood by the reliability engineer, but without the correct environmental usage, customer satis- faction can suffer from lack of optimization. RELIABILITY STATISTICS Without standardization of the semiconductor sensor stan- dards, the end customer is placed in a situation of possible jeopardy. If non-standard reliability data is generated and published by manufacturers, the information can be perplexing to disseminate and compare. Reliability lifetime statistics can be confusing for the novice user of the informa- tion, “let the buyer beware”. The reporting of reliability statistics is generally in terms of failure rate, measured in FITs, or failure rate for one billion device hours. In most cases, the underlying assumption used in reporting either the failure rate or the MTBF is that the failures occurring during the reliability test follow an expo- nential life distribution. The inverse of the failure rate is the MTBF, or mean time between failure. The details on the various life distributions will not be explored here but the key concern about the exponential distribution is that the failure rate over time is constant. Other life distributions, such as the lognormal or Weibull can take on different failure rates over time, in particular, both distributions can represent a wear out or increasing failure rate that might be seen on a product reaching the limitations on its lifetime or for certain types of failure mechanisms. The time duration use for the prediction of most reliability statistics is of relatively short duration with respect to the product’s lifetime ability and failures are usually not observed. When a test is terminated after a set number of hours is achieved, or time censored, and no failures are observed, the failure rate can be estimated by use of the chi- square distribution which relates observed and expected Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

frequencies of an event to established confidence intervals. for up to 12 failures is shown in Table 1. estimate for the chi-square distribution interval is obtainable. cally as additional device hours are accumulated. measured in FITs is shown in Figure 1. Table 1. Chi-Square Table Figure 1. Depiction of the influence on the cumulative device hours with no failures and the Failure Rate as measured in FITs. Freescale Semiconductor, Inc.

1–5Motorola Sensor Device Data www.motorola.com/semiconductors One could thus imply that the reliability performance indicates that vendor B has an order of magnitude improve- ment in performance over vendor A with neither one seeing an occurrence of failure during their performance. The incorrect assumption of a constant failure rate over time can potentially result in a less reliable device being designed into an application. The reliability testing assump- tions and test methodology between the various vendors needs to be critiqued to insure a full understanding of the product performance over the intended lifetime, especially in the case of a new product. Testing to failure and determina- tion of the lifetime statistics is beyond the scope of this paper and presented elsewhere [2]. INDUSTRY RELIABILITY STANDARDS Reliability standards for large market segments are often developed by “cross-corporation” committees that evaluate the requirements for the particular application of interest. It is the role of these committees to generate documents intended as guides for technical personnel of the end users and suppliers, to assist with the following functions: speci- fying, developing, demonstrating, calibrating, and testing the performance characteristics for the specific application. One such committee which has developed a standard for a particular application is the Blood Pressure Monitoring Committee of the Association for the Advancement of Medical Instrumentation (AAMI) [3]. Their document, the “American National Standard for Interchangeability and Performance of Resistive Bridge Type Blood Pressure Transducers”, has an objective to provide performance requirements, test methodology, and terminology that will help insure that safe, accurate blood pressure transducers are supplied to the marketplace. In the automotive arena, the Society of Automotive Engineers (SAE) develops standards for various pressure sensor applications such as SAE document J1346, “Guide to Manifold Absolute Pressure Transducer Representative Test Method” [4]. While these two very distinct groups have successfully developed the requirements for their solid-state silicon pressure sensor needs, no real standard has been set for the general industrial marketplace to insure products being offered have been tested to insure reliability under industrial conditions. Motorola has utilized MIL-STD-750 as a refer- ence document in establishing reliability testing practices for the silicon pressure sensor, but the differences in the technology between a discrete semiconductor and a silicon pressure sensor varies dramatically. The additional tests that are utilized in semiconductor sensor reliability testing are based on the worst case operational conditions that the device might encounter in actual usage. ESTABLISHED SENSOR TESTING Motorola has established semiconductor sensor reliability testing based on exercising to detect failures by the presence of the environmental stress. Potential failure modes and causes are developed by allowing tests to run beyond the normal test times, thus stressing to destruction. The typical reliability test matrix used to insure conformance to customers end usage is as follows [5]: PULSED PRESSURE TEMPERATURE CYCLING WITH BIAS (PPTCB) This test is an environmental stress test combined with cyclic pressure loading in which the devices are alternately subjected to a low and high temperature while operating under bias under a cyclical pressure load. This test simulates the extremes in the operational life of a pressure sensor. PPTCB evaluates the sensor’s overall performance as well as evaluating the die, die bond, wire bond and package integrity. Typical Test Conditions: Temperature per specified operating limits (i.e., Ta = –40 to 125°C for an automotive application). Dwell time ≥ 15 minutes, transfer time ≤ 5 minutes, bias = 100% rated voltage. Pressure = 0 to full scale, pressure frequency = 0.05 Hz, test time = up to 1000 hours. Potential Failure Modes: Open, short, parametric shift. Potential Failure Mechanisms: Die defects, wire bond fatigue, die bond fatigue, port adhesive failure, volumetric gel changes resulting in excessive package stress. Mechanical creep of packaging material. HIGH HUMIDITY, HIGH TEMPERATURE WITH BIAS (H3TB) A combined environmental/electrical stress test in which devices are subjected to an elevated ambient temperature and humidity while under bias. The test is useful for evaluating package integrity as well as detecting surface contamination and processing flaws. Typical Test Conditions: Temperature between 60 and 85°C, relative humidity between 85 and 90%, rated voltage, test time = up to 1000 hours. Potential Failure Modes: Open, short, parametric shift. Potential Failure Mechanisms: Shift from ionic affect, parametric instability, moisture ingress resulting in exces- sive package stress, corrosion. HIGH TEMPERATURE WITH BIAS (HTB) This operational test exposes the pressure sensor to a high temperature ambient environment in which the device is biased to the rated voltage. The test is useful for evaluating the integrity of the interfaces on the die and thin film stability. Typical Test Conditions: Temperature per specified operational maximum, bias = 100% rated voltage, test time = up to 1000 hours. Potential Failure Modes: Parametric shift in offset and/or sensitivity. Potential Failure Mechanisms: Bulk die or diffusion defects, film stability and ionic contamination. HIGH AND LOW TEMPERATURE STORAGE LIFE (HTSL, LTSL) High and low temperature storage life testing is performed to simulate the potential shipping and storage conditions that the pressure sensor might encounter in actual usage. The test also evaluates the devices thermal integrity at worst case temperatures. Freescale Sem iconductor, I Freescale Semiconductor, Inc. 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1–6 Motorola Sensor Device Datawww.motorola.com/semiconductors Typical Test Conditions: Temperature per specified storage maximum and minimum, no bias, test time = up to 1000 hours. Potential Failure Modes: Parametric shift in offset and/or sensitivity. Potential Failure Mechanisms: Bulk die or diffusion defects, mechanical creep in packaging components due to thermal mismatch. TEMPERATURE CYCLING (TC) This is an environmental test in which the pressure sensor is alternatively subjected to hot and cold temperature extremes with a short stabilization time at each temperature in an air medium. The test will stress the devices by generating thermal mismatches between materials. Typical Test Conditions: Temperature per specified storage maximum and minimum (i.e., –40 to +125°C for automotive applications). Dwell time ≥ 15 minutes, transfer time ≤ 5 minutes, no bias. Test time up to 1000 cycles. Potential Failure Modes: Open, parametric shift in offset and/or sensitivity. Potential Failure Mechanisms: Wire bond fatigue, die bond fatigue, port adhesive failure, volumetric gel changes resulting in excessive package stress. Mechanical creep of packaging material. MECHANICAL SHOCK This is an environmental test where the sensor device is evaluated to determine its ability to withstand a sudden change in mechanical stress due to an abrupt change in motion. This test simulates motion that may be seen in handling, shipping or actual use. MIL STD 750, Method 2016 Reference. Typical Test Conditions: Acceleration = 1500 g’s, orienta- tion = X, Y, Z planes, time = 0.5 milliseconds, 5 blows. Potential Failure Modes: Open, parametric shift in offset and/or sensitivity. Potential Failure Mechanisms: Diaphragm fracture, mechanical failure of wire bonds or package. VARIABLE FREQUENCY VIBRATION A test to examine the ability of the pressure sensor device to withstand deterioration due to mechanical resonance. MIL STD 750, Method 2056 Reference. Typical Test Conditions: Frequency – 10 Hz to 2 kHz, 6.0 G’s max, orientation = X, Y, Z planes, 8 cycles each axis, 2 hrs. per cycle. Potential Failure Modes: Open, parametric shift in offset and/or sensitivity. Potential Failure Mechanisms: Diaphragm fracture, mechanical failure of wire bonds or package. SOLDERABILITY In this reliability test, the lead/terminals are evaluated for their ability to solder after an extended time period of storage (shelf life). MIL STD 750, Method 2026 Reference. Typical Test Conditions: Steam aging = 8 hours, Flux= R, Solder = Sn63, Pb37. Potential Failure Modes: Pin holes, non–wetting, dewetting. Potential Failure Mechanisms: Poor plating, contamination. OVER PRESSURE This test is performed to measure the ability of the pressure sensor to withstand excessive pressures that may be encountered in the application. The test is performed from either the front or back side depending on the application. Typical Test Conditions: Pressure increase to failure, record value. Potential Failure Modes: Open. Potential Failure Mechanisms: Diaphragm fracture, adhesive or cohesive failure of die attach. A pressure sensor may be placed in an application where it will be exposed to various media that may chemically attack the active circuitry, silicon, interconnections and/or packaging material. The focus of media compatibility is to understand the chemical impact with the other environmental factors such as temperature and bias and determine the impact on the device lifetime. The primary driving mecha- nism to consider is permeation which quantifies the time for a chemical to permeate across a membrane or encapsulant corrosion can result. Media related product testing is generally very specific to the application since the factors that relate to the product lifetime are very numerous and varied. An example is solution pH where the further from neutral will drive the chemical reaction, generally to a power rule relationship. The pH alone does not always drive the reaction either, the non–desired products in the media such as strong acids in fuels as a result of acid rain can directly influence the lifetime. It is recommended the customer and/or vendor perform application specific testing that best represents the environ- ment. This testing should be performed utilizing in situ monitoring of the critical device parameter to insure the device survives while exposed to the chemical. The Sensor Products Division within Motorola has a wide range of media specific test capabilities and under certain circumstances will perform application specific media testing. A sufficient sample size manufactured over a pre-defined time interval to maximize process and time variability is tested based on the guidelines of the matrix shown above. This test methodology is employed on all new product introductions and process changes on current products. A silicon pressure sensor has a typical usage environ- ment of pressure, temperature, and voltage. Unlike the typical bipolar transistor life tests which incorporate current density and temperature to accelerate failures, a silicon pressure sensor’s acceleration of its lifetime performance is primarily based on the pressure and temperature interac- tion with a presence of bias. This rationale was incorporated into the development of the Pulsed Pressure Temperature Cycling with Bias (PPTCB) test where the major accelera- tion factor is the pressure and temperature component. It is also why PPTCB is considered the standard sensor operational life test. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

eliminate the concerns raised, a reliable product is achieved. utmost importance, the reliability test must be optimized. using accelerated life testing techniques. Figure 2. Process and Product Variability Concerns During Reliability Testing Freescale Semiconductor, Inc.

1–8 Motorola Sensor Device Datawww.motorola.com/semiconductors The temperature acceleration factor for a particular failure mechanism can be related by taking the ratio for the reaction rate of the two different stress levels as expressed by the Arrhenius type of equation. The mathematical derivation of the first order chemical reaction rate computes to: AF /C0043(RT)HS /C0043tHS (RT)LS tLS AF /C0043exp /C0426Ea k /C04661 TLS /C00421 THS /C0467/C0427 Where: AF = Acceleration Factor R T = Reaction Rate t = time T = temperature [ °K] Ea = activation energy of expressed in electron-volts [eV] k = Boltzman’s constant, 8.6171 x 10 -5 eV/°K LS = Low stress or nominal temperature HS = High stress or test temperature The activation energy is dependent on the failure mecha- nism and typically varies from 0.3 to 1.8 electron-volts. The activation energy is directly proportional to the degree of influence that temperature has on the chemical reaction rate. A listing of typical activation energies is included in reference [6] and [7]. An example using the Arrenhius equation will be demon- strated. A 32 device HTB test for 500 hours total and no failure was performed. The 125°C, 100% rated voltage test resulted in no failures. If a customer’s actual usage conditions was 55°C at full rated voltage, an estimate of the lower one side confidence limit can be calculated. An assumption is made that the failure rate is constant thus implying the exponential distribution. The first step is to calculate the equivalent device hours for the customer’s use conditions by solving for the acceleration factor. From the acceleration factor above, if eA is assumed equal to 1, AF /C0043exp /C0426Ea k /C04661 TLS /C00421 THS /C0467/C0427 Where: eA = 0.7eV/ °K (assumed) TLS =5 5 °C + 273.16 = 328.16°K THS = 125 °C + 273.16 = 398.16°K then; AF = 77.64 Therefore, the equivalent cumulative device hours at the customer’s use condition is: tLS = AF x t HS = (32 /C0001 500) /C0001 77.64 or tLS = 1,242,172 device hours Computing the lower one sided failure rate with a 90% confi- dence level and no failures: 2tor λ = 1.853E–06 failures per hour or λ = 1,853 FITs The inverse of the failure, λ, or the Mean Time To Failure (MTTF) is: MTTF /C00431 /C0108or MTTF = 540,000 device hours CONCLUSION Reliability testing durations and acceptance numbers are used as a baseline for achieving adequate performance in the actual use condition that the silicon pressure sensor might encounter. The baseline for reliability testing can be related to the current record high jump bar height. Just as athletes in time achieve a higher level of performance by improvements in their level of physical and mental fitness, silicon pressure sensors must also incorporate improve- ments in the design, materials, and manufacturability to achieve the reliability growth demands the future market place will require. This philosophy of never ending improve- ment will promote consistent conformance to the customer’s expectation and production of a best in class product. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

1–9Motorola Sensor Device Data www.motorola.com/semiconductors REFERENCES [1] Dr. Joseph E. Matar and Theresa Maudie, “Reliability Engineering and Accelerated Life Testing,” Motorola Internal Training Text, 1989. J. Matkin, and S. Petrovic, “Media Compatible Packaging and Environmental Testing of Barrier Coating Encapsulated Silicon Pressure Sensors,’’ 1996, Solid–State Sensors and Actuators Workshop. Hilton Head, SC, pp. 36–41, 1996. [3] “Guide to Manifold Absolute Pressure Transducer Representative Test Method,” SAE Guideline J1346, Transducer Subcommittee, latest revision. [4] “Interchangeability and Performance of Resistive Bridge Type Blood Pressure Transducers,” AAMI Guideline, Blood Pressure Monitoring Committee, latest revision. [6] Wayne Nelson, “Accelerated Testing: Statistical Models,” Test Plans, and Data Analyses, John Wiley & Sons, Inc., New York, N.Y., 1990. [7] D.S. Peck and O.D. Trapp, (1978), “Accelerated Testing Handbook,” Technology Associates, revised 1987. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

mize the thermal stress to which the devices are subjected.

Always preheat the device.
The delta temperature between the preheat and soldering should be 100°C or less.*
For pressure sensor devices, a no–clean solder is recommended unless the silicone die coat is sealed and unexposed. Also, prolonged exposure to fumes can damage the silicone die coat of the device during the solder reflow process.
When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference should be a maximum of 10°C.
The soldering temperature and time should not exceed 260°C for more than 10 seconds.
When shifting from preheating to soldering, the maximum temperature gradient shall be 5°C or less.
After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used since the use of forced cooling will increase the temperature gradient and will result in latent failure due to mechanical stress.
Mechanical stress or shock should not be applied during cooling. * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device. TYPICAL SOLDER HEATING PROFILE For any given circuit board, there will be a group of control settings that will give the desired heat pattern. The operator must set temperatures for several heating zones and a figure for belt speed. Taken together, these control settings make up a heating “profile” for that particular circuit board. On machines controlled by a computer, the computer remem- bers these profiles from one operating session to the next. Figure 3 shows a typical heating profile for use when soldering a surface mount device to a printed circuit board. This profile will vary among soldering systems, but it is a good starting point. Factors that can affect the profile include the type of soldering system in use, density and types of components on the board, type of solder used, and the type of board or substrate material being used. This profile shows temperature versus time. The line on the graph shows the actual temperature that might be experienced on the surface of a test board at or near a central solder joint. The two profiles are based on a high density and a low density board. The Vitronics SMD310 convection/infrared reflow soldering system was used to generate this profile. The type of solder used was 62/36/2 Tin Lead Silver with a melting point between 177–189°C. When this type of furnace is used for solder reflow work, the circuit boards and solder joints tend to heat first. The components on the board are then heated by conduction. The circuit board, because it has a large surface area, absorbs the thermal energy more efficiently, then distributes this energy to the components. Because of this effect, the main body of a component may be up to 30 degrees cooler than the adjacent solder joints. STEP 1 PREHEAT ZONE 1 “RAMP” STEP 2 VENT “SOAK” STEP 3 HEATING ZONES 2 & 5 “RAMP” STEP 4 HEATING ZONES 3 & 6 “SOAK” STEP 5 HEATING ZONES 4 & 7 “SPIKE” STEP 6 VENT STEP 7 COOLING 200°C 150°C 100°C 50°C TIME (3 TO 7 MINUTES TOTAL) TMAX SOLDER IS LIQUID FOR

40 TO 80 SECONDS

Figure 3. Typical Solder Heating Profile Freescale Semiconductor, Inc.

1–11Motorola Sensor Device Data www.motorola.com/semiconductors Electrostatic Discharge Data Electrostatic damage (ESD) to semiconductor devices has plagued the industry for years. Special packaging and handling techniques have been developed to protect these sensitive devices. While many of Motorola’s semiconductors devices are not susceptible to ESD, all products are revered as sensitive and handled accordingly. The data in this section was developed using the human-body model specified in MIL-STD-750C, Method 1020. The threshold values (Eth, kV) of ten devices was recorded, then the average value calculated. This data plus the device type, device source, package type, classification, polarity and general device description are supplied. Devices listed are mainly JEDEC registered 1N and 2N numbers. Military QPL devices and some customer specials are also in this database. The data in this report will be updated regularly, and the range will be added as new data becomes available. The sensitivity classifications listed are as follows: Class 1 . . .1 to 1999 volts Class 2 . . .2000 to 3999 volts Class 3 . . .4000 to > 15500 volts The code “N/S” signifies a non-sensitive device. “SEN” are considered sensitive and should be handled according to ESD procedures. Of the various products manufactured by the Communications, Power and Signal Technologies Group, the following examples list general device families by not sensitive to extremely sensitive. Least sensitive Zener diodes (on a square. . . . mil/millijoule basis) More sensitive Bipolar darlington transistors. . . . Extremely sensitive Hot carrier diodes and MOSFET transistors without gate protection The data supplied herein, is listed in numerical or alphabetical order. DEVICE LINE CASE CLASS PRODUCT DESCRIPTION MPX10D XL0010V1 344–15 3–SEN Uncompensated MPX10DP XL0010V1 344C–01 3–SEN Uncompensated MPX10GP XL0010V1 344B–01 3–SEN Uncompensated MPX12D XL0012V1 344–15 3–SEN Uncompensated MPX12DP XL0012V1 344C–01 3–SEN Uncompensated MPX12GP XL0012V1 344B–01 3–SEN Uncompensated MPX2010D XL2010V5 344–15 1–SEN Temperature Compensated/Calibrated MPX2010DP XL2010V5 344C–01 1–SEN Temperature Compensated/Calibrated MPX2010GP XL2010V5 344B–01 1–SEN Temperature Compensated/Calibrated MPX2010GS XL2010V5 344E–01 1–SEN Temperature Compensated/Calibrated MPX2010GSX XL2010V5 344F–01 1–SEN Temperature Compensated/Calibrated MPX2300DT1 XL2300C1,01C1 423–05 1–SEN Temperature Compensated/Calibrated MPX4100A XL4101S2 867–08 1–SEN Signal–Conditioned MPX4100AP XL4101S2 867B–04 1–SEN Signal–Conditioned MPX4100AS XL4101S2 867E–03 1–SEN Signal–Conditioned MPX4101A XL4101S2 867–08 1–SEN Signal–Conditioned MPX4115A XL4101S2 867–08 1–SEN Signal–Conditioned MPX4115AP XL4101S2 867B–04 1–SEN Signal–Conditioned MPX4115AS XL4101S2 867E–03 1–SEN Signal–Conditioned MPX4250A XL4101S2 867–08 1–SEN Signal–Conditioned MPX4250AP XL4101S2 867B–04 1–SEN Signal–Conditioned MPX5010D XL4010S5 867–08 1–SEN Signal–Conditioned MPX5010DP XL4010S5 867C–05 1–SEN Signal–Conditioned MPX5010GP XL4010S5 867B–04 1–SEN Signal–Conditioned MPX5010GS XL4010S5 867E–03 1–SEN Signal–Conditioned MPX5010GSX XL4010S5 867F–03 1–SEN Signal–Conditioned Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

1–12 Motorola Sensor Device Datawww.motorola.com/semiconductors DEVICE PRODUCT DESCRIPTIONCLASSCASELINE MPX5050D XL4051S1 867–08 1–SEN Signal–Conditioned MPX5050DP XL4051S1 867C–05 1–SEN Signal–Conditioned MPX5050GP XL4051S1 867B–04 1–SEN Signal–Conditioned MPX5100D XL4101S1 867–08 1–SEN Signal–Conditioned MPX5100DP XL4101S1 867C–05 1–SEN Signal–Conditioned MPX5100GP XL4101S1 867B–04 1–SEN Signal–Conditioned MPX5700D XL4701S1 867–08 1–SEN Signal–Conditioned MPX5700DP XL4701S1 867C–05 1–SEN Signal–Conditioned MPX5700GP XL4701S1 867B–04 1–SEN Signal–Conditioned MPX5999D XL4999S1 867–08 1–SEN Signal–Conditioned Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

Figure 4. Example of Process Control Chart Showing Oven Temperature Data measurements would not be unreasonable. sponding to 3 sigma, 2 sigma, and 1 sigma limits respectively. increases, more subtle tests may be employed successfully. ance of 5, 3, 2, 1 and 0.4 respectively. This results in less than 2% total variability improvement. us a total variability improvement of nearly 40%. eliminated in the most expeditious manner possible. to be in a state of control. Freescale Semiconductor, Inc.

1–17Motorola Sensor Device Data www.motorola.com/semiconductors Micromachined Accelerometer Reliability Testing Results LIFE AND ENVIRONMENTAL TESTING RESULTS STRESS TEST CONDITIONS RESULTS FAILED/PASS High Temperature Bias TA = 90°C, VDD = 5.0 V t = 1000 hours, 12 minutes on, 8 seconds off High Temperature/High Humidity Bias TA = 85°C, RH = 85%, VDD = 5.0 V, t = 2016 High Temperature Storage (Bake) TA = 105°C, t = 1000 hours 0/35 Temperature Cycle /C004240 to 105°C, Air to Air, 15 minutes at extremes, /C0118 5 minutes transfer, 1000 cycles Mechanical Shock 5 blows X1, X2, Y1, Y2, Z1, Z2 Vibration Variable Frequency with Temperature Cycle 10 – 1 Khz @ 50 G’s max, 24 hours each axis, X1, X2, Y1, Y2, Z1, Z2, TA = /C004240 to 90°C, Dwell = 1 Hour, transfer = 65 minutes Autoclave TA = 121°C, RH = 100%

15 PSIG, t = 240 hours

Drop Test 10 Drops from 1.0 meters onto concrete, any orientation PARAMETERS MONITORED LIMITS INITIAL END POINTS PARAMETER CONDITIONS MIN MAX MIN MAX Offset VDD = 5.0 V, 25, /C004240 & 90°C 2.15 V 2.95 V 2.15 V 2.95V Self Test VDD = 5.0 V, 25, /C004240 & 90°C 20G 30 G 20 G 30 G Sensitivity VDD = 5.0 V, 25, /C004240 & 90°C 45 mV/G 55 mV/G 45 mV/G 55 mV/G Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

and misuses of their applications. recommends a path to industry standardization. the silicon MEMS device and material still need answers [4]. nonpolar organic liquids, acids, bases, or aqueous solutions. hardware to perform reliability tests. Inc. (P.O. Box 915, Fairfield, CT 06430). pressure sensor will be proposed. static or cyclic temperature and pressure. Figure 1. Typical bulk micromachined silicon Freescale Semiconductor, Inc.

blood pressure monitor whose lifetime is several days. Table 1. Typical Failure Mechanisms for after the test interval) can be enhanced by in situ monitoring. such as swelling or weight change. encountered in a customer’s application. Permeability is the product of diffusivity and solubility. material dependence of permeation is shown in Figure 2. Figure 2. Permeation relationship for various materials. associated hardware to perform the media related testing [11]. challenge to MEMS device reliability. Freescale Semiconductor, Inc.

the task force from Chrysler, Ford, and General Motors. Table 2. Fuel Testing Methods ions (as it most assuredly will) but at what concentration. surfactants, builders, whitening agents and enzymes [15]. exposure to these liquids [16]. all sensor and actuator devices. trimmable resistors, bonding pads, wires, leadframes, etc. surfaces, which compounds the corrosion problem. influenced by specific metal–to–metal connections. Freescale Semiconductor, Inc.

of fatigue, environment assisted cracking, and creep. accelerating stress for all of the mechanical failure mechanisms. Table 3. Mechanical Failure Mechanisms and a corresponding straight line for the piezoresistive element. place a barrier coating over the die and wire interconnection. corresponding media, swelling or dissolution will occur. generally are very costly and limit the sensitivity of the device. adequately isolate the package stress from the die. Figure 10. Graphical comparison of the output from a mechanical pressure sensor compared to a piezoresistive sensor during a washing machine fill cycle. Freescale Semiconductor, Inc.

For means of example, the Weibull distribution will be used. The two parameters for the Weibull distribution are q and b.

/C0466 RH high RH low /C0467 n A media test typically needs to take results received in weeks or months to predict lifetime in years. Acceleration models are used to determine the relationship between the accelerated test and the normal lifetime. Literature has reported numerous models to equate testing to lifetime including the Peck model for temperature and humidity [25]. The acceleration equation based on Peck’s model is where Ea is 0.9eV and n is –3.0. The value K is Boltzmann’s constant which is equal to 8.6171x10–5 eV/K. The relative humidity is entered as a whole number, i.e. 85 for 85%. Using this sample model, test results from humidity testing can be related to the lifetime. The methods to equate test time to lifetime first involves fitting the failure data to a lifetime distribution. For an example, humidity data at 60°C, 90% relative humidity and bias was tested to failure. The failure data fit a Weibull distribution with a characteristic life of 40,000 hours. By applying the acceleration factor equation shown above, quantification of the lifetime in the use conditions can be calculated. Figure 15 shows the cumulative failure distribution for the test and use conditions for a 15 year lifetime. This technique is key for media testing since the range of use conditions is very broad. The consumer can determine the attributes for the sensor to use for the application. The attributes might include cost, performance, and possibility for replacement.

Figure 15. Probability of failure versus time for humidity testing with bias on an integrated sensor device. put the application at risk for surviving. Freescale Semiconductor, Inc.

designer with a method of evaluating sensor performance. savings on to their customers. coherent, complete definition of a media’s effects on a sensor. criteria to include in a model are shown in table 4. Table 4. Suggested Criteria for Media Compatibility will require meeting the customers’ needs. Characterization Lab, and the Prototype Lab. Freescale Semiconductor, Inc.

1–29Motorola Sensor Device Data www.motorola.com/semiconductors REFERENCE (1) Theresa Maudie, Testing Requirements and Reliability Issues Encountered with Micromachined Structures, Proceedings of the Second International Symposium on Microstructures and Microfabricated Systems, Eds. 95–27 (1995) pp. 223–230. (2) Arne Nakladal et al., Influences of Humidity and Mois- ture on the Long–Term Stability of Piezoresistive Pres- sure Sensors, Measurement, vol. 16 (1995) pp. 21–29. (3) Marin Nese and Anders Hanneborg, Anodic Bonding of Silicon to Silicon Wafers Coated with Aluminum, Silicon Oxide, Polysilicon or Silicon Nitride, Sensors and Actuators A, vol. 37–38 (1993) pp. 61–67. (4) Janusz Bryzek, Micromachines on the March, IEEE Spectrum, May 1994. (5) J. M. Hu, Physics–of–Failure–Based Reliability Qualifi- cation of Automotive Electronics, Communications in RMS, vol. 1, no. 2 (1994) pp. 21–33. (6) Michael Pecht et.al., Quality Conformance and Qualifi- cation of Microelectronics Packages and Intercon- nects, John Wiley & Sons, Inc., 1994. (7) William M. Alvino, Plastics for Electronics, McGraw– Hill, 1995 (8) Eugene R. Hnatek, Integrated Circuit Quality and Reli- ability, Marcel Dekker, Inc., 1987. (9) Charles A. Harper, Handbook of Plastics, Elastomers, and Composites, McGraw–Hill, 1992. (10) Richard W. Hertzberg, Deformation and Fracture Mechanics of Engineering Materials, John Wiley & Sons, Inc., 1983. (11) Joseph M. Giachino, Automotive Sensors: Driving Toward Optimized Vehicle Performance, 7th Int’l Con- ference on Solid State Sensor and Actuators, June 1993. (12) Perry Poiss, What Additives do for Gasoline, Hydro- carbon Processing, Feb. 1973. (13) Gasoline/Methanol Mixtures for Material Testing, SAE Cooperative Research Report CRP–001, Sep. 1990. (14) Private communication to Andrew McNeil from City of Phoenix, Water and Wastewater Department, Water Quality Division, Jan. 1994. (15) Laundry Detergents, Consumer Reports, Feb. 1991, pp. 100–106. (16) Silicon as a Mechanical Material, Kurt E. Petersen, (17) Principles and Prevention of Corrosion, Denny A. Jones, (Prentice Hall: Englewood Cliffs, NJ, 1992). (18) Atlas of Electrochemical Equilibria in Aqueous Solu- tions, M. Pourbaix, (Pergamon Press: Oxford, Eng- land, 1966) (19) Anisotropic Etching of Crystalline Silicon in Alkaline Solutions, Part I. Orientation Dependence and Behav- ior of Passivation Layers, H. Seidel et al., J. Electro- (20) Anisotropic Etching of Crystalline Silicon in Alkaline Solutions, Part II. Influence of Dopants, H. Seidel et pp. 3612–3625. (21) Principles of Polymer Systems, 2nd ed., F. Rodriguez, (Hemisphere Publishing Corporation: Washington, D.C., 1982. (22) D. J. Monk, Pressure Leakage through Material Inter- faces in Pressure Sensor Packages, Sensors in Elec- tronic Packaging, Eds. Charles Ume and Chao Pin–Yeh, MED–Vol. 3/EEP–Vol.14 (1995) pp. 87–93. (23) Paul A. Tobias and David C. Trindade, Applied Reli- ability, Van Nostrand Reinhold, 1995. (24) Wayne Nelson, Accelerated Testing, John Wiley & Sons, Inc., 1990. (25) O. Hallberg and D. S. Peck, “Recent Humidity Accel- erations, A Base for Testing Standards,” Quality and Reliability Engr. International, Vol. 7, pp 169–180, 1991. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

1–30 Motorola Sensor Device Datawww.motorola.com/semiconductors Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

2–1Motorola Sensor Device Data www.motorola.com/semiconductors /C0065/C0099/C0099/C0101/C0108/C0101/C0114/C0097/C0116/C0105/C0111/C0110 /C0083/C0101/C0110/C0115/C0111/C0114 /C0080/C0114/C0111/C0100/C0117/C0099/C0116/C0115 Section Two Accelerometer Overview: Motorola’s series of acceleration sensors incorporate a surface micromachined structure. The force of acceleration moves the seismic mass, thereby changing the g–cell’s capacitance. Coupled with the g–cell is a control chip to pro- vide the accelerometer with signal amplification, signal conditioning, low pass filter and temperature compensation. With Zero–g offset, sensitivity and filter roll–off that is factory set, the device requires only a few external passives. In fact, this acceleration sensor device offers a calibrated self–test feature that mechanically displaces the seismic mass with the application of a digital self–test signal. The g–cell is hermetically sealed at the die level, creating a particle–free environment with features such as built in damping and over–range stops to protect it from mechanical shock. These acceleration sensors are rugged, highly accurate and feature X, XY, and Z axis of sensitivity. Motorola’s acceleration sensors are economical, accurate and highly reproducible for the ideal sensing solution in auto- motive, industrial, commercial and consumer applications. Data Sheets Application Notes Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

2–2 Motorola Sensor Device Datawww.motorola.com/semiconductors Mini Selector Guide Accelerometer Sensor Device Acceleration Range (g) Sensing Axis AC Sensitivity (mV/g) VDD Supply Voltage (Typ) (V) Zero g Output (Typ) (V) MMA1200D ±250g Z axis 8.0 5.0 2.5 MMA1201P ±38g Z axis 50 5.0 2.5 MMA1220D ±8g Z axis 250 5.0 2.5 MMA1250D ±5g Z axis 400 5.0 2.5 MMA1260D ±1.5g Z axis 1200 5.0 2.5 MMA1270D ±2.5g Z axis 750 5.0 2.5 MMA2200W ±38g X axis 50 5.0 2.5 MMA2201D ±38g X axis 50 5.0 2.5 MMA2202D ±50g X axis 40 5.0 2.5 MMA3201D ±38g X–Y axis 50 5.0 2.5 Device Numbering System for Accelerometers P M M A XXXX D PROTOTYPE MICROMACHINED ACCELEROMETER PACKAGE D SOIC (Surface Mount) P 16 Pin Dip W Wingback AXIS OF SENSITIVITY

1000 SERIES — Z AXIS

2000 SERIES — X AXIS

3000 SERIES — X–Y AXIS

iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

2–3Motorola Sensor Device Data www.motorola.com/semiconductors Sensor Applications AUTOMOTIVE APPLICATIONS

Airbags
Rollover detection
Fuel shut–off valve
Crash detection
Suspension control
Vehicle dynamic control
Braking systems
Occupant safety HEALTHCARE / FITNESS APPLICATIONS
Physical therapy
Rehabilitation equipment
Range of body motion measurement
Pedometers
Ergonomics tools
Sports medicine equipment
Sports diagnostic systems INDUSTRIAL / CONSUMER

APPLICATIONS

Game pads
Vibration monitoring
Computer hard drive protection
Appliance balance and vibration controls
Seismic detection
Seismic switches
Security systems
Security enhancement equipment
Mouse control for Handheld devices
Cell phone menu selection scrolling
Virtual reality input devices
Dead reckoning in navigation systems
Bearing wear monitoring
Inclinometers
Robotics Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

2–4 Motorola Sensor Device Datawww.motorola.com/semiconductors Acceleration Sensor FAQ’s We have discovered that many of our customers have similar questions about certain aspects of our accelerome- ter’s technology and operation. Here are the most frequently asked questions and answers that have been explained in relatively non–technical terms. Q. What is the g–cell? A. The g–cell is the acceleration transducer within the accelerometer device. It is hermetically sealed at the wafer level to ensure a contaminant free environment, resulting in superior reliability performance. Q. What does the output typically interface with? A. The accelerometer device is designed to interface with an analog to digital converter available on most microcontrol- lers. The output has a 2.5 V DC offset, therefore positive and negative acceleration is measurable. For unique customer applications, the output voltage can be scaled and shifted to meet requirements using external circuitry. Q. What is the resonant frequency of the g–cell? A. The resonant frequency of the g–cell is much higher than the cut–off frequency of the internal filter. Therefore, the resonant frequency of the g–cell does not play a role in the accelerometer response. Q. What is ratiometricity? A. Ratiometricity simply means that the output offset voltage and sensitivity scales linearly with applied supply voltage. That is, as you increase supply voltage the sensitivity and offset increase linearly; as supply voltage decreases, offset and sensitivity decrease linearly. This is a key feature when interfacing to a microcontroller or an A/D converter. Ratiometricity allows for system level cancellation of supply induced errors in the analog to digital conversion process. Refer to the Special Features section under the Principle of Operation for more information. Q. Is the accelerometer device sensitive to electro static discharge (ESD)? A. Yes. The accelerometer should be handled like other CMOS technology devices. Q. Can the g–cell part “latch’’? A. No, overrange stops have been designed into the g–cell to prevent latching. (Latching is when the middle plate of the g–cell sticks to the top or bottom plate.) Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

2–5Motorola Sensor Device Data www.motorola.com/semiconductors /C0083/C0117/C0114/C0102/C0097/C0099/C0101 /C0077/C0111/C0117/C0110/C0116 /C0077/C0105/C0099/C0114/C0111/C0109/C0097/C0099/C0104/C0105/C0110/C0101/C0100 /C0065/C0099/C0099/C0101/C0108/C0101/C0114/C0111/C0109/C0101/C0116/C0101/C0114 The MMA series of silicon capacitive, micromachined accelerometers features signal conditioning, a 4–pole low pass filter and temperature compensation. Zero–g offset full scale span and filter cut–off are factory set and require no external devices. A full system self–test capability verifies system functionality.

Features

Integral Signal Conditioning
Linear Output
Ratiometric Performance
4th Order Bessel Filter Preserves Pulse Shape Integrity
Calibrated Self–test
Low Voltage Detect, Clock Monitor, and EPROM Parity Check Status
Transducer Hermetically Sealed at Wafer Level for Superior Reliability
Robust Design, High Shocks Survivability Typical Applications
Vibration Monitoring and Recording
Impact Monitoring SIMPLIFIED ACCELEROMETER FUNCTIONAL BLOCK DIAGRAM G–CELL SENSOR INTEGRATOR GAIN FILTER TEMP COMP SELF–TEST CONTROL LOGIC & EPROM TRIM CIRCUITS CLOCK GEN.OSCILLATOR VDD VOUT VSS ST

Figure 1. Simplified Accelerometer Functional Block Diagram

16 LEAD SOIC

Freescale Semiconductor, Inc.

/C0077/C0077/C0065/C0049/C0050/C0048/C0048/C0068 2–6 Motorola Sensor Device Datawww.motorola.com/semiconductors MAXIMUM RATINGS (Maximum ratings are the limits to which the device can be exposed without causing permanent damage.) Rating Symbol Value Unit Powered Acceleration (all axes) G pd 500 g Unpowered Acceleration (all axes) G upd 2000 g Supply Voltage VDD –0.3 to +7.0 V Drop Test(1) D drop 1.2 m Storage Temperature Range Tstg –40 to +105 °C NOTES: 1. Dropped onto concrete surface from any axis. ELECTRO STATIC DISCHARGE (ESD) WARNING: This device is sensitive to electrostatic discharge. Although the Motorola accelerometers contain internal 2kV ESD protection circuitry, extra precaution must be taken by the user to protect the chip from ESD. A charge of over 2000 volts can accumulate on the human body or associated test equipment. A charge of this magnitude can alter the per- formance or cause failure of the chip. When handling the accelerometer, proper ESD precautions should be followed to avoid exposing the device to discharges which may be detrimental to its performance. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0077/C0065/C0049/C0050/C0048/C0048/C0068 2–7Motorola Sensor Device Data www.motorola.com/semiconductors OPERATING CHARACTERISTICS (Unless otherwise noted: –40°C /C0118 TA /C0118 +85°C, 4.75 /C0118 VDD /C0118 5.25, Acceleration = 0g, Loaded output(1)) Characteristic Symbol Min Typ Max Unit Operating Range(2) Supply Voltage(3) Supply Current Operating Temperature Range Acceleration Range VDD IDD TA gFS 4.75 3.0 /C004240 5.00 5.25 6.0 +85 V mA g Output Signal Zero g (VDD = 5.0 V)(4) Zero g Sensitivity (TA = 25°C, VDD = 5.0 V)(5) Sensitivity Bandwidth Response Nonlinearity VOFF VOFF,V S SV f–3dB NL OUT 2.2

0.44 VDD

7.5 1.47 360 2.0 2.5

0.50 VDD

8.0 1.6 400 2.8

0.56 VDD

8.5 1.72 440 2.0 V V mV/g mV/g/V Hz % FSO Noise RMS (.01–1 kHz) Power Spectral Density Clock Noise (without RC load on output)(6) nRMS nPSD nCLK 110 2.0 2.8 mVrms µV/(Hz1/2) mVpk Self–Test Output Response Input Low Input High Input Loading(7) Response Time(8) gST VIL VIH IIN tST VSS 0.7 x VDD /C004230 /C0042100 2.0 0.3 x VDD VDD /C0042260 g V V µA ms Status(12)(13) Output Low (Iload = 100 µA) Output High (Iload = 100 µA) VOL VOH VDD /C0042.8 0.4 V V Minimum Supply Voltage (LVD Trip) VLVD 2.7 3.25 4.0 V Clock Monitor Fail Detection Frequency fmin 50 — 260 kHz Output Stage Performance Electrical Saturation Recovery Time(9) Full Scale Output Range (IOUT = 200 µA) Capacitive Load Drive(10) Output Impedance tDELAY VFSO C L ZO VSST 0.2 300 VDD /C00420.3 100 ms V pF Ω Mechanical Characteristics Transverse Sensitivity(11) Package Resonance VXZ,YZ fPKG 5.0 % FSO kHz NOTES: 1. For a loaded output the measurements are observed after an RC filter consisting of a 1 kΩ resistor and a 0.01 µF capacitor to ground. 2. These limits define the range of operation for which the part will meet specification. 3. Within the supply range of 4.75 and 5.25 volts, the device operates as a fully calibrated linear accelerometer. Beyond these supply limits the device may operate as a linear device but is not guaranteed to be in calibration. 4. The device can measure both + and /C0042 acceleration. With no input acceleration the output is at midsupply. For positive acceleration the output will increase above VDD /2 and for negative acceleration the output will decrease below VDD /2. 5. The device is calibrated at 35g. 6. At clock frequency /C0094 70 kHz. 7. The digital input pin has an internal pull–down current source to prevent inadvertent self test initiation due to external board level leakages. 8. Time for the output to reach 90% of its final value after a self–test is initiated. 9. Time for amplifiers to recover after an acceleration signal causing them to saturate. 10. Preserves phase margin (60°) to guarantee output amplifier stability. 11. A measure of the device’s ability to reject an acceleration applied 90° from the true axis of sensitivity. 12. The Status pin output is not valid following power–up until at least one rising edge has been applied to the self–test pin. The Status pin is high whenever the self–test input is high. 13. The Status pin output latches high if a Low Voltage Detection or Clock Frequency failure occurs, or the EPROM parity changes to odd. The Status pin can be reset by a rising edge on self–test, unless a fault condition continues to exist. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

4 ST Logic input pin used to initiate

5 VOUT Output voltage of the accelerome-

6 STATUS Logic output pin to indicate fault. 7 VSS The power supply ground. 8 VDD The power supply input. Figure 4. SOIC Accelerometer with Recommended Figure 5. Recommend PCB Layout for Interfacing

Use a 0.1 µF capacitor on VDD to decouple the power source.
Physical coupling distance of the accelerometer to the microcontroller should be minimal.
Place a ground plane beneath the accelerometer to reduce noise, the ground plane should be attached to all of the open ended terminals shown in Figure 4.
Use an RC filter of 1 kΩ and 0.01 µF on the output of the accelerometer to minimize clock noise (from the switched capacitor filter circuit).
PCB layout of power and ground should not couple power supply noise.
Accelerometer and microcontroller should not be a high current path.
A/D sampling rate and any external power supply switching frequency should be selected such that they do not inter- fere with the internal accelerometer sampling frequency. This will prevent aliasing errors. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0077/C0065/C0049/C0050/C0048/C0048/C0068 2–10 Motorola Sensor Device Datawww.motorola.com/semiconductors * When positioned as shown, the Earth’s gravity will result in a positive 1g output Positive Acceleration Sensing Direction –Z +Z Direction of Earth’s gravity field.* Side View Side View Side View

ORDERING INFORMATION

Device Temperature Range Case No. Package MMA1200D /C004240 to +85°C Case 475–01 SOIC–16 MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection inter- face between the board and the package. With the correct footprint, the packages will self–align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and short- ing between solder pads. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

Figure 6. Footprint SOIC–16 (Case 475–01) Freescale Semiconductor, Inc.

2–12 Motorola Sensor Device Datawww.motorola.com/semiconductors /C0077/C0105/C0099/C0114/C0111/C0109/C0097/C0099/C0104/C0105/C0110/C0101/C0100 /C0065/C0099/C0099/C0101/C0108/C0101/C0114/C0111/C0109/C0101/C0116/C0101/C0114 The MMA series of silicon capacitive, micromachined accelerometers features signal conditioning, a 4–pole low pass filter and temperature compensation. Zero–g offset full scale span and filter cut–off are factory set and require no external devices. A full system self–test capability verifies system functionality.

Integral Signal Conditioning
Linear Output
Ratiometric Performance
4th Order Bessel Filter Preserves Pulse Shape Integrity
Calibrated Self–test
Low Voltage Detect, Clock Monitor, and EPROM Parity Check Status
Transducer Hermetically Sealed at Wafer Level for Superior Reliability
Robust Design, High Shocks Survivability
Two Packaging Options Available: 1) Plastic DIP for Z Axis Sensing (MMA1201P) 2) Wingback for X Axis Sensing (MMA2200W) Typical Applications
Vibration Monitoring and Recording
Appliance Control
Mechanical Bearing Monitoring
Computer Hard Drive Protection
Computer Mouse and Joysticks
Virtual Reality Input Devices
Sports Diagnostic Devices and Systems SIMPLIFIED ACCELEROMETER FUNCTIONAL BLOCK DIAGRAM G–CELL SENSOR INTEGRATOR GAIN FILTER TEMP COMP SELF–TEST CONTROL LOGIC & EPROM TRIM CIRCUITS CLOCK GEN.OSCILLATOR VDD VOUT VSS VST

Freescale Semiconductor, Inc.

/C0077/C0077/C0065/C0049/C0050/C0048/C0049/C0080 /C0077/C0077/C0065/C0050/C0050/C0048/C0048/C0087 2–13Motorola Sensor Device Data www.motorola.com/semiconductors MAXIMUM RATINGS (Maximum ratings are the limits to which the device can be exposed without causing permanent damage.) Rating Symbol Value Unit Powered Acceleration (all axes) G pd 500 g Unpowered Acceleration (all axes) G upd 2000 g Supply Voltage VDD –0.3 to +7.0 V Drop Test(1) D drop 1.2 m Storage Temperature Range Tstg –40 to +105 °C NOTES: 1. Dropped onto concrete surface from any axis. ELECTRO STATIC DISCHARGE (ESD) WARNING: This device is sensitive to electrostatic discharge. Although the Motorola accelerometers contain internal 2kV ESD protection circuitry, extra precaution must be taken by the user to protect the chip from ESD. A charge of over 2000 volts can accumulate on the human body or associated test equipment. A charge of this magnitude can alter the per- formance or cause failure of the chip. When handling the accelerometer, proper ESD precautions should be followed to avoid exposing the device to discharges which may be detrimental to its performance. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0077/C0065/C0049/C0050/C0048/C0049/C0080 /C0077/C0077/C0065/C0050/C0050/C0048/C0048/C0087 2–14 Motorola Sensor Device Datawww.motorola.com/semiconductors OPERATING CHARACTERISTICS (Unless otherwise noted: –40°C /C0118 TA /C0118 +85°C, 4.75 /C0118 VDD /C0118 5.25, Acceleration = 0g, Loaded output(1)) Characteristic Symbol Min Typ Max Unit Operating Range(2) Supply Voltage(3) Supply Current Operating Temperature Range Acceleration Range VDD IDD TA gFS 4.75 4.0 /C004240 5.00 5.0 5.25 6.0 +85 V mA g Output Signal Zero g (VDD = 5.0 V)(4) Zero g Sensitivity (TA = 25°C, VDD = 5.0 V)(5) Sensitivity (VDD = 5.0 V) Bandwidth Response Nonlinearity VOFF VOFF,V S SV f–3dB NL OUT 2.2 47.5 9.3 360 /C00421.0 2.5 2.8 52.5 10.7 440 +1.0 V V mV/g mV/g/V Hz % FSO Noise RMS (.01–1 kHz) Power Spectral Density Clock Noise (without RC load on output)(6) nRMS nPSD nCLK 110 2.0 3.5 mVrms µV/(Hz1/2) mVpk Self–Test Output Response Input Low Input High Input Loading(7) Response Time(8) gST VIL VIH IIN tST VSS 0.7 x VDD /C004230 /C0042110 2.0 0.3 x VDD VDD /C0042300 g V V µA ms Status(12)(13) Output Low (Iload = 100 µA) Output High (Iload = 100 µA) VOL VOH VDD /C0042.8 0.4 V V Minimum Supply Voltage (LVD Trip) VLVD 2.7 3.25 4.0 V Clock Monitor Fail Detection Frequency fmin 50 — 260 kHz Output Stage Performance Electrical Saturation Recovery Time(9) Full Scale Output Range (IOUT = 200 µA) Capacitive Load Drive(10) Output Impedance tDELAY VFSO C L ZO 0.3 0.2 300 VDD /C00420.3 100 ms V pF Ω Mechanical Characteristics Transverse Sensitivity(11) Package Resonance VZX,YX fPKG 5.0 % FSO kHz NOTES: 1. For a loaded output the measurements are observed after an RC filter consisting of a 1 kΩ resistor and a 0.01 µF capacitor to ground. 2. These limits define the range of operation for which the part will meet specification. 3. Within the supply range of 4.75 and 5.25 volts, the device operates as a fully calibrated linear accelerometer. Beyond these supply limits the device may operate as a linear device but is not guaranteed to be in calibration. 4. The device can measure both + and /C0042 acceleration. With no input acceleration the output is at midsupply. For positive acceleration the output will increase above VDD /2 and for negative acceleration the output will decrease below VDD /2. 5. The device is calibrated at 20g. 6. At clock frequency /C0094 70 kHz. 7. The digital input pin has an internal pull–down current source to prevent inadvertent self test initiation due to external board level leakages. 8. Time for the output to reach 90% of its final value after a self–test is initiated. 9. Time for amplifiers to recover after an acceleration signal causing them to saturate. 10. Preserves phase margin (60°) to guarantee output amplifier stability. 11. A measure of the device’s ability to reject an acceleration applied 90° from the true axis of sensitivity. 12. The Status pin output is not valid following power–up until at least one rising edge has been applied to the self–test pin. The Status pin is high whenever the self–test input is high. 13. The Status pin output latches high if a Low Voltage Detection or Clock Frequency failure occurs, or the EPROM parity changes to odd. The Status pin can be reset by a rising edge on self–test, unless a fault condition continues to exist. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

integrated–circuit accelerometer. using a bulk micromachined “cap’’ wafer. jecting the system to an acceleration (Figure 2). metric and proportional to acceleration. Figure 2. Transducer Figure 3. Equivalent and capacitors) to set the cut–off frequency. and sensitivity will scale linearly with applied supply voltage. in the analog to digital conversion process.

Supply voltage falls below the Low Voltage Detect (LVD) voltage threshold
Clock oscillator falls below the clock monitor minimum frequency
Parity of the EPROM bits becomes odd in number. The fault latch can be reset by a rising edge on the self– test input pin, unless one (or more) of the fault conditions continues to exist. BASIC CONNECTIONS Pinout Description for the Wingback Package 1 2 3 4 5 6 Pin No. Pin Name Description 1 — Leave unconnected or connect to sig- nal ground

2 ST Logic input pin to initiate self test

3 VOUT Output voltage

4 Status Logic output pin to indicate fault

5 VSS Signal ground

6 VDD Supply voltage (5 V)

Freescale Semiconductor, Inc.

Figure 4. Wingback Accelerometer with 4 ST Logic input pin to initiate self test.

5 VOUT Output voltage

6 Status Logic output pin to indicate fault.

7 VSS Signal ground

8 VDD Supply voltage (5 V)

Figure 5. DIP Accelerometer with Recommended Figure 6. Recommend PCB Layout for Interfacing

Use a 0.1 µF capacitor on VDD to decouple the power source.
Physical coupling distance of the accelerometer to the microcontroller should be minimal.
Place a ground plane beneath the accelerometer to reduce noise, the ground plane should be attached to all of the open ended terminals shown in Figure 4.
Use an RC filter of 1 kΩ and 0.01 µF on the output of the accelerometer to minimize clock noise (from the switched capacitor filter circuit).
PCB layout of power and ground should not couple power supply noise.
Accelerometer and microcontroller should not be a high current path.
A/D sampling rate and any external power supply switching frequency should be selected such that they do not inter- fere with the internal accelerometer sampling frequency. This will prevent aliasing errors. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0077/C0065/C0049/C0050/C0048/C0049/C0080 /C0077/C0077/C0065/C0050/C0050/C0048/C0048/C0087 2–17Motorola Sensor Device Data www.motorola.com/semiconductors 16 9 DIP PACKAGE * When positioned as shown, the Earth’s gravity will result in a positive 1g output Positive Acceleration Sensing Direction WINGBACK PACKAGE .090 ∅ .033 Measurement in inches Drilling Patterns WB PACKAGE DRILLING PATTERN .031 6X∅ .049 .047 2X .590 .680 Device Temperature Range Case No. Package MMA1201P –40 to +85°C Case 648C–04 Plastic DIP MMA2200W –40 to +85°C Case 456–06 Plastic Wingback Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

2–18 Motorola Sensor Device Datawww.motorola.com/semiconductors /C0076/C0111/C0119 /C0071 /C0077/C0105/C0099/C0114/C0111/C0109/C0097/C0099/C0104/C0105/C0110/C0101/C0100 /C0065/C0099/C0099/C0101/C0108/C0101/C0114/C0111/C0109/C0101/C0116/C0101/C0114 The MMA series of silicon capacitive, micromachined accelerometers features signal conditioning, a 4–pole low pass filter and temperature compensation. Zero–g offset full scale span and filter cut–off are factory set and require no external devices. A full system self–test capability verifies system functionality.

Integral Signal Conditioning
Linear Output
Ratiometric Performance
4th Order Bessel Filter Preserves Pulse Shape Integrity
Calibrated Self–test
Low Voltage Detect, Clock Monitor, and EPROM Parity Check Status
Transducer Hermetically Sealed at Wafer Level for Superior Reliability
Robust Design, High Shock Survivability Typical Applications
Vibration Monitoring and Recording
Appliance Control
Mechanical Bearing Monitoring
Computer Hard Drive Protection
Computer Mouse and Joysticks
Virtual Reality Input Devices
Sports Diagnostic Devices and Systems

Device Temperature Range Case No. Package MMA1220D –40 to +85°C Case 475–01 SOIC–16 SIMPLIFIED ACCELEROMETER FUNCTIONAL BLOCK DIAGRAM G–CELL SENSOR INTEGRATOR GAIN FILTER TEMP COMP SELF–TEST CONTROL LOGIC & EPROM TRIM CIRCUITS CLOCK GEN.OSCILLATOR VDD VOUT VSS ST Freescale Semiconductor, Inc.

/C0077/C0077/C0065/C0049/C0050/C0050/C0048/C0068 2–19Motorola Sensor Device Data www.motorola.com/semiconductors MAXIMUM RATINGS (Maximum ratings are the limits to which the device can be exposed without causing permanent damage.) Rating Symbol Value Unit Powered Acceleration (all axes) G pd 1500 g Unpowered Acceleration (all axes) G upd 2000 g Supply Voltage VDD –0.3 to +7.0 V Drop Test(1) D drop 1.2 m Storage Temperature Range Tstg –40 to +105 °C NOTES: 1. Dropped onto concrete surface from any axis. ELECTRO STATIC DISCHARGE (ESD) WARNING: This device is sensitive to electrostatic discharge. Although the Motorola accelerometers contain internal 2kV ESD protection circuitry, extra precaution must be taken by the user to protect the chip from ESD. A charge of over 2000 volts can accumulate on the human body or associated test equipment. A charge of this magnitude can alter the per- formance or cause failure of the chip. When handling the accelerometer, proper ESD precautions should be followed to avoid exposing the device to discharges which may be detrimental to its performance. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0077/C0065/C0049/C0050/C0050/C0048/C0068 2–20 Motorola Sensor Device Datawww.motorola.com/semiconductors OPERATING CHARACTERISTICS (Unless otherwise noted: –40°C /C0118 TA /C0118 +85°C, 4.75 /C0118 VDD /C0118 5.25, Acceleration = 0g, Loaded output(1)) Characteristic Symbol Min Typ Max Unit Operating Range(2) Supply Voltage(3) Supply Current Operating Temperature Range Acceleration Range VDD IDD TA gFS 4.75 3.0 /C004240 5.00 5.0 8.0 5.25 6.0 +85 V mA g Output Signal Zero g (VDD = 5.0 V)(4) Zero g Sensitivity (TA = 25°C, VDD = 5.0 V)(5) Sensitivity Bandwidth Response Nonlinearity VOFF VOFF,V S SV f–3dB NL OUT 2.25

0.45 VDD

237.5 46.5 150 /C00421.0 2.5 2.75

0.55 VDD

262.5 53.5 350 +3.0 V V mV/g mV/g/V Hz % FSO Noise RMS (10 Hz – 1 kHz) Clock Noise (without RC load on output)(6) nRMS nCLK 2.0 6.0 mVrms mVpk Self–Test Output Response Input Low Input High Input Loading(7) Response Time(8) /C0068VST VIL VIH IIN tST

0.2 VDD

0.7 VDD

/C004250 /C0042100 2.0

0.3 VDD

/C0042200 V V V µA ms Status(12)(13) Output Low (Iload = 100 µA) Output High (Iload = 100 µA) VOL VOH VDD /C00420.8 0.4 V V Minimum Supply Voltage (LVD Trip) VLVD 2.7 3.25 4.0 V Clock Monitor Fail Detection Frequency fmin 50 — 260 kHz Output Stage Performance Electrical Saturation Recovery Time(9) Full Scale Output Range (IOUT = 200 µA) Capacitive Load Drive(10) Output Impedance tDELAY VFSO C L ZO VSS +0.25 2.0 300 VDD /C00420.25 100 ms V pF Ω Mechanical Characteristics Transverse Sensitivity(11) Package Resonance VXZ,YZ fPKG 5.0 % FSO kHz NOTES: 1. For a loaded output the measurements are observed after an RC filter consisting of a 1 kΩ resistor and a 0.01 µF capacitor to ground. 2. These limits define the range of operation for which the part will meet specification. 3. Within the supply range of 4.75 and 5.25 volts, the device operates as a fully calibrated linear accelerometer. Beyond these supply limits the device may operate as a linear device but is not guaranteed to be in calibration. 4. The device can measure both + and /C0042 acceleration. With no input acceleration the output is at midsupply. For positive acceleration the output will increase above VDD /2 and for negative acceleration the output will decrease below VDD /2. 5. The device is calibrated at 20g, 100 Hz. Sensitivity limits apply to 0 Hz acceleration. 6. At clock frequency /C0094 70 kHz. 7. The digital input pin has an internal pull–down current source to prevent inadvertent self test initiation due to external board level leakages. 8. Time for the output to reach 90% of its final value after a self–test is initiated. 9. Time for amplifiers to recover after an acceleration signal causing them to saturate. 10. Preserves phase margin (60°) to guarantee output amplifier stability. 11. A measure of the device’s ability to reject an acceleration applied 90° from the true axis of sensitivity. 12. The Status pin output is not valid following power–up until at least one rising edge has been applied to the self–test pin. The Status pin is high whenever the self–test input is high. 13. The Status pin output latches high if a Low Voltage Detection or Clock Frequency failure occurs, or the EPROM parity changes to odd. The Status pin can be reset by a rising edge on self–test, unless a fault condition continues to exist. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

VSS and may be left unconnected.

4 ST Logic input pin used to initiate self–

5 VOUT Output voltage of the accelerometer. 6 STATUS Logic output pin used to indicate fault. 7 VSS The power supply ground. 8 VDD The power supply input. 9 thru 13 Trim pins Used for factory trim. 14 thru 16 — No internal connection. Figure 5. Recommended PCB Layout for Interfacing

Use a 0.1 µF capacitor on VDD to decouple the power source.
Physical coupling distance of the accelerometer to the microcontroller should be minimal.
Place a ground plane beneath the accelerometer to reduce noise, the ground plane should be attached to all of the open ended terminals shown in Figure 4.
Use an RC filter of 1 kΩ and 0.01 µF on the output of the accelerometer to minimize clock noise (from the switched capacitor filter circuit).
PCB layout of power and ground should not couple power supply noise.
Accelerometer and microcontroller should not be a high current path.
A/D sampling rate and any external power supply switching frequency should be selected such that they do not inter- fere with the internal accelerometer sampling frequency. This will prevent aliasing errors. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0077/C0065/C0049/C0050/C0050/C0048/C0068 2–23Motorola Sensor Device Data www.motorola.com/semiconductors * When positioned as shown, the Earth’s gravity will result in a positive 1g output ACCELERATION SENSING DIRECTIONS N/C N/C N/C ST VOUT STATUS VSS VDD N/C N/C N/C N/C N/C N/C N/C N/C 16–Pin SOIC Package N/C pins are recommended to be left FLOATING Direction of Earth’s gravity field.* DYNAMIC ACCELERATION STATIC ACCELERATION [ VOUT > 2.75 ] [ VOUT < 2.75 ] –1g +1g 0g 0g VOUT = 2.50V VOUT = 2.50V VOUT = 2.75V VOUT = 2.25V Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

2–24 Motorola Sensor Device Datawww.motorola.com/semiconductors /C0076/C0111/C0119 /C0071 /C0077/C0105/C0099/C0114/C0111/C0109/C0097/C0099/C0104/C0105/C0110/C0101/C0100 /C0065/C0099/C0099/C0101/C0108/C0101/C0114/C0111/C0109/C0101/C0116/C0101/C0114 The MMA series of silicon capacitive, micromachined accelerometers features signal conditioning, a 2–pole low pass filter and temperature compensation. Zero–g offset full scale span and filter cut–off are factory set and require no external devices. A full system self–test capability verifies system functionality.

Integral Signal Conditioning
Linear Output
2nd Order Bessel Filter
Calibrated Self–test
EPROM Parity Check Status
Transducer Hermetically Sealed at Wafer Level for Superior Reliability
Robust Design, High Shock Survivability Typical Applications
Vibration Monitoring and Recording
Appliance Control
Mechanical Bearing Monitoring
Computer Hard Drive Protection
Computer Mouse and Joysticks
Virtual Reality Input Devices
Sports Diagnostic Devices and Systems

Device Temperature Range Case No. Package MMA1250D –40 to +105°C Case 475–01 SOIC–16 SIMPLIFIED ACCELEROMETER FUNCTIONAL BLOCK DIAGRAM G–CELL SENSOR INTEGRATOR GAIN FILTER TEMP COMP & GAIN SELF–TEST CONTROL LOGIC & EPROM TRIM CIRCUITS CLOCK GEN.OSCILLATOR VDD VOUT VSS ST Freescale Semiconductor, Inc.

/C0077/C0077/C0065/C0049/C0050/C0053/C0048/C0068 2–25Motorola Sensor Device Data www.motorola.com/semiconductors MAXIMUM RATINGS (Maximum ratings are the limits to which the device can be exposed without causing permanent damage.) Rating Symbol Value Unit Powered Acceleration (all axes) gpd 1500 g Unpowered Acceleration (all axes) gupd 2000 g Supply Voltage VDD –0.3 to +7.0 V Drop Test(1) H drop 1.2 m Storage Temperature Range Tstg –40 to +125 °C NOTES: 1. Dropped onto concrete surface from any axis. ELECTRO STATIC DISCHARGE (ESD) WARNING: This device is sensitive to electrostatic discharge. Although the Motorola accelerometers contain internal 2kV ESD protection circuitry, extra precaution must be taken by the user to protect the chip from ESD. A charge of over 2000 volts can accumulate on the human body or associated test equipment. A charge of this magnitude can alter the per- formance or cause failure of the chip. When handling the ac- celerometer, proper ESD precautions should be followed to avoid exposing the device to discharges which may be detri- mental to its performance. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0077/C0065/C0049/C0050/C0053/C0048/C0068 2–26 Motorola Sensor Device Datawww.motorola.com/semiconductors OPERATING CHARACTERISTICS (Unless otherwise noted: –40°C /C0118 TA /C0118 +105°C, 4.75 /C0118 VDD /C0118 5.25, Acceleration = 0g, Loaded output(1)) Characteristic Symbol Min Typ Max Unit Operating Range(2) Supply Voltage(3) Supply Current Operating Temperature Range Acceleration Range VDD IDD TA gFS 4.75 1.1 /C004240 5.00 2.1 5.25 3.0 +105 V mA g Output Signal Zero g (TA = 25°C, VDD = 5.0 V)(4) Zero g (VDD = 5.0 V) Sensitivity (TA = 25°C, VDD = 5.0 V)(5) Sensitivity (VDD = 5.0 V) Bandwidth Response Nonlinearity VOFF VOFF S S f–3dB NL OUT 2.25 2.0 380 370 42.5 /C00421.0 2.5 2.5 400 400 2.75 3.0 420 430.1 57.5 +1.0 V V mV/g mV/g Hz % FSO Noise RMS (0.1 Hz – 1.0 kHz) Spectral Density (RMS, 0.1 Hz – 1.0 kHz)(6) nRMS nSD 2.0 700 4.0 mVrms µg/√Hz Self–Test Output Response (VDD = 5.0 V) Input Low Input High Input Loading(7) Response Time(8) /C0068VST VIL VIH IIN tST 1.0 VSS /C004250 1.25 /C0042125 1.5 /C0042300 V V V µA ms Status(12)(13) Output Low (Iload = 100 µA) Output High (Iload = –100 µA) VOL VOH VDD /C00420.8 0.4 V V Output Stage Performance Electrical Saturation Recovery Time(9) Full Scale Output Range (IOUT = –200 µA) Capacitive Load Drive(10) Output Impedance tDELAY VFSO C L ZO VSS +0.25 2.0 VDD /C00420.25 100 ms V pF Ω Mechanical Characteristics Transverse Sensitivity(11) VXZ,YZ — — 5.0 % FSO NOTES: 1. For a loaded output the measurements are observed after an RC filter consisting of a 1 kΩ resistor and a 0.1 µF capacitor to ground. 2. These limits define the range of operation for which the part will meet specification. 3. Within the supply range of 4.75 and 5.25 volts, the device operates as a fully calibrated linear accelerometer. Beyond these supply limits the device may operate as a linear device but is not guaranteed to be in calibration. 4. The device can measure both + and /C0042 acceleration. With no input acceleration the output is at midsupply. For positive acceleration the output will increase above VDD /2 and for negative acceleration the output will decrease below VDD /2. 5. Sensitivity limits apply to 0 Hz acceleration. 6. At clock frequency /C0094 35 kHz. 7. The digital input pin has an internal pull–down current source to prevent inadvertent self test initiation due to external board level leakages. 8. Time for the output to reach 90% of its final value after a self–test is initiated. 9. Time for amplifiers to recover after an acceleration signal causing them to saturate. 10. Preserves phase margin (60°) to guarantee output amplifier stability. 11. A measure of the device’s ability to reject an acceleration applied 90° from the true axis of sensitivity. 12. The Status pin output is not valid following power–up until at least one rising edge has been applied to the self–test pin. The Status pin is high whenever the self–test input is high. 13. The Status pin output latches high if the EPROM parity changes to odd. The Status pin can be reset by a rising edge on self–test, unless a fault condition continues to exist. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

Figure 4. Pinout Description VSS and may be left unconnected. 4 VOUT Output voltage of the accelerometer. 5 STATUS Logic output pin used to indicate fault. 6 VDD The power supply input. 7 VSS The power supply ground.

8 ST Logic input pin used to initiate self–

9 thru 13 Trim pins Used for factory trim. 14 thru 16 — No internal connection. Figure 5. SOIC Accelerometer with Recommended Figure 6. Recommended PCB Layout for Interfacing

Use a 0.1 µF capacitor on VDD to decouple the power source.
Physical coupling distance of the accelerometer to the mi- crocontroller should be minimal.
Place a ground plane beneath the accelerometer to reduce noise, the ground plane should be attached to all internal VSS terminals shown in Figure 4.
Use an RC filter of 1 kΩ and 0.1 µF on the output of the ac- celerometer to minimize clock noise (from the switched capacitor filter circuit).
PCB layout of power and ground should not couple power supply noise.
Accelerometer and microcontroller should not be a high current path.
A/D sampling rate and any external power supply switching frequency should be selected such that they do not inter- fere with the internal accelerometer sampling frequency. This will prevent aliasing errors. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0077/C0065/C0049/C0050/C0053/C0048/C0068 2–29Motorola Sensor Device Data www.motorola.com/semiconductors * When positioned as shown, the Earth’s gravity will result in a positive 1g output ACCELERATION SENSING DIRECTIONS VSS VSS VSS VOUT STATUS VDD VSS ST N/C N/C N/C N/C N/C N/C N/C N/C 16–Pin SOIC Package N/C pins are recommended to be left FLOATING Direction of Earth’s gravity field.* DYNAMIC ACCELERATION STATIC ACCELERATION –1g +1g 0g 0g VOUT = 2.50V VOUT = 2.50V VOUT = 2.9V VOUT = 2.1V Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

2–30 Motorola Sensor Device Datawww.motorola.com/semiconductors /C0076/C0111/C0119 /C0071 /C0077/C0105/C0099/C0114/C0111/C0109/C0097/C0099/C0104/C0105/C0110/C0101/C0100 /C0065/C0099/C0099/C0101/C0108/C0101/C0114/C0111/C0109/C0101/C0116/C0101/C0114 The MMA series of silicon capacitive, micromachined accelerometers features signal conditioning, a 2–pole low pass filter and temperature compensation. Zero–g offset full scale span and filter cut–off are factory set and require no external devices. A full system self–test capability verifies system functionality.

Integral Signal Conditioning
Linear Output
2nd Order Bessel Filter
Calibrated Self–test
EPROM Parity Check Status
Transducer Hermetically Sealed at Wafer Level for Superior Reliability
Robust Design, High Shock Survivability Typical Applications
Vibration Monitoring and Recording
Appliance Control
Mechanical Bearing Monitoring
Computer Hard Drive Protection
Computer Mouse and Joysticks
Virtual Reality Input Devices
Sports Diagnostic Devices and Systems

Device Temperature Range Case No. Package MMA1260D –40 to +105°C Case 475–01 SOIC–16 SIMPLIFIED ACCELEROMETER FUNCTIONAL BLOCK DIAGRAM G–CELL SENSOR INTEGRATOR GAIN FILTER TEMP COMP & GAIN SELF–TEST CONTROL LOGIC & EPROM TRIM CIRCUITS CLOCK GEN.OSCILLATOR VDD VOUT VSS ST Freescale Semiconductor, Inc.

/C0077/C0077/C0065/C0049/C0050/C0054/C0048/C0068 2–31Motorola Sensor Device Data www.motorola.com/semiconductors MAXIMUM RATINGS (Maximum ratings are the limits to which the device can be exposed without causing permanent damage.) Rating Symbol Value Unit Powered Acceleration (all axes) gpd 1500 g Unpowered Acceleration (all axes) gupd 2000 g Supply Voltage VDD –0.3 to +7.0 V Drop Test(1) H drop 1.2 m Storage Temperature Range Tstg –40 to +125 °C NOTES: 1. Dropped onto concrete surface from any axis. ELECTRO STATIC DISCHARGE (ESD) WARNING: This device is sensitive to electrostatic discharge. Although the Motorola accelerometers contain internal 2kV ESD protection circuitry, extra precaution must be taken by the user to protect the chip from ESD. A charge of over 2000 volts can accumulate on the human body or associated test equipment. A charge of this magnitude can alter the per- formance or cause failure of the chip. When handling the ac- celerometer, proper ESD precautions should be followed to avoid exposing the device to discharges which may be detri- mental to its performance. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0077/C0065/C0049/C0050/C0054/C0048/C0068 2–32 Motorola Sensor Device Datawww.motorola.com/semiconductors OPERATING CHARACTERISTICS (Unless otherwise noted: –40°C /C0118 TA /C0118 +105°C, 4.75 /C0118 VDD /C0118 5.25, Acceleration = 0g, Loaded output(1)) Characteristic Symbol Min Typ Max Unit Operating Range(2) Supply Voltage(3) Supply Current Operating Temperature Range Acceleration Range VDD IDD TA gFS 4.75 1.1 /C004240 5.00 2.2 1.5 5.25 3.2 +105 V mA g Output Signal Zero g (TA = 25°C, VDD = 5.0 V)(4) Zero g (VDD = 5.0 V) Sensitivity (TA = 25°C, VDD = 5.0 V)(5) Sensitivity (VDD = 5.0 V) Bandwidth Response Nonlinearity VOFF VOFF S S f–3dB NL OUT 2.25 2.2 1140 1110 /C00421.0 2.5 2.5 1200 1200 2.75 2.8 1260 1290 +1.0 V V mV/g mV/g Hz % FSO Noise RMS (0.1 Hz – 1.0 kHz) Spectral Density (RMS, 0.1 Hz – 1.0 kHz)(6) nRMS nSD 5.0 500 9.0 mVrms µg/√Hz Self–Test Output Response (VDD = 5.0 V) Input Low Input High Input Loading(7) Response Time(8) /C0068VST VIL VIH IIN tST 0.3 VSS /C004250 0.6 /C0042125 0.9 /C0042300 V V V µA ms Status(12)(13) Output Low (Iload = 100 µA) Output High (Iload = –100 µA) VOL VOH VDD /C00420.8 0.4 V V Output Stage Performance Electrical Saturation Recovery Time(9) Full Scale Output Range (IOUT = –200 µA) Capacitive Load Drive(10) Output Impedance tDELAY VFSO C L ZO VSS +0.25 2.0 VDD /C00420.25 100 ms V pF Ω Mechanical Characteristics Transverse Sensitivity(11) VXZ,YZ — — 5.0 % FSO NOTES: 1. For a loaded output the measurements are observed after an RC filter consisting of a 1 kΩ resistor and a 0.1 µF capacitor to ground. 2. These limits define the range of operation for which the part will meet specification. 3. Within the supply range of 4.75 and 5.25 volts, the device operates as a fully calibrated linear accelerometer. Beyond these supply limits the device may operate as a linear device but is not guaranteed to be in calibration. 4. The device can measure both + and /C0042 acceleration. With no input acceleration the output is at midsupply. For positive acceleration the output will increase above VDD /2 and for negative acceleration the output will decrease below VDD /2. 5. Sensitivity limits apply to 0 Hz acceleration. 6. At clock frequency /C0094 35 kHz. 7. The digital input pin has an internal pull–down current source to prevent inadvertent self test initiation due to external board level leakages. 8. Time for the output to reach 90% of its final value after a self–test is initiated. 9. Time for amplifiers to recover after an acceleration signal causing them to saturate. 10. Preserves phase margin (60°) to guarantee output amplifier stability. 11. A measure of the device’s ability to reject an acceleration applied 90° from the true axis of sensitivity. 12. The Status pin output is not valid following power–up until at least one rising edge has been applied to the self–test pin. The Status pin is high whenever the self–test input is high. 13. The Status pin output latches high if the EPROM parity changes to odd. The Status pin can be reset by a rising edge on self–test, unless a fault condition continues to exist. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

VSS and may be left unconnected. 4 VOUT Output voltage of the accelerometer. 5 STATUS Logic output pin used to indicate fault. 6 VDD The power supply input. 7 VSS The power supply ground. 9 thru 13 Trim pins Used for factory trim. 14 thru 16 — No internal connection.

Use a 0.1 µF capacitor on VDD to decouple the power source.
Physical coupling distance of the accelerometer to the mi- crocontroller should be minimal.
Place a ground plane beneath the accelerometer to reduce noise, the ground plane should be attached to all internal VSS terminals shown in Figure 4.
Use an RC filter of 1 kΩ and 0.1 µF on the output of the ac- celerometer to minimize clock noise (from the switched capacitor filter circuit).
PCB layout of power and ground should not couple power supply noise.
Accelerometer and microcontroller should not be a high current path.
A/D sampling rate and any external power supply switching frequency should be selected such that they do not inter- fere with the internal accelerometer sampling frequency. This will prevent aliasing errors. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0077/C0065/C0049/C0050/C0054/C0048/C0068 2–35Motorola Sensor Device Data www.motorola.com/semiconductors * When positioned as shown, the Earth’s gravity will result in a positive 1g output ACCELERATION SENSING DIRECTIONS VSS VSS VSS VOUT STATUS VDD VSS ST N/C N/C N/C N/C N/C N/C N/C N/C 16–Pin SOIC Package N/C pins are recommended to be left FLOATING Direction of Earth’s gravity field.* DYNAMIC ACCELERATION STATIC ACCELERATION –1g +1g 0g 0g VOUT = 2.50V VOUT = 2.50V VOUT = 3.7V VOUT = 1.3V Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

2–36 Motorola Sensor Device Datawww.motorola.com/semiconductors /C0076/C0111/C0119 /C0071 /C0077/C0105/C0099/C0114/C0111/C0109/C0097/C0099/C0104/C0105/C0110/C0101/C0100 /C0065/C0099/C0099/C0101/C0108/C0101/C0114/C0111/C0109/C0101/C0116/C0101/C0114 The MMA series of silicon capacitive, micromachined accelerometers features signal conditioning, a 2–pole low pass filter and temperature compensation. Zero–g offset full scale span and filter cut–off are factory set and require no external devices. A full system self–test capability verifies system functionality.

Integral Signal Conditioning
Linear Output
2nd Order Bessel Filter
Calibrated Self–test
EPROM Parity Check Status
Transducer Hermetically Sealed at Wafer Level for Superior Reliability
Robust Design, High Shock Survivability Typical Applications
Vibration Monitoring and Recording
Appliance Control
Mechanical Bearing Monitoring
Computer Hard Drive Protection
Computer Mouse and Joysticks
Virtual Reality Input Devices
Sports Diagnostic Devices and Systems

Device Temperature Range Case No. Package MMA1270D –40 to +105°C Case 475–01 SOIC–16 SIMPLIFIED ACCELEROMETER FUNCTIONAL BLOCK DIAGRAM G–CELL SENSOR INTEGRATOR GAIN FILTER TEMP COMP & GAIN SELF–TEST CONTROL LOGIC & EPROM TRIM CIRCUITS CLOCK GEN.OSCILLATOR VDD VOUT VSS ST Freescale Semiconductor, Inc.

/C0077/C0077/C0065/C0049/C0050/C0055/C0048/C0068 2–37Motorola Sensor Device Data www.motorola.com/semiconductors MAXIMUM RATINGS (Maximum ratings are the limits to which the device can be exposed without causing permanent damage.) Rating Symbol Value Unit Powered Acceleration (all axes) gpd 1500 g Unpowered Acceleration (all axes) gupd 2000 g Supply Voltage VDD –0.3 to +7.0 V Drop Test(1) H drop 1.2 m Storage Temperature Range Tstg –40 to +125 °C NOTES: 1. Dropped onto concrete surface from any axis. ELECTRO STATIC DISCHARGE (ESD) WARNING: This device is sensitive to electrostatic discharge. Although the Motorola accelerometers contain internal 2kV ESD protection circuitry, extra precaution must be taken by the user to protect the chip from ESD. A charge of over 2000 volts can accumulate on the human body or associated test equipment. A charge of this magnitude can alter the per- formance or cause failure of the chip. When handling the ac- celerometer, proper ESD precautions should be followed to avoid exposing the device to discharges which may be detri- mental to its performance. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0077/C0065/C0049/C0050/C0055/C0048/C0068 2–38 Motorola Sensor Device Datawww.motorola.com/semiconductors OPERATING CHARACTERISTICS (Unless otherwise noted: –40°C /C0118 TA /C0118 +105°C, 4.75 /C0118 VDD /C0118 5.25, Acceleration = 0g, Loaded output(1)) Characteristic Symbol Min Typ Max Unit Operating Range(2) Supply Voltage(3) Supply Current Operating Temperature Range Acceleration Range VDD IDD TA gFS 4.75 1.1 /C004240 5.00 2.1 2.5 5.25 3.0 +105 V mA g Output Signal Zero g (TA = 25°C, VDD = 5.0 V)(4) Zero g (VDD = 5.0 V) Sensitivity (TA = 25°C, VDD = 5.0 V)(5) Sensitivity(VDD = 5.0 V) Bandwidth Response Nonlinearity VOFF VOFF S S f–3dB NL OUT 2.25 2.2 712.5 693.8 /C00421.0 2.5 2.5 750 750 2.75 2.8 787.5 806.3 +1.0 V V mV/g mV/g Hz % FSO Noise RMS (0.1 Hz – 1.0 kHz) Spectral Density (RMS, 0.1 Hz – 1.0 kHz)(6) nRMS nSD 3.5 700 6.5 mVrms µg/√Hz Self–Test Output Response (VDD = 5.0 V) Input Low Input High Input Loading(7) Response Time(8) /C0068VST VIL VIH IIN tST 0.9 VSS /C004250 1.25 /C0042125 1.6 /C0042300 V V V µA ms Status(12)(13) Output Low (Iload = 100 µA) Output High (Iload = –100 µA) VOL VOH VDD /C00420.8 0.4 V V Output Stage Performance Electrical Saturation Recovery Time(9) Full Scale Output Range (IOUT = –200 µA) Capacitive Load Drive(10) Output Impedance tDELAY VFSO C L ZO VSS +0.25 2.0 VDD /C00420.25 100 ms V pF Ω Mechanical Characteristics Transverse Sensitivity(11) VXZ,YZ — — 5.0 % FSO NOTES: 1. For a loaded output the measurements are observed after an RC filter consisting of a 1 kΩ resistor and a 0.1 µF capacitor to ground. 2. These limits define the range of operation for which the part will meet specification. 3. Within the supply range of 4.75 and 5.25 volts, the device operates as a fully calibrated linear accelerometer. Beyond these supply limits the device may operate as a linear device but is not guaranteed to be in calibration. 4. The device can measure both + and /C0042 acceleration. With no input acceleration the output is at midsupply. For positive acceleration the output will increase above VDD /2 and for negative acceleration the output will decrease below VDD /2. 5. Sensitivity limits apply to 0 Hz acceleration. 6. At clock frequency /C0094 35 kHz. 7. The digital input pin has an internal pull–down current source to prevent inadvertent self test initiation due to external board level leakages. 8. Time for the output to reach 90% of its final value after a self–test is initiated. 9. Time for amplifiers to recover after an acceleration signal causing them to saturate. 10. Preserves phase margin (60°) to guarantee output amplifier stability. 11. A measure of the device’s ability to reject an acceleration applied 90° from the true axis of sensitivity. 12. The Status pin output is not valid following power–up until at least one rising edge has been applied to the self–test pin. The Status pin is high whenever the self–test input is high. 13. The Status pin output latches high if the EPROM parity changes to odd. The Status pin can be reset by a rising edge on self–test, unless a fault condition continues to exist. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

Use a 0.1 µF capacitor on VDD to decouple the power source.
Physical coupling distance of the accelerometer to the mi- crocontroller should be minimal.
Place a ground plane beneath the accelerometer to reduce noise, the ground plane should be attached to all internal VSS terminals shown in Figure 4.
Use an RC filter of 1 kΩ and 0.1 µF on the output of the ac- celerometer to minimize clock noise (from the switched capacitor filter circuit).
PCB layout of power and ground should not couple power supply noise.
Accelerometer and microcontroller should not be a high current path.
A/D sampling rate and any external power supply switching frequency should be selected such that they do not inter- fere with the internal accelerometer sampling frequency. This will prevent aliasing errors. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0077/C0065/C0049/C0050/C0055/C0048/C0068 2–41Motorola Sensor Device Data www.motorola.com/semiconductors * When positioned as shown, the Earth’s gravity will result in a positive 1g output ACCELERATION SENSING DIRECTIONS VSS VSS VSS VOUT STATUS VDD VSS ST N/C N/C N/C N/C N/C N/C N/C N/C 16–Pin SOIC Package N/C pins are recommended to be left FLOATING Direction of Earth’s gravity field.* DYNAMIC ACCELERATION STATIC ACCELERATION –1g +1g 0g 0g VOUT = 2.50V VOUT = 2.50V VOUT = 3.25V VOUT = 1.75V Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

2–42 Motorola Sensor Device Datawww.motorola.com/semiconductors /C0083/C0117/C0114/C0102/C0097/C0099/C0101 /C0077/C0111/C0117/C0110/C0116 /C0077/C0105/C0099/C0114/C0111/C0109/C0097/C0099/C0104/C0105/C0110/C0101/C0100 /C0065/C0099/C0099/C0101/C0108/C0101/C0114/C0111/C0109/C0101/C0116/C0101/C0114 The MMA series of silicon capacitive, micromachined accelerometers features signal conditioning, a 4–pole low pass filter and temperature compensation. Zero–g offset full scale span and filter cut–off are factory set and require no external devices. A full system self–test capability verifies system functionality.

Integral Signal Conditioning
Linear Output
Ratiometric Performance
4th Order Bessel Filter Preserves Pulse Shape Integrity
Calibrated Self–test
Low Voltage Detect, Clock Monitor, and EPROM Parity Check Status
Transducer Hermetically Sealed at Wafer Level for Superior Reliability
Robust Design, High Shocks Survivability Typical Applications
Vibration Monitoring and Recording
Appliance Control
Mechanical Bearing Monitoring
Computer Hard Drive Protection
Computer Mouse and Joysticks
Virtual Reality Input Devices
Sports Diagnostic Devices and Systems SIMPLIFIED ACCELEROMETER FUNCTIONAL BLOCK DIAGRAM G–CELL SENSOR INTEGRATOR GAIN FILTER TEMP COMP SELF–TEST CONTROL LOGIC & EPROM TRIM CIRCUITS CLOCK GEN.OSCILLATOR VDD VOUT VSS VST

Freescale Semiconductor, Inc.

/C0077/C0077/C0065/C0050/C0050/C0048/C0049/C0068 2–43Motorola Sensor Device Data www.motorola.com/semiconductors MAXIMUM RATINGS (Maximum ratings are the limits to which the device can be exposed without causing permanent damage.) Rating Symbol Value Unit Powered Acceleration (all axes) G pd 500 g Unpowered Acceleration (all axes) G upd 2000 g Supply Voltage VDD –0.3 to +7.0 V Drop Test(1) D drop 1.2 m Storage Temperature Range Tstg –40 to +105 °C NOTES: 1. Dropped onto concrete surface from any axis. ELECTRO STATIC DISCHARGE (ESD) WARNING: This device is sensitive to electrostatic discharge. Although the Motorola accelerometers contain internal 2kV ESD protection circuitry, extra precaution must be taken by the user to protect the chip from ESD. A charge of over 2000 volts can accumulate on the human body or associated test equipment. A charge of this magnitude can alter the per- formance or cause failure of the chip. When handling the accelerometer, proper ESD precautions should be followed to avoid exposing the device to discharges which may be detrimental to its performance. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0077/C0065/C0050/C0050/C0048/C0049/C0068 2–44 Motorola Sensor Device Datawww.motorola.com/semiconductors OPERATING CHARACTERISTICS (Unless otherwise noted: –40°C /C0118 TA /C0118 +85°C, 4.75 /C0118 VDD /C0118 5.25, Acceleration = 0g, Loaded output(1)) Characteristic Symbol Min Typ Max Unit Operating Range(2) Supply Voltage(3) Supply Current Operating Temperature Range Acceleration Range VDD IDD TA gFS 4.75 4.0 /C004240 5.00 5.0 5.25 6.0 +85 V mA g Output Signal Zero g (VDD = 5.0 V)(4) Zero g Sensitivity (TA = 25°C, VDD = 5.0 V)(5) Sensitivity Bandwidth Response Nonlinearity VOFF VOFF,V S SV f–3dB NL OUT 2.3 47.5 9.3 360 /C00421.0 2.5 2.7 52.5 10.7 440 +1.0 V V mV/g mV/g/V Hz % FSO Noise RMS (.01–1 kHz) Power Spectral Density Clock Noise (without RC load on output)(6) nRMS nPSD nCLK 110 2.0 2.8 mVrms µV/(Hz1/2) mVpk Self–Test Output Response Input Low Input High Input Loading(7) Response Time(8) gST VIL VIH IIN tST VSS 0.7 x VDD /C004230 /C0042110 2.0 0.3 x VDD VDD /C0042300 g V V µA ms Status(12)(13) Output Low (Iload = 100 µA) Output High (Iload = 100 µA) VOL VOH VDD /C0042.8 0.4 V V Minimum Supply Voltage (LVD Trip) VLVD 2.7 3.25 4.0 V Clock Monitor Fail Detection Frequency fmin 150 — 400 kHz Output Stage Performance Electrical Saturation Recovery Time(9) Full Scale Output Range (IOUT = 200 µA) Capacitive Load Drive(10) Output Impedance tDELAY VFSO C L ZO 0.3 0.2 300 VDD /C00420.3 100 ms V pF Ω Mechanical Characteristics Transverse Sensitivity(11) Package Resonance VZX,YX fPKG 5.0 % FSO kHz NOTES: 1. For a loaded output the measurements are observed after an RC filter consisting of a 1 kΩ resistor and a 0.01 µF capacitor to ground. 2. These limits define the range of operation for which the part will meet specification. 3. Within the supply range of 4.75 and 5.25 volts, the device operates as a fully calibrated linear accelerometer. Beyond these supply limits the device may operate as a linear device but is not guaranteed to be in calibration. 4. The device can measure both + and /C0042 acceleration. With no input acceleration the output is at midsupply. For positive acceleration the output will increase above VDD /2 and for negative acceleration the output will decrease below VDD /2. 5. The device is calibrated at 20g. 6. At clock frequency /C0094 70 kHz. 7. The digital input pin has an internal pull–down current source to prevent inadvertent self test initiation due to external board level leakages. 8. Time for the output to reach 90% of its final value after a self–test is initiated. 9. Time for amplifiers to recover after an acceleration signal causing them to saturate. 10. Preserves phase margin (60°) to guarantee output amplifier stability. 11. A measure of the device’s ability to reject an acceleration applied 90° from the true axis of sensitivity. 12. The Status pin output is not valid following power–up until at least one rising edge has been applied to the self–test pin. The Status pin is high whenever the self–test input is high. 13. The Status pin output latches high if a Low Voltage Detection or Clock Frequency failure occurs, or the EPROM parity changes to odd. The Status pin can be reset by a rising edge on self–test, unless a fault condition continues to exist. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

7 VSS The power supply ground. 8 VDD The power supply input.

Use a 0.1 µF capacitor on VDD to decouple the power source.
Physical coupling distance of the accelerometer to the microcontroller should be minimal.
Place a ground plane beneath the accelerometer to reduce noise, the ground plane should be attached to all of the open ended terminals shown in Figure 4.
Use an RC filter of 1 kΩ and 0.01 µF on the output of the accelerometer to minimize clock noise (from the switched capacitor filter circuit).
PCB layout of power and ground should not couple power supply noise.
Accelerometer and microcontroller should not be a high current path.
A/D sampling rate and any external power supply switching frequency should be selected such that they do not inter- fere with the internal accelerometer sampling frequency. This will prevent aliasing errors. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0077/C0065/C0050/C0050/C0048/C0049/C0068 2–47Motorola Sensor Device Data www.motorola.com/semiconductors * When positioned as shown, the Earth’s gravity will result in a positive 1g output Positive Acceleration Sensing Direction N/C N/C N/C SELF TEST XOUT N/C VSS VDD N/C N/C N/C N/C N/C N/C N/C N/C 16–Pin SOIC Package N/C pins are recommended to be left FLOATING AXIS ORIENTATION (ACCELERATION FORCE VECTOR) –X +X 10 11 12 13 14 15 16 8 7654321 Direction of Earth’s gravity field.* Device Temperature Range Case No. Package MMA2201D /C004240 to +85°C Case 475–01 SOIC–16 Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

2–48 Motorola Sensor Device Datawww.motorola.com/semiconductors /C0083/C0117/C0114/C0102/C0097/C0099/C0101 /C0077/C0111/C0117/C0110/C0116 /C0077/C0105/C0099/C0114/C0111/C0109/C0097/C0099/C0104/C0105/C0110/C0101/C0100 /C0065/C0099/C0099/C0101/C0108/C0101/C0114/C0111/C0109/C0101/C0116/C0101/C0114 The MMA series of silicon capacitive, micromachined accelerometers features signal conditioning, a 4–pole low pass filter and temperature compensation. Zero–g offset full scale span and filter cut–off are factory set and require no external devices. A full system self–test capability verifies system functionality.

Integral Signal Conditioning
Linear Output
Ratiometric Performance
4th Order Bessel Filter Preserves Pulse Shape Integrity
Calibrated Self–test
Low Voltage Detect, Clock Monitor, and EPROM Parity Check Status
Transducer Hermetically Sealed at Wafer Level for Superior Reliability
Robust Design, High Shocks Survivability Typical Applications
Vibration Monitoring and Recording
Impact Monitoring
Appliance Control
Mechanical Bearing Monitoring
Computer Hard Drive Protection
Computer Mouse and Joysticks
Virtual Reality Input Devices
Sports Diagnostic Devices and Systems SIMPLIFIED ACCELEROMETER FUNCTIONAL BLOCK DIAGRAM G–CELL SENSOR INTEGRATOR GAIN FILTER TEMP COMP SELF–TEST CONTROL LOGIC & EPROM TRIM CIRCUITS CLOCK GEN.OSCILLATOR VDD VOUT VSS ST

Freescale Semiconductor, Inc.

/C0077/C0077/C0065/C0050/C0050/C0048/C0050/C0068 2–49Motorola Sensor Device Data www.motorola.com/semiconductors MAXIMUM RATINGS (Maximum ratings are the limits to which the device can be exposed without causing permanent damage.) Rating Symbol Value Unit Powered Acceleration (all axes) G pd 500 g Unpowered Acceleration (all axes) G upd 2000 g Supply Voltage VDD –0.3 to +7.0 V Drop Test(1) D drop 1.2 m Storage Temperature Range Tstg –40 to +105 °C NOTES: 1. Dropped onto concrete surface from any axis. ELECTRO STATIC DISCHARGE (ESD) WARNING: This device is sensitive to electrostatic discharge. Although the Motorola accelerometers contain internal 2kV ESD protection circuitry, extra precaution must be taken by the user to protect the chip from ESD. A charge of over 2000 volts can accumulate on the human body or associated test equipment. A charge of this magnitude can alter the per- formance or cause failure of the chip. When handling the accelerometer, proper ESD precautions should be followed to avoid exposing the device to discharges which may be detrimental to its performance. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0077/C0065/C0050/C0050/C0048/C0050/C0068 2–50 Motorola Sensor Device Datawww.motorola.com/semiconductors OPERATING CHARACTERISTICS (Unless otherwise noted: –40°C /C0118 TA /C0118 +85°C, 4.75 /C0118 VDD /C0118 5.25, Acceleration = 0g, Loaded output(1)) Characteristic Symbol Min Typ Max Unit Operating Range(2) Supply Voltage(3) Supply Current Operating Temperature Range Acceleration Range VDD IDD TA gFS 4.75 4.0 /C004240 5.00 5.0 5.25 6.0 +85 V mA g Output Signal Zero g (VDD = 5.0 V)(4) Zero g Sensitivity (TA = 25°C, VDD = 5.0 V)(5) Sensitivity Bandwidth Response Nonlinearity VOFF VOFF,V S SV f–3dB NL OUT 2.3 7.4 360 /C00421.0 2.5 2.7 8.6 440 +1.0 V V mV/g mV/g/V Hz % FSO Noise RMS (.01–1 kHz) Power Spectral Density Clock Noise (without RC load on output)(6) nRMS nPSD nCLK 110 2.0 2.8 mVrms µV/(Hz1/2) mVpk Self–Test Output Response Input Low Input High Input Loading(7) Response Time(8) gST VIL VIH IIN tST VSS 0.7 x VDD /C004230 /C0042110 2.0 0.3 x VDD VDD /C0042300 g V V µA ms Status(12)(13) Output Low (Iload = 100 µA) Output High (Iload = 100 µA) VOL VOH VDD /C0042.8 0.4 V V Minimum Supply Voltage (LVD Trip) VLVD 2.7 3.25 4.0 V Clock Monitor Fail Detection Frequency fmin 150 — 400 kHz Output Stage Performance Electrical Saturation Recovery Time(9) Full Scale Output Range (IOUT = 200 µA) Capacitive Load Drive(10) Output Impedance tDELAY VFSO C L ZO 0.3 0.2 300 VDD /C00420.3 100 ms V pF Ω Mechanical Characteristics Transverse Sensitivity(11) Package Resonance VZX,YX fPKG 5.0 % FSO kHz NOTES: 1. For a loaded output the measurements are observed after an RC filter consisting of a 1 kΩ resistor and a 0.01 µF capacitor to ground. 2. These limits define the range of operation for which the part will meet specification. 3. Within the supply range of 4.75 and 5.25 volts, the device operates as a fully calibrated linear accelerometer. Beyond these supply limits the device may operate as a linear device but is not guaranteed to be in calibration. 4. The device can measure both + and /C0042 acceleration. With no input acceleration the output is at midsupply. For positive acceleration the output will increase above VDD /2 and for negative acceleration the output will decrease below VDD /2. 5. The device is calibrated at 20g. 6. At clock frequency /C0094 70 kHz. 7. The digital input pin has an internal pull–down current source to prevent inadvertent self test initiation due to external board level leakages. 8. Time for the output to reach 90% of its final value after a self–test is initiated. 9. Time for amplifiers to recover after an acceleration signal causing them to saturate. 10. Preserves phase margin (60°) to guarantee output amplifier stability. 11. A measure of the device’s ability to reject an acceleration applied 90° from the true axis of sensitivity. 12. The Status pin output is not valid following power–up until at least one rising edge has been applied to the self–test pin. The Status pin is high whenever the self–test input is high. 13. The Status pin output latches high if a Low Voltage Detection or Clock Frequency failure occurs, or the EPROM parity changes to odd. The Status pin can be reset by a rising edge on self–test, unless a fault condition continues to exist. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

6 STATUS Logic output pin to indicate fault. 7 VSS The power supply ground. 8 VDD The power supply input.

Use a 0.1 µF capacitor on VDD to decouple the power source.
Physical coupling distance of the accelerometer to the microcontroller should be minimal.
Place a ground plane beneath the accelerometer to reduce noise, the ground plane should be attached to all of the open ended terminals shown in Figure 4.
Use an RC filter of 1 kΩ and 0.01 µF on the output of the accelerometer to minimize clock noise (from the switched capacitor filter circuit).
PCB layout of power and ground should not couple power supply noise.
Accelerometer and microcontroller should not be a high current path.
A/D sampling rate and any external power supply switching frequency should be selected such that they do not inter- fere with the internal accelerometer sampling frequency. This will prevent aliasing errors. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0077/C0065/C0050/C0050/C0048/C0050/C0068 2–53Motorola Sensor Device Data www.motorola.com/semiconductors * When positioned as shown, the Earth’s gravity will result in a positive 1g output Positive Acceleration Sensing Direction 16–Pin SOIC Package N/C pins are recommended to be left FLOATING –X +X 10 11 12 13 14 15 16 8 7654321 Direction of Earth’s gravity field.* Front View Top View Side View Device Temperature Range Case No. Package MMA2202D /C004240 to +85°C Case 475–01 SOIC–16 MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection inter- face between the board and the package. With the correct footprint, the packages will self–align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and short- ing between solder pads. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

Freescale Semiconductor, Inc.

2–55Motorola Sensor Device Data www.motorola.com/semiconductors /C0083/C0117/C0114/C0102/C0097/C0099/C0101 /C0077/C0111/C0117/C0110/C0116 /C0077/C0105/C0099/C0114/C0111/C0109/C0097/C0099/C0104/C0105/C0110/C0101/C0100 /C0065/C0099/C0099/C0101/C0108/C0101/C0114/C0111/C0109/C0101/C0116/C0101/C0114 The MMA series of silicon capacitive, micromachined accelerometers features signal conditioning, a 4–pole low pass filter and temperature compensation. Zero–g offset full scale span and filter cut–off are factory set and require no external devices. A full system self–test capability verifies system functionality.

Integral Signal Conditioning
Linear Output
Ratiometric Performance
4th Order Bessel Filter Preserves Pulse Shape Integrity
Calibrated Self–test
Low Voltage Detect, Clock Monitor, and EPROM Parity Check Status
Transducer Hermetically Sealed at Wafer Level for Superior Reliability
Robust Design, High Shocks Survivability Typical Applications
Vibration Monitoring and Recording
Impact Monitoring
Appliance Control
Mechanical Bearing Monitoring
Computer Hard Drive Protection
Computer Mouse and Joysticks
Virtual Reality Input Devices
Sports Diagnostic Devices and Systems SIMPLIFIED ACCELEROMETER FUNCTIONAL BLOCK DIAGRAM G–CELL SENSOR INTEGRATOR GAIN FILTER TEMP COMP SELF–TEST CONTROL LOGIC & EPROM TRIM CIRCUITS CLOCK GEN.OSCILLATOR VDD XOUT VSS ST

20 LEAD SOIC

Freescale Semiconductor, Inc.

/C0077/C0077/C0065/C0051/C0050/C0048/C0049/C0068 2–56 Motorola Sensor Device Datawww.motorola.com/semiconductors MAXIMUM RATINGS (Maximum ratings are the limits to which the device can be exposed without causing permanent damage.) Rating Symbol Value Unit Powered Acceleration (all axes) G pd /C0036200 g Unpowered Acceleration (all axes) G upd 2000 g Supply Voltage VDD –0.3 to +7.0 V Drop Test(1) D drop 1.2 m Storage Temperature Range Tstg –40 to +105 °C NOTES: 1. Dropped onto concrete surface from any axis. ELECTRO STATIC DISCHARGE (ESD) WARNING: This device is sensitive to electrostatic discharge. Although the Motorola accelerometers contain internal 2kV ESD protection circuitry, extra precaution must be taken by the user to protect the chip from ESD. A charge of over 2000 volts can accumulate on the human body or associated test equipment. A charge of this magnitude can alter the per- formance or cause failure of the chip. When handling the ac- celerometer, proper ESD precautions should be followed to avoid exposing the device to discharges which may be detri- mental to its performance. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0077/C0065/C0051/C0050/C0048/C0049/C0068 2–57Motorola Sensor Device Data www.motorola.com/semiconductors OPERATING CHARACTERISTICS (Unless otherwise noted: –40°C /C0118 TA /C0118 +85°C, 4.75 /C0118 VDD /C0118 5.25, X and Y Channels, Acceleration = 0g, Loaded output(1)) Characteristic Symbol Min Typ Max Unit Operating Range(2) Supply Voltage(3) Supply Current Operating Temperature Range Acceleration Range VDD IDD TA gFS 4.75 /C004240 5.00 5.25 +85 V mA g Output Signal Zero g (VDD = 5.0 V)(4) Zero g Sensitivity (TA = 25°C, VDD = 5.0 V)(5) Sensitivity Bandwidth Response Nonlinearity VOFF VOFF,V S SV f–3dB NL OUT 2.2 /C00421.0 2.5 2.8 +1.0 V V mV/g mV/g/V Hz % FSO Noise RMS (.01–1 kHz) Power Spectral Density Clock Noise (without RC load on output)(6) nRMS nPSD nCLK 110 2.0 2.8 mVrms µV/(Hz1/2) mVpk Self–Test Output Response Input Low Input High Input Loading(7) Response Time(8) gST VIL VIH IIN tST 9.6 VSS 0.7 x VDD /C004230 /C0042110 2.0 14.4 0.3 x VDD VDD /C0042300 g V V µA ms Status(12)(13) Output Low (Iload = 100 µA) Output High (Iload = 100 µA) VOL VOH VDD /C0042.8 0.4 V V Minimum Supply Voltage (LVD Trip) VLVD 2.7 3.25 4.0 V Clock Monitor Fail Detection Frequency fmin 50 — 260 kHz Output Stage Performance Electrical Saturation Recovery Time(9) Full Scale Output Range (IOUT = 200 µA) Capacitive Load Drive(10) Output Impedance tDELAY VFSO C L ZO 0.3 0.2 300 VDD /C00420.3 100 ms V pF Ω Mechanical Characteristics Transverse Sensitivity(11) Package Resonance VZX,YX fPKG 5.0 % FSO kHz NOTES: 1. For a loaded output the measurements are observed after an RC filter consisting of a 1 kΩ resistor and a 0.01 µF capacitor to ground. 2. These limits define the range of operation for which the part will meet specification. 3. Within the supply range of 4.75 and 5.25 volts, the device operates as a fully calibrated linear accelerometer. Beyond these supply limits the device may operate as a linear device but is not guaranteed to be in calibration. 4. The device can measure both + and /C0042 acceleration. With no input acceleration the output is at midsupply. For positive acceleration the output will increase above VDD /2 and for negative acceleration the output will decrease below VDD /2. 5. The device is calibrated at 20g. 6. At clock frequency /C0094 70 kHz. 7. The digital input pin has an internal pull–down current source to prevent inadvertent self test initiation due to external board level leakages. 8. Time for the output to reach 90% of its final value after a self–test is initiated. 9. Time for amplifiers to recover after an acceleration signal causing them to saturate. 10. Preserves phase margin (60°) to guarantee output amplifier stability. 11. A measure of the device’s ability to reject an acceleration applied 90° from the true axis of sensitivity. 12. The Status pin output is not valid following power–up until at least one rising edge has been applied to the self–test pin. The Status pin is high whenever the self–test input is high. 13. The Status pin output latches high if a Low Voltage Detection or Clock Frequency failure occurs, or the EPROM parity changes to odd. The Status pin can be reset by a rising edge on self–test, unless a fault condition continues to exist. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0077/C0065/C0051/C0050/C0048/C0049/C0068 2–59Motorola Sensor Device Data www.motorola.com/semiconductors Pin No. Pin Name

Description

1 thru 3 — Redundant Vss. Leave unconnected. 4 — No internal connection. Leave unconnected.

5 ST Logic input pin used to initiate

self–test. 6 XOUT Output voltage of the accelerometer. X Direction. 7 STATUS Logic output pin to indicate fault. 8 VSS The power supply ground. 9 VDD Power supply input. 10 AV DD Power supply input (Analog). 11 YOUT Output voltage of the accelerometer. Y Direction. 12 thru 16 — Used for factory trim. Leave unconnected. 17 thru 20 — No internal connection. Leave unconnected. XOUT YOUT MMA3201D ST VDD VSS X OUTPUT SIGNAL 1 kΩ 0.01 µF LOGIC INPUT VDD 0.1 µF

Use a 0.1 µF capacitor on VDD to decouple the power source.
Physical coupling distance of the accelerometer to the mi- crocontroller should be minimal.
Place a ground plane beneath the accelerometer to reduce noise, the ground plane should be attached to all of the open ended terminals shown in Figure 4.
Use an RC filter of 1 kΩ and 0.01 µF on the outputs of the accelerometer to minimize clock noise (from the switched capacitor filter circuit).
PCB layout of power and ground should not couple power supply noise.
Accelerometer and microcontroller should not be a high current path.
A/D sampling rate and any external power supply switching frequency should be selected such that they do not inter- fere with the internal accelerometer sampling frequency. This will prevent aliasing errors. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0077/C0065/C0051/C0050/C0048/C0049/C0068 2–60 Motorola Sensor Device Datawww.motorola.com/semiconductors * When positioned as shown, the Earth’s gravity will result in a positive 1g output Positive Acceleration Sensing Direction 20–Pin SOIC Package N/C pins are recommended to be left FLOATING –X +X Direction of Earth’s gravity field.* Front View Top View Side View 14 15 16 17 18 19 20 87654321 1312 10 9 Device Temperature Range Case No. Package MMA3201D /C004240 to +85°C Case 475A–01 SOIC–20 MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

Figure 6. Footprint SOIC–20 (Case 475A–01) Freescale Semiconductor, Inc.

capacitor techniques as in the Motorola accelerometer. can be introduced and more importantly minimized. lower figure is due to the low–pass filter). Figure 1. Aliased Signals Freescale Semiconductor, Inc.

Figure 4. Aliasing Comparison

Under clean dc bias, Vout and VCC , Figures 3a and 3b have a signal component at the sampling rate. This is due to switched capacitor currents coupling through finite power supply source impedances and PCB paracitics.
The low frequency output spectrum, Figure 3c, displays the internal lowpass filter characteristics. (The filter and sam- pling characteristics are sometimes useful in system de- bugging.)
When an ac component is superimposed onto VCC near the sampling frequency, as shown in Figure 4b, the output will contain the original signal plus a mirrored signal about the sampling frequency, shown in Figure 4a. Signals on the VCC line will appear at the output due to the ratiometric characteristic of the accelerometer and will be one half the amplitude.
As a result of sampling, the output waveform of Figure 4c is produced where the injected high frequency signal has now produced a signal in the passband.
Harmonics of the aliased signal in the pass band are also shown in Figure 4c.
Aliased signals in the passband will be amplified versions of the injected signals. This is due to the signal conditioning circuitry in the accelerometer that includes gain. ALIASING AVOIDANCE KEYS
Use a linear regulated power source when feasible. Linear regulators have excellent power supply rejection offering a stable dc source.
If using a switching power supply, ensure that the switching frequency is not close to the accelerometer sampling fre- quency or its harmonics. Noting that the accelerometer will gain the aliasing signal, it is desirable to keep frequencies at least 4 kHz away from the sampling frequency and its harmonics. 4 kHz is one decade from the –3 dB frequency, therefore any signals will be sufficiently attenuated by the internal 4–pole lowpass filter.
Proper bias decoupling will aid in noise reduction from oth- er sources. With dense surface mount PCB assemblies, it is often difficult to place and route decoupling components. However, the accelerometer is not like a typical logic de- vice. A little extra effort on decoupling goes a long way.
Good PCB layout practices should always be followed. Proper system grounding is essential. Parasitic capaci- tance and inductance could prove to be troublesome, par- ticularly during EMC testing. Signal harmonics and sub–harmonics play a significant role in introducing aliased signals. Clean layouts minimize the effects of parasitics and thus signal harmonics and sub–harmonics. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

the Earth’s gravity and the shock or vibration from an impact. Figure 1. Orientation of Accelerometer Freescale Semiconductor, Inc.

crash waveform of a toy car having a stiff bumper. Figure 2. Typical Crash Pattern Freescale Semiconductor, Inc.

/C0065/C0078/C0049/C0054/C0049/C0049 2–67Motorola Sensor Device Data www.motorola.com/semiconductors HARDWARE DESCRIPTION AND OPERATION Since MMA2200W is fully signal–conditioned by its internal op–amp and temperature compensation, the output of the accelerometer can be directly interfaced with an analog–to– digital (A/D) converter for digitization. A filter consists of one RC network should be added if the connection between the output of the accelerometer and the A/D converter is a long track or cable. This stray capacitance may change the position of the internal pole which would drive the output amplifier of the accelerometer into oscillation or unstability. In this design, the cut–off frequency is chosen to be 15.9 kHz which also acts as an anti–alias filter for the A/D converter. The 3dB frequency can be approximated by the following equation. f–3dB /C00431 2πRC Referring to the schematic, Figure 3, the MMA2200W accelerometer is connected to PORT D bit 5 and the output of the amplifier is connected to PORT D bit 6 of the micro- controller. This port is an input to the on–chip 8–bit analog–to– digital (A/D) converter. Typically, the accelerometer provides a signal output to the microprocessor of approximately 0.3 Vdc at –55g to 4.7 Vdc at +55g of acceleration. However, Motorola only guarantees the accuracy within ±40g range. Using the same reference voltage for the A/D converter and accelerom- eter minimizes the number of additional components, but does sacrifice resolution. The resolution is defined by the following: count/C0043 Vout 5 /C0032255 The count at 0g = [2.5/5] /C0032 255 ∝ 128 The count at +25g = [3.5/5] /C0032 255 ∝ 179 The count at –25g = [1.5/5] /C0032 255 ∝ 77 Therefore the resolution 0.5g/count The output of the accelerometer is ratiometric to the voltage applied to it. The accelerometer and the reference voltages are connected to a common supply; this yields a system that is ratiometric. By nature of this ratiometric system, variations in the voltage of the power supplied to the system will have no effect on the system accuracy. The liquid crystal display (LCD) is directly driven from I/O ports A, B, and C on the microcontroller. The operation of a LCD requires that the data and backplane (BP) pins must be driven by an alternating signal. This function is provided by a software routine that toggles the data and backplane at approximately a 30 Hz rate. Other than the LCD, one light emitting diode (LED) are connected to the pulse length converter (PLM) of the microcontroller. This LED will lights up for 3 seconds when an impact greater or equal to 7g is detected. The microcontroller section of the system requires certain support hardware to allow it to function. The MC34064P–5 provides an undervoltage sense function which is used to reset the microprocessor at system power–up. The 4 MHz crystal provides the external portion of the oscillator function for clocking the microcontroller and provides a stable base for time bases functions, for instance calculation of pulse rate. SOFTWARE DESCRIPTION Upon power–up the system, the LCD will display CAL for approximately 4 seconds. During this period, the output of the accelerometer are sampled and averaged to obtain the zero offset voltage or zero acceleration. This value will be saved in the RAM which is used by the equation below to calculate the impact in term of g–force. One point to note is that the accelerometer should remain stationary during the zero calibration. Impact/C0043[count/C0042countoffset]/C0032resolution In this software program, the output of the accelerometer is calculated every 650µs. During an impact, the peak decelera- tion is measured and displayed on the LCD for 3 seconds before resetting it to zero. In the mean time, if a higher impact is detected, the value on the LCD will be updated accordingly. However, when a low g is detected (e.g. 1.0g), the value will not be displayed. Instead, more samples will be taken for further averaging to eliminate the random noise and high frequency component. Due to the fact that tilting is a low g and low frequency signal, large number of sampling is preferred to avoid unstable display. Moreover, the display value is not hold for 3 seconds as in the case of an impact. Figure 4 is a flowchart for the program that controls the system. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

9.0 V BATTERY

3 GND

5.0 V REGULATOR

21 PLMB

51 SCLK

1 TCMP2

10 VDD

Figure 3. Impact Measurement Schematic Drawing Freescale Semiconductor, Inc.

4 SECONDS

Figure 4. Main Program Flowchart Freescale Semiconductor, Inc.

/C0065/C0078/C0049/C0054/C0049/C0049 2–70 Motorola Sensor Device Datawww.motorola.com/semiconductors SOFTWARE SOURCE/ASSEMBLY PROGRAM CODE * * * Accelerometer Demo Car Version 2.0 * * * * The following code is written for MC68HC705B16 using MMDS05 software * * Version 1.01 * * CASM05 – Command line assembler Version 3.04 * * P & E Microcomputer Systems, Inc. * * * * Written by : C.S. Chua * * 29 August 1996 * * * * * * Copyright Motorola Electronics Pte Ltd 1996 * * All rights Reserved * * * * This software is the property of Motorola Electronics Pte Ltd. * * * * Any usage or redistribution of this software without the express * * written consent of Motorola is strictly prohibited. * * * * Motorola reserves the right to make changes without notice to any * * products herein to improve reliability, function, or design. Motorola * * does not assume liability arising out of the application or use of any * * product or circuit described herein, neither does it convey license * * under its patents rights nor the rights of others. Motorola products are * * not designed, intended or authorised for use as component in systems * * intended to support or sustain life or for any other application in * * which the failure of the Motorola product could create a situation * * a situation where personal injury or death may occur. Should the buyer * * shall indemnify and hold Motorola products for any such unintended or * * unauthorised application, buyer shall indemnify and hold Motorola and * * its officers, employees, subsidiaries, affiliates, and distributors * * harmless against all claims, costs, damages, expenses and reasonable * * attorney fees arising out of, directly or indirectly, any claim of * * personal injury or death associated with such unintended or unauthorised * * use, even if such claim alleges that Motorola was negligent regarding * * the design or manufacture of the part. * * * * Motorola and the Motorola logo are registered trademarks of Motorola Inc.* * * * Motorola Inc. is an equal opportunity/affirmative action employer. * * * * * * Software Description * * * * This software is used to read the output of the accelerometer MMA2200W * * and display it to a LCD as gravity force. It ranges from –55g to +55g * * with 0g as zero acceleration or constant velocity. The resolution is * * 0.5g. * * * * The program will read from the accelerometer and hold the maximum * * deceleration value for about 3.0 seconds before resetting. At the same * * time, the buzzer/LED is activated if the impact is more than 7.0g. * * However, if the maximum deceleration changes before 3.0 seconds, it * * will update the display using the new value. Note that positive value * * implies deceleration whereas negative value implies acceleration * * * * * * Initialisation * * * PORTA EQU $00 ; Last digit PORTB EQU $01 ; Second digit (and negative sign) PORTC EQU $02 ; First digit (and decimal point) ADDATA EQU $08 ; ADC Data ADSTAT EQU $09 ; ADC Status PLMA EQU $0A ; Pulse Length Modulator (Output to Buzzer) MISC EQU $0C ; Miscellaneous Register (slow/fast mode) TCONTROL EQU $12 ; Timer control register TSTATUS EQU $13 ; Timer Status Register OCMPHI1 EQU $16 ; Output Compare Register 1 High Byte Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0054/C0049/C0049 2–71Motorola Sensor Device Data www.motorola.com/semiconductors OCMPLO1 EQU $17 ; Output Compare Register 1 Low Byte TCNTHI EQU $18 ; Timer Count Register High Byte TCNTLO EQU $19 ; Timer Count Register Low Byte OCMPHI2 EQU $1E ; Output Compare Register 2 High Byte OCMPLO2 EQU $1F ; Output Compare Register 2 Low Byte * * * User–defined RAM * * * SIGN EQU $54 ; Acceleration (–) or deceleration (+) PRESHI2 EQU $55 ; MSB of accumulated acceleration PRESHI EQU $56 PRESLO EQU $57 ; LSB of accumulated acceleration PTEMPHI EQU $58 ; Acceleration High Byte (Temp storage) PTEMPLO EQU $59 ; Acceleration Low Byte (Temp storage) ACCHI EQU $5A ; Temp storage of acc value (High byte) ACCLO EQU $5B ; (Low byte) ADCOUNTER EQU $5C ; Sampling Counter AVERAGE_H EQU $5D ; MSB of the accumulated data of low g AVERAGE_M EQU $5E AVERAGE_L EQU $5F ; LSB of the accumulated data of low g SHIFT_CNT EQU $60 ; Counter for shifting the accumulated data AVE_CNT1 EQU $61 ; Number of samples in the accumulated data AVE_CNT2 EQU $75 TEMPTCNTHI EQU $62 ; Temp storage for Timer count register TEMPTCNTLO EQU $63 ; Temp storage for Timer count register DECHI EQU $64 ; Decimal digit high byte DECLO EQU $65 ; Decimal digit low byte DCOFFSETHI EQU $66 ; DC offset of the output (high byte) DCOFFSETLO EQU $67 ; DC offset of the output (low byte) MAXACC EQU $68 ; Maximum acceleration TEMPHI EQU $69 TEMPLO EQU $6A TEMP1 EQU $6B ; Temporary location for ACC during delay TEMP2 EQU $6C ; Temporary location for ACC during ISR DIV_LO EQU $6D ; No of sampling (low byte) DIV_HI EQU $6E ; No of sampling (high byte) NO_SHIFT EQU $6F ; No of right shift to get average value ZERO_ACC EQU $70 ; Zero acceleration in no of ADC steps HOLD_CNT EQU $71 ; Hold time counter HOLD_DONE EQU $72 ; Hold time up flag START_TIME EQU $73 ; Start of count down flag RSHIFT EQU $74 ; No of shifting required for division ORG $300 ; ROM space 0300 to 3DFE (15,104 bytes) DB $FC ; Display ”0” DB $30 ; Display ”1” DB $DA ; Display ”2” DB $7A ; Display ”3” DB $36 ; Display ”4” DB $6E ; Display ”5” DB $EE ; Display ”6” DB $38 ; Display ”7” DB $FE ; Display ”8” DB $7E ; Display ”9” HUNDREDHI DB $00 ; High byte of hundreds HUNDREDLO DB $64 ; Low byte of hundreds TENHI DB $00 ; High byte of tens TENLO DB $0A ; Low byte of tens * * * Program starts here upon hard reset * * * RESET CLR PORTC ; Port C = 0 CLR PORTB ; Port B = 0 CLR PORTA ; Port A = 0 LDA #$FF STA $06 ; Port C as output STA $05 ; Port B as output STA $04 ; Port A as output LDA TSTATUS ; Dummy read the timer status register CLR OCMPHI2 ; so as to clear the OCF CLR OCMPHI1 LDA OCMPLO2 JSR COMPRGT CLR START_TIME Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0054/C0049/C0049 2–72 Motorola Sensor Device Datawww.motorola.com/semiconductors LDA #$40 ; Enable the output compare interrupt STA TCONTROL CLI ; Interrupt begins here LDA #$CC ; Port C = 1100 1100 Letter ”C” STA PORTC LDA #$BE ; Port B = 1011 1110 Letter ”A” STA PORTB LDA #$C4 ; Port A = 1100 0100 Letter ”L” STA PORTA LDA #16 IDLE JSR DLY20 ; Idling for a while (16*0.125 = 2 sec) DECA ; for the zero offset to stabilize BNE IDLE ; before perform auto–zero LDA #$00 ; Sample the data 32,768 times and take STA DIV_LO ; the average 8000 H = 32,768 LDA #$80 ; Right shift of 15 equivalent to divide STA DIV_HI ; by 32,768 LDA #!15 ; Overall sampling time = 1.033 s) STA NO_SHIFT JSR READAD ; Zero acceleration calibration LDX #5 ; Calculate the zero offset LDA PTEMPLO ; DC offset = PTEMPLO * 5 STA ZERO_ACC MUL STA DCOFFSETLO ; Save the zero offset in the RAM TXA STA DCOFFSETHI CLR HOLD_CNT LDA #$10 ; Sample the data 16 times and take STA DIV_LO ; the average 0100 H = 16 LDA #$00 ; Right shift of 4 equivalent to divide STA DIV_HI ; by 16 LDA #$4 ; Overall sampling time = 650 us STA NO_SHIFT LDA ZERO_ACC ; Display 0.0g at the start STA MAXACC JSR ADTOLCD CLR START_TIME CLR AVE_CNT1 CLR AVE_CNT2 CLR SHIFT_CNT CLR AVERAGE_L CLR AVERAGE_M CLR AVERAGE_H REPEAT JSR READAD ; Read acceleration from ADC LDA ZERO_ACC ADD #$04 CMP PTEMPLO BLO CRASH ; If the acceleration < 2.0g LDA PTEMPLO ; Accumulate the averaged results ADD AVERAGE_L ; for 128 times and take the averaging STA AVERAGE_L ; again to achieve more stable CLRA ; reading at low g ADC AVERAGE_M STA AVERAGE_M CLRA ADC AVERAGE_H STA AVERAGE_H LDA #$01 ADD AVE_CNT1 STA AVE_CNT1 CLRA ADC AVE_CNT2 STA AVE_CNT2 CMP #$04 BNE REPEAT LDA AVE_CNT1 CMP #$00 BNE REPEAT SHIFTING INC SHIFT_CNT ; Take the average of the 128 samples LSR AVERAGE_H ROR AVERAGE_M ROR AVERAGE_L LDA SHIFT_CNT CMP #$0A BLO SHIFTING LDA AVERAGE_L Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0054/C0049/C0049 2–73Motorola Sensor Device Data www.motorola.com/semiconductors STA PTEMPLO LDA HOLD_CNT ; Check if the hold time of crash data CMP #$00 ; is up BNE NON–CRASH LDA PTEMPLO ; If yes, display the current acceleration STA MAXACC ; value JSR ADTOLCD BRA NON–CRASH CRASH LDA ZERO_ACC ADD #$0E ; If the crash is more than 7g CMP PTEMPLO ; 7g = 0E H * 0.5 BHS NO_INFLATE LDA #$FF ; activate the LED STA PLMA NO_INFLATE JSR MAXVALUE ; Display the peak acceleration JSR ADTOLCD NON–CRASH CLR SHIFT_CNT CLR AVE_CNT1 CLR AVE_CNT2 CLR AVERAGE_L CLR AVERAGE_M CLR AVERAGE_H BRA REPEAT ; Repeat the whole process * * * Delay Subroutine * * (162 * 0.7725 ms = 0.125 sec) * * * DLY20 STA TEMP1 LDA #!162 ; 1 unit = 0.7725 ms OUTLP CLRX INNRLP DECX BNE INNRLP DECA BNE OUTLP LDA TEMP1 RTS * * * Reading the ADC data X times * * and take the average * * X is defined by DIV_HI and DIV_LO * * * READAD LDA #$25 STA ADSTAT ; AD status = 25H CLR PRESHI2 CLR PRESHI ; Clear the memory CLR PRESLO CLRX CLR ADCOUNTER LOOP128 TXA CMP #$FF BEQ INC_COUNT BRA CONT INC_COUNT INC ADCOUNTER CONT LDA ADCOUNTER ; If ADCOUNTER = X CMP DIV_HI ; Clear bit = 0 BEQ CHECK_X ; Branch to END100 BRA ENDREAD CHECK_X TXA CMP DIV_LO BEQ END128 ENDREAD BRCLR 7,ADSTAT,ENDREAD ; Halt here till AD read is finished LDA ADDATA ; Read the AD register ADD PRESLO ; PRES = PRES + ADDATA STA PRESLO CLRA ADC PRESHI STA PRESHI CLRA ADC PRESHI2 STA PRESHI2 INCX ; Increase the AD counter by 1 BRA LOOP128 ; Branch to Loop128 END128 CLR RSHIFT ; Reset the right shift counter Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0054/C0049/C0049 2–74 Motorola Sensor Device Datawww.motorola.com/semiconductors DIVIDE INC RSHIFT ; Increase the right counter LSR PRESHI2 ROR PRESHI ; Right shift the high byte ROR PRESLO ; Right shift the low byte LDA RSHIFT CMP NO_SHIFT ; If the right shift counter >= NO_SHIFT BHS ENDDIVIDE ; End the shifting JMP DIVIDE ; otherwise continue the shifting ENDDIVIDE LDA PRESLO STA PTEMPLO RTS * * * Timer service interrupt * * Alternates the Port data and * * backplane of LCD * * * TIMERCMP STA TEMP2 ; Push Accumulator COM PORTC ; Port C = – (Port C) COM PORTB ; Port B = – (Port B) COM PORTA ; Port A = – (Port A) LDA START_TIME ; Start to count down the hold time CMP #$FF ; if START_TIME = FF BNE SKIP_TIME JSR CHECK_HOLD SKIP_TIME BSR COMPRGT ; Branch to subroutine compare register LDA TEMP2 ; Pop Accumulator RTI * * * Check whether the hold time * * of crash impact is due * * * CHECK_HOLD DEC HOLD_CNT LDA HOLD_CNT CMP #$00 ; Is the hold time up? BNE NOT_YET LDA #$00 ; If yes, STA PLMA ; stop buzzer LDA #$FF ; Set HOLD_DONE to FF indicate that the STA HOLD_DONE ; hold time is up CLR START_TIME ; Stop the counting down of hold time NOT_YET RTS * * * Subroutine reset * * the timer compare register * * * COMPRGT LDA TCNTHI ; Read Timer count register STA TEMPTCNTHI ; and store it in the RAM LDA TCNTLO STA TEMPTCNTLO ADD #$4C ; Add 1D4C H = 7500 periods STA TEMPTCNTLO ; with the current timer count LDA TEMPTCNTHI ; 1 period = 2 us ADC #$1D STA TEMPTCNTHI ; Save the next count to the register STA OCMPHI1 LDA TSTATUS ; Clear the output compare flag LDA TEMPTCNTLO ; by access the timer status register STA OCMPLO1 ; and then access the output compare RTS ; register * * * Determine which is the next * * acceleration value to be display * * * MAXVALUE LDA PTEMPLO CMP MAXACC ; Compare the current acceleration with BLS OLDMAX ; the memory, branch if it is <= maxacc BRA NEWMAX1 OLDMAX LDA HOLD_DONE ; Decrease the Holdtime when CMP #$FF ; the maximum value remain unchanged Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0054/C0049/C0049 2–75Motorola Sensor Device Data www.motorola.com/semiconductors BEQ NEWMAX1 ; Branch if the Holdtime is due LDA MAXACC ; otherwise use the current value BRA NEWMAX2 NEWMAX1 LDA #$C8 ; Hold time = 200 * 15 ms = 3 sec STA HOLD_CNT ; Reload the hold time for the next CLR HOLD_DONE ; maximum value LDA #$FF STA START_TIME ; Start to count down the hold time LDA PTEMPLO ; Take the current value as maximum NEWMAX2 STA MAXACC RTS * * * This subroutine is to convert * * the AD data to the LCD * * Save the data to be diaplayed * * in MAXACC * * * ADTOLCD SEI ; Disable the Timer Interrupt !! LDA #$00 ; Load 0000 into the memory STA DECHI LDA #$00 STA DECLO LDA MAXACC LDX #5 MUL ; Acceleration = AD x 5 ADD DECLO ; Acceleration is stored as DECHI STA DECLO ; and DECLO STA ACCLO ; Temporary storage LDA #$00 ; Assume positive deceleration STA SIGN ; ”00” positive ; ”01” negative CLRA TXA ADC DECHI STA DECHI STA ACCHI ; Temporary storage LDA DECLO SUB DCOFFSETLO ; Deceleration = Dec – DC offset STA DECLO LDA DECHI SBC DCOFFSETHI STA DECHI BCS NEGATIVE ; Branch if the result is negative BRA SEARCH NEGATIVE LDA DCOFFSETLO ; Acceleration = DC offset – Dec SUB ACCLO STA DECLO LDA DCOFFSETHI SBC ACCHI STA DECHI LDA #$01 ; Assign a negative sign STA SIGN SEARCH CLRX ; Start the search for hundred digit LOOP100 LDA DECLO ; Acceleration = Acceleration – 100 SUB HUNDREDLO STA DECLO LDA DECHI SBC HUNDREDHI STA DECHI INCX ; X = X + 1 BCC LOOP100 ; if acceleration >= 100, continue the DECX ; loop100, otherwise X = X – 1 LDA DECLO ; Acceleration = Acceleration + 100 ADD HUNDREDLO STA DECLO LDA DECHI ADC HUNDREDHI STA DECHI TXA ; Check if the MSD is zero AND #$FF BEQ NOZERO ; If MSD is zero, branch to NOZERO LDA $0300,X ; Output the first second digit STA PORTC BRA STARTTEN NOZERO LDA #$00 ; Display blank if MSD is zero STA PORTC Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0054/C0049/C0049 2–76 Motorola Sensor Device Datawww.motorola.com/semiconductors STARTTEN CLRX ; Start to search for ten digit LOOP10 LDA DECLO ; acceleration = acceleration – 10 SUB TENLO STA DECLO LDA DECHI SBC TENHI STA DECHI INCX BCC LOOP10 ; if acceleration >= 10 continue the DECX ; loop, otherwise end LDA DECLO ; acceleration = acceleration + 10 ADD TENLO STA DECLO LDA DECHI ADC TENHI STA DECHI LDA $0300,X ; Output the last second digit EOR SIGN ; Display the sign STA PORTB CLRX ; Start to search for the last digit LDA DECLO ; declo = declo – 1 TAX LDA $0300,X ; Output the last digit EOR #$01 ; Add a decimal point in the display STA PORTA CLI ; Enable Interrupt again ! RTS * * * This subroutine provides services * * for those unintended interrupts * * * SWI RTI ; Software interrupt return IRQ RTI ; Hardware interrupt TIMERCAP RTI ; Timer input capture TIMERROV RTI ; Timer overflow SCI RTI ; Serial communication Interface ; Interrupt ORG $3FF2 ; For 68HC05B16, the vector location FDB SCI ; starts at 3FF2 FDB TIMERROV ; For 68HC05B5, the address starts FDB TIMERCMP ; 1FF2 FDB TIMERCAP FDB IRQ FDB SWI FDB RESET Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

Figure 6. Overall Schematic Diagram of the Demo

4 MHz

Freescale Semiconductor, Inc.

Figure 10. Main Program Flowchart output transition speeds for many applications. Freescale Semiconductor, Inc.

/C0065/C0078/C0049/C0054/C0049/C0050 2–82 Motorola Sensor Device Datawww.motorola.com/semiconductors SOFTWARE SOURCE/ASSEMBLY PROGRAM CODE * * * Pager Shock & Mute Detection Version 1.0 * * * * The following code is written for MC68HC705B16 using MMDS05 software * * Version 1.01 * * CASM05 – Command line assembler Version 3.04 * * P & E Microcomputer Systems, Inc. * * * * Written by : C.S. Chua * * 9th January 1997 * * * * Software Description * * * * J1 ON – Sound mode * * Buzzer will turn off if the accelerometer is tapped or switch S2 is * * depressed. * * * * J1 OFF – Silence mode * * LED will turn off if and only if S2 is depressed * * * * * * I/O Declaration * * * PORTB EQU $01 ; Port B PLMA EQU $0A ; D/A to control buzzer TCONTROL EQU $12 ; Timer control register TSTATUS EQU $13 ; Timer Status Register OCMPHI1 EQU $16 ; Output Compare Register 1 High Byte OCMPLO1 EQU $17 ; Output Compare Register 1 Low Byte TCNTHI EQU $18 ; Timer Count Register High Byte TCNTLO EQU $19 ; Timer Count Register Low Byte OCMPHI2 EQU $1E ; Output Compare Register 2 High Byte OCMPLO2 EQU $1F ; Output Compare Register 2 Low Byte * * * RAM Area ($0050 – $0100) * * * ORG $50 STACK RMB 4 ; Stack segment TEMPTCNTLO RMB 1 ; Temp. storage of timer result (LSB) TEMPTCNTHI RMB 1 ; Temp. storage of timer result (MSB) * * * ROM Area ($0300 – $3DFD) * * * ORG $300 * * * Program starts here upon hard reset * * * RESET CLR PORTB ; Initialise Ports LDA #%01001000 ; Configure Port B STA $05 LDA TSTATUS ; Dummy read the timer status register so as to clear the OCF CLR OCMPHI2 CLR OCMPHI1 LDA OCMPLO2 JSR COMPRGT LDA #$40 ; Enable the output compare interrupt STA TCONTROL LDA #10 ; Idle for a while before ”beeping” IDLE JSR DLY20 DECA BNE IDLE CLI ; Interrupt begins here BRSET 1,PORTB,SILENCE ; Branch if J1 is off BSET 6,PORTB ; Turn on accelerometer JSR DLY20 ; Wait till the supply is stable TEST BRSET 5,PORTB,MUTE ; Sample shock sensor for tapping BRCLR 7,PORTB,MUTE ; Sample switch S2 for muting JMP TEST MUTE BCLR 6,PORTB ; Turn off accelerometer SEI CLR PLMA ; Turn off buzzer Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0054/C0049/C0050 2–83Motorola Sensor Device Data www.motorola.com/semiconductors DONE JMP DONE ; End SILENCE BRSET 7,PORTB,SILENCE ; Sample switch S2 for stopping LED SEI BCLR 3,PORTB ; Turn off LED JMP DONE ; End * * * Timer service interrupt * * Alternates the PLMA data * * and bit 3 of Port B * * * TIMERCMP BSR COMPRGT ; Branch to subroutine compare register BRSET 1,PORTB,SKIPBUZZER ; Branch if J1 is OFF LDA PLMA EOR #$80 ; Alternate the buzzer STA PLMA RTI SKIPBUZZER BRSET 3,PORTB,OFF_LED ; Alternate LED supply BSET 3,PORTB RTI OFF_LED BCLR 3,PORTB RTI * * * Subroutine reset * * the timer compare register * * * COMPRGT LDA TCNTHI ; Read Timer count register STA TEMPTCNTHI ; and store it in the RAM LDA TCNTLO STA TEMPTCNTLO ADD #$50 ; Add C350 H = 50,000 periods STA TEMPTCNTLO ; with the current timer count LDA TEMPTCNTHI ; 1 period = 2 us ADC #$C3 STA TEMPTCNTHI ; Save the next count to the register STA OCMPHI1 LDA TSTATUS ; Clear the output compare flag LDA TEMPTCNTLO ; by access the timer status register STA OCMPLO1 ; and then access the output compare register RTS * * * Delay Subroutine for 0.20 sec * * * * Input: None * * Output: None * * * DLY20 STA STACK+2 STX STACK+3 LDA #!40 ; 1 unit = 0.7725 mS OUTLP CLRX INNRLP DECX BNE INNRLP DECA BNE OUTLP LDX STACK+3 LDA STACK+2 RTS * * * This subroutine provides services * * for those unintended interrupts * * * SWI RTI ; Software interrupt return IRQ RTI ; Hardware interrupt TIMERCAP RTI ; Timer input capture TIMERROV RTI ; Timer overflow interrupt SCI RTI ; Serial communication Interface Interrupt ORG $3FF2 ; For 68HC05B16, the vector location FDB SCI ; starts at 3FF2 FDB TIMERROV ; For 68HC05B5, the address starts at 1FF2 FDB TIMERCMP FDB TIMERCAP FDB IRQ FDB SWI FDB RESET Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0054/C0051/C0050 2–85Motorola Sensor Device Data www.motorola.com/semiconductors

Oscillator The oscillator has been redesigned to center the nominal frequency within the trimming range and to have better temperature compensation. As shown in Figure 1, the oscillator controls three switched capacitor circuit sub– blocks within the ASIC, thus having direct impact on their performance. The trimmable oscillator enhances the con- trol of other performance parameters and enables the part to meet tighter specification tolerances. Additionally, the placement of the oscillator on the silicon die has changed, contributing to a 50% reduction in the noise of the part.
Power Supply Filter An internal capacitor has been added between the VDD and VSS pins to provide some de–coupling of the power supply. Also, a lowpass filter has been added to the circuitry that supplies power to the transducer element and that sets the DC level of the capacitance–to–voltage converter stage. The filter response suppresses high frequency noise, but maintains a ratiometric output.
New Sensing Scheme The capacitance–to–voltage converter employs innovative circuit techniques (at the time of this writing, patents are pending) to improve signal ratiometricity. Amplification is achieved using an EPROM trimmable gain stage, provid- ing capability for both coarse and fine tuning. As in the previous version of the control ASIC, the second gain stage is cascaded by a switched capacitor four pole Bessel low- pass filter, with a unity gain response and –3 dB frequency at 400 Hz.
Temperature Compensation The final stage in the ASIC performs temperature com- pensation of gain. Thus, the temperature coefficient for sensitivity is set using EPROM trim. PERFORMANCE ENHANCEMENTS Motorola’s new MMA1201P accelerometer provides perfor- mance enhancements in a number of areas, including ratio- metric output, signal–to–noise ratio, output filter response, and temperature compensation. For complete details, refer to the MMA1201P data sheet.
Ratiometric Output The offset voltage and the sensitivity of the part are ratio- metric with supply voltage. Typical error values are less than 0.5%.
Signal to Noise Ratio The noise has been reduced by 50% and is specified at 3.5 mV RMS maximum. Typical values are about 2.0 mVRMS . As a result, the signal to noise ratio of the part is about 50 dB.
Lowpass Filter Response The frequency response of the four pole Bessel lowpass filter has the –3 dB frequency at 400 Hz. The tolerance has been narrowed by 60% and is specified at /C003440 Hz.
Temperature Compensation The sensitivity is very uniform over temperature, with typi- cal errors of about /C00341% over the specified temperature range. Also, although the spec allows for the equivalent of 5 mV/°C for the temperature coefficient of offset, typical values are actually less than 2 mV/°C, at VDD equal to 5 V. INTERFACE CONSIDERATIONS With only four active pin connections, Motorola’s accel- erometers are very easy to use. There are only a few simple considerations to be taken into account to ensure reliable operation and attain the high level of performance that the can part offer.
Power Supply Power is applied to the accelerometer through the VDD pin. For optimum performance, it is recommended that the part be powered with a voltage regulator such as the Motorola MC78L05. An optional 0.1 µF capacitor can be placed on the VDD pin to complement the accelerometer’s internal capacitor and provide additional de–coupling of the supply. The capacitor should be physically located as close as possible to the accelerometer.
Ground Ground is applied through the VSS pin. Whenever pos- sible it is recommended that a solid ground plane be used so that the impedance of the ground path is minimized. If this is not possible, it is strongly recommended that a low impedance trace (no additional components should be connected to it) be used to directly connect the VSS pin to the power supply ground.
Self–test The ST pin is an active, high logic level input pin that pro- vides a way for the user to verify proper operation of the part. It is pulled down internally. Therefore, for normal operation, the user could apply a logic level “0” or leave it unconnected. Applying a logic level “1” to the ST pin will apply the equivalent of a 25 g acceleration to the trans- ducer, and the user should see a change in the output equivalent to 25 times the part’s rated sensitivity.
Output The accelerometer’s output is measured at the VOUT pin. As shown in Figure 1, the ASIC’s oscillator controls the switched capacitor lowpass filter, with a nominal operating frequency of 65 kHz. As a result, a clock noise component of about 2 mVpeak may be present at 65 kHz. Therefore, it is recommended that the user place a simple RC lowpass filter on the VOUT pin to reduce the clock noise present in the output signal. Recommended values are a 1 kΩ resistor and a 0.01 µF capacitor. These values produce a filter with a –3 dB frequency at about 16 kHz, which will not interfere with the response of the internal Bessel filter, yet will pro- vide sufficient attenuation (approximately –12 dB) of the clock noise. Placing a filter on the output is especially recommended for applications where the signal will be fed into a stand–alone A/D converter, and in cases where the signal will be ampli- fied to a level where the amplified clock noise may begin to contribute significantly to the noise floor of the system. However, if using an MCU or microprocessor in the system, the user may choose to use a software algorithm to digitally filter the signal, instead of using the analog RC filter. This option would have to be evaluated based on the system performance requirements. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

Connection to the A/D on an MCU When using the accelerometer with the analog to digital converter on an MCU, it is important to connect the supply and ground pins of the accelerometer and the VRH and VRL pins of the MCU to the same supply and ground traces, respectively. This will maximize the ratiometricity of the system by avoiding voltage differences that may result from trace impedances. Figure 2 shows the recommended supporting circuitry for operating the new accelerometer. Part (a) shows the16 pin DIP package version, the MMA1201P, while part (b) shows the 6 pin Wingback package version, the MMA2200W. For the MMA1201P , pins 1, 2, 3, 6, 14, 15, and 16 have no internal connections, and pins 9 through 13 are used for calibration and trimming in the factory. These pins should all be left un- connected. For the MMA2200W, pins 1 and 4, and the wings (supporting pins) should be left unconnected. VSS ST VDD VOUT MMA2200W VCC LOGIC INPUT R1 OUTPUT SIGNAL (b) VSS ST VDD VOUT MMA1201P VCC 0.1 F LOGIC INPUT OUTPUT SIGNAL (a) /C0109 /C0087

0.01 F/C0109

Figure 2. Accelerometers with Recommended Supporting Circuitry

11 TRIM 3

supply, noise from the supply will appear in the output signal. there are several simple ways to avoid aliasing. tivity that was approximately twice that of standard parts. where HRC 1 and HRC2 are coefficients used in the model. Freescale Semiconductor, Inc.

/C0065/C0078/C0049/C0054/C0051/C0050 2–88 Motorola Sensor Device Datawww.motorola.com/semiconductors The total output noise would be the sum of the individual components: + 1.03) mV Total Output Noise = 24.41 mV peak–to–peak. If this output signal were fed into an 8 bit A/D converter, referenced to 5 V full scale, the worst case error due to power supply noise would be equivalent to /C00341 bit count. The error that can occur in the output due to aliasing gain can be avoided very easily. The easiest method is to power the part with a voltage regulator. Since the voltage regulator pro- vides a clean, steady supply, the possibility of aliasing is elimi- nated. If the accelerometer is powered with a switching supply, a filter should be placed on the power supply output to elimi- nate the noise of the harmonics. If placing a filter on the switch- ing supply is not feasible, the user must ensure that the operating frequency of the switching power supply is outside the frequency ranges of the peaks shown in Figure 3. The plot shown is a superposition of the response of the internal four pole Bessel lowpass filter, scaled by the corresponding alias- ing gain for each harmonic. The Bessel filter has the –3 dB frequency at 400 Hz and, being of fourth order, has a very steep roll–off outside the passband, with approximately –80 dB of attenuation at 4 kHz. If a switching power supply must be used, its operating frequency should be at least 800 Hz from the accelerometer’s sampling frequency. Any switch- ing noise present will be aliased to 800 Hz or higher, where the attenuation will be approximately –24 dB or lower, thus reduc- ing the power supply induced noise below the part’s noise floor. CONCLUSION The MMA1201P accelerometer demonstrates Motorola’s commitment to continuous product improvement. A new oscil- lator lowers the noise in the part and enables tighter control of the –3 dB bandwidth of the internal lowpass filter. The supply voltage is routed to the transducer and the DC level reference of the capacitance–to–voltage converter stage through a newly added filter, thus reducing the part’s susceptibility to power supply noise. The capacitance–to–voltage converter stage uses new signal conditioning methods, which virtually eliminate ratiometric errors. The temperature compensation for sensitivity is improved, producing a very flat response over temperature. Overall the part offers much enhanced perfor- mance and is simpler to use. Equally important, Motorola’s MMA1201P accelerometer has remained very price competi- tive, making it ideal for most applications requiring accelera- tion sensors. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

is contained in a display box on the top front side of the cage. basic principle behind the Baseball Pitch Speedometer. Figure 1. David Heeley, mechanical designer of the Baseball Pitch Speedometer Demo, tests his skills at Sensors Expo Boston ’97. Freescale Semiconductor, Inc.

Figure 2. Typical Crash Pattern for the Baseball Pitch Speedometer Demo initial velocity of the baseball determined. Freescale Semiconductor, Inc.

with fairly accurate results. Figure 3. Baseball Pitch Speedometer Characterization Data Freescale Semiconductor, Inc.

/C0065/C0078/C0049/C0054/C0051/C0053 2–92 Motorola Sensor Device Datawww.motorola.com/semiconductors The bulk of the circuit hardware is contained in a display box mounted on the top front side of the cage. Since the accel- erometers are physically located far away from the mother board (about 10 feet of wiring), op–amps were used to buffer the accelerometers’ output and drive the transmission line. The four accelerometer signals are then simultaneously fed into a comparator network and four of the ADC inputs on an MC68HC11 microcontroller. The MC68HC11 was selected because it has the capability of converting four A/D channels in one conversion sequence and operates at a higher clock speed. These two features reduce the overall time interval between digitizations of the analog signal (that result from the minimum required time for proper A/D conversion and from software latency) thus allowing a more accurate representa- tion of the acceleration waveform to be captured. The comparator network serves a similar purpose by eliminating the additional software algorithm and execution time that would be required to continually monitor the outputs of all four accelerometers and determine whether impact has occurred or not. By minimizing this delay (some is still present since the output signal must exceed a threshold, and a finite amount of time is required for this) more of the initial and more significant part of the signal is captured. The comparator network employs four LM311’s configured to provide an OR function, and a single output is fed into an input capture pin on the MCU. A potentiometer and filter capacitor are used to provide a stable reference threshold voltage to the comparator network. The threshold voltage is set as close as possible to the accelerometers’ offset voltage to minimize the delay between ball impact and the triggering of the conversion sequence, but enough clearance must be provided to prevent false triggering due to noise. Because the comparator network is wired such that any one of the accel- erometer outputs can trigger it, the threshold voltage must be higher than the highest accelerometer offset voltage. Hystere- sis is not necessary for the comparator network, because once the MCU goes into the conversion sequence it ignores the input capture pin. The system is powered using a commercially available 9 V supply. A Motorola MC7805 voltage regulator is used to pro- vide a steady 5 Volt supply for the operation of the MCU, the accelerometers, the comparator network, and the op–amp buffers. The 9 V supply is directly connected to the common anode 8–segment LED displays. Each segment can draw as much as 30 mA of current. Therefore, to ensure proper opera- tion, the power supply selected to build this circuit should be capable of supplying at least 600 mA. Ports B and C on the MCU are used to drive the LED displays. Each port output pin is connected via a resistor to the base of a BJT, which has the emitter tied to ground. A current limiting resistor is connected between the collector of each BJT and the cathode of the corresponding segment on the display. To minimize the amount of board space consumed by the output driving cir- cuitry, MPQ3904s (quad packaged 2N3904s) were selected instead of the standard discrete 2N3904s. The zero bit on Port C is connected to a combination BJT and MOSFET circuit that drives the “Your Speed” and “Best Speed” LED’s. The circuit is wired so that the LED’s toggle, and only one can be ON at a time. Figure 4 shows a schematic of the circuit used. Part (a) shows the accelerometers, the op–amps used to buffer the outputs and drive the transmission lines, the comparator net- work and the potentiometer used to set the detection thresh- old. Part (b) shows the MCU, with its minimal required supporting circuitry. Part (c) shows the voltage regulator, a mapping of the cathodes to the corresponding segments on the LED displays, the BJT switch circuitry used to drive the seven segment display LEDs (although not shown on the schematic, this circuit block is actually repeated 15 times), and finally, the circuitry used to drive the “Your Speed”/“Best Speed” LEDs. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0054/C0051/C0053 2–93Motorola Sensor Device Data www.motorola.com/semiconductors Figure 4a. Accelerometers, Buffer Op–Amps, and Comparator Network ST ACCELEROMETER STST VDD VSS VOUT VCC 0.1 /C0109F 1 kΩ 0.01 /C0109F VCC MC33201 VCC VCC 10 kΩ 1 kΩ PA2/IC1 0.01 /C0109F PE4/AN4 LM311 STSTST VDD VSS VOUT VCC 0.1 /C0109F 1 kΩ 0.01 /C0109F VCC MC33201 U10 VCC PE5/AN5 LM311 STSTST VDD VSS VOUT VCC 0.1 /C0109F 1 kΩ 0.01 /C0109F VCC MC33201 U11 VCC PE6/AN6 LM311 STSTST VDD VSS VOUT VCC 0.1 /C0109F 1 kΩ 0.01 /C0109F VCC MC33201 U12 VCC PE7/AN7 LM311 C10 1 /C0109F VCC 20 kΩ ACCELEROMETER ACCELEROMETER ACCELEROMETER Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0054/C0051/C0053 2–94 Motorola Sensor Device Datawww.motorola.com/semiconductors Figure 4b. MC68HC11E9 MCU with Supporting Circuitry VCC

8 MHz

R12 4.7 k R13 4.7 k VCC IN RST* MC34164P GND U13 C14 18 pF C13 0.1 VCC VCC PA2/IC1 PE7/AN7 PE4/AN4 PE5/AN5 PE6/AN6 R14 4.7 k VRL VRH MODA/LIR* MODB/VSTBY IRQ* XIRQ* RESET* XTAL EXTAL VSS VDD PE7/AN7 PE6/AN6 PE5/AN5 PE4/AN4 PE3/AN3 PE2/AN2 PE1/AN1 PE0/AN0 PD5/SS* PD4/SCK PD3/MOSI PD2/MISO PD1/TxD PD0/RxD PC7/AD7 PC6/AD6 PC5/AD5 PC4/AD4 PC3/AD3 PC2/AD2 PC1/AD1 PC0/AD0 STRA/AS STRB/R/W* PB7/A15 PB6/A14 PB5/A13 PB4/A12 PB3/A11 PB2/A10 PB1/A9 PB0/A8 PA7/PAI/OC1 PA6/OC2/OC1 PA5/OC3/OC1 PA4/OC4/OC1 PA3/IC4/OC5/OC1 PA2/IC1 PA1/IC2 PA0/IC3 E MC68HC11E9 U14 C16 C12 4.7 “Your’’ / “Best’’ F G E D C B A F G E D C B A DP4.7 k R10 200 k 4.7 k RESET C11 Ones Digit LED Display Tens Digit LED Display µ F µ F µ F µ F Ω ΩΩ Ω Ω Ω Ω Ω 18 pF C15 Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0054/C0051/C0053 2–95Motorola Sensor Device Data www.motorola.com/semiconductors VIN VOUT MC78L05ACP GND U15 +9 VDC P.S. VCC C17 C18 GND P.S. R16 – R30 10 k R32 – R46 180 From PB or PC 1/8 LED Display U16–U19 MPQ3904 R31 R47 PB0 VCC R48 VCC “Your Speed’’ “Best Speed’’ 1/4 MPQ3094 U20 VN0300L B C D E F G DP µF 1µF A Ω Ω Ωk 1 Ωk Ωk Figure 4c. Voltage Regulator, LED Segment Mapping, and LED Driving Circuitry Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0054/C0051/C0053 2–96 Motorola Sensor Device Datawww.motorola.com/semiconductors IMPLEMENTATION — SOFTWARE The operation of the Baseball Pitch Speedometer is very simple. Upon power on reset, the output LEDs are initialized to display “00” and “Best Speed.” The analog to digital con- verter is turned on and the offset voltages of the accelerome- ters are measured and stored. Finally, all the variables are initialized and the MCU goes into a dormant state, where it will wait for a negative edge input capture pulse to trigger it to begin processing the crash signal. Once the input capture flag is set, the MCU will immediately begin the analog to digital conversion sequence. As it digitizes the crash signature, it will calculate the absolute difference between the current value and the stored offset voltage value. It will integrate by summing up all the differences. Figure 2 shows a typical crash signature of the Baseball Pitch Speedometer. As illustrated, starting at the point of impact (A), the acceleration will initially ramp up, reaching a maximum, then decrease as the target is displaced. Because the target is constrained to the frame structure, the acceleration will continue to decrease until it reaches a minimum (point B), which correspond to the travel stop of the target. It is difficult to determine exactly when point B will occur, because the amplitude and duration of the initial acceleration pulse will vary with ball speed. Therefore, the capture window duration is set so that it will encompass most typical crash signatures, while rejecting most of the secondary ripples that result as the energy is dissipated by the system. After integrating the four signals, the results are added together to produce an overall sum. This procedure averages out the individual responses and reduces measurement error due to the variability of where the ball lands on the target. The MCU then divides the grand sum by an empirically predeter- mined constant of proportionality. The result will then go through a binary to BCD conversion algorithm. A look–up table is used to match the BCD numbers to their corresponding 7–segment display codes. The calculated speed is displayed on the two digit 8–segment displays (one segment corre- sponds to the decimal point), and the “Your Speed” LED is turned on while the “Best Speed” LED is turned off. After a duration of approximately five seconds, the LEDs are toggled and stored best speed is redisplayed. The five second delay is used to provide enough time for the user to check his/her speed and also to allow the target to return to a rest state. The system is now ready for another pitch. A complete listing of the software is presented in the Appendix. CONCLUSION The Baseball Pitch Speedometer works fairly well, with an accuracy of +/– 5 mph. The dynamic range of the system is also worthy of note, measuring speeds from less than 10 mph up to well above the 70 mph range. One key point to empha- size, is that the system is empirically calibrated, and so to maintain good accuracy the system should only be used with balls of mass equal to those used during calibration. Although intended mainly for training and recreational pur- poses, the Baseball Pitch Speedometer demonstrates a very important concept concerning the use of accelerometers. Accelerometers can be used not only to detect that an event such as impact or motion has occurred, but more importantly they measure the intensity of such events. They can be used to discern between different crash levels and durations. This is very useful in applications where it is desired to have the system respond in accord with the magnitude of the input being monitored. An example application would be a smart air bag system, where the speed at which the bag inflates is proportional to the severity of the crash. The deployment rate of the airbag would be controlled so that it does not throw the occupant back against the seat, thus minimizing the possibil- ity of injury to the occupant. Another application where this concept may be utilized is in car alarms, where the response may range from an increased state of readiness and monitor- ing, to a full alarm sequence depending on the intensity of the shock sensed by the accelerometer. This could be used to prevent unnecessary firing of the alarm in the event that an animal or person were to inadvertently bump or brush against the automobile. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0054/C0051/C0053 2–97Motorola Sensor Device Data www.motorola.com/semiconductors APPENDIX — ASSEMBLY CODE LISTING FOR BASEBALL PITCH SPEEDOMETER * Baseball Pitch Speedometer – Rev. 1.0 * Program waits for detection of impact via the input capture pin and then reads four A/D channels. * The area under the Acceleration vs. Time curve is found by subtracting the steady state offsets * from the digitized readings and summing the results. The sum is then divided by an empirically * determined constant of proportionality, and the speed of the ball is displayed. * Written by Carlos Miranda * Systems and Applications * Sensor Products Division * Motorola Semiconductor Products Sector * May 6, 1997 * Although the information contained herein, as well as any information provided relative * * thereto, has been carefully reviewed and is believed accurate, Motorola assumes no * * liability arising out of its application or use, neither does it convey any license under * * its patent rights nor the rights of others. * * These equates assign memory addresses to variables. EEPROM EQU $B600 CODEBGN EQU $B60D REGOFF EQU $1000 ;Offset to access registers beyond direct addressing range. PORTC EQU $03 PORTB EQU $04 DDRC EQU $07 TCTL2 EQU $21 TFLG1 EQU $23 ADCTL EQU $30 ADR1 EQU $31 ADR2 EQU $32 ADR3 EQU $33 ADR4 EQU $34 OPTION EQU $39 STACK EQU $01FF ;Starting address for the Stack Pointer. RAM EQU $0000 * These equates assign specific masks to variables to facilitate bit setting, clearing, etc. ADPU EQU $80 ;Power up the analog to digital converter circuitry. CSEL EQU $40 ;Select the internal system clock. CCF EQU $80 ;Conversion complete flag. IC1F EQU $04 ;Input Capture 1 flag. IC1FLE EQU $20 ;Configure Input Capture 1 to detect falling edges only. IC1FCLR EQU $FB ;Clear the Input Capture 1 flag. CHNLS47 EQU $14 ;Select channels 4 through 7 with MULT option ON. SAMPLES EQU $0200 ;Number of A/D samples taken. OC1F EQU $80 ;Output Compare 1 flag. OC1FCLR EQU $7F ;Clear the Output Compare flag. CURDLY EQU $0098 ;Timer cycles to create delay for displaying ”Your Speed.” RAMBYTS EQU $19 ;Number of RAM variables to clear during initialization. ALLONES EQU $FF YOURSPD EQU $01 PRPFCTR EQU $00AD ;This constant of proportionality was empirically determined. * Variables used for computation. ORG RAM OFFSET1 RMB 1 ;One for each accelerometer. OFFSET2 RMB 1 OFFSET3 RMB 1 OFFSET4 RMB 1 SUM1 RMB 2 ;Area under the acceleration vs. time curve. SUM2 RMB 2 SUM3 RMB 2 SUM4 RMB 2 GRNDSUM RMB 2 COUNT RMB 2 CURBIN RMB 1 TEMPBIN RMB 1 BCD RMB 2 CURDSPL RMB 2 MAXBIN RMB 1 MAXDSPL RMB 2 * LED seven segment display patterns table. ORG EEPROM JMP START SEVSEG FCB %11111010 FCB %01100000 FCB %11011100 FCB %11110100 FCB %01100110 FCB %10110110 FCB %10111110 FCB %11100000 FCB %11111110 FCB %11100110 Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0054/C0051/C0053 2–98 Motorola Sensor Device Datawww.motorola.com/semiconductors * This is the main program loop. ORG CODEBGN START LDS #STACK LDX #REGOFF JSR LEDINIT JSR ADCINIT JSR VARINIT MAIN JSR CAPTURE JSR COMPUTE JSR BINTBCD JSR OUTPUT BRA MAIN * This subroutine initializes ports B & C, and the LED display. LEDINIT PSHX PSHA LDX #REGOFF BSET DDRC,X,ALLONES ;Configure port C as an output. LDAA SEVSEG STAA PORTB,X STAA PORTC,X PULA PULX RTS * This subroutine initializes the analog to digital converter. ADCINIT PSHX PSHA LDX #REGOFF BSET OPTION,X,ADPU ;Turn on A/D converter via ADPU bit. BCLR OPTION,X,CSEL ;Select system e clock via CSEL bit. CLRA DELAY INCA BNE DELAY PULA PULX RTS * This subroutine clears all the memory variables. VARINIT PSHX LDX #$0000 CLRVAR CLR OFFSET1,X INX CPX #RAMBYTS ;Number of RMB bytes. BLO CLRVAR DONECLR LDX #REGOFF LDAA #CHNLS47 ;Measure the offset. STAA ADCTL,X OFSWAIT BRCLR ADCTL,X,CCF,OFSWAIT LDD ADR1,X STD OFFSET1 LDD ADR3,X STD OFFSET3 PULX RTS * This subroutine waits for impact and computes the area under the curve. CAPTURE PSHX PSHA PSHB LDX #REGOFF BSET TCTL2,X,IC1FLE ;Set IC1 to detect falling edge only. BCLR TFLG1,X,IC1FCLR MONITOR BRCLR TFLG1,X,IC1F,MONITOR ADCREAD LDAA #CHNLS47 ;Select channels 4 – 7 for conversion. STAA ADCTL,X ADCWAIT BRCLR ADCTL,X,CCF,ADCWAIT CALDLT1 LDAB ADR1,X SUBB OFFSET1 BPL ADDSUM1 COMB INCB ADDSUM1 CLRA ADDD SUM1 STD SUM1 CALDLT2 LDAB ADR2,X SUBB OFFSET2 BPL ADDSUM2 COMB INCB ADDSUM2 CLRA ADDD SUM2 STD SUM2 CALDLT3 LDAB ADR3,X SUBB OFFSET3 BPL ADDSUM3 COMB INCB Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0054/C0051/C0053 2–99Motorola Sensor Device Data www.motorola.com/semiconductors ADDSUM3 CLRA ADDD SUM3 STD SUM3 CALDLT4 LDAB ADR4,X SUBB OFFSET4 BPL ADDSUM4 COMB INCB ADDSUM4 CLRA ADDD SUM4 STD SUM4 LDD COUNT ADDD #$0001 STD COUNT CPD #SAMPLES BLO ADCREAD PULB PULA PULX RTS * This subroutine computes the ball speed by dividing the overall sum by a constant. COMPUTE PSHX PSHA PSHB LDD SUM1 ADDD SUM2 ADDD SUM3 ADDD SUM4 STD GRNDSUM LDX #PRPFCTR IDIV XGDX STAB CURBIN PULB PULA PULX RTS * This subroutine converts from binary to BCD. (Limited to number up to 99 decimal.) BINTBCD PSHX PSHA PSHB LDX #$0000 LDAA CURBIN STAA TEMPBIN CLRA CLRB BINSHFT LSL TEMPBIN ROLB LSLA CMPB #$10 BLO CHKDONE INCA ANDB #$0F CHKDONE INX CPX #$0008 BEQ RAILAT9 CHKFIVE CMPB #$05 BLO BINSHFT ADDB #$03 BRA BINSHFT RAILAT9 CMPA #$09 ;Force the display to “99” if speed > 100 mph. BLS DONE LDD #$0909 DONE STD BCD LDX #SEVSEG ;This part finds the seven segment display codes. XGDX ADDB BCD XGDX LDAA $00,X STAA CURDSPL LDX #SEVSEG XGDX ADDB BCD+1 XGDX LDAA $00,X STAA CURDSPL+1 PULB PULA PULX RTS * This subroutine displays the current speed for 5 seconds & then displays the maximum. OUTPUT PSHX PSHA PSHB Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0054/C0051/C0053 2–100 Motorola Sensor Device Datawww.motorola.com/semiconductors LDX #REGOFF LDAA CURBIN CMPA MAXBIN BLS OLDMAX STAA MAXBIN LDD CURDSPL STD MAXDSPL OLDMAX LDD CURDSPL STD PORTC,X BSET PORTB,X,YOURSPD ;Toggle the ”YOUR”/“BEST” LEDs. LDD #$0000 LEDWAIT BCLR TFLG1,X,OC1FCLR ;Clear output compare 1 flag. DSPLDLY BRCLR TFLG1,X,OC1F,DSPLDLY ADDD #$0001 CPD #CURDLY ;Decimal 152. (152 * 33ms = 5.0 sec) BLO LEDWAIT LDX #$0000 RECLEAR CLR SUM1,X ;Clear 12 RAM bytes beginning at address ”SUM1”. INX ;Clears SUM1 thru SUM4, GRNDSUM, and COUNT. CPX #$000C BLO RECLEAR LDX #REGOFF LDD MAXDSPL STD PORTC,X ;The ”YOUR”/“BEST” LEDS are automatically toggled. PULB PULA PULX RTS Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

pass stringent electromagnetic compatibility (EMC) tests. can be applied to other electronic components in the system. Figure 1. BCI Test Setup Freescale Semiconductor, Inc.

be monitored for unexpected performance. there is not a crash or not deploy when there is a crash. a sensitivity of 40 mV/g and an offset (0g output) of 2.50 V. expected window of drift, it fails the test. generator creating the high frequency signal was turned on). Figure 2. Accelerometer Tested Under High Frequency BCI shift was caused by a shift in the 0–5 V supply window. Freescale Semiconductor, Inc.

/C0065/C0078/C0049/C0054/C0052/C0048 2–103Motorola Sensor Device Data www.motorola.com/semiconductors voltage will result in the same proportional change in the output. For example, if the 5 V supply were to change by 10%, from 5.0 V to 5.5 V, the accelerometer offset will change by 10% also, from 2.5 V to 2.75 V. This phenomena would also occur if the ground were to shift. A 100 mV change in ground would result in a 50 mV change in the output. If the accelerometer does not have low impedance path to ground and parasitics from a poor ground are present as a result, the ground seen by the accelerometer may change over frequency. So, during a BCI test, if the 5.0 V supply does not shift but the output of the accelerometer does, the ground to the accelerometer may be moving. It was found with some experimentation that the offset shift can be eliminated with proper board layout techniques as described below. PROPER LAYOUT TECHNIQUES Since the Motorola accelerometer is a sensitive analog device that relies on a clean supply to function within established parameters, there are some techniques that can be employed to minimize the effects of BCI on the accelerometer performance. PCB layout is paramount to reducing susceptibility to BCI.

A low impedance path to ground will provide shunting of the high frequency interference and minimize its effect on the accelerometer. The best way to provide a good path is by putting a solid, unbroken ground plane in the PCB. This ground plane should be shunted to chassis ground at the module connector. This will ensure that the high frequency BCI will be shunted before interfering with accelerometer performance.
All accelerometer pins that require ground connection should be tied together to a common ground.
Traces attached directly to the connector pins can receive high RF noise, which can couple to nearby traces and com- ponents. Increasing series impedance of the traces helps reduce the couple or conducted noise. High frequency fil- ters on the supply line and other susceptible lines may be required to filter out high frequency interference introduced by the BCI test. Signal lines that carry low current can toler- ate series resistances of 100–200 Ω .
Decoupling capacitors on every input line to the common ground plane will help shunt the high frequency away from the system. These should be placed near the connector.
Signal trace lengths to and from the accelerometer should be kept at a minimum. The shorter the trace, the less chance it has of picking up high frequency BCI signals as it crosses the board. Trace lengths can be reduced by plac- ing the accelerometer and the microcontroller as close together as possible. Signal and ground traces looping should be minimized.
A decoupling capacitor on the accelerometer Vcc pin will also help minimize BCI effects. The recommended value is 0.1 µF. This capacitor should be placed as close as pos- sible to the accelerometer to achieve the best results.
To maximize ratiometricity, the accelerometer Vcc and the microcontroller A/D reference pin should be on the same trace. The accelerometer ground and the microcontroller ground should also share the same ground point. There- fore, when there is signal interference due to BCI, the A/D converter and the accelerometer will see the interference at the same level. This will result in the same digital code representation of acceleration without signal interference.
A clean power supply to both the accelerometer and the microcontroller should be provided. Supply traces should avoid high current traces that might carry high RF currents during the BCI test. The traces should be as short as possible.
The accelerometer should be placed on the opposite end of the PCB away from the connector. The farther the dis- tance, the lower the chance high frequency RF from BCI will interfere with the accelerometer.
The accelerometer should be placed away from high cur- rent paths that may carry high RF currents during the BCI test. Automotive customers will continue to require airbag systems to have high standards for EMC. One way to test for EMC is perform the Bulk Current Injection test. Because of the high current involved, BCI is one of the most difficult EMC tests to pass. Being part of the airbag system, the accelerometer must continue to function normally under application of high frequency BCI. The accelerometer is highly sensitive to placement on the board and its connection to ground. Poor design will caused the device to fail the BCI test. The practice of good PCB layout, device placement and good grounding will allow the accelerometer to function within specification and pass the BCI test. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

Figure 2. Evaluation Board Circuit Schematic

9 V to 15 V

6 STATUS

82 VDD

Figure 3. Motorola Accelerometer Evaluation Board with Test Socket by lifting the top and bottom snaps of the lid.

4 ST Logic input pin to initiate self–test

5 VOUT Output voltage of the accelerometer

6 STATUS Logic output pin to indicate fault

7 VSS Power supply ground

8 VDD Power supply input

Freescale Semiconductor, Inc.

selected to facilitate component replacement. board has holes on the four corners of the board for mounting. perpendicular to the plane of the evaluation board. the end product; such as a motor or a piece of equipment. Figure 4. Board Layout (Com ponent Side) Figure 5. Board Layout (Back Side) Freescale Semiconductor, Inc.

2–107Motorola Sensor Device Data www.motorola.com/semiconductors Case Outlines CASE 475–01 ISSUE B NOTES: 1. ALL DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS ”A” AND ”B” DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 PER SIDE. 4. DIMENSION ”D” DOES NOT INCLUDE DAMBAR PROTRUSION. PROTRUSIONS SHALL NOT CAUSE THE LEAD WIDTH TO EXCEED 0.75 DIM MIN MAX MILLIMETERS A 10.15 10.45 B 7.40 7.60 C 3.30 3.55 D 0.35 0.49 F 0.76 1.14 G 1.27 BSC J 0.25 0.32 K 0.10 0.25 M 0 7 P 10.16 10.67 R 0.25 0.75 /C0095/C0095 16 9 P

2 PLACES, 16 TIPS

A0.15 BT AM0.13 B T C K R X 45/C0095 J F M SEATING PLANE A B A B T G G/2 0.1 CASE 475A–01 ISSUE O NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUM MATERIAL CONDITION. DIM MIN MAX MIN MAX INCHESMILLIMETERS A 12.67 12.96 0.499 0.510 B 7.40 7.60 0.292 0.299 C 3.30 3.55 0.130 0.140 D 0.35 0.49 0.014 0.019 F 0.76 1.14 0.030 0.045 G 1.27 BSC 0.050 BSC J 0.25 0.32 0.010 0.012 K 0.10 0.25 0.004 0.009 M 0 7 0 7 P 10.16 10.67 0.400 0.420 R 0.25 0.75 0.010 0.029 /C0095/C0095/C0095/C0095 11 0 20 11 –T– –B– –A– P10 PL D 16 PL MAM0.13 (0.005) B MT MAM0.13 (0.005) B MT C K G R X 45/C0095 J F MSEATING PLANE Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

2–108 Motorola Sensor Device Datawww.motorola.com/semiconductors CASE 456–06 ISSUE J WB PACKAGE DIM MIN MAX INCHES A 0.6380.618 B 0.2600.240 C 0.1330.127 D 0.0210.015 G 0.100 BSC H 0.050 BSC J 0.009 0.012 K 0.125 0.140 L 0.063 0.070 M 0.015 0.025 N 0.036 0.044 P 0.095 0.110 NOTES: 1. DIMENSIONS ARE IN INCHES. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M–1994. 3. PLANE –X– AND PLANE –Y– SHOULD BE ALIGNED WITHIN /C00340.0015”. MAM0.005 B MT G H D6X C J N M S S 0.025 0.035 U U P U 0.088 0.108 L8X K8X A A Y T B B Y CASE 648C–04 ISSUE D DIP PACKAGE DIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.744 0.783 18.90 19.90 B 0.240 0.260 6.10 6.60 C 0.145 0.185 3.69 4.69 D 0.015 0.021 0.38 0.53 E 0.050 BSC 1.27 BSC F 0.040 0.70 1.02 1.78 G 0.100 BSC 2.54 BSC J 0.008 0.015 0.20 0.38 K 0.115 0.135 2.92 3.43 L 0.300 BSC 7.62 BSC M 0 10 0 10 N 0.015 0.040 0.39 1.01 /C0095/C0095/C0095/C0095 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 16 9 D G E N K C 16X AM0.005 (0.13) T SEATING PLANE BM0.005 (0.13) T J16X M L A A B F T B Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

2–109Motorola Sensor Device Data www.motorola.com/semiconductors Accelerometer Glossary of Terms Acceleration Change in velocity per unit time. Acceleration Vector Vector describing the net acceleration acting upon the device. Frequency Bandwidth The accelerometer output frequency range. g A unit of acceleration equal to the average force of gravity occurring at the earth’s surface. A g is approximately equal to 32.17 ft/s2 or 9.807 m/s2. Nonlinearity The maximum deviation of the accelerometer output from a point–to–point straight line fitted to a plot of acceleration vs. output voltage. This is determined as the percentage of the full–scale output (FSO) voltage at full–scale acceleration (40g). Ratiometric The variation of the accelerometer’s output offset and sensitivity linearly proportional to the variation of the power supply voltage. Sensitivity The change in output voltage per unit g of acceleration applied. This is specified in mV/g. Sensitive Axis The most sensitive axis of the accelerometer. On the DIP package, acceleration is in the direction perpendicular to the top of the package (positive acceleration going into the device). On the SIP package, acceleration is in the direction perpendicular to the pins. Transverse Acceleration Any acceleration applied 90° to the axis of sensitivity. Transverse Sensitivity Error The percentage of a transverse acceleration that appears at the output. For example, if the transverse sensitivity is 1%, then a +40 g transverse acceleration will cause a 0.4 g signal to appear on the output. Transverse sensitivity can result from sensitivity of the g–cell to transverse forces. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

2–110 Motorola Sensor Device Datawww.motorola.com/semiconductors Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

3–1Motorola Sensor Device Data www.motorola.com/semiconductors /C0080/C0114/C0101/C0115/C0115/C0117/C0114/C0101 /C0083/C0101/C0110/C0115/C0111/C0114 /C0080/C0114/C0111/C0100/C0117/C0099/C0116/C0115 Section Three General Information: Pressure Sensor Overview Motorola’s pressure sensors are silicon micromachined, elec- tromechanical devices featuring device uniformity and con- sistency, high reliability, accuracy and repeatability at competitively low costs. With more than 20 years in pressure sensor engineering, technology development and manufac- turing, these pressure sensors have been designed into auto- motive, industrial, healthcare, commercial and consumer products worldwide. Pressure sensors operate in pressures up to 150psi (1000 kPa). For maximum versatility, Motorola pressure sensors are single silicon, piezoresistive devices with three levels of de- vice sophistication. The basic sensor device provides uncom- pensated sensing, the next level adds device compensation and the third and most value added pressure sensors are the integrated devices. Compensated sensors are available in temperature compensated and calibrated configurations; inte- grated devices are available in temperature compensated, calibrated and signal conditioned (or amplified) configura- tions. Each sensor family is available in gauge, absolute and differential pressure references in a variety of packaging and porting options. Pressure Sensor Overview Reference Information Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

3–2 Motorola Sensor Device Datawww.motorola.com/semiconductors Mini Selector Guide PRESSURE SENSORS Uncompensated Pressure Sensors Product Family Pressure Rating Maximum Pressure Rating Maximum Pressure Rating Maximum Pressure Rating Maximum Pressure Rating Maximum Offset (Typ) (mV) Full Scale Span (Typ) Sensitivity (mV/kPa) Pressure Type Note Maxim um (psi) Maxim um (kPa) Maxim um (in H2O) Maxim um (cm H20) Maxim um (mm Hg) (mV) (Typ) (mV) A D G MPX10 1.45 10 40 102 75 20 35 3.5 /C0068/C0068 MPX12 1.45 10 40 102 75 20 55 3.5 /C0068/C0068 MPX53 7 50 200 510 375 20 60 1.2 /C0068/C0068 Note: A = Absolute, D = Differential, G = Gauge, V = Vacuum Compensated Pressure Sensors Product Family Pressure Rating Maximum Pressure Rating Maximum Pressure Rating Maximum Pressure Rating Maximum Pressure Rating Maximum Offset (mV) Full Scale Span (Typ) Sensitivity (mV/kPa) Pressure Type Note Maxim um (psi) Maxim um (kPa) Maxim um (in H2O) Maxim um (cm H20) Maxim um (mm Hg) (Typ) (mV) A D G MPX2010 1.45 10 40 102 75 ±1.0 25 2.5 /C0068/C0068 MPX2053 7 50 201 510 375 ±1.0 40 0.8 /C0068V MPX2102 14.5 100 400 1020 750 ±2.0 40 0.4 /C0068 14.5 100 400 750 ±1.0 40 0.4 /C0068V MPX2202 29 200 800 2040 1500 ±1.0 40 0.2 /C0068 29 200 800 1500 ±1.0 40 0.2 /C0068V MPX2050 7 50 201 510 375 ±1.0 40 0.8 /C0068/C0068 MPX2100 14.5 100 400 1020 750 ±2.0 40 0.4 /C0068 14.5 100 400 750 ±1.0 40 0.4 /C0068V MPX2200 29 200 800 2040 1500 ±1.0 40 0.2 /C0068 29 200 800 1500 ±1.0 40 0.2 /C0068V Note: A = Absolute, D = Differential, G = Gauge, V = Vacuum Compensated Medical Grade Pressure Sensors Product Family Pressure Rating Maximum Pressure Rating Maximum Pressure Rating Maximum Pressure Rating Maximum Pressure Rating Maximum Supply Voltage (Typ) Offset Maximum (mV) Sensitivity (mV/kPa) Pressure Type Note Maxim um (psi) Maxim um (kPa) Maxim um (in H2O) Maxim um (cm H20) Maxim um (mm Hg) (Typ) (Vdc) (mV) A D G MPXC2011 1.45 10 40 102 75 10.0 1.0 n/a /C0068 MPX2300 5.8 40 161 408 300 6.0 0.75 5.0 /C0068 Note: A = Absolute, D = Differential, G = Gauge, V = Vacuum Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

3–3Motorola Sensor Device Data www.motorola.com/semiconductors PRESSURE SENSORS (continued) Integrated Pressure Sensors Product Family Pressure Rating Maximum Pressure Rating Maximum Pressure Rating Maximum Pressure Rating Maximum Pressure Rating Maximum Full Scale Span Sensitivity (mV/kPa) Accuracy 0/C0095C–85 /C0095C (% of Pressure Type Note (psi) (kPa) (in H2O) (cm H2O) (mm Hg) (Typ) (Vdc) VFSS) A D G MPX4080 11.6 80 321 815 600 4.3 54 ±3.0 /C0068 MPX4100 15.2 105 422 1070 788 4.6 54 ±1.8 /C0068 MPX4101 14.8 102 410 1040 765 4.6 54 ±1.8 /C0068 MPXH6101 14.8 102 410 1040 765 4.6 54 ±1.8 /C0068 MPX4105 15.2 105 422 1070 788 4.6 51 ±1.8 /C0068 MPX4115 16.7 115 462 1174 863 4.6 46 ±1.5 /C0068 16.7 115 462 1174 863 4 38 ±1.5 V MPX6115 16.7 115 462 1174 863 4.6 46 ±1.5 /C0068 MPX4200 29 200 803 2040 1500 4.6 26 ±1.5 /C0068 MPX4250 36 250 1000 2550 1880 4.7 20 ±1.5 /C0068 36 250 1000 2550 1880 4.7 19 ±1.4 /C0068/C0068 MPXV4006 0.87 6 24 61 45 4.6 766 ±5.0 /C0068V MPXV5004 0.57 4 16 40 29 3.9 1000 ±2.5 /C0068V MPX5010 1.45 10 40 102 75 4.5 450 ±5.0 /C0068V MPX5050 7.25 50 201 510 375 4.5 90 ±2.5 /C0068/C0068 MPX5100 14.5 100 401 1020 750 4.5 45 ±2.5 /C0068/C0068 16.7 115 462 1174 863 4.5 45 ±2.5 /C0068 MPX5500 72.5 500 2000 5100 3750 4.5 9 ±2.5 /C0068/C0068 MPX5700 102 700 2810 7140 5250 4.5 6 ±2.5 /C0068/C0068/C0068 MPX5999 150 1000 4150 10546 7757 4.5 5 ±2.5 /C0068 MPXH6300 44 300 1200 3060 2250 4.7 16 ±1.8 /C0068 Note: A = Absolute, D = Differential, G = Gauge, V = Vacuum Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

3–4 Motorola Sensor Device Datawww.motorola.com/semiconductors Device Numbering System for Pressure Sensors M PX A 2 XXX A P X T1 CATEGORY Qualified standard Custom device Prototype device M S P,X PRESSURE SENSORS PACKAGE TYPE Unibody Small outline package (SOP) Small outline media resistant package Chip pak Super small outline package (SSOP) M–Pak Super small outline package (TPMP) None A/V AZ C H M Y FEATURES* Uncompensated Temperature compensated/ calibrated Open Temperature compensated/ calibrated/signal conditioned Automotive accuracy Temperature compensated/ calibrated/signal conditioned High temperature Open CMOS None SHIPPING METHOD Trays Tape and reel 1 indicates part orientation in tape Rail None U No leadform Open (Consult factory) Open SOP only NONE 1 thru 2 3 thru 5 6 thru 7 LEADFORM OPTIONS TYPE OF DEVICE Absolute Gauge Differential Vacuum/Gauge A G D V PORTING STYLE Axial port (small outline package) Ported Single port (AP, GP, GVP) Dual port (DP) Stovepipe port (unibody) Axial port (unibody) C P S SX Rated pressure in kPa, except for MPX2300, expressed in mmHg. (6 = Gull wing/Surface mount) (7 = 87 degrees/DIP) Note: Actual product marking may be abbreviated due to space constraints but packaging label will reflect full part number. *Only applies to qualified and prototype devices. This does not apply to custom devices. Examples: MPX10DP 10 kPa uncompensated, differential device in minibody package, ported, no leadform, shipped in trays. MPXA4115A6T1 115 kPa automotive temperature compensated and calibrated device with signal conditioning, SOP surface mount with gull wing leadform, shipped in tape and reel. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

3–5Motorola Sensor Device Data www.motorola.com/semiconductors What Are the Pressure Packaging Options? (Sizes not to scale) UNIBODY BASIC ELEMENT CASE 344 SUFFIX A / D UNIBODY SINGLE PORT CASE 344B SUFFIX AP / GP UNIBODY DUAL PORT CASE 344C SUFFIX DP UNIBODY BASIC ELEMENT CASE 867 SUFFIX A / D UNIBODY SINGLE PORT CASE 867B SUFFIX AP / GP UNIBODY DUAL PORT CASE 867C SUFFIX DP UNIBODY AXIAL PORT CASE 867F SUFFIX ASX / GSX UNIBODY STOVEPIPE PORT CASE 867E SUFFIX AS / GS Preferred Pressure Sensor Packaging Options Pressure Sensor Packaging SOP CASE 482 SUFFIX AG / G6 SOP CASE 482B SUFFIX G7U SOP AXIAL PORT CASE 482A SUFFIX AC6 / GC6 SOP AXIAL PORT CASE 482C SUFFIX GC7U MEDICAL CHIP PAK CASE 423A SUFFIX DT1 UNIBODY STOVEPIPE PORT CASE 344E SUFFIX AS / GS J MPAK CASE 1320 SUFFIX A / D MPAK AXIAL PORT CASE 1320A SUFFIX AS / GS SOP SIDE PORT CASE 1369 SUFFIX AP / GP SOP DUAL PORT CASE 1351 SUFFIX DP SOP VACUUM PORT CASE 1368 SUFFIX GVP SSOP CASE 1317 SUFFIX A6 SSOP AXIAL PORT CASE 1317A SUFFIX AC6 Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

3–6 Motorola Sensor Device Datawww.motorola.com/semiconductors Orderable Part Numbers PRESSURE SENSOR ORDERABLE PART NUMBERS Uncompensated MPX2102D Integrated MPX4100A MPX4250A MPX10D MPX2102GP MPXV5004GC6T1 MPX4100AP MPX4250AP MPX10DP MPX2102DP MPXV5004GC6U MPX4100AS MPXA4250AC6T1 MPX10GP MPX2102GSX MPXV5004GC7U MPXA4100AC6U MPXA4250AC6U MPX10GS MPX2102GVP MPXV5004G6T1 MPXA4100A6T1 MPXA4250A6T1 MPXV10GC6T1 MPXM2102D MPXV5004G6U MPXA4100A6U MPXA4250A6U MPXV10GC6U MPXM2102DT1 MPXV5004G7U MPXAZ4100AC6T1 MPXH6300ACGU MPXV10GC7U MPXM2102GS MPXV5004GP MPXAZ4100AC6U MPXH6300AC6T1 MPX12D MPXM2102GST1 MPXV5004DP MPXAZ4100A6T1 MPXH6300A6U MPX12DP MPXV2102GP MPXV5004GVP MPXAZ4100A6U MPXH6300A6T1 MPX12GP MPXV2102DP MPXV4006GC6T1 MPX4101A MPX5700D MPX53D MPX2102A MPXV4006GC6U MPXA4101AC6U MPX5700DP MPX53DP MPX2102AP MPXV4006GC7U MPXH6101A6T1 MPX5700GP MPX53GP MPX2102ASX MPXV4006G6T1 MPXH6101A6U MPX5700GS MPXV53GC6T1 MPXM2102A MPXV4006G6U MPX4105A MPXV6115VC6U MPXV53GC6U MPXM2102AT1 MPXV4006G7U MPXV4115VC6U MPXAZ6115A6U MPXV53GC7U MPXM2102AS MPXV4006GP MPXV4115V6T1 MPXAZ6115A6T1 Compensated MPXM2102AST1 MPXV4006DP MPXV4115V6U MPXAZ6115AC6U MPX2300DT1 MPX2100D MPX5010D MPX5700A MPXAZ6115AC6T1 MPX2301DT1 MPX2100GP MPX5010DP MPX5700AP MPX2010D MPX2100DP MPX5010DP1 MPX5700AS MPX2010GP MPX2100GSX MPX5010GP MPX5999D MPX2010DP MPX2100GVP MPX5010GS MPX4115A MPX2010GS MPX2100A MPX5010GSX MPX4115AP MPX2010GSX MPX2100AP MPXV5010GC6T1 MPX4115AS MPXM2010D MPX2100ASX MPXV5010GC6U MPXA4115AC6T1 MPXM2010DT1 MPX2202D MPXV5010GC7U MPXA4115AC6U MPXM2010GS MPX2202GP MPXV5010G6U MPXA4115A6T1 MPXM2010GST1 MPX2202DP MPXV5010G7U MPXA4115A6U MPXC2011DT1 MPX2202GSX MPXV5010GP MPXA4115AP MPXC2012DT1 MPX2202GVP MPXV5010DP MPXAZ4115AC6T1 MPXV2010GP MPXM2202D MPX5500D MPXAZ4115AC6U MPXV2010DP MPXM2202DT1 MPX5500DP MPXAZ4115A6T1 MPX2053D MPXM2202GS MPX5050D MPXAZ4115A6U MPX2053GP MPXM2202GST1 MPX5050DP MPXA6115AC6T1 MPX2053DP MPXV2202GP MPX5050GP1 MPXA6115AC6U MPX2053GSX MPXV2202DP MPX5050GP MPXA6115A6T1 MPX2053GVP MPX2202A MPXV5050GP MPXA6115A6U MPXM2053D MPX2202AP MPXV5050DP MPXH6115A6T1 MPXM2053DT1 MPX2202ASX MPX5100D MPXH6115A6U MPXM2053GS MPXM2202A MPX5100DP MPXH6115AC6T1 MPXM2053GST1 MPXM2202AT1 MPX5100GP MPXH6115AC6U MPXV2053GP MPXM2202AS MPX5100GSX MPX4200A MPXV2053DP MPXM2202AST1 MPX5100A MPX4250D MPX2050D MPX2200D MPX5100AP MPX4250DP MPX2050GP MPX2200GP MPX4080D MPX4250GP MPX2050DP MPX2200DP MPX2050GSX MPX2200GSX MPX2200GVP MPX2200A MPX2200AP Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

Figure 4. Linearity Specification Comparison calculations required are burdensome. point straight line method measured at the midrange pressure. Differential Pressure and Gauge Pressure. pressure to the “Pressure” side of the sensor. negative pressure applied to the “Vacuum” side. Figure 5. Pressure Measurements

1 ATM PMAX

capacity, although accuracy at pressures exceeding the rated pressure will be reduced. When excessive pressure is reduced, the previous linearity is immediately restored. Freescale Semiconductor, Inc.

3–12 Motorola Sensor Device Datawww.motorola.com/semiconductors Integration ON-CHIP SIGNAL CONDITIONING To make the designer’s job even easier, Motorola’s integrated devices carry sensor technology one step further. In addition to the on-chip temperature compensation and calibration offered currently on the 2000 series, amplifier signal conditioning has been integrated on-chip in the 4000, 5000 and 6000 series to allow interface directly to any microcomputer with an on-board A/D converter. The signal conditioning is accomplished by means of a four-stage amplification network, incorporating linear bipolar processing, thin-film metallization techniques, and interac- tive laser trimming to provide the state-of-the-art in sensor technology. 1.0 /C0109F IPS OUTPUT3 /C00435 V 0.01 /C0109F Recommended Power Supply Decoupling. For output filtering recommendations, please refer to Application Note AN1646. 470 pF Design Considerations for Different Levels of Sensor Integration DESIGN ADVANTAGES DESIGN CONSIDERATIONS Uncompensated Sensors High Sensitivity Device–to–Device Variation in Offset and Span Lowest Device Cost Temperature Compensation Circuitry Required Low–Level Output Allows Flexibility of Signal Conditioning Requires Signal Conditioning/ Amplification of Output Signal Relatively Low Input Impedance (400 Ω Typical) Temperature Compensated & Calibrated (2000 Series) Reduced Device–to–Device Variations in Offset and Span Lower Sensitivity Due to Span Compensation (Compared to Uncompensated) Reduced Temperature Drift in Offset and Span Priced Higher than Uncompensated Device Reasonable Input Impedance (2K Ω Typical) Requires Signal Conditioning/ Amplification of Output Signal Low Level Output Allows Flexibility in Signal Conditioning Integrated Pressure Sensors (4000, 5000 and 6000 Series) No Amplification Needed Direct Interface to MPU Priced Higher than Compensated/ Uncompensated Device Signal Conditioning, Calibration of Span and Offset, Temperature Compensation Included On–Chip Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

3–13Motorola Sensor Device Data www.motorola.com/semiconductors Sensor Applications AUTOMOTIVE/AVIATION APPLICATIONS

Fuel Level Indicator
Altimeters
Air Speed Indicator
Ejection Seat Control
Turbo Boost Control
Manifold Vacuum Control
Fuel Flow Metering
Oil Filter Flow Indicator
Oil Pressure Sensor
Air Flow Measurement
Anti–Start
Breathalizer Systems
Smart Suspension Systems
Variometer–Hang glider & Sailplanes
Automotive Speed Control HEALTHCARE APPLICATIONS
Blood Pressure
Esophagus Pressure
Heart Monitor
Interoccular Pressure
Saline Pumps
Kidney Dialysis
Blood Gas Analysis
Blood Serum Analysis
Seating Pressure (Paraplegic)
Respiratory Control
Intravenous Infusion Pump Control
Hospital Beds
Drug Delivery
IUPC
Patient Monitors INDUSTRIAL/COMMERCIAL APPLICATIONS
Electronic Fire Fighting Control
Flow Control
Barometer
HVAC Systems
Tire Pressure Monitoring
Water Filtered Systems (Flow Rate Indicator)
Air Filtered Systems (Flow Rate Indicator)
Tactile Sensing for Robotic Systems
Boiler Pressure Indicators
End of Tape Readers
Disc Drive Control/Protection Systems
Ocean Wave Measurement
Diving Regulators
Oil Well Logging
Building Automation (Balancing, Load Control, Windows)
Fluid Dispensers
Explosion Sensing — Shock Wave Monitors
Load Cells
Autoclave Release Control
Soil Compaction Monitor — Construction
Water Depth Finders (Industrial, Sport Fishing/Diving)
Pneumatic Controls — Robotics
Pinch Roller Pressure — Paper Feed
Blower Failure Safety Switch — Computer
Vacuum Cleaner Control
Electronic Drum
Pressure Controls Systems — Building, Domes
Engine Dynamometer
Water Level Monitoring
Altimeters Motorola has tested media tolerant sensor devices in selected solutions or environments and test results are based on particular conditions and procedures selected by Motorola. Customers are advised that the results may vary for actual services conditions. Customers are cautioned that they are responsible to determine the media compatibility of sensor devices in their applications and the foreseeable use and misuses of their applications. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

3–14 Motorola Sensor Device Datawww.motorola.com/semiconductors Pressure Sensor FAQ’s We have discovered that many of our customers have similar questions about certain aspects of our pressure sensor technology and operation. Here are the most frequently asked questions and answers that have been explained in relatively non–technical terms. Q. How do I calculate total pressure error for my applications? A. You can calculate total error in two fashions, worst case error and most probable error. Worst case error is taking all the individual errors and adding them up, while most probable error sums the squares of the individual errors and then take the square root of the total. In summary, Error (Worst Case) = E1 + E2 + E3 + ... + En, while Error (Most Probable) = SQRT[(E1)2 + (E2)2 + (E3)2 + ... (En)2]; Please note that not all errors may apply in your individual application. Q. What is the media tolerance of our pressure sen- sors? A. Most Motorola pressure sensors are specifically de- signed for dry air applications. However, Motorola now offers an MPXAZ series specifically designed for im- proved media resistance. This series incorporates a durable barrier that allows the sensor to operate reliably in high humidity conditions as well as environments containing common automotive media. NOTE: Applica- tions exposing the sensor to media other than what has been specified could potentially limit the lifetime of the sensor. Please consult the Motorola factory for more information regarding media compatibility in your specific application. Q. Can I pull a vacuum on P1? A. Motorola pressure sensors are designed to measure pressure in one direction and are not bi–directional. It is possible to measure either a positive pressure OR a negative pressure, but not both. For example, the sensor can be designed to accept a ”positive” pressure on the P1 port, providing that P1 is greater or equal to P2 while staying with in the sensors specified pressure range. Or, the sensor can measure ”negative” pressure (a vacu- um)by applying the pressure to the P2 port, again while P1 is greater or equal to P2 and staying within the sensors specified range. Our pressure sensors are based on a silicon diaphragm and can not tolerate a pressure that alternates from positive to negative without resulting damage. The devices are rated for over pressure and burst but should not be intentionally designed to operate in a bi–direction- al manner. If you need to measure both a positive and negative pressure within the same system, we suggest designing with two separate sensors, one for each pressure type. Or, a mechanical pressure transducer should be utilized. Q. What will happen if I run the pressure sensor beyond the rated operating pressure? A. For bare elements (uncompensated and compensated series devices), when you take the sensor higher than the rated pressure, the part will still provide an output increasing linearly with pressure. When you go below the minimum rated pressure, the output of the sensor will eventually go negative. Motorola, however, does not guarantee electrical specifications beyond the rated operating pressure range specified in the data sheet of each device. The integrated series devices will not function at all beyond the rated pressure of the part. These series of parts will saturate at near 4.8 V and 0.2 V and thus no further change in output will occur. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

3–15Motorola Sensor Device Data www.motorola.com/semiconductors /C0049/C0048 /C0107/C0080/C0097 /C0085/C0110/C0099/C0111/C0109/C0112/C0101/C0110/C0115/C0097/C0116/C0101/C0100 /C0083/C0105/C0108/C0105/C0099/C0111/C0110 /C0080/C0114/C0101/C0115/C0115/C0117/C0114/C0101 /C0083/C0101/C0110/C0115/C0111/C0114/C0115 The MPX10 and MPXV10GC series devices are silicon piezoresistive pressure sensors providing a very accurate and linear voltage output — directly proportional to the applied pressure. These standard, low cost, uncompensated sensors permit manufacturers to design and add their own external temperature compensation and signal conditioning networks. Compensation techniques are simplified because of the predictability of Motorola’s single element strain gauge design. Figure 1 shows a schematic of the internal circuitry on the stand–alone pressure sensor chip.

Low Cost
Patented Silicon Shear Stress Strain Gauge Design
Ratiometric to Supply Voltage
Easy to Use Chip Carrier Package Options
Differential and Gauge Options
Durable Epoxy Unibody Element or Thermoplastic (PPS) Surface Mount Package Application Examples
Air Movement Control
Environmental Control Systems
Level Indicators
Leak Detection
Medical Instrumentation
Industrial Controls
Pneumatic Control Systems
Robotics

Figure 1. Uncompensated Pressure

1 GND

Freescale Semiconductor, Inc.

/C0077/C0080/C0088/C0049/C0048 /C0077/C0080/C0088/C0086/C0049/C0048/C0071/C0067 /C0083/C0069/C0082/C0073/C0069/C0083 3–16 Motorola Sensor Device Datawww.motorola.com/semiconductors MAXIMUM RATINGS (NOTE) Rating Symbol Value Unit Maximum Pressure (P1 > P2) Pmax 75 kPa Burst Pressure (P1 > P2) Pburst 100 kPa Storage Temperature Tstg –40 to +125 °C Operating Temperature TA –40 to +125 °C NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device. OPERATING CHARACTERISTICS (VS = 3.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Characteristic Symbol Min Typ Max Unit Differential Pressure Range(1) POP 0 — 10 kPa Supply Voltage(2) VS — 3.0 6.0 Vdc Supply Current Io — 6.0 — mAdc Full Scale Span(3) VFSS 20 35 50 mV Offset(4) Voff 0 20 35 mV Sensitivity ΔV/ΔP — 3.5 — mV/kPa Linearity(5) — –1.0 — 1.0 %V FSS Pressure Hysteresis(5) (0 to 10 kPa) — — ± 0.1 — %V FSS Temperature Hysteresis(5) (–40°C to +125°C) — — ± 0.5 — %V FSS Temperature Coefficient of Full Scale Span(5) TCV FSS –0.22 — –0.16 %V FSS /°C Temperature Coefficient of Offset(5) TCV off — ±15 — µV/°C Temperature Coefficient of Resistance(5) TCR 0.28 — 0.34 %Z in/°C Input Impedance Zin 400 — 550 Ω Output Impedance Zout 750 — 1250 Ω Response Time(6) (10% to 90%) tR — 1.0 — ms Warm–Up Time (7) — — 20 — ms Offset Stability(8) — — ± 0.5 — %V FSS NOTES: 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self–heating. 3. Full Scale Span (VFSS ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following:

Linearity: Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C.
TcSpan: Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C.
TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C.
TCR: Z in deviation with minimum rated pressure applied, over the temperature range of –40°C to +125°C, relative to 25°C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Warm–up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 8. Offset Stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

MPX10 and MPXV10GC series over temperature. an extensive temperature range. presented in Motorola Applications Note AN840. culations required are burdensome. point straight line method measured at the midrange pressure. Figure 2. Output versus Pressure Differential Figure 3. Linearity Specification Comparison Figure 4. Unibody Package — Cross–Sectional

0 MAX POP

information regarding media compatibility in your application. Freescale Semiconductor, Inc.

/C0077/C0080/C0088/C0049/C0048 /C0077/C0080/C0088/C0086/C0049/C0048/C0071/C0067 /C0083/C0069/C0082/C0073/C0069/C0083 3–18 Motorola Sensor Device Datawww.motorola.com/semiconductors PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing silicone gel which isolates the die from the environment. The Motorola pres- sure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below: Part Number Case Type Pressure (P1) Side Identifier MPX10D 344 Stainless Steel Cap MPX10DP 344C Side with Part Marking MPX10GP 344B Side with Port Attached MPX10GS 344E Side with Port Attached MPXV10GC6U 482A Side with Part Marking MPXV10GC7U 482C Side with Part Marking ORDERING INFORMATION — UNIBODY PACKAGE MPX10 series pressure sensors are available in differential and gauge configurations. Devices are available in the basic element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose pressure connections. MPX Series Device Type Options Case Type Order Number Device Marking Basic Element Differential Case 344 MPX10D MPX10D Ported Elements Differential Case 344C MPX10DP MPX10DP Gauge Case 344B MPX10GP MPX10GP Gauge Case 344E MPX10GS MPX10D ORDERING INFORMATION — SMALL OUTLINE PACKAGE (MPXV10GC SERIES) Device Type/Order No Packing Options Case Type Device MarkingDevice Type/Order No . Packing Options Case Type Device Marking MPXV10GC6U Rails Case 482A MPXV10G MPXV10GC6T1 Tape and Reel Case 482A MPXV10G MPXV10GC7U Rails Case 482C MPXV10G Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0080/C0088/C0049/C0050 /C0083/C0069/C0082/C0073/C0069/C0083 3–20 Motorola Sensor Device Datawww.motorola.com/semiconductors MAXIMUM RATINGS (NOTE) Rating Symbol Value Unit Maximum Pressure (P1 > P2) Pmax 75 kPa Burst Pressure (P1 > P2) Pburst 100 kPa Storage Temperature Tstg –40 to +125 °C Operating Temperature TA –40 to +125 °C NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device. OPERATING CHARACTERISTICS (VS = 3.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Characteristic Symbol Min Typ Max Unit Differential Pressure Range(1) POP 0 — 10 kPa Supply Voltage(2) VS — 3.0 6.0 Vdc Supply Current Io — 6.0 — mAdc Full Scale Span(3) VFSS 45 55 70 mV Offset(4) Voff 0 20 35 mV Sensitivity ΔV/ΔP — 5.5 — mV/kPa Linearity(5) — –0.5 — 5.0 %V FSS Pressure Hysteresis(5) (0 to 10 kPa) — — ± 0.1 — %V FSS Temperature Hysteresis(5) (–40°C to +125°C) — — ± 0.5 — %V FSS Temperature Coefficient of Full Scale Span(5) TCV FSS –0.22 — –0.16 %V FSS /°C Temperature Coefficient of Offset(5) TCV off — ±15 — µV/°C Temperature Coefficient of Resistance(5) TCR 0.28 — 0.34 %Z in/°C Input Impedance Zin 400 — 550 Ω Output Impedance Zout 750 — 1250 Ω Response Time(6) (10% to 90%) tR — 1.0 — ms Warm–Up Time (7) — — 20 — ms Offset Stability(8) — — ± 0.5 — %V FSS NOTES: 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self–heating. 3. Full Scale Span (VFSS ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following:

Linearity: Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C.
TcSpan: Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C.
TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C.
TCR: Z in deviation with minimum rated pressure applied, over the temperature range of –40°C to +125°C, relative to 25°C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Warm–up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 8. Offset Stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

MPX12 series over temperature. an extensive temperature range. presented in Motorola Applications Note AN840. culations required are burdensome. Figure 4. Cross–Sectional Diagram (not to scale) garding media compatibility in your application. Freescale Semiconductor, Inc.

/C0077/C0080/C0088/C0049/C0050 /C0083/C0069/C0082/C0073/C0069/C0083 3–22 Motorola Sensor Device Datawww.motorola.com/semiconductors PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing silicone gel which isolates the die from the environment. The Motorola MPX pressure sensor is designed to operate with positive differen- tial pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below: Part Number Case Type Pressure (P1) Side Identifier MPX12D 344 Stainless Steel Cap MPX12DP 344C Side with Part Marking MPX12GP 344B Side with Port Attached MPX12 series pressure sensors are available in differential and gauge configurations. Devices are available in the basic element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose pressure connections. MPX Series Device Type Options Case Type Order Number Device Marking Basic Element Differential Case 344 MPX12D MPX12D Ported Elements Differential Case 344C MPX12DP MPX12DP Gauge Case 344B MPX12GP MPX12GP Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0080/C0088/C0050/C0048/C0049/C0048 /C0077/C0080/C0088/C0086/C0050/C0048/C0049/C0048/C0071 /C0083/C0069/C0082/C0073/C0069/C0083 3–24 Motorola Sensor Device Datawww.motorola.com/semiconductors MAXIMUM RATINGS (NOTE) Rating Symbol Value Unit Maximum Pressure (P1 > P2) Pmax 75 kPa Storage Temperature Tstg –40 to +125 °C Operating Temperature TA –40 to +125 °C NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device. OPERATING CHARACTERISTICS (VS = 10 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Characteristic Symbol Min Typ Max Unit Pressure Range(1) POP 0 — 10 kPa Supply Voltage(2) VS — 10 16 Vdc Supply Current Io — 6.0 — mAdc Full Scale Span(3) VFSS 24 25 26 mV Offset(4) Voff –1.0 — 1.0 mV Sensitivity ΔV/ΔP — 2.5 — mV/kPa Linearity(5) — –1.0 — 1.0 %V FSS Pressure Hysteresis(5) (0 to 10 kPa) — — ± 0.1 — %V FSS Temperature Hysteresis(5) (–40°C to +125°C) — — ± 0.5 — %V FSS Temperature Effect on Full Scale Span(5) TCV FSS –1.0 — 1.0 %V FSS Temperature Effect on Offset(5) TCV off –1.0 — 1.0 mV Input Impedance Zin 1000 — 2550 Ω Output Impedance Zout 1400 — 3000 Ω Response Time(6) (10% to 90%) tR — 1.0 — ms Warm–Up — — 20 — ms Offset Stability(7) — — ± 0.5 — %V FSS NOTES: 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self–heating. 3. Full Scale Span (VFSS ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following:

Linearity: Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C.
TcSpan: Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C.
TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

calculations required are burdensome. point straight line method measured at the midrange pressure. tial pressure applied, P1 > P2. Freescale Semiconductor, Inc.

/C0077/C0080/C0088/C0050/C0048/C0053/C0048 /C0083/C0069/C0082/C0073/C0069/C0083 3–28 Motorola Sensor Device Datawww.motorola.com/semiconductors MAXIMUM RATINGS (NOTE) Rating Symbol Value Unit Maximum Pressure (P1 > P2) Pmax 200 kPa Storage Temperature Tstg –40 to +125 °C Operating Temperature TA –40 to +125 °C NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device. OPERATING CHARACTERISTICS (VS = 10 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Characteristic Symbol Min Typ Max Unit Pressure Range(1) POP 0 — 50 kPa Supply Voltage(2) VS — 10 16 Vdc Supply Current Io — 6.0 — mAdc Full Scale Span(3) MPX2050 VFSS 38.5 40 41.5 mV Offset(4) MPX2050 Voff –1.0 — 1.0 mV Sensitivity ΔV/ΔP — 0.8 — mV/kPa Linearity(5) MPX2050 — –0.25 — 0.25 %V FSS Pressure Hysteresis(5) (0 to 50 kPa) — — ± 0.1 — %V FSS Temperature Hysteresis(5) (–40°C to +125°C) — — ± 0.5 — %V FSS Temperature Effect on Full Scale Span(5) TCV FSS –1.0 — 1.0 %V FSS Temperature Effect on Offset(5) TCV off –1.0 — 1.0 mV Input Impedance Zin 1000 — 2500 Ω Output Impedance Zout 1400 — 3000 Ω Response Time(6) (10% to 90%) tR — 1.0 — ms Warm–Up — — 20 — ms Offset Stability(7) — — ± 0.5 — %V FSS NOTES: 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self–heating. 3. Full Scale Span (VFSS ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following:

Linearity: Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C.
TcSpan: Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C.
TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0080/C0088/C0050/C0048/C0053/C0048 /C0083/C0069/C0082/C0073/C0069/C0083 3–30 Motorola Sensor Device Datawww.motorola.com/semiconductors PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing the silicone gel which isolates the die. The Motorola MPX pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below: Part Number Case Type Pressure (P1) Side Identifier MPX2050D 344 Stainless Steel Cap MPX2050DP 344C Side with Part Marking MPX2050GP 344B Side with Port Attached MPX2050GSX 344F Side with Port Attached MPX2050 series pressure sensors are available in differential and gauge configurations. Devices are available in the basic element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose pressure connections. MPX Series Device Type Options Case Type Order Number Device Marking Basic Element Differential 344 MPX2050D MPX2050D Ported Elements Differential, Dual Port 344C MPX2050DP MPX2050DP Gauge 344B MPX2050GP MPX2050GP Gauge Axial PC Mount 344F MPX2050GSX MPX2050D Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0080/C0088/C0050/C0048/C0053/C0051 /C0077/C0080/C0088/C0086/C0050/C0048/C0053/C0051/C0071 /C0083/C0069/C0082/C0073/C0069/C0083 3–32 Motorola Sensor Device Datawww.motorola.com/semiconductors MAXIMUM RATINGS (NOTE) Rating Symbol Value Unit Maximum Pressure (P1 > P2) Pmax 200 kPa Storage Temperature Tstg –40 to +125 °C Operating Temperature TA –40 to +125 °C NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device. OPERATING CHARACTERISTICS (VS = 10 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Characteristic Symbol Min Typ Max Unit Pressure Range(1) POP 0 — 50 kPa Supply Voltage(2) VS — 10 16 Vdc Supply Current Io — 6.0 — mAdc Full Scale Span(3) VFSS 38.5 40 41.5 mV Offset(4) Voff –1.0 — 1.0 mV Sensitivity ΔV/ΔP — 0.8 — mV/kPa Linearity(5) — –0.6 — 0.4 %V FSS Pressure Hysteresis(5) (0 to 50 kPa) — — ± 0.1 — %V FSS Temperature Hysteresis(5) (–40°C to +125°C) — — ± 0.5 — %V FSS Temperature Effect on Full Scale Span(5) TCV FSS –2.0 — 2.0 %V FSS Temperature Effect on Offset(5) TCV off –1.0 — 1.0 mV Input Impedance Zin 1000 — 2500 Ω Output Impedance Zout 1400 — 3000 Ω Response Time(6) (10% to 90%) tR — 1.0 — ms Warm–Up — — 20 — ms Offset Stability(7) — — ± 0.5 — %V FSS NOTES: 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self–heating. 3. Full Scale Span (VFSS ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following:

Linearity: Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C.
TcSpan: Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C.
TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0080/C0088/C0050/C0048/C0053/C0051 /C0077/C0080/C0088/C0086/C0050/C0048/C0053/C0051/C0071 /C0083/C0069/C0082/C0073/C0069/C0083 3–34 Motorola Sensor Device Datawww.motorola.com/semiconductors PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing the silicone gel which isolates the die. The Motorola MPX pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below: Part Number Case Type Pressure (P1) Side Identifier MPX2053D 344C Stainless Steel Cap MPX2053DP 344C Side with Part Marking MPX2053GP 344B Side with Port Attached MPX2053GSX 344F Side with Port Attached MPX2053GVP 344D Stainless Steel Cap MPXV2053GP 1369 Side with Port Attached MPXV2053DP 1351 Side with Part Marking ORDERING INFORMATION — UNIBODY PACKAGE (MPX2053 SERIES) MPX Series Device Type Options Case Type Order Number Device Marking Basic Element Differential 344 MPX2053D MPX2053D Ported Elements Differential, Dual Port 344C MPX2053DP MPX2053DP Gauge 344B MPX2053GP MPX2053GP Gauge, Axial PC Mount 344F MPX2053GSX MPX2053D Gauge, Vacuum 344D MPX2053GVP MPX2053GVP ORDERING INFORMATION — SMALL OUTLINE PACKAGE (MPXV2053G SERIES) Device Type Options Case No. MPX Series Order No. Packing Options Marking Ported Elements Gauge, Side Port, SMT 1369 MPXV2053GP Trays MPXV2053G Differential, Dual Port, SMT1351 MPXV2053DP Trays MPXV2053G Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0080/C0088/C0050/C0049/C0048/C0048 /C0083/C0069/C0082/C0073/C0069/C0083 3–36 Motorola Sensor Device Datawww.motorola.com/semiconductors MAXIMUM RATINGS (NOTE) Rating Symbol Value Unit Maximum Pressure (P1 > P2) Pmax 400 kPa Storage Temperature Tstg –40 to +125 °C Operating Temperature TA –40 to +125 °C NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device. OPERATING CHARACTERISTICS (VS = 10 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Characteristic Symbol Min Typ Max Unit Pressure Range(1) POP 0 — 100 kPa Supply Voltage(2) VS — 10 16 Vdc Supply Current Io — 6.0 — mAdc Full Scale Span(3) MPX2100A, MPX2100D VFSS 38.5 40 41.5 mV Offset(4) MPX2100D MPX2100A Series Voff –1.0 –2.0 1.0 2.0 mV Sensitivity ΔV/ΔP — 0.4 — mV/kPa Linearity(5) MPX2100D Series MPX2100A Series –0.25 –1.0 0.25 1.0 %V FSS Pressure Hysteresis(5) (0 to 100 kPa) — — ± 0.1 — %V FSS Temperature Hysteresis(5) (–40°C to +125°C) — — ± 0.5 — %V FSS Temperature Effect on Full Scale Span(5) TCV FSS –1.0 — 1.0 %V FSS Temperature Effect on Offset(5) TCV off –1.0 — 1.0 mV Input Impedance Zin 1000 — 2500 Ω Output Impedance Zout 1400 — 3000 Ω Response Time(6) (10% to 90%) tR — 1.0 — ms Warm–Up — — 20 — ms Offset Stability(7) — — ± 0.5 — %V FSS NOTES: 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self–heating. 3. Full Scale Span (VFSS ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following:

Linearity: Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C.
TcSpan: Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C.
TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0080/C0088/C0050/C0049/C0048/C0048 /C0083/C0069/C0082/C0073/C0069/C0083 3–38 Motorola Sensor Device Datawww.motorola.com/semiconductors PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing the silicone gel which isolates the die. The differential or gauge sensor is designed to operate with positive differential pressure applied, P1 > P2. The absolute sensor is designed for vacuum applied to P1 side. The Pressure (P1) side may be identified by using the table below: Part Number Case Type Pressure (P1) Side Identifier MPX2100A MPX2100D 344 Stainless Steel Cap MPX2100DP 344C Side with Part Marking MPX2100AP MPX2100GP 344B Side with Port Attached MPX2100ASX MPX2100GSX 344F Side with Port Attached MPX2100 series pressure sensors are available in absolute, differential and gauge configurations. Devices are available in the basic element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose pressure connections. MPX Series Device Type Options Case Type Order Number Device Marking Basic Element Absolute, Differential 344 MPX2100A MPX2100D MPX2100A MPX2100D Ported Elements Differential, Dual Port 344C MPX2100DP MPX2100DP MPX2100GP MPX2100AP MPX2100GP MPX2100GSX MPX2100A MPX2100D Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0080/C0088/C0050/C0049/C0048/C0050 /C0077/C0080/C0088/C0086/C0050/C0049/C0048/C0050/C0071 /C0083/C0069/C0082/C0073/C0069/C0083 3–40 Motorola Sensor Device Datawww.motorola.com/semiconductors MAXIMUM RATINGS (NOTE) Rating Symbol Value Unit Maximum Pressure (P1 > P2) Pmax 400 kPa Storage Temperature Tstg –40 to +125 °C Operating Temperature TA –40 to +125 °C NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device. OPERATING CHARACTERISTICS (VS = 10 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Characteristic Symbol Min Typ Max Unit Pressure Range(1) POP 0 — 100 kPa Supply Voltage(2) VS — 10 16 Vdc Supply Current Io — 6.0 — mAdc Full Scale Span(3) VFSS 38.5 40 41.5 mV Offset(4) MPX2102D Series MPX2102A Series Voff –1.0 –2.0 1.0 2.0 mV Sensitivity ΔV/ΔP — 0.4 — mV/kPa Linearity(5) MPX2102D Series MPX2102A Series –0.6 –1.0 0.4 1.0 %V FSS Pressure Hysteresis(5) (0 to 100 kPa) — — ± 0.1 — %V FSS Temperature Hysteresis(5) (–40°C to +125°C) — — ± 0.5 — %V FSS Temperature Effect on Full Scale Span(5) TCV FSS –2.0 — 2.0 %V FSS Temperature Effect on Offset(5) TCV off –1.0 — 1.0 mV Input Impedance Zin 1000 — 2500 Ω Output Impedance Zout 1400 — 3000 Ω Response Time(6) (10% to 90%) tR — 1.0 — ms Warm–Up — — 20 — ms Offset Stability(7) — — ± 0.5 — %V FSS NOTES: 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self–heating. 3. Full Scale Span (VFSS ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following:

Linearity: Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C.
TcSpan: Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C.
TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0080/C0088/C0050/C0049/C0048/C0050 /C0077/C0080/C0088/C0086/C0050/C0049/C0048/C0050/C0071 /C0083/C0069/C0082/C0073/C0069/C0083 3–42 Motorola Sensor Device Datawww.motorola.com/semiconductors PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing the silicone gel which isolates the die. The differential or gauge sensor is designed to operate with positive differential pressure applied, P1 > P2. The absolute sensor is designed for vacuum applied to P1 side. The Pressure (P1) side may be identified by using the table below: Part Number Case Type Pressure (P1) Side Identifier MPX2102A MPX2102D 344 Stainless Steel Cap MPX2102DP 344C Side with Part Marking MPX2102AP MPX2102GP 344B Side with Port Attached MPX2102GVP 344D Stainless Steel Cap MPX2102ASX MPX2102GSX 344F Side with Port Attached MPXV2102GP 1369 Side with Port Attached MPXV2102DP 1351 Side with Part Marking ORDERING INFORMATION — UNIBODY PACKAGE (MPX2102 SERIES) MPX Series Device Type Options Case Type Order Number Device Marking Basic Element Absolute, Differential 344 MPX2102A MPX2102D MPX2102A MPX2102D Ported Elements Differential, Dual Port 344C MPX2102DP MPX2102DP MPX2102GP MPX2102AP MPX2102GP MPX2102GSX MPX2102A MPX2102D Gauge, Vacuum 344D MPX2102GVP MPX2102GVP ORDERING INFORMATION — SMALL OUTLINE PACKAGE (MPXV2102G SERIES) Device Type Options Case No. MPX Series Order No. Packing Options Marking Ported Elements Gauge, Side Port, SMT 1369 MPXV2102GP Trays MPXV2102G Differential, Dual Port, SMT1351 MPXV2102DP Trays MPXV2102G Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0080/C0088/C0050/C0050/C0048/C0048 /C0083/C0069/C0082/C0073/C0069/C0083 3–44 Motorola Sensor Device Datawww.motorola.com/semiconductors MAXIMUM RATINGS (NOTE) Rating Symbol Value Unit Maximum Pressure (P1 > P2) Pmax 800 kPa Storage Temperature Tstg –40 to +125 °C Operating Temperature TA –40 to +125 °C NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device. OPERATING CHARACTERISTICS (VS = 10 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Characteristics Symbol Min Typ Max Unit Pressure Range(1) POP 0 — 200 kPa Supply Voltage VS — 10 16 Vdc Supply Current Io — 6.0 — mAdc Full Scale Span(3) VFSS 38.5 40 41.5 mV Offset(4) Voff –1.0 — 1.0 mV Sensitivity ΔV/ΔP — 0.2 — mV/kPa Linearity(5) MPX2200D Series MPX2200A Series — –0.25 –1.0 0.25 1.0 %V FSS Pressure Hysteresis(5) (0 to 200 kPa) — — ± 0.1 — %V FSS Temperature Hysteresis(5) (–40°C to +125°C) — — ± 0.5 — %V FSS Temperature Effect on Full Scale Span(5) TCV FSS –1.0 — 1.0 %V FSS Temperature Effect on Offset(5) TCV off –1.0 — 1.0 mV Input Impedance Zin 1300 — 2500 Ω Output Impedance Zout 1400 — 3000 Ω Response Time(6) (10% to 90%) tR — 1.0 — ms Warm–Up — — 20 — ms Offset Stability(7) — — ± 0.5 — %V FSS NOTES: 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self–heating. 3. Full Scale Span (VFSS ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following:

Linearity: Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C.
TcSpan: Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C.
TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0080/C0088/C0050/C0050/C0048/C0048 /C0083/C0069/C0082/C0073/C0069/C0083 3–46 Motorola Sensor Device Datawww.motorola.com/semiconductors PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing the silicone gel which isolates the die from the environment. The differential or gauge sensor is designed to operate with positive differen- tial pressure applied, P1 > P2. The absolute sensor is designed for vacuum applied to P1 side. The Pressure (P1) side may be identified by using the table below: Part Number Case Type Pressure (P1) Side Identifier MPX2200A MPX2200D 344 Stainless Steel Cap MPX2200DP 344C Side with Part Marking MPX2200AP MPX2200GP 344B Side with Port Attached MPX2200GVP 344D Stainless Steel Cap MPX2200 series pressure sensors are available in absolute, differential and gauge configurations. Devices are available in the basic element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose pressure connections. MPX Series Device Type Options Case Type Order Number Device Marking Basic Element Absolute, Differential 344 MPX2200A MPX2200D MPX2200A MPX2200D Ported Elements Differential 344C MPX2200DP MPX2200DP MPX2200GP MPX2200AP MPX2200GP Gauge, Vacuum 344D MPX2200GVP MPX2200GVP Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0080/C0088/C0050/C0050/C0048/C0050 /C0077/C0080/C0088/C0086/C0050/C0050/C0048/C0050/C0071 /C0083/C0069/C0082/C0073/C0069/C0083 3–48 Motorola Sensor Device Datawww.motorola.com/semiconductors MAXIMUM RATINGS (NOTE) Rating Symbol Value Unit Maximum Pressure (P1 > P2) Pmax 800 kPa Storage Temperature Tstg –40 to +125 °C Operating Temperature TA –40 to +125 °C NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device. OPERATING CHARACTERISTICS (VS = 10 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Characteristics Symbol Min Typ Max Unit Pressure Range(1) POP 0 — 200 kPa Supply Voltage VS — 10 16 Vdc Supply Current Io — 6.0 — mAdc Full Scale Span(3) VFSS 38.5 40 41.5 mV Offset(4) Voff –1.0 — 1.0 mV Sensitivity ΔV/ΔP — 0.2 — mV/kPa Linearity(5) MPX2202D Series MPX2202A Series — –0.6 –1.0 0.4 1.0 %V FSS Pressure Hysteresis(5) (0 to 200 kPa) — — ± 0.1 — %V FSS Temperature Hysteresis(5) (–40°C to +125°C) — — ± 0.5 — %V FSS Temperature Effect on Full Scale Span(5) TCV FSS –2.0 — 2.0 %V FSS Temperature Effect on Offset(5) TCV off –1.0 — 1.0 mV Input Impedance Zin 1000 — 2500 Ω Output Impedance Zout 1400 — 3000 Ω Response Time(6) (10% to 90%) tR — 1.0 — ms Warm–Up — — 20 — ms Offset Stability(7) — — ± 0.5 — %V FSS NOTES: 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self–heating. 3. Full Scale Span (VFSS ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following:

Linearity: Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C.
TcSpan: Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C.
TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0080/C0088/C0050/C0050/C0048/C0050 /C0077/C0080/C0088/C0086/C0050/C0050/C0048/C0050/C0071 /C0083/C0069/C0082/C0073/C0069/C0083 3–50 Motorola Sensor Device Datawww.motorola.com/semiconductors PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing the silicone gel which isolates the die from the environment. The differential or gauge sensor is designed to operate with positive differen- tial pressure applied, P1 > P2. The absolute sensor is designed for vacuum applied to P1 side. The Pressure (P1) side may be identified by using the table below: Part Number Case Type Pressure (P1) Side Identifier MPX2202A MPX2202D 344 Stainless Steel Cap MPX2202DP 344C Side with Part Marking MPX2202AP MPX2202GP 344B Side with Port Attached MPX2202GVP 344D Stainless Steel Cap MPX2202ASX MPX2202GSX 344F Side with Port Attached MPXV2202GP 1369 Side with Port Attached MPXV2202DP 1351 Side with Part Marking ORDERING INFORMATION — UNIBODY PACKAGE (MPX2202 SERIES) MPX Series Device Type Options Case Type Order Number Device Marking Basic Element Absolute, Differential 344 MPX2202A MPX2202D MPX2202A MPX2202D Ported Elements Differential, Dual Port 344C MPX2202DP MPX2202DP MPX2202GP MPX2202AP MPX2202GP MPX2202GSX MPX2202A MPX2202D Gauge, Vacuum 344D MPX2202GVP MPX2202GVP ORDERING INFORMATION — SMALL OUTLINE PACKAGE (MPXV2202G SERIES) Device Type Options Case No. MPX Series Order No. Packing Options Marking Ported Elements Gauge, Side Port, SMT 1369 MPXV2202GP Trays MPXV2202G Differential, Dual Port, SMT1351 MPXV2202DP Trays MPXV2202G Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

3–51Motorola Sensor Device Data www.motorola.com/semiconductors /C0072/C0105/C0103/C0104 /C0086/C0111/C0108/C0117/C0109/C0101 /C0080/C0114/C0101/C0115/C0115/C0117/C0114/C0101 /C0083/C0101/C0110/C0115/C0111/C0114 /C0070/C0111/C0114 /C0068/C0105/C0115/C0112/C0111/C0115/C0097/C0098/C0108/C0101 /C0065/C0112/C0112/C0108/C0105/C0099/C0097/C0116/C0105/C0111/C0110/C0115 Motorola has developed a low cost, high volume, miniature pressure sensor package which is ideal as a sub–module component or a disposable unit. The unique concept of the Chip Pak allows great flexibility in system design while allowing an economic solution for the designer. This new chip carrier package uses Motorola’s unique sensor die with its piezoresistive technology, along with the added feature of on–chip, thin–film temperature compensation and calibration. NOTE: Motorola is also offering the Chip Pak package in application–specific configurations, which will have an “SPX” prefix, followed by a four–digit number, unique to the specific customer.

Low Cost
Integrated Temperature Compensation and Calibration
Ratiometric to Supply Voltage
Polysulfone Case Material (Medical, Class V Approved)
Provided in Easy–to–Use Tape and Reel Application Examples
Medical Diagnostics
Infusion Pumps
Blood Pressure Monitors
Pressure Catheter Applications
Patient Monitoring NOTE: The die and wire bonds are exposed on the front side of the Chip Pak (pressure is applied to the backside of the device). Front side die and wire protection must be provided in the customer’s housing. Use caution when handling the devices during all processes. Motorola’s MPX2300DT1/MPX2301DT1 Pressure Sen- sors have been designed for medical usage by combining the performance of Motorola’s shear stress pressure sensor design and the use of biomedically approved materials. Materials with a proven history in medical situations have been chosen to provide a sensor that can be used with confidence in applications, such as invasive blood pressure monitoring. It can be sterilized using ethylene oxide. The portions of the pressure sensor that are required to be biomedically approved are the rigid housing and the gel coating. The rigid housing is molded from a white, medical grade polysulfone that has passed extensive biological testing including: tissue culture test, rabbit implant, hemolysis, intracutaneous test in rabbits, and system toxicity, USP. A silicone dielectric gel covers the silicon piezoresistive sensing element. The gel is a nontoxic, nonallergenic elasto- mer system which meets all USP XX Biological Testing Class V requirements. The properties of the gel allow it to transmit pressure uniformly to the diaphragm surface, while isolating the internal electrical connections from the corrosive effects of fluids, such as saline solution. The gel provides electrical isolation sufficient to withstand defibrillation testing, as speci- fied in the proposed Association for the Advancement of Medical Instrumentation (AAMI) Standard for blood pressure transducers. A biomedically approved opaque filler in the gel prevents bright operating room lights from affecting the per- formance of the sensor. The MPX2301DT1 is a reduced gel option. Preferred devices are Motorola recommended choices for future use and best overall value. /C0077/C0079/C0084/C0079/C0082/C0079/C0076/C0065 SEMICONDUCTOR TECHNICAL DATA /C0077/C0080/C0088/C0050/C0051/C0048/C0048/C0068/C0084/C0049 /C0077/C0080/C0088/C0050/C0051/C0048/C0049/C0068/C0084/C0049 PRESSURE SENSORS 0 to 300 mmHg (0 to 40 kPa) PIN NUMBER MPX2300/1DT1 CASE 423A VS Gnd Motorola Preferred Device CHIP PAK PACKAGE REV 5 Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0080/C0088/C0050/C0051/C0048/C0048/C0068/C0084/C0049 /C0077/C0080/C0088/C0050/C0051/C0048/C0049/C0068/C0084/C0049 3–52 Motorola Sensor Device Datawww.motorola.com/semiconductors MAXIMUM RATINGS (NOTE) Rating Symbol Value Unit Maximum Pressure (Backside) Pmax 125 PSI Storage Temperature Tstg –25 to +85 °C Operating Temperature TA +15 to +40 °C NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device. OPERATING CHARACTERISTICS (VS = 6 Vdc, TA = 25°C unless otherwise noted) Characteristics Symbol Min Typ Max Unit Pressure Range POP 0 — 300 mmHg Supply Voltage(7) VS — 6.0 10 Vdc Supply Current Io — 1.0 — mAdc Zero Pressure Offset Voff –0.75 — 0.75 mV Sensitivity — 4.95 5.0 5.05 µV/V/mmHg Full Scale Span(1) VFSS 2.976 3.006 3.036 mV Linearity + Hysteresis(2) — – 1.5 — 1.5 %V FSS Accuracy(9) VS = 6 V, P = 101 to 200 mmHg — – 1.5 — 1.5 % Accuracy(9) VS = 6 V, P = 201 to 300 mmHg — – 3.0 — 3.0 % Temperature Effect on Sensitivity TCS –0.1 — +0.1 %/°C Temperature Effect on Full Scale Span(3) TCV FSS –0.1 — +0.1 %/°C Temperature Effect on Offset(4) TCV off –9.0 — +9.0 µV/°C Input Impedance Zin 1800 — 4500 Ω Output Impedance Zout 270 — 330 Ω R CAL (150 kΩ )(8) R CAL 97 100 103 mmHg Response Time(5) (10% to 90%) tR — 1.0 — ms Temperature Error Band — 0 — 85 °C Stability(6) — — ± 0.5 — %V FSS NOTES: 1. Measured at 6.0 Vdc excitation for 100 mmHg pressure differential. VFSS and FSS are like terms representing the algebraic difference between full scale output and zero pressure offset. 2. Maximum deviation from end–point straight line fit at 0 and 200 mmHg. 3. Slope of end–point straight line fit to full scale span at 15°C and +40°C relative to +25°C. 4. Slope of end–point straight line fit to zero pressure offset at 15°C and +40°C relative to +25°C. 5. For a 0 to 300 mmHg pressure step change. 6. Stability is defined as the maximum difference in output at any pressure within POP and temperature within +10°C to +85°C after: a. 1000 temperature cycles, –40°C to +125°C. b. 1.5 million pressure cycles, 0 to 300 mmHg. 7. Recommended voltage supply: 6 V ± 0.2 V, regulated. Sensor output is ratiometric to the voltage supply. Supply voltages above +10 V may induce additional error due to device self–heating. 8. Offset measurement with respect to the measured sensitivity when a 150k ohm resistor is connected to VS and S+ output. 9. Accuracy is calculated using the following equation: Errorp = {[Vp – Offset)/(SensNom *VEX )]–P}/P Where: V p = Actual output voltage at pressure P in microvolts (µV) Offset = Voltage output at P = 0mmHg in microvolts (µV) SensNom = Nominal sensitivity = 5.01 µV/V/mmHg VEX = Excitation voltage P = Pressure applied to the device Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0080/C0088/C0050/C0051/C0048/C0048/C0068/C0084/C0049 /C0077/C0080/C0088/C0050/C0051/C0048/C0049/C0068/C0084/C0049 3–53Motorola Sensor Device Data www.motorola.com/semiconductors The MPX2300DT1/MPX2301DT1 silicon pressure sensors are available in tape and reel packaging. Device Type/Order No. Case No. Device Description Marking MPX2300DT1 423A Chip Pak, Full Gel Date Code, Lot ID MPX2301DT1 423A Chip Pak, 1/3 Gel Date Code, Lot ID Packaging Information Reel Size Tape Width Quantity Tape and Reel 330 mm 24 mm 1000 pc/reel Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0080/C0088/C0052/C0048/C0056/C0048/C0068 3–55Motorola Sensor Device Data www.motorola.com/semiconductors MAXIMUM RATINGS (NOTE) Parametrics Symbol Value Unit Maximum Pressure (P1 > P2) (P2 > P1) Pmax 400 400 kPa Storage Temperature Tstg –40° to +125° °C NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device. OPERATING CHARACTERISTICS (VS = 5.1 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 4 required to meet electrical specifications.) Characteristic Symbol Min Typ Max Unit Pressure Range(1) POP 0 — 80 kPa Supply Voltage(2) VS 4.85 5.1 5.35 Vdc Supply Current Io — 7.0 10 mAdc Minimum Pressure Offset(3) (0 to 85°C) @ V S = 5.1 Volts Voff 0.478 0.575 0.672 Vdc Full Scale Output(4) (0 to 85°C) @ V S = 5.1 Volts VFSO 4.772 4.900 5.020 Vdc Full Scale Span(5) (0 to 85°C) @ V S = 5.1 Volts VFSS — 4.325 — Vdc Accuracy(6) — — — /C00343.0 %V FSS Sensitivity V/P — 54 — mV/kPa NOTES: 1. 1.0kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Full Scale Output (VFSO ) is defined as the output voltage at the maximum or full rated pressure. 5. Full Scale Span (VFSS ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 6. Accuracy (error budget) consists of the following:

Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25°C.
TcSpan: Output deviation over the temperature range of 0 ° to 85°C, relative to 25°C.
TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative to 25°C.
Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS at 25°C. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0080/C0088/C0052/C0048/C0056/C0048/C0068 3–57Motorola Sensor Device Data www.motorola.com/semiconductors Nominal Transfer Value:Vout = VS (P x 0.01059 + 0.11280) +/– (Pressure Error x Temp. Mult. x 0.01059 x VS) VS = 5.1 V ±0.25V P kPa Transfer Function (MPX4080D) Temperature Error Multiplier Break Points Temp Multiplier Temperature in °C 4.0 3.0 2.0 0.0 1.0 –40 –20 0 20 40 60 13012010080 MPX4080D Pressure Error Band Pressure in kPa 3.0 2.0 1.0 –1.0 –2.0 –3.0 0.0 0 20 40 60 80 100 120 Pressure Error (max) 0 to 6 kPa ± 1.8 kPa 0 to 60 kPa ± 1.5 kPa 60 to 80 kPa ± 2.3 kPa – 40 3 0 to 85 1 +105 2 NOTE: The Temperature Multiplier is a linear response from 0° to –40°C and from 85° to 105°C. 140 Error (kPa) Error Limits for Pressure MPX4080D Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0080/C0088/C0052/C0048/C0056/C0048/C0068 3–58 Motorola Sensor Device Datawww.motorola.com/semiconductors PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluoro silicone gel which protects the die from harsh media. The Motorola pres- sure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side is identified by the stainless steel cap. ORDERING INFORMATION: The MPX4080D is available only in the unibody package. Device Order No Device Type Case No Device MarkingDevice Order No . Device Type Case No . Device Marking MPX4080D Differential 867 MPX4080D Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

3–59Motorola Sensor Device Data www.motorola.com/semiconductors /C0073/C0110/C0116/C0101/C0103/C0114/C0097/C0116/C0101/C0100 /C0083/C0105/C0108/C0105/C0099/C0111/C0110 /C0080/C0114/C0101/C0115/C0115/C0117/C0114/C0101 /C0083/C0101/C0110/C0115/C0111/C0114 /C0077/C0097/C0110/C0105/C0102/C0111/C0108/C0100 /C0065/C0098/C0115/C0111/C0108/C0117/C0116/C0101 /C0080/C0114/C0101/C0115/C0115/C0117/C0114/C0101 /C0083/C0101/C0110/C0115/C0111/C0114 /C0079/C0110/C0045/C0067/C0104/C0105/C0112/C0083/C0105/C0103/C0110/C0097/C0108 /C0067/C0111/C0110/C0100/C0105/C0116/C0105/C0111/C0110/C0101/C0100/C0044 /C0084/C0101/C0109/C0112/C0101/C0114/C0097/C0116/C0117/C0114/C0101 /C0067/C0111/C0109/C0112/C0101/C0110/C0115/C0097/C0116/C0101/C0100 /C0097/C0110/C0100 /C0067/C0097/C0108/C0105/C0098/C0114/C0097/C0116/C0101/C0100 The Motorola MPX4100 series Manifold Absolute Pressure (MAP) sensor for engine control is designed to sense absolute air pressure within the intake manifold. This measurement can be used to compute the amount of fuel required for each cylinder. The small form factor and high reliability of on–chip integration makes the Motorola MAP sensor a logical and economical choice for automotive system designers.

1.8% Maximum Error Over 0° to 85°C
Specifically Designed for Intake Manifold Absolute Pressure Sensing in Engine Control Systems
Ideally Suited for Microprocessor Interfacing
Temperature Compensated Over –40°C to +125°C
Durable Epoxy Unibody Element
Ideal for Non–Automotive Applications Application Examples
Manifold Sensing for Automotive Systems

Figure 1. Fully Integrated Pressure Sensor Schematic

1 Vout

signal that is proportional to applied pressure. integrated on a pressure sensor chip. is noted by the notch in the Lead. Freescale Semiconductor, Inc.

/C0077/C0080/C0088/C0052/C0049/C0048/C0048 /C0083/C0069/C0082/C0073/C0069/C0083 3–60 Motorola Sensor Device Datawww.motorola.com/semiconductors MAXIMUM RATINGS (1) Parametric Symbol Value Unit Overpressure(2) (P1 > P2) Pmax 400 kPa Burst Pressure(2) (P1 > P2) Pburst 1000 kPa Storage Temperature Tstg –40 to +125 °C Operating Temperature TA –40 to +125 °C 1. TC = 25°C unless otherwise noted. 2. Exposure beyond the specified limits may cause permanent damage or degradation to the device. OPERATING CHARACTERISTICS (VS = 5.1 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Characteristic Symbol Min Typ Max Unit Pressure Range(1) POP 20 — 105 kPa Supply Voltage(1) VS 4.85 5.1 5.35 Vdc Supply Current Io — 7.0 10 mAdc Minimum Pressure Offset(3) (0 to 85°C) @ V S = 5.1 Volts Voff 0.225 0.306 0.388 Vdc Full Scale Output(4) (0 to 85°C) @ V S = 5.1 Volts VFSO 4.815 4.897 4.978 Vdc Full Scale Span(5) (0 to 85°C) @ V S = 5.1 Volts VFSS — 4.59 — Vdc Accuracy(6) (0 to 85°C) — — — ±1.8 %V FSS Sensitivity V/P — 54 — mV/kPa Response Time(7) tR — 1.0 — ms Output Source Current at Full Scale Output Io+ — 0.1 — mAdc Warm–Up Time (8) — — 20 — ms Offset Stability(9) — — ± 0.5 — %V FSS Decoupling circuit shown in Figure 3 required to meet electrical specifications. MECHANICAL CHARACTERISTICS Characteristic Symbol Min Typ Max Unit Weight, Basic Element (Case 867) — — 4.0 — Grams Common Mode Line Pressure(10) — — — 690 kPa NOTES: 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Full Scale Output (VFSO ) is defined as the output voltage at the maximum or full rated pressure. 5. Full Scale Span (VFSS ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 6. Accuracy (error budget) consists of the following:

Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C.
TcSpan: Output deviation over the temperature range of 0 to 85 °C, relative to 25°C.
TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C.
Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS , at 25°C. 7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 8. Warm–up is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. 9. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. 10. Common mode pressures beyond specified may result in leakage at the case–to–lead interface. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0080/C0088/C0052/C0049/C0048/C0048 /C0083/C0069/C0082/C0073/C0069/C0083 3–62 Motorola Sensor Device Datawww.motorola.com/semiconductors Transfer Function (MPX4100A) Nominal Transfer Value:Vout = VS (P x 0.01059 – 0.1518) +/– (Pressure Error x Temp. Factor x 0.01059 x VS) VS = 5.1 V ± 0.25 Vdc Temperature Error Band MPX4100A Series Temp Multiplier – 40 3 0 to 85 1 +125 3 Temperature in C° 4.0 3.0 2.0 0.0 1.0 –40 –20 0 20 40 60 14012010080 Temperature Error Factor Pressure Error Band Error Limits for Pressure3.0 2.0 1.0 –1.0 – 2.0 – 3.0 0.0 20 40 60 80 100 120 Pressure (in kPa) Pressure Error (kPa) Pressure Error (Max) 20 to 105 (kPa) ± 1.5 (kPa) Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0080/C0088/C0052/C0049/C0048/C0048 /C0083/C0069/C0082/C0073/C0069/C0083 3–63Motorola Sensor Device Data www.motorola.com/semiconductors PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluorosilicone gel which protects the die from harsh media. The Motorola MPX pressure sensor is designed to operate with positive differen- tial pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below: Part Number Case Type Pressure (P1) Side Identifier MPX4100A 867–08 Stainless Steel Cap MPX4100AP 867B–04 Side with Port Marking MPX4100AS 867E–03 Side with Port Attached MPX4100ASX 867F–03 Side with Port Attached The MPX4100A series MAP silicon pressure sensors are available in the Basic Element, or with pressure port fittings that provide mounting ease and barbed hose connections. MPX Series Device Type Options Case Type Order Number Device Marking Basic Element Absolute, Element Only 867–08 MPX4100A MPX4100A Ported Elements Absolute, Ported 867B–04 MPX4100AP MPX4100AP Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0080/C0088/C0052/C0049/C0048/C0048/C0065 /C0077/C0080/C0088/C0065/C0052/C0049/C0048/C0048/C0065 /C0083/C0069/C0082/C0073/C0069/C0083 3–65Motorola Sensor Device Data www.motorola.com/semiconductors MAXIMUM RATINGS (NOTE) Parametrics Symbol Value Units Maximum Pressure (P1 /C0117 P2) Pmax 400 kPa Storage Temperature Tstg –40° to +125° °C Operating Temperature TA –40° to +125° °C NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device. OPERATING CHARACTERISTICS (VS = 5.1 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 3 required to meet electrical specifications.) Characteristic Symbol Min Typ Max Unit Pressure Range(1) POP 20 — 105 kPa Supply Voltage(2) VS 4.85 5.1 5.35 Vdc Supply Current Io — 7.0 10 mAdc Minimum Pressure Offset(3) (0 to 85°C) @ V S = 5.1 Volts Voff 0.225 0.306 0.388 Vdc Full Scale Output(4) (0 to 85°C) @ V S = 5.1 Volts VFSO 4.870 4.951 5.032 Vdc Full Scale Span(5) (0 to 85°C) @ V S = 5.1 Volts VFSS — 4.59 — Vdc Accuracy(6) (0 to 85°C) — — — ±1.8 %V FSS Sensitivity V/P — 54 — mV/kPa Response Time(7) tR — 1.0 — ms Output Source Current at Full Scale Output Io+ — 0.1 — mAdc Warm–Up Time (8) — — 20 — ms Offset Stability(9) — — ± 0.5 — %V FSS NOTES: 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Full Scale Output (VFSO ) is defined as the output voltage at the maximum or full rated pressure. 5. Full Scale Span (VFSS ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 6. Accuracy (error budget) consists of the following:

Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C.
TcSpan: Output deviation over the temperature range of 0 to 85 °C, relative to 25°C.
TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C.
Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS , at 25°C. 7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 8. Warm–up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. 9. Offset Stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MECHANICAL CHARACTERISTICS Characteristics Typ Unit Weight, Basic Element (Case 867) 4.0 grams Weight, Small Outline Package (Case 482) 1.5 grams Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0080/C0088/C0052/C0049/C0048/C0048/C0065 /C0077/C0080/C0088/C0065/C0052/C0049/C0048/C0048/C0065 /C0083/C0069/C0082/C0073/C0069/C0083 3–67Motorola Sensor Device Data www.motorola.com/semiconductors Transfer Function (MPX4100A, MPXA4100A) Nominal Transfer Value:Vout = VS (P x 0.01059 – 0.1518) +/– (Pressure Error x Temp. Factor x 0.01059 x VS) VS = 5.1 V ± 0.25 Vdc Temperature Error Band MPX4100A, MPXA4100A Series Temp Multiplier – 40 3 0 to 85 1 +125 3 Temperature in C° 4.0 3.0 2.0 0.0 1.0 –40 –20 0 20 40 60 14012010080 Temperature Error Factor NOTE: The Temperature Multiplier is a linear response from 0°C to –40°C and from 85°C to 125°C. Pressure Error Band Error Limits for Pressure3.0 2.0 1.0 –1.0 – 2.0 – 3.0 0.0 20 40 60 80 100 120 Pressure (in kPa) Pressure Error (kPa) Pressure Error (Max) 20 to 105 (kPa) ± 1.5 (kPa) Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0080/C0088/C0052/C0049/C0048/C0048/C0065 /C0077/C0080/C0088/C0065/C0052/C0049/C0048/C0048/C0065 /C0083/C0069/C0082/C0073/C0069/C0083 3–68 Motorola Sensor Device Datawww.motorola.com/semiconductors PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluorosilicone gel which protects the die from harsh media. The Motorola MPX pressure sensor is designed to operate with positive differen- tial pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below: Part Number Case Type Pressure (P1) Side Identifier MPX4100A 867 Stainless Steel Cap MPX4100AP 867B Side with Port Marking MPX4100AS 867E Side with Port Attached MPXA4100A6U/T1 482 Stainless Steel Cap MPXA4100AC6U 482A Side with Port Attached ORDERING INFORMATION — UNIBODY PACKAGE MPX Series Device Type Options Case Type Order Number Device Marking Basic Element Absolute, Element Only 867 MPX4100A MPX4100A Ported Elements Absolute, Ported 867B MPX4100AP MPX4100AP ORDERING INFORMATION — SMALL OUTLINE PACKAGE Device Type Options Case No. MPX Series Order No. Packing Options Marking Basic Element Absolute, Element Only 482 MPXA4100A6U Rails MPXA4100A Ported Element Absolute, Axial Port 482A MPXA4100AC6U Rails MPXA4100A Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

0.060 TYP 8X

0.100 TYP 8X

Figure 5. SOP Footprint (Case 482) Freescale Semiconductor, Inc.

/C0077/C0080/C0088/C0052/C0049/C0048/C0049/C0065 /C0077/C0080/C0088/C0065/C0052/C0049/C0048/C0049/C0065 /C0077/C0080/C0088/C0072/C0054/C0049/C0048/C0049/C0065 /C0083/C0069/C0082/C0073/C0069/C0083 3–71Motorola Sensor Device Data www.motorola.com/semiconductors MAXIMUM RATINGS (NOTE) Parametric Symbol Value Unit Maximum Pressure (P1 > P2) Pmax 400 kPa Storage Temperature Tstg –40 to +125 °C Operating Temperature TA –40 to +125 °C NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device. OPERATING CHARACTERISTICS (VS = 5.1 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 3 required to meet electrical specifications.) Characteristic Symbol Min Typ Max Unit Pressure Range(1) POP 15 — 102 kPa Supply Voltage(2) VS 4.85 5.1 5.35 Vdc Supply Current Io — 7.0 10 mAdc Minimum Pressure Offset(3) (0 to 85°C) @ V S = 5.1 Volts Voff 0.171 0.252 0.333 Vdc Full Scale Output(4) (0 to 85°C) @ V S = 5.1 Volts VFSO 4.870 4.951 5.032 Vdc Full Scale Span(5) (0 to 85°C) @ V S = 5.1 Volts VFSS — 4.7 — Vdc Accuracy(6) (0 to 85°C) — — — ±1.72 %V FSS Sensitivity V/P — 54 — mV/kPa Response Time(7) tR — 15 — ms Output Source Current at Full Scale Output Io+ — 0.1 — mAdc Warm–Up Time (8) — — 20 — ms Offset Stability(9) — — ± 0.5 — %V FSS NOTES: 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Full Scale Output (VFSO ) is defined as the output voltage at the maximum or full rated pressure. 5. Full Scale Span (VFSS ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 6. Accuracy (error budget) consists of the following:

Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C.
TcSpan: Output deviation over the temperature range of 0 to 85 °C, relative to 25°C.
TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C.
Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS , at 25°C. 7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 8. Warm–up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. 9. Offset Stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

Figure 2. Cross Sectional Diagram SSOP Figure 2 illustrates an absolute sensing chip in the super small outline package (Case 1317). Figure 3. Recommended power supply decoupling Figure 4. Output versus Absolute Pressure

51 K47 pF

ling of the power supply is recommended. Freescale Semiconductor, Inc.

provide mounting ease and barbed hose connections. Figure 6. SSOP Footprint (Case 1317)

0.027 TYP 8X

0.053 TYP 8X

Freescale Semiconductor, Inc.

/C0077/C0080/C0088/C0052/C0049/C0048/C0053/C0065 /C0083/C0069/C0082/C0073/C0069/C0083 3–76 Motorola Sensor Device Datawww.motorola.com/semiconductors MAXIMUM RATINGS (NOTE) Parametrics Symbol Value Units Maximum Pressure (P1 /C0117 P2) Pmax 400 kPa Storage Temperature Tstg –40° to +125° °C Operating Temperature TA –40° to +125° °C NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device. OPERATING CHARACTERISTICS (VS = 5.1 Vdc, TA = 25°C unless otherwise noted. Decoupling circuit shown in Figure 3 required to meet specification.) Characteristic Symbol Min Typ Max Unit Pressure Range POP 15 — 105 kPa Supply Voltage(1) VS 4.85 5.1 5.35 Vdc Supply Current Io — 7.0 10 mAdc Minimum Pressure Offset(2) (0 to 85°C) Voff 0.184 0.306 0.428 Vdc Full Scale Output(3) (0 to 85°C) VFSO 4.804 4.896 4.988 Vdc Full Scale Span(4) (0 to 85°C) VFSS — 4.590 — Vdc Accuracy(5) (0 to 85°C) — — — ±1.8 %V FSS Sensitivity ΔV/ΔP — 51 — mV/kPa Response Time(6) tR — 1.0 — ms Output Source Current at Full Scale Output Io+ — 0.1 — mAdc Warm–up Time(7) — — 15 — ms Offset Stability(8) — — ± 0.65 — %V FSS NOTES: 1. Device is ratiometric within this specified excitation range. 2. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 3. Full Scale Output (VFSO ) is defined as the output voltage at the maximum or full rated pressure. 4. Full Scale Span (VFSS ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 5. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span at 25°C due to all sources of error including the following:

Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with minimum specified pressure applied.
Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25°C.
TcSpan: Span deviation per °C over the temperature range of 0° to 85°C, as a percent of span at 25°C.
TcOffset: Output deviation per °C with minimum pressure applied, over the temperature range of 0° to 85°C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Warm–up Time is defined as the time required for the product to meet the specified output voltage. 8. Offset Stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MECHANICAL CHARACTERISTICS Characteristics Typ Unit Weight, Basic Element (Case 867) 4.0 grams Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0080/C0088/C0052/C0049/C0048/C0053/C0065 /C0083/C0069/C0082/C0073/C0069/C0083 3–78 Motorola Sensor Device Datawww.motorola.com/semiconductors Transfer Function (MPX4105A) Nominal Transfer Value:Vout = VS (P x 0.01 – 0.09) +/– (Pressure Error x Temp. Factor x 0.01 x VS) VS = 5.1 V ± 0.25 Vdc Temperature Error Band MPX4105A Series Break Points Temp Multiplier – 40 3.0 – 20 1.5 0 to 85 1.0 125 2.5 Temperature in C° 4.0 3.0 2.0 0.0 1.0 –40 –20 0 20 40 60 14012010080 Temperature Error Factor NOTE: The Temperature Multiplier is a linear response from –40°C to –20°C, –20°C to 0°C, and from 85°C to 125°C Pressure Error Band Error Limits for Pressure3.0 2.0 1.0 –1.0 – 2.0 – 3.0 0.0 20 40 60 80 100 120 Pressure (in kPa) Pressure Error (kPa) Pressure Error (Max) 40 to 94 (kPa) ± 1.5 (kPa) 15 (kPa) ± 2.4 (kPa) 105 (kPa) ± 1.8 (kPa) ORDERING INFORMATION — UNIBODY PACKAGE Device Type Options Case No MPX Series Order No MarkingDevice Type Options Case No . MPX Series Order No . Marking Basic Element Absolute Element 867 MPX4105A MPX4105ABasic Element Absolute, Element 867 MPX4105A MPX4105A Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0080/C0088/C0052/C0049/C0049/C0053/C0065 /C0077/C0080/C0088/C0065/C0052/C0049/C0049/C0053/C0065 /C0083/C0069/C0082/C0073/C0069/C0083 3–80 Motorola Sensor Device Datawww.motorola.com/semiconductors MAXIMUM RATINGS (NOTE) Parametrics Symbol Value Units Maximum Pressure (P1 /C0117 P2) Pmax 400 kPa Storage Temperature Tstg –40° to +125° °C Operating Temperature TA –40° to +125° °C NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device. OPERATING CHARACTERISTICS (VS = 5.1 Vdc, TA = 25°C unless otherwise noted, P1 /C0117 P2. Decoupling circuit shown in Figure 3 required to meet Electrical Specifications.) Characteristic Symbol Min Typ Max Unit Pressure Range POP 15 — 115 kPa Supply Voltage(1) VS 4.85 5.1 5.35 Vdc Supply Current Io — 7.0 10 mAdc Minimum Pressure Offset(2) (0 to 85°C) @ V S = 5.1 Volts Voff 0.135 0.204 0.273 Vdc Full Scale Output(3) (0 to 85°C) @ V S = 5.1 Volts VFSO 4.725 4.794 4.863 Vdc Full Scale Span(4) (0 to 85°C) @ V S = 5.1 Volts VFSS 4.521 4.590 4.659 Vdc Accuracy(5) (0 to 85°C) — — — ±1.5 %V FSS Sensitivity V/P — 45.9 — mV/kPa Response Time(6) tR — 1.0 — ms Output Source Current at Full Scale Output Io+ — 0.1 — mAdc Warm–Up Time (7) — — 20 — ms Offset Stability(8) — — ± 0.5 — %V FSS NOTES: 1. Device is ratiometric within this specified excitation range. 2. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 3. Full Scale Output (VFSO ) is defined as the output voltage at the maximum or full rated pressure. 4. Full Scale Span (VFSS ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 5. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span at 25°C due to all sources of error including the following:

Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25°C.
TcSpan: Output deviation over the temperature range of 0 ° to 85°C, relative to 25°C.
TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative to 25°C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Warm–up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 8. Offset Stability is the product’s output deviation when subjected to 1000 cycles of Pulsed Pressure, Temperature Cycling with Bias Test. MECHANICAL CHARACTERISTICS Characteristics Typ Unit Weight, Basic Element (Case 867) 4.0 grams Weight, Small Outline Package (Case 482) 1.5 grams Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0080/C0088/C0052/C0049/C0049/C0053/C0065 /C0077/C0080/C0088/C0065/C0052/C0049/C0049/C0053/C0065 /C0083/C0069/C0082/C0073/C0069/C0083 3–82 Motorola Sensor Device Datawww.motorola.com/semiconductors Transfer Function (MPX4115A, MPXA4115A) Nominal Transfer Value:Vout = VS x (0.009 x P – 0.095) ± (Pressure Error x Temp. Factor x 0.009 x VS) VS = 5.1 ± 0.25 Vdc Temperature Error Band MPX4115A, MPXA4115A Series Break Points Temp Multiplier – 40 3 0 to 85 1 125 3 Temperature in C° 4.0 3.0 2.0 0.0 1.0 –40 –20 0 20 40 60 14012010080 Temperature Error Factor NOTE: The Temperature Multiplier is a linear response from 0°C to –40°C and from 85°C to 125°C Pressure Error Band Error Limits for Pressure3.0 2.0 1.0 –1.0 – 2.0 – 3.0 0.0

20 Pressure (in kPa)

Pressure Error (kPa) Pressure Error (Max) 15 to 115 (kPa) ± 1.5 (kPa) 40 60 80 100 120 ORDERING INFORMATION — UNIBODY PACKAGE Device Type Options Case No. MPX Series Order No. Marking Basic Element Absolute, Element Only 867 MPX4115A MPX4115A Ported Elements Absolute, Ported 867B MPX4115AP MPX4115AP ORDERING INFORMATION — SMALL OUTLINE PACKAGE Device Type Options Case No. MPX Series Order No. Packing Options Marking Basic Element Absolute, Element Only 482 MPXA4115A6U Rails MPXA4115A Ported Element Absolute, Axial Port 482A MPXA4115AC6U Rails MPXA4115A Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

Freescale Semiconductor, Inc.

3–84 Motorola Sensor Device Datawww.motorola.com/semiconductors /C0073/C0110/C0116/C0101/C0103/C0114/C0097/C0116/C0101/C0100 /C0083/C0105/C0108/C0105/C0099/C0111/C0110 /C0080/C0114/C0101/C0115/C0115/C0117/C0114/C0101 /C0083/C0101/C0110/C0115/C0111/C0114 /C0102/C0111/C0114 /C0077/C0097/C0110/C0105/C0102/C0111/C0108/C0100 /C0065/C0098/C0115/C0111/C0108/C0117/C0116/C0101 /C0080/C0114/C0101/C0115/C0115/C0117/C0114/C0101 /C0065/C0112/C0112/C0108/C0105/C0099/C0097/C0116/C0105/C0111/C0110/C0115 /C0079/C0110/C0045/C0067/C0104/C0105/C0112/C0083/C0105/C0103/C0110/C0097/C0108 /C0067/C0111/C0110/C0100/C0105/C0116/C0105/C0111/C0110/C0101/C0100/C0044 /C0084/C0101/C0109/C0112/C0101/C0114/C0097/C0116/C0117/C0114/C0101 /C0067/C0111/C0109/C0112/C0101/C0110/C0115/C0097/C0116/C0101/C0100 /C0097/C0110/C0100 /C0067/C0097/C0108/C0105/C0098/C0114/C0097/C0116/C0101/C0100 The Motorola MPX4200A series Manifold Absolute Pressure (MAP) sensor for turbo boost engine control is designed to sense absolute air pressure within the intake manifold. This measurement can be used to compute the amount of fuel required for each cylinder. The MPX4200A series sensor integrates on–chip, bipolar op amp circuitry and thin film resistor networks to provide a high level analog output signal and temperature compensation. The small form factor and reliability of on–chip integration make the Motorola MAP sensor a logical and economical choice for automotive system designers.

Specifically Designed for Intake Manifold Absolute Pressure Sensing in Engine Control Systems
Patented Silicon Shear Stress Strain Gauge
Temperature Compensated Over –40° to +125°C
Offers Reduction in Weight and Volume Compared to Existing Hybrid Modules
Durable Epoxy Unibody Element Application Examples
Manifold Sensing for Automotive Systems
Ideally suited for Microprocessor or Microcontroller–Based Systems
Also ideal for Non–Automotive Applications PINS 4, 5 AND 6 ARE NO CONNECTS

is noted by the notch in the lead. Freescale Semiconductor, Inc.

/C0077/C0080/C0088/C0052/C0050/C0048/C0048/C0065 /C0083/C0069/C0082/C0073/C0069/C0083 3–85Motorola Sensor Device Data www.motorola.com/semiconductors MAXIMUM RATINGS (NOTE) Parametrics Symbol Value Unit Maximum Pressure (P1 > P2) Pmax 800 kPa Storage Temperature Tstg –40 to +125 °C Operating Temperature TA –40 to +125 °C NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device. OPERATING CHARACTERISTICS (VS = 5.1 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 3 required to meet electrical specifications.) Characteristic Symbol Min Typ Max Unit Pressure Range(1) POP 20 — 200 kPa Supply Voltage(2) VS 4.85 5.1 5.35 Vdc Supply Current Io — 7.0 10 mAdc Minimum Pressure Offset(3) (0 to 85°C) @ V S = 5.1 Volts Voff 0.199 0.306 0.413 Vdc Full Scale Output(4) (0 to 85°C) @ V S = 5.1 Volts VFSO 4.725 4.896 4.978 Vdc Full Scale Span(5) (0 to 85°C) @ V S = 5.1 Volts VFSS — 4.590 — Vdc Accuracy(6) (0 to 85°C) — — — ±1.5 %V FSS Sensitivity V/P — 25.5 — mV/kPa Response Time(7) tR — 1.0 — ms Output Source Current at Full Scale Output lo+ — 0.1 — mAdc Warm–Up Time (8) — — 20 — ms Offset Stability(9) — — ± 0.5 — %V FSS NOTES: 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Full Scale Output (VFSO ) is defined as the output voltage at the maximum or full rated pressure. 5. Full Scale Span (VFSS ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 6. Accuracy (error budget) consists of the following:

Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C.
TcSpan: Output deviation over the temperature range of 0 ° to 85°C, relative to 25°C.
TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0° to 85°C, relative to 25°C.
Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS at 25°C. 7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 8. Warm–up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. 9. Offset Stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MECHANICAL CHARACTERISTICS Characteristics Typ Unit Weight, Basic Element (Case 867) 4.0 grams Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0080/C0088/C0052/C0050/C0048/C0048/C0065 /C0083/C0069/C0082/C0073/C0069/C0083 3–87Motorola Sensor Device Data www.motorola.com/semiconductors Device Type Options Case No. MPX Series Order No. Marking Basic Element Absolute, Element Case 867 MPX4200A MPX4200A Transfer Function (MPX4200A) Nominal Transfer Value:Vout = VS x (0.005 x P – 0.04) Nominal Transfer Value:± (Pressure Error x Temp. Factor x 0.005 x VS) Nominal Transfer Value:VS = 5.1 ± 0.25 Vdc Temperature Error Band Temp Multiplier – 40 3 –18 1.56 0 to 85 1 +125 2 Temperature in C° 4.0 3.0 2.0 0.0 1.0 –40 –20 0 20 40 60 14012010080 MPX4200A Series Temperature Error Factor Pressure Error Band Pressure in kPa Pressure Error (Max) 20 kPa ± 4.2 (kPa) 40 kPa ± 2.4 (kPa) 160 kPa ± 2.4 (kPa) 200 kPa ± 3.2 (kPa) 6.0 4.0 2.0 –2.0 – 4.0 – 6.0 60 80 100 120 140 160 Pressure Error (kPa) 18020 40 200 MPX4200A Series NOTE: The Temperature Multiplier is a linear response from 0°C to –40°C and from 85°C to 125°C Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

3–88 Motorola Sensor Device Datawww.motorola.com/semiconductors /C0073/C0110/C0116/C0101/C0103/C0114/C0097/C0116/C0101/C0100 /C0083/C0105/C0108/C0105/C0099/C0111/C0110 /C0080/C0114/C0101/C0115/C0115/C0117/C0114/C0101 /C0083/C0101/C0110/C0115/C0111/C0114 /C0077/C0097/C0110/C0105/C0102/C0111/C0108/C0100 /C0065/C0098/C0115/C0111/C0108/C0117/C0116/C0101 /C0080/C0114/C0101/C0115/C0115/C0117/C0114/C0101 /C0083/C0101/C0110/C0115/C0111/C0114 /C0079/C0110/C0045/C0067/C0104/C0105/C0112 /C0083/C0105/C0103/C0110/C0097/C0108 /C0067/C0111/C0110/C0100/C0105/C0116/C0105/C0111/C0110/C0101/C0100/C0044 /C0084/C0101/C0109/C0112/C0101/C0114/C0097/C0116/C0117/C0114/C0101 /C0067/C0111/C0109/C0112/C0101/C0110/C0115/C0097/C0116/C0101/C0100 /C0097/C0110/C0100 /C0067/C0097/C0108/C0105/C0098/C0114/C0097/C0116/C0101/C0100 The Motorola MPX4250A/MPXA4250A series Manifold Absolute Pressure (MAP) sensor for engine control is designed to sense absolute air pressure within the intake manifold. This measurement can be used to compute the amount of fuel required for each cylinder. The MPX4250A/MPXA4250A series piezoresistive transducer is a state–of–the–art monolithic silicon pressure sensor designed for a wide range of applications, particularly those employing a microcontroller or microprocessor with A/D inputs. This transducer combines advanced micromachining techniques, thin–film metallization and bipolar processing to provide an accurate, high–level analog output signal that is proportional to the applied pressure. The small form factor and high reliability of on–chip integration make the Motorola sensor a logical and economical choice for the automotive system engineer.

1.5% Maximum Error Over 0° to 85°C
Specifically Designed for Intake Manifold Absolute Pressure Sensing in Engine Control Systems
Patented Silicon Shear Stress Strain Gauge
Temperature Compensated Over –40° to +125°C
Offers Reduction in Weight and Volume Compared to Existing Hybrid Modules
Durable Epoxy Unibody Element or Thermoplastic Small Outline, Surface Mount Package
Ideal for Non–Automotive Applications Application Examples
Turbo Boost Engine Control
Ideally Suited for Microprocessor or Microcontroller– Based Systems PINS 4, 5, AND 6 ARE NO CONNECTS FOR UNIBODY DEVICE PINS 1, 5, 6, 7, AND 8 ARE NO CONNECTS FOR SMALL OUTLINE PACKAGE DEVICE

Figure 1. Fully Integrated Pressure Sensor is noted by the notch in the lead. is noted by the notch in the lead. Freescale Semiconductor, Inc.

/C0077/C0080/C0088/C0052/C0050/C0053/C0048/C0065 /C0077/C0080/C0088/C0065/C0052/C0050/C0053/C0048/C0065 /C0083/C0069/C0082/C0073/C0069/C0083 3–89Motorola Sensor Device Data www.motorola.com/semiconductors MAXIMUM RATINGS (1) Parametrics Symbol Value Unit Maximum Pressure(2) (P1 > P2) Pmax 1000 kPa Storage Temperature Tstg –40 to +125 °C Operating Temperature TA –40 to +125 °C NOTES: 1. TC = 25°C unless otherwise noted. 2. Exposure beyond the specified limits may cause permanent damage or degradation to the device. OPERATING CHARACTERISTICS (VS = 5.1 Vdc, TA = 25°C unless otherwise noted, P1 > P2, Decoupling circuit shown in Figure 3 required to meet electrical specifications.) Characteristic Symbol Min Typ Max Unit Pressure Range(1) POP 20 — 250 kPa Supply Voltage(2) VS 4.85 5.1 5.35 Vdc Supply Current Io — 7.0 10 mAdc Minimum Pressure Offset(3) (0 to 85°C) @ V S = 5.1 Volts Voff 0.133 0.204 0.274 Vdc Full Scale Output(4) (0 to 85°C) @ V S = 5.1 Volts VFSO 4.826 4.896 4.966 Vdc Full Scale Span(5) (0 to 85°C) @ V S = 5.1 Volts VFSS — 4.692 — Vdc Accuracy(6) (0 to 85°C) — — — ±1.5 %V FSS Sensitivity ΔV/ΔP — 20 — mV/kPa Response Time(7) tR — 1.0 — msec Output Source Current at Full Scale Output lo+ — 0.1 — mAdc Warm–Up Time (8) — — 20 — msec Offset Stability(9) — — ± 0.5 — %V FSS NOTES: 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Full Scale Output (VFSO ) is defined as the output voltage at the maximum or full rated pressure. 5. Full Scale Span (VFSS ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 6. Accuracy (error budget) consists of the following:

Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C.
TcSpan: Output deviation over the temperature range of 0 ° to 85°C, relative to 25°C.
TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0° to 85°C, relative to 25°C.
Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS , at 25°C. 7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 8. Warm–up is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. 9. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MECHANICAL CHARACTERISTICS Characteristics Typ Unit Weight, Basic Element (Case 867) 4.0 Grams Weight, Small Outline Package (Case 482) 1.5 Grams Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0080/C0088/C0052/C0050/C0053/C0048/C0065 /C0077/C0080/C0088/C0065/C0052/C0050/C0053/C0048/C0065 /C0083/C0069/C0082/C0073/C0069/C0083 3–91Motorola Sensor Device Data www.motorola.com/semiconductors Transfer Function Nominal Transfer Value:Vout = VS (P x 0.004 – 0.04) Nominal Transfer Value:+/– (Pressure Error x Temp. Factor x 0.004 x VS) Nominal Transfer Value:VS = 5.1 V ± 0.25 Vdc Temperature Error Band Temp Multiplier – 40 3 0 to 85 1 +125 3 Temperature in C° 4.0 3.0 2.0 0.0 1.0 –40 –20 0 20 40 60 14012010080 Temperature Error Factor Pressure Error Band Pressure Error (Max) 20 to 250 kPa ± 3.45 (kPa) NOTE: The Temperature Multiplier is a linear response from 0° to –40°C and from 85° to 125°C. Pressure (kPa)75 100 125 150 175 200 22525 50 250 4.0 3.0 2.0 1.0 –1.0 –2.0 –3.0 –4.0 –5.0 5.0 Pressure Error (kPa) Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

port fittings that provide mounting ease and barbed hose connections. pressure port fitting. Two packing options are offered for each type. Freescale Semiconductor, Inc.

3–93Motorola Sensor Device Data www.motorola.com/semiconductors /C0073/C0110/C0116/C0101/C0103/C0114/C0097/C0116/C0101/C0100 /C0083/C0105/C0108/C0105/C0099/C0111/C0110 /C0080/C0114/C0101/C0115/C0115/C0117/C0114/C0101 /C0083/C0101/C0110/C0115/C0111/C0114 /C0079/C0110/C0045/C0067/C0104/C0105/C0112 /C0083/C0105/C0103/C0110/C0097/C0108 /C0067/C0111/C0110/C0100/C0105/C0116/C0105/C0111/C0110/C0101/C0100/C0044 /C0084/C0101/C0109/C0112/C0101/C0114/C0097/C0116/C0117/C0114/C0101 /C0067/C0111/C0109/C0112/C0101/C0110/C0115/C0097/C0116/C0101/C0100 /C0097/C0110/C0100 /C0067/C0097/C0108/C0105/C0098/C0114/C0097/C0116/C0101/C0100 The MPX4250D series piezoresistive transducer is a state–of–the–art monolithic silicon pressure sensor designed for a wide range of applications, particularly those employing a microcontroller or microprocessor with A/D inputs. This transducer combines advanced micromachining techniques, thin–film metallization, and bipolar processing to provide an accurate, high–level analog output signal that is proportional to the applied pressure. The small form factor and high reliability of on–chip integration make the Motorola sensor a logical and economical choice for the automotive system engineer.

Differential and Gauge Applications Available
1.4% Maximum Error Over 0° to 85°C
Patented Silicon Shear Stress Strain Gauge
Temperature Compensated Over –40° to +125°C
Offers Reduction in Weight and Volume Compared to Existing Hybrid Modules
Durable Epoxy Unibody Element
Ideally Suited for Microprocessor or Microcontroller–Based Systems PINS 4, 5 AND 6 ARE NO CONNECTS FOR UNIBODY DEVICE

is noted by the notch in the lead. Freescale Semiconductor, Inc.

/C0077/C0080/C0088/C0052/C0050/C0053/C0048/C0068 /C0083/C0069/C0082/C0073/C0069/C0083 3–94 Motorola Sensor Device Datawww.motorola.com/semiconductors MAXIMUM RATINGS (1) Parametrics Symbol Value Unit Maximum Pressure(2) (P1 > P2) Pmax 1000 kPa Storage Temperature Tstg –40° to +125° °C Operating Temperature TA –40° to +125° °C NOTES: 1. TC = 25°C unless otherwise noted. 2. Exposure beyond the specified limits may cause permanent damage or degradation to the device. OPERATING CHARACTERISTICS (VS = 5.1 Vdc, TA = 25°C unless otherwise noted, P1 > P2, Decoupling circuit shown in Figure 3 required to meet electrical specifications.) Characteristic Symbol Min Typ Max Unit Pressure Range(1) POP 0 — 250 kPa Supply Voltage(2) VS 4.85 5.1 5.35 Vdc Supply Current Io — 7.0 10 mAdc Minimum Pressure Offset(3) (0 to 85°C) @ V S = 5.1 Volts VOFF 0.139 0.204 0.269 Vdc Full Scale Output(4) (0 to 85°C) @ V S = 5.1 Volts VFSO 4.844 4.909 4.974 Vdc Full Scale Span(5) (0 to 85°C) @ V S = 5.1 Volts VFSS — 4.705 — Vdc Accuracy(6) (0 to 85°C) — — — ±1.4 %V FSS Sensitivity ΔV/ΔP — 18.8 — mV/kPa Response Time(7) tR — 1.0 — msec Output Source Current at Full Scale Output lo+ — 0.1 — mAdc Warm–Up Time (8) — — 20 — msec Offset Stability(9) — — ± 0.5 — %V FSS NOTES: 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Full Scale Output (VFSO ) is defined as the output voltage at the maximum or full rated pressure. 5. Full Scale Span (VFSS ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 6. Accuracy (error budget) consists of the following:

Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C.
TcSpan: Output deviation over the temperature range of 0 ° to 85°C, relative to 25°C.
TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0° to 85°C, relative to 25°C.
Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS , at 25°C. 7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 8. Warm–up is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. 9. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MECHANICAL CHARACTERISTICS Characteristics Typ Unit Weight, Basic Element (Case 867) 4.0 Grams Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0080/C0088/C0052/C0050/C0053/C0048/C0068 /C0083/C0069/C0082/C0073/C0069/C0083 3–96 Motorola Sensor Device Datawww.motorola.com/semiconductors The MPX4250D series silicon pressure sensors are available in the basic element package or with pressure port fittings that provide mounting ease and barbed hose connections. Device Type/Order No. Options Case No. Marking MPX4250D Basic Element 867 MPX4250D MPX4250GP Gauge Ported Element 867B MPX4250GP MPX4250DP Dual Ported Element 867C MPX4250DP Transfer Function (MPX4250D) Nominal Transfer Value:Vout = VS x (0.00369 x P + 0.04) Nominal Transfer Value:/C0034 (Pressure Error x Temp. Factor x 0.00369 x VS) Nominal Transfer Value:VS = 5.1 /C0034 0.25 Vdc Temperature Error Band Temp Multiplier – 40 3 0 to 85 1 +125 3 Temperature in °C 4.0 3.0 2.0 0.0 1.0 –40 –20 0 20 40 60 14012010080 Temperature Error Factor Pressure Error Band Pressure (kPa) Pressure Error (max) 0 to 250 kPa ± 3.45 kPa 75 100 125 150 175 200 22525 50 250 NOTE: The Temperature Multiplier is a linear response from 0° to –40°C and from 85° to 125°C. 4.0 3.0 2.0 1.0 –1.0 –2.0 –3.0 –4.0 –5.0 5.0 Pressure Error (kPa) Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

3–97Motorola Sensor Device Data www.motorola.com/semiconductors /C0073/C0110/C0116/C0101/C0103/C0114/C0097/C0116/C0101/C0100 /C0083/C0105/C0108/C0105/C0099/C0111/C0110 /C0080/C0114/C0101/C0115/C0115/C0117/C0114/C0101 /C0083/C0101/C0110/C0115/C0111/C0114 /C0079/C0110/C0045/C0067/C0104/C0105/C0112 /C0083/C0105/C0103/C0110/C0097/C0108 /C0067/C0111/C0110/C0100/C0105/C0116/C0105/C0111/C0110/C0101/C0100/C0044 /C0084/C0101/C0109/C0112/C0101/C0114/C0097/C0116/C0117/C0114/C0101 /C0067/C0111/C0109/C0112/C0101/C0110/C0115/C0097/C0116/C0101/C0100 /C0097/C0110/C0100 /C0067/C0097/C0108/C0105/C0098/C0114/C0097/C0116/C0101/C0100 The MPX5010/MPXV5010G series piezoresistive transducers are state–of–the–art monolithic silicon pres- sure sensors designed for a wide range of applications, but particularly those employing a microcontroller or micro- processor with A/D inputs. This transducer combines advanced micromachining techniques, thin–film metal- lization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure.

5.0% Maximum Error over 0° to 85°C
Ideally Suited for Microprocessor or Microcontroller– Based Systems
Durable Epoxy Unibody and Thermoplastic (PPS) Surface Mount Package
Temperature Compensated over /C004240° to +125°C
Patented Silicon Shear Stress Strain Gauge
Available in Differential and Gauge Configurations
Available in Surface Mount (SMT) or Through–hole (DIP) Configurations Application Examples
Hospital Beds
HVAC
Respiratory Systems
Process Control

Figure 1. Fully Integrated Pressure is noted by the notch in the lead. Freescale Semiconductor, Inc.

/C0077/C0080/C0088/C0053/C0048/C0049/C0048 /C0077/C0080/C0088/C0086/C0053/C0048/C0049/C0048/C0071 /C0083/C0069/C0082/C0073/C0069/C0083 3–98 Motorola Sensor Device Datawww.motorola.com/semiconductors MAXIMUM RATINGS (NOTE) Parametrics Symbol Value Unit Maximum Pressure (P1 > P2) Pmax 75 kPa Storage Temperature Tstg –40 to +125 °C Operating Temperature TA –40 to +125 °C NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device. OPERATING CHARACTERISTICS (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 3 required to meet specification.) Characteristic Symbol Min Typ Max Unit Pressure Range(1) POP 0 — 10 kPa Supply Voltage(2) VS 4.75 5.0 5.25 Vdc Supply Current Io — 5.0 10 mAdc Minimum Pressure Offset(3) (0 to 85°C) @ V S = 5.0 Volts Voff 0 0.2 0.425 Vdc Full Scale Output(4) (0 to 85 °C) @ V S = 5.0 Volts VFSO 4.475 4.7 4.925 Vdc Full Scale Span(5) (0 to 85°C) @ V S = 5.0 Volts VFSS 4.275 4.5 4.725 Vdc Accuracy(6) (0 to 85°C) — — — ± 5.0 %V FSS Sensitivity V/P — 450 — mV/kPa Response Time(7) tR — 1.0 — ms Output Source Current at Full Scale Output IO+ — 0.1 — mAdc Warm–Up Time (8) — — 20 — ms Offset Stability(9) — — ± 0.5 — %V FSS NOTES: 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Full Scale Output (VFSO ) is defined as the output voltage at the maximum or full rated pressure. 5. Full Scale Span (VFSS ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 6. Accuracy (error budget) consists of the following:

Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C.
TcSpan: Output deviation over the temperature range of 0 ° to 85°C, relative to 25°C.
TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0° to 85°C, relative to 25°C.
Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS , at 25°C. 7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 8. Warm–up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. 9. Offset Stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MECHANICAL CHARACTERISTICS Characteristics Typ Unit Weight, Basic Element (Case 867) 4.0 grams Weight, Basic Element (Case 482) 1.5 grams Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0080/C0088/C0053/C0048/C0049/C0048 /C0077/C0080/C0088/C0086/C0053/C0048/C0049/C0048/C0071 /C0083/C0069/C0082/C0073/C0069/C0083 3–100 Motorola Sensor Device Datawww.motorola.com/semiconductors Transfer Function (MPX5010, MPXV5010G) Nominal Transfer Value:Vout = VS x (0.09 x P + 0.04) Nominal Transfer Value:± (Pressure Error x Temp. Factor x 0.09 x VS) Nominal Transfer Value:VS = 5.0 V ± 0.25 Vdc Temperature Error Band Temp Multiplier – 40 3 0 to 85 1 +125 3 Temperature in C° 4.0 3.0 2.0 0.0 1.0 –40 –20 0 20 40 60 14012010080 MPX5010, MPXV5010G Series Temperature Error Factor Pressure Error Band NOTE: The Temperature Multiplier is a linear response from 0° to –40°C and from 85° to 125°C. Pressure (kPa) 0.5 0.4 0.2 –0.3 –0.4 –0.5 0 123456 7 Pressure Error (Max) 0 to 10 kPa ± 0.5 kPa 890 0.3 0.1 –0.2 –0.1 Pressure Error (kPa) Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0080/C0088/C0053/C0048/C0049/C0048 /C0077/C0080/C0088/C0086/C0053/C0048/C0049/C0048/C0071 /C0083/C0069/C0082/C0073/C0069/C0083 3–101Motorola Sensor Device Data www.motorola.com/semiconductors PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluoro silicone gel which protects the die from harsh media. The Motorola MPX pressure sensor is designed to operate with positive differen- tial pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below: Part Number Case Type Pressure (P1) Side Identifier MPX5010D 867C Stainless Steel Cap MPX5010DP 867C Side with Part Marking MPX5010GP 867B Side with Port Attached MPX5010GS 867E Side with Port Attached MPX5010GSX 867F Side with Port Attached MPXV5010G6U 482 Stainless Steel Cap MPXV5010G7U 482B Stainless Steel Cap MPXV5010GC6U/T1 482A Side with Port Attached MPXV5010GC7U 482C Side with Port Attached MPXV5010GP 1369 Side with Port Attached MPXV5010DP 1351 Side with Part Marking ORDERING INFORMATION — UNIBODY PACKAGE (MPX5010 SERIES) MPX Series Device Type Options Case Type Order Number Device Marking Basic Element Differential 867 MPX5010D MPX5010D Ported Elements Differential, Dual Port 867C MPX5010DP MPX5010DP Gauge 867B MPX5010GP MPX5010GP Gauge, Axial 867E MPX5010GS MPX5010D Gauge, Axial PC Mount 867F MPX5010GSX MPX5010D ORDERING INFORMATION — SMALL OUTLINE PACKAGE (MPXV5010G SERIES) Device Type Options Case No. MPX Series Order No. Packing Options Marking Basic Elements Gauge, Element Only, SMT 482 MPXV5010G6U Rails MPXV5010G Gauge, Element Only, DIP 482B MPXV5010G7U Rails MPXV5010G Ported Elements Gauge, Axial Port, SMT 482A MPXV5010GC6U Rails MPXV5010G Gauge, Axial Port, DIP 482C MPXV5010GC7U Rails MPXV5010G Gauge, Axial Port, SMT 482A MPXV5010GC6T1 Tape and Reel MPXV5010G Gauge, Side Port, SMT 1369 MPXV5010GP Trays MPXV5010G Differential, Dual Port, SMT1351 MPXV5010DP Trays MPXV5010G Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

Freescale Semiconductor, Inc.

3–103Motorola Sensor Device Data www.motorola.com/semiconductors /C0073/C0110/C0116/C0101/C0103/C0114/C0097/C0116/C0101/C0100 /C0083/C0105/C0108/C0105/C0099/C0111/C0110 /C0080/C0114/C0101/C0115/C0115/C0117/C0114/C0101 /C0083/C0101/C0110/C0115/C0111/C0114 /C0079/C0110/C0045/C0067/C0104/C0105/C0112/C0083/C0105/C0103/C0110/C0097/C0108 /C0067/C0111/C0110/C0100/C0105/C0116/C0105/C0111/C0110/C0101/C0100/C0044 /C0084/C0101/C0109/C0112/C0101/C0114/C0097/C0116/C0117/C0114/C0101 /C0067/C0111/C0109/C0112/C0101/C0110/C0115/C0097/C0116/C0101/C0100 /C0097/C0110/C0100 /C0067/C0097/C0108/C0105/C0098/C0114/C0097/C0116/C0101/C0100 The MPX5050/MPXV5050G series piezoresistive transducer is a state–of–the–art monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This patented, single element transducer combines advanced micromachining techniques, thin–film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure.

2.5% Maximum Error over 0° to 85°C
Ideally suited for Microprocessor or Microcontroller–Based Systems
Temperature Compensated Over – 40° to +125°C
Patented Silicon Shear Stress Strain Gauge
Durable Epoxy Unibody Element
Easy–to–Use Chip Carrier Option

is noted by the notch in the lead. Freescale Semiconductor, Inc.

/C0077/C0080/C0088/C0053/C0048/C0053/C0048 /C0077/C0080/C0088/C0086/C0053/C0048/C0053/C0048/C0071 /C0083/C0069/C0082/C0073/C0069/C0083 3–104 Motorola Sensor Device Datawww.motorola.com/semiconductors MAXIMUM RATINGS (NOTE) Parametrics Symbol Value Unit Maximum Pressure (P1 > P2) Pmax 200 kPa Storage Temperature Tstg –40° to +125° °C Operating Temperature TA –40° to +125° °C NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device. OPERATING CHARACTERISTICS (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 4 required to meet electrical specifications.) Characteristic Symbol Min Typ Max Unit Pressure Range(1) POP 0 — 50 kPa Supply Voltage(2) VS 4.75 5.0 5.25 Vdc Supply Current Io — 7.0 10.0 mAdc Minimum Pressure Offset(3) (0 to 85°C) @ V S = 5.0 Volts Voff 0.088 0.20 0.313 Vdc Full Scale Output(4) (0 to 85°C) @ V S = 5.0 Volts VFSO 4.587 4.70 4.813 Vdc Full Scale Span(5) (0 to 85°C) @ V S = 5.0 Volts VFSS — 4.50 — Vdc Accuracy(6) — — — /C00342.5 %V FSS Sensitivity V/P — 90 — mV/kPa Response Time(7) tR — 1.0 — ms Output Source Current at Full Scale Output Io+ — 0.1 — mAdc Warm–Up Time (8) — — 20 — ms Offset Stability(9) — — /C00340.5 — %V FSS NOTES: 1. 1.0kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Full Scale Output (VFSO ) is defined as the output voltage at the maximum or full rated pressure. 5. Full Scale Span (VFSS ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 6. Accuracy (error budget) consists of the following:

Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25°C.
TcSpan: Output deviation over the temperature range of 0 ° to 85°C, relative to 25°C.
TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative to 25°C.
Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS at 25°C. 7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 8. Warm–up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. 9. Offset Stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MECHANICAL CHARACTERISTICS Characteristics Typ Unit Weight, Basic Element (Case 867) 4.0 grams Weight, Basic Element (Case 1369) 1.5 grams Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0080/C0088/C0053/C0048/C0053/C0048 /C0077/C0080/C0088/C0086/C0053/C0048/C0053/C0048/C0071 /C0083/C0069/C0082/C0073/C0069/C0083 3–106 Motorola Sensor Device Datawww.motorola.com/semiconductors Nominal Transfer Value: Vout = VS (P x 0.018 + 0.04) +/– (Pressure Error x Temp. Factor x 0.018 x VS) VS = 5.0 V ± 0.25 Vdc Transfer Function 0.0 –40 –20 0 20 40 60 14012010080 Temperature Error Band – 40 3 0 to 85 1 +125 3 Temperature in °C 4.0 3.0 2.0 1.0 MPX5050/MPXV5050G Series Temp Multiplier Temperature Error Factor NOTE: The Temperature Multiplier is a linear response from 0° to –40°C and from 85° to 125°C. Pressure Error Band Error Limits for Pressure Pressure (in kPa) 3.0 2.0 1.0 –1.0 – 2.0 – 3.0 0.0 01 02 0 3 0 4 0 5 0 60 Pressure Error (kPa) Pressure Error (Max) 0 to 50 kPa ± 1.25 kPa Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0080/C0088/C0053/C0048/C0053/C0048 /C0077/C0080/C0088/C0086/C0053/C0048/C0053/C0048/C0071 /C0083/C0069/C0082/C0073/C0069/C0083 3–107Motorola Sensor Device Data www.motorola.com/semiconductors PRESSURE (P1) / VACUUM (P2) SIDE IDENTIFICATION TABLE Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluorosilicone gel which protects the die from harsh media. The Motorola MPX pressure sensor is designed to operate with positive differen- tial pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below: Part Number Case Type Pressure (P1) Side Identifier MPX5050D 867 Stainless Steel Cap MPX5050DP 867C Side with Part Marking MPX5050GP 867B Side with Port Attached MPXV5050GP 1369 Side with Port Attached MPXV5050DP 1351 Side with Part Marking ORDERING INFORMATION — UNIBODY PACKAGE (MPX5050 SERIES) MPX Series Device Type Options Case Type Order Number Device Marking Basic Element Differential 867 MPX5050D MPX5050D Ported Elements Differential Dual Ports 867C MPX5050DP MPX5050DP Gauge 867B MPX5050GP MPX5050GP ORDERING INFORMATION — SMALL OUTLINE PACKAGE (MPXV5050G SERIES) Device Type Options Case No. MPX Series Order No. Packing Options Marking Ported Elements Side Port 1369 MPXV5050GP Trays MPXV5050G Dual Port 1351 MPXV5050DP Trays MPXV5050G Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

3–108 Motorola Sensor Device Datawww.motorola.com/semiconductors /C0073/C0110/C0116/C0101/C0103/C0114/C0097/C0116/C0101/C0100 /C0083/C0105/C0108/C0105/C0099/C0111/C0110 /C0080/C0114/C0101/C0115/C0115/C0117/C0114/C0101 /C0083/C0101/C0110/C0115/C0111/C0114 /C0079/C0110/C0045/C0067/C0104/C0105/C0112 /C0083/C0105/C0103/C0110/C0097/C0108 /C0067/C0111/C0110/C0100/C0105/C0116/C0105/C0111/C0110/C0101/C0100/C0044 /C0084/C0101/C0109/C0112/C0101/C0114/C0097/C0116/C0117/C0114/C0101 /C0067/C0111/C0109/C0112/C0101/C0110/C0115/C0097/C0116/C0101/C0100 /C0097/C0110/C0100 /C0067/C0097/C0108/C0105/C0098/C0114/C0097/C0116/C0101/C0100 The MPX5100 series piezoresistive transducer is a state–of–the–art monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This patented, single element transducer combines advanced micromachining techniques, thin–film metalliza- tion, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure.

2.5% Maximum Error over 0° to 85°C
Ideally suited for Microprocessor or Microcontroller–Based Systems
Patented Silicon Shear Stress Strain Gauge
Available in Absolute, Differential and Gauge Configurations
Durable Epoxy Unibody Element
Easy–to–Use Chip Carrier Option VS SENSING ELEMENT GND THIN FILM TEMPERATURE COMPENSATION AND GAIN STAGE #1 GAIN STAGE #2 AND GROUND REFERENCE SHIFT CIRCUITRY PINS 4, 5 AND 6 ARE NO CONNECTS

is noted by the notch in the lead. Freescale Semiconductor, Inc.

/C0077/C0080/C0088/C0053/C0049/C0048/C0048 /C0083/C0069/C0082/C0073/C0069/C0083 3–109Motorola Sensor Device Data www.motorola.com/semiconductors MAXIMUM RATINGS (NOTE) Parametrics Symbol Value Unit Maximum Pressure (P1 > P2) Pmax 400 kPa Storage Temperature Tstg –40° to +125° °C Operating Temperature TA –4 0° to +125° °C NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device. OPERATING CHARACTERISTICS (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 4 required to meet electrical specifications.) Characteristic Symbol Min Typ Max Unit Pressure Range(1) Gauge, Differential: MPX5100D POP 0 100 115 kPa Supply Voltage(2) VS 4.75 5.0 5.25 Vdc Supply Current Io — 7.0 10 mAdc Minimum Pressure Offset(3) (0 to 85°C) @ V S = 5.0 Volts Voff 0.088 0.20 0.313 Vdc Full Scale Output(4) Differential and Absolute (0 to 85°C) @ V S = 5.0 Volts Vacuum(10) VFSO 4.587 3.688 4.700 3.800 4.813 3.913 Vdc Full Scale Span(5) Differential and Absolute (0 to 85°C) @ V S = 5.0 Volts Vacuum(10) VFSS — 4.500 3.600 Vdc Accuracy(6) — — — /C00342.5 %V FSS Sensitivity V/P — 45 — mV/kPa Response Time(7) tR — 1.0 — ms Output Source Current at Full Scale Output Io+ — 0.1 — mAdc Warm–Up Time (8) — — 20 — ms Offset Stability(9) — — /C00340.5 — %V FSS NOTES: 1. 1.0kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Full Scale Output (VFSO ) is defined as the output voltage at the maximum or full rated pressure. 5. Full Scale Span (VFSS ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 6. Accuracy (error budget) consists of the following:

Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25°C.
TcSpan: Output deviation over the temperature range of 0 ° to 85°C, relative to 25°C.
TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative to 25°C.
Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS at 25°C. 7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 8. Warm–up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. 9. Offset Stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MECHANICAL CHARACTERISTICS Characteristics Typ Unit Weight, Basic Element (Case 867) 4.0 grams Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0080/C0088/C0053/C0049/C0048/C0048 /C0083/C0069/C0082/C0073/C0069/C0083 3–111Motorola Sensor Device Data www.motorola.com/semiconductors Nominal Transfer Value:Vout = VS (P x 0.009 + 0.04) +/– (Pressure Error x Temp. Mult. x 0.009 x VS) VS = 5.0 V ±5% P kPa Transfer Function (MPX5100D, MPX5100G) Temperature Error Multiplier Break Points Temp Multiplier Temperature in °C 4.0 3.0 2.0 0.0 1.0 –40 –20 0 20 40 60 13012010080 MPX5100D Series Pressure Error Band Pressure in kPa 3.0 2.0 1.0 –1.0 –2.0 –3.0 0.0 0 20 40 60 80 100 120 Pressure Error (max) 0 to 100 kPa ± 2.5 kPa – 40 3 0 to 85 1 +125 3 NOTE: The Temperature Multiplier is a linear response from 0° to –40°C and from 85° to 125°C. 140 Error (kPa) Error Limits for Pressure MPX5100D Series Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0080/C0088/C0053/C0049/C0048/C0048 /C0083/C0069/C0082/C0073/C0069/C0083 3–112 Motorola Sensor Device Datawww.motorola.com/semiconductors Nominal Transfer Value:Vout = VS (P x 0.009 – 0.095) +/– (Pressure Error x Temp. Mult. x 0.009 x VS) VS = 5.0 V ±5% P kPa Transfer Function (MPX5100A) Temperature Error Multiplier Break Points Temp Multiplier Temperature in °C 4.0 3.0 2.0 0.0 1.0 –40 –20 0 20 40 60 13012010080 MPX5100A Series Pressure Error Band – 40 3 0 to 85 1 +125 3 140 NOTE: The Temperature Multiplier is a linear response from 0° to –40°C and from 85° to 125°C. Pressure in kPa 3.0 2.0 1.0 –1.0 –2.0 –3.0 0.0 0 20 40 60 80 100 130 Pressure Error (max) 15 to 115 kPa ± 2.5 kPa Error (kPa) Error Limits for Pressure MPX5100A Series Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0080/C0088/C0053/C0049/C0048/C0048 /C0083/C0069/C0082/C0073/C0069/C0083 3–113Motorola Sensor Device Data www.motorola.com/semiconductors PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluoro silicone gel which protects the die from harsh media. The Motorola MPX pressure sensor is designed to operate with positive differen- tial pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the Table below: Part Number Case Type Pressure (P1) Side Identifier MPX5100A, MPX5100D 867 Stainless Steel Cap MPX5100DP 867C Side with Part Marking MPX5100AP , MPX5100GP 867B Side with Port Attached MPX5100GSX 867F Side with Port Attached ORDERING INFORMATION: The MPX5100 pressure sensor is available in absolute, differential, and gauge configurations. Devices are available in the basic element package or with pressure port fittings that provide printed circuit board mounting ease and barbed hose pres- sure connections. MPX Series Device Name Options Case Type Order Number Device Marking Basic Element Absolute 867 MPX5100A MPX5100A Differential 867 MPX5100D MPX5100D Ported Elements Differential Dual Ports 867C MPX5100DP MPX5100DP Gauge, Single Port 867B MPX5100GP MPX5100GP Gauge, Axial PC Mount 867F MPX5100GSX MPX5100D Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0080/C0088/C0053/C0051 /C0077/C0080/C0088/C0086/C0053/C0051/C0071/C0067 /C0083/C0069/C0082/C0073/C0069/C0083 3–115Motorola Sensor Device Data www.motorola.com/semiconductors MAXIMUM RATINGS (NOTE) Rating Symbol Value Unit Maximum Pressure (P1 > P2) Pmax 200 kPa Storage Temperature Tstg –40 to +125 °C Operating Temperature TA –40 to +125 °C NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device. OPERATING CHARACTERISTICS (VS = 3.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Characteristic Symbol Min Typ Max Unit Pressure Range(1) POP 0 — 50 kPa Supply Voltage(2) VS — 3.0 6.0 Vdc Supply Current Io — 6.0 — mAdc Full Scale Span(3) VFSS 45 60 90 mV Offset(4) Voff 0 20 35 mV Sensitivity ΔV/ΔP — 1.2 — mV/kPa Linearity(5) — –0.6 — 0.4 %V FSS Pressure Hysteresis(5) (0 to 50 kPa) — — ± 0.1 — %V FSS Temperature Hysteresis(5) (– 40°C to +125°C) — — ± 0.5 — %V FSS Temperature Coefficient of Full Scale Span(5) TCV FSS –0.22 — –0.16 %V FSS /°C Temperature Coefficient of Offset(5) TCV off — ± 15 — µV/°C Temperature Coefficient of Resistance(5) TCR 0.31 — 0.37 %Z in/°C Input Impedance Zin 355 — 505 Ω Output Impedance Zout 750 — 1875 Ω Response Time(6) (10% to 90%) tR — 1.0 — ms Warm–Up — — 20 — ms Offset Stability(7) — — ± 0.5 — %V FSS NOTES: 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self–heating. 3. Full Scale Span (VFSS ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following:

Linearity: Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C.
TcSpan: Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C.
TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C.
TCR: Z in deviation with minimum rated pressure applied, over the temperature range of –40°C to +125°C, relative to 25°C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

MPX53/MPXV53GC series over temperature. con diaphragm by the applied pressure. an extensive temperature range. presented in Motorola Applications Note AN840. calculations required are burdensome. formation regarding media compatibility in your application. Freescale Semiconductor, Inc.

/C0077/C0080/C0088/C0053/C0051 /C0077/C0080/C0088/C0086/C0053/C0051/C0071/C0067 /C0083/C0069/C0082/C0073/C0069/C0083 3–117Motorola Sensor Device Data www.motorola.com/semiconductors PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing silicone gel which isolates the die from the environment. The Motorola pres- sure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below: Part Number Case Type Pressure (P1) Side Identifier MPX53D 344 Stainless Steel Cap MPX53DP 344C Side with Port Marking MPX53GP 344B Side with Port Attached MPXV53GC series 482A, 482C Sides with Port Attached ORDERING INFORMATION – UNIBODY PACKAGE MPX53 series pressure sensors are available in differential and gauge configurations. Devices are available with basic element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose pressure connections. MPX Series Device Type Options Case Type Order Number Device Marking Basic Element Differential Case 344 MPX53D MPX53D Ported Elements Differential Case 344C MPX53DP MPX53DP Gauge Case 344B MPX53GP MPX53GP ORDERING INFORMATION — SMALL OUTLINE PACKAGE The MPXV53GC series pressure sensors are available with a pressure port, surface mount or DIP leadforms, and two packing options. Device Order No. Case No. Packing Options Marking MPXV53GC6T1 482A Tape & Rail MPXV53G MPXV53GC6U 482A Rails MPXV53G MPXV53GC7U 482C Rails MPXV53G Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

3–118 Motorola Sensor Device Datawww.motorola.com/semiconductors /C0073/C0110/C0116/C0101/C0103/C0114/C0097/C0116/C0101/C0100 /C0083/C0105/C0108/C0105/C0099/C0111/C0110 /C0080/C0114/C0101/C0115/C0115/C0117/C0114/C0101 /C0083/C0101/C0110/C0115/C0111/C0114 /C0079/C0110/C0045/C0067/C0104/C0105/C0112 /C0083/C0105/C0103/C0110/C0097/C0108 /C0067/C0111/C0110/C0100/C0105/C0116/C0105/C0111/C0110/C0101/C0100/C0044 /C0084/C0101/C0109/C0112/C0101/C0114/C0097/C0116/C0117/C0114/C0101 /C0067/C0111/C0109/C0112/C0101/C0110/C0115/C0097/C0116/C0101/C0100 /C0097/C0110/C0100 /C0067/C0097/C0108/C0105/C0098/C0114/C0097/C0116/C0101/C0100 The MPX5500 series piezoresistive transducer is a state–of–the–art monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This patented, single element transducer combines advanced micromachining techniques, thin–film metalliza- tion, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure.

2.5% Maximum Error over 0° to 85°C
Ideally suited for Microprocessor or Microcontroller–Based Systems
Patented Silicon Shear Stress Strain Gauge
Durable Epoxy Unibody Element
Available in Differential and Gauge Configurations VS SENSING ELEMENT Vout GND THIN FILM TEMPERATURE COMPENSATION AND GAIN STAGE #1 GAIN STAGE #2 AND GROUND REFERENCE SHIFT CIRCUITRY PINS 4, 5 AND 6 ARE NO CONNECTS

is noted by the notch in the lead. Freescale Semiconductor, Inc.

/C0077/C0080/C0088/C0053/C0053/C0048/C0048 /C0083/C0069/C0082/C0073/C0069/C0083 3–119Motorola Sensor Device Data www.motorola.com/semiconductors MAXIMUM RATINGS (1) Parametrics Symbol Value Unit Maximum Pressure(2) (P2 /C0118 1 Atmosphere) P1max 2000 kPa Storage Temperature Tstg –40° to +125° °C Operating Temperature TA –40° to +125° °C NOTES: 1. Maximum Ratings apply to Case 867 only. Extended exposure at the specified limits may cause permanent damage or degradation to the device. 2. This sensor is designed for applications where P1 is always greater than, or equal to P2. P2 maximum is 500 kPa. OPERATING CHARACTERISTICS (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 4 required to meet electrical specifications.) Characteristic Symbol Min Typ Max Unit Pressure Range(1) POP 0 — 500 kPa Supply Voltage(2) VS 4.75 5.0 5.25 Vdc Supply Current Io — 7.0 10.0 mAdc Zero Pressure Offset(3) (0 to 85°C) Voff 0.088 0.20 0.313 Vdc Full Scale Output(4) (0 to 85°C) VFSO 4.587 4.70 4.813 Vdc Full Scale Span(5) (0 to 85°C) VFSS — 4.50 — Vdc Accuracy(6) — — — /C00342.5 %V FSS Sensitivity V/P — 9.0 — mV/kPa Response Time(7) tR — 1.0 — ms Output Source Current at Full Scale Output Io+ — 0.1 — mAdc Warm–Up Time (8) — — 20 — ms NOTES: 1. 1.0kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Full Scale Output (VFSO ) is defined as the output voltage at full rated pressure. 5. Full Scale Span (VFSS ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 6. Accuracy (error budget) consists of the following:

Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25°C.
TcSpan: Output deviation over the temperature range of 0 ° to 85°C, relative to 25°C.
TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative to 25°C.
Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS at 25°C. 7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 8. Warm–up Time is defined as the time required for the device to meet the specified output voltage after the pressure has been stabilized. MECHANICAL CHARACTERISTICS Characteristics Typ Unit Weight, Basic Element (Case 867) 4.0 grams Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0080/C0088/C0053/C0053/C0048/C0048 /C0083/C0069/C0082/C0073/C0069/C0083 3–121Motorola Sensor Device Data www.motorola.com/semiconductors PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluorosilicone gel which protects the die from the environment. The Motorola MPX pressure sensor is designed to operate with positive dif- ferential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the Table below: Part Number Case Type Pressure (P1) Side Identifier MPX5500D 867 Stainless Steel Cap MPX5500DP 867C Side with Part Marking Device Name Options Case Type Order Number Device Marking Basic Element Differential 867 MPX5500D MPX5500D Ported Elements Differential Dual Ports 867C MPX5500DP MPX5500DP Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

3–122 Motorola Sensor Device Datawww.motorola.com/semiconductors /C0073/C0110/C0116/C0101/C0103/C0114/C0097/C0116/C0101/C0100 /C0083/C0105/C0108/C0105/C0099/C0111/C0110 /C0080/C0114/C0101/C0115/C0115/C0117/C0114/C0101 /C0083/C0101/C0110/C0115/C0111/C0114 /C0079/C0110/C0045/C0067/C0104/C0105/C0112 /C0083/C0105/C0103/C0110/C0097/C0108 /C0067/C0111/C0110/C0100/C0105/C0116/C0105/C0111/C0110/C0101/C0100/C0044 /C0084/C0101/C0109/C0112/C0101/C0114/C0097/C0116/C0117/C0114/C0101 /C0067/C0111/C0109/C0112/C0101/C0110/C0115/C0097/C0116/C0101/C0100 /C0097/C0110/C0100 /C0067/C0097/C0108/C0105/C0098/C0114/C0097/C0116/C0101/C0100 The MPX5700 series piezoresistive transducer is a state–of–the–art monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This patented, single element transducer combines advanced micromachining techniques, thin–film metalliza- tion, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure.

2.5% Maximum Error over 0° to 85°C
Ideally Suited for Microprocessor or Microcontroller–Based Systems
Available in Absolute, Differential and Gauge Configurations
Patented Silicon Shear Stress Strain Gauge
Durable Epoxy Unibody Element

is noted by the notch in the lead. Freescale Semiconductor, Inc.

/C0077/C0080/C0088/C0053/C0055/C0048/C0048 /C0083/C0069/C0082/C0073/C0069/C0083 3–123Motorola Sensor Device Data www.motorola.com/semiconductors MAXIMUM RATINGS (1) Parametrics Symbol Value Unit Maximum Pressure(2) (P2 /C0118 1 Atmosphere) P1max 2800 kPa Storage Temperature Tstg –40 to +125 °C Operating Temperature TA –40 to +125 °C NOTES: 1. Maximum Ratings apply to Case 867 only. Extended exposure at the specified limits may cause permanent damage or degradation to the device. 2. This sensor is designed for applications where P1 is always greater than, or equal to P2. P2 maximum is 500 kPa. OPERATING CHARACTERISTICS (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 4 required to meet electrical specifications.) Characteristic Symbol Min Typ Max Unit Pressure Range(1) Gauge, Differential: MPX5700D POP 0 — 700 700 kPa Supply Voltage(2) VS 4.75 5.0 5.25 Vdc Supply Current Io – 7.0 10 mAdc Zero Pressure Offset(3) Gauge, Differential: (0 to 85°C) Absolute (0 to 85 °C) Voff 0.088 0.184 0.2 0.313 0.409 Vdc Full Scale Output(4) (0 to 85 °C) VFSO 4.587 4.7 4.813 Vdc Full Scale Span(5) (0 to 85 °C) VFSS — 4.5 — Vdc Accuracy(6) (0 to 85°C) — — — ± 2.5 %V FSS Sensitivity V/P — 6.4 — mV/kPa Response Time(7) tR — 1.0 — ms Output Source Current at Full Scale Output IO+ — 0.1 — mAdc Warm–Up Time (8) — — 20 — ms NOTES: 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Full Scale Output (VFSO ) is defined as the output voltage at the maximum or full rated pressure. 5. Full Scale Span (VFSS ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 6. Accuracy (error budget) consists of the following:

Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C.
TcSpan: Output deviation over the temperature range of 0 ° to 85°C, relative to 25°C.
TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0° to 85°C, relative to 25°C.
Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS , at 25°C. 7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 8. Warm–up Time is defined as the time required for the device to meet the specified output voltage after the pressure has been stabilized. MECHANICAL CHARACTERISTICS Characteristics Typ Unit Weight, Basic Element (Case 867) 4.0 grams Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0080/C0088/C0053/C0055/C0048/C0048 /C0083/C0069/C0082/C0073/C0069/C0083 3–125Motorola Sensor Device Data www.motorola.com/semiconductors PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluoro silicone gel which protects the die from harsh media. The Motorola MPX pressure sensor is designed to operate with positive differen- tial pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below: Part Number Case Type Pressure (P1) Side Identifier MPX5700D, MPX5700A 867C Stainless Steel Cap MPX5700DP 867C Side with Part Marking MPX5700GP , MPX5700AP 867B Side with Port Attached MPX5700GS, MPX5700AS 867E Side with Port Attached Device Type Options Case Type Order Number Device Marking Basic Element Differential 867C MPX5700D MPX5700D Ported Elements Differential Dual Ports 867C MPX5700DP MPX5700DP Gauge 867B MPX5700GP MPX5700GP Gauge, Axial 867E MPX5700GS MPX5700D Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0080/C0088/C0053/C0057/C0057/C0057/C0068 3–127Motorola Sensor Device Data www.motorola.com/semiconductors MAXIMUM RATINGS (1) Parametrics Symbol Value Unit Maximum Pressure(2) (P1 > P2) P1max 4000 kPa Storage Temperature Tstg –40° to +125 °C Operating Temperature TA –40° to +125 °C NOTES: 1. Extended exposure at the specified limits may cause permanent damage or degradation to the device. 2. This sensor is designed for applications where P1 is always greater than, or equal to P2. P2 maximum is 500 kPa. OPERATING CHARACTERISTICS (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 4 required to meet electrical specifications.) Characteristic Symbol Min Typ Max Unit Pressure Range(1) POP 0 — 1000 kPa Supply Voltage(2) VS 4.75 5.0 5.25 Vdc Supply Current Io — 7.0 10 mAdc Zero Pressure Offset(3) (0 to 85°C) Voff 0.088 0.2 0.313 Vdc Full Scale Output(4)(0 to 85°C) VFSO 4.587 4.7 4.813 Vdc Full Scale Span(5) (0 to 85°C) VFSS — 4.5 — Vdc Sensitivity V/P — 4.5 — mV/kPa Accuracy(6) (0 to 85°C) — — — ± 2.5 %V FSS Response Time(7) tR — 1.0 — ms Output Source Current at Full Scale Output IO+ — 0.1 — mA Warm–Up Time (8) — — 20 — ms NOTES: 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Full Scale Output (VFSO ) is defined as the output voltage at the maximum or full rated pressure. 5. Full Scale Span (VFSS ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 6. Accuracy (error budget) consists of the following:

Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C.
TcSpan: Output deviation over the temperature range of 0 ° to 85°C, relative to 25°C.
TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0° to 85°C, relative to 25°C.
Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS , at 25°C. 7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 8. Warm–up Time is defined as the time required for the device to meet the specified output voltage after the pressure has been stabilized. MECHANICAL CHARACTERISTICS Characteristics Typ Unit Weight, Basic Element (Case 867) 4.0 grams Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0080/C0088/C0053/C0057/C0057/C0057/C0068 3–129Motorola Sensor Device Data www.motorola.com/semiconductors PRESSURE (P1) / VACUUM (P2) SIDE IDENTIFICATION TABLE Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluoro silicone gel which protects the die from harsh media. The Motorola MPX pressure sensor is designed to operate with positive differen- tial pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below: Part Number Case Type Pressure (P1) Side Identifier MPX5999D 867 Stainless Steel Cap The MPX5999D pressure sensor is available as an element only. MPX Series Device Type Options Case Type Order Number Device Marking Basic Element Differential 867 MPX5999D MPX5999D Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0080/C0088/C0065/C0054/C0049/C0049/C0053/C0065 /C0077/C0080/C0088/C0072/C0054/C0049/C0049/C0053/C0065 /C0083/C0069/C0082/C0073/C0069/C0083 3–131Motorola Sensor Device Data www.motorola.com/semiconductors MAXIMUM RATINGS (1) Parametrics Symbol Value Units Maximum Pressure (P1 /C0117 P2) Pmax 400 kPa Storage Temperature Tstg –40° to +125° °C Operating Temperature TA –40° to +125° °C Output Source Current @ Full Scale Output(2) Io+ 0.5 mAdc Output Sink Current @ Minimum Pressure Offset(2) Io– –0.5 mAdc NOTES: 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. 2. Maximum Output Current is controlled by effective impedance from Vout to Gnd or Vout to VS in the application circuit. OPERATING CHARACTERISTICS (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 /C0117 P2.) Characteristic Symbol Min Typ Max Unit Pressure Range POP 15 — 115 kPa Supply Voltage(1) VS 4.75 5.0 5.25 Vdc Supply Current Io — 6.0 10 mAdc Minimum Pressure Offset(2) (0 to 85°C) @ V S = 5.0 Volts Voff 0.133 0.200 0.268 Vdc Full Scale Output(3) (0 to 85°C) @ V S = 5.0 Volts VFSO 4.633 4.700 4.768 Vdc Full Scale Span(4) (0 to 85°C) @ V S = 5.0 Volts VFSS 4.433 4.500 4.568 Vdc Accuracy(5) (0 to 85°C) — — — ±1.5 %V FSS Sensitivity V/P — 45.9 — mV/kPa Response Time(6) tR — 1.0 — ms Warm–Up Time (7) — — 20 — ms Offset Stability(8) — — ± 0.25 — %V FSS NOTES: 1. Device is ratiometric within this specified excitation range. 2. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 3. Full Scale Output (VFSO ) is defined as the output voltage at the maximum or full rated pressure. 4. Full Scale Span (VFSS ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 5. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span at 25°C due to all sources of error including the following:

Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25°C.
TcSpan: Output deviation over the temperature range of 0 ° to 85°C, relative to 25°C.
TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative to 25°C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Warm–up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 8. Offset Stability is the product’s output deviation when subjected to 1000 cycles of Pulsed Pressure, Temperature Cycling with Bias Test. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

Figure 3. Typical Application Circuit Super Small Outline chip carrier (Case 1317). are shown for operation over 0 to 85°C temperature range. The output will saturate outside of the rated pressure range. information regarding media compatibility in your application. Freescale Semiconductor, Inc.

/C0077/C0080/C0088/C0065/C0054/C0049/C0049/C0053/C0065 /C0077/C0080/C0088/C0072/C0054/C0049/C0049/C0053/C0065 /C0083/C0069/C0082/C0073/C0069/C0083 3–133Motorola Sensor Device Data www.motorola.com/semiconductors Transfer Function (MPXA6115A/MPXH6115A) Nominal Transfer Value:Vout = VS x (0.009 x P – 0.095) ± (Pressure Error x Temp. Factor x 0.009 x VS) VS = 5.0 ± 0.25 Vdc Temperature Error Band MPXA6115A/MPXH6115A Series Break Points Temp Multiplier – 40 3 0 to 85 1 125 1.75 Temperature in C° 4.0 3.0 2.0 0.0 1.0 –40 –20 0 20 40 60 14012010080 Temperature Error Factor NOTE: The Temperature Multiplier is a linear response from 0°C to –40°C and from 85°C to 125°C Pressure Error Band Error Limits for Pressure3.0 2.0 1.0 –1.0 – 2.0 – 3.0 0.0 Pressure Error (kPa) Pressure Error (Max) 15 to 115 (kPa) ± 1.5 (kPa) 40 60 80 100 120 ORDERING INFORMATION — SMALL OUTLINE PACKAGE Device Type Options Case No. MPX Series Order No. Packing Options Marking Basic Element Absolute, Element Only 482 MPXA6115A6U Rails MPXA6115A Ported Element Absolute, Axial Port 482A MPXA6115AC6U Rails MPXA6115A ORDERING INFORMATION — SUPER SMALL OUTLINE PACKAGE Device Type Options Case No. MPX Series Order No. Packing Options Marking Basic Element Absolute, Element Only 1317 MPXH6115A6U Rails MPXH6115A Ported Element Absolute, Axial Port 1317A MPXH6115AC6U Rails MPXH6115A Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

0.100 TYP

Figure 6. SSOP Footprint (Case 1317 and 1317A) Freescale Semiconductor, Inc.

/C0077/C0080/C0088/C0065/C0090/C0052/C0049/C0048/C0048/C0065 /C0083/C0069/C0082/C0073/C0069/C0083 3–136 Motorola Sensor Device Datawww.motorola.com/semiconductors MAXIMUM RATINGS (NOTE) Parametric Symbol Value Unit Maximum Pressure (P1 > P2) Pmax 400 kPa Storage Temperature Tstg –40 to +125 °C Operating Temperature TA –40 to +125 °C NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device. OPERATING CHARACTERISTICS (VS = 5.1 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 3 required to meet electrical specifications.) Characteristic Symbol Min Typ Max Unit Pressure Range(1) POP 20 — 105 kPa Supply Voltage(2) VS 4.85 5.1 5.35 Vdc Supply Current Io — 7.0 10 mAdc Minimum Pressure Offset(3) (0 to 85°C) @ V S = 5.1 Volts Voff 0.225 0.306 0.388 Vdc Full Scale Output(4) (0 to 85°C) @ V S = 5.1 Volts VFSO 4.870 4.951 5.032 Vdc Full Scale Span(5) (0 to 85°C) @ V S = 5.1 Volts VFSS — 4.59 — Vdc Accuracy(6) (0 to 85°C) — — — ±1.8 %V FSS Sensitivity V/P — 54 — mV/kPa Response Time(7) tR — 1.0 — ms Output Source Current at Full Scale Output Io+ — 0.1 — mAdc Warm–Up Time (8) — — 20 — ms Offset Stability(9) — — ± 0.5 — %V FSS NOTES: 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Full Scale Output (VFSO ) is defined as the output voltage at the maximum or full rated pressure. 5. Full Scale Span (VFSS ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 6. Accuracy (error budget) consists of the following:

Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C.
TcSpan: Output deviation over the temperature range of 0 to 85 °C, relative to 25°C.
TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C.
Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS , at 25°C. 7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 8. Warm–up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. 9. Offset Stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0080/C0088/C0065/C0090/C0052/C0049/C0048/C0048/C0065 /C0083/C0069/C0082/C0073/C0069/C0083 3–138 Motorola Sensor Device Datawww.motorola.com/semiconductors Transfer Function (MPXAZ4100A) Nominal Transfer Value:Vout = VS (P x 0.01059 – 0.1518) +/– (Pressure Error x Temp. Factor x 0.01059 x VS) VS = 5.1 V ± 0.25 Vdc Temperature Error Band MPXAZ4100A Series Temp Multiplier – 40 3 0 to 85 1 +125 3 Temperature in C° 4.0 3.0 2.0 0.0 1.0 –40 –20 0 20 40 60 14012010080 Temperature Error Factor NOTE: The Temperature Multiplier is a linear response from 0°C to –40°C and from 85°C to 125°C. Pressure Error Band Error Limits for Pressure3.0 2.0 1.0 –1.0 – 2.0 – 3.0 0.0 20 40 60 80 100 120 Pressure (in kPa) Pressure Error (kPa) Pressure Error (Max) 20 to 105 (kPa) ± 1.5 (kPa) ORDERING INFORMATION — SMALL OUTLINE PACKAGE Device Type Options Case No. MPX Series Order No. Packing Options Marking Basic Element Absolute, Element Only 482 MPXAZ4100A6U Rails MPXAZ4100A Ported Element Absolute, Axial Port 482A MPXAZ4100AC6U Rails MPXAZ4100A Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

Freescale Semiconductor, Inc.

/C0077/C0080/C0088/C0065/C0090/C0052/C0049/C0049/C0053/C0065 /C0083/C0069/C0082/C0073/C0069/C0083 3–141Motorola Sensor Device Data www.motorola.com/semiconductors MAXIMUM RATINGS (NOTE) Parametrics Symbol Value Units Maximum Pressure (P1 /C0117 P2) Pmax 400 kPa Storage Temperature Tstg –40° to +125° °C Operating Temperature TA –40° to +125° °C NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device. OPERATING CHARACTERISTICS (VS = 5.1 Vdc, TA = 25°C unless otherwise noted, P1 /C0117 P2. Decoupling circuit shown in Figure 3 required to meet Electrical Specifications.) Characteristic Symbol Min Typ Max Unit Pressure Range POP 15 — 115 kPa Supply Voltage(1) VS 4.85 5.1 5.35 Vdc Supply Current Io — 7.0 10 mAdc Minimum Pressure Offset(2) (0 to 85°C) @ V S = 5.1 Volts Voff 0.135 0.204 0.273 Vdc Full Scale Output(3) (0 to 85°C) @ V S = 5.1 Volts VFSO 4.725 4.794 4.863 Vdc Full Scale Span(4) (0 to 85°C) @ V S = 5.1 Volts VFSS 4.521 4.590 4.659 Vdc Accuracy(5) (0 to 85°C) — — — ±1.5 %V FSS Sensitivity V/P — 45.9 — mV/kPa Response Time(6) tR — 1.0 — ms Output Source Current at Full Scale Output Io+ — 0.1 — mAdc Warm–Up Time (7) — — 20 — ms Offset Stability(8) — — ± 0.5 — %V FSS NOTES: 1. Device is ratiometric within this specified excitation range. 2. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 3. Full Scale Output (VFSO ) is defined as the output voltage at the maximum or full rated pressure. 4. Full Scale Span (VFSS ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 5. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span at 25°C due to all sources of error including the following:

Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25°C.
TcSpan: Output deviation over the temperature range of 0 ° to 85°C, relative to 25°C.
TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative to 25°C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Warm–up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 8. Offset Stability is the product’s output deviation when subjected to 1000 cycles of Pulsed Pressure, Temperature Cycling with Bias Test. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0080/C0088/C0065/C0090/C0052/C0049/C0049/C0053/C0065 /C0083/C0069/C0082/C0073/C0069/C0083 3–143Motorola Sensor Device Data www.motorola.com/semiconductors Transfer Function (MPXAZ4115A) Nominal Transfer Value:Vout = VS x (0.009 x P – 0.095) ± (Pressure Error x Temp. Factor x 0.009 x VS) VS = 5.1 ± 0.25 Vdc Temperature Error Band MPXAZ4115A Series Break Points Temp Multiplier – 40 3 0 to 85 1 125 3 Temperature in C° 4.0 3.0 2.0 0.0 1.0 –40 –20 0 20 40 60 14012010080 Temperature Error Factor NOTE: The Temperature Multiplier is a linear response from 0°C to –40°C and from 85°C to 125°C Pressure Error Band Error Limits for Pressure3.0 2.0 1.0 –1.0 – 2.0 – 3.0 0.0 Pressure Error (kPa) Pressure Error (Max) 15 to 115 (kPa) ± 1.5 (kPa) 40 60 80 100 120 ORDERING INFORMATION — SMALL OUTLINE PACKAGE Device Type Options Case No. MPX Series Order No. Packing Options Marking Basic Element Absolute, Element Only 482 MPXAZ4115A6U Rails MPXAZ4115A Ported Element Absolute, Axial Port 482A MPXAZ4115AC6U Rails MPXAZ4115A Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

Freescale Semiconductor, Inc.

3–145Motorola Sensor Device Data www.motorola.com/semiconductors /C0077/C0101/C0100/C0105/C0097 /C0082/C0101/C0115/C0105/C0115/C0116/C0097/C0110/C0116 /C0097/C0110/C0100 /C0072/C0105/C0103/C0104 /C0084/C0101/C0109/C0112/C0101/C0114/C0097/C0116/C0117/C0114/C0101 /C0065/C0099/C0099/C0117/C0114/C0097/C0099/C0121 /C0073/C0110/C0116/C0101/C0103/C0114/C0097/C0116/C0101/C0100 /C0083/C0105/C0108/C0105/C0099/C0111/C0110 /C0080/C0114/C0101/C0115/C0115/C0117/C0114/C0101 /C0083/C0101/C0110/C0115/C0111/C0114 /C0102/C0111/C0114 /C0077/C0101/C0097/C0115/C0117/C0114/C0105/C0110/C0103 /C0065/C0098/C0115/C0111/C0108/C0117/C0116/C0101 /C0080/C0114/C0101/C0115/C0115/C0117/C0114/C0101/C0044 /C0079/C0110/C0045/C0067/C0104/C0105/C0112 /C0083/C0105/C0103/C0110/C0097/C0108 /C0067/C0111/C0110/C0100/C0105/C0116/C0105/C0111/C0110/C0101/C0100/C0044 /C0084/C0101/C0109/C0112/C0101/C0114/C0097/C0116/C0117/C0114/C0101 /C0067/C0111/C0109/C0112/C0101/C0110/C0115/C0097/C0116/C0101/C0100 /C0097/C0110/C0100 /C0067/C0097/C0108/C0105/C0098/C0114/C0097/C0116/C0101/C0100 Motorola’s MPXAZ6115A series sensor integrates on–chip, bipolar op amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation. The small form factor and high reliability of on–chip integration make the Motorola pressure sensor a logical and economical choice for the system designer. The MPXAZ6115A series piezoresistive transducer is a state–of–the–art, monolithic, signal conditioned, silicon pressure sensor. This sensor combines advanced micromachining techniques, thin film metallization, and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.

Resistant to High Humidity and Common Automotive Media
Improved Accuracy at High Temperature
1.5% Maximum Error over 0° to 85°C
Ideally suited for Microprocessor or Microcontroller–Based Systems
Temperature Compensated from –40° to +125°C
Durable Thermoplastic (PPS) Surface Mount Package Application Examples
Aviation Altimeters
Industrial Controls
Engine Control/Manifold Absolute Pressure (MAP)
Weather Station and Weather Reporting Devices

denoted by the notch in the lead.

4 N/C

Freescale Semiconductor, Inc.

/C0077/C0080/C0088/C0065/C0090/C0054/C0049/C0049/C0053/C0065 /C0083/C0069/C0082/C0073/C0069/C0083 3–146 Motorola Sensor Device Datawww.motorola.com/semiconductors MAXIMUM RATINGS (1) Parametrics Symbol Value Units Maximum Pressure (P1 /C0117 P2) Pmax 400 kPa Storage Temperature Tstg –40° to +125° °C Operating Temperature TA –40° to +125° °C Output Source Current @ Full Scale Output(2) Io+ 0.5 mAdc Output Sink Current @ Minimum Pressure Offset(2) Io– –0.5 mAdc NOTES: 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. 2. Maximum Output Current is controlled by effective impedance from Vout to Gnd or Vout to VS in the application circuit. OPERATING CHARACTERISTICS (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 /C0117 P2.) Characteristic Symbol Min Typ Max Unit Pressure Range POP 15 — 115 kPa Supply Voltage(1) VS 4.75 5.0 5.25 Vdc Supply Current Io — 6.0 10 mAdc Minimum Pressure Offset(2) (0 to 85°C) @ V S = 5.0 Volts Voff 0.133 0.200 0.268 Vdc Full Scale Output(3) (0 to 85°C) @ V S = 5.0 Volts VFSO 4.633 4.700 4.768 Vdc Full Scale Span(4) (0 to 85°C) @ V S = 5.0 Volts VFSS 4.433 4.500 4.568 Vdc Accuracy(5) (0 to 85°C) — — — ±1.5 %V FSS Sensitivity V/P — 45.9 — mV/kPa Response Time(6) tR — 1.0 — ms Warm–Up Time (7) — — 20 — ms Offset Stability(8) — — ± 0.25 — %V FSS NOTES: 1. Device is ratiometric within this specified excitation range. 2. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 3. Full Scale Output (VFSO ) is defined as the output voltage at the maximum or full rated pressure. 4. Full Scale Span (VFSS ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 5. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span at 25°C due to all sources of error including the following:

Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25°C.
TcSpan: Output deviation over the temperature range of 0 ° to 85°C, relative to 25°C.
TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative to 25°C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Warm–up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 8. Offset Stability is the product’s output deviation when subjected to 1000 cycles of Pulsed Pressure, Temperature Cycling with Bias Test. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

Figure 2. Cross Sectional Diagram SOP Small Outline chip carrier (Case 482). are shown for operation over 0 to 85°C temperature range. The output will saturate outside of the rated pressure range. Freescale Semiconductor, Inc.

/C0077/C0080/C0088/C0065/C0090/C0054/C0049/C0049/C0053/C0065 /C0083/C0069/C0082/C0073/C0069/C0083 3–148 Motorola Sensor Device Datawww.motorola.com/semiconductors Transfer Function (MPXAZ6115A) Nominal Transfer Value:Vout = VS x (0.009 x P – 0.095) ± (Pressure Error x Temp. Factor x 0.009 x VS) VS = 5.0 ± 0.25 Vdc Temperature Error Band MPXAZ6115A Series Break Points Temp Multiplier – 40 3 0 to 85 1 125 1.75 Temperature in C° 4.0 3.0 2.0 0.0 1.0 –40 –20 0 20 40 60 14012010080 Temperature Error Factor NOTE: The Temperature Multiplier is a linear response from 0°C to –40°C and from 85°C to 125°C Pressure Error Band Error Limits for Pressure3.0 2.0 1.0 –1.0 – 2.0 – 3.0 0.0 Pressure Error (kPa) Pressure Error (Max) 15 to 115 (kPa) ± 1.5 (kPa) 40 60 80 100 120 ORDERING INFORMATION — SMALL OUTLINE PACKAGE Device Type Options Case No. MPX Series Order No. Packing Options Marking Basic Element Absolute, Element Only 482 MPXAZ6115A6U Rails MPXAZ6115A Ported Element Absolute, Axial Port 482A MPXAZ6115AC6U Rails MPXAZ6115A Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

Figure 5. SOP Footprint (Case 482 and 482A) Freescale Semiconductor, Inc.

3–150 Motorola Sensor Device Datawww.motorola.com/semiconductors /C0072/C0105/C0103/C0104 /C0086/C0111/C0108/C0117/C0109/C0101 /C0083/C0101/C0110/C0115/C0111/C0114 /C0102/C0111/C0114 /C0076/C0111/C0119 /C0080/C0114/C0101/C0115/C0115/C0117/C0114/C0101 /C0065/C0112/C0112/C0108/C0105/C0099/C0097/C0116/C0105/C0111/C0110/C0115 Motorola has developed a low cost, high volume, miniature pressure sensor package which is ideal as a sub–module component or a disposable unit. The unique concept of the Chip Pak allows great flexibility in system design while allowing an economic solution for the designer. This new chip carrier package uses Motorola’s unique sensor die with its piezoresistive technology, along with the added feature of on–chip, thin–film temperature compensation and calibration. NOTE: Motorola is also offering the Chip Pak package in application–specific configurations, which will have an “SPX” prefix, followed by a four–digit number, unique to the specific customer. Features:

Low Cost
Integrated Temperature Compensation and Calibration
Ratiometric to Supply Voltage
Polysulfone Case Material (Medical, Class V Approved)
Provided in Easy–to–Use Tape and Reel Application Examples
Respiratory Diagnostics
Air Movement Control
Controllers
Pressure Switching NOTE: The die and wire bonds are exposed on the front side of the Chip Pak (pressure is applied to the backside of the device). Front side die and wire protection must be provided in the customer’s housing. Use caution when handling the devices during all processes. Motorola’s MPXC2011DT1/MPXC2012DT1 Pressure Sensor has been designed for medical usage by combining the performance of Motorola’s shear stress pressure sensor design and the use of biomedically approved materials. Materials with a proven history in medical situations have been chosen to provide a sensor that can be used with confidence in applications, such as invasive blood pressure monitoring. It can be sterilized using ethylene oxide. The portions of the pressure sensor that are required to be biomedically approved are the rigid housing and the gel coating. The rigid housing is molded from a white, medical grade polysulfone that has passed extensive biological testing including: tissue culture test, rabbit implant, hemolysis, intracutaneous test in rabbits, and system toxicity, USP. The MPXC2011DT1 contains a silicone dielectric gel which covers the silicon piezoresistive sensing element. The gel is a nontoxic, nonallergenic elastomer system which meets all USP XX Biological Testing Class V requirements. The properties of the gel allow it to transmit pressure uni- formly to the diaphragm surface, while isolating the internal electrical connections from the corrosive effects of fluids, such as saline solution. The gel provides electrical isolation sufficient to withstand defibrillation testing, as specified in the proposed Association for the Advancement of Medical Instrumentation (AAMI) Standard for blood pressure trans- ducers. A biomedically approved opaque filler in the gel pre- vents bright operating room lights from affecting the performance of the sensor. The MPXC2012DT1 is a no–gel option. Preferred devices are Motorola recommended choices for future use and best overall value. /C0077/C0079/C0084/C0079/C0082/C0079/C0076/C0065 SEMICONDUCTOR TECHNICAL DATA /C0077/C0080/C0088/C0067/C0050/C0048/C0049/C0049/C0068/C0084/C0049 /C0077/C0080/C0088/C0067/C0050/C0048/C0049/C0050/C0068/C0084/C0049 PRESSURE SENSORS 0 to 75 mmHg (0 to 10 kPa) PIN NUMBER MPXC2011DT1/MPXC2012DT1 CASE 423A Gnd VS CHIP PAK PACKAGE Motorola Preferred Device REV 2 Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0080/C0088/C0067/C0050/C0048/C0049/C0049/C0068/C0084/C0049 /C0077/C0080/C0088/C0067/C0050/C0048/C0049/C0050/C0068/C0084/C0049 3–151Motorola Sensor Device Data www.motorola.com/semiconductors MAXIMUM RATINGS (NOTE) Rating Symbol Value Unit Maximum Pressure (Backside) Pmax 75 kPa Storage Temperature Tstg –25 to +85 °C Operating Temperature TA +15 to +40 °C NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device. OPERATING CHARACTERISTICS (VS = 10 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Characteristic Symbol Min Typ Max Unit Pressure Range(1) POP 0 — 10 kPa Supply Voltage(2) VS — 3 10 Vdc Supply Current Io — 6.0 — mAdc Full Scale Span(3) VFSS 24 25 26 mV Offset(4) Voff –1.0 — 1.0 mV Sensitivity ΔV/ΔP — 2.5 — mV/kPa Linearity(5) — –1.0 — 1.0 %V FSS Pressure Hysteresis(5) (0 to 10 kPa) — — ± 0.1 — %V FSS Temperature Hysteresis(5) (+15°C to +40°C) — — ± 0.1 — %V FSS Temperature Effect on Full Scale Span(5) TCV FSS –1.0 — 1.0 %V FSS Temperature Effect on Offset(5) TCV off –1.0 — 1.0 mV Input Impedance Zin 1300 — 2550 Ω Output Impedance Zout 1400 — 3000 Ω Response Time(6) (10% to 90%) tR — 1.0 — ms Warm–Up — — 20 — ms Offset Stability(7) — — ± 0.5 — %V FSS NOTES: 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self–heating. 3. Full Scale Span (VFSS ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following:

Linearity: Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C.
TcSpan: Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C.
TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0080/C0088/C0067/C0050/C0048/C0049/C0049/C0068/C0084/C0049 /C0077/C0080/C0088/C0067/C0050/C0048/C0049/C0050/C0068/C0084/C0049 3–152 Motorola Sensor Device Datawww.motorola.com/semiconductors The MPXC2011DT1/MPXC2012DT1 silicon pressure sensors are available in tape and reel. Device Type/Order No. Case No. Device Description Marking MPXC2011DT1 423A Chip Pak, 1/3 Gel Date Code, Lot ID MPXC2012DT1 423A Chip Pak, No Gel Date Code, Lot ID Packaging Information Reel Size Tape Width Quantity Tape and Reel 330 mm 24 mm 1000 pc/reel Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0080/C0088/C0072/C0054/C0051/C0048/C0048/C0065 /C0083/C0069/C0082/C0073/C0069/C0083 3–154 Motorola Sensor Device Datawww.motorola.com/semiconductors MAXIMUM RATINGS (1) Parametrics Symbol Value Units Maximum Pressure (P1 /C0117 P2) Pmax 1200 kPa Storage Temperature Tstg –40° to +125° °C Operating Temperature TA –40° to +125° °C Output Source Current @ Full Scale Output(2) Io+ 0.5 mAdc Output Sink Current @ Minimum Pressure Offset(2) Io– –0.5 mAdc NOTES: 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. 2. Maximum Output Current is controlled by effective impedance from Vout to Gnd or Vout to VS in the application circuit. OPERATING CHARACTERISTICS (VS = 5.1 Vdc, TA = 25°C unless otherwise noted, P1 /C0117 P2.) Characteristic Symbol Min Typ Max Unit Pressure Range POP 20 — 304 kPa Supply Voltage(1) VS 4.74 5.1 5.46 Vdc Supply Current Io — 6.0 10 mAdc Minimum Pressure Offset(2) (0 to 85°C) @ V S = 5.1 Volts Voff 0.241 0.306 0.371 Vdc Full Scale Output(3) (0 to 85°C) @ V S = 5.1 Volts VFSO 4.847 4.912 4.977 Vdc Full Scale Span(4) (0 to 85°C) @ V S = 5.1 Volts VFSS 4.476 4.606 4.736 Vdc Accuracy(5) (0 to 85°C) — — — ±1.5 %V FSS Sensitivity V/P — 16.2 — mV/kPa Response Time(6) tR — 1.0 — ms Warm–Up Time (7) — — 20 — ms Offset Stability(8) — — ± 0.25 — %V FSS NOTES: 1. Device is ratiometric within this specified excitation range. 2. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 3. Full Scale Output (VFSO ) is defined as the output voltage at the maximum or full rated pressure. 4. Full Scale Span (VFSS ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 5. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span at 25°C due to all sources of error including the following:

Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25°C.
TcSpan: Output deviation over the temperature range of 0 ° to 85°C, relative to 25°C.
TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative to 25°C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Warm–up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 8. Offset Stability is the product’s output deviation when subjected to 1000 cycles of Pulsed Pressure, Temperature Cycling with Bias Test. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

Super Small Outline chip carrier (Case 1317). are shown for operation over 0 to 85°C temperature range. The output will saturate outside of the rated pressure range. garding media compatibility in your application. Freescale Semiconductor, Inc.

/C0077/C0080/C0088/C0072/C0054/C0051/C0048/C0048/C0065 /C0083/C0069/C0082/C0073/C0069/C0083 3–156 Motorola Sensor Device Datawww.motorola.com/semiconductors Transfer Function (MPXH6300A) Nominal Transfer Value:Vout = VS x (0.00318 x P – 0.00353) ± (Pressure Error x Temp. Factor x 0.00318 x VS) VS = 5.1 ± 0.36 Vdc Temperature Error Band MPXH6300A Series Break Points Temp Multiplier – 40 3 0 to 85 1 125 3 Temperature in C° 4.0 3.0 2.0 0.0 1.0 –40 –20 0 20 40 60 14012010080 Temperature Error Factor NOTE: The Temperature Multiplier is a linear response from 0°C to –40°C and from 85°C to 125°C Pressure Error Band Error Limits for Pressure 3.0 2.0 1.0 –1.0 – 2.0 –4.0 0.0 Pressure Error (kPa) Pressure Error (Max) 20 to 304 (kPa) ± 4.0 (kPa) 60 100 4.0 – 3.0 140 180 220 260 300 ORDERING INFORMATION — SUPER SMALL OUTLINE PACKAGE Device Type Options Case No. MPX Series Order No. Packing Options Marking Basic Element Absolute, Element Only 1317 MPXH6300A6U Rails MPXH6300A Ported Element Absolute, Axial Port 1317A MPXH6300AC6U Rails MPXH6300A Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

Figure 5. SSOP Footprint (Case 1317 and 1317A) Freescale Semiconductor, Inc.

/C0077/C0080/C0088/C0077/C0050/C0048/C0049/C0048 /C0083/C0069/C0082/C0073/C0069/C0083 3–159Motorola Sensor Device Data www.motorola.com/semiconductors MAXIMUM RATINGS (NOTE) Rating Symbol Value Unit Maximum Pressure (P1 > P2) Pmax 75 kPa Storage Temperature Tstg –40 to +125 °C Operating Temperature TA –40 to +125 °C NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device. OPERATING CHARACTERISTICS (VS = 10 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Characteristic Symbol Min Typ Max Unit Pressure Range(1) POP 0 — 10 kPa Supply Voltage(2) VS — 10 16 Vdc Supply Current Io — 6.0 — mAdc Full Scale Span(3) VFSS 24 25 26 mV Offset(4) Voff –1.0 — 1.0 mV Sensitivity ΔV/ΔP — 2.5 — mV/kPa Linearity(5) — –1.0 — 1.0 %V FSS Pressure Hysteresis(5) (0 to 10 kPa) — — ± 0.1 — %V FSS Temperature Hysteresis(5) (–40°C to +125°C) — — ± 0.5 — %V FSS Temperature Effect on Full Scale Span(5) TCV FSS –1.0 — 1.0 %V FSS Temperature Effect on Offset(5) TCV off –1.0 — 1.0 mV Input Impedance Zin 1000 — 2550 Ω Output Impedance Zout 1400 — 3000 Ω Response Time(6) (10% to 90%) tR — 1.0 — ms Warm–Up — — 20 — ms Offset Stability(7) — — ± 0.5 — %V FSS NOTES: 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self–heating. 3. Full Scale Span (VFSS ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following:

Linearity: Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C.
TcSpan: Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C.
TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0080/C0088/C0077/C0050/C0048/C0053/C0051 /C0083/C0069/C0082/C0073/C0069/C0083 3–162 Motorola Sensor Device Datawww.motorola.com/semiconductors MAXIMUM RATINGS (NOTE) Rating Symbol Value Unit Maximum Pressure (P1 > P2) Pmax 200 kPa Storage Temperature Tstg –40 to +125 °C Operating Temperature TA –40 to +125 °C NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device. OPERATING CHARACTERISTICS (VS = 10 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Characteristic Symbol Min Typ Max Unit Pressure Range(1) POP 0 — 50 kPa Supply Voltage(2) VS — 10 16 Vdc Supply Current Io — 6.0 — mAdc Full Scale Span(3) VFSS 38.5 40 41.5 mV Offset(4) Voff –1.0 — 1.0 mV Sensitivity ΔV/ΔP — 0.8 — mV/kPa Linearity(5) — –0.6 — 0.4 %V FSS Pressure Hysteresis(5) (0 to 50 kPa) — — ± 0.1 — %V FSS Temperature Hysteresis(5) (–40°C to +125°C) — — ± 0.5 — %V FSS Temperature Effect on Full Scale Span(5) TCV FSS –2.0 — 2.0 %V FSS Temperature Effect on Offset(5) TCV off –1.0 — 1.0 mV Input Impedance Zin 1000 — 2500 Ω Output Impedance Zout 1400 — 3000 Ω Response Time(6) (10% to 90%) tR — 1.0 — ms Warm–Up — — 20 — ms Offset Stability(7) — — ± 0.5 — %V FSS NOTES: 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self–heating. 3. Full Scale Span (VFSS ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following:

Linearity: Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C.
TcSpan: Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C.
TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0080/C0088/C0077/C0050/C0048/C0053/C0051 /C0083/C0069/C0082/C0073/C0069/C0083 3–163Motorola Sensor Device Data www.motorola.com/semiconductors LINEARITY Linearity refers to how well a transducer’s output follows the equation: Vout = Voff + sensitivity x P over the operating pressure range. There are two basic methods for calculating nonlinearity: (1) end point straight line fit (see Figure 2) or (2) a least squares best line fit. While a least squares fit gives the “best case” linearity error (lower numerical value), the calculations required are burdensome. Conversely, an end point fit will give the “worst case” error (often more desirable in error budget calculations) and the cal- culations are more straightforward for the user. Motorola’s specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. Figure 2. Linearity Specification Comparison transmitted to the silicon diaphragm. Figure 3. Output versus Pressure Differential

20 MAX

Device Type Options Case NoDevice Type Options Case No . MPXM2053D Non–ported 1320 MPXM2053DT1 Non–ported, Tape and Reel 1320 MPXM2053GS Ported 1320A MPXM2053GST1 Ported, Tape and Reel 1320A Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0080/C0088/C0077/C0050/C0049/C0048/C0050 /C0083/C0069/C0082/C0073/C0069/C0083 3–165Motorola Sensor Device Data www.motorola.com/semiconductors MAXIMUM RATINGS (NOTE) Rating Symbol Value Unit Maximum Pressure (P1 > P2) Pmax 200 kPa Storage Temperature Tstg –40 to +125 °C Operating Temperature TA –40 to +125 °C NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device. OPERATING CHARACTERISTICS (VS = 10 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Characteristic Symbol Min Typ Max Unit Pressure Range(1) POP 0 — 100 kPa Supply Voltage(2) VS — 10 16 Vdc Supply Current Io — 6.0 — mAdc Full Scale Span(3) VFSS 38.5 40 41.5 mV Offset(4) MPXM2102D/G Series MPXM2102A Series Voff –1.0 –2.0 1.0 2.0 mV Sensitivity ΔV/ΔP — 0.4 — mV/kPa Linearity(5) MPXM2102D/G Series MPXM2102A Series –0.6 –1.0 0.4 1.0 %V FSS Pressure Hysteresis(5) (0 to 100 kPa) — — ± 0.1 — %V FSS Temperature Hysteresis(5) (–40°C to +125°C) — — ± 0.5 — %V FSS Temperature Effect on Full Scale Span(5) TCV FSS –2.0 — 2.0 %V FSS Temperature Effect on Offset(5) TCV off –1.0 — 1.0 mV Input Impedance Zin 1000 — 2500 Ω Output Impedance Zout 1400 — 3000 Ω Response Time(6) (10% to 90%) tR — 1.0 — ms Warm–Up — — 20 — ms Offset Stability(7) — — ± 0.5 — %V FSS NOTES: 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self–heating. 3. Full Scale Span (VFSS ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following:

Linearity: Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C.
TcSpan: Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C.
TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0080/C0088/C0077/C0050/C0050/C0048/C0050 /C0083/C0069/C0082/C0073/C0069/C0083 3–168 Motorola Sensor Device Datawww.motorola.com/semiconductors MAXIMUM RATINGS (NOTE) Rating Symbol Value Unit Maximum Pressure (P1 > P2) Pmax 400 kPa Storage Temperature Tstg –40 to +125 °C Operating Temperature TA –40 to +125 °C NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device. OPERATING CHARACTERISTICS (VS = 10 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Characteristic Symbol Min Typ Max Unit Pressure Range(1) POP 0 — 200 kPa Supply Voltage(2) VS — 10 16 Vdc Supply Current Io — 6.0 — mAdc Full Scale Span(3) VFSS 38.5 40 41.5 mV Offset(4) MPXM2202D/G Series MPXM2202A Series Voff –1.0 –2.0 1.0 2.0 mV Sensitivity ΔV/ΔP — 0.2 — mV/kPa Linearity(5) MPXM2202D/G Series MPXM2202A Series –0.6 –1.0 0.4 1.0 %V FSS Pressure Hysteresis(5) (0 to 100 kPa) — — ± 0.1 — %V FSS Temperature Hysteresis(5) (–40°C to +125°C) — — ± 0.5 — %V FSS Temperature Effect on Full Scale Span(5) TCV FSS –2.0 — 2.0 %V FSS Temperature Effect on Offset(5) TCV off –1.0 — 1.0 mV Input Impedance Zin 1000 — 2500 Ω Output Impedance Zout 1400 — 3000 Ω Response Time(6) (10% to 90%) tR — 1.0 — ms Warm–Up — — 20 — ms Offset Stability(7) — — ± 0.5 — %V FSS NOTES: 1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self–heating. 3. Full Scale Span (VFSS ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following:

Linearity: Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C.
TcSpan: Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C.
TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

3–170 Motorola Sensor Device Datawww.motorola.com/semiconductors /C0073/C0110/C0116/C0101/C0103/C0114/C0097/C0116/C0101/C0100 /C0083/C0105/C0108/C0105/C0099/C0111/C0110 /C0080/C0114/C0101/C0115/C0115/C0117/C0114/C0101 /C0083/C0101/C0110/C0115/C0111/C0114 /C0079/C0110/C0045/C0067/C0104/C0105/C0112 /C0083/C0105/C0103/C0110/C0097/C0108 /C0067/C0111/C0110/C0100/C0105/C0116/C0105/C0111/C0110/C0101/C0100/C0044 /C0084/C0101/C0109/C0112/C0101/C0114/C0097/C0116/C0117/C0114/C0101 /C0067/C0111/C0109/C0112/C0101/C0110/C0115/C0097/C0116/C0101/C0100 /C0097/C0110/C0100 /C0067/C0097/C0108/C0105/C0098/C0114/C0097/C0116/C0101/C0100 The MPXV4006G series piezoresistive transducer is a state–of–the–art monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This sensor combines a highly sensitive implanted strain gauge with advanced micromachining techniques, thin–film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure.

Temperature Compensated over 10° to 60°C
Ideally Suited for Microprocessor or Microcontroller– Based Systems
Available in Gauge Surface Mount (SMT) or Through– hole (DIP) Configurations
Durable Thermoplastic (PPS) Package

Freescale Semiconductor, Inc.

/C0077/C0080/C0088/C0086/C0052/C0048/C0048/C0054/C0071 /C0083/C0069/C0082/C0073/C0069/C0083 3–171Motorola Sensor Device Data www.motorola.com/semiconductors MAXIMUM RATINGS (NOTE) Parametrics Symbol Value Unit Maximum Pressure (P1 > P2) Pmax 24 kPa Storage Temperature Tstg –30 to +100 °C Operating Temperature TA +10 to +60 °C NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device. OPERATING CHARACTERISTICS (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 3 required to meet electrical specifications.) Characteristic Symbol Min Typ Max Unit Pressure Range POP 0 — 6.0 kPa Supply Voltage(1) VS 4.75 5.0 5.25 Vdc Supply Current IS — — 10 mAdc Full Scale Span(2) (RL = 51kΩ ) VFSS — 4.6 — V Offset(3)(5) (RL = 51kΩ ) Voff 0.100 0.225 0.430 V Sensitivity V/P — 766 — mV/kPa Accuracy(4)(5) (10 to 60°C) — — — ± 5.0 %V FSS NOTES: 1. Device is ratiometric within this specified excitation range. 2. Full Scale Span (VFSS ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Accuracy (error budget) consists of the following:

Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C.
Offset Stability: Output deviation, after 1000 temperature cycles, /C004230 to 100°C, and 1.5 million pressure cycles, with minimum rated pressure applied.
TcSpan: Output deviation over the temperature range of 10 to 60 °C, relative to 25°C.
TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 10 to 60°C, relative to 25°C.
Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS , at 25°C. 5. Auto Zero at Factory Installation: Due to the sensitivity of the MPXV4006G, external mechanical stresses and mounting position can affect the zero pressure output reading. To obtain the 5% FSS accuracy, the device output must be “autozeroed’’ after installation. Autozeroing is defined as storing the zero pressure output reading and subtracting this from the device’s output during normal operations. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0080/C0088/C0086/C0052/C0048/C0048/C0054/C0071 /C0083/C0069/C0082/C0073/C0069/C0083 3–173Motorola Sensor Device Data www.motorola.com/semiconductors PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing silicone gel which isolates the die from the environment. The Motorola pres- sure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below: Part Number Case Type Pressure (P1) Side Identifier MPXV4006G6U/T1 482 Stainless Steel Cap MPXV4006GC6U/T1 482A Side with Port Attached MPXV4006G7U 482B Stainless Steel Cap MPXV4006GC7U 482C Side with Port Attached MPXV4006GP 1369 Side with Port Attached MPXV4006DP 1351 Side with Part Marking MPXV4006G series pressure sensors are available in the basic element package or with pressure ports. Two packing options are offered for the 482 and 482A case configurations. Device Type Options Case No. MPX Series Order No. Packing Options Marking Basic Element Element Only 482 MPXV4006G6U Rails MPXV4006G Element Only 482 MPXV4006G6T1 Tape and Reel MPXV4006G Element Only 482 MPXV4006G7U Rails MPXV4006G Ported Element Axial Port 482A MPXV4006GC6U Rails MPXV4006G Axial Port 482A MPXV4006GC6T1 Tape and Reel MPXV4006G Axial Port 482A MPXV4006GC7U Rails MPXV4006G Side Port 1369 MPXV4006GP Trays MPXV4006G Dual Port 1351 MPXV4006DP Trays MPXV4006G MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection inter- face between the board and the package. With the correct footprint, the packages will self align when subjected to a sol- der reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and short- ing between solder pads. 0.660 16.76 1.52 2.54 2.54 0.300 7.62 Freescale Semiconductor, Inc.

3–174 Motorola Sensor Device Datawww.motorola.com/semiconductors /C0073/C0110/C0116/C0101/C0103/C0114/C0097/C0116/C0101/C0100 /C0083/C0105/C0108/C0105/C0099/C0111/C0110 /C0080/C0114/C0101/C0115/C0115/C0117/C0114/C0101 /C0083/C0101/C0110/C0115/C0111/C0114 /C0079/C0110/C0045/C0067/C0104/C0105/C0112/C0083/C0105/C0103/C0110/C0097/C0108 /C0067/C0111/C0110/C0100/C0105/C0116/C0105/C0111/C0110/C0101/C0100/C0044 /C0084/C0101/C0109/C0112/C0101/C0114/C0097/C0116/C0117/C0114/C0101 /C0067/C0111/C0109/C0112/C0101/C0110/C0115/C0097/C0116/C0101/C0100 /C0097/C0110/C0100 /C0067/C0097/C0108/C0105/C0098/C0114/C0097/C0116/C0101/C0100 The MPXV4115V series piezoresistive transducer is a state–of–the–art monolithic silicon pressure sensor designed for a wide range of applications, particularly those employing a microcontroller with A/D inputs. This transducer combines advanced micromachining techniques, thin–film metallization and bipolar processing to provide an accurate, high–level analog output signal that is proportional to the applied pressure/vac- uum. The small form factor and high reliability of on–chip integration make the Motorola sensor a logical and economical choice for the automotive system designer. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.

1.5 % Maximum error over 0° to 85°C
Temperature Compensated from –40° + 125°C
Ideally Suited for Microprocessor or Microcontroller–Based Systems
Durable Thermoplastic (PPS) Surface Mount Package Application Examples
Vacuum Pump Monitoring
Brake Booster Monitoring

8 N/C

connect to external circuitry or ground. Pin 1 is noted by the notch in the lead. Freescale Semiconductor, Inc.

/C0077/C0080/C0088/C0086/C0052/C0049/C0049/C0053/C0086 /C0083/C0069/C0082/C0073/C0069/C0083 3–175Motorola Sensor Device Data www.motorola.com/semiconductors MAXIMUM RATINGS (NOTE) Parametrics Symbol Value Unit Maximum Pressure Pmax 400 kPa Storage Temperature Tstg –40 to + 125 °C Operating Temperature TA –40 to + 125 °C NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device. OPERATING CHARACTERISTICS (VS = 5 Vdc, TA = 25° C unless otherwise noted. Decoupling circuit shown in Figure 3 required to meet electrical specifications.) Characteristic Symbol Min Typ Max Unit Pressure Range (Differential mode, Vacuum on metal cap side, Atmo- spheric pressure on back side) POP –115 — 0 kPa Supply Voltage(1) VS 4.75 5 5.25 Vdc Supply Current Io — 6.0 10 mAdc Full Scale Output (2) (0 to 85° C) (Pdiff = 0 kPa) 2 VFSO 4.535 4.6 4.665 Vdc Full Scale Span (3) (0 to 85° C) @Vs = 5.0 V VFSS 4.4 Vdc Accuracy (4) (0 to 85° C) — — 1.5% %V FSS Sensitivity V/P — 38.26 — mV/kPa Response Time (5) tR — 1.0 — ms Output Source Current at Full Scale Output Io — 0.1 — mAdc Warm–Up Time (6) — — 20 — ms Offset Stability (7) — ± 0.5 — %V FSS NOTES: 1. Device is ratiometric within the specified excitation voltage range. 2. Full–scale output is defined as the output voltage at the maximum or full–rated pressure. 3. Full–scale span is defined as the algebraic difference between the output voltage at full–rated pressure and the output voltage at the mini- mum–rated pressure. 4. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span at 25° C due to all sources of errors, including the following:

Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25°C.
TcSpan: Output deviation over the temperature range of 0 ° to 85°C, relative to 25°C.
TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative to 25°C. 5. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 6. Warm–up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 7. Offset Stability is the product’s output deviation when subjected to 1000 cycles of Pulsed Pressure, Temperature Cycling with Bias Test. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0080/C0088/C0086/C0052/C0049/C0049/C0053/C0086 /C0083/C0069/C0082/C0073/C0069/C0083 3–177Motorola Sensor Device Data www.motorola.com/semiconductors The MPXV4115V series pressure sensors are available in the basic element package or with a pressure port. Two packing options are also offered. Device Type Case No Packing Options Device MarkingDevice Type Case No . Packing Options Device Marking MPXV4115V6U 482 Rails MPXV4115V MPXV4115V6T1 482 Tape and Reel MPXV4115V MPXV4115VC6U 482A Rails MPXV4115V MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection inter- face between the board and the package. With the correct fottprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and short- ing between solder pads. 0.660 16.76 1.52 2.54 2.54 0.300 7.62 Freescale Semiconductor, Inc.

/C0077/C0080/C0088/C0086/C0052/C0049/C0049/C0053/C0086 /C0083/C0069/C0082/C0073/C0069/C0083 3–178 Motorola Sensor Device Datawww.motorola.com/semiconductors Transfer Function Nominal Transfer Value:Vout = VS (P x 0.007652 ) /C0041 0.92) +/– (Pressure Error x Temp. Factor x 0.007652 x VS) VS = 5 V ± 0.25 Vdc Temperature Error Band Temp Multiplier – 40 3 0 to 85 1 +125 3 Temperature in C° 4.0 3.0 2.0 0.0 1.0 –40 –20 0 20 40 60 14012010080 MPXV4115V Series Temperature Error Factor Pressure Error Band Pressure in kPa (below atmospheric) Pressure Error (Max) 1.950 1.725 1.500 –1.500 – 1.725 – 1.950 Pressure Error (kPa) NOTE: The Temperature Multiplier is a linear response from 0° to –40°C and from 85° to 125°C. –115 to 0 kPa /C00341.725 (kPa) Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

3–179Motorola Sensor Device Data www.motorola.com/semiconductors /C0073/C0110/C0116/C0101/C0103/C0114/C0097/C0116/C0101/C0100 /C0083/C0105/C0108/C0105/C0099/C0111/C0110 /C0080/C0114/C0101/C0115/C0115/C0117/C0114/C0101 /C0083/C0101/C0110/C0115/C0111/C0114 /C0079/C0110/C0045/C0067/C0104/C0105/C0112 /C0083/C0105/C0103/C0110/C0097/C0108 /C0067/C0111/C0110/C0100/C0105/C0116/C0105/C0111/C0110/C0101/C0100/C0044 /C0084/C0101/C0109/C0112/C0101/C0114/C0097/C0116/C0117/C0114/C0101 /C0067/C0111/C0109/C0112/C0101/C0110/C0115/C0097/C0116/C0101/C0100 /C0097/C0110/C0100 /C0067/C0097/C0108/C0105/C0098/C0114/C0097/C0116/C0101/C0100 The MPXV5004G series piezoresistive transducer is a state–of–the–art monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This sensor combines a highly sensitive implanted strain gauge with advanced micromachining techniques, thin–film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure.

Temperature Compensated over 10° to 60°C
Available in Gauge Surface Mount (SMT) or Through– hole (DIP) Configurations
Durable Thermoplastic (PPS) Package Application Examples
Washing Machine Water Level
Ideally Suited for Microprocessor or Microcontroller– Based Systems

Freescale Semiconductor, Inc.

/C0077/C0080/C0088/C0086/C0053/C0048/C0048/C0052/C0071 /C0083/C0069/C0082/C0073/C0069/C0083 3–180 Motorola Sensor Device Datawww.motorola.com/semiconductors MAXIMUM RATINGS (NOTE) Parametrics Symbol Value Unit Maximum Pressure (P1 > P2) Pmax 16 kPa Storage Temperature Tstg –30 to +100 °C Operating Temperature TA 0 to +85 °C NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device. OPERATING CHARACTERISTICS (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 3 required to meet electrical specifications) Characteristic Symbol Min Typ Max Unit Pressure Range POP 0 — 3.92 400 kPa mm H 2O Supply Voltage(1) VS 4.75 5.0 5.25 Vdc Supply Current IS — — 10 mAdc Span at 306 mm H2O (3 kPa)(2) VFSS — 3.0 — V Offset(3)(5) Voff 0.75 1.00 1.25 V Sensitivity V/P — 1.0 9.8 — V/kPa mV/mm H 2O Accuracy(4)(5) 0 to 100 mm H2O (10 to 60 °C) 100 to 400 mm H2O (10 to 60 °C) — — — ± 1.5 ± 2.5 %V FSS %V FSS NOTES: 1. Device is ratiometric within this specified excitation range. 2. Span is defined as the algebraic difference between the output voltage at specified pressure and the output voltage at the minimum rated pressure. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Accuracy (error budget) consists of the following:

Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C.
Offset Stability: Output deviation, after 1000 temperature cycles, /C004230 to 100°C, and 1.5 million pressure cycles, with minimum rated pressure applied.
TcSpan: Output deviation over the temperature range of 10 to 60 °C, relative to 25°C.
TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 10 to 60°C, relative to 25°C.
Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS , at 25°C. 5. Auto Zero at Factory Installation: Due to the sensitivity of the MPXV5004G, external mechanical stresses and mounting position can affect the zero pressure output reading. Autozeroing is defined as storing the zero pressure output reading and subtracting this from the device’s output during normal operations. Reference AN1636 for specific information. The specified accuracy assumes a maximum temperature change of ± 5° C between autozero and measurement. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0080/C0088/C0086/C0053/C0048/C0048/C0052/C0071 /C0083/C0069/C0082/C0073/C0069/C0083 3–182 Motorola Sensor Device Datawww.motorola.com/semiconductors PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Motorola designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing silicone gel which isolates the die from the environment. The Motorola pressure sensor is designed to operate with positive differential pres- sure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below: Part Number Case Type Pressure (P1) Side Identifier MPXV5004GC6U/T1 482A Side with Port Attached MPXV5004G6U/T1 482 Stainless Steel Cap MPXV5004GC7U 482C Side with Port Attached MPXV5004G7U 482B Stainless Steel Cap MPXV5004GP 1369 Side with Port Attached MPXV5004DP 1351 Side with Port Marking MPXV5004GVP 1368 Stainless Steel Cap MPXV5004G series pressure sensors are available in the basic element package or with a pressure port. Two packing options are offered for the surface mount configuration. Device Type / Order No Case No Packing Options Device MarkingDevice Type / Order No . Case No . Packing Options Device Marking MPXV5004G6U 482 Rails MPXV5004G MPXV5004G6T1 482 Tape and Reel MPXV5004G MPXV5004GC6U 482A Rails MPXV5004G MPXV5004GC6T1 482A Tape and Reel MPXV5004G MPXV5004GC7U 482C Rails MPXV5004G MPXV5004G7U 482B Rails MPXV5004G MPXV5004GP 1369 Trays MPXV5004G MPXV5004DP 1351 Trays MPXV5004G MPXV5004GVP 1368 Trays MPXV5004G INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482) MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection inter- face between the board and the package. With the correct fottprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and short- ing between solder pads. 0.660 16.76 1.52 2.54 2.54 0.300 7.62 Freescale Semiconductor, Inc.

3–183Motorola Sensor Device Data www.motorola.com/semiconductors /C0072/C0105/C0103/C0104 /C0084/C0101/C0109/C0112/C0101/C0114/C0097/C0116/C0117/C0114/C0101 /C0065/C0099/C0099/C0117/C0114/C0097/C0099/C0121 /C0073/C0110/C0116/C0101/C0103/C0114/C0097/C0116/C0101/C0100 /C0083/C0105/C0108/C0105/C0099/C0111/C0110 /C0080/C0114/C0101/C0115/C0115/C0117/C0114/C0101 /C0083/C0101/C0110/C0115/C0111/C0114 /C0079/C0110/C0045/C0067/C0104/C0105/C0112 /C0083/C0105/C0103/C0110/C0097/C0108 /C0067/C0111/C0110/C0100/C0105/C0116/C0105/C0111/C0110/C0101/C0100/C0044 /C0084/C0101/C0109/C0112/C0101/C0114/C0097/C0116/C0117/C0114/C0101 /C0067/C0111/C0109/C0112/C0101/C0110/C0115/C0097/C0116/C0101/C0100 /C0097/C0110/C0100 /C0067/C0097/C0108/C0105/C0098/C0114/C0097/C0116/C0101/C0100 Motorola’s MPXV6115VC6U sensor integrates on–chip, bipolar op amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation. The small form factor and high reliability of on–chip integration make the Motorola pressure sensor a logical and economical choice for the system designer. The MPXV6115VC6U piezoresistive transducer is a state–of–the–art, monolithic, signal conditioned, silicon pressure sensor. This sensor combines advanced micromachining techniques, thin film metallization, and bipolar semi- conductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.

Improved Accuracy at High Temperature
1.5% Maximum Error over 0° to 85°C
Ideally suited for Microprocessor or Microcontroller–Based Systems
Temperature Compensated from –40° to +125°C
Durable Thermoplastic (PPS) Surface Mount Package Application Examples
Vacuum Pump Monitoring
Brake Booster Monitoring

Freescale Semiconductor, Inc.

/C0077/C0080/C0088/C0086/C0054/C0049/C0049/C0053/C0086/C0067/C0054/C0085 3–184 Motorola Sensor Device Datawww.motorola.com/semiconductors MAXIMUM RATINGS (1) Parametrics Symbol Value Units Maximum Pressure (P1 /C0117 P2) Pmax 400 kPa Storage Temperature Tstg –40° to +125° °C Operating Temperature TA –40° to +125° °C Output Source Current @ Full Scale Output(2) Io+ 0.5 mAdc Output Sink Current @ Minimum Pressure Offset(2) Io– –0.5 mAdc NOTES: 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. 2. Maximum Output Current is controlled by effective impedance from Vout to Gnd or Vout to VS in the application circuit. OPERATING CHARACTERISTICS (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 /C0117 P2.) Characteristic Symbol Min Typ Max Unit Pressure Range POP –115 — 0 kPa Supply Voltage(1) VS 4.75 5.0 5.25 Vdc Supply Current Io — 6.0 10 mAdc Full Scale Output(2) (0 to 85°C) @ V S = 5.0 Volts (P diff = 0 kPa) VFSO 4.534 4.6 4.665 Vdc Full Scale Span(3) (0 to 85°C) @ V S = 5.0 Volts VFSS — 4.4 — Vdc Accuracy(4) (0 to 85°C) — — — ±1.5 %V FSS Sensitivity V/P — 38.26 — mV/kPa Response Time(5) tR — 1.0 — ms Warm–Up Time (6) — — 20 — ms Offset Stability(7) — — ± 0.5 — %V FSS NOTES: 1. Device is ratiometric within this specified excitation range. 2. Full Scale Output (VFSO ) is defined as the output voltage at the maximum or full rated pressure. 3. Full Scale Span (VFSS ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span at 25°C due to all sources of error including the following:

Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25°C.
TcSpan: Output deviation over the temperature range of 0 ° to 85°C, relative to 25°C.
TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative to 25°C. 5. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 6. Warm–up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 7. Offset Stability is the product’s output deviation when subjected to 1000 cycles of Pulsed Pressure, Temperature Cycling with Bias Test. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

Small Outline chip carrier (Case 482). are shown for operation over 0 to 85°C temperature range. The output will saturate outside of the rated pressure range. dia compatibility in your application. Freescale Semiconductor, Inc.

/C0077/C0080/C0088/C0086/C0054/C0049/C0049/C0053/C0086/C0067/C0054/C0085 3–186 Motorola Sensor Device Datawww.motorola.com/semiconductors Transfer Function (MPXV6115VC6U) Nominal Transfer Value:Vout = VS x (0.007652 x P + 0.92) ± (Pressure Error x Temp. Factor x 0.007652 x VS) VS = 5.0 ± 0.25 Vdc Temperature Error Band MPXV6115VC6U Break Points Temp Multiplier – 40 3 0 to 85 1 125 2 Temperature in C° 4.0 3.0 2.0 0.0 1.0 –40 –20 0 20 40 60 14012010080 Temperature Error Factor NOTE: The Temperature Multiplier is a linear response from 0°C to –40°C and from 85°C to 125°C Pressure Error Band –85 –60 –45 –30 –15–115 –100 0 Pressure in kPa (below atmospheric) Pressure Error (Max) 1.950 1.725 1.500 –1.500 – 1.725 – 1.950 Pressure Error (kPa) –115 to 0 kPa /C00341.725 (kPa) Error Limits for Pressure ORDERING INFORMATION — SMALL OUTLINE PACKAGE Device Type Options Case No. MPX Series Order No. Packing Options Marking Ported Element Vacuum, Axial Port 482A MPXV6115VC6U Rails MPXV6115V Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

Figure 5. SOP Footprint (Case 482A) Freescale Semiconductor, Inc.

3–188 Motorola Sensor Device Datawww.motorola.com/semiconductors /C0065/C0078/C0057/C0051/C0053 /C0067/C0111/C0109/C0112/C0101/C0110/C0115/C0097/C0116/C0105/C0110/C0103 /C0102/C0111/C0114 /C0078/C0111/C0110/C0108/C0105/C0110/C0101/C0097/C0114/C0105/C0116/C0121 /C0105/C0110 /C0116/C0104/C0101 /C0077/C0080/C0088/C0049/C0048 /C0083/C0101/C0114/C0105/C0101/C0115 /C0080/C0114/C0101/C0115/C0115/C0117/C0114/C0101 /C0084/C0114/C0097/C0110/C0115/C0100/C0117/C0099/C0101/C0114 Prepared by: Carl Demington Design Engineering INTRODUCTION This application note describes a technique to improve the linearity of Motorola’s MPX10 series (i.e., MPX10, MPXV10, and MPX12 pressure sensors) pressure transducers when they are interfaced to a microprocessor system. The linearization technique allows the user to obtain both high sensitivity and good linearity in a cost effective system. The MPX10, MPXV10 and MPX12 pressure transducers are semiconductor devices which give an electrical output signal proportional to the applied pressure over the pressure range of 0–10 kPa (0–75 mm Hg). These devices use a unique transverse voltage–diffused silicon strain–gauge which is sensitive to stress produced by pressure applied to a thin silicon diaphragm. One of the primary considerations when using a pressure transducer is the linearity of the transfer function, since this parameter has a direct effect on the total accuracy of the system, and compensating for nonlinearities with peripheral circuits is extremely complicated and expensive. The purpose of this document is to outline the causes of nonlinearity, the trade–offs that can be made for increased system accuracy, and a relatively simple technique that can be utilized to maintain system performance, as well as system accuracy. ORIGINS OF NONLINEARITY Nonlinearity in semiconductor strain–gauges is a topic that has been the target of many experiments and much discussion. Parameters such as resistor size and orientation, surface impurity levels, oxide passivation thickness and growth temperatures, diaphragm size and thickness are all contributors to nonlinear behavior in silicon pressure transducers. The Motorola X–ducer was designed to minimize these effects. This goal was certainly accomplished in the MPX2000 series which have a maximum nonlinearity of 0.1% FS. However, to obtain the higher sensitivity of the MPX10 series, a maximum nonlinearity of ±1% FS has to be allowed. The primary cause of the additional nonlinearity in the MPX10 series is due to the stress induced in the diaphragm by applied pressure being no longer linear. One of the basic assumptions in using semiconductor strain–gauges as pressure sensors is that the deflection of the diaphragm when pressure is applied is small compared to the thickness of the diaphragm. With devices that are very sensitive in the low pressure ranges, this assumption is no longer valid. The deflection of the diaphragm is a considerable percentage of the diaphragm thickness, especially in devices with higher sensitivities (thinner diaphragms). The resulting stresses do not vary linearly with applied pressure. This behavior can be reduced somewhat by increasing the area of the diaphragm and consequently thickening the diaphragm. Due to the constraint, the device is required to have high sensitivity over a fairly small pressure range, and the nonlinearity cannot be eliminated. Much care was given in the design of the MPX10 series to minimize the nonlinear behavior. However, for systems which require greater accuracy, external techniques must be used to account for this behavior. PERFORMANCE OF AN MPX DEVICE The output versus pressure of a typical MPX12 along with an end–point straight line is shown in Figure 1. All nonlinearity errors are referenced to the end–point straight line (see data sheet). Notice there is an appreciable deviation from the end–point straight line at midscale pressure. This shape of curve is consistent with MPX10 and MPXV10, as well as MPX12 devices, with the differences between the parts being the magnitude of the deviation from the end–point line. The major tradeoff that can be made in the total device performance is sensitivity versus linearity. Figure 2 shows the relationship between full scale span and nonlinearity error for the MPX10 series of devices. The data shows the primary contribution to nonlinearity is nonproportional stress with pressure, while assembly and packaging stress (scatter of the data about the line) is fairly small and well controlled. It can be seen that relatively good accuracies (<0.5% FS) can be achieved at the expense of reduced sensitivity, and for high sensitivity the nonlinearity errors increase rapidly. The data shown in Figure 2 was taken at room temperature with a constant voltage excitation of 3.0 volts. /C0077/C0079/C0084/C0079/C0082/C0079/C0076/C0065 SEMICONDUCTOR APPLICATION NOTE REV 3 Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

equation [2] for the different techniques are given in Table 1. the full scale span of the particular pressure transducer. Figure 10. Linearity Error of Piece–Wise Linear Fit at 1/4 FS Table 1. Comparison of Linearization Methods Freescale Semiconductor, Inc.

/C0065/C0078/C0057/C0051/C0054 3–198 Motorola Sensor Device Datawww.motorola.com/semiconductors Electrical Connection The MPX series pressure sensor is designed to be installed on a printed circuit board (standard 0.100″lead spacing) or to accept an appropriate connector if installed on a baseplate. The leads of the sensor may be formed at right angles for assembly to the circuit board, but one must ensure that proper leadform techniques and tools are employed. Hand or “needlenose” pliers should never be used for leadforming unless they are specifically designed for that purpose. Refer to Figure 7 for the recommended leadform technique. It is also important that once the leads are formed, they should not be straightened and reformed without expecting reduced durability. The recommended connector for off–circuit board applications may be supplied by JST Corp. (1–800–292–4243) in Mount Prospect, IL. The part numbers for the housing and pins are listed below. CONCLUSION Motorola’s MPX series pressure sensors in the chip carrier package provide the design engineer several packaging alternatives. They can easily be tested with or without pressure ports using the information provided. CONNECTORS FOR CHIP CARRIER PACKAGES MFG./ADDRESS/PHONE CONNECTOR PIN J.S. Terminal Corp. 4 Pin Housing: SMP–04V–BC SHF–001T–0.8SS 1200 Business Center Dr. 6 Pin Housing: SMP–06V–BC SHF–01T–0.8SS Mount Prospect, IL 60056 (800) 292–4243 Hand crimper YC–12 recommended Methode Electronics, Inc. 1300–004 1400–213 Rolling Meadows, IL 60008 1402–213 (312) 392–3500 Requires hand crimper 1402–214 Reel TERMINAL BLOCKS Molex 22–18–2043

2222 Wellington Court 22–16–2041

Lisle, IL 60532 (312) 969–4550 P.O. Box 1147 SSW–104–02–G–S New Albany, IN 47150 (812) 944–6733 Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

0.002 TOTAL

1.25 Ref

Figure 8. O–Ring Test Fixture Freescale Semiconductor, Inc.

3–200 Motorola Sensor Device Datawww.motorola.com/semiconductors /C0065/C0078/C0049/C0048/C0056/C0050 /C0083/C0105/C0109/C0112/C0108/C0101 /C0068/C0101/C0115/C0105/C0103/C0110 /C0102/C0111/C0114 /C0097 /C0052/C0045/C0050/C0048 /C0109/C0065 /C0084/C0114/C0097/C0110/C0115/C0109/C0105/C0116/C0116/C0101/C0114 /C0073/C0110/C0116/C0101/C0114/C0102/C0097/C0099/C0101 /C0085/C0115/C0105/C0110/C0103 /C0097 /C0077/C0111/C0116/C0111/C0114/C0111/C0108/C0097 /C0080/C0114/C0101/C0115/C0115/C0117/C0114/C0101 /C0083/C0101/C0110/C0115/C0111/C0114 Prepared by: Jean Claude Hamelain Motorola Toulouse Application Lab Manager INTRODUCTION Pressure is a very important parameter in most industrial applications such as air conditioning, liquid level sensing and flow control. In most cases, the sensor is located close to the measured source in a very noisy environment, far away from the receiver (recorder, computer, automatic controller, etc.) The transmission line can be as long as a few hundred meters and is subject to electromagnetic noise when the signal is transmitted as voltage. If the signal is transmitted as a current it is easier to recover at the receiving end and is less affected by the length of the transmission line. The purpose of this note is to describe a simple circuit which can achieve high performance, using standard Motorola pressure sensors, operational amplifiers and discrete devices. PERFORMANCES The following performances have been achieved using an MPXV2102DP Motorola pressure sensor and an MC33079 quad operational amplifier. The MPXV2102DP is a 100 kPa temperature compensated differential pressure sensor. The load is a 150 ohm resistor at the end of a 50 meter telephone line. The 15 volt power supply is connected at the receiver end. Power Supply +15 Vdc, 30 mA Connecting Line 3 wire telephone cable Load Resistance 150 to 400 Ohms Temperature Range –40 to +85°C (up to +125°C with special hardware) Pressure Range 0 to 100 kPa Total Maximum Error Better than 2% full scale Basic Circuit The Motorola MPXV2102DP pressure sensor is a very high performance piezoresistive pressure sensor. Manufacturing technologies include standard bipolar processing techniques with state of the art metallization and on–chip laser trim for offset and temperature compensation. This unique design, coupled with computer laser trimming, gives this device excellent performance at competitive cost for demanding applications such as automotive, industrial or healthcare. MC33078, 79 operational amplifiers are specially designed for very low input voltage, a high output voltage swing and very good stability versus temperature changes. First Stage The Motorola MPXV2102 and the operational amplifier are directly powered by the 15 Vdc source. The first stage is a simple true differential amplifier made with both of the operational amplifiers in the MC33078. The potentiometer, R G , provides adjustment for the output. Current Generator The voltage to current conversion is made with a unity gain differential amplifier, one of the four operational amplifiers in an MC33079. The two output connections from the first stage are connected to the input of this amplifier through R3 and R5. Good linearity is achieved by the matching between R3, R4, R5 and R6, providing a good common mode rejection. For the same reason, a good match between resistors R8 and R9 is needed. The MC33078 or MC33079 has a limited current output; therefore, a 2N2222 general purpose transistor is connected as the actual output current source to provide a 20 mA output. To achieve good performance with a very long transmission line it may be necessary to place some capacitors (C1, C2) between the power supply and output to prevent oscillations. Calibration The circuit is electrically connected to the 15 Vdc power supply and to the load resistor (receiver). The high pressure is connected to the pressure port and the low pressure (if using a differential pressure sensor), is connected to the vacuum port. It is important to perform the calibration with the actual transmission line connected. The circuit needs only two adjustments to achieve the 4–20 mA output current. 1. With no pressure (zero differential pressure), adjust Roff to read exactly 4 mA on the receiver. 2. Under the full scale pressure, adjust RG to exactly read 20 mA on the receiver. The calibration is now complete. /C0077/C0079/C0084/C0079/C0082/C0079/C0076/C0065 SEMICONDUCTOR APPLICATION NOTE REV 2 Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

Figure 1. Demo Kit with 4–20 mA Current Loop VOLTAGE. THE OUTPUT WILL CHANGE WITH THE SAME RATIO AS VOLTAGE CHANGE. pressure with 14 V power supply. chosen for high temperatures up to 125°C. Motorola product for evaluation. Freescale Semiconductor, Inc.

full scale output, offset, and temperature compensation. of measurement which should facilitate the life of the designer. an accurate and reliable pressure measurement system. or 20 mV at the excitation voltage of 5.0 Vdc. where the signal is conditioned in a different way. Figure 1. Seven Laser–Trimmed Resistors and Two don’t allow the unit–to–unit replacement of devices or modules. affected by inaccuracy in the region 0 kPa thru 40 kPa. inherent offset voltage of the pressure sensor. Freescale Semiconductor, Inc.

Figure 5. Instrument Amplifier Transfer Function with

5 Vdc

Figure 6. Input Offset Voltage versus Temperature compensation network circuit. Figure 7. Input Bias Current versus Temperature Figure 8. Crossing of the Instrument Amplifier converts the output signals V1, V2. Four conversions are necessary to compute the final result. Freescale Semiconductor, Inc.

relatively simple and uses standard components. used by the microprocessor as shown in Figure 1. would require an A/D with at least 12 bits ( 212 = 4096 steps). where Papp is the pressure applied to the sensor. D/A, for an 8–bit D/A with same references, will be 2783 mV. This is greater than the 0.1 kPa resolution requirement. Figure 1. Block Diagram Freescale Semiconductor, Inc.

Figure 4. Second Stage — Difference Amplifier and Gain between Vm, and the digitized/calculated voltage Vc. where G3 is the gain associated with amplifiers A3 and A4. stability, which can be self–calibrated by the microprocessor. therefore, PVexpanded /C0043V expanded/C0324S. using inexpensive microprocessors and converters. Freescale Semiconductor, Inc.

performance is not affected by a long transmission line.

24 VDC

Figure 1. System Block Diagram Freescale Semiconductor, Inc.

terminals on the evaluation board and the power supply/load. Figure 2. Schematic Diagram full scale output span, the input voltage span must be defined. Freescale Semiconductor, Inc.

Table 1. Parts List for 4–20 mA Pressure Transducer Evaluation Board

100 V Diode

6.4 V Zener

1 A 1N4002

100 KΩ , one turn

of 10% unless otherwise noted. Freescale Semiconductor, Inc.

considerations are presented here. Figure 1. DEVB129 MPX5100 Bar Graph Pressure Gauge Freescale Semiconductor, Inc.

/C0065/C0078/C0049/C0051/C0048/C0052 3–215Motorola Sensor Device Data www.motorola.com/semiconductors EVALUATION BOARD DESCRIPTION A summary of the information required to use evaluation board number DEVB129 is presented as follows. A discussion of the design appears under the heading Design Considerations. FUNCTION The evaluation board shown in Figure 1 is designed to provide a 100 kPa full scale pressure measurement. It has two input ports. P1, the pressure port is on the top side of the MPX5100 sensor, and P2, a vacuum port, is on the bottom side. These ports can be supplied up to 100 kPa (15 psi)* of pressure on P1 or up to 100 kPa of vacuum on P2, or a differential pressure up to 100 kPa between P1 and P2. Any of these sources will produce the same output. The primary output is a 10 segment LED bar graph, which is labeled in increments of 10 kPa. If full scale pressure is adjusted for a value other than 100 kPa the bar graph may be read as a percent of full scale. An analog output is also provided. It nominally supplies 0.5 volts at zero pressure and 4.5 volts at 100 kPa. Zero and full scale adjustments are made with potentiometers so labeled at the bottom of the board. Both adjustments are independent of each other.

ELECTRICAL CHARACTERISTICS

The following electrical characteristics are included to describe evaluation board operation. They are not specifications in the usual sense and are intended only as a guide to operation. Characteristic Symbol Min Typ Max Units Power Supply Voltage B+ 6.8 — 13.2 Volts Full Scale Pressure PFS — — 100 kPa Overpressure PMAX — — 700 kPa Analog Full Scale VFS — 4.5 — Volts Analog Zero Pressure Offset VOFF — 0.5 — Volts Analog Sensitivity SAOUT — 40 — mV/kPa Quiescent Current ICC — 20 — mA Full Scale Current IFS — 140 — mA CONTENT Board contents are described in the following parts list, schematic, and silk screen plot. A pin by pin circuit description follows in the next section. PIN–BY–PIN DESCRIPTION B+: Input power is supplied at the B+ terminal. Minimum input voltage is 6.8 volts and maximum is 13.2 volts. The upper limit is based upon power dissipation in the LM3914 assuming all 10 LED’s are lit and ambient temperature is 25°C. The board will survive input transients up to 25 volts provided that power dissipation in the LM3914 does not exceed 1.3 watts. OUT: An analog output is supplied at the OUT terminal. The signal it provides is nominally 0.5 volts at zero pressure and 4.5 volts at 100 kPa. This output is capable of sourcing 100µA at full scale output. GND: There are two ground connections. The ground terminal on the left side of the board is intended for use as the power supply return. On the right side of the board, one of the test point terminals is also connected to ground. It provides a convenient place to connect instrumentation grounds. TP1: Test point 1 is connected to the zero pressure reference voltage and can be used for zero pressure calibration. To calibrate for zero pressure, this voltage is adjusted with R6 to match the zero pressure voltage that is measured at the analog output (OUT) terminal. TP2: Test point 2 performs a similar function at full scale. It is connected to the LM3914’s reference voltage which sets the trip point for the uppermost LED segment. This voltage is adjusted via R5 to set full scale pressure. P1, P2: Pressure and Vacuum ports P1 & P2 protrude from the MPX5100 sensor on the right side of the board. Pressure port P1 is on the top and vacuum port P2 is on the bottom. Neither is labeled. Either one or a differential pressure applied to both can be used to obtain full scale readings up to 100 kPa (15 psi). Maximum safe pressure is 700 kPa. * 100 kPa = 14.7 psi, 15 psi is used throughout the text for convenience Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

design is quite straight forward. signal to other control circuitry. Figure 2. MPX5100 Pressure Gauge Freescale Semiconductor, Inc.

/C0065/C0078/C0049/C0051/C0048/C0052 3–217Motorola Sensor Device Data www.motorola.com/semiconductors Figure 3. Silk Screen 2X Table 1. Parts List Note: All resistors have a tolerance of 5% unless otherwise noted. Note: All capacitors are 50 volt ceramic capacitors with a tolerance of 10% unless otherwise noted. Freescale Semiconductor, Inc.

Figure 4. LM3914 Block Diagram Freescale Semiconductor, Inc.

Figure 1. DEVB–114 MPX5100 Evaluation Module Freescale Semiconductor, Inc.

/C0065/C0078/C0049/C0051/C0048/C0053 3–220 Motorola Sensor Device Datawww.motorola.com/semiconductors PURPOSE This evaluation system, shown in Figure 1, demonstrates the ease of operation and interfacing of the Motorola MPX5100 series pressure sensors with on–chip temperature compensation, calibration and amplification. The board may be used to evaluate the sensor’s suitability for a specific application. The DEVB–114 evaluation board is constructed on a small printed circuit board. It is powered from a single +5 Vdc regulated power supply. The system will display the pressure applied to the MPX5100 sensor in pounds per square inch. The range is 0 PSI through 15 PSI, resolved to 0.1 PSI. No potentiometers are used in the system to adjust the span and offset. The sensor’s zero offset voltage with no pressure applied to the sensor is empirically computed each time power is applied to the system and stored in RAM. The sensitivity of the MPX5100 is repeatable from unit to unit. There is a facility for a small “rubbering” of the slope constant built into the program. It is accomplished with jumpers J1 and J2, and is explained in the Operation section. The board contents are further described in the schematic, silk screen plot, and parts list that appear in Figures 2, 3 and Table 1. BASIC CIRCUIT The evaluation board consists of three basic subsystems: an MPX5100GP pressure sensor, a four digit liquid crystal display (only three digits and a decimal are used) and a programmed microprocessor with the necessary external circuitry to support the operation of the microprocessor. 3029 28 27262524313837 36 3534333248 45 4442 43 464749 44 VSS ∼.302 V ∼4.85 V

15 OHM

453 OHM

100 µF TD0 RDI PORTAPORTB 34567120345671276 5 4 3210 PORTC GND VPP6 15 1%

30.1 OHM

34064P– .1+ 10K 10K 4.7K 22 pF 10MEG 1–4, 33 39, 38, 40 BP IEE PART NUMBER LCD5657 OR EQUALLIQUID CRYSTAL DISPLAY 2637 36 35 34 32 31 30 29 27 25 24 23 22 21 2019141211 17 18 1615131098765 141312111092 1 2 2 2 3 LCD Figure 2. DEVB–114 System Schematic Freescale Semiconductor, Inc.

Table 1. DEVB–114 Parts List Note: All resistors are 1/4 W resistors with a tolerance of 5% unless otherwise noted. Note: All capacitors are 100 volt, ceramic capacitors with a tolerance of 10% unless otherwise noted. Figure 3. Silk Screen Freescale Semiconductor, Inc.

Figure 5. DEVB–114 Software Flowchart delay() Used to provide approximately a 20 ms loop. processor interrupts, and calls adzero(). the display. It is then output to the display. played. The loop then repeats. to compute and display the pressure applied to the sensor. Freescale Semiconductor, Inc.

/C0065/C0078/C0049/C0051/C0048/C0053 3–224 Motorola Sensor Device Datawww.motorola.com/semiconductors SOFTWARE SOURCE/ASSEMBLY PROGRAM CODE #pragma option v ; rev 1.1 code rewritten to use the MC68HC705B5 instead of the MC68HC805B6. WLL 6/17/91 THE FOLLOWING ’C’ SOURCE CODE IS WRITTEN FOR THE DEVB–114 DEMONSTRATION BOARD. IT WAS COMPILED WITH A COMPILER COURTESY OF: BYTE CRAFT LTD. 421 KING ST. WATERLOO, ONTARIO CANADA N2J 4E4 (519)888–6911 SOME SOURCE CODE CHANGES MAY BE NECESSARY FOR COMPILATION WITH OTHER COMPILERS. BILL LUCAS 8/5/90 MOTOROLA, SPS */ 0800 1700 #pragma memory ROMPROG [5888] @ 0x0800 ; 0050 0096 #pragma memory RAMPAGE0 [150] @ 0x0050 ; /* Vector assignments */ 1FFE #pragma vector __RESET @ 0x1ffe ; 1FFC #pragma vector __SWI @ 0x1ffc ; 1FFA #pragma vector IRQ @ 0x1ffa ; 1FF8 #pragma vector TIMERCAP @ 0x1ff8 ; 1FF6 #pragma vector TIMERCMP @ 0x1ff6 ; 1FF4 #pragma vector TIMEROV @ 0x1ff4 ; 1FF2 #pragma vector SCI @ 0x1ff2 ; #pragma has STOP ; #pragma has WAIT ; #pragma has MUL ; /* Register assignments for the 68HC705B5 microcontroller */ 0000 #pragma portrw porta @ 0x00; /* */ 0001 #pragma portrw portb @ 0x01; /* */ 0002 #pragma portrw portc @ 0x02; /* */ 0003 #pragma portrw portd @ 0x03; /* in ,– ,SS ,SCK ,MOSI,MISO,TxD,RxD */ 0004 #pragma portrw ddra @ 0x04; /* Data direction, Port A */ 0005 #pragma portrw ddrb @ 0x05; /* Data direction, Port B */ 0006 #pragma portrw ddrc @ 0x06; /* Data direction, Port C (all output) */ 0007 #pragma portrw eeclk @ 0x07; /* eeprom/eclk cntl */ 0008 #pragma portrw addata @ 0x08; /* a/d data register */ 0009 #pragma portrw adstat @ 0x09; /* a/d stat/control */ 000A #pragma portrw plma @ 0x0a; /* pulse length modulation a */ 000B #pragma portrw plmb @ 0x0b; /* pulse length modulation b */ 000C #pragma portrw misc @ 0x0c; /* miscellaneous register */ 000D #pragma portrw scibaud @ 0x0d; /* sci baud rate register */ 000E #pragma portrw scicntl1 @ 0x0e; /* sci control 1 */ 000F #pragma portrw scicntl2 @ 0x0f; /* sci control 2 */ 0010 #pragma portrw scistat @ 0x10; /* sci status reg */ Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0051/C0048/C0053 3–225Motorola Sensor Device Data www.motorola.com/semiconductors 0011 #pragma portrw scidata @ 0x11; /* SCI Data */ 0012 #pragma portrw tcr @ 0x12; /* ICIE,OCIE,TOIE,0;0,0,IEGE,OLVL */ 0013 #pragma portrw tsr @ 0x13; /* ICF,OCF,TOF,0; 0,0,0,0 */ 0014 #pragma portrw icaphi1 @ 0x14; /* Input Capture Reg (Hi–0x14, Lo–0x15) */ 0015 #pragma portrw icaplo1 @ 0x15; /* Input Capture Reg (Hi–0x14, Lo–0x15) */ 0016 #pragma portrw ocmphi1 @ 0x16; /* Output Compare Reg (Hi–0x16, Lo–0x17)*/ 0017 #pragma portrw ocmplo1 @ 0x17; /* Output Compare Reg (Hi–0x16, Lo–0x17)*/ 0018 #pragma portrw tcnthi @ 0x18; /* Timer Count Reg (Hi–0x18, Lo–0x19) */ 0019 #pragma portrw tcntlo @ 0x19; /* Timer Count Reg (Hi–0x18, Lo–0x19) */ 001A #pragma portrw acnthi @ 0x1A; /* Alternate Count Reg (Hi–$1A, Lo–$1B) */ 001B #pragma portrw acntlo @ 0x1B; /* Alternate Count Reg (Hi–$1A, Lo–$1B) */ 001C #pragma portrw icaphi2 @ 0x1c; /* Input Capture Reg (Hi–0x1c, Lo–0x1d) */ 001D #pragma portrw icaplo2 @ 0x1d; /* Input Capture Reg (Hi–0x1c, Lo–0x1d) */ 001E #pragma portrw ocmphi2 @ 0x1e; /* Output Compare Reg (Hi–0x1e, Lo–0x1f)*/ 001F #pragma portrw ocmplo2 @ 0x1f; /* Output Compare Reg (Hi–0x1e, Lo–0x1f)*/ /* put constants and variables here...they must be global */ 1EFE 74 #pragma mor @ 0x1EFE = 0x74; /* this disables the watchdog counter and does not add pull–down resistors on ports B and C */

0800 FC 30 DA 7A 36 6E E6 38 FE const char lcdtab[]={0xfc,0x30,0xda,0x7a,0x36,0x6e,0xe6,0x38,0xfe,0x3e };

/* lcd pattern table 0 1 2 3 4 5 6 7 8 9 */ 080A 27 10 03 E8 00 64 00 0A const long dectable[] = { 10000, 1000, 100, 10 }; 0050 0005 unsigned int digit[5]; /* buffer to hold results from cvt_bin_dec functio */ 0000 registera ac; /* processor’s A register */ 0055 long atodtemp; /* temp to accumulate 100 a/d readings for smoothing */ 0059 long slope; /* multiplier for adc to engineering units conversion */ 005B int adcnt; /* a/d converter loop counter */ 005C long xdcr_offset; /* initial xdcr offset */ 005E 0060 unsigned long i,j; /* counter for loops */ 0062 int k; /* misc variable */ struct bothbytes { int hi; int lo; union isboth { long l; struct bothbytes b; 0063 0002 union isboth q; /* used for timer set–up */ Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0051/C0048/C0053 3–226 Motorola Sensor Device Datawww.motorola.com/semiconductors /* code starts here */ /* these interrupts are not used...give them a graceful return if for some reason one occurs */ 1FFC 08 12 __SWI(){} 0812 80 RTI 1FFA 08 13 IRQ(){} 0813 80 RTI 1FF8 08 14 TIMERCAP(){} 0814 80 RTI 1FF4 08 15 TIMEROV(){} 0815 80 RTI 1FF2 08 16 SCI(){} 0816 80 RTI void delay(void) /* just hang around for a while */ 0817 4F CLRA for (i=0; i<20000; ++i); 0818 3F 57 CLR $57 081A B7 58 STA $58 081C B6 57 LDA $57 081E B7 5E STA $5E

0820 B6 58 LDA $58

0822 B7 5F STA $5F

0824 B6 5F LDA $5F

0826 A0 20 SUB #$20

0828 B6 5E LDA $5E

082A A2 4E SBC #$4E 082C 24 08 BCC $0836 082E 3C 5F INC $5F 0830 26 02 BNE $0834 0832 3C 5E INC $5E 0834 20 EE BRA $0824 0836 81 RTS } read_a2d(void) /* read the a/d converter on channel 5 and accumulate the result in atodtemp */ 0837 3F 56 CLR $56 atodtemp=0; /* zero for accumulation */ 0839 3F 55 CLR $55 083B 4F CLRA for ( adcnt = 0 ; adcnt<100; ++adcnt) /* do 100 a/d conversions */ 083C B7 5B STA $5B 083E B6 5B LDA $5B

0840 A8 80 EOR #$80

0842 A1 E4 CMP #$E4

0844 24 21 BCC $0867 Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0051/C0048/C0053 3–227Motorola Sensor Device Data www.motorola.com/semiconductors

0846 A6 25 LDA #$25 adstat = 0x25; /* convert on channel 5 */

0848 B7 09 STA $09

084A 0F 09 FD BRCLR 7,$09,$084A while (!(adstat & 0x80)); /* wait for a/d to complete */ 084D B6 08 LDA $08 atodtemp = addata + atodtemp; 084F 3F 57 CLR $57

0851 B7 58 STA $58

0853 BB 56 ADD $56

0855 B7 58 STA $58

0857 B6 57 LDA $57

0859 B9 55 ADC $55

085B B7 57 STA $57 085D B7 55 STA $55 085F B6 58 LDA $58

0861 B7 56 STA $56

0863 3C 5B INC $5B 0865 20 D7 BRA $083E

0867 B6 56 LDA $56 atodtemp = atodtemp/100;

0869 B7 58 STA $58

086B B6 55 LDA $55 086D B7 57 STA $57 086F 3F 66 CLR $66

0871 A6 64 LDA #$64

0873 B7 67 STA $67

0875 CD 0A 5E JSR $0A5E

0878 CD 0A 8F JSR $0A8F

087B BF 55 STX $55 087D B7 56 STA $56 087F 81 RTS return atodtemp; void fixcompare (void) /* sets–up the timer compare for the next interrup */ 0880 B6 18 LDA $18 q.b.hi =tcnthi;

0882 B7 63 STA $63

0884 B6 19 LDA $19 q.b.lo = tcntlo;

0886 B7 64 STA $64

0888 AB 4C ADD #$4C q.l +=7500; /* ((4mhz xtal/2)/4) = counter period = 2us.*7500 = 15ms.*/ 088A B7 64 STA $64 088C B6 63 LDA $63 088E A9 1D ADC #$1D

0890 B7 63 STA $63

0892 B7 16 STA $16 ocmphi1 = q.b.hi;

0894 B6 13 LDA $13 ac=tsr;

0896 B6 64 LDA $64 ocmplo1 = q.b.lo;

0898 B7 17 STA $17

089A 81 RTS } void TIMERCMP (void) /* timer service module */ 1FF6 08 9B { Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0051/C0048/C0053 3–228 Motorola Sensor Device Datawww.motorola.com/semiconductors 089B 33 02 COM $02 portc =~ portc; /* service the lcd */ 089D 33 01 COM $01 portb =~ portb; 089F 33 00 COM $00 porta =~ porta; 08A1 AD DD BSR $0880 fixcompare(); 08A3 80 RTI } void adzero(void) /* called by initio() to save initial xdcr’s zero pressure offset voltage output */ 08A4 4F CLRA for ( j=0; j<20; ++j) /* give the sensor time to ”warm–up” and the 08A5 3F 57 CLR $57 08A7 B7 58 STA $58 08A9 B6 57 LDA $57 08AB B7 60 STA $60 08AD B6 58 LDA $58 08AF B7 61 STA $61 08B1 B6 61 LDA $61 08B3 A0 14 SUB #$14 08B5 B6 60 LDA $60 08B7 A2 00 SBC #$00 08B9 24 0B BCC $08C6 power supply time to settle down */ 08BB CD 08 17 JSR $0817 delay(); 08BE 3C 61 INC $61 08C0 26 02 BNE $08C4 08C2 3C 60 INC $60 08C4 20 EB BRA $08B1 08C6 CD 08 37 JSR $0837 xdcr_offset = read_a2d(); 08C9 3F 5C CLR $5C 08CB B7 5D STA $5D 08CD 81 RTS } void initio (void) /* setup the I/O */ 08CE A6 20 LDA #$20 adstat = 0x20; /* power–up the A/D */ 08D0 B7 09 STA $09 08D2 3F 02 CLR $02 porta = portb = portc = 0; 08D4 3F 01 CLR $01 08D6 3F 00 CLR $00 08D8 A6 FF LDA #$FF ddra = ddrb = ddrc = 0xff; 08DA B7 06 STA $06 08DC B7 05 STA $05 08DE B7 04 STA $04 08E0 B6 13 LDA $13 ac=tsr; /* dummy read */ 08E2 3F 1E CLR $1E ocmphi1 = ocmphi2 = 0; 08E4 3F 16 CLR $16 08E6 B6 1F LDA $1F ac = ocmplo2; /* clear out output compare 2 if it happens to be set */ 08E8 AD 96 BSR $0880 fixcompare(); /* set–up for the first timer interrupt */ Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0051/C0048/C0053 3–229Motorola Sensor Device Data www.motorola.com/semiconductors 08EA A6 40 LDA #$40 tcr = 0x40; 08EC B7 12 STA $12 08EE 9A CLI CLI; /* let the interrupts begin ! */ /* write CAL to the display */ 08EF A6 CC LDA #$CC portc = 0xcc; /* C */ 08F1 B7 02 STA $02 08F3 A6 BE LDA #$BE portb = 0xbe; /* A */ 08F5 B7 01 STA $01 08F7 A6 C4 LDA #$C4 porta = 0xc4; /* L */ 08F9 B7 00 STA $00 08FB AD A7 BSR $08A4 adzero(); 08FD 81 RTS } void cvt_bin_dec(unsigned long arg) /* First converts the argument to a five digit decimal value. The msd is in the lowest address. Then leading zero suppresses the value and writes it to the display ports. The argument value range is 0..65535 decimal. */ 0069 { 08FE BF 69 STX $69

0900 B7 6A STA $6A

006B char i; 006C unsigned long l; 0902 4F CLRA for ( i=0; i < 5; ++i )

0903 B7 6B STA $6B

0905 B6 6B LDA $6B

0907 A1 05 CMP #$05

0909 24 07 BCC $0912 090B 97 TAX digit[i] = 0x0; /* put blanks in all digit positions */ 090C 6F 50 CLR $50,X 090E 3C 6B INC $6B 0910 20 F3 BRA $0905 0912 4F CLRA for ( i=0; i < 4; ++i )

0913 B7 6B STA $6B

0915 B6 6B LDA $6B

0917 A1 04 CMP #$04

0919 24 70 BCC $098B 091B 97 TAX if ( arg >= dectable [i] ) 091C 58 LSLX 091D D6 08 0B LDA $080B,X

0920 B1 6A CMP $6A

0922 26 07 BNE $092B

0924 D6 08 0A LDA $080A,X

0927 B1 69 CMP $69

0929 27 5C BEQ $0987 092B BE 6B LDX $6B l = dectable[i]; 092D 58 LSLX 092E D6 08 0A LDA $080A,X Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0051/C0048/C0053 3–230 Motorola Sensor Device Datawww.motorola.com/semiconductors

0931 B7 6C STA $6C

0933 D6 08 0B LDA $080B,X

0936 B7 6D STA $6D

0938 B6 6A LDA $6A digit[i] = arg / l;

093A B7 58 STA $58 093C B6 69 LDA $69 093E B7 57 STA $57

0940 B6 6C LDA $6C

0942 B7 66 STA $66

0944 B6 6D LDA $6D

0946 B7 67 STA $67

0948 CD 0A 5E JSR $0A5E

094B CD 0A 8F JSR $0A8F 094E BF 57 STX $57

0950 B7 58 STA $58

0952 BE 6B LDX $6B

0954 E7 50 STA $50,X

0956 BE 6B LDX $6B arg = arg–(digit[i] * l);

0958 E6 50 LDA $50,X

095A 3F 57 CLR $57 095C B7 58 STA $58 095E B6 6C LDA $6C

0960 B7 66 STA $66

0962 B6 6D LDA $6D

0964 B7 67 STA $67

0966 CD 0A 3F JSR $0A3F

0969 BF 57 STX $57

096B B7 58 STA $58 096D 33 57 COM $57 096F 30 58 NEG $58 0971 26 02 BNE $0975 0973 3C 57 INC $57

0975 B6 58 LDA $58

0977 BB 6A ADD $6A

0979 B7 58 STA $58

097B B6 57 LDA $57 097D B9 69 ADC $69 097F B7 57 STA $57

0981 B7 69 STA $69

0983 B6 58 LDA $58

0985 B7 6A STA $6A

0987 3C 6B INC $6B 0989 20 8A BRA $0915 098B B6 6A LDA $6A digit[i] = arg; 098D B7 58 STA $58 098F B6 69 LDA $69

0991 B7 57 STA $57

0993 BE 6B LDX $6B

0995 B6 58 LDA $58

0997 E7 50 STA $50,X

/* now zero suppress and send the lcd pattern to the display */ 0999 9B SEI SEI; Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0051/C0048/C0053 3–231Motorola Sensor Device Data www.motorola.com/semiconductors 099A 3D 50 TST $50 if ( digit[0] == 0 ) /* leading zero suppression */ 099C 26 04 BNE $09A2 099E 3F 02 CLR $02 portc = 0; 09A0 20 07 BRA $09A9 else 09A2 BE 50 LDX $50 portc = ( lcdtab[digit[0]] ); /* 100’s digit */ 09A4 D6 08 00 LDA $0800,X 09A7 B7 02 STA $02 09A9 3D 50 TST $50 if ( digit[0] == 0 && digit[1] == 0 ) 09AB 26 08 BNE $09B5 09AD 3D 51 TST $51 09AF 26 04 BNE $09B5 09B1 3F 01 CLR $01 portb=0; 09B3 20 07 BRA $09BC else 09B5 BE 51 LDX $51 portb = ( lcdtab[digit[1]] ); /* 10’s digit */ 09B7 D6 08 00 LDA $0800,X 09BA B7 01 STA $01 09BC BE 52 LDX $52 porta = ( lcdtab[digit[2]]+1 ); /* 1’s digit + decimal point */ 09BE D6 08 00 LDA $0800,X 09C1 4C INCA 09C2 B7 00 STA $00 09C4 9A CLI CLI; 09C5 CD 08 17 JSR $0817 delay(); 09C8 81 RTS } void display_psi(void) /* At power–up it is assumed that the pressure port of the sensor is open to atmosphere. The code in initio() delays for the sensor and power to stabilize. One hundred A/D conversions are averaged and divided by 100. The result is called xdcr_offset. This routine calls the A/D routine which performs one hundred conversions, divides the result by 100 and returns the value. If the value returned is less than or equal to the xdcr_offset, the value of xdcr_offset is substituted. If the value returned is greater than xdcr_offset, xdcr_offset is subtracted from the returned value. That result is multiplied by a constant to yield pressure in PSI * 10 to yield a ”decimal point”. while(1) 09C9 3F 59 CLR $59 slope = 64; 09CB A6 40 LDA #$40 09CD B7 5A STA $5A 09CF B6 03 LDA $03 k = portd & 0xc0; /* this lets us ”rubber” the slope to closer fit 09D1 A4 C0 AND #$C0 09D3 B7 62 STA $62 the slope of the sensor */ 09D5 A1 80 CMP #$80 if ( k == 0x80 ) /* J2 removed, J1 installed */ 09D7 26 06 BNE $09DF 09D9 3F 59 CLR $59 slope = 65; 09DB A6 41 LDA #$41 09DD B7 5A STA $5A 09DF B6 62 LDA $62 if ( k == 0x40 ) /* J1 removed, J2 installed */ Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0051/C0048/C0053 3–232 Motorola Sensor Device Datawww.motorola.com/semiconductors 09E1 A1 40 CMP #$40 09E3 26 06 BNE $09EB 09E5 3F 59 CLR $59 slope = 63; 09E7 A6 3F LDA #$3F 09E9 B7 5A STA $5A /* else both jumpers are removed or installed... don’t change the slope */ 09EB CD 08 37 JSR $0837 atodtemp = read_a2d(); /* atodtemp = raw a/d ( 0..255 ) */ 09EE 3F 55 CLR $55 09F0 B7 56 STA $56 09F2 B0 5D SUB $5D if ( atodtemp <= xdcr_offset ) 09F4 B7 58 STA $58 09F6 B6 5C LDA $5C 09F8 A8 80 EOR #$80 09FA B7 57 STA $57 09FC B6 55 LDA $55 09FE A8 80 EOR #$80 0A00 B2 57 SBC $57 0A02 BA 58 ORA $58 0A04 22 08 BHI $0A0E 0A06 B6 5C LDA $5C atodtemp = xdcr_offset; 0A08 B7 55 STA $55 0A0A B6 5D LDA $5D 0A0C B7 56 STA $56 0A0E B6 56 LDA $56 atodtemp –= xdcr_offset; /* remove the offset */ 0A10 B0 5D SUB $5D 0A12 B7 56 STA $56 0A14 B6 55 LDA $55 0A16 B2 5C SBC $5C 0A18 B7 55 STA $55 0A1A B6 56 LDA $56 atodtemp *= slope; /* convert to psi */ 0A1C B7 58 STA $58 0A1E B6 55 LDA $55 0A20 B7 57 STA $57 0A22 B6 59 LDA $59 0A24 B7 66 STA $66 0A26 B6 5A LDA $5A 0A28 B7 67 STA $67 0A2A CD 0A 3F JSR $0A3F 0A2D BF 55 STX $55 0A2F B7 56 STA $56 0A31 CD 08 FE JSR $08FE cvt_bin_dec( atodtemp ); /* convert to decimal and display */ 0A34 20 93 BRA $09C9 } 0A36 81 RTS } main() 0A37 CD 08 CE JSR $08CE initio(); /* set–up the processor’s i/o */ 0A3A AD 8D BSR $09C9 display_psi(); 0A3C 20 FE BRA $0A3C while(1); /* should never get here */ 0A3E 81 RTS } 0A3F BE 58 LDX $58 0A41 B6 67 LDA $67 Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0051/C0048/C0053 3–233Motorola Sensor Device Data www.motorola.com/semiconductors 0A43 42 MUL 0A44 B7 70 STA $70 0A46 BF 71 STX $71 0A48 BE 57 LDX $57 0A4A B6 67 LDA $67 0A4C 42 MUL 0A4D BB 71 ADD $71 0A4F B7 71 STA $71 0A51 BE 58 LDX $58 0A53 B6 66 LDA $66 0A55 42 MUL 0A56 BB 71 ADD $71 0A58 B7 71 STA $71 0A5A 97 TAX 0A5B B6 70 LDA $70 0A5D 81 RTS 0A5E 3F 70 CLR $70 0A60 5F CLRX 0A61 3F 6E CLR $6E 0A63 3F 6F CLR $6F 0A65 5C INCX 0A66 38 58 LSL $58 0A68 39 57 ROL $57 0A6A 39 6E ROL $6E 0A6C 39 6F ROL $6F 0A6E B6 6E LDA $6E 0A70 B0 67 SUB $67 0A72 B7 6E STA $6E 0A74 B6 6F LDA $6F 0A76 B2 66 SBC $66 0A78 B7 6F STA $6F 0A7A 24 0D BCC $0A89 0A7C B6 67 LDA $67 0A7E BB 6E ADD $6E 0A80 B7 6E STA $6E 0A82 B6 66 LDA $66 0A84 B9 6F ADC $6F 0A86 B7 6F STA $6F 0A88 99 SEC 0A89 59 ROLX 0A8A 39 70 ROL $70 0A8C 24 D8 BCC $0A66 0A8E 81 RTS 0A8F 53 COMX 0A90 9F TXA 0A91 BE 70 LDX $70 0A93 53 COMX 0A94 81 RTS 1FFE 0A 37 Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

making Bar Graph Pressure Gauges relatively simple. Figure 1. DEVB147 Compensated Pressure Sensor Evaluation Board Freescale Semiconductor, Inc.

/C0065/C0078/C0049/C0051/C0048/C0057 3–236 Motorola Sensor Device Datawww.motorola.com/semiconductors EVALUATION BOARD DESCRIPTION The information required to use evaluation board number DEVB147 follows, and a discussion of the design appears in the Design Considerations section. FUNCTION The evaluation board shown in Figure 1 is supplied with an MPX2100DP sensor and provides a 100 kPa full scale pressure measurement. It has two input ports. P1, the pressure port, is on the top side of the sensor and P2, a vacuum port, is on the bottom side. These ports can be supplied up to 100 kPa (15 psi) of pressure on P1 or up to 100 kPa of vacuum on P2, or a differential pressure up to 100 kPa between P1 and P2. Any of these sources will produce the same output. The primary output is a 10 segment LED bar graph, which is labeled in increments of 10% of full scale, or 10 kPa with the MPX2100 sensor. An analog output is also provided. It nominally supplies 0.5 volts at zero pressure and 4.5 volts at full scale. Zero and full scale adjustments are made with potentiometers so labeled at the bottom of the board. Both adjustments are independent of one another. The following electrical characteristics are included as a guide to operation. Characteristic Symbol Min Typ Max Units Power Supply Voltage B+ 6.8 — 13.2 dc Volts Full Scale Pressure PFS — — 100 kPa Overpressure PMAX — — 700 kPa Analog Full Scale VFS — 4.5 — Volts Analog Zero Pressure Offset VOFF — 0.5 — Volts Analog Sensitivity SAOUT — 40 — mV/kPa Quiescent Current ICC — 40 — mA Full Scale Current IFS — 160 — mA CONTENT Board contents are described in the parts list shown in Table 1. A schematic and silk screen plot are shown in Figures 2 and 6. A pin by pin circuit description follows. convenient place to connect instrumentation grounds. Test point 2 is connected to the +5.0 volt regulator output. labeled. Maximum safe pressure is 700 kPa. Freescale Semiconductor, Inc.

Figure 2. Compensated Pressure Sensor EVB Schematic

2 OUTPUT 1

Figure 3. Compensated Sensor Interface Freescale Semiconductor, Inc.

at (VOFFSET ). With 2.5 volts at pin 10, pin 9 is also at 2.5 volts. at pin 4 subtracts from the DC level that is amplified by U2A. to the interface circuit’s 0.5 volt zero pressure output voltage. is approximately +/– (10 kPa +10%). Figure 5. To get maximum accuracy from the A/D conversion, dividing down a 5.0 volt reference with 1% resistors. compatible to a microprocessor. Freescale Semiconductor, Inc.

Freescale Semiconductor, Inc.

15 OHMS

453 OHMS

30.1 OHMS

Figure 5. Application Example Figure 6. Silk Screen Freescale Semiconductor, Inc.

Freescale Semiconductor, Inc.

3–242 Motorola Sensor Device Datawww.motorola.com/semiconductors /C0065/C0078/C0049/C0051/C0049/C0053 /C0065/C0110 /C0069/C0118/C0097/C0108/C0117/C0097/C0116/C0105/C0111/C0110 /C0083/C0121/C0115/C0116/C0101/C0109 /C0073/C0110/C0116/C0101/C0114/C0102/C0097/C0099/C0105/C0110/C0103 /C0116/C0104/C0101 /C0077/C0080/C0088/C0050/C0048/C0048/C0048 /C0083/C0101/C0114/C0105/C0101/C0115 /C0080/C0114/C0101/C0115/C0115/C0117/C0114/C0101 /C0083/C0101/C0110/C0115/C0111/C0114/C0115 /C0116/C0111 /C0097 /C0077/C0105/C0099/C0114/C0111/C0112/C0114/C0111/C0099/C0101/C0115/C0115/C0111/C0114 Prepared by: Bill Lucas Discrete Applications Engineering INTRODUCTION Outputs from compensated and calibrated semiconductor pressure sensors such as the MPX2000 series devices are easily amplified and interfaced to a microprocessor. Design considerations and the description of an evaluation board using a simple analog interface connected to a microprocessor is presented here. PURPOSE The evaluation system shown in Figure 1 shows the ease of operating and interfacing the MOTOROLA MPX2000 series pressure sensors to a quad operational amplifier, which amplifies the sensor’s output to an acceptable level for an analog–to–digital converter. The output of the op amp is connected to the A/D converter of the microprocessor and that analog value is then converted to engineering units and displayed on a liquid crystal display (LCD). This system may be used to evaluate any of the MPX2000 series pressure sensors for your specific application. The DEVB158 evaluation system is constructed on a small printed circuit board. Designed to be powered from a 12 Vdc power supply, the system will display the pressure applied to the MPX2000 series sensor in pounds per square inch (PSI) on the liquid crystal display. Table 1 shows the pressure sensors that may be used with the system and the pressure range associated with that particular sensor as well as the jumper configuration required to support that sensor. These jumpers are installed at assembly time to correspond with the supplied sensor. Should the user chose to evaluate a different sensor other than that supplied with the board, the jumpers must be changed to correspond to Table 1 for the new sensor. The displayed pressure is scaled to the full scale (PSI) range of the installed pressure sensor. No potentiometers are used in the system to adjust its span and offset. This function is performed by software. Figure 1. DEVB158 2000 Series LCD Pressure Gauge EVB Freescale Semiconductor, Inc.

references and a voltage offset source. Table 2. Parts List J4–J7 1 Dual Row Straight 4 Pos. Note: All resistors are 1/4 W resistors with a tolerance of 5% unless otherwise noted. Note: All capacitors are 100 volt, ceramic capacitors with a tolerance of 10% unless otherwise noted. Freescale Semiconductor, Inc.

/C0065/C0078/C0049/C0051/C0049/C0053 3–245Motorola Sensor Device Data www.motorola.com/semiconductors OPERATIONAL CHARACTERISTICS The following operational characteristics are included as a guide to operation. Characteristic Symbol Min Max Unit Power Supply Voltage +12 10.75 16 Volts Operating Current ICC 75 mA Full Scale Pressure MPX2010 MPX2050 MPX2100 MPX2200 Pfs 1.5 7.5 PSI PSI PSI PSI PIN–BY–PIN DESCRIPTION +12: Input power is supplied at the +12 terminal. The minimum operating voltage is 10.75 Vdc and the maximum operating voltage is 16 Vdc. GND: The ground terminal is the power supply return for the system. TP1: Test point 1 is connected to the final op amp stage. It is the voltage that is applied to the microprocessor’s A/D converter. There are two ports on the pressure sensor located at the bottom center of the printed circuit board. The pressure port is on the top left and the vacuum port is on the bottom right of the sensor. PD1 2–A2 PD2 2–A3 PD3 2–A3 PD4 2–A3 PD5 2–A3 PD6 2–A3 PD7 2–A3 +12 IN GROUND P1 1N4002 1 µF 78L08 IN OUT GROUND 78L05 IN OUT GROUND 1 µF 0.1 C2 C3 +5 V R12 R13 R14 VRH 2–D4 VRL 2–D4 402 3.32K1 µF 0.1 CPU_RESET 2–B4 MC34064P–5 +IN GND OUT +5 V +5 V R114.7K PD0 2–A2 TP1 +5 V 1N914 4.7K 810 1412 U1A U1C U1D U1B3 976 R10340 R823.7 XDCR1 121 200 6.98K 4 7 +12 V MC33274 +5 V 7 x 47K SENSOR TYPE SELECT SLOPE ADJ. Figure 3a. Schematic J8 IS INSTALLED FOR THE MPX2010 ONLY 4.53K Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0051/C0049/C0053 3–246 Motorola Sensor Device Datawww.motorola.com/semiconductors 02 1 7 65 4 3 0 2 17 6 5 4320 49 47 48 42 43 44 45 46 39 37 38 32 33 34 35 36 17 6 54 3 31 29 30 24 25 26 27 28 28 37 36 5 6 7 34 35 8 31 32 9 10 11 29 30 12 26 27 13 14 15 24 25 16 22 23 17 18 19 20 1 21 BLK PLN PINS: 2–4, 33, 38–40 22 pF 22 pF17 R15 10M OSC2 OSC1

4.00 MHz

IRQ* RESET* VPP6 VDD VSS TCAP1 D/A RDI TDO VRL VRH PLMA TCAP2 19 18 15 10 41 22 23 21 50 52 7 8 20 +5 V CPU_RESET 1-E2 0.1 VRL 1-C4 VRH 1-C4 LCD1 Figure 3b. Schematic Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0051/C0049/C0053 3–247Motorola Sensor Device Data www.motorola.com/semiconductors OPERATION Connect the system to a 12 Vdc regulated power supply. (Note the polarity marked on the power terminal P1.) Depending on the particular pressure sensor being used with the system, wire jumpers J1 through J3 and J8 must be installed at board assembly time. If at some later time it is desirable to change the type of sensor that is installed on the board, jumpers J1 through J3 and J8, must be reconfigured for the system to function properly (see Table 1). If an invalid J1 through J3 jumper combination (i.e., not listed in Table 1) is used the LCD will display “SE” to indicate that condition. These jumpers are read by the software and are used to determine which sensor is installed on the board. Wire jumper J8 is installed only when an MPX2010DP pressure sensor is used on the system. The purpose of wire jumper J8 will be explained later in the text. Jumpers J4 through J7 are read by the software to allow the user to adjust the slope constant used for the engineering units calculation (see Table 3). The pressure and vacuum ports on the sensor must be left open to atmosphere anytime the board is powered–up. This is because the zero pressure offset voltage is computed at power–up. When you apply power to the system, the LCD will display CAL for approximately 5 seconds. After that time, pressure or vacuum may be applied to the sensor. The system will then start displaying the applied pressure in PSI. Table 3. J7 J6 J5 J4 Action IN IN IN IN Normal Slope IN IN IN OUT Decrease the Slope Approximately 7% IN IN OUT IN Decrease the Slope Approximately 6% IN IN OUT OUT Decrease the Slope Approximately 5% IN OUT IN IN Decrease the Slope Approximately 4% IN OUT IN OUT Decrease the Slope Approximately 3% IN OUT OUT IN Decrease the Slope Approximately 2% IN OUT OUT OUT Decrease the Slope Approximately 1% OUT IN IN IN Increase the Slope Approximately 1% OUT IN IN OUT Increase the Slope Approximately 2% OUT IN OUT IN Increase the Slope Approximately 3% OUT IN OUT OUT Increase the Slope Approximately 4% OUT OUT IN IN Increase the Slope Approximately 5% OUT OUT IN OUT Increase the Slope Approximately 6% OUT OUT OUT IN Increase the Slope Approximately 7% OUT OUT OUT OUT Normal Slope To improve the accuracy of the system, you can change the constant used by the program that determines the span of the sensor and amplifier. You will need an accurate test gauge (using PSI as the reference) to measure the pressure applied to the sensor. Anytime after the display has completed the zero calculation, (after CAL is no longer displayed) apply the sensor’s full scale pressure (see Table 1), to the sensor. Make sure that jumpers J4 through J7 are in the “normal” configuration (see Table 3). Referring to Table 3, you can better “calibrate” the system by changing the configuration of J4 through J7. To “calibrate” the system, compare the display reading against that of the test gauge (with J4 through J7 in the “normal slope” configuration). Change the configuration of J4 through J7 according to Table 3 to obtain the best results. The calibration jumpers may be changed while the system is powered up as they are read by the software before each display update. DESIGN CONSIDERATIONS To build a system that will show how to interface an MPX2000 series pressure sensor to a microprocessor, there are two main challenges. The first is to take a small differential signal produced by the sensor and produce a ground referenced signal of sufficient amplitude to drive a microprocessor’s A/D input. The second challenge is to understand the microprocessor’s operation and to write software that makes the system function. From a hardware point of view, the microprocessor portion of the system is straight forward. The microprocessor needs power, a clock source (crystal Y1, two capacitors and a resistor), and a reset signal to make it function. As for the A/D converter, external references are required to make it function. In this case, the power source for the sensor is divided to produce the voltage references for the A/D converter. Accurate results will be achieved since the output from the sensor and the A/D references are ratiometric to its power supply voltage. The liquid crystal display is driven by Ports A, B and C of the microprocessor. There are enough I/O lines on these ports to provide drive for three full digits, the backplane and two decimal points. Software routines provide the AC waveform necessary to drive the display. The analog portion of the system consists of the pressure sensor, a quad operational amplifier and the voltage references for the microprocessor’s A/D converter and signal conditioning circuitry. Figure 4 shows an interface circuit that will provide a single ended signal with sufficient amplitude to drive the microprocessor’s A/D input. It uses a quad operational amplifier and several resistors to amplify and level shift the sensor’s output. It is necessary to level shift the output from the final amplifier into the A/D. Using single power supplied op amps, the VCE saturation of the output from an op amp cannot be guaranteed to pull down to zero volts. The analog design shown here will provide a signal to the A/D converter with a span of approximately 4 volts when zero to full–scale pressure is applied to the sensor. The final amplifier’s output is level shifted to approximately 0.7 volts. This will provide a signal that will swing between approximately 0.7 volts and 4.7 volts. The offset of 0.7 volts in this implementation does not have to be trimmed to an exact point. The software will sample the voltage applied to the A/D converter at initial power up time and call that value “zero”. The important thing to remember is that the span of the signal will be approximately 4 volts when zero to full scale pressure is applied to the sensor. The 4 volt swing in signal may vary slightly from sensor to sensor and can also vary due to resistor tolerances in the analog circuitry. Jumpers J4 through J7 may be placed in various configurations to compensate for these variations (see Table 3). Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

Figure 5. DEVB–158 Software Flowchart delay() Used to provide a software loop delay. multiplexer channel 0 and returns the accumulation. enables processor interrupts. sensors output voltage with zero pressure applied. for the display. This is then output to the display. that particular sensor in a variable for use by display_psi(). Freescale Semiconductor, Inc.

/C0065/C0078/C0049/C0051/C0049/C0053 3–250 Motorola Sensor Device Datawww.motorola.com/semiconductors 6805 ’C’ COMPILER V3.48 16–Oct–1991 PAGE 1 #pragma option f0; THE FOLLOWING ’C’ SOURCE CODE IS WRITTEN FOR THE DEVB158 EVALUATION BOARD. IT WAS COMPILED WITH A COMPILER COURTESY OF: BYTE CRAFT LTD. 421 KING ST. WATERLOO, ONTARIO CANADA N2J 4E4 (519)888–6911 SOME SOURCE CODE CHANGES MAY BE NECESSARY FOR COMPILATION WITH OTHER COMPILERS. BILL LUCAS 2/5/92 MOTOROLA, SPS

Revision history

rev. 1.0 initial release 3/19/92 rev. 1.1 added additional decimal digit to the MPX2010 sensor. Originally resolved the output to .1 PSI. Modified cvt_bin_dec to output PSI resolved to .01 PSI. WLL 9/25/92 0800 1700 #pragma memory ROMPROG [5888] @ 0x0800 ; 0050 0096 #pragma memory RAMPAGE0 [150] @ 0x0050 ; /* Vector assignments */ 1FFE #pragma vector __RESET @ 0x1ffe ; 1FFC #pragma vector __SWI @ 0x1ffc ; 1FFA #pragma vector IRQ @ 0x1ffa ; 1FF8 #pragma vector TIMERCAP @ 0x1ff8 ; 1FF6 #pragma vector TIMERCMP @ 0x1ff6 ; 1FF4 #pragma vector TIMEROV @ 0x1ff4 ; 1FF2 #pragma vector SCI @ 0x1ff2 ; #pragma has STOP ; #pragma has WAIT ; #pragma has MUL ; /* Register assignments for the 68HC705B5 microcontroller */ 0000 #pragma portrw porta @ 0x00; /* */ 0001 #pragma portrw portb @ 0x01; /* */ 0002 #pragma portrw portc @ 0x02; /* */ 0003 #pragma portrw portd @ 0x03; /* in ,– ,SS ,SCK ,MOSI ,MISO,TxD,RxD */ 0004 #pragma portrw ddra @ 0x04; /* Data direction, Port A */ 0005 #pragma portrw ddrb @ 0x05; /* Data direction, Port B */ 0006 #pragma portrw ddrc @ 0x06; /* Data direction, Port C (all output) */ 0007 #pragma portrw eeclk @ 0x07; /* eeprom/eclk cntl */ 0008 #pragma portrw addata @ 0x08; /* a/d data register */ 0009 #pragma portrw adstat @ 0x09; /* a/d stat/control */ 000A #pragma portrw plma @ 0x0a; /* pulse length modulation a */ 000B #pragma portrw plmb @ 0x0b; /* pulse length modulation b */ 000C #pragma portrw misc @ 0x0c; /* miscellaneous register */ 000D #pragma portrw scibaud @ 0x0d; /* sci baud rate register */ 000E #pragma portrw scicntl1 @ 0x0e; /* sci control 1 */ 000F #pragma portrw scicntl2 @ 0x0f; /* sci control 2 */ 0010 #pragma portrw scistat @ 0x10; /* sci status reg */ 0011 #pragma portrw scidata @ 0x11; /* SCI Data */ 0012 #pragma portrw tcr @ 0x12; /* ICIE,OCIE,TOIE,0;0,0,IEGE,OLVL */ 0013 #pragma portrw tsr @ 0x13; /* ICF,OCF,TOF,0; 0,0,0,0 */ 0014 #pragma portrw icaphi1 @ 0x14; /* Input Capture Reg (Hi–0x14, Lo–0x15) */ 0015 #pragma portrw icaplo1 @ 0x15; /* Input Capture Reg (Hi–0x14, Lo–0x15) */ 0016 #pragma portrw ocmphi1 @ 0x16; /* Output Compare Reg (Hi–0x16, Lo–0x17) */ 0017 #pragma portrw ocmplo1 @ 0x17; /* Output Compare Reg (Hi–0x16, Lo–0x17) */ 0018 #pragma portrw tcnthi @ 0x18; /* Timer Count Reg (Hi–0x18, Lo–0x19) */ 0019 #pragma portrw tcntlo @ 0x19; /* Timer Count Reg (Hi–0x18, Lo–0x19) */ 001A #pragma portrw aregnthi @ 0x1A; /* Alternate Count Reg (Hi–$1A, Lo–$1B) */ 001B #pragma portrw aregntlo @ 0x1B; /* Alternate Count Reg (Hi–$1A, Lo–$1B) */ 001C #pragma portrw icaphi2 @ 0x1c; /* Input Capture Reg (Hi–0x1c, Lo–0x1d) */ 001D #pragma portrw icaplo2 @ 0x1d; /* Input Capture Reg (Hi–0x1c, Lo–0x1d) */ 001E #pragma portrw ocmphi2 @ 0x1e; /* Output Compare Reg (Hi–0x1e, Lo–0x1f) */ 001F #pragma portrw ocmplo2 @ 0x1f; /* Output Compare Reg (Hi–0x1e, Lo–0x1f) */ Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0051/C0049/C0053 3–251Motorola Sensor Device Data www.motorola.com/semiconductors 1EFE 74 #pragma mor @ 0x1efe = 0x74; /* this disables the watchdog counter and does not add pull–down resistors on ports B and C */ /* put constants and variables here...they must be global */ /* lcd pattern table 0 1 2 3 4 5 6 7 8 9 */ 080A 27 10 03 E8 00 64 00 0A const long dectable[] = { 10000, 1000, 100, 10 }; 0050 0005 unsigned int digit[5]; /* buffer to hold results from cvt_bin_dec function */ 0812 00 96 00 4B 00 96 00 1E 00 const long type[] = { 150, 75, 150, 30, 103 }; 081B 67 /* MPX2010 MPX2050 MPX2100 MPX2200 MPX2700 The table above will cause the final results of the pressure to engineering units to display the 1.5, 7.3 and 15.0 devices with a decimal place in the tens position. The 30 and 103 psi devices will display in integer units. const long slope_const[]={ 450,418,423,427,432,436,441,445,454,459, 081C 01 C2 01 A2 01 A7 01 AB 01 463,468,472,477,481,450 };

0825 B0 01 B4 01 B9 01 BD 01 C6

082E 01 CB 01 CF 01 D4 01 D8 01

0837 DD 01 E1 01 C2

0000 registera areg; /* processor’s A register */ 0055 long atodtemp; /* temp to accumulate 100 a/d readings for smoothing */ 0059 long slope; /* multiplier for adc to engineering units conversion */ 005B int adcnt; /* a/d converter loop counter */ 005C long xdcr_offset; /* initial xdcr offset */ 005E long sensor_model; /* installed sensor based on J1..J3 */ 0060 int sensor_index; /* determine the location of the decimal pt. */ 0061 0063 unsigned long i,j; /* counter for loops */ 0065 unsigned int k; /* misc variable */ struct bothbytes { int hi; { int lo; union isboth 0066 0002 { long l; 0066 0002 struct bothbytes b; 0066 0002 }; 0066 0002 union isboth q; /* used for timer set–up */ /* variables for add32 */ 0068 0004 unsigned long SUM[2]; /* result */ 006C 0004 unsigned long ADDEND[2]; /* one input */ 0070 0004 unsigned long AUGEND[2]; /* second input */ /* variables for sub32 */ 0074 0004 unsigned long MINUE[2]; /* minuend */ 0078 0004 unsigned long SUBTRA[2]; /* subtrahend */ 007C 0004 unsigned long DIFF[2]; /* difference */ /* variables for mul32 */ 0080 0004 unsigned long MULTP[2]; /* multiplier */ 0084 0004 unsigned long MTEMP[2]; /* high order 4 bytes at return */ 0088 0004 unsigned long MULCAN[2]; /* multiplicand at input, low 4 bytes at return */ Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0051/C0049/C0053 3–252 Motorola Sensor Device Datawww.motorola.com/semiconductors /* variables for div32 */ 008C 0004 unsigned long DVDND[2]; /* Dividend */ 0090 0004 unsigned long DVSOR[2]; /* Divisor */ 0094 0004 unsigned long QUO[2]; /* Quotient */ 0098 unsigned int CNT; /* Loop counter */ /* The code starts here */ void add32() #asm * Add two 32–bit values. * Inputs: * ADDEND: ADDEND[0..3] HIGH ORDER BYTE IS ADDEND+0 * AUGEND: AUGEND[0..3] HIGH ORDER BYTE IS AUGEND+0 * Output: * SUM: SUM[0..3] HIGH ORDER BYTE IS SUM+0 083C B6 6F LDA ADDEND+3 low byte 083E BB 73 ADD AUGEND+3

0840 B7 6B STA SUM+3

0842 B6 6E LDA ADDEND+2 medium low byte

0844 B9 72 ADC AUGEND+2

0846 B7 6A STA SUM+2

0848 B6 6D LDA ADDEND+1 medium high byte

084E B6 6C LDA ADDEND high byte

0850 B9 70 ADC AUGEND

0852 B7 68 STA SUM

#endasm 0855 81 RTS } void sub32() #asm * Subtract two 32–bit values. * Input: * Minuend: MINUE[0..3] * Subtrahend: SUBTRA[0..3] * Output: * Difference: DIFF[1..0]

0856 B6 77 LDA MINUE+3 low byte

0858 B0 7B SUB SUBTRA+3

085C B6 76 LDA MINUE+2 medium low byte 085E B2 7A SBC SUBTRA+2

0860 B7 7E STA DIFF+2

0862 B6 75 LDA MINUE+1 medium high byte

0864 B2 79 SBC SUBTRA+1

0866 B7 7D STA DIFF+1

0868 B6 74 LDA MINUE high byte

#endasm 086F 81 RTS } void mul32() #asm * Multiply 32–bit value by a 32–bit value * Input: Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0051/C0049/C0053 3–253Motorola Sensor Device Data www.motorola.com/semiconductors * Multiplier: MULTP[0..3] * Multiplicand: MULCAN[0..3] * Output: * Product: MTEMP[0..3] AND MULCAN[0..3] MTEMP[0] IS THE HIGH * ORDER BYTE AND MULCAN[3] IS THE LOW ORDER BYTE * THIS ROUTINE DOES NOT USE THE MUL INSTRUCTION FOR THE SAKE OF USERS NOT * USING THE HC(7)05 SERIES PROCESSORS.

0870 AE 20 LDX #32 loop counter

0872 3F 84 CLR MTEMP clean–up for result 0874 3F 85 CLR MTEMP+1 * 0876 3F 86 CLR MTEMP+2 * 0878 3F 87 CLR MTEMP+3 * 087A 36 88 ROR MULCAN low but to carry, the rest one to the right 087C 36 89 ROR MULCAN+1 * 087E 36 8A ROR MULCAN+2 * 0880 36 8B ROR MULCAN+3 * 0882 24 18 MNEXT BCC ROTATE if carry is set, do the add

0884 B6 87 LDA MTEMP+3 *

0886 BB 83 ADD MULTP+3 *

0888 B7 87 STA MTEMP+3 *

088A B6 86 LDA MTEMP+2 * 088C B9 82 ADC MULTP+2 * 088E B7 86 STA MTEMP+2 *

0890 B6 85 LDA MTEMP+1 *

0892 B9 81 ADC MULTP+1 *

0894 B7 85 STA MTEMP+1 *

0896 B6 84 LDA MTEMP *

0898 B9 80 ADC MULTP *

089A B7 84 STA MTEMP * 089C 36 84 ROTATE ROR MTEMP else: shift low bit to carry, the rest to the right 089E 36 85 ROR MTEMP+1 * 08A0 36 86 ROR MTEMP+2 * 08A2 36 87 ROR MTEMP+3 * 08A4 36 88 ROR MULCAN * 08A6 36 89 ROR MULCAN+1 * 08A8 36 8A ROR MULCAN+2 * 08AA 36 8B ROR MULCAN+3 * 08AC 5A DEX bump the counter down 08AD 26 D3 BNE MNEXT done yet ? 08AF 81 RTS done #endasm 08B0 81 RTS } void div32() #asm * Divide 32 bit by 32 bit unsigned integer routine * Input: * Dividend: DVDND [+0..+3] HIGH ORDER BYTE IS DVND+0 * Divisor: DVSOR [+0..+3] HIGH ORDER BYTE IS DVSOR+0 * Output: * Quotient: QUO [+0..+3] HIGH ORDER BYTE IS QUO+0 08B1 3F 94 CLR QUOzero result registers 08B3 3F 95 CLR QUO+1 * 08B5 3F 96 CLR QUO+2 * 08B7 3F 97 CLR QUO+3 * 08B9 A6 01 LDA #1 initial loop count 08BB 3D 90 TST DVSOR if the high order bit is set..no need to shift DVSOR 08BD 2B 0F BMI DIV153 08BF 4C DIV151 INCA bump the loop counter 08C0 38 93 ASL DVSOR+3 now shift the divisor until the high order bit = 1 08C2 39 92 ROL DVSOR+2 08C4 39 91 ROL DVSOR+1 * 08C6 39 90 ROL DVSOR * 08C8 2B 04 BMI DIV153 done if high order bit = 1 Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0051/C0049/C0053 3–254 Motorola Sensor Device Datawww.motorola.com/semiconductors 08CA A1 21 CMP #33 have we shifted all possible bits in the DVSOR yet ? 08CC 26 F1 BNE DIV151 no 08CE B7 98 DIV153 STA CNT save the loop counter so we can do the divide 08D0 B6 8F DIV163 LDA DVDND+3 sub 32 bit divisor from dividend 08D2 B0 93 SUB DVSOR+3 * 08D4 B7 8F STA DVDND+3 * 08D6 B6 8E LDA DVDND+2 * 08D8 B2 92 SBC DVSOR+2 * 08DA B7 8E STA DVDND+2 * 08DC B6 8D LDA DVDND+1 * 08DE B2 91 SBC DVSOR+1 * 08E0 B7 8D STA DVDND+1 * 08E2 B6 8C LDA DVDND * 08E4 B2 90 SBC DVSOR * 08E6 B7 8C STA DVDND * 08E8 24 1B BCC DIV165 carry is clear if DVSOR was larger than DVDND 08EA B6 8F LDA DVDND+3 add the divisor back...was larger than the dividend 08EC BB 93 ADD DVSOR+3 * 08EE B7 8F STA DVDND+3 * 08F0 B6 8E LDA DVDND+2 * 08F2 B9 92 ADC DVSOR+2 * 08F4 B7 8E STA DVDND+2 * 08F6 B6 8D LDA DVDND+1 * 08F8 B9 91 ADC DVSOR+1 * 08FA B7 8D STA DVDND+1 * 08FC B6 8C LDA DVDND * 08FE B9 90 ADC DVSOR *

0900 B7 8C STA DVDND *

0902 98 CLC this will clear the respective bit in QUO due to * the need to add DVSOR back to DVND 0903 20 01 BRA DIV167 0905 99 DIV165 SEC this will set the respective bit in QUO 0906 39 97 DIV167 ROL QUO+3 set or clear the low order bit in QUO based on above 0908 39 96 ROL QUO+2 * 090A 39 95 ROL QUO+1 * 090C 39 94 ROL QUO * 090E 34 90 LSR DVSOR divide the divisor by 2 0910 36 91 ROR DVSOR+1 * 0912 36 92 ROR DVSOR+2 * 0914 36 93 ROR DVSOR+3 * 0916 3A 98 DEC CNT bump the loop counter down 0918 26 B6 BNE DIV163 finished yet ? 091A 81 RTSyes #endasm 091B 81 RTS } /* These interrupts are not used...give them a graceful return if for some reason one occurs */ 1FFC 09 1C __SWI(){} 091C 80 RTI 1FFA 09 1D IRQ(){} 091D 80 RTI 1FF8 09 1E TIMERCAP(){} 091E 80 RTI 1FF4 09 1F TIMEROV(){} 091F 80 RTI 1FF2 09 20 SCI(){} 0920 80 RTI void sensor_type() 0921 B6 03 LDA $03 k = portd & 0x0e; /* we only care about bits 1..3 */

0923 A4 0E AND #$0E

0925 B7 65 STA $65

0927 34 65 LSR $65 k = k >> 1; /* right justify the variable */

0929 B6 65 LDA $65 if ( k > 4 )

092B A1 04 CMP #$04 Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0051/C0049/C0053 3–255Motorola Sensor Device Data www.motorola.com/semiconductors 092D 23 0C BLS $093B { /* we have a set–up error in wire jumpers J1 – J3 */ 092F 3F 02 CLR $02 portc = 0; /* */

0931 A6 6E LDA #$6E portb = 0x6e; /* S */

0933 B7 01 STA $01

0935 A6 CE LDA #$CE porta = 0xce; /* E */

0937 B7 00 STA $00

0939 20 FE BRA $0939 while(1); 093B B6 65 LDA $65 sensor_index = k; 093D B7 60 STA $60 093F 97 TAX sensor_model = type[k]; 0940 58 LSLX

0941 D6 08 12 LDA $0812,X

0944 B7 5E STA $5E

0946 D6 08 13 LDA $0813,X

0949 B7 5F STA $5F

094B 81 RTS } void sensor_slope() 094C B6 03 LDA $03 k=portd & 0xf0; /* we only care about bits 4..7 */ 094E A4 F0 AND #$F0

0950 B7 65 STA $65

0952 34 65 LSR $65 k = k >> 4; /* right justify the variable */ 0954 34 65 LSR $65 0956 34 65 LSR $65 0958 34 65 LSR $65 095A BE 65 LDX $65 slope = slope_const[k]; 095C 58 LSLX 095D D6 08 1C LDA $081C,X

0960 B7 59 STA $59

0962 D6 08 1D LDA $081D,X

0965 B7 5A STA $5A

0967 81 RTS } void delay(void) /* just hang around for a while */ 0968 3F 62 CLR $62 for (i=0; i<20000; ++i); 096A 3F 61 CLR $61 096C B6 62 LDA $62 096E A0 20 SUB #$20

0970 B6 61 LDA $61

0972 A2 4E SBC #$4E

0974 24 08 BCC $097E 0976 3C 62 INC $62 0978 26 02 BNE $097C 097A 3C 61 INC $61 097C 20 EE BRA $096C 097E 81 RTS } read_a2d(void) /* read the a/d converter on channel 5 and accumulate the result in atodtemp */ 097F 3F 56 CLR $56 atodtemp=0; /* zero for accumulation */ 0981 3F 55 CLR $55 0983 3F 5B CLR $5B for ( adcnt = 0 ; adcnt<100; ++adcnt) /* do 100 a/d conversions */

0985 B6 5B LDA $5B

0987 A8 80 EOR #$80

0989 A1 E4 CMP #$E4

098B 24 21 BCC $09AE 098D A6 20 LDA #$20 adstat = 0x20; /* convert on channel 0 */ 098F B7 09 STA $09 0991 0F 09 FD BRCLR 7,$09,$0991 while (!(adstat & 0x80)); /* wait for a/d to complete */

0994 B6 08 LDA $08 atodtemp = addata + atodtemp;

0996 3F 57 CLR $57

0998 B7 58 STA $58

iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0051/C0049/C0053 3–256 Motorola Sensor Device Datawww.motorola.com/semiconductors 099A BB 56 ADD $56 099C B7 58 STA $58 099E B6 57 LDA $57 09A0 B9 55 ADC $55 09A2 B7 57 STA $57 09A4 B7 55 STA $55 09A6 B6 58 LDA $58 09A8 B7 56 STA $56 09AA 3C 5B INC $5B 09AC 20 D7 BRA $0985 09AE B6 56 LDA $56 atodtemp = atodtemp/100; 09B0 B7 58 STA $58 09B2 B6 55 LDA $55 09B4 B7 57 STA $57 09B6 3F 9A CLR $9A 09B8 A6 64 LDA #$64 09BA B7 9B STA $9B 09BC CD 0B F1 JSR $0BF1 09BF CD 0C 22 JSR $0C22 09C2 BF 55 STX $55 09C4 B7 56 STA $56 09C6 81 RTS return atodtemp; void fixcompare (void) /* sets–up the timer compare for the next interrupt */ 09C7 B6 18 LDA $18 q.b.hi =tcnthi; 09C9 B7 66 STA $66 09CB B6 19 LDA $19 q.b.lo = tcntlo; 09CD B7 67 STA $67 09CF AB 4C ADD #$4C q.l +=7500; /* ((4mhz xtal/2)/4) = counter period = 2us.*7500 = 15ms. */ 09D1 B7 67 STA $67 09D3 B6 66 LDA $66 09D5 A9 1D ADC #$1D 09D7 B7 66 STA $66 09D9 B7 16 STA $16 ocmphi1 = q.b.hi; 09DB B6 13 LDA $13 areg=tsr; /* dummy read */ 09DD B6 67 LDA $67 ocmplo1 = q.b.lo; 09DF B7 17 STA $17 09E1 81 RTS } void TIMERCMP (void) /* timer service module */ 1FF6 09 E2 { 09E2 33 02 COM $02 portc =~ portc; /* service the lcd by inverting the ports */ 09E4 33 01 COM $01 portb =~ portb; 09E6 33 00 COM $00 porta =~ porta; 09E8 AD DD BSR $09C7 fixcompare(); 09EA 80 RTI } void adzero(void) /* called by initio() to save initial xdcr’s zero pressure offset voltage output */ 09EB 3F 64 CLR $64 for ( j=0; j<20; ++j) /* give the sensor time to ”warm–up” and the 09ED 3F 63 CLR $63 09EF B6 64 LDA $64 09F1 A0 14 SUB #$14 09F3 B6 63 LDA $63 09F5 A2 00 SBC #$00 09F7 24 0B BCC $0A04 power supply time to settle down */ 09F9 CD 09 68 JSR $0968 delay(); 09FC 3C 64 INC $64 09FE 26 02 BNE $0A02 0A00 3C 63 INC $63 0A02 20 EB BRA $09EF 0A04 CD 09 7F JSR $097F xdcr_offset = read_a2d(); Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0051/C0049/C0053 3–257Motorola Sensor Device Data www.motorola.com/semiconductors 0A07 3F 5C CLR $5C 0A09 B7 5D STA $5D 0A0B 81 RTS } void initio (void) /* setup the I/O */ 0A0C A6 20 LDA #$20 adstat = 0x20; /* power–up the A/D */ 0A0E B7 09 STA $09 0A10 3F 02 CLR $02 porta = portb = portc = 0; 0A12 3F 01 CLR $01 0A14 3F 00 CLR $00 0A16 A6 FF LDA #$FF ddra = ddrb = ddrc = 0xff; 0A18 B7 06 STA $06 0A1A B7 05 STA $05 0A1C B7 04 STA $04 0A1E B6 13 LDA $13 areg=tsr; /* dummy read */ 0A20 3F 1E CLR $1E ocmphi1 = ocmphi2 = 0; 0A22 3F 16 CLR $16 0A24 B6 1F LDA $1F areg = ocmplo2; /* clear out output compare 2 if it happens to be set */ 0A26 AD 9F BSR $09C7 fixcompare(); /* set–up for the first timer interrupt */ 0A28 A6 40 LDA #$40 tcr = 0x40; 0A2A B7 12 STA $12 0A2C 9A CLI CLI; /* let the interrupts begin ! */ /* write CAL to the display */ 0A2D A6 CC LDA #$CC portc = 0xcc; /* C */ 0A2F B7 02 STA $02 0A31 A6 BE LDA #$BE portb = 0xbe; /* A */ 0A33 B7 01 STA $01 0A35 A6 C4 LDA #$C4 porta = 0xc4; /* L */ 0A37 B7 00 STA $00 0A39 CD 09 21 JSR $0921 sensor_type(); /* get the model of the sensor based on J1..J3 */ 0A3C AD AD BSR $09EB adzero(); /* auto zero */ 0A3E 81 RTS } void cvt_bin_dec(unsigned long arg) /* First converts the argument to a five digit decimal value. The msd is in the lowest address. Then leading zero suppress the value and write it to the display ports. The argument value is 0..65535 decimal. */ 009D { 0A3F BF 9D STX $9D 0A41 B7 9E STA $9E 009F char i; 00A0 unsigned long l; 0A43 3F 9F CLR $9F for ( i=0; i < 5; ++i ) 0A45 B6 9F LDA $9F 0A47 A1 05 CMP #$05 0A49 24 07 BCC $0A52 0A4B 97 TAX digit[i] = 0x0; /* put blanks in all digit positions */ 0A4C 6F 50 CLR $50,X 0A4E 3C 9F INC $9F 0A50 20 F3 BRA $0A45 0A52 3F 9F CLR $9F for ( i=0; i < 4; ++i ) 0A54 B6 9F LDA $9F 0A56 A1 04 CMP #$04 0A58 24 7A BCC $0AD4 0A5A 97 TAX if ( arg >= dectable [i] ) 0A5B 58 LSLX 0A5C D6 08 0B LDA $080B,X 0A5F B0 9E SUB $9E 0A61 B7 58 STA $58 0A63 B6 9D LDA $9D 0A65 A8 80 EOR #$80 0A67 B7 57 STA $57 0A69 D6 08 0A LDA $080A,X 0A6C A8 80 EOR #$80 0A6E B2 57 SBC $57 Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0051/C0049/C0053 3–258 Motorola Sensor Device Datawww.motorola.com/semiconductors 0A70 BA 58 ORA $58 0A72 22 5C BHI $0AD0 0A74 BE 9F LDX $9F l = dectable[i]; 0A76 58 LSLX 0A77 D6 08 0A LDA $080A,X 0A7A B7 A0 STA $A0 0A7C D6 08 0B LDA $080B,X 0A7F B7 A1 STA $A1 0A81 B6 9E LDA $9E digit[i] = arg / l; 0A83 B7 58 STA $58 0A85 B6 9D LDA $9D 0A87 B7 57 STA $57 0A89 B6 A0 LDA $A0 0A8B B7 9A STA $9A 0A8D B6 A1 LDA $A1 0A8F B7 9B STA $9B 0A91 CD 0B F1 JSR $0BF1 0A94 CD 0C 22 JSR $0C22 0A97 BF 57 STX $57 0A99 B7 58 STA $58 0A9B BE 9F LDX $9F 0A9D E7 50 STA $50,X 0A9F BE 9F LDX $9F arg = arg–(digit[i] * l); 0AA1 E6 50 LDA $50,X 0AA3 3F 57 CLR $57 0AA5 B7 58 STA $58 0AA7 B6 A0 LDA $A0 0AA9 B7 9A STA $9A 0AAB B6 A1 LDA $A1 0AAD B7 9B STA $9B 0AAF CD 0B D2 JSR $0BD2 0AB2 BF 57 STX $57 0AB4 B7 58 STA $58 0AB6 33 57 COM $57 0AB8 30 58 NEG $58 0ABA 26 02 BNE $0ABE 0ABC 3C 57 INC $57 0ABE B6 58 LDA $58 0AC0 BB 9E ADD $9E 0AC2 B7 58 STA $58 0AC4 B6 57 LDA $57 0AC6 B9 9D ADC $9D 0AC8 B7 57 STA $57 0ACA B7 9D STA $9D 0ACC B6 58 LDA $58 0ACE B7 9E STA $9E 0AD0 3C 9F INC $9F 0AD2 20 80 BRA $0A54 0AD4 B6 9E LDA $9E digit[i] = arg; 0AD6 B7 58 STA $58 0AD8 B6 9D LDA $9D 0ADA B7 57 STA $57 0ADC BE 9F LDX $9F 0ADE B6 58 LDA $58 0AE0 E7 50 STA $50,X /* now zero suppress and send the lcd pattern to the display */ 0AE2 9B SEI SEI; 0AE3 3D 52 TST $52 if ( digit[2] == 0 ) /* leading zero suppression */ 0AE5 26 04 BNE $0AEB 0AE7 3F 02 CLR $02 portc = 0; 0AE9 20 07 BRA $0AF2 else 0AEB BE 52 LDX $52 portc = ( lcdtab[digit[2]] ); /* 100’s digit */ 0AED D6 08 00 LDA $0800,X 0AF0 B7 02 STA $02 0AF2 3D 52 TST $52 if ( digit[2] == 0 && digit[3] == 0 ) 0AF4 26 08 BNE $0AFE 0AF6 3D 53 TST $53 0AF8 26 04 BNE $0AFE 0AFA 3F 01 CLR $01 portb=0; 0AFC 20 07 BRA $0B05 else 0AFE BE 53 LDX $53 portb = ( lcdtab[digit[3]] ); /* 10’s digit */ 0B00 D6 08 00 LDA $0800,X Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0051/C0049/C0053 3–259Motorola Sensor Device Data www.motorola.com/semiconductors 0B03 B7 01 STA $01 0B05 BE 54 LDX $54 porta = ( lcdtab[digit[4]] ); /* 1’s digit */ 0B07 D6 08 00 LDA $0800,X 0B0A B7 00 STA $00 /* place the decimal point only if the sensor is 15 psi or 7.5 psi */ 0B0C B6 60 LDA $60 if ( sensor_index < 3 ) 0B0E A8 80 EOR #$80 0B10 A1 83 CMP #$83 0B12 24 08 BCC $0B1C 0B14 BE 54 LDX $54 porta = ( lcdtab[digit[4]]+1 ); /* add the decimal point to the lsd */ 0B16 D6 08 00 LDA $0800,X 0B19 4C INCA 0B1A B7 00 STA $00 0B1C 3D 60 TST $60 if(sensor_index ==0) /* special case */ 0B1E 26 0F BNE $0B2F 0B20 BE 54 LDX $54 porta = ( lcdtab[digit[4]] ); /* get rid of the decimal at lsd */ 0B22 D6 08 00 LDA $0800,X 0B25 B7 00 STA $00 0B27 BE 53 LDX $53 portb = ( lcdtab[digit[3]]+1 ); /* decimal point at middle digit */ 0B29 D6 08 00 LDA $0800,X 0B2C 4C INCA 0B2D B7 01 STA $01 0B2F 9A CLI CLI; 0B30 CD 09 68 JSR $0968 delay(); 0B33 81 RTS } void display_psi(void) At power–up it is assumed that the pressure or vacuum port of the sensor is open to atmosphere. The code in initio() delays for the sensor and power supply to stabilize. One hundred A/D conversions are averaged. That result is called xdcr_offset. This routine calls the A/D routine which performs one hundred conversions, divides the result by 100 and returns the value. If the value returned is less than or equal to the xdcr_offset, the value of xdcr_offset is substituted. If the value returned is greater than xdcr_offset, xdcr_offset is subtracted from the returned value. while(1) 0B34 CD 09 7F JSR $097F atodtemp = read_a2d(); /* atodtemp = raw a/d ( 0..255 ) */ 0B37 3F 55 CLR $55 0B39 B7 56 STA $56 0B3B B0 5D SUB $5D if ( atodtemp <= xdcr_offset ) 0B3D B7 58 STA $58 0B3F B6 5C LDA $5C 0B41 A8 80 EOR #$80 0B43 B7 57 STA $57 0B45 B6 55 LDA $55 0B47 A8 80 EOR #$80 0B49 B2 57 SBC $57 0B4B BA 58 ORA $58 0B4D 22 08 BHI $0B57 0B4F B6 5C LDA $5C atodtemp = xdcr_offset; 0B51 B7 55 STA $55 0B53 B6 5D LDA $5D 0B55 B7 56 STA $56 0B57 B6 56 LDA $56 atodtemp –= xdcr_offset; /* remove the offset */ 0B59 B0 5D SUB $5D 0B5B B7 56 STA $56 0B5D B6 55 LDA $55 0B5F B2 5C SBC $5C 0B61 B7 55 STA $55 0B63 CD 09 4C JSR $094C sensor_slope(); /* establish the slope constant for this output */ 0B66 B6 56 LDA $56 atodtemp *= sensor_model; 0B68 B7 58 STA $58 0B6A B6 55 LDA $55 0B6C B7 57 STA $57 0B6E B6 5E LDA $5E Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0051/C0049/C0053 3–260 Motorola Sensor Device Datawww.motorola.com/semiconductors 0B70 B7 9A STA $9A 0B72 B6 5F LDA $5F 0B74 B7 9B STA $9B 0B76 CD 0B D2 JSR $0BD2 0B79 BF 55 STX $55 0B7B B7 56 STA $56 0B7D 3F 89 CLR $89 MULTP[0] = MULCAN[0] = 0; 0B7F 3F 88 CLR $88 0B81 3F 81 CLR $81 0B83 3F 80 CLR $80 0B85 9F TXA MULTP[1] = atodtemp; 0B86 B7 82 STA $82 0B88 B6 56 LDA $56 0B8A B7 83 STA $83 0B8C B6 59 LDA $59 MULCAN[1] = slope; 0B8E B7 8A STA $8A 0B90 B6 5A LDA $5A 0B92 B7 8B STA $8B 0B94 CD 08 70 JSR $0870 mul32(); /* analog value * slope based on J1 through J3 */ 0B97 3F 90 CLR $90 DVSOR[0] = 1; /* now divide by 100000 */ 0B99 A6 01 LDA #$01 0B9B B7 91 STA $91 0B9D A6 86 LDA #$86 DVSOR[1] = 0x86a0; 0B9F B7 92 STA $92 0BA1 A6 A0 LDA #$A0 0BA3 B7 93 STA $93 0BA5 B6 88 LDA $88 DVDND[0] = MULCAN[0]; 0BA7 B7 8C STA $8C 0BA9 B6 89 LDA $89 0BAB B7 8D STA $8D 0BAD B6 8A LDA $8A DVDND[1] = MULCAN[1]; 0BAF B7 8E STA $8E 0BB1 B6 8B LDA $8B 0BB3 B7 8F STA $8F 0BB5 CD 08 B1 JSR $08B1 div32(); 0BB8 B6 96 LDA $96 atodtemp = QUO[1]; /* convert to psi */ 0BBA B7 55 STA $55 0BBC B6 97 LDA $97 0BBE B7 56 STA $56 0BC0 BE 55 LDX $55 cvt_bin_dec( atodtemp ); /* convert to decimal and display */ 0BC2 CD 0A 3F JSR $0A3F 0BC5 CC 0B 34 JMP $0B34 } 0BC8 81 RTS } void main() 0BC9 CD 0A 0C JSR $0A0C initio(); /* set–up the processor’s i/o */ 0BCC CD 0B 34 JSR $0B34 display_psi(); 0BCF 20 FE BRA $0BCF while(1); /* should never get back to here */ 0BD1 81 RTS } 0BD2 BE 58 LDX $58 0BD4 B6 9B LDA $9B 0BD6 42 MUL 0BD7 B7 A4 STA $A4 0BD9 BF A5 STX $A5 0BDB BE 57 LDX $57 0BDD B6 9B LDA $9B 0BDF 42 MUL 0BE0 BB A5 ADD $A5 0BE2 B7 A5 STA $A5 0BE4 BE 58 LDX $58 0BE6 B6 9A LDA $9A 0BE8 42 MUL 0BE9 BB A5 ADD $A5 0BEB B7 A5 STA $A5 0BED 97 TAX 0BEE B6 A4 LDA $A4 0BF0 81 RTS 0BF1 3F A4 CLR $A4 0BF3 5F CLRX 0BF4 3F A2 CLR $A2 0BF6 3F A3 CLR $A3 0BF8 5C INCX 0BF9 38 58 LSL $58 Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0051/C0049/C0053 3–262 Motorola Sensor Device Datawww.motorola.com/semiconductors 0B00 : XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX 0B40 : XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX 0B80 : XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX 0BC0 : XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX XXXXXXXXXXXXXXXX All other memory blocks unused. Errors : 0 Warnings : 0 Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

analog circuitry, control logic, or a microcontroller unit (MCU). that occur at input pins designated for screening such events. pulse width of an incoming square or rectangular wave signal. electrically noisy environments. Figure 1. DEVB160 Frequency Output Sensor EVB Freescale Semiconductor, Inc.

/C0065/C0078/C0049/C0051/C0049/C0054 3–264 Motorola Sensor Device Datawww.motorola.com/semiconductors The following sections will detail the design issues involved in such a system architecture, and will provide an example circuit which has been developed as an evaluation tool for frequency output pressure sensor applications. DESIGN CONSIDERATIONS Signal Conditioning Motorola’s MPX2000 Series sensors are temperature compensated and calibrated – i.e. – offset and full–scale span are precision trimmed – pressure transducers. These sensors are available in full–scale pressure ranges from 10 kPa (1.5 psi) to 200 kPa (30 psi). Although the specifications in the data sheets apply only to a 10 V supply voltage, the output of these devices is ratiometric with the supply voltage. At the absolute maximum supply voltage specified, 16 V, the sensor will produce a differential output voltage of 64 mV at the rated full–scale pressure of the given sensor. One exception to this is that the full–scale span of the MPX2010 (10 kPa sensor) will be only 40 mV due to a slightly lower sensitivity. Since the maximum supply voltage produces the most output voltage, it is evident that even the best case scenario will require some signal conditioning to obtain a usable voltage level. Many different “instrumentation–type” amplifier circuits can satisfy the signal conditioning needs of these devices. Depending on the precision and temperature performance demanded by a given application, one can design an amplifier circuit using a wide variety of operational amplifier (op amp) IC packages with external resistors of various tolerances, or a precision–trimmed integrated instrumentation amplifier IC. In any case, the usual goal is to have a single–ended supply, “rail–to–rail” output (i.e. use as much of the range from ground to the supply voltage as possible, without saturating the op amps). In addition, one may need the flexibility of performing zero–pressure offset adjust and full–scale pressure calibration. The circuitry or device used to accomplish the voltage–to–frequency conversion will determine if, how, and where calibration adjustments are needed. See Evaluation Board Circuit Description section for details. Voltage–to–Frequency Conversion Since most semiconductor pressure sensors provide a voltage output, one must have a means of converting this voltage signal to a frequency that is proportional to the sensor output voltage. Assuming the analog voltage output of the sensor is proportional to the applied pressure, the resultant frequency will be linearly related to the pressure being measured. There are many different timing circuits that can perform voltage–to–frequency conversion. Most of the “simple” (relatively low number of components) circuits do not provide the accuracy or the stability needed for reliably encoding a signal quantity. Fortunately, many voltage–to–frequency (V/F) converter IC’s are commercially available that will satisfy this function. Switching Time Reduction One limitation of some V/F converters is the less than adequate switching transition times that effect the pulse or square–wave frequency signal. The required switching speed will be determined by the hardware used to detect the switching edges. The Motorola family of microcontrollers have input–capture functions that employ “Schmitt trigger–like” inputs with hysteresis on the dedicated input pins. In this case, slow rise and fall times will not cause an input capture pin to be in an indeterminate state during a transition. Thus, CMOS logic instability and significant timing errors will be prevented during slow transitions. Since the sensor’s frequency output may be interfaced to other logic configurations, a designer’s main concern is to comply with a worst–case timing scenario. For high–speed CMOS logic, the maximum rise and fall times are typically specified at several hundreds of nanoseconds. Thus, it is wise to speed up the switching edges at the output of the V/F converter. A single small–signal FET and a resistor are all that is required to obtain switching times below 100 ns. Besides eliminating the need for an A/D converter, a frequency output is conducive to applications in which the sensor output must be transmitted over long distances, or when the presence of noise in the sensor environment is likely to corrupt an otherwise healthy signal. For sensor outputs encoded as a voltage, induced noise from electromagnetic fields will contaminate the true voltage signal. A frequency signal has greater immunity to these noise sources and can be effectively filtered in proximity to the MCU input. In other words, the frequency measured at the MCU will be the frequency transmitted at the output of a sensor located remotely. Since high–frequency noise and 50–60 Hz line noise are the two most prominent sources for contamination of instrumentation signals, a frequency signal with a range in the low end of the kHz spectrum is capable of being well filtered prior to being examined at the MCU. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0051/C0049/C0054 3–265Motorola Sensor Device Data www.motorola.com/semiconductors Table 1. Specifications The evaluation board shown in Figure 1 is designed to transduce pressure, vacuum or differential pressure into a single–ended, ground referenced voltage that is then input to a voltage–to–frequency converter. It nominally provides a 1 kHz output at zero pressure and 10 kHz at full scale pressure. Zero pressure calibration is made with a trimpot that is located on the lower half of the left side of the board, while the full scale output can be calibrated via another trimpot just above the offset adjust. The board comes with an MPX2100DP sensor installed, but will accommodate any MPX2000 series sensor. One additional modification that may be required is that the gain of the circuit must be increased slightly when using an MPX2010 sensor. Specifically, the resistor R5 must be increased from 7.5 kΩ to 12 kΩ . Circuit Description The following pin description and circuit operation corresponds to the schematic shown in Figure 2. Pin–by–Pin Description B +: Input power is supplied at the B+ terminal of connector CN1. Minimum input voltage is 10 V and maximum is 30 V. Fout: A logic–level (5 V) frequency output is supplied at the OUT terminal (CN1). The nominal signal it provides is 1 kHz at zero pressure and 10 kHz at full scale pressure. Zero pressure frequency is adjustable and set with R12. Full–scale frequency is calibrated via R13. This output is designed to be directly connected to a microcontroller timer system input–capture channel. GND: The ground terminal on connector CN1 is intended for use as the power supply return and signal common. Test point terminal TP3 is also connected to ground, for measurement convenience. TP1: Test point 1 is connected to the final frequency output, Fout. TP2: Test point 2 is connected to the +5 V regulator output. It can be used to verify that this supply voltage is within its tolerance. TP3: Test point 3 is the additional ground point mentioned above in the GND description. TP4: Test point 4 is connected to the +8 V regulator output. It can be used to verify that this supply voltage is within its tolerance. P1, P2: Pressure and Vacuum ports P1 and P2 protrude from the sensor on the right side of the board. Pressure port P1 is on the top (marked side of package) and vacuum port P2, if present, is on the bottom. When the board is set up with a dual ported sensor (DP suffix), pressure applied to P1, vacuum applied to P2 or a differential pressure applied between the two all produce the same output voltage per kPa of input. Neither port is labeled. Absolute maximum differential pressure is 700 kPa. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

Figure 2. DEVB160 Frequency Output Sensor Evaluation Board Freescale Semiconductor, Inc.

The following is a table of the components that are assembled on the DEVB160 Frequency Output Sensor Evaluation Board. NOTE: All resistors are 1/4 watt, 5% tolerance values. All capacitors are 50 V rated, ±20% tolerance values. Freescale Semiconductor, Inc.

/C0065/C0078/C0049/C0051/C0049/C0054 3–268 Motorola Sensor Device Datawww.motorola.com/semiconductors Circuit Operation The voltage signal conditioning portion of this circuit is a variation on the classic instrumentation amplifier configuration. It is capable of providing high differential gain and good common–mode rejection with very high input impedance; however, it provides a more user friendly method of performing the offset/bias point adjustment. It uses four op amps and several resistors to amplify and level shift the sensor’s output. Most of the amplification is done in U1A which is configured as a differential amplifier. Unwanted current flow through the sensor is prevented by buffer U1B. At zero pressure the differential voltage from pin 2 to pin 4 on the sensor has been precision trimmed to essentially zero volts. The common–mode voltage on each of these nodes is 4 V (one–half the sensor supply voltage). The zero pressure output voltage at pin 1 of U1A is then 4.0 V, since any other voltage would be coupled back to pin 2 via R5 and create a non–zero bias across U1A’s differential inputs. This 4.0 V zero pressure DC output voltage is then level translated to the desired zero pressure offset voltage by U1C and U1D. The offset voltage is produced by R4 and adjustment trimpot R12. R7’s value is such that the total source impedance into pin 13 is approximately 1 k. The gain is approximately (R5/R6)(1 + R11/R10), which is 125 for the values shown in Figure 2. A gain of 125 is selected to provide a 4 V span for 32 mV of full–scale sensor output (at a sensor supply voltage of 8 V). The resulting .5 V to 4.5 V output from U1C is then converted by the V/F converter to the nominal 1–10 kHz that has been specified. The AD654 V/F converter receives the amplified sensor output at pin 8 of op amp U1C. The full–scale frequency is determined by R3, R13 and C3 according to the following formula: Fout (full-scale)/C0043 V in (10V)(R3 /C0041R13 )C3 For best performance, R3 and R13 should be chosen to provide 1 mA of drive current at the full–scale voltage produced at pin 3 of the AD654 (U3). The input stage of the AD654 is an op–amp; thus, it will work to make the voltage at pin 3 of U3 equal to the voltage seen at pin 4 of U3 (pins 3 and 4 are the input terminals of the op amp). Since the amplified sensor output will be 4.5 V at full–scale pressure, R3 + R13 should be approximately equal to 4.5 kΩ to have optimal linearity performance. Once the total resistance from pin 3 of U3 to ground is set, the value of C3 will determine the full–scale frequency output of the V/F. Trimpot R13 should be sized (relative to R3 value) to provide the desired amount of full–scale frequency adjustment. The zero–pressure frequency is adjusted via the offset adjust provided for calibrating the offset voltage of the signal conditioned sensor output. For additional information on using this particular V/F converter, see the applications information provided in the Analog Devices Data Conversion Products Databook. The frequency output has its edge transitions “sped” up by a small–signal FET inverter. This final output is directly compatible with microprocessor timer inputs, as well as any other high–speed CMOS logic. The amplifier portion of this circuit has been patented by Motorola Inc. and was introduced on evaluation board DEVB150A. Additional information pertaining to this circuit and the evaluation board DEVB150A is contained in Motorola Application Note AN1313.1 TEST/CALIBRATION PROCEDURE 1. Connect a +12 V supply between B+ and GND terminals on the connector CN1. 2. Connect a frequency counter or scope probe on the Fout terminal of CN1 or on TP1 with the test instrumentation ground clipped to TP3 or GND. 3 . Turn the power switch, S1, to the on position. Power LED, D1, should be illuminated. Verify that the voltage at TP2 and TP4 (relative to GND or TP3) is 5 V and 8 V, respectively. While monitoring the frequency output by whichever means one has chosen, one should see a 50% duty cycle square wave signal. 4. Turn the wiper of the OFFSET adjust trimpot, R12, to the approximate center of the pot. 5. Apply 100 kPa to pressure port P1 of the MPX2100DP (topside port on marked side of the package) sensor, X1. 6. Adjust the FULL–SCALE trimpot, R13, until the output frequency is 10 kHz. If 10 kHz is not within the trim range of the full–scale adjustment trimpot, tweak the offset adjust trimpot to obtain 10 kHz (remember, the offset pot was at an arbitrary midrange setting as per step 4). 7. Apply zero pressure to the pressure port (i.e., both ports at ambient pressure, no differential pressure applied). Adjust OFFSET trimpot so frequency output is 1 kHz. 8. Verify that zero pressure and full–scale pressure (100 kPa) produce 1 and 10 kHz respectively, at Fout and/or TP1. A second iteration of adjustment on both full–scale and offset may be necessary to fine tune the 1 – 10 kHz range. CONCLUSION Transforming conventional analog voltage sensor outputs to frequency has great utility for a variety of applications. Sensing remotely and/or in noisy environments is particularly challenging for low–level (mV) voltage output sensors such as the MPX2000 Series pressure sensors. Converting the MPX2000 sensor output to frequency is relatively easy to accomplish, while providing the noise immunity required for accurate pressure sensing. The evaluation board presented is an excellent tool for either “stand–alone” evaluation of the MPX2000 Series pressure sensors or as a building block for system prototyping which can make use of DEVB160 as a “drop–in” frequency output sensor solution. The output of the DEVB160 circuit is ideally conditioned for interfacing to MCU timer inputs that can measure the sensor frequency signal. REFERENCES 1. Schultz, Warren (Motorola, Inc.), “Sensor Building Block Evaluation Board,” Motorola Application Note AN1313. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

immune to noise on long interconnect lines. value while RV1 and RV2 decrease a similar amount. associated with piezoresistance. scale pressure produces 40 mV of differential output voltage. Figure 1. Sensor Equivalent Circuit output for zero differential input. The translation is one to one. offset voltage at the output. With R10 at 240 ohms, gain is set for a nominal value of 125. This provides a 4 V span for 32 mV of full scale sensor output. Freescale Semiconductor, Inc.

Figure 2. Instrumentation Amplifier Interface offset that was established in the instrumentation amplifier. Output voltage range is therefore 0.5 to 4.5 V.

Shown in Figure 4, it uses one quad op amp and several

pressure offset voltage (VOFFSET ) by U1C and U1D. Freescale Semiconductor, Inc.

source impedance into pin 13 is approximately 1 k. Figure 5. Simplified Sensor Specific Interface amplifier configuration in Figure 2. It also uses fewer parts. Freescale Semiconductor, Inc.

Figure 6. Application Example

15.0 OHMS

generated with current source U5 and capacitor C3. to both comparators U2A and U2B are at the same voltage. and PA1 go low, reading zero for zero pressure. analog to digital conversion. between PA0 and PA1 going low. typically used. They are frequency output and 4–20 mA loops. pressure, and 20 mA to full scale. Freescale Semiconductor, Inc.

Figure 7. Single Slope A/D Converter Freescale Semiconductor, Inc.

Figure 8. Frequency Output Pressure Sensor Freescale Semiconductor, Inc.

frequency is shown in Figure 8. It consists of three basic parts. to 1 kHz by adjusting the zero pressure input voltage with R3. clean up the edges and level translate the output to 5 V. ground and an output line) are routed to the sensor. for microcomputer A/D inputs. Figure 9. 4–20 mA Pressure Transducer full scale. Calibration is set with R5. Freescale Semiconductor, Inc.

Figure 10. MPX5100 LCD Pressure Gauge Freescale Semiconductor, Inc.

3–279Motorola Sensor Device Data www.motorola.com/semiconductors /C0065/C0078/C0049/C0051/C0050/C0050 /C0065/C0112/C0112/C0108/C0121/C0105/C0110/C0103 /C0083/C0101/C0109/C0105/C0099/C0111/C0110/C0100/C0117/C0099/C0116/C0111/C0114 /C0083/C0101/C0110/C0115/C0111/C0114/C0115 /C0116/C0111 /C0066/C0097/C0114 /C0071/C0114/C0097/C0112/C0104 /C0080/C0114/C0101/C0115/C0115/C0117/C0114/C0101 /C0071/C0097/C0117/C0103/C0101/C0115 Prepared by: Warren Schultz Discrete Applications Engineering INTRODUCTION Bar Graph displays are noted for their ability to very quickly convey a relative sense of how much of something is present. They are particularly useful in process monitoring applications where quick communication of a relative value is more important than providing specific data. Designing bar graph pressure gauges based upon semiconductor pressure sensors is relatively straightforward. The sensors can be interfaced to bar graph display drive IC’s, microcomputers and MC33161 voltage monitors. Design examples for all three types are included. BAR GRAPH DISPLAY DRIVER Interfacing semiconductor pressure sensors to a bar graph display IC such as an LM3914 is very similar to microcomputer interface. The same 0.5 to 4.5 V analog signal that a microcomputer’s A/D converter wants to see is also quite suitable for driving an LM3914. In Figure 1, this interface is provided by dual op amp U2 and several resistors. The op amp interface amplifies and level shifts the sensor’s output. To see how this amplifier works, simplify it by grounding the output of voltage divider R3, R5. If the common mode voltage at pins 2 and 4 of the sensor is 4.0 V, then pin 2 of U2A and pin 6 of U2B are also at 4.0 V. This puts 4.0 V across R6. Assuming that the current in R4 is equal to the current in R6, 323 µA • 100 ohms produces a 32 mV drop across R4 which adds to the 4.0 V at pin 2. The output voltage at pin 1 of U2A is, therefore, 4.032 V. This puts 4.032 – 4.0 V across R2, producing 43 µA. The same current flowing through R1 again produces a voltage drop of 4.0 V, which sets the output at zero. Substituting a divider output greater than zero into this calculation reveals that the zero pressure output voltage is equal to the output voltage of divider R3, R5. For this DC output voltage to be independent of the sensor’s common mode voltage, it is necessary to satisfy the condition that R1/R2 = R6/R4. Gain can be determined by assuming a differential output at the sensor and going through the same calculation. To do this assume 100 mV of differential output, which puts pin 2 of U2A at 3.95 V, and pin 6 of U2B at 4.05 V. Therefore, 3.95 V is applied to R6, generating 319 µA. This current flowing through R4 produces 31.9 mV, placing pin 1 of U2A at 3950 mV + 31.9 mV = 3982 mV. The voltage across R2 is then 4050 mV – 3982 mV = 68 mV, which produces a current of 91 µA that flows into R1. The output voltage is then 4.05 V + (91 µA • 93.1k) = 12.5 V. Dividing 12.5 V by the 100 mV input yields a gain of 125, which provides a 4.0 V span for 32 mV of full scale sensor output. Setting divider R3, R5 at 0.5 V results in a 0.5 V to 4.5 V output that is easily tied to an LM3914. The block diagram that appears in Figure 2 shows the LM3914’s internal architecture. Since the lower resistor in the input comparator chain is pinned out at RLO , it is a simple matter to tie this pin to a voltage that is approximately equal to the interface circuit’s 0.5 V zero pressure output voltage. Returning to Figure 1, this is accomplished by using the zero pressure offset voltage that is generated at the output of divider R3, R5. Again looking at Figure 1, full scale is set by adjusting the upper comparator’s reference voltage to match the sensor’s output at full pressure. An internal regulator on the LM3914 sets this voltage with the aid of resistors R7, R9, and adjustment pot R8. Eight volt regulated power is supplied by an MC78L08. The LED’s are powered directly from LM3914 outputs, which are set up as current sources. Output current to each LED is approximately 10 times the reference current that flows from pin 7 through R7, R8, and R9 to ground. In this design it is nominally (4.5 V/4.9 k)10 = 9.2 mA. Over a zero to 50°C temperature range combined accuracy for the sensor, interface, and driver IC are ±10%. Given a 10 segment display total accuracy for the bar graph readout is approximately ± (10 kPa +10%). This circuit can be simplified by substituting an MPX5100 integrated sensor for the MPX2100 and the op amp interface. The resulting schematic is shown in Figure 3. In this case zero reference for the bar graph is provided by dividing down the 5 V regulator with R4, R1 and adjustment pot R6. The voltage at the wiper of R6 is adjusted to match the sensor’s zero pressure offset voltage. It is connected to RLO to zero the bar graph. /C0077/C0079/C0084/C0079/C0082/C0079/C0076/C0065 SEMICONDUCTOR APPLICATION NOTE REV 1 Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

Figure 3. MPX5100 Bar Graph Pressure Gauge Figure 4. Microcomputer Bar Graph Pressure Gauge Freescale Semiconductor, Inc.

/C0065/C0078/C0049/C0051/C0050/C0050 3–283Motorola Sensor Device Data www.motorola.com/semiconductors MICROCOMPUTER BAR GRAPH Microcomputers with internal A/D converters such as an MC68HC05B5 lend themselves to easily creating bar graphs. Using the A/D converter to measure the sensor’s analog output voltage and output ports to individually switch LED’s makes a relatively straightforward pressure gauge. This type of design is facilitated by a new MDC4510A gated current sink. The MDC4510A takes one of the processor’s logic outputs and switches 10 mA to an LED. One advantage of this approach is that it is very flexible regarding the number of segments that are used, and has the availability through software to independently adjust scaling factors for each segment. This approach is particularly useful for process monitoring in systems where a microprocessor is already in place. Figure 4 shows a direct connection from an MPX5100 sensor to the microcomputer. Similar to the previous example, an MPX2000 series sensor with the op amp interface that is shown in Figure 1 can be substituted for the MPX5100. In this case the op amp interface’s output at pin 7 ties to port PD5, and its supply needs to come from a source greater than 6.5 V. PROCESS MONITOR For applications where an inexpensive HIGH-LOW-OK process monitor is required, the circuit in Figure 5 does a good job. It uses an MC33161 Universal Voltage Monitor and the same analog interface previously described to indicate high, low or in-range pressure. A block diagram of the MC33161 is illustrated in Figure 6. By tying pin 1 to pin 7 it is set up as a window detector. Whenever input 1 exceeds 1.27 V, two logic ones are placed at the inputs of its exclusive OR gate, turning off output 1. Therefore this output is on unless the lower threshold is exceeded. When 1.27 V is exceeded on input 2, just the opposite occurs. A single logic one appears at its exclusive OR gate, turning on output 2. These two outputs drive LED’s through MDC4010A 10 mA current sources to indicate low pressure and high pressure. Returning to Figure 5, an in-range indication is developed by turning on current source I1 whenever both the high and low outputs are off. This function is accomplished with a discrete gate made from D1, D2 and R7. Its output feeds the input of switched current source I1, turning it on with R7 when neither D1 nor D2 is forward biased. Thresholds are set independently with R8 and R9. They sample the same 4.0 V full scale span that is used in the other examples. However, zero pressure offset is targeted for 1.3 V. This voltage was chosen to approximate the 1.27 V reference at both inputs, which avoids throwing away the sensor’s analog output signal to overcome the MC33161’s input threshold. In addition, R10 and R11 are selected such that at full scale output, ie., 5.3 V on pin 7, the low side of the pots is nominally at 1.1 V. This keeps the minimum input just below the comparator thresholds of 1.27 V, and maximizes the resolution available from adjustment pots R8 and R9. When level adjustment is not desired, R8 – R11 can be replaced by a simpler string of three fixed resistors. CONCLUSION The circuits that have been shown here are intended to make simple, practical and cost effective bar graph pressure gauges. Their application involves a variety of trade-offs that can be matched to the needs of individual applications. In general, the most important trade-offs are the number of segments required and processor utilization. If the system in which the bar graph is used already has a microprocessor with unused A/D channels and I/O ports, tying MDC4510A current sources to the unused output ports is a very cost effective solution. On a stand-alone basis, the MC33161 based process monitor is the most cost effective where only 2 or 3 segments are required. Applications that require a larger number of segments are generally best served by one of the circuits that uses a dedicated bar graph display. REFERENCES 1. Alberkrack, Jade, & Barrow, Stephen; “Power Supply Monitor IC Fills Voltage Sensing Roles,” Power Conver- sion & Intelligent Motion, October 1991. 2. Lucas, William, “An Evaluation System for Direct Inter- face of the MPX5100 Pressure Sensor with a Micropro- cessor,” Motorola Application Note AN1305. 3. Schultz, Warren, “Integrated Sensor Simplifies Bar Graph Pressure Gauge,” Motorola Application Note AN1304. 4. Schultz, Warren, “Compensated Sensor Bar Graph Pressure Gauge,” Motorola Application Note AN1309. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

circuit that is better suited to sensor interface. A classic instrumentation amplifier is shown in Figure 1. Figure 1. Classic Instrumentation Amplifier Freescale Semiconductor, Inc.

providing a 4 V span for 32 mV of full scale sensor output. compared to 0.5 V for each of the following two circuits. resistors to amplify and level shift the sensor’s output. translation works, assume that the wiper of R9 is at ground. Freescale Semiconductor, Inc.

Figure 3. Sensor Specific Amplifier approximately translated into a DC offset. the condition that R1/R2 = (R3+R9)/R4. resistors that is associated with classic instrument amplifiers. it is the optimum choice for a low cost interface amplifier. Freescale Semiconductor, Inc.

Figure 1. Barometer System Freescale Semiconductor, Inc.

Table 3. MPX2100AP Electrical Characteristics this device are summarized in Table 3. circuitry is operated at a regulated supply voltage of 8 Vdc. sensor at sea level) will be approximately 32 mV. as the offset voltage and full–scale span tolerances indicate. amplifier is shown in Figure 3. parameters is illustrated below. used in the A/D conversion process to resolve 0.1 in–Hg. maximum and minimum absolute pressures, respectively. Freescale Semiconductor, Inc.

transfer function shown below. ΔV is the differential output of the sensor. developed using the MC68HC11 EVB development system.

Set up and enable A/D converter and SPI interface.
Initialize memory locations, initialize variables.
Make A/D conversion, store result.
Convert digital value to inches of mercury.
Determine if conversion is in system range.

6a. Convert pressure into decimal display digits. 6b. Otherwise, display range error message.

Output result via SPI to LCD driver device.

included at the beginning of the appendix. Figure 3. Signal Conditioning Circuit Freescale Semiconductor, Inc.

Figure 4. LCD Display Interface Diagram Freescale Semiconductor, Inc.

/C0065/C0078/C0049/C0051/C0050/C0054 3–293Motorola Sensor Device Data www.motorola.com/semiconductors APPENDIX MC68HC11 Barometer Software Available on: Motorola Electronic Bulletin Board MCU Freeware Line 8–bit, no parity, 1 stop bit 1200/300 baud (512) 891–FREE (3733) * BAROMETER APPLICATIONS PROJECT – Chris Winkler * Developed: October 1st, 1992 – Motorola Discrete Applications * This code will be used to implement an MC68HC11 Micro–Controller * as a processing unit for a simple barometer system. * The HC11 will interface with an MPX2100AP to monitor,store * and display measured Barometric pressure via the 8–bit A/D channel * The sensor output (32mv max) will be amplified to .5 – 2.5 V dc * The processor will interface with a 4–digit LCD (FE202) via * a Motorola LCD driver (MC145453) to display the pressure * within +/– one tenth of an inch of mercury. * The systems range is 15.0 – 30.5 in–Hg * A/D & CPU Register Assignment * This code will use index addressing to access the * important control registers. All addressing will be * indexed off of REGBASE, the base address for these registers. REGBASE EQU $1000 * register base of control register ADCTL EQU $30 * offset of A/D control register ADR2 EQU $32 * offset of A/D results register ADOPT EQU $39 * offset for A/D option register location PORTB EQU $04 * Location of PORTB used for conversion PORTD EQU $08 * PORTD Data Register Index DDRD EQU $09 * offset of Data Direction Reg. SPCR EQU $28 * offset of SPI Control Reg. SPSR EQU $29 * offset of SPI Status Reg. SPDR EQU $2A * offset of SPI Data Reg. * User Variables * The following locations are used to store important measurements * and calculations used in determining the altitude. They * are located in the lower 256 bytes of user RAM DIGIT1 EQU $0001 * BCD blank digit (not used) DIGIT2 EQU $0002 * BCD tens digit for pressure DIGIT3 EQU $0003 * BCD tenths digit for pressure DIGIT4 EQU $0004 * BCD ones digit for pressure COUNTER EQU $0005 * Variable to send 5 dummy bytes POFFSET EQU $0010 * Storage Location for max pressure offset SENSOUT EQU $0012 * Storage location for previous conversion RESULT EQU $0014 * Storage of Pressure(in Hg) in hex format FLAG EQU $0016 * Determines if measurement is within range * MAIN PROGRAM * The conversion process involves the following steps: * 1. Set–Up SPI device– SPI_CNFG * 2. Set–Up A/D, Constants SET_UP * 3. Read A/D, store sample ADCONV * 4. Convert into in–Hg IN_HG * 5. Determine FLAG condition IN_HG * a. Display error ERROR * b. Continue Conversion INRANGE * 6. Convert hex to BCD format BCDCONV * 7. Convert LCD display digits LOOKUP * 8. Output via SPI to LCD SPI2LCD * This process is continually repeated as the loop CONVERT * runs unconditionally through BRA (the BRANCH ALWAYS statement) * Repeats to step 3 indefinitely. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0051/C0050/C0054 3–294 Motorola Sensor Device Datawww.motorola.com/semiconductors ORG $C000 * DESIGNATES START OF MEMORY MAP FOR USER CODE LDX #REGBASE * Location of base register for indirect adr BSR SPI_CNFG * Set–up SPI Module for data X–mit to LCD BSR SET_UP * Power–Up A/D, initialize constants CONVERT BSR ADCONV * Calls subroutine to make an A/D conversion BSR DELAY * Delay routine to prevent LCD flickering BSR IN_HG * Converts hex format to in of Hg * The value of FLAG passed from IN_HG is used to determine * If a range error has occurred. The following logical * statements are used to either allow further conversion or jump * to a routine to display a range error message. LDAB FLAG * Determines if an range Error has ocurred CMPB #$80 * If No Error detected (FLAG=$80) then BEQ INRANGE * system will continue conversion process BSR ERROR * If error occurs (FLAG<>80), branch to ERROR BRA OUTPUT * Branches to output ERROR code to display * No Error Detected, Conversion Process Continues INRANGE JSR BCDCONV * Converts Hex Result to BCD JSR LOOKUP * Uses Look–Up Table for BCD–Decimal OUTPUT JSR SPI2LCD * Output transmission to LCD BRA CONVERT * Continually converts using Branch Always * Subroutine SPI_CNFG * Purpose is to initialize SPI for transmission * and clear the display before conversion. SPI_CNFG BSET PORTD,X #$20 * Set SPI SS Line High to prevent glitch LDAA #$38 * Initializing Data Direction for Port D STAA DDRD,X * Selecting SS, MOSI, SCK as outputs only LDAA #$5D * Initialize SPI–Control Register STAA SPCR,X * selecting SPE,MSTR,CPOL,CPHA,CPRO LDAA #$5 * sets counter to X–mit 5 blank bytes STAA COUNTER LDAA SPSR,X * Must read SPSR to clear SPIF Flag CLRA * Transmission of Blank Bytes to LCD ERASELCD JSR TRANSFER * Calls subroutine to transmit DEC COUNTER BNE ERASELCD RTS * Subroutine SET_UP * Purpose is to initialize constants and to power–up A/D * and to initialize POFFSET used in conversion purposes. SET_UP LDAA #$90 * selects ADPU bit in OPTION register STAA ADOPT,X * Power–Up of A/D complete LDD #$0131+$001A * Initialize POFFSET STD POFFSET * POFFSET = 305 – 25 in hex LDAA #$00 * or Pmax + offset voltage (5 V) RTS * Subroutine DELAY * Purpose is to delay the conversion process * to minimize LCD flickering. DELAY LDA #$FF * Loop for delay of display OUTLOOP LDB #$FF * Delay = clk/255*255 INLOOP DECB BNE INLOOP DECA BNE OUTLOOP RTS * Subroutine ADCONV * Purpose is to read the A/D input, store the conversion into * SENSOUT. For conversion purposes later. ADCONV LDX #REGBASE * loads base register for indirect addressing LDAA #$25 STAA ADCTL,X * initializes A/D cont. register SCAN=1,MULT=0 Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0051/C0050/C0054 3–295Motorola Sensor Device Data www.motorola.com/semiconductors WTCONV BRCLR ADCTL,X #$80 WTCONV * Wait for completion of conversion flag LDAB ADR2,X * Loads conversion result into Accumulator CLRA STD SENSOUT * Stores conversion as SENSOUT RTS * Subroutine IN_HG * Purpose is to convert the measured pressure SENSOUT, into * units of in–Hg, represented by a hex value of 305–150 * This represents the range 30.5 – 15.0 in–Hg IN_HG LDD POFFSET * Loads maximum offset for subtraction SUBD SENSOUT * RESULT = POFFSET–SENSOUT in hex format STD RESULT * Stores hex result for P, in Hg CMPD #305 BHI TOHIGH CMPD #150 BLO TOLOW LDAB #$80 STAB FLAG BRA END_CONV TOHIGH LDAB #$FF STAB FLAG BRA END_CONV TOLOW LDAB #$00 STAB FLAG END_CONV RTS * Subroutine ERROR * This subroutine sets the display digits to output * an error message having detected an out of range * measurement in the main program from FLAG ERROR LDAB #$00 * Initialize digits 1,4 to blanks STAB DIGIT1 STAB DIGIT4 LDAB FLAG * FLAG is used to determine CMPB #$00 * if above or below range. BNE SET_HI * If above range GOTO SET_HI LDAB #$0E * ELSE display LO on display STAB DIGIT2 * Set DIGIT2=L,DIGIT3=O LDAB #$7E STAB DIGIT3 BRA END_ERR * GOTO exit of subroutine SET_HI LDAB #$37 * Set DIGIT2=H,DIGIT3=1 STAB DIGIT2 LDAB #$30 STAB DIGIT3 END_ERR RTS * Subroutine BCDCONV * Purpose is to convert ALTITUDE from hex to BCD * uses standard HEX–BCD conversion scheme * Divide HEX/10 store Remainder, swap Q & R, repeat * process until remainder = 0. BCDCONV LDAA #$00 * Default Digits 2,3,4 to 0 STAA DIGIT2 STAA DIGIT3 STAA DIGIT4 LDY #DIGIT4 * Conversion starts with lowest digit LDD RESULT * Load voltage to be converted CONVLP LDX #$A * Divide hex digit by 10 IDIV * Quotient in X, Remainder in D STAB 0,Y * stores 8 LSB’s of remainder as BCD digit DEY CPX #$0 * Determines if last digit stored XGDX * Exchanges remainder & quotient BNE CONVLP LDX #REGBASE * Reloads BASE into main program RTS * Subroutine LOOKUP Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0051/C0050/C0054 3–296 Motorola Sensor Device Datawww.motorola.com/semiconductors * Purpose is to implement a Look–Up conversion * The BCD is used to index off of TABLE * where the appropriate hex code to display * that decimal digit is contained. * DIGIT4,3,2 are converted only. LOOKUP LDX #DIGIT1+4 * Counter starts at 5 TABLOOP DEX * Start with Digit4 LDY #TABLE * Loads table base into Y–pointer LDAB 0,X * Loads current digit into B ABY * Adds to base to index off TABLE LDAA 0,Y * Stores HEX segment result in A STAA 0,X CPX #DIGIT2 * Loop condition complete, DIGIT2 Converted BNE TABLOOP RTS * Subroutine SPI2LCD * Purpose is to output digits to LCD via SPI * The format for this is to send a start byte, * four digits, and a stop byte. This system * will have 3 significant digits: blank digit * and three decimal digits. * Sending LCD Start Byte SPI2LCD LDX #REGBASE LDAA SPSR,X * Reads to clear SPIF flag LDAA #$02 * Byte, no colon, start bit BSR TRANSFER * Transmit byte * Initializing decimal point & blank digit LDAA DIGIT3 * Sets MSB for decimal pt. ORA #$80 * after digit 3 STAA DIGIT3 LDAA #$00 * Set 1st digit as blank STAA DIGIT1 * Sending four decimal digits LDY #DIGIT1 * Pointer set to send 4 bytes DLOOP LDAA 0,Y * Loads digit to be x–mitted BSR TRANSFER * Transmit byte INY * Branch until both bytes sent CPY #DIGIT4+1 BNE DLOOP * Sending LCD Stop Byte LDAA #$00 * end byte requires all 0’s BSR TRANSFER * Transmit byte RTS * Subroutine TRANSFER * Purpose is to send data bits to SPI * and wait for conversion complete flag bit to be set. TRANSFER LDX #REGBASE BCLR PORTD,X #$20 * Assert SS Line to start X–misssion STAA SPDR,X * Load Data into Data Reg.,X–mit XMIT BRCLR SPSR,X #$80 XMIT* Wait for flag BSET PORTD,X #$20 * DISASSERT SS Line LDAB SPSR,X * Read to Clear SPI Flag RTS * Location for FCB memory for look–up table * There are 11 possible digits: blank, 0–9 END Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

Figure 3. Case Outline Drawings

DIMENSIONING AND TOLERANCING PER
CONTROLLING DIMENSION: INCH.

4 PLD

DIMENSIONING AND TOLERANCING PER ANSI
CONTROLLING DIMENSION: INCH.

board) to secure to the device. the package, or affect the performance of the device. Freescale Semiconductor, Inc.

/C0065/C0078/C0049/C0053/C0049/C0051 3–299Motorola Sensor Device Data www.motorola.com/semiconductors Nylon Screws Motorola recommends the use of #6–32 nylon screws as a hardware option. However, they should not be torqued excessively. The nylon screw will twist and deform under higher than recommended torque. These screws should be used with a nylon nut. Rivets Rivets are excellent fasteners which are strong and very inexpensive. However, they are a permanent connection. Plastic rivets are recommended because metal rivets may damage the plastic package. When selecting a rivet size, the most important dimension, besides diameter, is the grip range. The grip range is the combined thickness of the sensor package and the thickness of the mounting surface. Package thicknesses are listed below. Port Style Thickness, a Grip Range = a + b Single side port Dual side port Axial side port Stovepipe port 0.321″ (8.15 mm) 0.420″ (10.66 mm) 0.321″ (8.15 mm) (Does not apply) a b Push–Pins Plastic push pins or ITW FasTex “Christmas Tree” pins are an excellent way to make a low cost and easily removable connection. However, these fasteners should not be used for permanent connections. Remember, the fastener should take all of the static and dynamic loads off the sensor leads. This type of fastener does not do this completely. HOSE APPLICATIONS By using a hose, a sensor can be located in a convenient place away from the actual sensing location which could be a hazardous and difficult area to reach. There are many types of hoses on the market. They have different wall thicknesses, working pressures, working temperatures, material compositions, and media compatibilities. All of the hoses referenced here are 1/8″ inside diameter and 1/16″ wall thickness, which produces a 1/4″ outside diameter. Since all the port hose barbs are 1/8″, they require 1/8″ inside diameter hose. The intent is for use in air only and any questions about hoses for your specific application should be directed to the hose manufacturer. Four main types of hose are available:

Vinyl • Tygon • Urethane • Nylon Vinyl hose is inexpensive and is best in applications with pressures under 50 psig and at room temperature. It is flexible and durable and should not crack or deteriorate with age. This type of hose should be used with a hose clamp such as those listed later in this application note. Two brands of vinyl hose are: Hose Wall Thickness Max. Press. @ 70°F (24°C) Max. Temp. (°F)/(°C) Clippard #3814–1 Herco Clear #0500–037 1/16″ 1/16″ 105 100/(38) 180/(82) Tygon tubing is slightly more expensive than vinyl, but it is the most common brand, and it is also very flexible. It also is recommended for use at room temperature and applications below 50 psig. This tubing is also recommended for applications where the hose may be removed and reattached several times. This tubing should also be used with a hose clamp. Tubing Wall Thickness Max. Press. @ 73°F (25°C) Max. Temp. (°F)/(°C) Tygon B–44–3 1/16″ 62 165/(74) Urethane tubing is the most expensive of the four types described herein. It can be used at higher pressures (up to 100 psig) and temperatures up to 100°F (38°C). It is flexible, although its flexibility is not as good as vinyl or Tygon. Urethane tubing is very strong and it is not necessary to use a hose clamp, although it is recommended. Two brands of urethane hose are: Hose Wall Thickness Max. Press. @ 70°F (24°C) Max. Temp. (°F)/(°C) Clippard #3814–6 Herco Clear #0585–037 1/16″ 1/16″ 105 105 120/(49) 225/(107) Nylon tubing does not work well with Motorola’s sensors. It is typically used in high pressure applications with metal fittings (such as compressed air). HOSE CLAMPS Hose clamps should be employed for use with all hoses listed above. They provide a strong connection with the sensor which prevents the hose from working itself off, and also reduces the chance of leakage. There are many types of hose clamps that can be used with the ported sensors. Here are some of the most common hose clamps used with hoses. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

Figure 4. Hose Clamps crimp–on clamp and the screw–on, Clippard reusable clamp. cost and ease of use, also has a size matching problem.

150 Dey Road, Wayne, NJ 07470–4599 USA

Clippard Instrument Laboratory, Inc.

187 Davidson Avenue

195 Algonquin Road

1331 Jarvis Avenue

Clippard Instrument Laboratory, Inc. Freescale Semiconductor, Inc.

level control using an ac powered pump or solenoid valve. 110/220 V 50/60 Hz ac main power line. pressure sensor manufacturers. the MPXM2010GS was selected. Figure 1. Pressure Sensor MPXM2000 Series Freescale Semiconductor, Inc.

directly from a line voltage of 220 V (50/60 Hz). Figure 2. MOC2A60 POWER OPTO Isolator it will provide an output of about 20 mV (at an 8 V supply). resistor, RG , sets the gain to about 200. the input of the third stage (A4). of the input (selected by the ratio R9/(R9 + R7). output at pin 14 goes low and no drive current is available. solid–state relay to the main power line. within the operating range of the pressure sensor. also be used with a bubbling method or equivalent. Freescale Semiconductor, Inc.

Figure 3. Liquid Level Monitoring in the pipe will increase by that same value (10 mm of water). In this example, a level sensing of 10 mm of water is desired. Table 1. Liquid Level Sensors Freescale Semiconductor, Inc.

Figure 4. Electrical Circuit

0.4 V Ref (TP2)

The sensing probe is tied to the positive pressure port of the sensor. The pump is turned on to fill the tank when the minimum level is reached. Figure 5. Functional Diagram Freescale Semiconductor, Inc.

/C0065/C0078/C0049/C0053/C0049/C0054 3–305Motorola Sensor Device Data www.motorola.com/semiconductors LEVEL CONTROL MODES This application describes two ways to keep the liquid level constant in the tank; first, by pumping the water out if the liquid level rises above the reference, or second, by pumping the water in if the liquid level drops below the reference. If pumping water out, the pump must be OFF when the liquid level is below the reference level. To turn the pump ON, the sensor signal must be decreased to drop the input to the Schmitt trigger below the reference voltage. To do this, the sensing pipe must be connected to the NEGATIVE pressure port (back or vacuum side) of the sensor. In the condition when the pressure increases (liquid level rises), the sensor voltage will decrease and the pump will turn ON when the sensor output crosses the referenced level. As pumping continues, the level in the tank decreases (thus the pressure on the sensor decreases) and the sensor signal increases back up to the trigger point where the pump was turned OFF. In the case of pumping water into the tank, the pump must be OFF when the liquid level is above the reference level. To turn ON the pump, the sensor signal must be decreased to drive the input Schmitt trigger below the reference voltage. To do this, the sensing pipe must be connected to the POSITIVE pressure port (top side) of the sensor. In this configuration when the pressure on the sensor decreases, (liquid level drops) the sensor voltage also decreases and the pump is turned ON when the signal exceeds the reference. As pumping continues, the water level increases and when the maximum level is reached, the Schmitt trigger turns the pump OFF. ADJUSTMENTS The sensing tube is placed into the water at a distance below the minimum limit level anywhere in the tank. The other end of the tube is opened to atmosphere. When the tank is filled to the desired maximum (or minimum) level, the pressure sensor is connected to the tube with the desired port configuration for the application. Then the water level in the tank is the reference. After connecting the tube to the pressure sensor, the module must be adjusted to control the water level. The output voltage at TP1 is preadjusted to about 4 V (half of the supply voltage). When the sensor is connected to the tube, the module output is ON (lighted) or OFF. By adjusting the offset adjust potentiometer the output is just turned into the other state: OFF, if it was ON or the reverse, ON, if it was OFF, (the change in the tank level may be simulated by moving the sensing tube up or down). The reference point TP2 shows the ON/OFF reference voltage, and the switching point of the module is reached when the voltage at TP1 just crosses the value of the TP2 voltage. The module is designed for about 10 mm of difference level between ON and OFF (hysteresis). CONCLUSION This circuit design concept may be used to evaluate Motorola pressure sensors used as a liquid level switch. This basic circuit may be easily modified to provide an analog signal of the level within the controlled range. It may also be easily modified to provide tighter level control (± 2 mm H2O) by increasing the gain of the first amplifier stage (decreasing RG resistor). The circuit is also a useful tool to evaluate the performance of the power optocoupler MOC2A60 when driving ac loads directly. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

voltage is comparable to the threshold voltage. signal conditioned to obtain a four volt signal swing (span). Table 1. MPX2100 Electrical Characteristics for VS = 10 V, TA = 25°C Freescale Semiconductor, Inc.

Figure 1. Pressure Switch Schematic

The threshold for which the output switches must be pro- grammable. The threshold is easily set by dividing the sup- ply voltage with resistors R7 and RTH . In Figure 1, the threshold is set at 2.5 V for R7 = RTH = 10 kΩ .
A method for providing an appropriate amount of hystere- sis should be available. Hysteresis prevents multiple tran- sitions from occurring when slow varying signal inputs oscillate about the threshold. The hysteresis can be set by applying positive feedback. The amount of hysteresis is determined by the value of the feedback resistor, RH (refer to equations in the following section).
It is ideal for the comparator’s logic level output to swing from one supply rail to the other. In practice, this is not pos- sible. Thus, the goal is to swing as high and low as possible for a given set of supplies. This offers the greatest differ- ence between logic states and will avoid having a micro- controller read the switch level as being in an indeterminate state.
In order to be compatible with CMOS circuitry and to avoid microcontroller timing delay errors, the comparator must switch sufficiently fast.
By using two comparators, a window comparator may be implemented. The window comparator may be used to monitor when the applied pressure is within a set range. By adjusting the input thresholds, the window width can be customized for a given application. As with the single Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

Several comparator circuits were built and evaluated. Figure 2. LM311 Comparator Circuit Schematic interface to microprocessors. when the normal state is above VREF . Table 2. Comparator Circuits Performance Characteristics calculate a more precise value for VREF . Freescale Semiconductor, Inc.

Figure 6. LM339 Window Comparator Circuit Schematic input voltage is above the normal state. hysteresis for the application. for the lower window threshold choose the value for VREFLW. where R2 + R3 = R23 from above calculation. the noninverting input exceed VREFLW . Choose R4 = R5 to simplify the design. Freescale Semiconductor, Inc.

/C0065/C0078/C0049/C0053/C0049/C0055 3–311Motorola Sensor Device Data www.motorola.com/semiconductors TEST/CALIBRATION PROCEDURE 1. Before testing the circuit, the user–defined values for R TH , RH and Roff should be calculated for the desired application. The sensor offset voltage is set by V off/C0043 V off R1 /C0041R off V CC . Then, the amplified sensor voltage corresponding to a given pressure is calculated by Vsensor = 201 x 0.0002 x APPLIED PRESSURE + Voff, where 201 is the gain, 0.0002 is in units of V/kPa and APPLIED PRESSURE is in kPa. The threshold voltage, VTH , at which the output changes state is calculated by determining Vsensor at the pressure that causes this change of state: R TH R7 /C0041R TH V CC . VTH = Vsensor (@ pressure threshold) = If hysteresis is desired, refer to the LM311 Used in a Comparator section to determine RH . 2. To test this design, connect a +5 volt supply between pins 3 and 4 of the connector CN1. 3. Connect a volt meter to pins 1 and 4 of CN1 to measure the output voltage and amplified sensor voltage, respectively. 4. Connect an additional volt meter to the VTH probe point to verify the threshold voltage. 5. Turn on the supply voltage. 6. With no pressure applied, check to see that Voff is correct by measuring the voltage at the output of the gain stage (the volt meter connected to Pin 4 of CN1). If desired, Voff can be fine tuned by using a potentiometer for Roff. 7. Check to see that the volt meter monitoring VTH displays the desired voltage for the output to change states. Use a potentiometer for RTH to fine tune VTH , if desired. 8. Apply pressure to the sensor. Monitor the sensor’s output via the volt meter connected to pin 4 of CN1. The output will switch from low to high when this pressure sensor voltage reaches or exceeds the threshold voltage. 9. If hysteresis is used, with the output high (pressure sensor voltage greater than the threshold voltage), check to see if VTH has dropped by the amount of hysteresis desired. A potentiometer can be used for RH to fine tune the amount of hysteresis. CONCLUSION The pressure switch design uses a comparator to create a logic level output by comparing the pressure sensor output voltage and a user–defined reference voltage. The flexibility of this minimal component, high performance design makes it compatible with many different applications. The design presented here uses an op amp with a transistor output stage, yielding excellent logic–level outputs and output transition speeds for many applications. Finally, several other comparison stage designs, including a window comparator, are evaluated and compared for overall performance. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

signal into a digital representation of the analog voltage signal. the advantages of frequency outputs. subsystems are explained in detail below. Figure 1. PWM Output Pressure Sensor Schematic Freescale Semiconductor, Inc.

transitions to measure the PWM output pulse width. at the output compare pin is approximately 40 µs. input capture pin requires approximately 20 µs to execute. earlier (refer to Figure 4). Figure 4. Desired Relationship Between the Ramp Waveform microcontroller. This, in turn, translates to 0.5 µs per clock tick. may be calculated with Equation 1. an internal clock speed of 2 MHz. 4 clock cycles = 1 timer count. Freescale Semiconductor, Inc.

Start with a pulse train that has a pulse width and
Decrease the frequency of the pulse train until the ramp

2.4 V will ensure that the maximum pulse width at full

result in the ramp looking nonlinear at the top.

If the ramp begins to become nonlinear, increase the

pulse width to decrease the dc offset.

Repeat steps 2 and 3 until the ramp spans 2.4 V and has

Figure 5. Relationships Between the PWM Output Pressure Sensor Voltages Figure 6. PWM Output Pressure Sensor Linearity Data Freescale Semiconductor, Inc.

/C0065/C0078/C0049/C0053/C0049/C0056 3–317Motorola Sensor Device Data www.motorola.com/semiconductors CONCLUSION The Pulse Width Modulated Output Pressure Sensor uses a ramp generator to create a linear ramp which is compared to the amplified output of the pressure sensor at the input of a comparator. The resulting output is a digital waveform with a duty cycle that is linearly proportional to the input pressure. Although the pressure sensor output has a fixed offset and span, the ramp waveform is adjustable in frequency, dc offset, and voltage span. This flexibility enables the effect of component tolerances to be nullified and ensures that ramp span encompasses the pressure sensor output range. The ramp’s span can be set to allow for the desired minimum and maximum duty cycle to guarantee a linear dynamic range. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

3–318 Motorola Sensor Device Datawww.motorola.com/semiconductors /C0065/C0078/C0049/C0053/C0050/C0053 /C0084/C0104/C0101 /C0065/C0045/C0066/C0045/C0067/C0039/C0115/C0111/C0102 /C0083/C0105/C0103/C0110/C0097/C0108/C0045/C0067/C0111/C0110/C0100/C0105/C0116/C0105/C0111/C0110/C0105/C0110/C0103 /C0065/C0109/C0112/C0108/C0105/C0102/C0105/C0101/C0114 /C0068/C0101/C0115/C0105/C0103/C0110 /C0102/C0111/C0114 /C0083/C0101/C0110/C0115/C0111/C0114 /C0065/C0112/C0112/C0108/C0105/C0099/C0097/C0116/C0105/C0111/C0110/C0115 Prepared by: Eric Jacobsen and Jeff Baum Sensor Applications Engineering Motorola Signal Products Division Phoenix, AZ INTRODUCTION Although fully signal–conditioned, calibrated, and temperature compensated monolithic sensor IC’s are commercially available today, there are many applications where the flexibility of designing custom signal–conditioning is of great benefit. Perhaps the need for a versatile low–level sensor output is best illustrated by considering two particular cases that frequently occur: (1) the user is in a prototyping phase of development and needs the ability to make changes rapidly to the overall transfer function of the combined sensor/amplifier subsystem, (2) the specific desired transfer function does not exist in a fully signal–conditioned, precision–trimmed sensor product (e.g., a signal–conditioned device is precision trimmed over a different pressure range than that of the application of interest). In such cases, it is obvious that there will always be a need for low–level, nonsignal–conditioned sensors. Given this need, there is also a need for sensor interface amplifier circuits that can signal condition the “raw” sensor output to a usable level. These circuits should also be user friendly, simple, and cost effective. Today’s unamplified solid–state sensors typically have an output voltage of tens of millivolts (Motorola’s basic 10 kPa pressure sensor, MPX10, has a typical full–scale output of 58 mV, when powered with a 5 V supply). Therefore, a gain stage is needed to obtain a signal large enough for additional processing. This additional processing may include digitization by a microcontroller’s analog to digital (A/D) converter, input to a comparator, etc. Although the signal–conditioning circuits described here are applicable to low–level, differential–voltage output sensors in general, the focus of this paper will be on interfacing pressure sensors to amplifier circuits. This paper presents a basic two operational–amplifier signal–conditioning circuit that provides the desired characteristics of an instrumentation amplifier interface:

High input impedance
Low output impedance
Differential to single–ended conversion of the pressure sensor signal
High gain capability For this two op–amp circuit, additional modifications to the circuit allow (1) gain adjustment without compromising common mode rejection and (2) both positive and negative dc level shifts of the zero pressure offset. Varying the gain and offset is desirable since full–scale span and zero pressure offset voltages of pressure sensors will vary somewhat from unit to unit. Thus, a variable gain is desirable to fine tune the sensor’s full–scale span, and a positive or negative dc level shift (offset adjustment) of the pressure sensor signal is needed to translate the pressure sensor’s signal–conditioned output span to a specific level (e.g., within the high and low reference voltages of an A/D converter). For the two op–amp gain stage, this paper will present the derivation of the transfer function and simplified transfer function for pressure sensor applications, the derivation and explanation of the gain stage with a gain adjust feature, and the derivation and explanation of the gain stage with the dc level shift modification. Adding another amplifier stage provides an alternative method of creating a negative dc voltage level shift. This stage is cascaded with the output from the two op–amp stage (Note: gain of the two op–amp stage will be reduced due to additional gain provided by the second amplifier stage). For this three op–amp stage, the derivation of the transfer function, simplified transfer function, and the explanation of the negative dc level shift feature will be presented. GENERAL NOTE ON OFFSET ADJUSTMENT Pressure sensor interface circuits may require either a positive or a negative dc level shift to adjust the zero pressure offset voltage. As described above, if the signal–conditioned pressure sensor voltage is input to an A/D, the sensor’s output dynamic range must be positioned within the high and low reference voltages of the A/D; i.e., the zero pressure offset voltage must be greater than (or equal to) the low reference voltage and the full–scale pressure voltage must be less than (or equal to) the high reference voltage (see Figure 1). Otherwise, voltages above the high reference will be digitally converted as 255 decimal (for 8–bit A/D), and voltages below the low reference will be converted as 0. This creates a nonlinearity in the analog–to–digital conversion. /C0077/C0079/C0084/C0079/C0082/C0079/C0076/C0065 SEMICONDUCTOR APPLICATION NOTE Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

where VO1 represents the part of VO that VIN1 contributes. where VO2 represents the part of VO that VIN2 contributes. mode rejection is shown in the next section. to a pressure sensor application, is derived in this section. a signal range from 0.5 V to 4.5 V results. Figure 3. A few design constraints are required when designing the resistor divider to set the voltage at VREF .

To establish a stable positive dc level shift (VREF ), VCC should be regulated; otherwise, VREF will vary as VCC va- ries.
When “looking” into the resistor divider from R1, the effec- tive resistance of the parallel combination of the resistors, R REF1 and RREF2 , should be at least an order of magni- tude smaller than R1’s resistance. If the resistance of the parallel combination is not small in comparison to R1, R1’s value will be significantly affected by the parallel combina- tion’s resistance. This effect on R1 will consequently affect the amplifier’s gain and reduce the common mode rejec- tion. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

Figure 5. Two Op–Amp Signal–Conditioning Stage with Variable Gain and Negative Dc Level Shift Adjust section on Two Op–Amp Gain Stage with Variable Gain.

To establish a stable negative dc level shift, VCC should be regulated; otherwise, the amount of negative level shift will vary as VCC varies.
R OFF should be the only resistor varied to adjust the negative level shift. Varying R4 will change the gain of the two op–amp circuit and reduce the common mode rejec- tion.
To determine the value of ROFF : 1. Determine the amount of negative dc level shifting re- quired (defined here as V–shift). 2. R4 already should have been determined to set the gain for the desired signal–conditioned sensor output. 3. Although V–shift is dependent on S+, S+ changes only slightly over the entire pressure range. With Motorola’s MPX10 powered at a 5 V supply, S+ will have a value of approximately 2.51 V at zero pressure and will increase as high as 2.53 V at full–scale pressure. This error over the full–scale pressure span of the device is negligible when considering that many applications use an 8–bit A/D converter to segment the pressure range. Using an 8–bit A/D, the 20 mV (0.02 V) error corresponds to only 1 bit of error over the entire pressure range (1 bit / 255 bits x 100% = 0.4% error). 4. ROFF is then calculated by the following equation: R OFF = S + –V CC V –shift R 4 (18) An alternative to using this equation is to use a potentiometer for ROFF that has a resistance range on the order of R4 (perhaps 1 to 5 times the value of R4). Use the potentiometer to fine tune the negative dc level shift, while monitoring the zero pressure offset output voltage, VO . As before, if a fixed resistor is preferable, then measure the potentiometer’s resistance and replace the potentiometer with the closest 1% resistor value. Important note: The common mode rejection of this amplifier topology will be low and perhaps unacceptable in some applications. (A SPICE model of this amplifier topology showed the common mode rejection to be 28 dB.) However, this circuit is presented as a solution for applications where only two operational amplifiers are available and the common mode rejection is not critical when considering the required Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

rejection, but at the expense of adding an additional op–amp.

Its non–inverting configuration provides gain via the ratio of R6 and R5.
It has negative dc voltage level shifting capability typically created by a resistor divider at V–shift, as discussed in the section on Application to Pressure Sensor Circuits. Al- though this configuration requires a third op–amp for the negative dc level shift, it has no intrinsic error nor low com- mon mode rejection associated with the negative level shift (as does the previous two op–amp stage). Depending on the application’s accuracy requirement, this may be a more desirable configuration for providing the negative dc level shift. First, use the same simplifications as before; that is, set R 1 = R4 and R 2 = R3 Defining the voltage differential between VIN2 and VIN1 as VSENSOR , the simplified transfer function is VO = /C04261 /C0041 R 6 R 5 /C0427/C0426/C0466 R 4 R 3 /C0041 2R 4 R G /C00411/C0467/C0466V SENSOR /C0467 + VREF – R 6 R 5 V–shift (20) The gain is G =/C04261 /C0041 R 6 R 5 /C0427/C0426 R 4 R 3 /C0041 2R 4 R G /C00411/C0427 (21) VREF is the positive dc level shift (offset), and V–shift is the negative dc level shift.

Figure 6. Three Op–Amp Gain Stage with Variable Gain and Negative Dc Level Shift Freescale Semiconductor, Inc.

/C0065/C0078/C0049/C0053/C0050/C0053 3–324 Motorola Sensor Device Datawww.motorola.com/semiconductors

Since the third op–amp contributes a gain of two to the overall system, design the gain that the two op–amp circuit contributes to the system to be one–half the desired sys- tem gain. The gain term for the two op–amp circuit is: G = R 4 R 3 2R 4 R G + 1 which is the same as presented in Equation 16.
Similarly, since the third op–amp also amplifies VREF by two (refer to Equation 22), the resistor divider that creates VREF should be designed to provide one–half the desired positive dc voltage level shift needed for the final output. When designing the voltage divider for VREF , use the same design constraints as were given in the section on Applica- tion to Pressure Sensor Circuits. With the above simplification of R5 = R6, the negative dc level shift, V–shift, which is also created by a voltage divider, is now amplified by a factor of unity. When designing the voltage divider, use the same design constraints as were presented in the section on Application to Pressure Sensor Circuits. CONCLUSION The amplifier circuits discussed in this paper apply to pressure sensor applications, but the amplifier circuits can be interfaced to low–level, differential–voltage output sensors, in general. All of the circuits exhibit the desired instrumentation amplifier characteristics of high input impedance, low output impedance, high gain capability, and differential to single–ended conversion of the sensor signal. Each amplifier circuit provides positive dc level shift capability, while the last two circuit topologies presented are also able to provide a negative dc voltage level shift. This enables the user to position the sensor’s dynamic output within a specified range (e.g., within the high and low references of an A/D converter). Also detailed is a method of using an additional feedback resistor to adjust easily the differential voltage gain, while not sacrificing common mode rejection. Combining the appropriate sensor device and amplifier interface circuit provides sensor users with a versatile system solution for applications in which the ideal fully single–conditioned sensor does not exist or in which such signal flexibility is warranted. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

3–325Motorola Sensor Device Data www.motorola.com/semiconductors /C0065/C0078/C0049/C0053/C0051/C0054 /C0068/C0105/C0103/C0105/C0116/C0097/C0108 /C0066/C0111/C0097/C0116 /C0083/C0112/C0101/C0101/C0100/C0111/C0109/C0101/C0116/C0101/C0114/C0115 Prepared by: Bill Lucas Industrial Technology Center INTRODUCTION This application note describes a Digital Boat Speedometer concept which uses a monolithic, temperature compensated silicon pressure sensor, analog signal–conditioning circuitry, microcontroller hardware/software and a liquid crystal display. This sensing system converts water head pressure to boat speed. This speedometer design using a 30 psi pressure sensor (Motorola P/N: MPXM2202GS) yields a speed range of 5 mph to 45 mph. Calibration of the system is performed using data programmed into the microcontroller’s internal memory. A key advantage in all Motorola pressure sensors is the patented X–ducer , a single piezoresistive implant that replaces the traditional Wheatstone bridge configuration used by competitors. In addition to the X–ducer, Motorola integrates on–chip all necessary temperature compensation, eliminat- ing the need for separate substrates/hybrids. This state–of– the–art technology yields superior performance and reliability. Motorola pressure sensors are offered in several different port configurations to allow measurement of absolute, differential and gauge pressure. Motorola offers three pressure sensor types: uncompensated, temperature compensated and calibrated or fully signal conditioned. WATER PRESSURE TO BOAT SPEED CONVERSION A typical analog boat speedometer employs a pitot tube, a calibrated pressure gauge/speedometer and a hose to connect the two. The pitot tube, located at the boat transom, provides the pressure signal corresponding to boat speed. This pressure signal is transmitted to the gauge via the hose. Boat speed is related to the water pressure at the pitot tube as described by the following equation: P /C0084e*( V2/C03242g) where: V = speed P = pressure at pitot tube e = specific weight of media g = gravitational acceleration For example, to calculate P in lb/in2 for an ocean application use: V = speed in mph e = 63.99 lbs/ft3 at 60°F, seawater (e will be smaller for fresh water) g = 32 ft/sec2 15 mph = 22 ft/sec 1 ft2 = 144 in2 P /C0043(63.99[lb/C0324ft3] /C0324144[in2/C0324ft2]) (V2[mph]2 (22/C032415)2[(ft/C0324sec)/C0324mph]2 /C03242 (32.2)[ft/C0324sec2]) P[PSI]/C0043/C0466V 8.208/C04672 For example, if the boat is cruising at 30 mph, the impact pressure on the pitot tube is: P /C0043(30/C03248.208)2 /C004313.36 psi. DIGITAL BOAT SPEEDOMETER DESCRIPTION AND OPERATION The MPXM2202GS senses the impact water pressure against the pitot tube and outputs a proportional differential voltage signal. This differential voltage signal is then fed (via an analog switch and gain circuitry) to a single slope analog–to–digital converter (A/D) which is external to the microcontroller. The A/D circuit can complete two separate conversions as well as a reference conversion simultaneous- ly. This A/D utilizes the microcontroller’s internal timers as counters and software to properly manipulate the data. The analog switch provides a way to flip the sensor outputs after an A/D conversion step, which is necessary to null out the offset effects of the op–amps. This is accomplished by performing an analog conversion, reversing the sensor’s differential output signal, performing another analog conver- sion, summing the two readings, then dividing this sum by two. Any op–amp offset present will be the same polarity regardless of the sensor output polarity, thus the op–amp offset can be mathematically nulled out. The digital representation of any analog signal is ratiometric to the reference voltages of the A/D converter. Also, the sensor’s output is ratiometric to its excitation voltage. Therefore, if both the sensor and A/D reference voltages are connected to the same unregulated supply, the variations in sensor output will be nullified, and system accuracy will be maintained (i.e., systems in which both the A/D converter’s digital value — due to variations in the A/D’s reference voltages — and sensor’s output voltage are ratiometric to the supply voltage so that a voltage regulator is not necessary). /C0077/C0079/C0084/C0079/C0082/C0079/C0076/C0065 SEMICONDUCTOR APPLICATION NOTE Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

the three (U6) comparator outputs to change from 1 to 0. included in the software listing contained in this article. Figure 3. Analog–to–Digital Converter Front End with Microcontroller Freescale Semiconductor, Inc.

Figure 4. Boat Speedometer Display Board Freescale Semiconductor, Inc.

PC0, PC1 and PC2, respectively as shown in Figure 5. Figure 5. Boat Speedometer Processor Board UNLESS OTHERWISE NOTED, ALL RESISTORS 1% METAL FILM.

10 MEG

Freescale Semiconductor, Inc.

/C0065/C0078/C0049/C0053/C0051/C0054 3–330 Motorola Sensor Device Datawww.motorola.com/semiconductors The calibration of this system is as follows. Refer to Table 1. CAUTION: While installing or changing the proper jumpers described by each step, power must be off. Reapply power to read the display after jumpers have been installed in their proper location for each step. In each step there is a few seconds’ delay after switching the power on and before an output is displayed. Steps 1 through 3 must be performed prior to system being operational. Calibration 1. The pressure range of the system must be established. The present software installed in this design supports 15, 30 and 100 psi sensors. Using an MPXM2202GS sensor (30 psi) for example, only jumper J2 should be installed. After power is applied, the LCD should read “30.” Power off the system prior to proceeding to step 2. 2. The total system offset, due to the sensor and A/D, must be established for the software routine to effectively calibrate. With power off, jumpers J1 and J3 should be installed. Reapply power, and the LCD should respond with “000.” The offset value measured in this step is thus stored for use in circuit operation. Power off the system prior to proceeding to step 3. 3. In this step, the system full scale span is calibrated. With power off, install jumper J1 only. Now apply the full rated pressure (30 psi for MPXM2202GS) to the sensor, power on and ensure the display reads “FFF.” The full scale span measured in this step is thus stored for use in circuit operation. Power off the system prior to step 4. Operation 4. Ensure power is off, and install jumpers J1, J2 and J3. The system is now ready for operation. Simply apply power and pressure to the sensor, and the LCD will display the proportional speed above 5 mph, up to the limits of the sensor. REFERENCES Burry, Michael (1989). “Calibration–Free Pressure Sensor System,” Motorola Application Note AN1097. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0053/C0051/C0054 3–331Motorola Sensor Device Data www.motorola.com/semiconductors NOTE. THIS WAS COMPILED WITH A COMPILER COURTESY OF: INTROL CORP. 9220 W. HOWARD AVE. MILWAUKEE, WI. 53228 PHONE (414) 327–7734. SOME SOURCE CODE CHANGES MAY BE NECESSARY FOR COMPILATION WITH OTHER COMPILERS. THE HEADER FILE io6811.h HAS I/O PORT DEFINITIONS FOR THE I/O PORTS PARTICULAR TO THE MC68HC711E9. A TYPICAL ENTRY FOR PORT A WILL FOLLOW. THE FIRST LINE ESTABLISHES A BASE ADDRESS BY WHICH ALL I/O FACILITIES AND COUNTERS ARE BIASED. REFER TO THE MC68HC711E9 DATA FOR MORE INFORMATION RELATIVE TO I/O AND TIMER ADDRESSES. #define IOBIAS 0x1000 /* BASE ADDRESS OF THE I/O FOR THE 68HC11 */ #define PORTA (* (char *) (IOBIAS + 0)) /* PORT A */ THE STARTUP ROUTINE NEED ONLY LOAD THE STACK TO THE TOP OF RAM, ZERO THE MICROCONTROLLER’S RAM AND PERFORM A BSR MAIN (BRANCH TO SUBROUTINE “MAIN”). THIS SOURCE CODE, HEADER FILE, COMPILED OBJECT CODE, AND LISTING FILES ARE AVAILABLE ON: THE MOTOROLA FREEWARE LINE AUSTIN, TX. (512) 891–3733. Bill Lucas 6/21/90 THE CODE STARTS HERE */ #include <io6811.h> /* I/O port definitions */ /* define locations in the eeprom to store calibration information */ #define EEPROM (char*)0xb600 /* used by calibration functions */ #define EEBASE 0xb600 /* start address of the eeprom */ #define ADZERO (* ( long int *)( EEBASE + 0 )) /* auto zero value */ #define HIATOD (* ( long int *)( EEBASE + 4 )) /* full scale measured input */ #define XDCRMAX (* ( char *)( EEBASE + 8 )) /* full scale input of the xdcr */ union bytes { unsigned long int l; char b[4]; }; /* ADZERO.l for long word ADZERO.b[0]; for byte */ const char lcdtab[] = { 95, 6, 59, 47, 102, 109, 125, 7, 127, 111, 0 }; /* lcd pattern table 0 1 2 3 4 5 6 7 8 9 blank */ const int dectable[] = { 10000, 1000, 100, 10 }; char digit[5]; /* buffer to hold results from cvt_bin_dec function */ /* real time interrupt service routine */ void real_time_interrupt (void) /* hits every 4.096 ms. */ TFLG2 = 0x40; /* clear the interrupt flag */ /* write_eeprom(0xA5,EEPROM); write A5h to first byte of EEPROM */ void write_eeprom(char data, char *address) PPROG = 0x16; /* single–byte erase mode */ *address = 0xff; /* write anything */ PPROG = 0x17; /* turn on programming voltage */ delay(); PPROG = 0x0; /* erase complete */ /* now program the data */ PPROG = 0x02; /* set eelat bit */ *address = data; /* write data */ PPROG = 0x03; /* set eelat and eepgm bits */ delay(); PPROG = 0; /* read mode */ /* programming complete */ long int convert(char polarity) Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0053/C0051/C0054 3–332 Motorola Sensor Device Datawww.motorola.com/semiconductors unsigned int cntr; /* free running timer system counter */ unsigned int r0; /* difference between cntr and input capture 1 register */ unsigned int r1; /* difference between cntr and input capture 2 register */ unsigned int r2; /* difference between cntr and input capture 3 register */ unsigned long difference; /* the difference between the upper and lower instrument amplifier outputs */ unsigned long int pfs; /* result defined as percent of full scale relative to the reference voltage */ if (polarity == 1) /* set the hc4053 configuration */ PORTB &= 0xfe; /* polarity = 1 means + output of sensor */ else PORTB |= 0x1; /* is connected to the upper opamp */ delay(); /* this will allow the hc4053 to stabilize and the cap to discharge from the previous conversion */ TFLG1=0X07; /* clear the input capture flags */ cntr=TCNT; /* get the current count */ PORTA &= 0X7F; /* turn the fet off */ while ((TFLG1 & 0X7) < 7); /* loop until all three input capture flags are set */ r0 = TIC1 – cntr; /* reference voltage */ r1 = TIC2 – cntr; /* top side of the inst. amp */ r2 = TIC3 – cntr; /* lower side of the inst. amp */ PORTA |= 0X80; /* turn the fet on */ if (polarity == 1) difference = ( r1 + 1000 ) – r2; else difference = ( r2 + 1000 ) – r1; pfs = (difference * 10000) / r0; if (difference > 32767) /* this will cover up the case where the a to d computes a negative value */ pfs=0; return ( pfs ); atod() /* computes the a/d value in terms of % full scale */ unsigned long int x,y,z; x = convert(1); /* normal */ y = convert(0); /* reversed */ z = (x + y)>>1 ; /* 2x difference / 2 */ return(z); /* z is percent of full scale */ integrate() /* returns the a/d value in terms of % full scale and computes offset from calibration values */ unsigned long int j; int i; j=0; for (i=0; i<20; ++i) j +=atod(); j = (j/20) – ADZERO; /* null out the xdcr zero input offset */ return(j); cala2d() /* returns the average of 50 raw a/d conversions this is only used by the calibration functions */ unsigned long int j; int i; j=0; for (i=0; i<50; ++i) { j +=atod(); } j=j/50; return(j); cvt_bin_dec ( unsigned int arg ) char i; for ( i=0; i < 6; ++i ) Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0053/C0051/C0054 3–333Motorola Sensor Device Data www.motorola.com/semiconductors digit[i] = 0; /* put blanks in all digit positions */ for ( i=0; i < 4; ++i ) if ( arg >= dectable [i] ) digit[i] = arg /dectable[i]; arg = arg–(digit[i] * dectable[i]); digit[i] = arg; delay() int i; for (i=0; i<1000; ++i); /* delay about 15 ms. @ 8 mhz xtal */ /* set–up i/o for the single slope a/d, initialize the spi port, then initialize the MC145453 for output */ init_io(void) char i; /* set–up i/o for the a/d */ PACTL |= 0X80; /* make pa7 an output */ PORTA |= 0X80; /* turn the fet on */ PORTB &= 0X7F; /* set–up the HC4053 in the Y0/Z0 connect mode */ TCTL2 = 0X2A; /* capture on falling edge for timer capture 0,1,2 */ TFLG1 = 0X07; /* clear any pending capture flags */ /* set–up the i/o for the spi subsystem */ PORTD=0x2f; /* set output low before setting the direction register */ DDRD=0x38; /* ss = 1, sck = 1, mosi = 1 */ SPCR=0x51; /* enable spi, make the cpu the master, E clock /4 */ /* initialize the lcd driver */ for (i=0; i<4; ++i) /* four bytes of zeros */ write_spi(0); write_spi (2); /* this creates a start bit and data bit 1 for the next write to the mc145453 */ /* this is an attempt at the newton square root method */ sqrt(unsigned long b) unsigned long x0,x1; if ( b < 4 ) { b=2; return (b); } else x0=4; x1=10; while (x0 != x1) if( (x1–x0) ==1 ) break; x1=x0; b=x0; return (b); Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0053/C0051/C0054 3–334 Motorola Sensor Device Datawww.motorola.com/semiconductors write() char i; digit[1]=10; if (digit[2]==0) {digit[2]=10;} if ( digit[2]==10 && digit[3]==0 ) {digit[3]=10;} for ( i=1; i<5; ++i ) if (i==4) write_spi((lcdtab[digit[i]])+0x80); else write_spi(lcdtab[digit[i]]); write_spi (2); /* this creates a start bit and data bit 1 for the next write to the mc145453 */ write_spi( char a ) /* write a character to the spi port */ SPDR=a; while ( ! ( SPSR & 0x80 ) ) {} /* loop until the spif = 1 */ /* This function is called at power–up and will determine the operation of the system. The user must complete the system configuration prior to setting the jumper in the first or last two configurations in the table or erroneous operation is guaranteed! test/operation jumper configuration: J3 J2 J1 1 = jumper removed 1 1 1 display speed in mph 1 1 0 reserved 1 0 1 30 psi xdcr installed 1 0 0 15 psi xdcr installed 0 1 1 full scale calibrate 0 1 0 zero calibrate 0 0 1 display pressure in psi 0 0 0 display speed in mph */ setconfig() char i; for ( i=0; i<125; ++i ) delay(); /* to let the charge pump come to life wll */ i = PORTC & 0x07; /* and off the unused bits */ if ( i == 7 ) display_speed(); if ( i == 6 ) setup_error(); /* non–valid pattern output –SE– on display*/ if ( i == 5 ) {write_eeprom(30,&XDCRMAX); /* xdcr is 30 psi */ display(30); if ( i == 4 ) {write_eeprom(15,&XDCRMAX); /* xdcr is 15 psi */ display(15); if ( i == 3 ) fullscale_calibrate(); if ( i == 2 ) zero_calibrate(); if ( i == 1 ) display_pressure(); else display_speed(); display(char d) Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0053/C0051/C0054 3–335Motorola Sensor Device Data www.motorola.com/semiconductors if (d==30) write_spi(0); /* blank the upper digit */ write_spi(0); /* blank the next to upper digit */ write_spi(47); /* 3 */ write_spi(95); /* 0 */ if (d==15) write_spi(0); /* blank the upper digit */ write_spi(0); /* blank the next to upper digit */ write_spi(6); /* 1 */ write_spi(109); /* 5 */ write_spi(2); while(1); fullscale_calibrate() int i; long int temp; union bytes average; temp=0; average.l = cala2d(); /* get the average of 50 a/d conversions */ for ( i=0; i<4; ++i) write_eeprom(average.b[i],EEPROM+i+4); write_spi(0); /* blank the upper digit */ write_spi(113); /* F */ write_spi(113); /* F */ write_spi(113); /* F */ write_spi(2); while(1); zero_calibrate() int i; long int temp; union bytes average; temp=0; average.l = cala2d(); /* get the average of 50 a/d conversions */ for ( i=0; i<4; ++i) write_eeprom(average.b[i],EEPROM+i); write_spi(0); /* blank the upper digit */ write_spi(95); /* 0 */ write_spi(95); /* 0 */ write_spi(95); /* 0 */ write_spi(2); while(1); /* speed=8.208(square root(%full scale*transducer full scale)) */ display_speed() long atod_result; unsigned int j; while(1) atod_result = integrate(); /* read the a/d */ atod_result=( (atod_result*10000) / (HIATOD–ADZERO) ) * XDCRMAX; atod_result=sqrt(atod_result); atod_result=(atod_result*8208)/10000; j=atod_result; Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0053/C0051/C0054 3–336 Motorola Sensor Device Datawww.motorola.com/semiconductors if (j<50) { j=0; } cvt_bin_dec ( j ); write(); /* pressure=%full scale*transducer max pressure */ display_pressure() long atod_result; int j; while(1) atod_result = integrate(); /* read the a/d */ atod_result=( (atod_result*1000) / (HIATOD–ADZERO) ) * XDCRMAX; j=atod_result/100; cvt_bin_dec ( j ); write(); setup_error() /* write ”SE” on the display */ write_spi(0); write_spi(109); /* S */ write_spi(121); /* E */ write_spi(0); write_spi(2); while(1); main() init_io(); setconfig(); /* determine how to function */ while(1); /* should never return here except after calibration */ Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

3–337Motorola Sensor Device Data www.motorola.com/semiconductors /C0065/C0078/C0049/C0053/C0053/C0049 /C0076/C0111/C0119/C0045/C0080/C0114/C0101/C0115/C0115/C0117/C0114/C0101 /C0083/C0101/C0110/C0115/C0105/C0110/C0103 /C0119/C0105/C0116/C0104 /C0116/C0104/C0101 /C0077/C0080/C0088/C0050/C0048/C0049/C0048 /C0080/C0114/C0101/C0115/C0115/C0117/C0114/C0101 /C0083/C0101/C0110/C0115/C0111/C0114 Prepared by: Jeffery Baum Systems Engineering Group Leader Sensor Products Division Motorola Semiconductor Products Sector Phoenix, AZ INTRODUCTION Until recently, low–cost semiconductor pressure sensors were designed to measure typical full–scale pressures only as low as 10 kPa (1.5 psi). Of course, “measure” is a relative term. “Measure” is used here to imply that an output of reasonable magnitude, signal–to–noise ratio, and accuracy is produced by the sensing device. Such sensor products are available in various levels of integration and package types. Depending on the level of application customization required and the budget available, a sensor user may choose from a range of low–pressure sensor products such as a 10 kPa “bare–element” (uncompensated) device, a 10 kPa calibrated and temperature compensated device, or a fully signal–conditioned (high–level output), calibrated, and temperature compensated integrated 10 kPa device. These options are typically available as well for higher pressures ranging up to 1000 kPa. What if the sensor user must measure full–scale pressures that are two, four, or even ten times lower than what conventional sensor technology is capable of measuring? “Do such applications and customers exist?’’ The answer is “yes” and “yes.” There are many potential customers that require such low–pressure sensing ability, the two application examples discussed here are: (1) heating ventilation and air–conditioning (HVAC) in the context of building controls and (2) water–level sensing in appliance applications such as clothes washing machines. For the purposes of measuring low pressures, the units of inches of water (″ H 2O) or millimeters of water (mm H2O) will be used. Typical HVAC applications have a full–scale pressure of 40 mm H2O and washing machines have either 300 or 600 mm H2O, depending on the region of the world (Note: just for reference purposes, 10 kPa /C0091 40″ H 2O /C0091 1000 mm H 2O /C0091 1.5 psi). Of course, a sensor intended for a higher pressure range than the one of interest can be used. However, the effect is that only a small portion on the device’s dynamic output range is used for the actual operating range. This low–level output may then be paired up with a larger than ideal amplifier gain. Thus, a poor signal–to–noise ratio is usually the result. Some sensor manufacturers have recently introduced pressure sensors designed for 4″ and 5″ H 2O full–scale ranges (approx. 100–125 mm H 2O). These devices typically employ silicon with very thinly micromachined diaphragms or other sensing technologies that are significantly larger in form factor without any additional functionality. Thin diaphragm devices tend to be extremely fragile and unstable. Even in cases where the device is sufficiently robust for the intended operating pressure range, the sensor has very poor overpressure capability. Now that the pressure range of interest has been established, the stage has been set to consider the system solution that is the enabling technology for achieving such low–pressure sensing capability. Also important in presenting this low–pressure system solution are some of the other application characteristics besides the pressure range. For example, the desired pressure resolution, accuracy, available power supply voltage, and end–equipment system architecture play a major role in determining the implementation of this system solution. DEVELOPMENT HISTORY For simplicity’s sake, let’s refer to this low–pressure sensing system solution as the “smart sensing” or “smart sensor system.” One of the key performance advantages of the smart sensor system is that the output of the actual sensing element is ratiometric (linearly proportional) to the excitation voltage applied to the sensing element. Since most semiconductor pressure sensors are characterized with a constant voltage power supply, current excitation will not be discussed. Although a sensor’s operation is specified at a given power supply voltage, there is some maximum supply that can be applied, beyond which power dissipation and self–heating produce significant output errors or exceed the package’s thermal handling capability. This means that the strategy of increasing the sensor’s excitation to improve the sensor’s sensitivity (increase signal output for a given applied pressure) can be done in a dc fashion only up to some maximum supply voltage. For Motorola pressure sensors, this limit allows only about a 50% to 60% increase in sensitivity, depending on the specific device family. About five years ago, some of my colleagues were working on pulsing the sensor supply voltage with a conventional voltage and very low duty–cycle, sampling–and–holding the resulting output, and then filtering the output to produce a dc sensor output with very low–power consumption. This was the impetus to consider pulsing a sensor at a much higher than recommended voltage and a low duty–cycle (10% or less) for the purpose of increased sensitivity. It is true that some of the sensor’s parasitic drawbacks, like its zero–pressure offset voltage and temperature coefficient of offset, are increased as well, but some of the sensor’s negative characteristics are lessened. In addition, other sources of error and noise in the system are not subjected to the higher amplifier gain that would be required if operating the sensor at a conventional supply voltage. /C0077/C0079/C0084/C0079/C0082/C0079/C0076/C0065 SEMICONDUCTOR APPLICATION NOTE Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

significant errors as a percentage of the sensor output signal. future enhancements to this technology. Table 1. MPX2010 Operating Characteristics (Supply Voltage = 10 Vdc, TA = 25°C unless otherwise noted) Freescale Semiconductor, Inc.

translates to a 0.25 mV/(V*kPa) pressure sensitivity. proportionally lower applied pressure range (i.e., 0–6.25 kPa). produces limited improvement in the output signal level. Figure 1. Smart Sensing Block Diagram

5 V ± 5%

Freescale Semiconductor, Inc.

high–side switch pulsing circuitry
signal–conditioning amplifier interface with resistors to ad- just the sensor’s amplified, full–scale span and zero–pres- sure offset
on–chip resources of a complete 8–bit microcontroller (MCU)
MCU oscillator circuitry (4 MHz)
5 V ±5% linear voltage regulator
low–voltage inhibit (LVI) supervisory voltage monitoring cir- cuit
resistor divider connected to the sensor’s power supply bias to sense the excitation voltage across the sensor These subsystems are explained as follows to provide an understanding of the system design and its intelligent features (refer to Figure 2). Pulsing Circuitry As previously mentioned, the sensor’s output is ratiometric to the excitation voltage across the sensing element; the sensor’s sensitivity increases with increasing supply voltage. Thus, to detect low pressures and minute changes in pressure, it is desirable to operate the sensor at the highest possible excitation voltage. The maximum supply voltage at which the sensor can reliably operate is determined by one or both of the following two limitations: (1) maximum allowable sensor die temperature, (2) maximum supply voltage available in the sensing application/system. In terms of thermal/power dissipation, the maximum voltage that can be supplied to the sensor on a continuous basis is relatively low compared to that which can be pulsed on the sensor at a low duty–cycle. The average power that is dissipated in the sensor is the square of the average sensor excitation voltage divided by the input resistance of the sensor. When the sensor’s supply bias is operated in a pulsed fashion, the average excitation voltage is simply the product of the dc supply voltage used and the percent duty–cycle that the dc voltage is “on.” The pulsing circuitry is a high–side switch (two small–signal switching transistors with associated bias resistors) that is controlled via the output compare (TCMP) pin of the MCU. The output compare timer function of the MCU provides a logic–level pulse waveform to the switch that has a 2–ms period and a 200– µs on–time ( Note: this is user–programmable).

Figure 2. System Schematic

high input impedance
low output impedance
differential to single–ended conversion of the pressure sen- sor signal
moderate gain capability Both the nominal gain and offset reference pedestal of this interface circuit can be adjusted to fit a given distribution of sensor devices. Varying the gain and offset reference pedestal Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0053/C0053/C0049 3–341Motorola Sensor Device Data www.motorola.com/semiconductors is desirable since pressure sensors’ full–scale span and zero–pressure offset voltages will vary somewhat from lot to lot and unit to unit. During software calibration, each sensor device’s specific offset and full–scale output characteristics will be stored. Nonetheless, a variable gain amplifier circuit is desirable to coarsely tune the sensor’s full–scale span, and a positive or negative dc level shift (offset pedestal adjustment) of the pressure sensor signal is needed to translate the pressure sensor’s signal–conditioned output span to a specific level (e.g., within the high and low reference voltages of the A/D converter). Microcontroller The microcontroller performs all of the necessary tasks to give the smart sensor system the specified performance and intelligent features. The following describes its responsibilities:

Creates the control signal to pulse the sensor.
Samples the pressure sensor’s output.
Signal averages a programmable number of samples for noise reduction.
Samples a scaled–down version of the pressure sensor supply voltage. Monitoring the power supply voltage allows the microcontroller to reject sensor output changes result- ing from power supply variations.
Uses serial communications interface (SPI) to receive com- mands from and to send sensor information to a master MCU. Resistor Divider for Rejection of Supply Voltage Variation Since the pressure sensor’s output voltage is ratiometric to its supply voltage, any variation in supply voltage will result in variation of the pressure sensor’s output voltage. By attenuating the supply voltage (since the supply voltage may exceed the 5 V range of the A/D) with a resistor divider, this scaled voltage can be sampled by the microcontroller’s A/D converter. By sampling the scaled supply voltage, the microcontroller can compensate for any variances in the pressure sensor’s output voltage that are due to supply variations. This technique allows correct pressure determination even when the pressure sensor is powered with an unregulated supply.

5 V Regulator

A 5 V ±5% voltage regulator is required for the following functions:

To provide a stable 5 V for the high voltage reference (VRH) of the microcontroller’s A/D converter. A stable voltage ref- erence is crucial for sampling any analog voltage signals.
To provide a stable 5 V for the resistor divider that is used to level shift the amplified zero–pressure offset voltage. Low Voltage Inhibit (LVI) Circuitry Low voltage inhibit circuitry is required to ensure proper power–on–reset (POR) of the microcontroller and to put the MCU in a known state when the supply voltage is decreased below the MCU supply voltage threshold. SOFTWARE DESCRIPTION The smart sensor system’s EPROM resident code provides the control pulse for the sensor’s excitation voltage and performs calibration with respect to a wide range of excitation voltages (20 ~ 28 V typically for HVAC). Pressure measurement averaging is also incorporated to reduce both signal error and noise. In addition, the availability of a serial communications interface allows a variety of software commands to be sent to the smart sensor system. The following brief outline provides a more detailed description about the software features included in the smart sensor system. Software Calibration and Power Supply Rejection Only six 8–bit words of information are stored both to calibrate the smart sensor system for a given sensor device and to store the relationship between sensor output and power supply voltage. This information is used to reduce errors due to device–to–device variations and to reject variations in power supply voltage that can introduce error into the pressure measurement. The sensor’s amplified output at the zero–pressure offset and full–scale pressure are stored at each of two different supply voltages. In addition, the scaled and digitized representation of the applied supply voltages is stored. Compensating for power supply variation in software allows higher performance with lower tolerance, or even unregulated, supply voltages. For HVAC applications, where a 24–Vac line voltage will be simply rectified and filtered to provide a crude 24–Vdc supply, this approach has major performance benefits. The impact on applications where a regulated supply is available is that a lower–cost regulator or dc–to–dc converter can be used without compromising system accuracy significantly. A/D Sample Averaging Noise inherent to the 8–bit A/D successive approximation conversion method used by the smart sensor accounts for ±1–bit resolution. Signal noise, which exhibits a measured peak–to–peak range larger in magnitude than 1 bit of A/D resolution, can be minimized by a sample averaging technique. The current technique uses 16 A/D converted pressure samples, sums the result, and divides by 16 (the number of samples) to get the average: AVG = ; where n = 16 (1)(an) n n /C0083 Assuming a gaussian distribution of noise, this averaging technique improves the signal–to–noise ratio (SNR). Smart Sensor Unit ID and Software Revision Level This solution may be implemented as a single sensing system using a nondedicated MCU to provide the sensing function and smart features or as a slaved smart sensor (with dedicated sensing MCU) that communicates over a serial bus to a master controller or microprocessor (Host). Part identification and software revision level can also be read on request from the master MCU. This information is utilized by the master MCU to determine what the full–scale pressure range of a given smart sensor unit is. This allows for multiple sensor units with different pressure ranges to be controlled and sensed from a single master MCU. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

Table 2. Software Command Codes Figure 3. SPI Timing Diagram Freescale Semiconductor, Inc.

/C0065/C0078/C0049/C0053/C0053/C0049 3–343Motorola Sensor Device Data www.motorola.com/semiconductors SOFTWARE EXAMPLES The following example listings show how a user may communicate with the smart sensor via a master MCU. The software example shown assumes that the master MCU is an MC68HC11. Any MCU with the proper I/O functionality will operate similarly with the smart sensor system. When using parallel I/O instead of an SPI port to interface the smart sensor, the user must “bit bang” the clock and data out of the parallel I/O, so as to simulate the SPI port. As long as the timing relationships of data and clock follow those of Figure 3 (see also Table 3), the smart sensor will function properly when interfaced to a processor with a parallel type interface. In the following two code examples, the sensor unit is interfaced to the master MCU via the SPI port, and the sensor’s CS input is connected to the HC11’s Port D pin 5. This example is coded in ‘C’ for the MC68HC11: /* FIRST INITIALIZE THE I/O (INCLUDE A HEADER FILE TO INCLUDE I/O DEFINITIONS) */ void init_io(void) PORTD = 0X29; /* SS* PD5 = 1, PD3 = 1, PD0 = 1 */ DDRD = 0X3B; /* SS* PD5 = 1, PD3 = 1, PD1 = 1, PD0 = 1 */ SPCR = 0X5E; /* ENABLE THE SPI, MAKE MCU THE MASTR, SCK = E CLK /4 */ /* I/O INITIALIZATION IS COMPLETE */ /* WE NEED A FUNCTION TO WRITE TO AND READ FROM THE SPI */ write_spi(char data) SPDR = data; /* WRITE THE DATA TO THE SPI DATA PORT */ while( ! (SPSR & 0x80 )); /* WAIT UNTIL DATA HAS SHIFTED OUT OF AND BACK INTO THE SPI */ return(SPDR): /* RETRIEVE THE RESULTS OF THE LAST COMMAND TO THE SENSOR AND RETURN */ /* NOW WE NEED TO CALL THE ABOVE */ void main(void) char rtn_data; /* rtn_data IS THE RETURNED DATA FROM THE SENSOR */ init_io(); while(1) /* JUST LOOP FOREVER */ rtn_data = write_spi(0x01); /* 0x01 IS THE COMMAND TO THE SENSOR THAT REQUESTS PRESSURE. THE VALUE IN rtn_data WILL BE IN THE RANGE OF 0..0XFF = 0..100% FULL SCALE PRESSURE THE SECOND TIME THROUGH THE LOOP. THE INITIAL TIME THROUGH THE LOOP, THE DATA RETURNED IS INDETERMINATE */ The next example is coded in assembly for the MC68HC11: * PORT OFFSETS INTO THE I/O MAP PORTS EQU $1000 ASSUME THE I/O STARTS AT $1000 PORTD EQU $8 DDRD EQU $9 SPCR EQU $8 SPSR EQU $29 SPDR EQU $2A ORG $E000 * FIRST INITIALIZE THE I/O INITIO LDX #PORTS BASE ADDRESS OF THE I/O LDAA #$29 STAA PORTD,X SS* PD5 = 1, PD3 = 1, PD0 = 1 LDAA #$3B STAA DDRD,X SS* PD5 = 1, PD3 = 1, PD1 = 1, PD0 = 1 LDAA #$5E STAA SPCR,X ENABLE THE SPI, MAKE MCU THE MASTR, * SCK = E CLK /4 RTS I/O INITIALIZATION IS COMPLETE Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

JSR WRITSPI SEND THE COMMAND TO THE SENSOR. Table 3. SPI Timing Characteristics The serial data output is an 8–bit number of value 0–255. in ″ H 2O and then divide (normalize) by 255. See equation 2. that contains full–scale pressure information for each sensor. Freescale Semiconductor, Inc.

/C0065/C0078/C0049/C0053/C0053/C0049 3–345Motorola Sensor Device Data www.motorola.com/semiconductors Besides the sensor excitation pulsing and output sampling functions, a low–cost MCU provides the performance– enhancing features of signal averaging, software calibration, and software power supply rejection. The added–functionality of intelligent communications capability, serial digital output flexibility, and local control and decision–making capability are also at the user’s disposal. The development history, system design, software functions, example communications routines, and serial output format have been detailed to provide the reader with an understanding of how low–pressure capability can be greatly enhanced via a smart sensor system approach. ACKNOWLEDGMENTS I wish to acknowledge my colleagues Bill Lucas and Warren Schultz for their outstanding efforts and major contributions to the pursuit of low–pressure sensing technology. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

3–346 Motorola Sensor Device Datawww.motorola.com/semiconductors /C0065/C0078/C0049/C0053/C0053/C0054 /C0068/C0101/C0115/C0105/C0103/C0110/C0105/C0110/C0103 /C0083/C0101/C0110/C0115/C0111/C0114 /C0080/C0101/C0114/C0102/C0111/C0114/C0109/C0097/C0110/C0099/C0101 /C0083/C0112/C0101/C0099/C0105/C0102/C0105/C0099/C0097/C0116/C0105/C0111/C0110/C0115 /C0102/C0111/C0114 /C0077/C0067/C0085/C0045/C0098/C0097/C0115/C0101/C0100 /C0083/C0121/C0115/C0116/C0101/C0109/C0115 Prepared by: Eric Jacobsen and Jeff Baum Sensor Systems Engineering Group Motorola Sensor Products Division Phoenix, AZ INTRODUCTION When designing a circuit for a sensor system, it is desirable to use fixed–value components in the design. This makes the system easier and cheaper to produce in high volume. The alternatives to using fixed–value circuitry are very expensive and usually impractical: laser–trimming resistances, manually calibrating potentiometers, or measuring and selecting specific component values are all very labor–intensive processes. However, every sensor has device–to–device variations in offset output voltage, full–scale output voltage, dynamic output voltage range (difference between the full–scale output voltage and zero–scale output voltage which is commonly referred to as the span), etc. Moreover, these same parameters also vary with temperature — e.g., temperature coefficient of offset (TCVoff) and temperature coefficient of full–scale span (TCVFSS ). To further complicate this situation, the fixed–value circuit in which a sensor is applied also has variation — e.g., the voltage or current regulator and resistors all have a specified tolerance. Since today’s unamplified solid–state sensors typically have an output voltage on the order of tens of millivolts (Motorola’s basic 10 kPa pressure sensor, MPX10, has a typical full–scale span of 58 mV, when powered with a 5 V supply), a major part of the fixed–value circuitry is a gain stage that amplifies the signal to a level that is large enough for additional processing. Typically, this additional processing is digitization of the amplified analog sensor signal by a microcontroller’s A/D converter. To obtain the best signal resolution with an A/D, the sensor’s amplified dynamic output voltage range should fill as much of the A/D window (difference between the A/D’s high and low reference voltages) as possible without extending beyond the high and low reference voltages (i.e., the zero–pressure offset voltage must be greater than or equal to the low reference voltage, and the full–scale output voltage must be less than or equal to the high reference voltage). In any case, the device–to–device, temperature, and circuit variations create a design dilemma: with a fixed–value amplifier circuit, the gain as well as any dc level shift incorporated in the amplifier design are fixed. If the variation of any of the aforementioned sensor parameters is too large, the amplified sensor output may saturate the amplifier near either its high or low supply rail or may extend beyond either the high or low reference voltages of the A/D converter. In either case, error (non–linearity) results in the system. To avoid this scenario, the solution is to design a fixed–value circuit that optimizes performance (signal resolution) while taking into account all possible types of variation that may cause the sensor output to vary. In other words, the goal of this fixed–value sensor system is to attain the best performance possible while ensuring through design, regardless of any system variation, that the sensor’s amplified output will ALWAYS be within the saturation levels of the amplifier and the high and low reference voltages of an A/D converter. The implication of ensuring that the sensor’s amplified output is always unsaturated and within the high and low reference voltages of the A/D is that an accurate software calibration of the sensor’s output is possible. By sampling the sensor’s output voltage at a couple of points at room temperature (zero and full–scale output, for example), all the room temperature device–to–device and circuit variations are nullified. Obviously, temperature variations will create error in the system (sensor’s output voltage will drift with changing temperature), but, by design, the sensor’s output voltage will remain within the A/D’s valid range. This paper discusses a methodology that optimizes a sensor system’s performance while considering device–to–device, temperature, and circuit variations that can create variation in the amplified sensor output. The methodology starts with a desired performance and some established parameters and then considers each type of variation in a worst case analysis to determine if the desired performance is attainable. While this paper discusses this methodology for pressure sensors and a specific amplifier topology, the methodology is applicable to low–level, differential–voltage output sensors and amplifier circuits in general. Two specific examples are presented that apply this methodology. The first example uses Motorola’s MPX10 pressure sensor, and the second example uses Motorola’s MPX2010 pressure sensor. Both sensors have a full–scale rated pressure of 10 kPa; the difference between the devices is the MPX2010 has on–chip calibration and temperature compensation circuitry to calibrate and temperature compensate the zero–pressure offset voltage and span. The comparison of these two devices will emphasize how dramatically device–to–device and temperature variations, if not compensated, can affect a system’s overall performance. /C0077/C0079/C0084/C0079/C0082/C0079/C0076/C0065 SEMICONDUCTOR APPLICATION NOTE Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

the device–to–device and temperature variations. resistor’s tolerance is ± 1%. Figure 1. MPX10/MPX2010 Circuit Schematic Table 1. MPX10 Variation Characteristics Table 2. MPX2010 Variation Characteristics

high input impedance
low output impedance
differential to single–ended conversion of the input signal
high gain capability
dc level shifting capability For good common mode rejection, the following resistor ratios are used: R 4 R 3 /C0043R 1 R 2 With this simplification, the transfer function of the amplifier is VO /C0043(R 4 R 3 /C00411)(S/C0041–S –)/C0041VREF Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

relative to the resistance of R1. Many pressure sensor systems interface an A/D converter. overall system transfer function. resistors must be considered. will be used in designing the fixed–value system. the A/D’s window. A general description is shown in Figure 2. that is available for the requisite amount of system resolution. resolution (less bits used for resolving sensor output signal). Figure 2. Sensor’s Full–Scale Span vs. Headroom Freescale Semiconductor, Inc.

A dc offset, VREF , is required to position the sensor’s span

the sensor’s output to be outside the A/D window. The following design examples use the methodology. Table 3. Design Example Using the MPX10 Freescale Semiconductor, Inc.

Table 4. Design Example Using the MPX2010 Freescale Semiconductor, Inc.

/C0065/C0078/C0049/C0053/C0053/C0054 3–354 Motorola Sensor Device Datawww.motorola.com/semiconductors DESIGN EXAMPLE COMPARISON SUMMARY The preceding examples show how sources of variation can affect the overall system resolution. The MPX2010 has on–chip temperature compensation and calibration circuitry to reduce device–to–device variations and temperature effects. Consequently, when designing the fixed–value amplifier circuitry, the resolution possible with the MPX2010 is almost four times greater than the same amplifier circuit using an MPX10. In both examples, both systems’ performance (Resolution) are optimized to be the best possible, given the distribution of the sensor device parameters and the other component variations. As stated previously if the methodology’s calculations show that the sensor’s signal will always be within the dynamic range of the amplifier (and high and low reference voltages of the A/D), a software calibration may then be implemented to nullify any room temperature device–to–device and component variations. It should be noted, however, that this methodology does not consider how to obtain the best performance from a single sensor system. Rather, the focus of the methodology is to obtain the best possible system performance while considering the distribution of device parameters that result from manufacturing and other sources of variation. By considering the sources of variation, the system may then be mass–produced without individually calibrating the sensor system hardware. Obviously, if each sensor system is hand–calibrated, the performance will be better. However, the hand–calibration also requires additional cost and time when producing the sensor system. CONCLUSION To guarantee a specified performance when designing a fixed–value circuit for sensor systems, all significant sources of variation must be considered. By considering the sources of variation (device–to–device variations, temperature effects, and component tolerances), the system may be designed so that the specified performance (resolution) is achieved while still keeping the sensor’s amplified dynamic range within the A/D window (or saturation levels of the amplifier). The specified performance may be achieved in all cases by applying the methodology described herein. By first calculat- ing the Minimum Required Span to achieve the required resolution in all scenarios and then determining if the remaining dynamic range or headroom is large enough to accommodate the sources of variation, the methodology determines if the resolution requirement is feasible. If the sources of variation are too large, the resolution requirement may not be attainable. In such a case, the resolution requirement should be relaxed, or the sources of variation must be decreased. Finally, once the system is successfully designed to ensure that the sensor signal will always be within the dynamic range of the amplifier (and high and low reference voltages of the A/D), a software calibration may be implement- ed to nullify any room temperature device–to–device and component variations. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

filter. This plot does not include the gain of the amplifier. Figure 2. Filter Frequency Response Freescale Semiconductor, Inc.

/C0065/C0078/C0049/C0053/C0055/C0049 3–358 Motorola Sensor Device Datawww.motorola.com/semiconductors Referring to the schematic, Figure 4, the MPX5050GP pressure sensor is connected to PORT D bit 5 and the output of the amplifier is connected to PORT D bit 6 of the microcontroller. This port is an input to the on–chip 8–bit analog–to–digital (A/D) converter. The pressure sensor provides a signal output to the microprocessor of approximately 0.2 Vdc at 0 mmHg to 4.7 Vdc at 375 mmHg of applied pressure whereas the amplifier provides a signal from 0.005 V to 3.5 V. In order to maximize the resolution, separate voltage references should be provided for the A/D instead of using the 5 V supply. In this example, the input range of the A/D converter is set at approximately 0 Vdc to 3.8 Vdc. This compresses the range of the A/D converter around 0 mmHg to 300 mmHg to maximize the resolution; 0 to 255 counts is the range of the A/D converter. VRH and VRL are the reference voltage inputs to the A/D converter. The resolution is defined by the following: Count = [(VXdcr – VRL )/(VRH – VRL )] x 255 The count at 0 mmHg = [(0.2 – 0)/(3.8 – 0)] x 255 ≈ 14 The count at 300 mmHg = [(3.8 – 0)/(3.8 – 0)] x 255 ≈ 255 Therefore the resolution = 255 – 14 = 241 counts. This translates to a system that will resolve to 1.24 mmHg. The voltage divider consisting of R5 and R6 is connected to the +5 volts powering the system. The output of the pressure sensor is ratiometric to the voltage applied to it. The pressure sensor and the voltage divider are connected to a common supply; this yields a system that is ratiometric. By nature of this ratiometric system, variations in the voltage of the power supplied to the system will have no effect on the system accuracy. The liquid crystal display (LCD) is directly driven from I/O ports A, B, and C on the microcontroller. The operation of a LCD requires that the data and backplane (BP) pins must be driven by an alternating signal. This function is provided by a software routine that toggles the data and backplane at approximately a 30 Hz rate. Other than the LCD, there are two more I/O devices that are connected to the pulse length converter (PLM) of the microcontroller; a buzzer and a light emitting diode (LED). The buzzer, which connected to the PLMA, can produce two different frequencies; 122 Hz and 1.953 kHz tones. For instance when the microcontroller encounters certain error due to improper inflation of cuff, a low frequency tone is alarm. In those instance when the measurement is successful, a high frequency pulsation tone will be heard. Hence, different musical tone can be produced to differential each condition. In addition, the LED is used to indicate the presence of a heart beat during the measurement. The microcontroller section of the system requires certain support hardware to allow it to function. The MC34064P–5 provides an undervoltage sense function which is used to reset the microprocessor at system power–up. The 4 MHz crystal provides the external portion of the oscillator function for clocking the microcontroller and provides a stable base for time based functions, for instance calculation of pulse rate. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

Figure 4. Blood Pressure Meter Schematic Drawing Freescale Semiconductor, Inc.

Figure 6. Main program flowchart Display ”SYS” follow by SBP. Display ”dlA” follow by DBP. Freescale Semiconductor, Inc.

Table 1. Selection of microcontroller Motorola Application Note AN1305. Freescale Semiconductor, Inc.

mechanics in terms that are easily understood while maintaining the necessary technical accuracy and level of detail. of pressure measurement and the conversion between the units. Figure 1. Conversion Table for Common Units of Pressure vacuum. Gage pressure is the measurement of the difference between the absolute pressure and the local atmospheric pressure. be psi and for the SI system it could be kPa. Freescale Semiconductor, Inc.

Figure 2. Pressure Term Relationships at rest and a dynamic system is on in which the fluid is moving. pressure being applied to the system. However, this may not remain true if the system is large enough or the pressures low enough. Pabs is the absolute pressure at depth H. P is the external pressure at the top of the liquid. For most open systems this will be atmospheric pressure. ρ is the density of the fluid. g is the acceleration due to gravity (g = 32.174 ft/sec2 (9.81 m/sec2)). H is the depth at which the pressure is desired. Freescale Semiconductor, Inc.

/C0065/C0078/C0049/C0053/C0055/C0051 3–367Motorola Sensor Device Data www.motorola.com/semiconductors Transient Systems Transient systems are systems with changing conditions such as pressures, flow rates, etc. Measurements in transient systems are the most difficult to accurately obtain. If the measurement system being used to measure the pressure has a faster response time than the rate of change in the system, then the system can be treated as quasi–steady–state. That is, the measurements will be about as accurate as those taken in the steady–state system. If the measurement of the system is assumed to be a snap shot of what is happening in the system, then you want to be able to take the picture faster than the rate of change in the system or the picture will be blurred. In other words, the measurement results will not be accurate. In a pressure measurement system, there are two factors that determine the overall measurement response: (1) the response of the transducer element that senses the pressure, and (2) the response of the interface between the transducer and the pressure system such as the pressure transmitting fluid and the connecting tube, etc. For Motorola pressure sensors, the second factor usually determines the overall frequency response of the pressure measurement system. The vast majority of pressure systems that require measurements today are quasi–steady–state systems where system conditions are changing relatively slowly compared to the response rate of the measurement system or the change happens instantaneously and then stabilizes. Two transient system examples include washing machines and ventilation ducts in buildings. In a washing machine, the height of the water in the tub is measured indirectly by measuring the pressure at the bottom of the tub. As the tub fills the pressure changes. The rate at which the tub fills and the pressure changes is much slower than the response rate of the measurement system. In a ventilation duct, the pressure changes as the duct registers are opened and closed, adjusting the air movement within the building. As more registers are opened and closed, the system pressure changes. The pressure changes are virtually instantaneous. In this case, pressure changes are essentially incremental and therefore easy to measure accurately except at the instant of the change. For most industrial and building control applications, the lag in the pressure measurement system is negligible. As the control or measurement system becomes more precise, the frequency response of the measurement system must be considered. Motorola Pressure Sensors This application note has covered various types of pressures that are measured and how to tap into a system to measure the desired pressures. How are the actual pressure measurements made? There are many types of pressure measurement systems ranging from simple liquid tube manometers to bourdon–tube type gages to piezo–electric silicon based transducers. Today, as electronic control and measurement systems are replacing mechanical systems, silicon–based pressure transducers and sensors are becoming the sensors of choice. Silicon micromachined sensors offer very high accuracies at very low cost and provide an interface between the mechanical world and the electrical system. Motorola carries a complete line of silicon based pressure sensors which feature a wide range of pressures with various levels of integration on a single chip. These levels of integration start with the basic uncompensated, uncalibrated pressure sensor all the way to the fully integrated, temperature compensated, calibrated and signal conditioned pressure sensors. The response time of Motorola’s MPX series silicon pressure sensors is typically 1 millisecond or less. For static or dynamic systems, Motorola’s pressure sensors are an excellent solution for pressure measurement systems. Conclusion Pressures and pressure measurements can be extremely complex and complicated. However, for most systems it is relatively easy to obtain accurate pressure measurements if the proper techniques are used. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

has better noise immunity compared to analog signals. option but a digital output to further process the signal. semiconductor pressure sensors.

Motorola MPX2000 series pressure sensor
A two op amp gain stage to amplify the sensor’s signal
An integrator (i.e. a low pass filter consisting of one resistor and one capacitor)
An LM311 comparator
An MC68HC05P9 microcontroller with which only two pins are used: the output compare timer channel (TCMP) and one general I/O pin (the input capture timer channel, TCAP, can be used in place of the general I/O pin). Since only two of the MC68HC05P9’s pins are used, the remaining pins are available for other system functions.

Figure 1. The Digital Output Sensor Schematic Freescale Semiconductor, Inc.

How the system works
Defining and designing the digital output for a desired sig- nal resolution
A step–by–step procedure that shows you how to digitize the signal
A procedure to show you how to software calibrate the digi- tal output
Related software examples This system, in addition to the benefits of a digital output (noise immunity, etc.), also has the following additional inherent benefits. These benefits will be addressed in more detail in the systems topics.
The circuit topology and method of “digitizing” the sensor’s analog output is very stable and accurate. The system uses the microcontroller’s precise, internal, digital time base to digitize the analog signal.
The signal resolution is user–programmable via software — i.e. the user can program whether the resolution is 8–bit, 10–bit, etc.
The digital output is calibrated in software so that compo- nent tolerances can be nullified.
The software required to digitize the signal requires very little CPU time and overhead.
The required circuitry is minimal, simple, and cost–effec- tive. THE PRESSURE SENSOR Motorola’s MPX2000 series sensors are temperature compensated and calibrated (i.e. offset and span are precision trimmed) pressure transducers. These sensors are available in full scale pressure ranges from 10 kPa (1.5 psi) to 700 kPa (100 psi). Although the specifications (see Table 1) in the data sheets apply to a 10 V supply voltage, the output of these devices is ratiometric with the supply voltage. For example, at the absolute maximum supply voltage rating,

16 V, the sensor will typically produce a differential output

a four volt span with a zero pressure offset of 0.5 V. Table 1. MPX2100 Electrical Characteristics for the zero pressure offset at the desired level. Table 2. Resistor Values for the MPX2100 Freescale Semiconductor, Inc.

pulse train from the microcontroller is input to the integrator. the same voltage as the microcontroller’s 5 V supply. pulse train logic–level one value of 5 V. Table 3. Example Pulse Train Duty Cycles and the at the output is all that is needed to obtain a rail–to–rail output. critical but should be on the order of 100 kΩ . an input to monitor the logic–level of the comparator’s output. transition is the digital representation of the sensor’s voltage.

Full–Scale Pressure in kPa Current Pressure = For example: At zero pressure, if the pulse train’s duty cycle required to cause a logic–level transition at the comparator’s output is 25% and at full–scale pressure the pulse train’s duty cycle is 75%, then the current pressure that corresponds to a duty cycle of 50% (required to obtain the logic–level one to logic–level zero transition at the comparator’s output) is Current Pressure/C004350% – 25% 75% – 25% • 100 kPa = 50 kPa Until now, the pulse train has been defined in terms of duty cycle. However, in practice duty cycle is calculated from the ratio of the high time to the total period of the pulse train. Therefore, there is a high time (typically in µs) of the pulse train that causes the logic–level transition of the comparator’s output. The interpolation of the current pressure can then be calculated directly from the high time of the pulse train that is programmed by the user to be generated by the Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

Full–Scale Pressure in kPa Current Pressure = Via this equation, the digital nature of the design is revealed. The analog voltage signal has been translated into a signal in the time domain where the high time generated by the output compare pin is actually the digital time representation of the sensor’s output. Since the user precisely controls the high time of the pulse train (and period) via software which is based on the accurate digital time base of the microcontroller, the digital representation of the signal is very stable and accurate. Additionally, the high accuracy of the digital representation is possible since all the user must do to digitize the signal is detect a single logic–level transition at the comparator’s output. SYSTEM DESIGN: DEFINING AND DESIGNING FOR A DESIRED SIGNAL RESOLUTION The resolution is directly related to the period (and thus frequency) of the pulse train. In our design, the difference between the pulse train’s high time at full scale pressure and the pulse train’s high time and zero pressure must be 512 µs to obtain at least 8–bit resolution. This is determined by the fact that a 4 MHz crystal yields a 2 MHz clock speed in the MC68HC05P9 microcontroller. This, in turn, translates to 0.5 µs per clock tick. There are four clock cycles per timer count. This results in 2 µs per timer count. Thus, to obtain 256 timer counts (discrete high–time time intervals or 8–bit resolution), the difference between the zero pressure and full scale pressure high times must be at least 2 µs x 256 = 512 µs. To determine the pulse train’s maximum frequency (or minimum period), the sensor’s analog dynamic range (span) must be known. For this design, the span is 4 V. Thus the 4 V span of the sensor must translate to 512 µs of time for 8–bit resolution. But the pulse train typically has a logic–level high value of 5 V, indicating that for a 100% duty cycle or a period with all high time, the integrator’s output would be 5 V; likewise for a duty cycle of 0% or a period with no high time, the output would be 0 V. Therefore 512 µs accounts for only 4 V/5 V (80%) of the pulse train’s total period. See Figure 2. . To calculate the pulse train’s total period, divide the 512 µs by 4/5 (0.8) to obtain the required minimum period for the pulse train of 640 µs. The reciprocal of this minimum period is the maximum frequency (1.56 kHz) of the pulse train to obtain at least 8–bit resolution. To summarize: The MC68HC05P9 runs off a 4 MHz crystal. The microcontroller internally divides this frequency by two to yield an internal clock speed of 2 MHz. 2M H z/C0043/C01170.5 /C0109s clock cycle And, 4 clock cycles = 1 timer count. Therefore, 4 clock cycles timer count 0.5 /C0109s clock cycle/C00432 /C0109s timer count• For 8–bit resolution, 2 /C0109s timer count• 256 timer counts = 512 µs which is the required minimum time into which the sensor’s 4 V span is translated. To calculate the required period of the pulse train to yield the 0 to 5 V output (from 0% to 100% duty cycle based on the pulse train’s logic–level high value of 5 V): 512 /C0109s for a 4 V sensor span 4/C03245 of integrator/C0512s output /C0043640 /C0109s Minimum Required Period = Translating this to frequency, the maximum pulse train frequency is thus 640 /C0109s /C00431.56 kHz. The above procedure can be implemented easily for other resolution requirements (i.e. a resolution of 1%, 2%, etc.).

Figure 2. Designing the Pulse Train’s Period for 8–Bit Resolution

5 V (PULSE TRAIN’S LOGIC–LEVEL ONE VALUE)

4.5 V (SENSOR’S ANALOG VOLTAGE OUTPUT

0.5 V (SENSOR’S ANALOG VOLTAGE OUTPUT

0 V (PULSE TRAIN’S LOGIC–LEVEL ZERO VALUE)

4.0 V SPAN

Freescale Semiconductor, Inc.

/C0065/C0078/C0049/C0053/C0056/C0054 3–372 Motorola Sensor Device Datawww.motorola.com/semiconductors Important Note: Very small and very large high times (assuming a fixed period) are typically unattainable due to the finite amount of time it takes to generate the pulse train on the output compare pin. This amount of time will vary depending on the microcontroller’s clock speed and the latency of the actual software routines implemented. Thus the sensor’s analog voltage to which the integrator’s dc voltage is compared must be within the possible ranges of voltages created by the integrator’s input pulse train — i.e. the sensor’s zero pressure offset voltage must be greater than the smallest voltage created by the integrator (corresponding to the pulse train’s smallest possible high time) and the sensor’s full scale output voltage must be less than the largest voltage created by the integrator (corresponding to the pulse train’s largest possible high time). After establishing the frequency of the pulse train, the RC time constant for the integrator can be determined and the resistor and capacitor value can be chosen. The RC time constant should be long compared to the period of the pulse train so that a stable dc voltage (very little ripple due to the capacitor’s charging and discharging) is obtained at the output of the comparator. Follow these steps to design the RC time constant and integrator’s component values. The design example’s calculations are presented simultaneously. For the resolution desired, determine the number of volts (typically mV) that corresponds to the least significant bit (one timer count). For this design example, 8–bit resolution (256 timer counts) over the desired pressure sensor span corresponds to #o f mV timer count /C0043Desired Pressure Sensor Span (V) Number of Timer Counts /C00434V 256 timer counts/C004315.6 mV timer count Therefore the stability of the integrator’s output voltage should be less than 15.6 mV (least significant bit). Choosing an RC time constant that allows a ripple of approximately one–fourth of the least significant bit is sufficient (approximately 3.9 mV). The most ripple occurs at a 50% duty cycle pulse train. For this design the entire period is 640 µs. 50% duty cycle indicates a high time (and low time) of 320 µs. Furthermore, the capacitor should discharge no more than approximately 3.9 mV (defined as ΔV) over the 320 µs. The following equation is used to calculate the value for RC: t RC V(t) = Vinitial – ΔV = Pulse Train Logic–level one value • Duty Cycle • e where Vinitial = Pulse Train Logic–level one value • Duty Cycle and ΔV is the voltage discharge of the capacitor. Solving for RC: t ln/C0466 V(t) Pulse Train Logic–level one value Duty Cycle/C0467• RC = – /C0043 320 /C0109s ln/C04662 . 5V–3 . 9m V

5 V 50% /C0467

/C00430.205 s Finally, choose the values of the resistor and capacitor. A typical resistor value is on the order of a tens of kΩ . The resistor’s value can be higher (hundreds of kΩ ) but care must be taken to avoid increased thermal noise. For this design, the resistor value is chosen to be 49.9 kΩ (1% resistor). The capacitor’s value is readily calculated to be C /C00430.205 s 49.9 k/C0087/C00434.1 /C0109F Choose the values of the resistor and capacitor so that the actual time constant is equal to or greater than the calculated time constant. Note: Be aware that temperature variations can create errors in the system (thus reducing system performance); therefore, be sure to use low temperature coefficient resistors, capacitors, etc. SYSTEM DESIGN: STEP–BY–STEP PROCEDURE FOR PRESSURE MEASUREMENT AND CALIBRATION To measure pressure (note: there are other measurement algorithms that can be performed that in some cases may be more acceptable (see below, Additional notes)): 1. Start with a pulse train with the minimum high time feasible with the system’s microcontroller. Pulse train should run at a frequency equal to or less than the frequency calculated above. 2. Make sure the general I/O pin’s input is high (sensor’s output voltage is greater than the integrator’s output voltage). 3. Increment the high time of the pulse train by one timer count. 4. Check the general I/O pin to see if its input is low (sensor’s output voltage has become less than the integrator’s output voltage). 5. If the general I/O pin is reading a logic–level zero, store in memory the high time of the pulse train as the current pressure high time reading that created the logic–level transition in the comparator’s output. 6. If the general I/O pin is reading a logic–level one, go back to step 3 and repeat. above, calculate the current pressure (assuming the system has already been calibrated). 8. Repeat steps 1 through 7 for additional pressure measurements. To calibrate the system: At zero and full scale pressures, perform the above 8 step pressure measurement routine. Store the appropriate pulse train high times corresponding to zero and full scale pressure. These high times will be used to calculate the current pressure as mentioned in Step 7 above. SOFTWARE EXAMPLES TO GENERATE PULSE TRAIN ON OUTPUT COMPARE TIMER CHANNEL The following software examples are written in assembly language for the MC68HC05P9 (the code is applicable to any HC05 series microcontroller with TCMP pin). Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0053/C0056/C0054 3–373Motorola Sensor Device Data www.motorola.com/semiconductors * GENERATES THE PULSE TRAIN ON TCMP GEN LDA PERIODL * LOW BYTE OF THE PERIOD SUB HIGHTIMEL * LOW BYTE OF THE HIGHTIME STA LOWTIMEL * LOW BYTE OF THE LOWTIME LDA PERIODH * HIGH BYTE OF THE PERIOD SBC HIGHTIMEH * HIGH BYTE OF THE HIGHTIME STA LOWTIMEH * HIGH BYTE OF THE LOWTIME RTS * INCREASE THE HIGH TIME (DUTY CYCLE) OF THE PULSE TRAIN INCPW LDA HIGHTIMEL ADD #$01 * INCREMENT PULSE WIDTH BY 2 µs STA HIGHTIMEL LDA HIGHTIMEH ADC #$0 STA HIGHTIMEH RTS * DECREASE THE HIGH TIME (DUTY CYCLE) OF THE PULSE TRAIN DECPW LDA HIGHTIMEL SUB #$01 * DECREMENT PULSE WIDTH BY 2 µs STA HIGHTIMEL LDA HIGHTIMEH SBC #$0 STA HIGHTIMEH JSR GEN RTS * INCREASE THE PERIOD (DECREASE FREQUENCY) OF THE PULSE TRAIN INCPER LDA PERIODL ADD #$05 * INCREMENT PERIOD BY 10 µs STA PERIODL LDA PERIODH ADC #$0 * ADJUST HIGH BYTE OF PERIOD IF CARRY STA PERIODH JSR GEN RTS * DECREASE THE PERIOD (INCREASE FREQUENCY) OF THE PULSE TRAIN DECPER LDA PERIODL SUB #$05 * DECREMENT PERIOD BY 10 µs STA PERIODL LDA PERIODH SBC #$0 * ADJUST HIGH BYTE OF PERIOD IF BORROW STA PERIODH JSR GEN RTS TIMER * INTERRUPT SERVICE ROUTINE FOR TCMP LDA TSR * CLEAR OCF FLAG IN TSR LDA TCMPL BRSET 0,TCR,ADDHIGH * HIGH OR LOW PULSE TIME NEEDED? ADDLOW BSET 0,TCR * ADD LOW TIME TO THE PULSE TRAIN LDA LOWTIMEL ADD TCMPL TAX LDA TCMPH ADC LOWTIMEH STA TCMPH STX TCMPL RTI ADDHIGH BCLR 0,TCR * ADD HIGH TIME TO THE PULSE TRAIN LDA HIGHTIMEL ADD TCMPL TAX LDA TCMPH ADC HIGHTIMEH STA TCMPH STX TCMPL RTI Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0053/C0056/C0054 3–374 Motorola Sensor Device Datawww.motorola.com/semiconductors ADDITIONAL NOTES This type of A/D conversion method (one type of A/D conversion) inherently takes a finite period of time to digitize the signal (incrementing the pulse train’s high time while polling the general I/O pin); however, for most sensor applications the physical phenomenon being measured does not change quickly (<1 ms) enough to warrant an ultra–fast A/D conversion process. An additional advantage of this design is that the measurement process may be performed only as necessary, keeping the CPU processing time and overhead minimal. If an input capture timer channel (TCAP) is available, it may be configured to detect the logic–level one to logic–level zero transition of the comparator’s output. When the edge transition occurs, an interrupt service routine is executed that stores the pulse train’s high times, calculates the current pressure, etc. This is typically more convenient and eliminates the need to poll a general I/O pin every time the pulse train’s high time is incremented (interrupt subroutine is executed only when the edge transition occurs). SUMMARY Shown above is a minimal component design that can convert an analog sensor’s output into a digital output. Each major subsystem (sensor, amplifier, integrator, comparator, and microcontroller) is explained in detail simultaneously with a design example. Next the system operation is discussed including how it works and how to design a desired system resolution. Finally a flow chart for measuring and calibrating the sensor’s output is presented. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

experience a zero–pressure condition at system start up,
are idle for a long time (zero pressure), take a pressure measurement then go back to idle again. For example, in a water level measurement in a washing machine application, there is a zero pressure reference condition when the water in the tub is fully pumped out. Another application that is perfect for auto–zeroing is a beverage fill level measurement; a zero reference condition exists before the bottle is filled. HVAC air flow applications can also use auto–zeroing; before system start up, an auto–zero can be initiated. In other words, it can be used in applications where a zero pressure condition can exist in order to auto–zero the system. An auto–zero command can be automated by the system or can be commanded manually. Each system will have a different algorithm to command an auto–zero signal. For example, using the beverage fill level measurement as an example, the system will auto zero the sensor before the bottle is filled. IMPLEMENTATION OF AUTO–ZERO WITH A MICROCONTROLLER Auto–zero can be implemented easily when the integrated sensor is interfaced to a microcontroller. The auto–zero algorithm is listed below: 1. Sample the sensor output when a known zero refer- ence is applied to the sensor (atmospheric pressure is a zero reference for gauge type measurement). Store current zero pressure offset as CZPO. 2. Sample the sensor output at the current applied pressure. Call this SP. 3. Subtract the stored offset correction, CZPO, from SP. The pressure being measured is simply calculated as: PMEAS = (SP/C0042CZPO)/S. Note that the equation is simply a straight line equation, where S is the sensitivity of the sensor. The auto–zero algorithm is shown graphically in Figure 3.

Figure 3. Flow–Chart of the Auto–Zero Algorithm Freescale Semiconductor, Inc.

/C0065/C0078/C0049/C0054/C0051/C0054 3–377Motorola Sensor Device Data www.motorola.com/semiconductors IMPROVEMENT ON OFFSET ERROR In the following calculations, we will illustrate how auto–zero will improve the offset error contribution. We will use the MPXV4006G interfaced to an 8–bit A/D as an example. When auto–zero is performed, the offset errors are reduced and the resulting offset errors are replaced with the error (due to resolution) of the A/D. We can categorize the offset error contributions into temperature and calibration errors. Temperature Coefficient of Offset Error The offset error due to temperature is due to Temperature Coefficient of Offset, or TCO. This parameter is the rate of change of the offset when the sensor is subject to temperature. It is defined as: TCO = (ΔVOFF /ΔT). The MPXV4006G has a temperature coefficient of offset (normalized with the span at 25°C) of: ΔTCO = (ΔVOFF /ΔT)/VFS@25 °C = 0.06% FS/°C. As an example, if the sensor is subjected to temperature range between 10°C and 60°C, the error due to TCO is: Offset Calibration Errors Even though the offset is laser trimmed, offset can shift due to packaging stresses, aging and external mechanical stresses due to mounting and orientation. This results in offset calibration error. For example, the MPXV4006G data sheet shows this as: VOFF MIN = 0.100 V, VOFF TYPICAL = 0.225 V and VOFF MAX = 0.430 V. We can then calculate the offset calibration error with respect to the full scale span as: ΔVOFF MIN,MAX = (VOFF TYPICAL /C0042VOFF MIN,MAX )/VFS. This results in the following offset calibration error, ΔVOFF MIN = 2.7% FS and ΔVOFF MAX = 4.5% FS. A/D Error As mentioned above, we can reduce offset errors (calibration and TCO) when we perform auto–zero. These errors are replaced with the A/D error (due to its resolution), ΔOFFSET AUTOZERO = ΔTCO + ΔOFFSET = ΔA/D. Typically, a sensor is interfaced to an 8–bit A/D. With the A/D reference tied to VRH = 5 V and VRL = 0 V, the A/D can resolve 19.6 mV/bit. For example, the MXPV4006G has a sensitivity of 7.5 mV/mmH20, the resolution is therefore, A/DRESOLUTION = 19.6 mV/bit)/(7.5 mV/mmH20) = 2.6 mmH20/bit. Assuming +//C00421 LSB error, the error due to digitization and the resulting offset error is, ΔA/D = ΔOFFSET AUTOZERO = 2.6 mmH20/612 mmH 20 It can be seen that with increasing A/D resolution, offset errors can be further reduced. For example, with a 10–bit A/D, the resulting offset error contribution is only 0.1% FS when auto–zero is performed. If auto–zero is to be performed only once and offset correction data is stored in non–volatile memory, the TCO offset error and calibration error will not be corrected if the sensor later experiences a wide temperature range or later experience an offset shift. However, if auto–zero is performed at the operating temperature, TCO error will be compensated although subsequent offset calibration error will not be compensated. It is therefore best to auto–zero as often as possible in order to dynamically compensate the system for offset errors. CONCLUSION Auto–zero can be used to reduce offset errors in a sensor system. This technique can easily be implemented when an integrated pressure sensor is interfaced to an A/D and a microcontroller. With a few lines of code, the offset errors are effectively reduced; the resulting offset error reduction is limited only by the resolution of the A/D. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

bridges becomes a design consideration. quency and is more dominant at lower frequencies3. needs special consideration. with high resolution A/D converters. amplified and shows up at the output as depicted in Figure 1. consider filtering. Filtering options are discussed as follows. Figure 1. MPX5006 Raw Output Freescale Semiconductor, Inc.

3–384 Motorola Sensor Device Datawww.motorola.com/semiconductors /C0065/C0078/C0049/C0054/C0054/C0048 /C0067/C0111/C0109/C0112/C0111/C0117/C0110/C0100 /C0067/C0111/C0101/C0102/C0102/C0105/C0099/C0105/C0101/C0110/C0116 /C0080/C0114/C0101/C0115/C0115/C0117/C0114/C0101 /C0083/C0101/C0110/C0115/C0111/C0114 /C0080/C0083/C0080/C0073/C0067/C0069 /C0077/C0111/C0100/C0101/C0108/C0115 Prepared by: Warren Schultz PSPICE models for Uncompensated, MPX2000 series, and MPX5000 series pressure sensors are presented here. These models use compound coefficients to improve modeling of temperature dependent behavior. The discussion begins with an overview of how the models are structured, and is followed by an explanation of compound coefficients. The emphasis is on how to use these models to estimate sensor performance. They can be found electronically on a disk included in ASB200 Motorola Sensor Development Controller kits, and on the WEB at: http://www.mot–sps.com/home2/models/bin/sensor2.html MODEL STRUCTURE Models for all three sensors series share a common structure. They are complete models set up to run as is. To obtain output voltage versus pressure, it is only necessary to run the model and display V(2,4) or V(1,0). V(2,4) gives the output voltage for Uncompensated and MPX2000 series sensors. V(1,0) applies to MPX5000 sensors. In both cases, V(2,4) and V(1,0) correspond to the pin numbers where output voltage would be, if probed on an actual part. These models are divided into five sections to facilitate ease of use. They are:

INPUT PARAMETERS
LINEAR TO COMPOUND CONVERSION
MODEL COEFFICIENTS
TRANSDUCER
STIMULUS Each of these sections is described in the following discussion. INPUT PARAMETERS This section contains input parameters that describe measurable sensor characteristics. Inputs such as full scale pressure (FSP), full scale span (FSS) offset voltage (VOFFSET), and temperature coefficient of offset voltage (TCOS) are made here. Characteristics that are specific to the transducer, such as bridge impedance (RBRIDGE), temperature coefficient of bridge resistance (TCRB), and temperature coefficient of span (TCSP) are also listed here. Parameters such as VOFFSET that set an output value for the sensor are used to calculate resistance values that produce those outputs. For example, if you input 100 mV of offset voltage and a 10 µV/degree temperature coefficient of offset voltage, the model will calculate the bridge resistance values necessary to produce 100 mV of offset voltage and a 10 µV/degree temperature coefficient. In the MPX2000 and MPX5000 models, temperature coefficient of span (TCSP) is handled differently than the other parameters. The non–linear behavior of span over temperature is calculated from the interaction of the transducer’s temperature coefficient of span (TCSP), the transducer’s temperature coefficient of resistance (TCRB), and the effects of inserting fixed resistance, RTCSPAN, in series with the bridge. The result is a temperature coefficient of span that closely resembles the real thing, but is not directly controlled by the user. LINEAR TO COMPOUND CONVERSION The compound coefficients used in these models are from equations of the form: (1) R(Temp) = R 25(1 /C0041 TCR)(Temp – 25) where R25 is resistance at 25 degrees Celsius , TCR is temperature coefficient of resistance, Temp is an abbreviation for Temperature in degrees Celsius, and R(Temp) is the function resistance versus temperature. The TCR (temperature coefficient of resistance) in equation (1) is a different number than a temperature coefficient that is stated in linear terms. The three statements in this section convert linear coefficients to the compound values that the models need. This conversion is based upon a 100 degree difference between the two points at which the linear coefficients have been measured. MODEL COEFFICIENTS In this section most of the calculation is performed. Values for the transducer bridge resistors are determined from pressure, temperature, offset, temperature coefficient of offset, span, temperature coefficient of span, and temperature coefficient of resistance inputs. A series of parameter statements are used, as much as is practical, to do calculations that will fit in an 80 character line without wraparounds. These calculations use PSPICE’s .PARAMETER function, making the models specific to PSPICE. Parameters are described as follows: KP — Pressure constant; translates pressure into a bridge resistance multiplier KO — Offset constant; offset component of bridge resistance DT — Delta temperature; Temperature /C004225 degrees Celsius KTCO — Temperature coefficient of offset constant; trans- lates temperature coefficient of offset into bridge resistance /C0077/C0079/C0084/C0079/C0082/C0079/C0076/C0065 SEMICONDUCTOR APPLICATION NOTE REV 1 Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

tors RS2 and RS4 are equal to RPL–ROL. Figure 1. MPX10 and 100 PSPICE Compound Coefficient Model Freescale Semiconductor, Inc.

Resistor RS12 is also added to the Uncompensated model. Figure 2. MPX2000 Series PSPICE Compound Coefficient Model set voltage and temperature coefficient of the sensor bridge. output of ES3 with saturation limits at 75 millivolts and 4.9 volts. Freescale Semiconductor, Inc.

Figure 3. MPX5000 Series PSPICE Compound Coefficient Model sweep. Line 3 calls for a sweep of pressure and temperature. ohms to the resistor’s value at all temperatures. pound interest is a direct analog of temperature coefficients. where i is the interest rate and n is the number of periods. measurements and a linear model are summarized in Table 1. Freescale Semiconductor, Inc.

Figure 5. MPX2010 Offset versus Temperature structured for easy entry of alternate assumptions. merchantability and fitness of the models for any purpose. they intended to replace breadboarding for final verification. was negligent regarding the design or manufacture of the part. Affirmative Action Employer. Freescale Semiconductor, Inc.

3–390 Motorola Sensor Device Datawww.motorola.com/semiconductors /C0065/C0078/C0049/C0054/C0054/C0056 /C0087/C0097/C0115/C0104/C0105/C0110/C0103 /C0065/C0112/C0112/C0108/C0105/C0097/C0110/C0099/C0101 /C0083/C0101/C0110/C0115/C0111/C0114 /C0083/C0101/C0108/C0101/C0099/C0116/C0105/C0111/C0110 Prepared by Ador Reodique Sensor and Systems Applications Engineer INTRODUCTION North American washing machines currently in production use mechanical sensors for water level measurement func- tion. These sensors are either purely mechanical pressure switch with discrete trip points or electromechanical pressure sensor with an on–board electronics for a frequency output. High efficiency machines require high performance sen- sors (accuracy, linearity, repeatability) even at lower pres- sure ranges. Benchmarks indicate that these performance goals is difficult to achieve using current mechanical pres- sure sensors1. In Europe, where energy conservation is mandated, washing machine manufacturers have started to look at electronic solu- tions where accuracy, reliability, repeatability and additional functionality is to be implemented. North American and Asia Pacific manufacturers are also looking for better solutions. From surveys of customer requirements, a typical vertical– axis machine calls for a sensor with 600 mmH2O (24 “ H2O ~ 6 kPa) sensor with a 5 % FS accuracy spec. Certain appli- ances call for a lower pressure range especially in Europe where horizontal axis machines are common. SENSOR SOLUTIONS For the typical 600 mmH2O, 5 % FS spec, an off the shelf solution available today is the MPX10/MPX12, MXP2010 and the MPXV4006G sensor. The MPX10 (or the MPX12) is 10 kPa (40 “ H2O) full–scale pressure range device. It is uncom- pensated for temperature and untrimmed offset and full–scale span. This means that the end user must temperature com- pensate as well as calibrate the full–scale offset and span of the device. The output of the device must be amplified using a differential amplifier (see Figure 1) so it can be interfaced to an A/D and to obtain the desired range. Since the MPX10/MPX12 sensors must be calibrated, the implications of this device being used in high–volume pro- duction is expensive. Because the offset and full–scale out- put can vary from part to part, a two–point calibration is required as a minimum. A two point calibration is a time con- suming procedure as well as possible modification to the pro- duction line to accommodate the calibration process. The circuitry must also accommodate for trimming, i.e., via trim- pots and/or EEPROM to store the calibration data. This adds extra cost to the system. The MPX2010 is a 10kPa (40” H2O), temperature compen- sated, offset and full–scale output calibrated device. A differ- ential amplifier like the one shown in Figure 1 should be used to amplify its output. Unlike the MPX10 or MPX12, this device does not need a two–point calibration but auto–zeroing can improve its performance. This procedure is easily imple- mented using the system MCU. The MPXV4006G is a fully integrated pressure sensor spe- cifically designed for appliance water level sensing applica- tion. This device has an on board amplification, temperature compensation and trimmed span. An auto–zero procedure should be implemented with this device (see Application Note AN1636). Because expensive and time consuming calibra- tion, temperature compensation and amplification is already implemented, this device is more suitable for high volume pro- duction. The MPXV4006G integrated sensor is guaranteed to be have an accuracy of +/–3 % FS over its pressure and tem- perature range. For washing machine applications where low cost and high volume productions are involved, both the MPX2010 and MPXV4006G are recommended. Both solutions can be used in current vertical axis machines where the water level in the 600 mmH 2O or 24 “ H2O range. In the following, a comparison is made between MPX2010 and MPXV4006G in terms of system and performance considerations to help the customer make a decision. EXPECTED ACCURACY OF THE MPX2010 SYSTEM SOLUTION The MPX2010 compensated sensor has an off the shelf overall RMS accuracy of +/–7.2 % FS over 0 to 85°C tempera- ture range. Auto–zeroing can improve the sensor accuracy to +/– 4.42 % FS. However, since this sensor does not have an integrated amplification, its amplifier section must be designed carefully in order to meet the target accuracy requirement. The MPX2010 compensated sensor has the following specifica- tions shown on Table 1. /C0077/C0079/C0084/C0079/C0082/C0079/C0076/C0065 SEMICONDUCTOR APPLICATION NOTE Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

Table 1. MPX2010 Specifications **Table 2. MPX2010 span, offset and calculated maximum RMS error. *This assumes that the power supply is constant.** Freescale Semiconductor, Inc.

single supply and only 2 op–amps and 1% resistors. Figure 1. MPX2010 Amplifier Circuit equation 5 is the resulting offset voltage of the amplifier. an op–amp and designing the amplifier circuit. mended to use 1% metal film resistors to reduce these errors. son with R1 in order to reduce common mode error. Freescale Semiconductor, Inc.

power supply, a MC33272 dual op–amp and a 1% resistors. values for the system based on MPX2010 sensor. Table 3. MPX2010 Sensor System Values Table 4. Performance Comparison between MPX2010 and MPXV4006G Solution large span (4.6 V versus 3.0 V typical). Freescale Semiconductor, Inc.

/C0065/C0078/C0049/C0054/C0054/C0056 3–394 Motorola Sensor Device Datawww.motorola.com/semiconductors SUMMARY Several washing machine solutions were examined. The MPX10/12 solution can be expensive in terms of additional support circuitry and the added time and labor involved during the calibration procedure. The MPX2010 is good alternative for high volume manufacturing because is already calibrated. With this solution, however, the system amplifier design must be chosen and designed carefully in order to minimize the sys- tem error. This is a consideration when deciding to implement a high accuracy solution with the MPX2010 because the cost of the system will go up. The MPXV4006G solution is geared towards high volume manufacturing because trimming, compensation and amplifi- cation is already on board. Besides the system simplicity and using less component, the resolution and overall accuracy of this solution is better than the MPX2010 solution. In some cases, less components can actually improve the reliability and manufacturability the system. REFERENCES [1] Benchmark of Washing Machine Mechanical Sensor, Jack Rondoni, Motorola Internal Document. [2] Mechanical Sensor Characterization, Ador Reodique, Motorola Internal Document. [3] AN1551 Low Pressure Sensing with the MPX2010 Pressure Sensor, Jeff Baum, Motorola Application Note. [4] AN1636 Implementing Auto–Zero for Integrated Pressure Sensors, Ador Reodique, Motorola Application Note. [5] AN1556 Designing Sensor Performance Specifications for MCU–based Systems, Eric Jacobsen and Jeff Baum, Motorola Application Note. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

use a mechanical sensor for water level detection. MC68HC908QT4, 8–pin microcontroller. integration – Uncompensated, Compensated and Integrated. return a full–scale span of 12.5 mV. perfect fit for this application. Figure 1. MPXM2010GS/GST1 Freescale Semiconductor, Inc.

/C0065/C0078/C0049/C0057/C0053/C0048 3–396 Motorola Sensor Device Datawww.motorola.com/semiconductors Table 1: MPXM2010D OPERATING CHARACTERISTICS (VS = 10 Vdc, TA = 25°C unless otherwise noted, P1 > P2) Characteristic Symbol Min Typ Max Unit Pressure Range(1) POP 0 — 10 kPa Supply Voltage(2) VS — 10 16 Vdc Supply Current Io — 6.0 — mAdc Full Scale Span(3) VFSS 24 25 26 mV Offset(4) Voff –1.0 — 1.0 mV Sensitivity ΔV/ΔP — 2.5 — mV/kPa Linearity(5) — –1.0 — 1.0 %V FSS Amplifier Selection and Amplifier Induced Errors The sensor output needs to be amplified before being inputted directly to the microcontroller through an 8–bit A/D input pin. To determine the amplification requirements, the pressure sensor output characteristics and the 0–5V input range for the A/D converter had to be considered. The amplification circuit uses three op–amps to add an offset and convert the differential output of the MPXM2010GS sensor to a ground–referenced, single–ended voltage in the range of 0 – 5V. The pressure sensor has a possible offset of +/– 1mV at the minimum rated pressure. To avoid a nonlinear response when a pressure sensor chosen for the system has a negative offset (Voff), we have added a 5mV offset to the positive sensor output signal. This offset will remain the same regardless of the sensor output. Any additional offset that the sensor or op–amp introduce is compensated for by software routines that are invoked when the initial system calibration is done. To determine the gain required for the system, the maximum output voltage from the sensor for this application had to be determined. The maximum output voltage from the sensor is approximately 12.5mV with a 5V supply since the full–scale output of the sensor changes linearly with supply voltage. This system will have a maximum pressure of 4kPa at 40cm of water. At a 5V supply, we will have a maximum sensor output of 5mV at 4kPa of pressure. To amplify the maximum sensor output to 5.0V, the following gain is needed: Gain = (Max Output needed) / (Max Sensor Output and Initial Offset) The gain for the system was set for 500 to avoid railing from possible offsets from the pressure sensor or the op–amp. The Voltage Outputs from the sensor are each connected to a non–inverting input of an op–amp. Each op–amp circuit has the same resistor ratio. The amplified voltage signal from the negative sensor lead is VA. The resulting voltage is calculated as follows: VA = (1+R8/R6) * V4 = (1+10/1000) * V4 = (1.001) * V4 The amplified voltage signal from the positive sensor lead is VB. This amplification adds a small gain to ensure that the positive lead, V2, is always greater than the voltage output from the negative sensor lead, V4. This ensures the linearity of the differential voltage signal. VB = (1+R7/R5) * V2 – (R7/R5) * Vcc The difference between the positive sensor voltage, VB, and the negative sensor voltage, VA is calculated and amplified with a resulting by a gain of 500. VC = (R12/R11) * (VB – VA ) = (500K/1K) * (VB – VA ) = 500 * (VB – VA ) The output voltage, Vc, is connected to a voltage follower. Therefore, the resulting voltage, Vc, is passed to an A/D pin of the microcontroller. The range of the A/D converter is 0 to 255 counts. However, the A/D Values that the system can achieve are dependent on the maximum and minimum system output values: Count = (Vout – VRL ) / ( VRH – VRL ) x 255 where VXdcr = Transducer Output Voltage Vrh = Maximum A/D voltage Vlh = Minimum A/D voltage Count (40mm H20) = (5.0 – 0) / (5.0 – 0) x 255 = 255 Total # counts = 255 – 127 = 127 counts. The resolution of the system is determined by the mm of water that is represented by each A/D count. As calculate above, the system has a span of 226 counts to represent water level up to and including 40cm. Therefore, the resolution is: Resolution = mm of water / Total # counts = 400mm/127 counts = 3.1 mm per A/D count Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

Ref Qty. Description Value Vendor Part No. be available with further functionality and menu selections. LCD for 5 seconds or until the select (SEL) button is pushed. representing the past forty level readings. Figure 4. Water level system set–up for demonstration density and the height of the column of fluid. Freescale Semiconductor, Inc.

/C0065/C0078/C0049/C0057/C0053/C0048 3–399Motorola Sensor Device Data www.motorola.com/semiconductors Software Function Descriptions Main Function The main function calls an initialization function “ALLINIT”, calls a warm–up function “WARMUP” to allow extra time for the lcd to initialize, then checks if buttons PB1 and PB2 are being pressed. If they are both pressed, then it calls a calibration function “CALIB”. If they are not both pressed, then it enters the main function loop. The main loop displays the menu, moves the cursor when the PB1 is pressed and enters the function corresponding to the highlighted menu option when PB2 is pressed. Calibration Function The calibration function is used to obtain two calibration points. The first calibration point is taken when the head tube is not placed in water to obtain the pressure for 0mm of water. The second calibration point is obtained when the head tube is placed at the bottom of a container with a height of 160mm. When the calibration function starts, a message appears displaying the A/D values for the corresponding calibration points currently stored in the flash. To program new calibration points, the user must press PB1 to take 256 A/D readings at 0mm of water. The average is calculated and stored in a page of flash. Then the user has the option to press PB1 to exit the calibration function or obtain the second calibration point. To obtain the second calibration point, the head tube should be placed in 160mm of water and then the user should press PB2 to take 256 A/D readings. The average is taken and stored in a page of flash. Once the two readings have been taken, averaged, and stored in the flash, a message displays the two A/D values that were stored. Level Function The Level function will initialize the graphics characters. Once this is complete, it will continue looping to obtain an average A/D reading and display the Water Level, the Water Flow, and a Graphical History until the user presses and holds both PB1 and PB2 to return to the main function. The function first clears the 40 pressure readings that it will be updating for the Graphical History. It then enters the loop which first displays 8 special characters, each containing 5 data points of water level history. The function “adcbyta” is called to obtain the current averaged A/D value. The function “LfNx” is called to convert the A/D value to a water level, which is then compared to the Calibration points, the maximum and minimum points, to determine if the container is full or empty. If true, then it displays the corresponding message. The current water level is compared to the previous read and displays the message “filling” if it has increased, “emptying” if it has decreased, and “steady” if it has not changed. The water level calculation has to be converted to decimal in order to display it in the LCD. To convert the water level calculation to decimal, the value is continually divided with the remainder displayed to the screen for each decimal place. To display the Rate of Water Flow, the sign of the value is first determined. If the value is negative, the one’s complement is taken, a negative sign is displayed, and then the value is continually divided to display each decimal place. If the number is positive, a plus sign is displayed to maintain the display alignment and the value is continually divided to display each decimal place. The most complicated part of this function is updating the graphics history display. The characters for the 16x2 LCD that were chosen for this reference design are 8x5 pixels by default. Therefore, each special character that is created will be able to display 5 water level readings. Since the height of the special character is 8 pixel, each vertical pixel position will represent a water level in increments of 20mm. Resolution = (H1 – H0) / D where H1 and H2 are the maximum and minimum water levels respectively and D is the possible datapoints available per character. Resolution = (160mm – 0mm) / 8 = 20mm / data point. The graphical history is displayed using the 8 special characters. To update the graphics, all the characters have to be updated. The characters are updated by first positioning a pixel for the most recent water level reading in the first column of the first character. Then the four right columns of the first character are shifted to the right. The pixel in the last column of that character is then carried to the first column of the next character. This column shifting is continued until all 40 data points have been updated in the 8 special characters. LfNx Function The LfNx function calculates the water level from the current A/D pressure reading. The A/D Pressure value is stored in Register A before this function is called. Using the A/D value and the calibration values stored in the flash, the water level is calculated from the following function: RBRA: = (NX – N1) * 160 / (N2 – N1), where NX is the current A/D Value N1 is the A/D Value at 0mm H20 N2 is the A/D Value at 160mm H20 To simplify the calculation, the multiplication is done first. Then the function “NdivD” is called to divide the values. NdivD Function The “NdivD” function performs a division by counting successive subtractions of the denominator from the numerator to determine the quotient. The denominator is subtracted from the numerator until the result is zero. If there is an overflow, the remainder from the last subtraction is the remainder of the division. wrflash and ersflsh Functions The “wrflash” and “ersflsh” functions are used to write to and erase values from the flash. For more information regarding flash functionality, refer to Section 4. Flash Memory from the MC68HC908QY4/D Databook. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0057/C0053/C0048 3–400 Motorola Sensor Device Datawww.motorola.com/semiconductors ALLINIT Function The ALLINIT function disables the COP for this version of software, sets the data direction bits, and disables the data to the LCD and turns off the LCD enable line. It also sets up the microcontroller’s internal clock to half the speed of the bus clock. See Section 15, Computer Operating Properly, of the MC68908QT4 datasheet for information on utilizing the COP module to help software recover from runaway code. WARMUP Function The WARMUP function alternates the blinking of the two LEDs ten times. This gives the LCD some time to warm up. Then the function “warmup” calls the LCD initialization function, “lcdinit”. bintasc Function The “binasc” function converts a binary value to its ascii representation. A/D Functions The A/D functions are used to input the amplified voltage from the pressure sensor from channel 0 of the A/D converter. The function “adcbyti” will set the A/D control register, wait for the A/D reading and load the data from the A/D data register into the accumulator. The function “adcbyta” is used to obtain an averaged A/D reading by calling “adcbyti” 256 times and returning the resulting average in the accumulator. LCD Functions The LCD hardware is set up for multiplexing 3 pins from the microcontroller using an 8–bit shift register. Channels 3, 4, and 5 are used on port A for the LCD enable (E), the LCD reset (RS), and the shift register clock bit, respectively. The clock bit is used to manually clock data from channel 4 into the 8–bit shift register. This is the same line as the LCD RS bit because the MSB of the data is low for a command and high for data. The RS bit prepares the LCD for instructions or data with the same bit convention. When the 8 bits of data are available on the output pins of the shift register, the LCD enable (E) is toggled to receive the data. The LCD functions consist of an initialization function “lcdinit” which is used once when the system is started and five output functions. The functions “lcdcmdo” and “lcdchro” both send a byte of data. The function “shiftA” is called by both “lcdcmdo” and “lcdchro” to manually shift 8 bits of data into the shift register. The function “lcdnibo” converts the data to binary before displaying. The “lcdbyto” displays a byte of data by calling “lcdnibo” for each nibble of data. The function “lcdstro” enables strings to be easily added to the software for display. The function accepts a comma–delimited string of data consisting of 1–2 commands for clearing the screen and positioning the cursor. It then continues to output characters from the string until the “@” symbol is found, signally the end of the string. Conclusion The water level reference design uses a MPXM2010GS pressure sensor in the low cost MPAK package, the low cost, 8–pin microcontroller, and a quad op–amp to amplify the sensor output voltage. This system uses very few components, reducing the overall system cost. This allows for a solution to compete with a mechanical switch for water level detection but also offer additional applications such as monitoring water flow for leak detection, and the other applications for smart washing machines. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0057/C0053/C0048 3–401Motorola Sensor Device Data www.motorola.com/semiconductors Software Listing ;NitroWater 2.0 15Nov02 ;Water level reference design ; – uses NITRON (MC68HC08QC4) and MPAK (MPXM2010GS) ; CALIB: 2–point pressure calibration (0mm and 160mm) ; LEVEL: displays water level, flow, and graphics ; UNITS: displays A/D value, calib max/min values ram equ $0080 ;memory pointers rom equ $EE00 vectors equ $FFDE porta equ $00 ;registers ddra equ $04 config2 equ $1E config1 equ $1F tsc equ $20 tmodh equ $23 icgcr equ $36 adscr equ $3C adr equ $3E adiclk equ $3F flcr equ $FE08 flbpr equ $FFBE org $FD00 ;flash variables N1 db $96 ;1st calibration pt. = 0mm org $FD40 N2 db $F6 ;2nd calibration pt. = 160mm org $FD80 org vectors dw cold ;ADC dw cold ;Keyboard dw cold ;not used dw cold ;not used dw cold ;not used dw cold ;not used dw cold ;not used dw cold ;not used dw cold ;not used dw cold ;not used dw cold ;TIM Overflow dw cold ;TIM Channel 1 dw cold ;TIM Channel 0 dw cold ;not used dw cold ;IRQ dw cold ;SWI dw cold ;RESET ($FFFE) org ram BB ds 1 flshadr ds 2 flshbyt ds 1 memSP ds 2 mem03 ds 2 CNT ds 1 Lgfx ds 1 weath ds 1 ram0 ds 1 NC ds 1 NB ds 1 NA ds 1 DC ds 1 DB ds 1 DA ds 1 MB ds 1 MA ds 1 OB ds 1 OA ds 1 Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0057/C0053/C0048 3–402 Motorola Sensor Device Datawww.motorola.com/semiconductors RB ds 1 RA ds 1 P0C ds 1 P0B ds 1 P0A ds 1 NPTR ds 1 ramfree ds 80 ;used both for running RAM version of wrflash & storing 40 readings org rom cold: rsp jsr ALLINIT ;general initialization jsr WARMUP ;give LCD extra time to initialize brset 1,porta,nocalib brset 2,porta,nocalib jmp CALIB ;do calibration if SEL & ENT at reset nocalib: ldhx #msg01 ;otherwise skip and show welcome messages jsr lcdstro ;”Reference Design” msg jsr del1s ldhx #msg01a ;”Water Level” msg jsr lcdstro jsr del1s MENU: ldhx #msg01b jsr lcdstro clr RA ;menu choice=0 to begin with lda #$0D jsr lcdcmdo ;blink cursor on menu choice luke: ldx RA ;get current menu choice clrh lda menupos,x ;and look up corresponding LCD address jsr lcdcmdo warm: brclr 1,porta,PB1 ;wait for SEL brclr 2,porta,PB2 ;or for ENT bclr 4,porta bset 5,porta ;toggle LEDs jsr del100ms ;delay bset 4,porta bclr 5,porta ;toggle again: SEL *or* ENT jsr del100ms ;delay and repeat until SEL or ENT bra warm PB1: inc RA ;*SEL* toggles menu choices lda RA cmp #$02 ;menu choices are $00 and $01 blt PB1ok cmp #$03 bgt menureset ; shift up and display 3 MENU2: ldhx #msg01c jsr lcdstro menureset: clr RA ;back to $00 when all others have been offered PB1ok: bclr 4,porta bclr 5,porta ;LEDs off jsr del100ms ;wait a little bit brclr 1,porta,PB1ok ;make sure they let go of SEL bra luke PB2: bclr 4,porta ;*ENT* confirms menu choice bclr 5,porta ;LEDs off lda RA ;get menu choice cmpa #$00 bne skip00 jmp LEVEL ;do ===LEVEL=== if choice=$00 skip00: cmpa #$01 bne skip01 jmp UNITS ;do ===UNITS=== if choice=$01 skip01: cmpa #$02 bne skip02 ;do ==MANCALIB= if choice=$02 Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0057/C0053/C0048 3–403Motorola Sensor Device Data www.motorola.com/semiconductors jmp MANCALIB skip02: jmp TEST CALIB: ldhx #msg05 ;===CALIB=== 2–point calibration jsr lcdstro ;Calibration current values lda N1 ;0mm jsr lcdbyto lda #’/’ jsr lcdchro lda N2 ;160mm jsr lcdbyto bset 4,porta bset 5,porta ;LEDs on lego1: brclr 1,porta,lego1 lego2: brclr 2,porta,lego2 bclr 4,porta bclr 5,porta ;LEDs off when both SEL & ENT are released jsr del1s jsr del1s ;wait 2s ldhx #msg05a jsr lcdstro ;show instructions waitPB1: brset 2,porta,no2 ;if ENT is not pressed, skip jmp nocalib ;if ENT is pressed then cancel calibration no2: brclr 1,porta,do1st ;if SEL is pressed then do 1st point cal bra waitPB1 ;otherwise wait for SEL do1st: ldhx #msg05b ;1st point cal: show values jsr lcdstro clr CNT ;CNT will count 256 A/D readings clr RB clr RA ;RB:RA contains 16–bit add–up of those 256 values do256: lda #$C9 jsr lcdcmdo ;position LCD cursor at the right spot lda CNT deca jsr lcdbyto ;display current iteration $FF downto $00 lda #’:’ jsr lcdchro jsr adcbyti ;get reading add RA sta RA lda RB adc #$00 sta RB ;add into RB:RA (16 bit add) jsr lcdbyto ;show RB lda RA jsr lcdbyto ;then RA dbnz CNT,do256 ;and do 256x lsl RA ;get bit7 into carry bcc nochg ;if C=0 then no need to round up inc RB ;otherwise round up nochg: lda RB ;we can discard RA: average value is in RB ldhx #N1 ;point to flash location jsr wrflash ;burn it in! ldhx #msg05c ;ask for 160mm jsr lcdstro waitPB2: brset 2,porta,waitPB2 ;wait for ENT ldhx #msg05d ;2nd point cal: show values jsr lcdstro clr CNT ;ditto as 1st point cal clr RB clr RA do256b: lda #$C9 jsr lcdcmdo lda CNT deca jsr lcdbyto lda #’:’ jsr lcdchro jsr adcbyti add RA sta RA lda RB adc #$00 sta RB Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0057/C0053/C0048 3–404 Motorola Sensor Device Datawww.motorola.com/semiconductors jsr lcdbyto lda RA jsr lcdbyto dbnz CNT,do256b lsl RA bcc nochg2 inc RB nochg2: lda RB cmp N1 ;compare N2 to N1 bne validcal ;if different, we are OK ldhx #msg05e ;otherwise warn of INVALID CAL! jsr lcdstro jsr del1s jsr del1s jsr del1s ;wait 2s jmp CALIB ;try cal again validcal: ldhx #N2 jsr wrflash ;burn N2 into flash ldhx #msg05 ;and display new current cal values from flash jsr lcdstro lda N1 ;0mm value jsr lcdbyto lda #’/’ jsr lcdchro lda N2 ;160mm value jsr lcdbyto jsr del1s jsr del1s jmp nocalib ;done! LEVEL: lda #$01 ;===LEVEL=== main routine: displays level, flow & graphics jsr lcdcmdo ;clear screen lda #$0C jsr lcdcmdo ;cursor off lda #$88 ;position cursor at LCD graphics portion jsr lcdcmdo ;(2nd half of first line) clra ;and write ascii $00 through $07 fillgfx: jsr lcdchro ;which contain the graphics related to inca ;40 different readings cmp #$08 bne fillgfx LVL: ldhx #ramfree ;point to 40 pressure readings lda #$28 ;count down from 40 purge: clr 0,x ;clear all those locations incx ;next (H cannot change: we are in page0 RAM) dbnza purge jsr adcbyta ;get Lref: reference A/D reading jsr LfNx sta Lgfx ;store in ”Level graphics” LVLwarm: bset 4,porta bset 5,porta ;LEDs on during this cycle ldhx #ramfree ;point to 40 pressure readings mov #$27,RA ;count down from 39 shiftgfx: lda 1,x ;take location+1 sta 0,x ;and move to location+0, i.e. shift graphics left incx ;next X (once again: we are in page 0, no need to worry about H) dbnz RA,shiftgfx ;do this 39x lda #$80 jsr lcdcmdo lda Lgfx jsr adcbyta ;get averaged A/D reading (i.e. LX) jsr LfNx ;LX:=(NX–N1)*160/(N2–N1) mov RA,OA clr RB cmp #$03 ;if <=2mm bcs Lzero ;then ”empty” cmp #$9E bcc Lsat ;then ”full” clrh ldx #$14 ;div by 20 div mov #$01,RB Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0057/C0053/C0048 3–405Motorola Sensor Device Data www.motorola.com/semiconductors cmp #$01 beq Lzero makeRB lsl RB dbnza makeRB bra Lzero Lsat: mov #$80,RB Lzero: lda RB ldhx #ramfree+$27 ;last of the 40 sta 0,x ;put it at then end of the 40 bytes (new value), all others were shifted left clr weath lda RB beq donew ;$00 if ”empty” cmp #$80 bne notfull mov #$01,weath ;set ”full” if $80 bra donew notfull mov #$02,weath ;prepare for ”steady” if L(i)=L(i–1) lda OA cmp Lgfx beq donew mov #$03,weath ;”filling” if L(i)>L(i–1) bcc donew mov #$04,weath ;”emptying” otherwise donew: lda OA sub Lgfx sta MA ;rate:=L(i)–L(i–1) mov RA,Lgfx ;update L(i–1) jsr lcdcmdo ;start on 1st character of 1st line lda OA clrh ldx #$64 clr RB div bne over100 lda #$20 ;prepare for a space in case first value is 0 jsr lcdchro bra lnext over100: jsr lcdnibo inc RB lnext: pshh pula clrh ldx #$0A ;divide by 10 div bne nospace tst RB bne nospace lda #$20 jsr lcdchro bra lnexta nospace: jsr lcdnibo ;display tens digit lnexta: pshh pula jsr lcdnibo ;and first decimal lda #’m’ jsr lcdchro lda #’m’ jsr lcdchro ;then the unit jsr lcdcmdo ;position cursor on 1st character 2nd line lda MA lsla ;test sign of rate (in MA) bcc positiv ;if positive, then it’s easy lda MA ;otherwise 1’s complement of MB coma inca sta MA lda #’–’ jsr lcdchro ;display that minus sign Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0057/C0053/C0048 3–406 Motorola Sensor Device Datawww.motorola.com/semiconductors bra goconv positiv: lda #’+’ jsr lcdchro ;display the plus sign (to keep alignment) goconv: lda MA clrh ldx #$64 clr RB div bne over100b lda #$20 ;prepare for a space in case first value is 0 jsr lcdchro bra lnextb over100b: jsr lcdnibo inc RB lnextb: pshh pula clrh ldx #$0A ;divide by 10 div bne nospaceb tst RB bne nospaceb lda #$20 jsr lcdchro bra lnextab nospaceb: jsr lcdnibo ;display tens digit lnextab: pshh pula jsr lcdnibo ;and first decimal lda #’m’ jsr lcdchro lda #’m’ jsr lcdchro ;then the unit lda #’/’ jsr lcdchro lda #’s’ jsr lcdchro lda #$40 ;======== Graphics Update: tough stuff =========== jsr lcdcmdo ;prepare to write 8 bytes into CGRAM starting at @ $40 ldhx #ramfree ;point to 40 pressure readings (this reuses wrflash RAM) mov #$08,DA ;DA will count those 8 CGRAM addresses cg8: lda 0,x sta NC lda 1,x sta NB lda 2,x sta NA lda 3,x sta DC lda 4,x sta DB ;readings 0–4 go into NC,NB,NA,DC,DB and will form 1 LCD special charac- ter mov #$08,RA ;RA will count the 8 bits fill: clr RB ;start with RB=0, this will eventually contain the data for CGRAM rol NC rol RB rol NB rol RB rol NA rol RB rol DC rol RB rol DB rol RB ;rotate left those 5 values and use carry bits to form RB (tough part) lda RB jsr lcdchro ;and put it into CGRAM dec RA ;do this 8 times to cover all 8 bits bne fill incx incx incx incx incx ;now point to next 5 values for next CGRAM address (5 values per charac- ter) Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0057/C0053/C0048 3–407Motorola Sensor Device Data www.motorola.com/semiconductors dec DA ;do this for all 8 CGRAM characters bne cg8 lda weath ;get weather variable and decide which message to display cmp #$04 bne try3210 ldhx #msg02e ;if $04 bra showit try3210: cmp #$03 bne try210 ldhx #msg02d ;if $03 bra showit try210: cmp #$02 bne try10 ldhx #msg02c ;if $02 bra showit try10: cmp #$01 bne try0 ldhx #msg02b ;if $01 bra showit try0: ldhx #msg02a ;otherwise this one showit: jsr lcdstro jsr del1s ;1s between pressure/altitude readings brset 1,porta,contin ;exit only if SEL brset 2,porta,contin ;and ENT pressed together jmp MENU contin: jmp LVLwarm LfNx: sub N1 ;* PX=f(NX,N2,N1) * ldx #$A0 ;x160 mul sta NA stx NB clr NC ;NCNBNA:=(NX–N1)*160 lda N2 sub N1 sta DA clr DB clr DC jsr NdivD ;RBRA:=(NX–N1)*160/(N2–N1) lda RA rts NdivD: clr RA ;RBRA:=NCNBNA/DCDBDA clr RB ;destroys NCNBNA and DCDBDA keepatit: lda RA add #$01 sta RA lda RB adc #$00 sta RB ;increment RB:RA lda NA sub DA sta NA lda NB sbc DB sta NB lda NC sbc DC sta NC ;NC:NB:NA:=NC:NB:NA–DC:DB:DA bcc keepatit ;keep counting how many times until overflow lda RA sub #$01 sta RA lda RB sbc #$00 sta RB ;we counted once too many, so undo that lsr DC ror DB ror DA ;divide DC:DB:DA by 2 lda NA add DA sta NA lda NB Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0057/C0053/C0048 3–408 Motorola Sensor Device Datawww.motorola.com/semiconductors adc DB sta NB lda NC adc DC sta NC ;and add into NC:NB:NA lsla bcs nornd ;if carry=1 then remainder<1/2 of dividend lda RA add #$01 sta RA lda RB adc #$00 sta RB ;otherwise add 1 to result nornd: rts UNITS: lda #$01 ;===UNITS=== : displays A/D value, calib max/min values jsr lcdcmdo ;clear screen UNTwarm: lda #$0C jsr lcdcmdo ;cursor off lda #$80 jsr lcdcmdo ;(pos cursor begining of first line) jsr adcbyta ;get Lref: reference A/D reading bset 4,porta ;SEL LED–ON signals getting reading jsr lcdbyto jsr del1s bclr 4,porta ;SEL LED–OFF signals reading received jsr adcbyta ;get Lref: reference A/D reading tstLfNx: sub N1 ;* PX=f(NX,N2,N1) * cmp #$00 ; IF Nx – N1 > 0 then calculate bgt skipzero lda #’–’ ; Else IF Nx << N1 then display error message to recalibrate jsr lcdbyto lda #’–’ jsr lcdbyto bra skipneg skipzero: ldx #$A0 ;x160 mul sta NA stx NB clr NC ;NCNBNA:=(NX–N1)*160 lda #$90 jsr lcdcmdo ;(pos cursor 2nd half of first line) jsr lcdbyto ; display NA lda #$87 jsr lcdcmdo lda NB jsr lcdbyto ; display NB skipneg: jsr del1s ;1s between pressure/altitude readings brset 1,porta,UNTcon ;exit only if SEL brset 2,porta,UNTcon ;and ENT pressed together jmp MENU UNTcon: jmp UNTwarm MANCALIB: jsr del1s rts TEST: jsr del1s Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0057/C0053/C0048 3–409Motorola Sensor Device Data www.motorola.com/semiconductors rts wrflash: sthx flshadr ;this is the address in the flash sta flshbyt ;and the byte we want to put there FLASH: tsx sthx memSP ;store SP in memSP, so it can be temporarily used as a 2nd index regis- ter ldhx #ramfree+1 ;SP now points to RAM (remember to add 1 to the address!!!, HC08 quirk) txs ;SP changed (careful not to push or call subroutines) ldhx #ersflsh ;H:X points to beginning of flash programming code doall: lda 0,x ;get 1st byte from flash sta 0,sp ;copy it into RAM aix #$0001 ;HX:=HX+1 ais #$0001 ;SP:=SP+1 cphx #lastbyt ;and continue until we reach the last byte bne doall ldhx memSP ;once done, restore the SP txs jsr ramfree ;and run the subroutine from RAM, you cannot write the flash while rts ;running a code in it, so the RAM has to take over for that piece ersflsh: lda #$02 ;textbook way to erase flash sta flcr lda flbpr clra ldhx flshadr sta 0,x bsr delayf lda #$0A sta flcr bsr delayf lda #$08 sta flcr bsr delayf clra sta flcr bsr delayf pgmflsh: lda #$01 ;textbook way to program flash sta flcr lda flbpr clra ldhx flshadr sta 0,x bsr delayf lda #$09 sta flcr bsr delayf lda flshbyt ldhx flshadr sta 0,x bsr delayf lda #$08 sta flcr bsr delayf clra sta flcr bsr delayf rts delayf: ldhx #$0005 mov #$36,tsc ;stop TIM & / 64 sthx tmodh ;count H:X x 20us bclr 5,tsc ;start clock delayfls: brclr 7,tsc,delayfls rts lastbyt: nop ALLINIT: bset 0,config1 ;disable COP mov #$38,ddra ;PTA0=MPAK,PTA1=SEL,PTA2=ENT,PTA3=E,PTA4=RS,PTA5=clk bclr 3,porta ;E=0 bclr 4,porta ;grn=OFF; RS=0 bclr 5,porta ;red=OFF; CLK=0 mov #$30,adiclk ;ADC clock /2 rts WARMUP: bclr 4,porta Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0057/C0053/C0048 3–410 Motorola Sensor Device Datawww.motorola.com/semiconductors bclr 5,porta ;LEDs off lda #$0A ;prepare to do this 10x tenx: jsr del25ms ;delay bclr 4,porta bset 5,porta ;alternate on/off jsr del25ms bset 4,porta bclr 5,porta ;and off/on dbnza tenx ;10 times so the LCD can get ready (slow startup) jsr lcdinit ;now initialize it bclr 4,porta bclr 5,porta ;LEDs off rts bintasc: add #$30 ;add $30 (0–9 offset) cmp #$39 ;is it a number (0–9) ? bls d0to9b ;if so skip add #$07 ;else add $07 = total of $37 (A–F offset) d0to9b: rts del1s: pshh pshx ldhx #$C350 bra delmain del100ms: pshh pshx ldhx #$1388 bra delmain del50ms: pshh pshx ldhx #$09C4 bra delmain del25ms: pshh pshx ldhx #$04E2 bra delmain del5ms: pshh pshx ldhx #$00FA bra delmain del1ms: pshh pshx ldhx #$0032 bra delmain del100us: pshh pshx ldhx #$0005 bra delmain delmain: mov #$36,tsc ;stop TIM & / 64 sthx tmodh ;count H:X x 20us bclr 5,tsc ;start clock delwait: brclr 7,tsc,delwait pulx pulh rts adcbyti: mov #$00,adscr ;ADC set to PTA0 brclr 7,adscr,* ;wait for ADC reading lda adr rts adcbyta; clr CNT ;average 256 readings clr RB clr RA do256a: bsr adcbyti add RA sta RA lda RB adc #$00 sta RB Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0057/C0053/C0048 3–411Motorola Sensor Device Data www.motorola.com/semiconductors dbnz CNT,do256a lsl RA bcc nochga inc RB nochga: lda RB rts lcdinit: lda #$3C bsr lcdcmdo lda #$0C bsr lcdcmdo lda #$06 bsr lcdcmdo lda #$01 bsr lcdcmdo rts lcdcmdo: bsr shiftA bclr 4,porta ;RS=0 for command bset 3,porta bclr 3,porta ;toggle E bsr del5ms rts lcdchro: bsr shiftA bset 4,porta ;RS=1 for data bset 3,porta bclr 3,porta ;toggle E bsr del100us rts shiftA: psha mov #$08,BB all8: lsla bcc shift0 shift1: bset 4,porta bra shift shift0: bclr 4,porta shift: bclr 5,porta bset 5,porta bclr 5,porta ;toggle CLK dbnz BB,all8 pula rts lcdnibo: psha jsr bintasc ;convert binary to asc bsr lcdchro pula rts lcdbyto: psha psha lsra lsra lsra lsra bsr lcdnibo ;high nibble pula and #$0F bsr lcdnibo ;low nibble pula rts lcdstro: psha lda 0,x lcon: cmp #$80 bhs iscmd cmp #$1F bls iscmd isdta: bsr lcdchro ;output it to LCD reuse1: aix #$0001 lda 0,x ;indexed by y cmp #$40 ;continue until bne lcon ;character = ’@’ Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0065/C0078/C0049/C0057/C0053/C0048 3–412 Motorola Sensor Device Datawww.motorola.com/semiconductors pula bclr 4,porta bclr 5,porta rts iscmd: bsr lcdcmdo bra reuse1 msg01 db $01,$80,’*NITRON & MPAK* ’ db $C0,’Reference Design’,’@’ msg01a db $01,$80,’Water Level & ’ db $C0,’Flow v2.0’,’@’ msg01b db $01,$80,’1:Level/Flow ’ db $C0,’2:A/D sys demo’,’@’ msg01c db $01,$80,’1:Level/Flow ’ db $C0,’2:A/D sys demo’,’@’ msg05 db $01,$80,’* Calibration! *’ db $C0,’Curr lo/hi:’,’@’ msg05a db $01,$80,’1st point: 0mm’ db $C0,’SEL:cal ENT:quit’,’@’ msg05b db $01,$80,’Calibrating... ’ db $C0,’ 0mm: ’,’@’ msg05c db $01,$80,’2nd point: 160mm’ db $C0,’ENT:continue ’,’@’ msg05d db $01,$80,’Calibrating... ’ msg05e db $01,$80,’INVALID ’ db $C0,’CALIBRATION! ’,’@’ msg02a db $C8,’ EMPTY’,’@’ msg02b db $C8,’ FULL’,’@’ msg02c db $C8,’ steady’,’@’ msg02d db $C8,’ filling’,’@’ msg02e db $C8,’emptying’,’@’ menupos db $80,$C0 end References 1) Baum, Jeff, “Frequency Output Conversion for MPX2000 Series Pressure Sensors,” Motorola Application Note AN1316/D. 2) Hamelain, JC, “Liquid Level Control Using a Motorola Pressure Sensor,” Motorola Application Note AN1516/D. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

and type of sensing element (absolute or differential).

Vout : Sensor output voltage
P: Applied pressure in kPa
Vs: Sensor supply voltage in V
K1: Sensitivity constant in V/V/kPa
K2: Offset Constant inV/V
PE: Pressure error in kPa
TM: Temperature multiplier The constants, K1, K2, PE & TM are specific to each device, temperature and pressure encountered in the application. The variables P and Vs are dependent on the user application but must remain within the operating specification of the device. THE MPXV6115VC6U INTEGRATED PRESSURE SENSOR The Motorola MPXV6115VC6U gauge vacuum sensor, designed to measure pressure below the atmospheric pressure, is suitable for automotive application such as vacuum pump or brake booster monitoring. The MXPV4115V is also ideal for non–automotive applications where vacuum control is required. The MPXV6115VC6U has the following basic characteristics (Note: Detailed characteristics of Motorola’s pressure sensors can be found on http://www.motorola.com/semiconductors). MPXV6115VC6U CHARACTERISTICS V out/C0043V S /C0032(P/C00320.007652/C00410.92) /C0034(PE /C0032TM /C0032V S /C00320.007652)

Figure 6. MPXV6115VC6U Transfer Function

P is the applied vacuum to the sensor pressure port. Pressures below atmospheric pressure have a negative sign. For example, 50 kPa below atmospheric is P = –50 in the transfer function. For pressure higher than the atmospheric pressure, the device will electrically satu- rate. The sensor is designed to measure vacuum from 0 kPa (Atmospheric pressure applied to the sensor pres- sure port) down to – 115kPa. Since the MPXV6115VC6U is using the atmospheric pressure as reference, –115 kPa can only be reached if the atmospheric pressure is higher or equal than 115 kPa. The device will electrically saturate for vacuum below –115 kPa.
PE = 1.725 kPa (1.5% of full scale span) over the entire pressure range
TM = 1 between 0 and +85/C0095C, 3 at –40/C0095C and +125/C0095C. TM is a linear response from –40/C0095 to 0/C0095C and from 85/C0095 to 125/C0095C. The real intent for the pressure–sensor user is to know the measured pressure. In this case it is preferable to express the transfer function as: P /C0043(Vout/C0324V S /C00420.92) 0.007652/C0034(PE /C0032TM) As an example, if Vout = 2.30 V for a 5 Vdc power supply and at 25/C0095C ambient temperature, the measured vacuum is P = –60.1 kPa /C0034 1.725 kPa. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

media compatible for the same reasons. Figure 7. Mounting Suggestion fit, or by a screws as shown. other circuitry all on one chip. Freescale Semiconductor, Inc.

applications present design–in challenges for these sensors. features to note about the circuitry. possible), this configuration results in a gain of G1= R4/R3+1. Figure 1. Low Pressure Evaluation Board Freescale Semiconductor, Inc.

/C0065/C0078/C0052/C0048/C0049/C0048 3–421Motorola Sensor Device Data www.motorola.com/semiconductors For example, if the evaluation board is being used under the following conditions: Vs = 3V G1 = 101 G2 = 6 MPX2010 zero pressure offset = 0.3mV At this supply voltage, VOFFSET can be calculated to be 6.7% x 3V = 0.2V. The voltage V, due simply to the zero pressure sensor offset voltage of 0.3mV, can be calculated from equation (1): V1 = 0.3mV * 101 + 0.2V = 0.23V The voltage after the second gain stage comes from equation (2), V2 = 6 x 0.23V = 1.38 V. Therefore, before any pressure is applied to the sensor, a 1.38V DC signal will appear at V. Since the supply voltage is 3V, the available signal for actual pressure is 1.62 V. With a total gain of G1 x G2 = 606, the largest raw pressure signal that can be accurately measured would be 1.62V/606 = 2.67 mV. For the MPX2010 family operating at Vs = 3V, this corresponds to roughly 3.5 kPa. The board lends itself well to system integration via an A/D converter and microprocessor. For particular applications, general knowledge of the expected pressure signal can aid in choosing the proper customized gain. This will avoid op-amp saturation and will also ensure that the full-scale output signal is suitable for A/D conversion. To take another example, suppose that a particular application has the following constraints: Supply Voltage, Vs = 5.0 V, (thus VOFFSET = 6.7% x 5 = 0.335 V) Sensor zero–pressure offset voltage, VZP = 0.3mV Expected Pressure range = 0—2 kPa, (corresponds to /C0068VSENSOR-MAX = 2.5mV @ 5V) Desired maximum output range, /C0068V2MAX = 2V (assume VMIN = 2V, V2MAX = 4V for reasonable A/D resolution) By manipulating equations (1) and (2) it can be shown that, /C0068V2MAX = GT x /C0068VSENSOR–MAX where GT is the total gain, equal to G1G2. Thus GT = 2V/2.5mV = 800 To find G1 and G2, evaluate V2MIN at the zero pressure condition. V2MIN = G2 V1MIN , But V1MIN = G1 VZP + VOFFSET Thus V2MIN = GT VZP + G2 VOFFSET Solving for G2, G2 = (V2MIN – GT VZP )/ VOFFSET numerically, G2 = (2V — (800x.0003V))/.335V G2 = 5.2, and G1 = GT /G2 = 152 BOARD LAYOUT & CONTENT The low-pressure evaluation board has been designed using standard components. The only item that requires careful selection is the operation amplifier IC. Because the selected gain may be relatively high as in the previous example, it is essential that this device have a low offset voltage. A device with a typical voltage offset of 35 mV has been selected. Even with a gain of 1500, this will result in a 52mV offset. Table 3 is a parts list for the board layout shown in Figure1. Table 3. Parts List ÁÁÁ Á Á Á ÁÁÁ Value ÁÁÁ Á Á Á ÁÁÁ Vendor ÁÁÁÁ Á ÁÁ Á ÁÁÁÁ Part No. ÁÁÁ ÁÁÁ ÁÁ ÁÁ ÁÁÁÁÁÁ ÁÁÁÁÁÁ Pressure Sensor ÁÁÁ ÁÁÁ

10 Kpa

ÁÁÁ ÁÁÁ Motorola ÁÁÁÁ ÁÁÁÁ MPX2010 MPXC2011 ÁÁÁ Á Á Á ÁÁÁ ÁÁ ÁÁ ÁÁ ÁÁÁÁÁÁ Á ÁÁÁÁ Á ÁÁÁÁÁÁ Vcc Cap ÁÁÁ Á Á Á ÁÁÁ 1 uF ÁÁÁ Á Á Á ÁÁÁ Generic ÁÁÁÁ Á ÁÁ Á ÁÁÁÁ ÁÁÁ ÁÁÁ ÁÁ ÁÁ ÁÁÁÁÁÁ ÁÁÁÁÁÁ Op-Amp Cap ÁÁÁ ÁÁÁ 0.1 uF ÁÁÁ ÁÁÁ Generic ÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁ ÁÁ ÁÁ ÁÁÁÁÁÁ ÁÁÁÁÁÁ 2nd stage cap ÁÁÁ ÁÁÁ 4700 pF ÁÁÁ ÁÁÁ Generic ÁÁÁÁ ÁÁÁÁ ÁÁÁ Á Á Á ÁÁÁ ÁÁ ÁÁ ÁÁ ÁÁÁÁÁÁ Á ÁÁÁÁ Á ÁÁÁÁÁÁ LED ÁÁÁ Á Á Á ÁÁÁ ÁÁÁ Á Á Á ÁÁÁ Generic ÁÁÁÁ Á ÁÁ Á ÁÁÁÁ ÁÁÁ ÁÁÁ for U1 ÁÁ ÁÁ ÁÁÁÁÁÁ ÁÁÁÁÁÁ Op-Amp socket ÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁ Generic ÁÁÁÁ ÁÁÁÁ ÁÁÁ Á Á Á ÁÁÁ ÁÁ ÁÁ ÁÁ ÁÁÁÁÁÁ Á ÁÁÁÁ Á ÁÁÁÁÁÁ Op-Amp ÁÁÁ Á Á Á ÁÁÁ ÁÁÁ Á Á Á ÁÁÁ Analog Devices ÁÁÁÁ Á ÁÁ Á ÁÁÁÁ OP496GP ÁÁÁ ÁÁÁ R1, R4 ÁÁ ÁÁ ÁÁÁÁÁÁ ÁÁÁÁÁÁ 1/4 W Resistor ÁÁÁ ÁÁÁ 100K ÁÁÁ ÁÁÁ Generic ÁÁÁÁ ÁÁÁÁ ÁÁÁ Á Á Á ÁÁÁ R2,R3, R5,R6 ÁÁ ÁÁ ÁÁ ÁÁÁÁÁÁ Á ÁÁÁÁ Á ÁÁÁÁÁÁ 1/4 W Resistor ÁÁÁ Á Á Á ÁÁÁ ÁÁÁ Á Á Á ÁÁÁ Generic ÁÁÁÁ Á ÁÁ Á ÁÁÁÁ ÁÁÁ ÁÁÁ ÁÁ ÁÁ ÁÁÁÁÁÁ ÁÁÁÁÁÁ 1/4 W Resistor ÁÁÁ ÁÁÁ 6.8K ÁÁÁ ÁÁÁ Generic ÁÁÁÁ ÁÁÁÁ ÁÁÁ Á Á Á ÁÁ ÁÁ ÁÁÁÁÁÁ Á ÁÁÁÁ Á 1/4 W Resistor ÁÁÁ Á Á Á 510 ÁÁÁ Á Á Á Generic ÁÁÁÁ Á ÁÁ ÁÁÁÁ Á Á Á ÁÁÁ ÁÁ ÁÁ ÁÁ ÁÁÁÁÁÁ Á ÁÁÁÁ Á ÁÁÁÁÁÁ Potentiometer ÁÁÁ Á Á Á ÁÁÁ ÁÁÁ Á Á Á ÁÁÁ Bourns ÁÁÁÁ Á ÁÁ Á ÁÁÁÁ 3386P–102 ÁÁÁ ÁÁÁ R10 ÁÁ ÁÁ ÁÁÁÁÁÁ ÁÁÁÁÁÁ 1/4 W Resistor ÁÁÁ ÁÁÁ 51K ÁÁÁ ÁÁÁ Generic ÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁ R11 ÁÁ ÁÁ ÁÁÁÁÁÁ ÁÁÁÁÁÁ 1/4 W Resistor ÁÁÁ ÁÁÁ custom ÁÁÁ ÁÁÁ Generic ÁÁÁÁ ÁÁÁÁ ÁÁÁ Á Á Á ÁÁÁ R12 ÁÁ ÁÁ ÁÁ ÁÁÁÁÁÁ Á ÁÁÁÁ Á ÁÁÁÁÁÁ 1/4 W Resistor ÁÁÁ Á Á Á ÁÁÁ ÁÁÁ Á Á Á ÁÁÁ Generic ÁÁÁÁ Á ÁÁ Á ÁÁÁÁ ÁÁÁ ÁÁÁ R41 ÁÁ ÁÁ ÁÁÁÁÁÁ ÁÁÁÁÁÁ 1/4 W Resistor ÁÁÁ ÁÁÁ custom ÁÁÁ ÁÁÁ Generic ÁÁÁÁ ÁÁÁÁ ÁÁÁ ÁÁÁ R51 ÁÁ ÁÁ ÁÁÁÁÁÁ ÁÁÁÁÁÁ 1/4 W Resistor ÁÁÁ ÁÁÁ custom ÁÁÁ ÁÁÁ Generic ÁÁÁÁ ÁÁÁÁ ÁÁÁ Á Á Á ÁÁÁ JP1 – JP7 ÁÁ ÁÁ ÁÁ ÁÁÁÁÁÁ Á ÁÁÁÁ Á ÁÁÁÁÁÁ Jumper ÁÁÁ Á Á Á ÁÁÁ ÁÁÁ Á Á Á ÁÁÁ Generic ÁÁÁÁ Á ÁÁ Á ÁÁÁÁ ÁÁÁ ÁÁÁ ÁÁ ÁÁ ÁÁÁÁÁÁ ÁÁÁÁÁÁ

3 Pos Connector

ÁÁÁ ÁÁÁ ÁÁÁ ÁÁÁ Phoenix ÁÁÁÁ ÁÁÁÁ MKDS1 Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

3–423Motorola Sensor Device Data www.motorola.com/semiconductors Package Outline Dimensions CASE 344–15 ISSUE AA STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPLY 4. – OUTPUT STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPLY 4. – OUTPUT CASE 344B–01 ISSUE B SEATING PLANE B N R C J –T– D F U H L PORT #1 POSITIVE PRESSURE PIN 1 –A– –Q– S K G 4 PL –P– SQM0.25 (0.010) T SSM0.13 (0.005) Q ST 12 34 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5, 1982. 2. CONTROLLING DIMENSION: INCH. DIM MIN MAX MIN MAX MILLIMETERSINCHES A 1.145 1.175 29.08 29.85 B 0.685 0.715 17.40 18.16 C 0.305 0.325 7.75 8.26 D 0.016 0.020 0.41 0.51 F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC H 0.182 0.194 4.62 4.93 J 0.014 0.016 0.36 0.41 K 0.695 0.725 17.65 18.42 L 0.290 0.300 7.37 7.62 N 0.420 0.440 10.67 11.18 P 0.153 0.159 3.89 4.04 Q 0.153 0.159 3.89 4.04 R 0.230 0.250 5.84 6.35 S U 0.910 BSC 23.11 BSC 0.220 0.240 5.59 6.10 (P1) MAM0.136 (0.005) T 1234PIN 1 R N L G F D 4 PL SEATING PLANE –T– C M J B –A– DIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.595 0.630 15.11 16.00 B 0.514 0.534 13.06 13.56 C 0.200 0.220 5.08 5.59 D 0.016 0.020 0.41 0.51 F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC J 0.014 0.016 0.36 0.40 L 0.695 0.725 17.65 18.42 M 30 NOM 30 NOM N 0.475 0.495 12.07 12.57 R 0.430 0.450 10.92 11.43 /C0095/C0095 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION –A– IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). DAMBAR TRIM ZONE: F THIS IS INCLUDED WITHIN DIM. “F” 8 PL 1 23 4 Y Z Y 0.048 0.052 1.22 1.32 Z 0.106 0.118 2.68 3.00 Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

3–424 Motorola Sensor Device Datawww.motorola.com/semiconductors PACKAGE OUTLINE DIMENSIONS (continued) STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPLY 4. – OUTPUT PORT #2 PORT #1 PORT #2 VACUUM SEATING PLANE SEATING PLANE K S W H L U F G D PORT #1 POSITIVE PRESSURE –Q– 12 4 3PIN 1 4 PL –P– SSM0.13 (0.005) Q ST B N J C V R NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM MIN MAX MIN MAX MILLIMETERSINCHES A 1.145 1.175 29.08 29.85 B 0.685 0.715 17.40 18.16 C 0.405 0.435 10.29 11.05 D 0.016 0.020 0.41 0.51 F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC H 0.182 0.194 4.62 4.93 J 0.014 0.016 0.36 0.41 K 0.695 0.725 17.65 18.42 L 0.290 0.300 7.37 7.62 N 0.420 0.440 10.67 11.18 P 0.153 0.159 3.89 4.04 Q 0.153 0.159 3.89 4.04 R 0.063 0.083 1.60 2.11 S U 0.910 BSC 23.11 BSC V 0.248 0.278 6.30 7.06 W 0.310 0.330 7.87 8.38 –A– 0.220 0.240 5.59 6.10 (P2) (P1) CASE 344C–01 ISSUE B CASE 344D–01 ISSUE B STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPLY 4. – OUTPUT NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5, 1982. 2. CONTROLLING DIMENSION: INCH. SEATING PLANE B N R C J –T– D F U L HPORT #2 VACUUM POSITIVE PRESSURE PIN 1 –A– –Q– S K G 4 PL –P– SQM0.25 (0.010) T SSM0.13 (0.005) Q ST DIM MIN MAX MIN MAX MILLIMETERSINCHES A 1.145 1.175 29.08 29.85 B 0.685 0.715 17.40 18.16 C 0.305 0.325 7.75 8.26 D 0.016 0.020 0.41 0.51 F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC H 0.182 0.194 4.62 4.93 J 0.014 0.016 0.36 0.41 K 0.695 0.725 17.65 18.42 L 0.290 0.300 7.37 7.62 N 0.420 0.440 10.67 11.18 P 0.153 0.159 3.89 4.04 Q 0.153 0.158 3.89 4.04 R 0.230 0.250 5.84 6.35 S U 0.910 BSC 23.11 BSC 12 34 0.220 0.240 5.59 6.10 (P2) (P1) Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

3–425Motorola Sensor Device Data www.motorola.com/semiconductors PACKAGE OUTLINE DIMENSIONS (continued) STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPLY 4. – OUTPUT S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.690 0.720 17.53 18.28 B 0.245 0.255 6.22 6.48 C 0.780 0.820 19.81 20.82 D 0.016 0.020 0.41 0.51 F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC J 0.014 0.016 0.36 0.41 K 0.345 0.375 8.76 9.53 N 0.300 0.310 7.62 7.87 R 0.178 0.186 4.52 4.72 S V 0.182 0.194 4.62 4.93 BACK SIDE VACUUM PIN 1 4 PL PORT #1 POSITIVE PRESSURE SEATING PLANE 32 1 K A G F D MBM0.13 (0.005) T C N R V J –B– –T– 0.220 0.240 5.59 6.10 (P1) (P2) CASE 344E–01 ISSUE B NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. STYLE 1: PIN 1. GROUND 2. V (+) OUT 3. V SUPPLY 4. V (–) OUT E C J V –T– PORT #1 POSITIVE PRESSURE PIN 1 –P– G K MQM0.25 (0.010) T U A F S N B SPM0.13 (0.005) Q ST DIM MIN MAX MIN MAX MILLIMETERSINCHES A 1.080 1.120 27.43 28.45 B 0.740 0.760 18.80 19.30 C 0.630 0.650 16.00 16.51 D 0.016 0.020 0.41 0.51 E 0.160 0.180 4.06 4.57 F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC J 0.014 0.016 0.36 0.41 K N 0.070 0.080 1.78 2.03 P 0.150 0.160 3.81 4.06 Q 0.150 0.160 3.81 4.06 R 0.440 0.460 11.18 11.68 S 0.695 0.725 17.65 18.42 U 0.840 0.860 21.34 21.84 V 0.182 0.194 4.62 4.92 –Q– R 4321 0.220 0.240 5.59 6.10 (P1) CASE 344F–01 ISSUE B Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

3–426 Motorola Sensor Device Datawww.motorola.com/semiconductors PACKAGE OUTLINE DIMENSIONS (continued) CASE 423A–03 ISSUE C DIM A MIN MAX MIN MAX MILLIMETERS 6.10 6.600.240 0.260 INCHES B 8.89 9.400.350 0.370 C 3.56 3.810.140 0.150 D1 0.30 0.510.012 0.020 E 2.24 2.590.088 0.102 F 3.12 3.250.123 0.128 G 1.14 1.400.045 0.055 H 0.94 1.190.037 0.047 J 0.18 0.280.007 0.011 K 3.05 3.560.120 0.140 L 2.41 2.670.095 0.105 M 4.19 4.450.165 0.175 N 5.66 6.070.223 0.239 V 2.67 2.920.105 0.115 AA 2.41 2.720.095 0.107 AB 0.38 0.890.015 0.035 AC 3.05 4.450.120 0.175 AD 2.54 2.920.100 0.115 STYLE 1: PIN 1. V CC 2. +OUT 3. –OUT 4. GROUND AB AD AA F AC BACK VIEW G V N FRONT VIEW M A 12 4 3 C L B F K H E J –T– END VIEW DETAIL A DETAIL A D2 0.36 0.560.014 0.022 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

3–427Motorola Sensor Device Data www.motorola.com/semiconductors PACKAGE OUTLINE DIMENSIONS (continued) CASE 482–01 ISSUE O DIM MIN MAX MIN MAX MILLIMETERSINCHES A 10.540.4250.415 10.79 B 10.540.4250.415 10.79 C 5.380.2300.212 5.84 D 0.960.0420.038 1.07 G 0.100 BSC 2.54 BSC H 0.002 0.010 0.05 0.25 J 0.009 0.011 0.23 0.28 K 0.061 0.071 1.55 1.80 M 0 7 0 7 N 0.405 0.415 10.29 10.54 S 0.709 0.725 18.01 18.41 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 /C0095 TYPICAL DRAFT. /C0095/C0095/C0095/C0095 S D G 8 PL N SBM0.25 (0.010) A ST –A– –B– C M J K PIN 1 IDENTIFIER H SEATING PLANE –T– CASE 482A–01 ISSUE A DIM MIN MAX MIN MAX MILLIMETERSINCHES A 10.540.4250.415 10.79 B 10.540.4250.415 10.79 C 12.700.5200.500 13.21 D 0.960.0420.038 1.07 G 0.100 BSC 2.54 BSC H 0.002 0.010 0.05 0.25 J 0.009 0.011 0.23 0.28 K 0.061 0.071 1.55 1.80 M 0 7 0 7 N 0.444 0.448 11.28 11.38 S 0.709 0.725 18.01 18.41 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 /C0095 TYPICAL DRAFT. /C0095/C0095/C0095/C0095 S D G 8 PL SBM0.25 (0.010) A ST –A– –B– C M J K PIN 1 IDENTIFIER H SEATING PLANE –T– N V W V 0.245 0.255 6.22 6.48 W 0.115 0.125 2.92 3.17 Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

3–428 Motorola Sensor Device Datawww.motorola.com/semiconductors PACKAGE OUTLINE DIMENSIONS (continued) CASE 482B–03 ISSUE B DIM MIN MAX MIN MAX MILLIMETERSINCHES A 10.540.4250.415 10.79 B 10.540.4250.415 10.79 C 5.330.2200.210 5.59 D 0.660.0340.026 0.864 G 0.100 BSC 2.54 BSC J 0.009 0.011 0.23 0.28 K 0.100 0.120 2.54 3.05 M 0 15 0 15 N 0.405 0.415 10.29 10.54 S 0.540 0.560 13.72 14.22 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 /C0095 TYPICAL DRAFT. 6. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL. /C0095/C0095/C0095/C0095 PIN 1 IDENTIFIER K SEATING PLANE–T– S G –A– –B– C M J N D 8 PL SBM0.25 (0.010) A ST DETAIL X DETAIL X CASE 482C–03 ISSUE B DIM MIN MAX MIN MAX MILLIMETERSINCHES A 10.540.4250.415 10.79 B 10.540.4250.415 10.79 C 12.700.5200.500 13.21 D 0.660.0340.026 0.864 G 0.100 BSC 2.54 BSC J 0.009 0.011 0.23 0.28 K 0.100 0.120 2.54 3.05 M 0 15 0 15 N 0.444 0.448 11.28 11.38 S 0.540 0.560 13.72 14.22 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 /C0095 TYPICAL DRAFT. 6. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL. /C0095/C0095/C0095/C0095PIN 1 K SEATING PLANE–T– S G –A– –B– C N V W M J V 0.245 0.255 6.22 6.48 W 0.115 0.125 2.92 3.17 IDENTIFIER D 8 PL SBM0.25 (0.010) A ST DETAIL X DETAIL X Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

3–429Motorola Sensor Device Data www.motorola.com/semiconductors PACKAGE OUTLINE DIMENSIONS (continued) BASIC ELEMENT (A, D) CASE 867–08 ISSUE N STYLE 1: PIN 1. VOUT 2. GROUND 3. VCC 4. V1 5. V2 6. VEX PIN 1 F G N L R C B M J S –A– 123456

6 PLD

PLANE –T– MAM0.136 (0.005) T DIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.595 0.630 15.11 16.00 B 0.514 0.534 13.06 13.56 C 0.200 0.220 5.08 5.59 D 0.027 0.033 0.68 0.84 F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC J 0.014 0.016 0.36 0.40 L 0.695 0.725 17.65 18.42 M 30 NOM 30 NOM N 0.475 0.495 12.07 12.57 R 0.430 0.450 10.92 11.43 S 0.090 0.105 2.29 2.66 /C0095/C0095 POSITIVE PRESSURE (P1) NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION –A– IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). PRESSURE SIDE PORTED (AP, GP) CASE 867B–04 ISSUE F STYLE 1: PIN 1. V OUT2. GROUND 3. V CC4. V1 5. V2 6. V EX SEATING PLANE R N C J PIN 1 MQM0.25 T B 6X DG F S K V SPM0.173 Q ST L U A 2 34 5 NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. DIM MIN MAX MILLIMETERS A 29.08 29.85 B 17.4 18.16 C 7.75 8.26 D 0.68 0.84 F 1.22 1.63 G 2.54 BSC J 0.36 0.41 K 17.65 18.42 L 7.37 7.62 N 10.67 11.18 P 3.89 4.04 Q 3.89 4.04 R 5.84 6.35 S 5.59 6.1 U 23.11 BSC V 4.62 4.93 T P P Q Q Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

3–430 Motorola Sensor Device Datawww.motorola.com/semiconductors PACKAGE OUTLINE DIMENSIONS (continued) PRESSURE AND VACUUM SIDES PORTED (DP) CASE 867C–05 ISSUE F NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. STYLE 1: PIN 1. V OUT2. GROUND 3. V CC4. V1 5. V2 6. V EX R X 123 45 6 DIM MIN MAX MIN MAX MILLIMETERSINCHES A 1.145 1.175 29.08 29.85 B 0.685 0.715 17.40 18.16 C 0.405 0.435 10.29 11.05 D 0.027 0.033 0.68 0.84 F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC J 0.014 0.016 0.36 0.41 K 0.695 0.725 17.65 18.42 L 0.290 0.300 7.37 7.62 N 0.420 0.440 10.67 11.18 P 0.153 0.159 3.89 4.04 Q 0.153 0.159 3.89 4.04 R 0.063 0.083 1.60 2.11 S U 0.910 BSC 23.11 BSC V 0.182 0.194 4.62 4.93 W 0.310 0.330 7.87 8.38 X 0.248 0.278 6.30 7.06 PORT #2 VACUUM (P2) PORT #1 POSITIVE PORT #1 PIN 1 PORT #2 POSITIVE VACUUM PRESSURE SEATING PLANE SEATING PLANE –T– –T– P G C J N B F D W V L U 6 PL S K –Q– –A–MQM0.25 (0.010) T MAM0.13 (0.005) PRESSURE (P1) 0.220 0.240 5.59 6.10 (P1) (P2) PRESSURE SIDE PORTED (AS, GS) CASE 867E–03 ISSUE D NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. STYLE 1: PIN 1. V OUT2. GROUND 3. V CC4. V1 5. V2 6. V EX A 654321 C K N E –B– PORT #1 POSITIVE PRESSURE J –T– S G F D 6 PL PIN 1 MBM0.13 (0.005) T DIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.690 17.53 18.28 B 0.245 0.255 6.22 6.48 C 0.780 0.820 19.81 20.82 D 0.027 0.033 0.69 0.84 E 0.178 0.186 4.52 4.72 F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC J 0.014 0.016 0.36 0.41 K 0.345 0.375 8.76 9.53 N 0.300 0.310 7.62 7.87 S 0.220 0.240 5.59 6.10 0.720 V V 0.182 0.194 4.62 4.93 (P1) Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

3–431Motorola Sensor Device Data www.motorola.com/semiconductors PACKAGE OUTLINE DIMENSIONS (continued) PRESSURE SIDE PORTED (ASX, GSX) CASE 867F–03 ISSUE D STYLE 1: PIN 1. V OUT2. GROUND 3. V CC4. V1 5. V2 6. V EX NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. C E V J PORT #1 POSITIVE PRESSURE –T– –P– MQM0.25 (0.010) T D F G 6 PL K S PIN 1 U A R B –Q– N SPM0.13 (0.005) Q ST 65 4 3 2 1 DIM MIN MAX MIN MAX MILLIMETERSINCHES A 1.080 1.120 27.43 28.45 B 0.740 0.760 18.80 19.30 C 0.630 0.650 16.00 16.51 D 0.027 0.033 0.68 0.84 E 0.160 0.180 4.06 4.57 F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC J 0.014 0.016 0.36 0.41 K N 0.070 0.080 1.78 2.03 P 0.150 0.160 3.81 4.06 Q 0.150 0.160 3.81 4.06 R 0.440 0.460 11.18 11.68 S 0.695 0.725 17.65 18.42 U 0.840 0.860 21.34 21.84 V 0.182 0.194 4.62 4.93 0.220 0.240 5.59 6.10 (P1) Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

3–432 Motorola Sensor Device Datawww.motorola.com/semiconductors PACKAGE OUTLINE DIMENSIONS (continued) CASE 1317–03 ISSUE B 0.025 0.298 0.050 AM0.004 B C 0.165 0.280 A B C NOTES: 1. ALL DIMENSIONS ARE IN INCHES. 2. DIMENSIONING AND TOLERANCING PER ASME Y14.5M–1994. 3. DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006 INCHES PER SIDE. 4. ALL VERTICAL SURFACES TO BE 5° MAXIMUM. 5. DIMENSION DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE .008 INCHES MAXIMUM. 0.004 A0.006 BC GAGE PLANE DETAIL E 0.023 0.010 .010 8X 0.014 DETAIL E SEATING PLANE 0.019 0.300 0.280 0.300 0.400 0.420 0.278 0.145 0.002 0.013 °10 Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

3–433Motorola Sensor Device Data www.motorola.com/semiconductors PACKAGE OUTLINE DIMENSIONS (continued) CASE 1317A–01 ISSUE A 0.025 0.130 0.050 AM0.004 B C 0.390 0.325A B C NOTES: 1. ALL DIMENSIONS ARE IN INCHES. 2. DIMENSIONING AND TOLERANCING PER ASME Y14.5M–1994. 3. DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006 INCHES PER SIDE. 4. ALL VERTICAL SURFACES TO BE 5° MAXIMUM. 5. DIMENSION DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE .008 INCHES MAXIMUM. 0.004 A0.006 BC GAGE PLANE DETAIL E 0.048 0.010 .014 8X 0.014 DETAIL E SEATING PLANE 0.018 0.345 0.325 0.345 0.400 0.420 0.110 0.370 0.002 0.038 °10 0.200 0.180 0.280 A B 0.300 0.280 0.300 BOTTOM VIEW Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

3–434 Motorola Sensor Device Datawww.motorola.com/semiconductors PACKAGE OUTLINE DIMENSIONS (continued) CASE 1320–02 ISSUE A DIM MIN MAX INCHES A .155 .165 A1 .002 .010 b .014 .018 b1 .120 .130 D .245 .255 E .475 .485 e e/2 L .038 .048 E1 .325 .335 0 7 .025 BSC .050 BSC θ °° NOTES: 1. DIMENSIONS ARE IN INCHES. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M–1994. 3. DIMENSIONS ”D” AND ”E1” DO NOT INCLUDE MOLD FLASH OR PROTRUSION. MOLD FLASH OR PROTRUSION SHALL NOT EXCEED .006” PER SIDE. 4. ALL VERTICAL SURFACES TO BE 5° MAXIMUM. 5. DIMENSIONS ”b” DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE .008 MAXIMUM. E e/2 e AM0.004 B C A0.006 BC 4X b AM0.004 B C A C 0.004 DETAIL E SEATING PLANE GAGE PLANE DETAIL E L A1 θ .014 B DA PIN 1 PIN 4 STYLE 1: PIN 1. GND 2. +Vout 3. Vs 4. –Vout Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

3–435Motorola Sensor Device Data www.motorola.com/semiconductors PACKAGE OUTLINE DIMENSIONS (continued) CASE 1320A–02 ISSUE O DIM MIN MAX INCHES A .377 .397 A1 .002 .010 b .014 .018 b1 .120 .130 D .245 .255 E .475 .485 e e/2 L .013 .023 E1 .325 .335 0 7 .025 BSC .050 BSC θ °° NOTES: 1. DIMENSIONS ARE IN INCHES. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M–1994. 3. DIMENSIONS ”D” AND ”E1” DO NOT INCLUDE MOLD FLASH OR PROTRUSION. MOLD FLASH OR PROTRUSION SHALL NOT EXCEED .006” PER SIDE. 4. ALL VERTICAL SURFACES TO BE 5° MAXIMUM. 5. DIMENSIONS ”b” DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE .008 MAXIMUM. E e/2 e AM0.004 B C A0.006 BC 4X b AM0.004 B C A C 0.004 DETAIL E SEATING PLANE GAGE PLANE DETAIL E L A1 θ .014 B DA M .283 .293 N .363 .373 P .107 .117 S .192 .202 N S P Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

3–436 Motorola Sensor Device Datawww.motorola.com/semiconductors PACKAGE OUTLINE DIMENSIONS (continued) CASE 1351–01 ISSUE O D E e/2 N e AM0.004 (0.1) B C A A B C 0.004 (0.1) A0.006 (0.15) BC 8X b

2 PLACES 4 TIPS

P NOTES: 1. CONTROLLING DIMENSION: INCH. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M–1994. 3. DIMENSIONS ”D” AND ”E1” DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152) PER SIDE. 4. DIMENSION ”b” DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM. DIM A MIN MAX MIN MAX MILLIMETERS 0.370 0.390 9.39 9.91 INCHES A1 0.002 0.010 0.05 0.25 b 0.038 0.042 0.96 1.07 D 0.465 0.485 11.81 12.32 E 0.680 0.700 17.27 17.78 E1 0.465 0.485 11.81 12.32 e M 0.270 0.290 6.86 7.37 N 0.160 0.180 4.06 4.57 P 0.009 0.011 0.23 0.28 T 0.110 0.130 2.79 3.30 0.100 BSC 2.54 BSC F 0.240 0.260 6.10 6.60 K 0.115 0.135 2.92 3.43 L 0.040 0.060 1.02 1.52 F K M GAGE DETAIL G L A1 θ.014 (0.35) PLANE 0 7 0 7 °°°°θ STYLE 1: PIN 1. GND 2. +Vout 3. Vs 4. –Vout 5. N/C 6. N/C 7. N/C 8. N/C STYLE 2: PIN 1. N/C 2. Vs 3. GND 4. Vout 5. N/C 6. N/C 7. N/C 8. N/C Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

3–437Motorola Sensor Device Data www.motorola.com/semiconductors PACKAGE OUTLINE DIMENSIONS (continued) CASE 1368–01 ISSUE O D E e/2 N e AM0.004 (0.1) B C A A B C 0.004 (0.1) A0.006 (0.15) BC 8X b P NOTES: 1. CONTROLLING DIMENSION: INCH. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M–1994. 3. DIMENSIONS ”D” AND ”E1” DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152) PER SIDE. 4. DIMENSION ”b” DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM. DIM A MIN MAX MIN MAX MILLIMETERS 0.280 0.300 7.11 7.62 INCHES A1 0.002 0.010 0.05 0.25 b 0.038 0.042 0.96 1.07 D 0.465 0.485 11.81 12.32 E E1 0.465 0.485 11.81 12.32 e M 0.035 0.055 1.90 2.41 N 0.075 0.095 0.89 1.39 P 0.009 0.011 0.23 0.28 R 0.405 0.415 10.28 10.54 0.100 BSC 2.54 BSC F 0.240 0.260 6.10 6.60 K 0.115 0.135 2.92 3.43 L 0.040 0.060 1.02 1.52 F K M GAGE DETAIL G L A1 θ.014 (0.35) PLANE 0 7 0 7 °°°°θ STYLE 1: PIN 1. GND 2. +Vout 3. Vs 4. –Vout 5. N/C 6. N/C 7. N/C 8. N/C STYLE 2: PIN 1. N/C 2. Vs 3. GND 4. Vout 5. N/C 6. N/C 7. N/C 8. N/C T 0.110 0.130 2.79 3.30 0.690 BSC 17.52 BSC Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

3–438 Motorola Sensor Device Datawww.motorola.com/semiconductors PACKAGE OUTLINE DIMENSIONS (continued) CASE 1369–01 ISSUE O D E e/2 N e AM0.004 (0.1) B C A A B C 0.004 (0.1) A0.008 (0.20) BC 8X b P NOTES: 1. CONTROLLING DIMENSION: INCH. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M–1994. 3. DIMENSIONS ”D” AND ”E1” DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152) PER SIDE. 4. DIMENSION ”b” DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.008 (0.203) MAXIMUM. DIM A MIN MAX MIN MAX MILLIMETERS 0.300 0.330 7.11 7.62 INCHES A1 0.002 0.010 0.05 0.25 b 0.038 0.042 0.96 1.07 D 0.465 0.485 11.81 12.32 E E1 0.465 0.485 11.81 12.32 e M 0.270 0.290 6.86 7.36 N 0.080 0.090 2.03 2.28 P 0.009 0.011 0.23 0.28 T 0.115 0.125 2.92 3.17 0.100 BSC 2.54 BSC F 0.245 0.255 6.22 6.47 K 0.120 0.130 3.05 3.30 L 0.061 0.071 1.55 1.80 F K M GAGE DETAIL G L A1 θ.014 (0.35) PLANE 0 7 0 7 °°°°θ 0.717 BSC 18.21 BSC Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

3–439Motorola Sensor Device Data www.motorola.com/semiconductors Reference Tables FLOW EQUIVALENTS 0.0166 0.4719 28.316 471.947 28317 0.1247 7.481 Cu. Ft./Min LPM LPH CC/Min. CC/Hr. Gal/Min. Gal/Hr. 28.316 1699 28317 1,699,011 7.481 448.831 Cu. Ft./Min LPM LPH CC/Min. CC/Hr. Gal/Min. Gal/Hr. 0.000035 0.0021 0.001 0.06 0.00026 0.0159 CC/Hr. Cu. Ft./Min Cu. Ft./Hr. LPM LPH Gal/Min. Gal/Hr. 0.0167 0.0000005 0.00003 0.000017 0.001 0.000004 0.00026 CC/Min. Cu. Ft./Min. Cu. Ft./Hr. LPM LPH Gal/Min. Gal/Hr. 1 LPM 1 LPH 1 Gal/Min. 1 Gal/Hr. LPH Cu. Ft./Min. Cu. Ft./Hr. CC/Min. CC/Hr. Gal/Min. Gal/Hr. 0.035 2.1189 1000 60,002 0.264 15.851 0.0166 0.00059 0.035 16.667 1000 0.004 0.264 LPM Cu. Ft./Min. Cu. Ft./Hr. CC/Min. CC/Hr. Gal/Min. Gal/Hr. 0.1337 8.021 3.785 227.118 3,785.412 227,125 Gal/Hr. Cu. Ft./Min. Cu. Ft./Hr. LPM LPH CC/Min. CC/Hr. 0.0167 0.002 0.1337 0.063 3.785 63.069 3785 Gal/Min. Cu. Ft./Min. Cu. Ft./Hr. LPM LPH CC/Min. CC/Hr. Airspeed Knots Inches of Mercury Knots Inches of Mercury 860 880 100 110 120 130 140 150 175 200 225 250 275 300 325 350 375 0.1727 0.3075 0.4814 0.5832 0.6950 0.8168 0.9488 1.0910 1.4918 1.9589 2.4943 3.1002 3.7792 4.5343 5.3687 6.2859 7.2900 8,400 8,425 8,450 8,475 8,500 8,525 8,550 8,575 8,600 8,650 8,700 8,750 8,800 8,850 8,900 1,000 88.3850 89.5758 10.8675 12.2654 13.7756 15.4045 17.1590 19.0465 21.0749 25.5893 30.7642 36.5662 42.9378 49.8423 57.2554 73.5454 Altitude (Feet) Equivalent Pressure (inches of Mercury) Altitude (Feet) Equivalent Pressure (inches of Mercury) –1,000 –900 500 1,000 1,500 2,000 3,000 4,000 6,000 8,000 10,000 12,000 31.0185 30.9073 29.9213 29.3846 28.8557 28.3345 27.8210 26.8167 25.8418 23.9782 22.2250 20.5770 19.0294 14,000 16,000 18,000 20,000 22,000 25,000 30,000 35,000 40,000 45,000 49,900 50,000 17.5774 16.2164 14.9421 13.7501 12.6363 11.1035 8.88544 7.04062 5.53802 4.35488 3.44112 3.42466 (EST) Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

3–440 Motorola Sensor Device Datawww.motorola.com/semiconductors Reference Tables (continued) Conversion Table for Common Units of Pressure kiloPascals mm Hg millibars inches H2O PSI Quick Conversion Chart for Common Units of Pressure kiloPascals inches H2O millibars mm Hg PSI 0 20 40 60 80 100 120 140 160 180 200 0 100 200 300 400 500 600 700 800 0 200 400 600 800 1000 1200 1400 1600 1800 2000 0 200 400 600 800 1000 1200 1400 1600 0 5 10 15 20 25 30 Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

O-ring to sensor cell interface dimensions. performed to ensure the integrity of the cell to port bond. thoroughly dried after this test. accept an appropriate connector if installed on a baseplate. unless they are specifically designed for that purpose. ies including Janesville Tool & Manufacturing (608-868-4925).

4 Pin Housing: SMP-04V-BC

6 Pin Housing: SMP-06V-BC

The crimp tool part number is: YC12. Figure 3. Leadforming represents surfaces to be clamped. Freescale Semiconductor, Inc.

3–442 Motorola Sensor Device Datawww.motorola.com/semiconductors Standard Warranty Clause Seller warrants that its products sold hereunder will at the time of shipment be free from defects in material and workmanship, and will conform to Seller’s approved specifications. If products are not as warranted, Seller shall, at its option and as Buyer’s exclusive remedy, either refund the purchase price, or repair, or replace the product, provided proof of purchase and written notice of nonconformance are received within the applicable periods noted below and provided said nonconforming products are, with Seller’s written authorization, returned in protected shipping containers FOB Seller’s plant within thirty (30) days after expiration of the warranty period unless otherwise specified herein. If product does not conform to this warranty, Seller will pay for the reasonable cost of transporting the goods to and from Seller’s plant. This warranty shall not apply to any products Seller determines have been, by Buyer or otherwise, subjected to improper testing, or have been the subject of mishandling or misuse. THIS WARRANTY EXTENDS TO BUYER ONLY AND MAY BE INVOKED BY BUYER ONLY FOR ITS CUSTOMERS. SELLER WILL NOT ACCEPT WARRANTY RETURNS DIRECTLY FROM BUYER’S CUSTOMERS OR USERS OF BUYER’S PRODUCTS. THIS WARRANTY IS IN LIEU OF ALL OTHER WARRANTIES WHETHER EXPRESS, IMPLIED OR STATUTORY INCLUDING IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. Seller’s warranty shall not be enlarged, and no obligation or liability shall arise out of Seller’s rendering of technical advice and/or assistance. A. Time periods, products, exceptions and other restrictions applicable to the above warranty are: (1) Unless otherwise stated herein, products are warranted for a period of one (1) year from date of shipment. (2) Device Chips/Wafers. Seller warrants that device chips or wafers have, at shipment, been subjected to electrical test/probe and visual inspection. Warranty shall apply to products returned to Seller within ninety (90) days from date of shipment. This warranty shall not apply to any chips or wafers improperly removed from their original shipping container and/or subjected to testing or operational procedures not approved by Seller in writing. B. Development products and Licensed Programs are licensed on an “AS IS” basis. IN NO EVENT SHALL SELLER BE LIABLE FOR ANY INCIDENTAL OR CONSEQUENTIAL DAMAGES. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

3–443Motorola Sensor Device Data www.motorola.com/semiconductors Glossary of Terms Absolute Pressure Sensor A sensor which measures input pressure in relation to a zero pressure (a total vacuum on one side of the diaphragm) reference. Analog Output An electrical output from a sensor that changes proportionately with any change in input pressure. Accuracy — also see Pressure Error A comparison of the actual output signal of a device to the true value of the input pressure. The various errors (such as linearity, hysteresis, repeatability and temperature shift) attributing to the accuracy of a device are usually expressed as a percent of full scale output (FSO). Altimetric Pressure Transducer A barometric pressure transducer used to determine altitude from the pressure-altitude profile. Barometric Pressure Transducer An absolute pressure sensor that measures the local ambient atmospheric pressure. Burst Pressure The maximum pressure that can be applied to a transducer without rupture of either the sensing ele- ment or transducer case. Calibration A process of modifying sensor output to improve output accuracy. Chip A die (unpackaged semiconductor device) cut from a silicon wafer, incorporating semiconductor cir- cuit elements such as resistors, diodes, transistors, and/or capacitors. Compensation Added circuitry or materials designed to counteract known sources of error. Diaphragm The membrane of material that remains after etching a cavity into the silicon sensing chip. Changes in input pressure cause the diaphragm to deflect. Differential Pressure Sensor A sensor which is designed to accept simultaneously two independent pressure sources. The output is proportional to the pressure difference between the two sources. Diffusion A thermochemical process whereby controlled impurities are introduced into the silicon to define the piezoresistor. Compared to ion implantation, it has two major disadvantages: 1) the maximum impuri- ty concentration occurs at the surface of the silicon rendering it subject to surface contamination, and making it nearly impossible to produce buried piezoresistors; 2) control over impurity concentra- tions and levels is about one thousand times poorer than obtained with ion implantation. Drift An undesired change in output over a period of time, with constant input pressure applied. End Point Straight Line Fit Motorola’s method of defining linearity. The maximum deviation of any data point on a sensor output curve from a straight line drawn between the end data points on that output curve. Error The algebraic difference between the indicated value and the true value of the input pressure. Usually expressed in percent of full scale span, sometimes expressed in percent of the sensor output reading. Error Band The band of maximum deviations of the output values from a specified reference line or curve due to those causes attributable to the sensor. Usually expressed as “± % of full scale output.” The error band should be specified as applicable over at least two calibration cycles, so as to include repeatability, and verified accordingly. Excitation Voltage (Current) — see Supply Voltage (Current) The external electrical voltage and/or current applied to a sensor for its proper operation (often referred to as the supply circuit or voltage). Motorola specifies constant voltage operation only. Full Scale Output The output at full scale pressure at a specified supply voltage. This signal is the sum of the offset signal plus the full scale span. Full Scale Span The change in output over the operating pressure range at a specified supply voltage. The SPAN of a device is the output voltage variation given between zero differential pressure and any given pressure. FULL SCALE SPAN is the output variation between zero differential pressure and when the maximum recommended operating pressure is applied. Hysteresis — also see Pressure Hysteresis and Temperature Hysteresis HYSTERESIS refers to a transducer’s ability to reproduce the same output for the same input, regardless of whether the input is increasing or decreasing. PRESSURE HYSTERESIS is measured at a constant temperature while TEMPERATURE HYSTERESIS is measured at a constant pressure in the operating pressure range. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

3–444 Motorola Sensor Device Datawww.motorola.com/semiconductors Glossary of Terms (continued) Input Impedance (Resistance) The impedance (resistance) measured between the positive and negative (ground) input terminals at a specified frequency with the output terminals open. For Motorola X-ducer, this is a resistance measurement only. Ion Implantation A process whereby impurity ions are accelerated to a specific energy level and impinged upon the silicon wafer. The energy level determines the depth to which the impurity ions penetrate the silicon. Impingement time determines the impurity concentration. Thus, it is possible to independently control these parameters, and buried piezoresistors are easily produced. Ion implantation is increasingly used throughout the semiconductor industry to provide a variety of products with improved performance over those produced by diffusion. Laser Trimming (Automated) A method for adjusting the value of thin film resistors using a computer-controlled laser system. Leakage Rate The rate at which a fluid is permitted or determined to leak through a seal. The type of fluid, the differential pressure across the seal, the direction of leakage, and the location of the seal must be specified. Linearity Error The maximum deviation of the output from a straight line relationship with pressure over the operating pressure range, the type of straight line relationship (end point, least square approximation, etc.) should be specified. Load Impedance The impedance presented to the output terminals of a sensor by the associated external circuitry. Null The condition when the pressure on each side of the sensing diaphragm is equal. Null Offset The electrical output present, when the pressure sensor is at null. Null Temperature Shift The change in null output value due to a change in temperature. Null Output See ZERO PRESSURE OFFSET Offset See ZERO PRESSURE OFFSET Operating Pressure Range The range of pressures between minimum and maximum pressures at which the output will meet the specified operating characteristics. Operating Temperature Range The range of temperature between minimum and maximum temperature at which the output will meet the specified operating characteristics. Output Impedance The impedance measured between the positive and negative (ground) output terminals at a speci- fied frequency with the input open. Overpressure The maximum specified pressure which may be applied to the sensing element of a sensor without causing a permanent change in the output characteristics. Piezoresistance A resistive element that changes resistance relative to the applied stress it experiences (e.g., strain gauge). Pressure Error The maximum difference between the true pressure and the pressure inferred from the output for any pressure in the operating pressure range. Pressure Hysteresis The difference in the output at any given pressure in the operating pressure range when this pressure is approached from the minimum operating pressure and when approached from the maximum operating pressure at room temperature. Pressure Range — also see Operating Pressure Range The pressure limits over which the pressure sensor is calibrated or specified. Pressure Sensor A device that converts an input pressure into an electrical output. Proof Pressure See OVERPRESSURE Ratiometric Ratiometricity refers to the ability of the transducer to maintain a constant sensitivity, at a constant pressure, over a range of supply voltage values. Ratiometric (Ratiometricity Error) At a given supply voltage, sensor output is a proportion of that supply voltage. Ratiometricity error is the change in this proportion resulting from any change to the supply voltage. Usually expressed as a percent of full scale output. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

3–445Motorola Sensor Device Data www.motorola.com/semiconductors Glossary of Terms (continued) Range See OPERATING PRESSURE RANGE Repeatability The maximum change in output under fixed operating conditions over a specified period of time. Resolution The maximum change in pressure required to give a specified change in the output. Response Time The time required for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. Room Conditions Ambient environmental conditions under which sensors most commonly operate. Sensing Element That part of a sensor which responds directly to changes in input pressure. Sensitivity The change in output per unit change in pressure for a specified supply voltage or current. Sensitivity Shift A change in sensitivity resulting from an environmental change such as temperature. Stability The maximum difference in the output at any pressure in the operating pressure range when this pressure is applied consecutively under the same conditions and from the same direction. Storage Temperature Range The range of temperature between minimum and maximum which can be applied without causing the sensor to fail to meet the specified operating characteristics. Strain Gauge A sensing device providing a change in electrical resistance proportional to the level of applied stress. Supply Voltage (Current) The voltage (current) applied to the positive and negative (ground) input terminals. Temperature Coefficient of Full Scale Span The percent change in full scale span per unit change in temperature relative to the full scale span at a specified temperature. Temperature Coefficient of Resistance The percent change in the DC input impedance per unit change in temperature relative to the DC input impedance at a specified temperature. Temperature Error The maximum change in output at any pressure in the operating pressure range when the tempera- ture is changed over a specified temperature range. Temperature Hysteresis The difference in output at any temperature in the operating temperature range when the tempera- ture is approached from the minimum operating temperature and when approached from the maximum operating temperature with zero pressure applied. Thermal Offset Shift See TEMPERATURE COEFFICIENT OF OFFSET Thermal Span Shift See TEMPERATURE COEFFICIENT OF FULL SCALE SPAN Thermal Zero Shift See TEMPERATURE COEFFICIENT OF OFFSET Thin Film A technology using vacuum deposition of conductors and dielectric materials onto a substrate (frequently silicon) to form an electrical circuit. Vacuum A perfect vacuum is the absence of gaseous fluid. Zero Pressure Offset The output at zero pressure (absolute or differential, depending on the device type) for a speci- fied supply voltage or current. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

3–446 Motorola Sensor Device Datawww.motorola.com/semiconductors Symbols, Terms and Definitions The following are the most commonly used letter symbols, terms and definitions associated with solid state silicon pressure sensors. Pburst Burst Pressure The maximum pressure that can be applied to a transducer without rupture of either the sensing element or transducer case. Io supply current The current drawn by the sensor from the voltage source. Io+ output source current The current sourcing capability of the pressure sensor. kPa kilopascals Unit of pressure. 1 kPa = 0.145038 PSI. — Linearity The maximum deviation of the output from a straight line relationship with pressure over the operating pressure range, the type of straight line relationship (end point, least square approximation, etc.) should be specified. mm Hg millimeters of mercury Unit of pressure. 1 mmHg = 0.0193368 PSI. Pmax overpressure The maximum specified pressure which may be applied to the sensing element without causing a permanent change in the output characteristics. POP operating pressure range The range of pressures between minimum and maximum temperature at which the output will meet the specified operating characteristics. — Pressure Hysteresis The difference in the output at any given pressure in the operating pressure range when this pressure is approached from the minimum operating pressure and when approached from the maximum operating pressure at room temperature. PSI pounds per square inch Unit of pressure. 1 PSI = 6.89473 kPa. — Repeatability The maximum change in output under fixed operating conditions over a specified period of time. R o input resistance The resistance measured between the positive and negative input terminals at a specified frequency with the output terminals open. TA operating temperature The temperature range over which the device may safely operate. TCR temperature coefficient of resistance The percent change in the DC input impedance per unit change in temperature relative to the DC input impedance at a specified temperature (typically +25°C). TCV FSS temperature coefficient of full scale span The percent change in full scale span per unit change in temperature relative to the full scale span at a specified temperature (typically +25°C). TCV off temperature coefficient of offset The percent change in offset per unit change in temperature relative to the offset at a speci- fied temperature (typically +25°C). Tstg storage temperature The temperature range at which the device, without any power applied, may be stored. tR response time The time required for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. — Temperature Hysteresis The difference in output at any temperature in the operating temperature range when the temperature is approached from the minimum operating temperature and when approached from the maximum operating temperature with zero pressure applied. VFSS full scale span voltage The change in output over the operating pressure range at a specified supply voltage. Voff offset voltage The output with zero differential pressure applied for a specified supply voltage or current. VS supply voltage dc The dc excitation voltage applied to the sensor. For precise circuit operation, a regulated supply should be used. VS max maximum supply voltage The maximum supply voltage that may be applied to a circuit or connected to the sensor. Zin input impedance The resistance measured between the positive and negative input terminals at a specified frequency with the output terminals open. For Motorola X-ducer, this is a resistance measure- ment only. Zout output impedance The resistance measured between the positive and negative output terminals at a speci- fied frequency with the input terminals open. ΔV/ΔP sensitivity The change in output per unit change in pressure for a specified supply voltage. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

4–1Motorola Sensor Device Data www.motorola.com/semiconductors /C0083/C0097/C0102/C0101/C0116/C0121 /C0097/C0110/C0100 /C0065/C0108/C0097/C0114/C0109 /C0073/C0110/C0116/C0101/C0103/C0114/C0097/C0116/C0101/C0100 /C0067/C0105/C0114/C0099/C0117/C0105/C0116/C0115 Section Four Motorola’s Safety and Alarm Integrated Circuits (IC’s) are low power, CMOS devices designed to meet a wide range of smoke detector applications at very competitive prices. Moto- rola has been producing both photoelectric and ionization safety and alarm IC’s for more than 20 years. Found in con- sumer and commercial applications worldwide, these inte- grated circuits can be operated using a battery or AC power. In addition, these devices are designed to be used in stand alone units or as an interconnected system of up to 40 units. All of Motorola’s safety and alarm IC’s have component recog- nition from Underwriter’s Laboratories and the newest devices meet the NFPA’s new temporal – new tone horn pattern. Data Sheets Application Notes Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

4–2 Motorola Sensor Device Datawww.motorola.com/semiconductors Mini Selector Guide SAFETY AND ALARM INTEGRATED CIRCUITS Smoke Ion Product Operating Voltage (V) Horn Tone Interconnectable Primary Power Source Ordering Suffix Note MC14467 6 to 12 Continuous – Old Tone – 4/6 No DC P1 MC14468 6 to 12 Continuous – Old Tone – 4/6 Yes AC/DC P MC145017 6 to 12 Temporal – New Tone – NFPA Tone No DC P MC145018 6 to 12 Temporal – New Tone – NFPA Tone Yes AC/DC P Smoke Photo Product Operating Voltage (V) Horn Tone Interconnectable Primary Power Source Ordering Suffix Note MC145010 6 to 12 Continuous – Old Tone – 4/6 Yes AC/DC P, DW, DWR2 MC145011 6 to 12 Continuous – Old Tone – 4/6 Yes AC P, DW, DWR2 MC145012 6 to 12 Temporal – New Tone – NFPA Tone Yes AC/DC P, DW, DWR2 Comparator Product Operating Voltage (V) Description Horn Modulation Primary Power Source Ordering Suffix Note MC14578 3.5 to 14 Micro–Power Comparator Plus Voltage Follower No Horn Driver AC/DC P General Alarm Product Operating Voltage (V) Description Horn Tone(ms) Primary Power Source Ordering Suffix Note MC14600 6.0 to 12 Alarm Detection, Horn Driver, Low Battery Detection, LED Driver Continuous – Old Tone – 4/6 AC/DC P, DW, DWR2 Note: P or P1 = 16–pin DIP, DW = SOIC 16–pin, DWR2 = SOIC 16–pin tape & reel Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

4–3Motorola Sensor Device Data www.motorola.com/semiconductors Low–Power CMOS /C0073/C0111/C0110/C0105/C0122/C0097/C0116/C0105/C0111/C0110 /C0083/C0109/C0111/C0107/C0101 /C0068/C0101/C0116/C0101/C0099/C0116/C0111/C0114 /C0073/C0067 The MC14467–1, when used with an ionization chamber and a small number of external components, will detect smoke. When smoke is sensed, an alarm is sounded via an external piezoelectric transducer and internal drivers. This circuit is designed to operate in smoke detector systems that comply with UL217 and UL268 specifications.

Ionization Type with On–Chip FET Input Comparator
Piezoelectric Horn Driver
Guard Outputs on Both Sides of Detect Input
Input–Production Diodes on the Detect Input
Low–Battery Trip Point, Internally Set, can be Altered Via External Resistor
Detect Threshold, Internally Set, can be Altered Via External Resistor
Pulse Testing for Low Battery Uses LED for Battery Loading
Comparator Outputs for Detect and Low Battery
Internal Reverse Battery Protection MAXIMUM RATINGS* (Voltages referenced to VSS ) Rating Symbol Value Unit DC Supply Voltage VDD /C00420.5 to + 15 V Input Voltage, All Inputs Except Pin 8 Vin /C00420.25 to VDD + 0.25 V DC Current Drain per Input Pin, Except Pin 15 = 1 mA I 10 mA DC Current Drain per Output Pin I 30 mA Operating Temperature Range TA /C004210 to +60 °C Storage Temperature Range Tstg /C004255 to + 125 °C Reverse Battery Time tRB 5.0 s * Maximum Ratings are those values beyond which damage to the device may occur. This device contains circuitry to protect the inputs against damage due to high static voltages or electric fields; however, it is advised that normal precautions be taken to avoid application of any voltage higher than maximum rated voltages to this high impedance circuit. For proper operation it is recommended that except for pin 8, Vin and Vout be constrained to the range VSS /C0118 (Vin or Vout) /C0118VDD . For pin 8, refer to the Electrical Characteristics. /C0077/C0079/C0084/C0079/C0082/C0079/C0076/C0065 SEMICONDUCTOR TECHNICAL DATA /C0077/C0067/C0049/C0052/C0052/C0054/C0055/C0045/C0049 P SUFFIX PLASTIC DIP CASE 648–08 PIN ASSIGNMENT (16 PIN DIP) Detect Comp. Out N/C Low V Set Low V Comp. Out LED VDD Timing Resistor Feedback Guard Hi–Z Detect Input Guard Lo–Z Sensitivity Set Osc Capacitor Silver Brass VSS

iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0067/C0049/C0052/C0052/C0054/C0055/C0045/C0049 4–4 Motorola Sensor Device Datawww.motorola.com/semiconductors RECOMMENDED OPERATING CONDITIONS (Voltages referenced to VSS ) Parameter Symbol Value Unit Supply Voltage VDD 9.0 V Timing Capacitor — 0.1 µF Timing Resistor — 8.2 M Ω Battery Load (Resistor or LED) — 10 mA ELECTRICAL CHARACTERISTICS (Voltages referenced to VSS , TA = 25°C) Characteristic Symbol VDD Vdc Min Typ# Max Unit Operating Voltage VDD — 6.0 — 12 V Output Voltage Piezoelectric Horn Drivers (IOH = /C004216 mA) Comparators (IOH = /C004230 µA) Piezoelectric Horn Drivers (IOL = +16 mA) Comparators (IOL = +30 µA) VOH VOL 7.2 9.0 7.2 9.0 6.3 8.5 8.8 0.1 0.9 0.5 V V Output Voltage — LED Driver, IOL = 10 mA VOL 7.2 — — 3.0 V Output Impedance, Active Guard Pin 14 Pin 16 Lo–Z Hi–Z 9.0 9.0 1000 kΩ Operating Current (Rbias = 8.2 MΩ ) IDD 9.0 12.0 5.0 9.0 12.0 µA Input Current — Detect (40% R.H.) Iin 9.0 — — /C00341.0 pA Internal Set Voltage Low Battery Sensitivity Vlow Vset 9.0 7.2 7.8 V %V DD Hysteresis vhys 9.0 75 100 150 mV Offset Voltage (measured at Vin = VDD/2) Active Guard Detect Comparator VOS 9.0 9.0 /C0034100 /C003450 mV Input Voltage Range, Pin 8 Vin — VSS –10 — VDD + 10 V Input Capacitance C in — — 5.0 — pF Common Mode Voltage Range, Pin 15 Vcm — 0.6 — VDD /C00422 V # Data labelled “Typ’’ is not to be used for design purposes but is intended as an indication of the IC’s potential performance. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

# Data labelled “Typ’’ is not to be used for design purposes but is intended as an indication of the IC’s potential performance.

14 LO–Z

16 HI–Z

Freescale Semiconductor, Inc.

battery alarm is inhibited, but the LED pulses at a 1.0 Hz rate. has internal diode protection against static damage. strobe, chip current rises to approximately 50 µA. Figure 5. Typical Application as Ionization Smoke Detector

8.2 MΩ+

1.5 MΩ *

1 M 1 M

*NOTE: Component values may change depending on type of piezoelectric horn used. Freescale Semiconductor, Inc.

Figure 6. Timing Diagram

24 Clock Cycles

24 Clock Cycles 6 Clock

Horn modulation is self–completing. When going from smoke to no smoke, the alarm condition will terminate only when horn is off.
Comparators are strobed on once per clock cycle (1.67 s for no smoke, 40 ms for smoke).
Low battery comparator information is latched only during LED pulse.

Freescale Semiconductor, Inc.

4–9Motorola Sensor Device Data www.motorola.com/semiconductors Low–Power CMOS /C0073/C0111/C0110/C0105/C0122/C0097/C0116/C0105/C0111/C0110 /C0083/C0109/C0111/C0107/C0101 /C0068/C0101/C0116/C0101/C0099/C0116/C0111/C0114 /C0073/C0067 /C0119/C0105/C0116/C0104 /C0073/C0110/C0116/C0101/C0114/C0099/C0111/C0110/C0110/C0101/C0099/C0116 The MC14468, when used with an ionization chamber and a small number of external components, will detect smoke. When smoke is sensed, an alarm is sounded via an external piezoelectric transducer and internal drivers. This circuit is designed to operate in smoke detector systems that comply with UL217 and UL268 specifications.

Ionization Type with On–Chip FET Input Comparator
Piezoelectric Horn Driver
Guard Outputs on Both Sides of Detect Input
Input–Production Diodes on the Detect Input
Low–Battery Trip Point, Internally Set, can be Altered Via External Resistor
Detect Threshold, Internally Set, can be Altered Via External Resistor
Pulse Testing for Low Battery Uses LED for Battery Loading
Comparator Output for Detect
Internal Reverse Battery Protection
Strobe Output for External Trim Resistors
I/O Pin Allows Up to 40 Units to be Connected for Common Signaling
Power–On Reset Prevents False Alarms on Battery Change MAXIMUM RATINGS* (Voltages referenced to VSS ) Rating Symbol Value Unit DC Supply Voltage VDD /C00420.5 to + 15 V Input Voltage, All Inputs Except Pin 8 Vin /C00420.25 to VDD + 0.25 V DC Current Drain per Input Pin, Except Pin 15 = 1 mA I 10 mA DC Current Drain per Output Pin I 30 mA Operating Temperature Range TA /C004210 to + 60 °C Storage Temperature Range Tstg /C004255 to + 125 °C Reverse Battery Time tRB 5.0 s * Maximum Ratings are those values beyond which damage to the device may occur. This device contains circuitry to protect the inputs against damage due to high static voltages or electric fields; however, it is advised that normal precautions be taken to avoid application of any voltage higher than maximum rated voltages to this high impedance circuit. For proper operation it is recommended that Vin and Vout be constrained to the range VSS /C0118 (Vin or Vout) /C0118VDD . /C0077/C0079/C0084/C0079/C0082/C0079/C0076/C0065 SEMICONDUCTOR TECHNICAL DATA /C0077/C0067/C0049/C0052/C0052/C0054/C0056 P SUFFIX PLASTIC DIP CASE 648–08 PIN ASSIGNMENT (16 PIN DIP) Detect Comp. Out I/O Low V Set Strobe Out LED VDD Timing Resistor Feedback Guard Hi–Z Detect Input Guard Lo–Z Sensitivity Set Osc Capacitor Silver Brass VSS

iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0067/C0049/C0052/C0052/C0054/C0056 4–10 Motorola Sensor Device Datawww.motorola.com/semiconductors RECOMMENDED OPERATING CONDITIONS (Voltages referenced to VSS ) Parameter Symbol Value Unit Supply Voltage VDD 9.0 V Timing Capacitor — 0.1 µF Timing Resistor — 8.2 M Ω Battery Load (Resistor or LED) — 10 mA ELECTRICAL CHARACTERISTICS (TA = 25°C) Characteristic Symbol VDD Vdc Min Typ# Max Unit Operating Voltage VDD — 6.0 — 12 V Output Voltage Piezoelectric Horn Drivers (IOH = /C004216 mA) Comparators (IOH = /C004230 µA) Piezoelectric Horn Drivers (IOL = +16 mA) Comparators (IOL = +30 µA) VOH VOL 7.2 9.0 7.2 9.0 6.3 8.5 8.8 0.1 0.9 0.5 V V Output Voltage — LED Driver, IOL = 10 mA VOL 7.2 — — 3.0 V Output Impedance, Active Guard Pin 14 Pin 16 Lo–Z Hi–Z 9.0 9.0 1000 kΩ Operating Current (Rbias = 8.2 MΩ ) IDD 9.0 12.0 5.0 9.0 12.0 µA Input Current — Detect (40% R.H.) Iin 9.0 — — /C00341.0 pA Input Current, Pin 8 Iin 9.0 — — /C00340.1 µA Input Current @ 50°C, Pin 15 Iin — — — /C00346.0 pA Internal Set Voltage Low Battery Sensitivity Vlow Vset 9.0 7.2 7.8 V %V DD Hysteresis vhys 9.0 75 100 150 mV Offset Voltage (measured at Vin = VDD/2) Active Guard Detect Comparator VOS 9.0 9.0 /C0034100 /C003450 mV Input Voltage Range, Pin 8 Vin — VSS /C004210 — VDD + 10 V Input Capacitance C in — — 5.0 — pF Common Mode Voltage Range, Pin 15 Vcm — 0.6 — VDD /C00422 V I/O Current, Pin 2 Input, VIH = VDD /C00422 Output, VOH = VDD /C00422 IIH IOH /C00424.0 100 /C004216 µA mA # Data labelled “Typ’’ is not to be used for design purposes but is intended as an indication of the IC’s potential performance. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

# Data labelled “Typ’’ is not to be used for design purposes but is intended as an indication of the IC’s potential performance. Freescale Semiconductor, Inc.

rate. In remote smoke, the LED is inhibited as well. has internal diode protection against static damage. constantly shows smoke/no smoke. Pin 1 = VDD for smoke. rises to approximately 50 µA. depending on type of piezoelectric horn used. Freescale Semiconductor, Inc.

Horn modulation is self–completing. When going from smoke to no smoke, the alarm condition will terminate only when horn is off.
Comparators are strobed on once per clock cycle (1.67 s for no smoke, 40 ms for smoke).
Low battery comparator information is latched only during LED pulse.

Freescale Semiconductor, Inc.

4–15Motorola Sensor Device Data www.motorola.com/semiconductors CMOS /C0077/C0105/C0099/C0114/C0111/C0045/C0080/C0111/C0119/C0101/C0114 /C0067/C0111/C0109/C0112/C0097/C0114/C0097/C0116/C0111/C0114 /C0112/C0108/C0117/C0115 /C0086/C0111/C0108/C0116/C0097/C0103/C0101 /C0070/C0111/C0108/C0108/C0111/C0119/C0101/C0114 The MC14578 is an analog building block consisting of a very–high input impedance comparator. The voltage follower allows monitoring the noninverting input of the comparator without loading. Four enhancement–mode MOSFETs are also included on chip. These FETs can be externally configured as open–drain or totem–pole outputs. The drains have on–chip static–protecting diodes. Therefore, the output voltage must be main- tained between VSS and VDD . The chip requires one external component. A 3.9 MΩ /C003410% resistor must be connected from the Rbias pin to VDD . This circuit is designed to operate in smoke detector systems that comply with UL217 and UL268 specifications.

Applications: Pulse Shapers Line–Powered Smoke Detectors Threshold Detectors Liquid/Moisture Sensors Low–Battery Detectors CO Detector and Micro Interface
Operating Voltage Range: 3.5 to 14 V
Operating Temperature Range: /C004230° to 70°C
Input Current (IN + Pin): /C00341 pA @ 25°C (DIP Only)
Quiescent Current: 10 µA @ 25°C
Electrostatic Discharge (ESD) Protection Circuitry on All Pins /C0077/C0079/C0084/C0079/C0082/C0079/C0076/C0065 SEMICONDUCTOR TECHNICAL DATA /C0077/C0067/C0049/C0052/C0053/C0055/C0056 P SUFFIX PLASTIC DIP CASE 648–08 PIN ASSIGNMENT COMP OUT IN A IN B VDD OUT B IN C OUT C1 NC IN + NC BUFF OUT IN— R bias VSS OUT C2

13 BUFF OUT

PIN 1 = VDD PIN 10 = VSS PINS 14, 16 = NO CONNECTION REV 1 Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0067/C0049/C0052/C0053/C0055/C0056 4–16 Motorola Sensor Device Datawww.motorola.com/semiconductors MAXIMUM RATINGS* (Voltages Referenced to VSS ) Symbol Parameter Value Unit VDD DC Supply Voltage /C00420.5 to +14 V Vin DC Input Voltage /C00420.5 to VDD +0.5 V Vout DC Output Voltage /C00420.5 to VDD +0.5 V Iin DC Input Current, Except IN + /C003410 mA Iin DC Input Current, IN + /C00341.0 mA Iout DC Output Current, per Pin /C003425 mA IDD DC Supply Current, VDD and VSS Pins /C003450 mA PD Power Dissipation, per Package 500 mW Tstg Storage Temperature /C004265 to +150 °C TL Lead Temperature (10–Second Soldering) 260 °C *Maximum Ratings are those values beyond which damage to the device may occur. This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high–impedance circuit. For proper operation, Vin and Vout should be constrained to the range VSS ≤ (Vin or Vout) ≤ VDD . Unused inputs must always be tied to an appropriate logic voltage level (e.g., either VSS or VDD ). Unused outputs must be left open. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0067/C0049/C0052/C0053/C0055/C0056 4–17Motorola Sensor Device Data www.motorola.com/semiconductors ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS , Rbias = 3.9 MΩ to VDD , TA = –30° to 70°C Unless Otherwise Indicated) Symbol Parameter Test Condition VDD V Guaranteed Limit Unit VDD Power Supply Voltage Range — 3.5 to 14.0 V VIL Maximum Low–Level Input Voltage, MOSFETs Wired as Inverters; i.e., IN A tied to IN B, OUT A to OUT B, OUT C1 to OUT C2. Vout = 9.0 V, |Iout| /C01161 µA 10.0 2.0 V VIH Minimum High–Level Input Voltage, MOSFETs Wired as Inverters; i.e., IN A tied to IN B, OUT A to OUT B, OUT C1 to OUT C2. Vout = 1.0 V, |Iout| /C01161 µA 10.0 8.0 V VIO Comparator Input Offset Voltage TA = 25°C, Over Common Mode Range 10.0 /C003450 mV TA = 0° to 50°C, Over Common Mode Range 3.5 to 14.0 /C003475 VCM Comparator Common Mode Voltage Range 3.5 to 14.0 0.7 to VDD /C00421.5 V VOL Maximum Low–Level Comparator Output VoltageIN +: Vin = VSS , IN /C0042: Vin = VDD , Iout = 30 µA 10.0 0.5 V VOH Minimum High–Level Comparator Output VoltageIN +: Vin = VDD , IN /C0042: Vin = VSS , Iout = /C004230 µA 10.0 9.5 V VOO Buffer Amp Output Offset Voltage R load = 10 MΩ to VDD or VSS , Over Common Mode Range — /C0034100 mV VOL Maximum Low–Level Output Voltage, MOSFETs Wired as Inverters;i e IN A tied to IN B OUT OUT C1, OUT C2: Iout = 1.1 mA 10.0 0.5 V Wired as Inverters i.e., IN A tied to IN B, OUT A to OUT B, OUT C1 to OUT C2. OUT A, OUT B: Iout = 270 µA 10.0 0.5 V VOH Minimum High–Level Output Voltage, MOSFETs Wired as Inverters;i e IN A tied to IN B OUT OUT C1, OUT C2: Iout = /C00421.1 mA 10.0 9.5 V Wired as Inverters i.e., IN A tied to IN B, OUT A to OUT B, OUT C1 to OUT C2. OUT A, OUT B: Iout = 270 µA 10.0 9.5 V Iin Maximum Input Leakage IN + (DIP Only) Current TA = 25°C, 40% R.H., Vin = VSS or VDD 10.0 /C00341.0 pA IN + (DIP Only) TA = 50°C, Vin = VSS or VDD 10.0 /C00346.0 IN + (SOG), IN A, IN B, IN C, IN/C0042Vin = VSS or VDD 10.0 /C003440 nA IOZ Maximum Off–State MOSFET Leakage Current IN A, IN C: Vin = VDD , OUT A, OUT C2: Vout = VSS or VDD 10.0 /C0034100 nA IN B, IN C: Vin = VSS , OUT B, OUT C1: Vout = VSS or VDD 10.0 /C0034100 IDD Maximum Quiescent Current TA = 25°C IN A, IN B, IN C: Vin = VSS or VDD , |VIN + /C0042VIN/C0042| = 100 mV, Iout = 0 µA 10.0 10 µA C in Maximum Input Capacitance IN + Other Inputs f = 1 kHz — 5.0 pF Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

4–19Motorola Sensor Device Data www.motorola.com/semiconductors Low–Power CMOS /C0065/C0076/C0065/C0082/C0077 /C0073/C0067 with Horn Driver The MC14600 Alarm IC is designed to simplify the process of interfacing an alarm level voltage condition to a piezoelectric horn and/or LED. With an extremely low average current requirement and an integrated low battery detect feature, the part is ideally suited to battery operated applications. The MC14600 is easily configured with a minimum number of external components to serve a wide range of applications and circuit configurations. Typical applications include intrusion alarms, moisture or water ingress alarms, and personal safety devices.

High Impedance, FET Input Comparator
Comparator Outputs for Low Battery and Alarm Detect
Alarm Detect Threshold Easily Established with 2 Resistor
Integrated Oscillator and Piezoelectric Horn Driver
Low Battery Trip Point Set Internally (Altered Externally)
Horn “Chirp’’ During Low Battery Condition
Pulsed LED Drive Output
Reverse Battery Protection
Input Protection Diodes on the Detect Input
Average Supply Current: 9 µA MAXIMUM RATINGS* (Voltages referenced to VSS ) Rating Symbol Value Unit DC Supply Voltage VDD /C00420.5 to + 15 V Input Voltage, All Inputs Except Pin 8Vin /C00420.25 to VDD + 0.25 V DC Current Drain per Input Pin, Except Pin 15 = 1 mA I 10 mA DC Current Drain per Output Pin I 30 mA Operating Temperature Range TA /C004210 to + 60°C °C Storage Temperature Range Tstg /C004255 to + 125 °C Reverse Battery Time tRB 5.0 s * Maximum Ratings are those values beyond which damage to the device may occur. This device contains circuitry to protect the inputs against damage due to high static voltages or electric fields; however, it is advised that normal precautions be taken to avoid application of any voltage higher than maximum rated voltages to this high impedance circuit. For proper operation it is recommended that Vin and Vout be constrained to the range VSS /C0118 (Vin or Vout) /C0118VDD . /C0077/C0079/C0084/C0079/C0082/C0079/C0076/C0065 SEMICONDUCTOR TECHNICAL DATA /C0077/C0067/C0049/C0052/C0054/C0048/C0048 P SUFFIX PLASTIC DIP CASE 648–08 PIN ASSIGNMENT (16 PIN DIP) Detect Comp. Out N/C Low V Set Low V Comp. Out LED VDD Timing Resistor Horn Feedback Guard Alarm Detect Input N/C Alarm Threshold Osc Capacitor Horn Out 2 Horn Out 1 VSS

MC14600DWR2 SOIC TAPE & REEL DW SUFFIX SOIC PACKAGE CASE 751G–03 REV 3 Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0067/C0049/C0052/C0054/C0048/C0048 4–20 Motorola Sensor Device Datawww.motorola.com/semiconductors RECOMMENDED OPERATING CONDITIONS (Voltages referenced to VSS ) Parameter Symbol Value Unit Supply Voltage VDD 9.0 V LED (Pin 5) Load — 10 mA ELECTRICAL CHARACTERISTICS (Voltages referenced to VSS , TA = 25°C) Characteristic Pin # Symbol VDD Vdc Min Typ Max Unit Operating Voltage 6 VDD — 6.0 — 12 V Output Voltage Piezoelectric Horn Drivers (IOH = +16 mA) Comparators (IOH = +30 µA) Piezoelectric Horn Drivers (IOL = /C004216 mA) Comparators (IOL = /C004230 µA) (IOL = /C0042200 µA) 10,11 10,11 VOH VOL 7.4 9.0 7.4 9.0 6.5 8.5 8.8 0.1 0.9 0.5 0.5 V V Output Voltage — LED Driver, IOL = 10 mA 5 VOL 7.2 — — 2.0 V Output Impedance, Active Guard 16 Hi–Z 9.0 — — 1000 kΩ Standby Current (Rbias = 8.2 MΩ ) — IDD 9.0 12.0 5.0 9.0 12.0 µA Input Leakage Current 1 Iin 9.0 9.0 9.0 /C003430 /C00340.1 /C003430 nA µA nA Detect Comp. Out V = 3 V V = 9 V 1 — 2.50 8.00 mA mA Low Battery Threshold Voltage (Pin 3 open) 6 Vlow 9.0 7.2 — 7.8 V Offset Voltage (measured at Vin = VDD/2) Active Guard Detect Comparator 13,15 VOS 9.0 9.0 /C0034100 /C003450 mV Input Voltage Range 8 Vin — VSS –10 — VDD + 10 V Input Capacitance (to VSS @ 1 khz) 15 C in — — 5.0 — pF Common Mode Voltage Range 13,15 Vcm — 1.5 — VDD –2 V Breakdown Voltage Human Body Models per MIL–STD–883 Method 3015 All pins except 15 /C0034500 /C0034400 V # Data labelled “Typ’’ is not to be used for design purposes but is intended as an indication of the IC’s potential performance. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

5 LED

7 VDD

Freescale Semiconductor, Inc.

tor should be of a low leakage type. chirp is inhibited, and the LED pulses at a 1.0 Hz rate. diode protection against static damage. old while a resistor to GND will increase it. Figure 2. Typical Application Components *NOTE: Component values may change depending on type of piezoelectric horn used. Freescale Semiconductor, Inc.

Figure 3. MC14600 Timing Diagram

24 CLOCKS 24 CLOCKS

Horn modulation is self–completing. When going from Alarm to No Alarm, the alarm condition will terminate only when horn is off.
Comparators are strobed once per cycle.
Low battery comparator information is latched only during LED pulse.
Current source required into Pin 1.
Alarm Condition can initiate on any clock pulse except 1 and 7.

Freescale Semiconductor, Inc.

4–24 Motorola Sensor Device Datawww.motorola.com/semiconductors /C0080/C0104/C0111/C0116/C0111/C0101/C0108/C0101/C0099/C0116/C0114/C0105/C0099 /C0083/C0109/C0111/C0107/C0101 /C0068/C0101/C0116/C0101/C0099/C0116/C0111/C0114 /C0073/C0067 /C0119/C0105/C0116/C0104 /C0073/C0047/C0079 The CMOS MC145010 is an advanced smoke detector component containing sophisticated very–low–power analog and digital circuitry. The IC is used with an infrared photoelectric chamber. Detection is accomplished by sensing scattered light from minute smoke particles or other aerosols. When detection occurs, a pulsating alarm is sounded via on–chip push–pull drivers and an external piezoelectric transducer. The variable–gain photo amplifier allows direct interface to IR detectors (photodiodes). Two external capacitors, C1 and C2, C1 being the larger, determine the gain settings. Low gain is selected by the IC during most of the standby state. Medium gain is selected during a local–smoke condition. High gain is used during pushbutton test. During standby, the special monitor circuit which periodically checks for degraded chamber sensitivity uses high gain, also. The I/O pin, in combination with VSS , can be used to interconnect up to 40 units for common signaling. An on–chip current sink provides noise immunity when the I/O is an input. A local–smoke condition activates the short–circuit– protected I/O driver, thereby signaling remote smoke to the interconnected units. Additionally, the I/O pin can be used to activate escape lights, enable auxiliary or remote alarms, and/or initiate auto–dialers. While in standby, the low–supply detection circuitry conducts periodic checks using a pulsed load current from the LED pin. The trip point is set using two external resistors. The supply for the MC145010 can be a 9 V battery. A visible LED flash accompanying a pulsating audible alarm indicates a local–smoke condition. A pulsating audible alarm with no LED flash indicates a remote–smoke condition. A beep or chirp occurring virtually simultaneously with an LED flash indicates a low–supply condition. A beep occurring half–way between LED flashes indicates degraded chamber sensitivity. A low–supply condition does not affect the smoke detection capability if VDD ≥ 6 V. Therefore, the low–supply condition and degraded chamber sensitivity can be further distinguished by performing a pushbutton (chamber) test.

Circuit is designed to operate in smoke detector systems that comply with UL217 and UL268 Specifications
Operating Voltage Range: 6 to 12 V
Operating Temperature Range: – 10 to 60°C
Average Supply Current: 12 µA
Power–On Reset Places IC in Standby Mode (Non–Alarm State)
Electrostatic Discharge (ESD) and Latch Up Protection Circuitry on All Pins
Chip Complexity: 2000 FETs, 12 NPNs, 16 Resistors, and 10 Capacitors
Ideal for battery powered applications. /C0077/C0079/C0084/C0079/C0082/C0079/C0076/C0065 SEMICONDUCTOR TECHNICAL DATA /C0077/C0067/C0049/C0052/C0053/C0048/C0049/C0048 P SUFFIX PLASTIC DIP CASE 648–08 PIN ASSIGNMENT Detect Strobe VDD IRED I/O Brass Test Low–Supply Trip VSS Osc LED Feedback Silver

CASE 751G–03 REV 4 Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0067/C0049/C0052/C0053/C0048/C0049/C0048 4–25Motorola Sensor Device Data www.motorola.com/semiconductors BLOCK DIAGRAM –DETECT OSC TEST STROBE LOW–SUPPLY TRIP C1 C2 OSC AMP COMP COMP ALARM LOGIC HORN MODULATOR AND DRIVER VDD – 5 V REF TIMING LOGIC VDD – 3.5 V REF ZERO GAIN LOW SUPPLY SMOKE GATE ON/OFF GATE ON/OFF PIN 5 = VDD PIN 14 = VSS LED IRED FEEDBACK SILVER BRASS I/O MAXIMUM RATINGS* (Voltages Referenced to VSS ) Symbol Parameter Value Unit VDD DC Supply Voltage /C00420.5 to +12 V Vin DC Input Voltage C1, C2, Detect Osc, Low–Supply Trip I/O Feedback Test /C00420.25 to VDD +0.25 /C00420.25 to VDD +0.25 /C00420.25 to VDD +10 /C004215 to +25 /C00421.0 to VDD +0.25 V Iin DC Input Current, per Pin /C003410 mA Iout DC Output Current, per Pin /C003425 mA IDD DC Supply Current, VDD and VSS Pins +25 / /C0042150 mA PD Power Dissipation in Still Air, 5 Seconds Continuous 1200 350* mW Tstg Storage Temperature /C004255 to +125 °C TL Lead Temperature, 1 mm from Case for 10 Seconds 260 °C * Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the limits in the Electrical Characteristics tables. Derating: – 12 mW/°C from 25° to 60°C. * Derating: – 3.5 mW/°C from 25° to 60°C. This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high–impedance circuit. For proper operation, Vin and Vout should be constrained to the range VSS ≤ (Vin or Vout) ≤ VDD except for the I/O, which can exceed VDD , and the Test input, which can go below VSS . Unused inputs must always be tied to an appropriate logic voltage level (e.g., either VSS or VDD ). Unused outputs and/or an unused I/O must be left open. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0067/C0049/C0052/C0053/C0048/C0049/C0048 4–26 Motorola Sensor Device Datawww.motorola.com/semiconductors ELECTRICAL CHARACTERISTICS (TA = – 10 to 60°C Unless Otherwise Indicated, Voltages Referenced to VSS ) Symbol Parameter Test Condition VDD V Min Max Unit VDD Power Supply Voltage Range — 6.0 12 V VTH Supply Threshold Voltage, Low–Supply Alarm Low–Supply Trip: Vin = VDD/3 — 6.5 7.8 V IDD Average Operating Supply Current (per Package) Standby Configured per Figure 5 12.0 — 12 µA iDD Peak Supply Current (per Package) During Strobe On, IRED Off Configured per Figure 5 12.0 — 2.0 mA During Strobe On, IRED On Configured per Figure 5 12.0 — 3.0 VIL Low–Level Input Voltage I/O Feedback Test 9.0 9.0 9.0 1.5 2.7 7.0 V VIH High–Level Input Voltage I/O Feedback Test 9.0 9.0 9.0 3.2 6.3 8.5 V Iin Input Current OSC, Detect Low–Supply Trip Feedback Vin = VSS or VDD Vin = VSS or VDD Vin = VSS or VDD 12.0 12.0 12.0 ± 100 ± 100 ± 100 nA IIL Low–Level Input Current Test Vin = VSS 12.0 — – 1 µA IIH Pull–Down Current Test I/O Vin = VDD No Local Smoke, Vin = VDD No Local Smoke, Vin = 17 V 9.0 9.0 12.0 0.5 100 140 µA VOL Low–Level Output Voltage LED Silver, Brass Iout = 10 mA Iout = 16 mA 6.5 6.5 0.6 1.0 V VOH High–Level Output Voltage Silver, BrassIout = – 16 mA 6.5 5.5 — V Vout Output Voltage Strobe (For Line Regulation, See Pin Descriptions) Inactive, Iout = –1 µA Active, Iout = 100 µA to 500 µA (Load Regulation) 9.0 VDD – 0.1 VDD – 4.4 VDD – 5.6 V IRED Inactive, Iout = 1 µA Active, Iout = 6 mA (Load Regulation) 9.0 2.25* 0.1 3.75* IOH High–Level Output Current I/O Local Smoke, Vout = 4.5 V 6.5 – 4 — mA Local Smoke, Vout = VSS (Short Circuit Current) 12.0 — – 16 IOZ Off–State Output Leakage Current LED Vout = VSS or VDD 12.0 — ± 1 µA VIC Common Mode C1, C2, Detect Voltage Range Local Smoke, Pushbutton Test, or Chamber Sensitivity Test — VDD – 4 VDD – 2 V Vref Smoke Comparator Internal Reference Voltage Local Smoke, Pushbutton Test, or Chamber Sensitivity Test — VDD – 3.08VDD – 3.92 V *TA = 25°C only. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0067/C0049/C0052/C0053/C0048/C0049/C0048 4–27Motorola Sensor Device Data www.motorola.com/semiconductors AC ELECTRICAL CHARACTERISTICS (Reference Timing Diagram Figures 3 and 4) (TA = 25°C, VDD = 9.0 V, Component Values from Figure 5: R1 = 100.0 KΩ , C3 = 1500.0 pF, R2 = 10.0 MΩ ) No. Symbol Parameter Test Condition Clocks Min Max Unit 1 1/fosc Oscillator Period* Free–Running Sawtooth Measured at Pin 12 1 9.5 11.5 ms 2 tLED LED Pulse Period No Local Smoke, and No Remote Smoke 4096 38.9 47.1 s

3 Remote Smoke, but

— None 4 Local Smoke or Pushbutton Test 64 0.60 0.74 5 tw(LED), tw(stb) LED Pulse Width and Strobe Pulse Width 1 9.5 11.5 ms 6 tIRED IRED Pulse Period Smoke Test 1024 9.67 11.83 s

7 Chamber Sensitivity Test,

4096 38.9 47.1 8 Pushbutton Test 32 0.302 0.370 9 tw(IRED) IRED Pulse Width Tf* 94 116 µs 10 tr IRED Rise Time — — 30 µs tf IRED Fall Time — — 200 11 tmod Silver and Brass Modulation Period Local or Remote Smoke — 297 363 ms 11,12 ton/tmod Silver and Brass Duty Cycle Local or Remote Smoke — 73 77 % 13 tCH Silver and Brass Chirp Pulse Period Low Supply or Degraded Chamber Sensitivity 4096 38.9 47.1 s 14 tw(CH) Silver and Brass Chirp Pulse Width Low Supply or Degraded Chamber Sensitivity 1 9.5 11.5 ms 15 tRR Rising Edge on I/O to Smoke Alarm Response Time Remote Smoke, No Local Smoke — — 800 ms 16 tstb Strobe Out Pulse Period Smoke Test 1024 9.67 11.83 s

17 Chamber Sensitivity Test,

4096 38.9 47.1

18 Low Supply Test,

4096 38.9 47.1 19 Pushbutton Test — 0.302 0.370 * Oscillator period T (= Tr + Tf) is determined by the external components R1, R2, and C3 where Tr = (0.6931) R2 * C3 and Tf = (0.6931) R1 * C3. The other timing characteristics are some multiple of the oscillator timing as shown in the table. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

Figure 1. AC Characteristics versus Supply NOTE: Includes external component variations. See Figure 2B. NOTE: These components were used to generate Figure 2A.

10 MΩ CARBON COMPOSITION

25 C VALUE)°

Freescale Semiconductor, Inc.

Figure 3. Standby Timing Diagram NOTES: Numbers refer to the AC Electrical Characteristics Table. Illustration is not to scale. Freescale Semiconductor, Inc.

Figure 4. Smoke Timing Diagram NOTES: Numbers refer to the AC Electrical Characteristics Table. Illustration is not to scale. Freescale Semiconductor, Inc.

4.7 TO 22

/C0075Values for R4, R5, and C6 may differ depending on type of piezoelectric horn used.

C2 and R13 are used for coarse sensitivity adjustment. Typical values are shown.

†R9 is for fine sensitivity adjustment (optional). If fixed resistors are used, R8 = 12 k, R10 is 5.6 k to 10 k, and R9 is eliminated. When R9 is used, noise pickup is increased due to antenna effects. Shielding may be required. **C4 should be 22 µF if B1 is a carbon battery. C4 could be reduced to 1 µF when an alkaline battery is used. Figure 5. Typical Battery–Powered Application of the closed–loop gain should not exceed 10,000. during pushbutton or chamber sensitivity tests. [1/(12√C2 )] – 680 where R14 is in ohms and C2 is in farads. pin must be minimized, also. See Figure 6. Freescale Semiconductor, Inc.

/C0077/C0067/C0049/C0052/C0053/C0048/C0049/C0048 4–32 Motorola Sensor Device Datawww.motorola.com/semiconductors VDD (Pin 5) This pin is connected to the positive supply potential and may range from +6 to +12 V with respect to V SS . CAUTION: In battery–powered applications, reverse– polarity protection must be provided externally. IRED (Pin 6) This output provides pulsed base current for external NPN transistor Q1 used as the infrared emitter driver. Q1 must have β ≥ 100. At 10 mA, the temperature coefficient of the output voltage is typically + 0.5%/°C from – 10° to 60°C. The supply–voltage coefficient (line regulation) is ± 0.2%/V maxi- mum from 6 to 12 V. The IRED pulse width (active–high) is determined by external components R1 and C3. With a 100 kΩ /1500 pF combination, the nominal width is 105 µs. To minimize noise impact, IRED is not active when the vis- ible LED and horn outputs are active. IRED is active near the end of Strobe pulses for Smoke Tests, Chamber Sensitivity Test, and Pushbutton Test. I/O (Pin 7) This pin can be used to connect up to 40 units together in a wired–OR configuration for common signaling. VSS is used as the return. An on–chip current sink minimizes noise pick up during non–smoke conditions and eliminates the need for an external pull–down resistor to complete the wired–OR. Remote units at lower supply voltages do not draw excessive current from a sending unit at a higher supply voltage. I/O can also be used to activate escape lights, auxiliary alarms, remote alarms, and/or auto–dialers. As an input, this pin feeds a positive–edge–triggered flip– flop whose output is sampled nominally every 625 ms during standby (using the recommended component values). A local–smoke condition or the pushbutton–test mode forces this current–limited output to source current. All input signals are ignored when I/O is sourcing current. I/O is disabled by the on–chip power–on reset to elimi- nate nuisance signaling during battery changes or system power–up. If unused, I/O must be left unconnected. BRASS (Pin 8) This half of the push–pull driver output is connected to the metal support electrode of a piezoelectric audio transducer and to the horn–starting resistor. A continuous modulated tone from the transducer is a smoke alarm indicating either local or remote smoke. A short beep or chirp is a trouble alarm indicating a low supply or degraded chamber sensitivity. SILVER (Pin 9) This half of the push–pull driver output is connected to the ceramic electrode of a piezoelectric transducer and to the horn–starting capacitor. FEEDBACK (Pin 10) This input is connected to both the feedback electrode of a self–resonating piezoelectric transducer and the horn–start- ing resistor and capacitor through current–limiting resistor R4. If unused, this pin must be tied to VSS or VDD . LED (Pin 11) This active–low open–drain output directly drives an exter- nal visible LED at the pulse rates indicated below. The pulse width is equal to the OSC period. The load for the low–supply test is applied by this output. This low–supply test is non–coincident with the smoke tests, chamber sensitivity test, pushbutton test, or any alarm signals. The LED also provides a visual indication of the detector status as follows, assuming the component values shown in Figure 5: Standby (includes low–supply and chamber sensitivity tests) — Pulses every 43 seconds (nominal) Local Smoke — Pulses every 0.67 seconds (nominal) Remote Smoke — No pulses Pushbutton Test — Pulses every 0.67 seconds (nominal) OSC (Pin 12) This pin is used in conjunction with external resistor R2 (10 MΩ ) to VDD and external capacitor C3 (1500 pF) to VDD to form an oscillator with a nominal period of 10.5 ms. R1 (Pin 13) This pin is used in conjunction with resistor R1 (100 kΩ ) to pin 12 and C3 (1500 pF, see pin 12 description) to determine the IRED pulse width. With this RC combination, the nominal pulse width is 105 µs. VSS (Pin 14) This pin is the negative supply potential and the return for the I/O pin. Pin 14 is usually tied to ground. LOW–SUPPLY TRIP (Pin 15) This pin is connected to an external voltage which deter- mines the low–supply alarm threshold. The trip voltage is obtained through a resistor divider connected between the VDD and LED pins. The low–supply alarm threshold voltage (in volts) ≈ (5R7/R6) + 5 where R6 and R7 are in the same units. TEST (Pin 16) This input has an on–chip pull–down device and is used to manually invoke a test mode. The Pushbutton Test mode is initiated by a high level at pin 16 (usually depression of a S.P.S.T. normally–open pushbut- ton switch to VDD ). After one oscillator cycle, IRED pulses approximately every 336 ms, regardless of the presence of smoke. Additionally, the amplifier gain is increased by auto- matic selection of C1. Therefore, the background reflections in the smoke chamber may be interpreted as smoke, gener- ating a simulated–smoke condition. After the second IRED pulse, a successful test activates the horn–driver and I/O cir- cuits. The active I/O allows remote signaling for system test- ing. When the Pushbutton Test switch is released, the Test input returns to VSS due to the on–chip pull–down device. After one oscillator cycle, the amplifier gain returns to nor- mal, thereby removing the simulated–smoke condition. After two additional IRED pulses, less than a second, the IC exits the alarm mode and returns to standby timing. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

floated for at least one OSC cycle. Battery and supervisory tests are disabled in this mode. Table 1. Configuration of Pins in the Calibration Mode Low–Supply Trip. The amp’s output appears as pulses and is referenced to VDD . Low–Supply Trip 15 If the I/O pin is high, pin 15 controls which gain capacitor is used. Low: normal gain, amp output on pin 1. High: supervisory gain, amp output on pin 2. Feedback 10 Driving this input high enables hysteresis (10% gain increase) in the photo amp; pin 15 must be low. that smoke has been detected. A static low level indicates no smoke. “on” (static high level) and 2 consecutive no–detections for “off” (static low level). NOTES: Illustration is bottom view of layout using a DIP. Top view for SOIC layout is mirror image. Optional potentiometer R9 is not included. Leads on D2, R11, R8, and R10 and their associated traces must be kept as short as possible. This practice minimizes noise pick up. Pin 3 must be decoupled from all other traces. Figure 6. Recommended PCB Layout Freescale Semiconductor, Inc.

4–34 Motorola Sensor Device Datawww.motorola.com/semiconductors /C0080/C0104/C0111/C0116/C0111/C0101/C0108/C0101/C0099/C0116/C0114/C0105/C0099 /C0083/C0109/C0111/C0107/C0101 /C0068/C0101/C0116/C0101/C0099/C0116/C0111/C0114 /C0073/C0067 /C0119/C0105/C0116/C0104 /C0073/C0047/C0079 For Line–Powered Applications The CMOS MC145011 is an advanced smoke detector component containing sophisticated very–low–power analog and digital circuitry. The IC is used with an infrared photoelectric chamber. Detection is accomplished by sensing scattered light from minute smoke particles or other aerosols. When detection occurs, a pulsating alarm is sounded via on–chip push–pull drivers and an external piezoelectric transducer. The variable–gain photo amplifier allows direct interface to IR detectors (photo–diodes). Two external capacitors C1 and C2, C1 being the larger, determine the gain settings. Low gain is selected by the IC during most of the standby state. Medium gain is selected during a local–smoke condition. High gain is used during pushbutton test. During standby, the special monitor circuit which periodically checks for degraded chamber sensitivity uses high gain, also. The I/O pin, in combination with VSS , can be used to interconnect up to 40 units for common signaling. An on–chip current sink provides noise immunity when the I/O is an input. A local–smoke condition activates the short–circuit–protected I/O driver, thereby signaling remote smoke to the interconnected units. Additionally, the I/O pin can be used to activate escape lights, enable auxiliary or remote alarms, and/or initiate auto–dialers. While in standby, the low–supply detection circuitry conducts periodic checks using a load current from the LED pin. The trip point is set using two external resistors. The supply for the MC145011 must be a dc power source capable of supplying 35 mA continuously and 45 mA peak. When the MC145011 is in standby, an external LED is continuously illuminated to indicate that the device is receiving power. An extinguished LED accompanied by a pulsating audible alarm indicates a local–smoke condition. A pulsating audible alarm with the LED illuminated indicates a remote–smoke condition. A beep or chirp indicates a low–supply condition or degraded chamber sensitivity. A low–supply condition does not affect the smoke detection capability if VDD /C01196 V. Therefore, the low–supply condition and degraded chamber sensitivity can be distinguished by performing a pushbutton (chamber) test. This circuit is designed to operate in smoke detector systems that comply with UL217 and UL268 specifications.

Operating Voltage Range: 6 to 12 V
Operating Temperature Range: /C004210 to 60°C
Average Standby Supply Current (Visible LED Illuminated): 20 mA
Power–On Reset Places IC in Standby Mode (Non–Alarm State)
Electrostatic Discharge (ESD) and Latch Up Protection Circuitry on All Pins
Chip Complexity: 2000 FETs, 12 NPNs, 16 Resistors, and 10 Capacitors /C0077/C0079/C0084/C0079/C0082/C0079/C0076/C0065 SEMICONDUCTOR TECHNICAL DATA /C0077/C0067/C0049/C0052/C0053/C0048/C0049/C0049 P SUFFIX PLASTIC DIP CASE 648–08 PIN ASSIGNMENT Detect Strobe VDD IRED I/O Brass Test Low–Supply Trip VSS Osc LED Feedback Silver

CASE 751G–03 REV 3 Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0067/C0049/C0052/C0053/C0048/C0049/C0049 4–35Motorola Sensor Device Data www.motorola.com/semiconductors –DETECT OSC TEST STROBE LOW–SUPPLY TRIP C1 C2 OSC AMP COMP COMP ALARM LOGIC HORN MODULATOR AND DRIVER VDD – 5 V REF TIMING LOGIC VDD – 3.5 V REF ZERO GAIN LOW SUPPLY SMOKE GATE ON/OFF GATE ON/OFF PIN 5 = VDD PIN 14 = VSS LED IRED FEEDBACK SILVER BRASS I/O Block Diagram MAXIMUM RATINGS* (Voltages referenced to VSS ) Symbol Parameter Value Unit VDD DC Supply Voltage /C00420.5 to +12 V Vin DC Input Voltage C1, C2, Detect Osc, Low–Supply Trip I/O Feedback Test /C00420.25 to VDD +0.25 /C00420.25 to VDD +0.25 /C00420.25 to VDD +10 /C004215 to +25 /C00421.0 to VDD +0.25 V Iin DC Input Current, per Pin /C003410 mA Iout DC Output Current, per Pin /C003425 mA IDD DC Supply Current, VDD and VSS Pins +25 / /C0042150 mA PD Power Dissipation in Still Air, 5 Seconds Continuous 1200 350* mW Tstg Storage Temperature /C004255 to +125 °C TL Lead Temperature, 1 mm from Case for 10 Seconds 260 °C * Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the limits in the Electrical Characteristics tables. Derating: – 12 mW/°C from 25° to 60°C. * Derating: – 3.5 mW/°C from 25° to 60°C. This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high–impedance circuit. For proper operation, Vin and Vout should be constrained to the range VSS ≤ (Vin or Vout) ≤ VDD except for the I/O, which can exceed VDD , and the Test input, which can go below VSS . Unused inputs must always be tied to an appropriate logic voltage level (e.g., either VSS or VDD ). Unused outputs and/or an unused I/O must be left open. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0067/C0049/C0052/C0053/C0048/C0049/C0049 4–36 Motorola Sensor Device Datawww.motorola.com/semiconductors ELECTRICAL CHARACTERISTICS (TA = – 10 to 60°C Unless Otherwise Indicated, Voltages Referenced to VSS ) Symbol Parameter Test Condition VDD V Min Max Unit VDD Power Supply Voltage Range — 6.0 12 V VTH Supply Threshold Voltage, Low–Supply Alarm Low–Supply Trip: Vin = VDD /3 — 6.5 7.8 V IDD Average Operating Supply Current, Excluding the Visible LED Current (per Package) Standby Configured per Figure 5 12.0 — 12 µA iDD Peak Supply Current , Excluding the Visible LED Current (per Package) During Strobe On, IRED Off Configured per Figure 5 12.0 — 2.0 mA During Strobe On, IRED On Configured per Figure 5 12.0 — 3.0 VIL Low–Level Input Voltage I/O Feedback Test 9.0 9.0 9.0 1.5 2.7 7.0 V VIH High–Level Input Voltage I/O Feedback Test 9.0 9.0 9.0 3.2 6.3 8.5 V Iin Input Current Osc, Detect Low–Supply Trip Feedback Vin = VSS or VDD Vin = VSS or VDD Vin = VSS or VDD 12.0 12.0 12.0 ± 100 ± 100 ± 100 nA IIL Low–Level Input Current Test Vin = VSS 12.0 — – 1 µA IIH Pull–Down Current Test I/O Vin = VDD No Local Smoke, Vin = VDD No Local Smoke, Vin = 17 V 9.0 9.0 12.0 0.5 100 140 µA VOL Low–Level Output Voltage LED Silver, Brass Iout = 10 mA Iout = 16 mA 6.5 6.5 0.6 1.0 V VOH High–Level Output Voltage Silver, BrassIout = – 16 mA 6.5 5.5 — V Vout Output Voltage Strobe (For Line Regulation, see Pin Descriptions) Inactive, Iout = –1 µA Active, Iout = 100 µA to 500 µA (Load Regulation) 9.0 VDD – 0.1 VDD – 4.4 VDD – 5.6 V IRED Inactive, Iout = 1 µA Active, Iout = 6 mA (Load Regulation) 9.0 2.25* 0.1 3.75* IOH High–Level Output Current I/O Local Smoke, Vout = 4.5 V 6.5 – 4 — mA Local Smoke, Vout = VSS (Short Circuit Current) 12.0 — – 16 IOZ Off–State Output Leakage Current LED Vout = VSS or VDD 12.0 — ± 1 µA VIC Common Mode C1, C2, Detect Voltage Range Local Smoke, Pushbutton Test, or Chamber Sensitivity Test — VDD – 4 VDD – 2 V Vref Smoke Comparator Internal Reference Voltage Local Smoke, Pushbutton Test, or Chamber Sensitivity Test — VDD – 3.08VDD – 3.92 V *TA = 25°C only. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0067/C0049/C0052/C0053/C0048/C0049/C0049 4–37Motorola Sensor Device Data www.motorola.com/semiconductors AC ELECTRICAL CHARACTERISTICS (Reference Timing Diagram Figures 3 and 4) (TA = 25°C, VDD = 9.0 V, Component Values from Figure 5: R1 = 100.0 KΩ , C3 = 1500.0 pF, R2 = 10.0 MΩ ) No. Symbol Parameter Test Condition Min Max Unit 1 1/fosc Oscillator Period* Free–Running Sawtooth Measured at Pin 12 9.5 11.5 ms 2 tLED LED Status No Local Smoke, and No Remote Smoke Illuminated

4 Local Smoke or Pushbutton

5 tw(stb) Strobe Pulse Width 9.5 11.5 ms 6 tIRED IRED Pulse Period Smoke Test 9.67 11.83 s 38.9 47.1 8 Pushbutton Test 0.302 0.370 9 tw(IRED) IRED Pulse Width 94 116 µs 10 tr IRED Rise Time — 30 µs tf IRED Fall Time — 200 11 tmod Silver and Brass Modulation Period Local or Remote Smoke 297 363 ms 11, 12 ton/tmod Silver and Brass Duty Cycle Local or Remote Smoke 73 77 % 13 tCH Silver and Brass Chirp Pulse Period Low Supply or Degraded Chamber Sensitivity 38.9 47.1 s 14 tw(CH) Silver and Brass Chirp Pulse Width Low Supply or Degraded Chamber Sensitivity 9.5 11.5 ms 15 tRR Rising Edge on I/O to Smoke Alarm Response TimeRemote Smoke, No Local Smoke — 800 ms 16 tstb Strobe Pulse Period Smoke Test 9.67 11.83 s 38.9 47.1 38.9 47.1 19 Pushbutton Test 0.302 0.370 * Oscillator period T (= Tr + Tf) is determined by the external components R1, R2, and C3 where Tr = (0.6931) R2 C3 and Tf = (0.6931) R1 C3. The other timing characteristics are some multiple of the oscillator timing as shown in the table. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

NOTE: Includes external component variations. See Figure 2B. NOTE: These components were used to generate Figure 2A. Freescale Semiconductor, Inc.

NOTES: Numbers refer to the AC Electrical Characteristics Table. Illustration is not to scale. Freescale Semiconductor, Inc.

1 TO 22 µF

H Values for R4, R5, and C6 may differ depending on type of piezoelectric horn used.

C2 and R13 are used for coarse sensitivity adjustment. Typical values are shown.

is used, noise pickup is increased due to antenna effects. Shielding may be required. ** C4 should be 22 µF if supply line resistance is high (up to 50 Ω ). C4 could be reduced to 1 µF when supply line resistance is < 30 Ω. Figure 5. Typical Application of the closed–loop gain should not exceed 10,000. during pushbutton or chamber sensitivity tests. [1/(12√C2 )] – 680 where R14 is in ohms and C2 is in farads. pin must be minimized, also. See Figure 6. Freescale Semiconductor, Inc.

/C0077/C0067/C0049/C0052/C0053/C0048/C0049/C0049 4–42 Motorola Sensor Device Datawww.motorola.com/semiconductors VDD (Pin 5) This pin is connected to the positive supply potential and may range from + 6 to + 12 V with respect to VSS . IRED (Pin 6) This output provides pulsed base current for external NPN transistor Q1 used as the infrared emitter driver. Q1 must have β ≥ 100. At 10 mA, the temperature coefficient of the output voltage is typically + 0.5%/°C from – 10° to 60°C. The supply–voltage coefficient (line regulation) is ± 0.2%/V maxi- mum from 6 to 12 V. The IRED pulse width (active–high) is determined by external components R1 and C3. With a 100 kΩ /1500 pF combination, the nominal width is 105 µs. To minimize noise impact, IRED is not active when the vis- ible LED and horn outputs are active. IRED is active near the end of Strobe pulses for Smoke Tests, Chamber Sensitivity Test, and Pushbutton Test. I/O (Pin 7) This pin can be used to connect up to 40 units together in a wired–OR configuration for common signaling. VSS is used as the return. An on–chip current sink minimizes noise pick up during non–smoke conditions and eliminates the need for an external pull–down resistor to complete the wired–OR. Remote units at lower supply voltages do not draw excessive current from a sending unit at a higher supply voltage. I/O can also be used to activate escape lights, auxiliary alarms, remote alarms, and/or auto–dialers. As an input, this pin feeds a positive–edge–triggered flip– flop whose output is sampled nominally every 625 ms during standby (using the recommended component values). A local–smoke condition or the pushbutton–test mode forces this current–limited output to source current. All input signals are ignored when I/O is sourcing current. I/O is disabled by the on–chip power–on reset to elimi- nate nuisance signaling during battery changes or system power–up. If unused, I/O must be left unconnected. BRASS (Pin 8) This half of the push–pull driver output is connected to the metal support electrode of a piezoelectric audio trans- ducer and to the horn–starting resistor. A continuous mod- ulated tone from the transducer is a smoke alarm indicating either local or remote smoke. A short beep or chirp is a trouble alarm indicating a low supply or degraded chamber sensitivity. SILVER (Pin 9) This half of the push–pull driver output is connected to the ceramic electrode of a piezoelectric transducer and to the horn–starting capacitor. FEEDBACK (Pin 10) This input is connected to both the feedback electrode of a self–resonating piezoelectric transducer and the horn–start- ing resistor and capacitor through current–limiting resistor R4. If unused, this pin must be tied to VSS or VDD . LED (Pin 11) This active–low open–drain output directly drives an exter- nal visible LED. The load for the low–supply test is applied by this output. This low–supply test is non–coincident with the smoke tests, chamber sensitivity test, pushbutton test, or any alarm signals. The LED also provides a visual indication of the detector status as follows, assuming the component values shown in Figure 5: Standby (includes low–supply and chamber sensitivity tests) — constantly illuminated Local Smoke — constantly extinguished Remote Smoke — constantly illuminated Pushbutton Test — constantly extinguished (system OK); constantly illuminated (system problem) OSC (Pin 12) This pin is used in conjunction with external resistor R2 (10 MΩ ) to VDD and external capacitor C3 (1500 pF) to VDD to form an oscillator with a nominal period of 10.5 ms. R1 (Pin 13) This pin is used in conjunction with resistor R1 (100 kΩ ) to pin 12 and C3 (1500 pF, see pin 12 description) to determine the IRED pulse width. With this RC combination, the nominal pulse width is 105 µs. VSS (Pin 14) This pin is the negative supply potential and the return for the I/O pin. Pin 14 is usually tied to ground. LOW–SUPPLY TRIP (Pin 15) This pin is connected to an external voltage which deter- mines the low–supply alarm threshold. The trip voltage is obtained through a resistor divider connected between the VDD and LED pins. The low–supply alarm threshold voltage (in volts) ≈ (5R7/R6) + 5 where R6 and R7 are in the same units. TEST (Pin 16) This input has an on–chip pull–down device and is used to manually invoke a test mode. The Pushbutton Test mode is initiated by a high level at pin 16 (usually depression of a S.P.S.T. normally–open pushbut- ton switch to VDD ). After one oscillator cycle, IRED pulses approximately every 336 ms, regardless of the presence of smoke. Additionally, the amplifier gain is increased by auto- matic selection of C1. Therefore, the background reflections in the smoke chamber may be interpreted as smoke, gener- ating a simulated–smoke condition. After the second IRED pulse, a successful test activates the horn–driver and I/O cir- cuits. The active I/O allows remote signaling for system test- ing. When the Pushbutton Test switch is released, the Test input returns to VSS due to the on–chip pull–down device. Af- ter one oscillator cycle, the amplifier gain returns to normal, thereby removing the simulated–smoke condition. After two additional IRED pulses, less than a second, the IC exits the alarm mode and returns to standby timing. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

floated for at least one OSC cycle. one for every OSC cycle. Also, Strobe is always active low. Low–Supply Trip. The amp’s output appears as pulses and is referenced to VDD . Low–Supply Trip 15 If the I/O pin is high, pin 15 controls which gain capacitor is used. Low: normal gain, amp output on pin 1. High: supervisory gain, amp output on pin 2. Feedback 10 Driving this input high enables hysteresis (10% gain increase) in the photo amp; pin 15 must be low. that smoke has been detected. A static low level indicates no smoke. “on” (static high level) and 2 consecutive no–detections for “off” (static low level). NOTES: Illustration is bottom view of layout using a DIP. Top view for SOIC layout is mirror image. Optional potentiometer R9 is not included. Leads on D1, R11, R8, and R10 and their associated traces must be kept as short as possible. This practice minimizes noise pick up. Pin 3 must be decoupled from all other traces. Freescale Semiconductor, Inc.

4–44 Motorola Sensor Device Datawww.motorola.com/semiconductors /C0080/C0104/C0111/C0116/C0111/C0101/C0108/C0101/C0099/C0116/C0114/C0105/C0099 /C0083/C0109/C0111/C0107/C0101 /C0068/C0101/C0116/C0101/C0099/C0116/C0111/C0114/C0073/C0067 /C0119/C0105/C0116/C0104 /C0073/C0047/C0079 /C0097/C0110/C0100 /C0084/C0101/C0109/C0112/C0111/C0114/C0097/C0108 /C0080/C0097/C0116/C0116/C0101/C0114/C0110 /C0072/C0111/C0114/C0110 /C0068/C0114/C0105/C0118/C0101/C0114 The CMOS MC145012 is an advanced smoke detector component containing sophisticated very–low–power analog and digital circuitry. The IC is used with an infrared photoelectric chamber. Detection is accomplished by sensing scattered light from minute smoke particles or other aerosols. When detection occurs, a pulsating alarm is sounded via on–chip push–pull drivers and an external piezoelectric transducer. The variable–gain photo amplifier allows direct interface to IR detectors (photodiodes). Two external capacitors, C1 and C2, C1 being the larger, determine the gain settings. Low gain is selected by the IC during most of the standby state. Medium gain is selected during a local–smoke condition. High gain is used during pushbutton test. During standby, the special monitor circuit which periodically checks for degraded chamber sensitivity uses high gain also. The I/O pin, in combination with VSS , can be used to interconnect up to 40 units for common signaling. An on–chip current sink provides noise immunity when the I/O is an input. A local–smoke condition activates the short–circuit– protected I/O driver, thereby signaling remote smoke to the interconnected units. Additionally, the I/O pin can be used to activate escape lights, enable auxiliary or remote alarms, and/or initiate auto–dialers. While in standby, the low–supply detection circuitry conducts periodic checks using a pulsed load current from the LED pin. The trip point is set using two external resistors. The supply for the MC145012 can be a 9 V battery. A visible LED flash accompanying a pulsating audible alarm indicates a local–smoke condition. A pulsating audible alarm with no LED flash indicates a remote–smoke condition. A beep or chirp occurring virtually simultaneously with an LED flash indicates a low–supply condition. A beep or chirp occurring halfway between LED flashes indicates degraded chamber sensitivity. A low–supply condition does not affect the smoke detection capability if VDD ≥ 6 V. Therefore, the low–supply condition and degraded chamber sensitivity can be further distinguished by performing a pushbutton (chamber) test.

Circuit is designed to operate in smoke detector systems that comply with UL217 and UL268 Specifications
Operating Voltage Range: 6 to 12 V
Operating Temperature Range: – 10 to 60°C
Average Supply Current: 8 µA
I/O Pin Allows Units to be Interconnected for Common Signalling
Power–On Reset Places IC in Standby Mode (Non–Alarm State)
Electrostatic Discharge (ESD) and Latch Up Protection Circuitry on All Pins
Chip Complexity: 2000 FETs, 12 NPNs, 16 Resistors, and 10 Capacitors
Supports NFPA 72, ANSI S3.41, and ISO 8201 Audible Emergency Evacuation Signals
Ideal for battery–powered applications /C0077/C0079/C0084/C0079/C0082/C0079/C0076/C0065 SEMICONDUCTOR TECHNICAL DATA /C0077/C0067/C0049/C0052/C0053/C0048/C0049/C0050 P SUFFIX PLASTIC DIP CASE 648–08 PIN ASSIGNMENT Detect Strobe VDD IRED I/O Brass Test Low–Supply Trip VSS Osc LED Feedback Silver

CASE 751G–03 REV 4 Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0067/C0049/C0052/C0053/C0048/C0049/C0050 4–45Motorola Sensor Device Data www.motorola.com/semiconductors BLOCK DIAGRAM –DETECT OSC TEST STROBE LOW–SUPPLY TRIP C1 C2 OSC AMP COMP COMP ALARM LOGIC TEMPORAL PATTERN HORN MODULATOR AND DRIVER VDD – 5 V REF TIMING LOGIC VDD – 3.5 V REF ZERO GAIN LOW SUPPLY SMOKE GATE ON/OFF GATE ON/OFF PIN 5 = VDD PIN 14 = VSS LED IRED FEEDBACK SILVER BRASS I/O MAXIMUM RATINGS* (Voltages referenced to VSS ) Symbol Parameter Value Unit VDD DC Supply Voltage /C00420.5 to +12 V Vin DC Input Voltage C1, C2, Detect Osc, Low–Supply Trip I/O Feedback Test /C00420.25 to VDD +0.25 /C00420.25 to VDD +0.25 /C00420.25 to VDD +10 /C004215 to +25 /C00421.0 to VDD +0.25 V Iin DC Input Current, per Pin /C003410 mA Iout DC Output Current, per Pin /C003425 mA IDD DC Supply Current, VDD and VSS Pins +25 / /C0042150 mA PD Power Dissipation in Still Air, 5 Seconds Continuous 1200 350* mW Tstg Storage Temperature /C004255 to +125 °C TL Lead Temperature, 1 mm from Case for 10 Seconds 260 °C * Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the limits in the Electrical Characteristics tables. Derating: – 12 mW/°C from 25° to 60°C. * Derating: – 3.5 mW/°C from 25° to 60°C. This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high–impedance circuit. For proper operation, Vin and Vout should be constrained to the range VSS ≤ (Vin or Vout) ≤ VDD except for the I/O, which can exceed VDD , and the Test input, which can go below VSS . Unused inputs must always be tied to an appropriate logic voltage level (e.g., either VSS or VDD ). Unused outputs and/or an unused I/O must be left open. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0067/C0049/C0052/C0053/C0048/C0049/C0050 4–46 Motorola Sensor Device Datawww.motorola.com/semiconductors ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS , TA = – 10 to 60°C Unless Otherwise Indicated) Symbol Parameter Test Condition VDD V Min Max Unit VDD Power Supply Voltage Range — 6 12 V VTH Supply Threshold Voltage, Low–Supply Alarm Low–Supply Trip: Vin = VDD /3 — 6.5 7.8 V IDD Average Operating Supply Current (per Package) (Does Not Include Current through D3–IR Emitter) Standby Configured per Figure 5 12.0 — 8.0 µA iDD Peak Supply Current (per Package) (Does Not Include IRED Current into Base of Q1) During Strobe On, IRED Off Configured per Figure 5 12.0 — 2.0 mA of Q1) During Strobe On, IRED On Configured per Figure 5 12.0 — 3.0 VIL Low–Level Input Voltage I/O Feedback Test 9.0 9.0 9.0 1.5 2.7 7.0 V VIH High–Level Input Voltage I/O Feedback Test 9.0 9.0 9.0 3.2 6.3 8.5 V Iin Input Current OSC, Detect Low–Supply Trip Feedback Vin = VSS or VDD Vin = VSS or VDD Vin = VSS or VDD 12.0 12.0 12.0 ± 100 ± 100 ± 100 nA IIL Low–Level Input Current Test Vin = VSS 12.0 – 100 – 1 µA IIH Pull–Down Current Test I/O Vin = VDD No Local Smoke, Vin = VDD No Local Smoke, Vin = 17 V 9.0 9.0 12.0 0.5 100 140 µA VOL Low–Level Output Voltage LED Silver, Brass Iout = 10 mA Iout = 16 mA 6.5 6.5 0.6 1.0 V VOH High–Level Output Voltage Silver, BrassIout = – 16 mA 6.5 5.5 — V Vout Output Voltage Strobe (For Line Regulation, See Pin Descriptions) Inactive, Iout = 1 µA Active, Iout = 100 µA to 500 µA (Load Regulation) 9.0 VDD – 0.1 VDD – 4.4 VDD – 5.6 V IRED Inactive, Iout = 1 µA Active, Iout = 6 mA (Load Regulation) 9.0 2.25* 0.1 3.75* IOH High–Level Output Current I/O Local Smoke, Vout = 4.5 V 6.5 – 4 — mA Local Smoke, Vout = VSS (Short Circuit Current) 12.0 — – 16 IOZ Off–State Output Leakage Current LED Vout = VSS or VDD 12.0 — ± 1 µA VIC Common Mode C1, C2, Detect Voltage Range Local Smoke, Pushbutton Test, or Chamber Sensitivity Test — VDD – 4 VDD – 2 V Vref Smoke Comparator Internal Reference Voltage Local Smoke, Pushbutton Test, or Chamber Sensitivity Test — VDD – 3.08VDD – 3.92 V *TA = 25°C only. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0067/C0049/C0052/C0053/C0048/C0049/C0050 4–47Motorola Sensor Device Data www.motorola.com/semiconductors AC ELECTRICAL CHARACTERISTICS (Reference Timing Diagram Figures 3 and 4) (TA = 25°C, VDD = 9.0 V, Component Values from Figure 5: R1 = 100.0 KΩ , C3 = 1500.0 pF, R2 = 7.5 MΩ ) No. Symbol Parameter Test Condition Clocks Min* Typ** Max* Unit 1 1/fosc Oscillator Period Free–Running Sawtooth Measured at Pin 12 1 7.0 7.9 8.6 ms 2 tLED LED Pulse Period No Local Smoke, and No Remote Smoke 4096 28.8 32.4 35.2 s — Extinguished 4 Local Smoke 64 0.45 0.5 0.55 5 Pushbutton Test 64 0.45 0.5 0.55 6 tw(LED), tw(stb) LED Pulse Width and Strobe Pulse Width 1 7.0 — 8.6 ms 7 tIRED IRED Pulse Period Smoke Test 1024 7.2 8.1 8.8 s 8 tIRED IRED Pulse Period Chamber Sensitivity Test, without Local Smoke 4096 28.8 32.4 35.2 s 9 Pushbutton Test 128 0.9 1 1.1 10 tw(IRED) IRED Pulse Width Tf* 94 116 µs 11 tr IRED Rise Time — — 30 µs 12 tf IRED Fall Time — — 200 13 ton Silver and Brass Temporal Mdlt i Pl Width 64 0.45 0.5 0.55 s 14 toff M odulation Pulse Width 0.45 0.5 0.55 15 toffd 192 1.35 1.52 1.65 16 tCH Silver and Brass Chirp Pulse Period Low Supply or Degraded Chamber Sensitivity 4096 28.8 32.4 35.2 s 17 twCH Silver and Brass Chirp Pulse Width 1 7.0 7.9 8.6 ms 18 tRR Rising Edge on I/O to Smoke Alarm Response Time Remote Smoke, No Local Smoke — — 2 ! — s 19 tstb Strobe Out Pulse Period Smoke Test 1024 7.2 8.1 8.8 s

20 Chamber Sensitivity Test,

4096 28.8 32.4 35.2

21 Low Supply Test,

4096 28.8 32.4 35.2

22 Pushbutton Test — — 1 —

Oscillator period T (= Tr + Tf) is determined by the external components R1, R2, and C3 where Tr = (0.6931) R2 * C3 and Tf = (0.6931) R1 * C3. The other timing characteristics are some multiple of the oscillator timing as shown in the table. The timing shown should accomodate the NFPA 72, ANSI S3.41, and ISO 8201 audible emergency evacuation signals. ** Typicals are not guaranteed. !Time is typical — depends on what point in cycle signal is applied. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

NOTE: Includes external component variations. See Figure 2B. NOTE: These components were used to generate Figure 2A.

7.5 MΩ CARBON COMPOSITION

Freescale Semiconductor, Inc.

Figure 3. Typical Standby Timing NOTES: Numbers refer to the AC Electrical Characteristics Table. Illustration is not to scale. Freescale Semiconductor, Inc.

Figure 4. Typical Local Smoke Timing NOTES: Numbers refer to the AC Electrical Characteristics Table. Illustration is not to scale. Freescale Semiconductor, Inc.

#Values for R4, R5, and C6 may differ depending on type of piezoelectric horn used.

C2 and R13 are used for coarse sensitivity adjustment. Typical values are shown.

†R9 is for fine sensitivity adjustment (optional). If fixed resistors are used, R8 = 12 k, R10 is 5.6 k to 10 k, and R9 is eliminated. When R9 is used, noise pickup is increased due to antenna effects. Shielding may be required. **C4 should be 22 µF if B1 is a carbon battery. C4 could be reduced to 1 µF when an alkaline battery is used. of the closed–loop gain should not exceed 10,000. during pushbutton or chamber sensitivity tests. [1/(12√C2 )] – 680 where R14 is in ohms and C2 is in farads. pin must be minimized, also. See Figure 6. Freescale Semiconductor, Inc.

/C0077/C0067/C0049/C0052/C0053/C0048/C0049/C0050 4–52 Motorola Sensor Device Datawww.motorola.com/semiconductors VDD (Pin 5) This pin is connected to the positive supply potential and may range from + 6 to + 12 V with respect to VSS CAUTION: In battery–powered applications, reverse–polar- ity protection must be provided externally. IRED (Pin 6) This output provides pulsed base current for external NPN transistor Q1 used as the infrared emitter driver. Q1 must have β ≥ 100. At 10 mA, the temperature coefficient of the output voltage is typically + 0.5%/°C from – 10° to 60°C. The supply–voltage coefficient (line regulation) is ± 0.2%/V maxi- mum from 6 to 12 V. The IRED pulse width (active–high) is determined by external components R1 and C3. With a 100 kΩ /1500 pF combination, the nominal width is 105 µs. To minimize noise impact, IRED is not active when the vis- ible LED and horn outputs are active. IRED is active near the end of strobe pulses for smoke tests, chamber sensitivity test, and pushbutton test. I/O (Pin 7) This pin can be used to connect up to 40 units together in a wired–OR configuration for common signaling. VSS is used as the return. An on–chip current sink minimizes noise pick up during non–smoke conditions and eliminates the need for an external pull–down resistor to complete the wired–OR. Remote units at lower supply voltages do not draw excessive current from a sending unit at a higher supply voltage. I/O can also be used to activate escape lights, auxiliary alarms, remote alarms, and/or auto–dialers. As an input, this pin feeds a positive–edge–triggered flip– flop whose output is sampled nominally every 1 second dur- ing standby (using the recommended component values). A local–smoke condition or the pushbutton–test mode forces this current–limited output to source current. All input signals are ignored when I/O is sourcing current. I/O is disabled by the on–chip power–on reset to eliminate nuisance signaling during battery changes or system power– up. If unused, I/O must be left unconnected. BRASS (Pin 8) This half of the push–pull driver output is connected to the metal support electrode of a piezoelectric audio transducer and to the horn–starting resistor. A continuous modulated tone from the transducer is a smoke alarm indicating either local or remote smoke. A short beep or chirp is a trouble alarm indicating a low supply or degraded chamber sensitiv- ity. SILVER (Pin 9) This half of the push–pull driver output is connected to the ceramic electrode of a piezoelectric transducer and to the horn–starting capacitor. FEEDBACK (Pin 10) This input is connected to both the feedback electrode of a self–resonating piezoelectric transducer and the horn–start- ing resistor and capacitor through current–limiting resistor R4. If unused, this pin must be tied to VSS or VDD . LED (Pin 11) This active–low open–drain output directly drives an exter- nal visible LED at the pulse rates indicated below. The pulse width is equal to the OSC period. The load for the low–supply test is applied by this output. This low–supply test is non–coincident with the smoke tests, chamber sensitivity test, pushbutton test, or any alarm sig- nals. The LED also provides a visual indication of the detector status as follows, assuming the component values shown in Figure 5: Standby (includes low–supply and chamber sensitivity tests) — Pulses every 32.4 seconds (typical) Local Smoke — Pulses every 0.51 seconds (typical) Remote Smoke — No pulses Pushbutton Test — Pulses every 0.51 seconds (typical) OSC (Pin 12) This pin is used in conjunction with external resistor R2 (7.5 MΩ ) to VDD and external capacitor C3 (1500 pF) to VDD to form an oscillator with a nominal period of 7.9 ms (typical). R1 (Pin 13) This pin is used in conjunction with resistor R1 (100 kΩ ) to Pin 12 and C3 (1500 pF, see Pin 12 description) to determine the IRED pulse width. With this RC combination, the nominal pulse width is 105 µs. VSS (Pin 14) This pin is the negative supply potential and the return for the I/O pin. Pin 14 is usually tied to ground. LOW–SUPPLY TRIP (Pin 15) This pin is connected to an external voltage which deter- mines the low–supply alarm threshold. The trip voltage is obtained through a resistor divider connected between the VDD and LED pins. The low–supply alarm threshold voltage (in volts) ≈ (5R7/R6) + 5 where R6 and R7 are in the same units. TEST (Pin 16) This input has an on–chip pull–down device and is used to manually invoke a test mode. The Pushbutton Test mode is initiated by a high level at Pin 16 (usually depression of a S.P.S.T. normally–open pushbut- ton switch to VDD ). After one oscillator cycle, IRED pulses approximately every 1.0 second, regardless of the presence of smoke. Additionally, the amplifier gain is increased by automatic selection of C1. Therefore, the background reflec- tions in the smoke chamber may be interpreted as smoke, generating a simulated–smoke condition. After the second IRED pulse, a successful test activates the horn–driver and I/O circuits. The active I/O allows remote signaling for system testing. When the Pushbutton Test switch is released, the Test input returns to VSS due to the on–chip pull–down device. After one oscillator cycle, the amplifier gain returns to normal, thereby removing the simulated–smoke condition. After two additional IRED pulses, less than three seconds, the IC exits the alarm mode and returns to standby timing. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

floated for at least one OSC cycle. one for every OSC cycle. Also, Strobe is always active low. Low–Supply Trip. The amp’s output appears as pulses and is referenced to VDD etc. Low–Supply Trip 15 If the I/O pin is high, Pin 15 controls which gain capacitor is used. Low: normal gain, amp output on Pin 1. High: supervisory gain, amp output on Pin 2. Feedback 10 Driving this input high enables hysteresis (10% gain increase) in the photo amp; Pin 15 must be low. that smoke has been detected. A static low level indicates no smoke. “on” (static high level) and 2 consecutive no–detections for “off” (static low level). NOTES: Illustration is bottom view of layout using a DIP. Top view for SOIC layout is mirror image. Optional potentiometer R9 is not included. Leads on D2, R11, R8, and R10 and their associated traces must be kept as short as possible. This practice minimizes noise pick up. Pin 3 must be decoupled from all other traces. Freescale Semiconductor, Inc.

4–54 Motorola Sensor Device Datawww.motorola.com/semiconductors Low–Power CMOS /C0073/C0111/C0110/C0105/C0122/C0097/C0116/C0105/C0111/C0110 /C0083/C0109/C0111/C0107/C0101 /C0068/C0101/C0116/C0101/C0099/C0116/C0111/C0114 /C0073/C0067 /C0119/C0105/C0116/C0104 /C0084/C0101/C0109/C0112/C0111/C0114/C0097/C0108 /C0080/C0097/C0116/C0116/C0101/C0114/C0110 /C0072/C0111/C0114/C0110 /C0068/C0114/C0105/C0118/C0101/C0114 The MC145017, when used with an ionization chamber and a small number of external components, will detect smoke. When smoke is sensed, an alarm is sounded via an external piezoelectric transducer and internal drivers. This circuit is designed to operate in smoke detector systems that comply with UL217 and UL268 specifications.

Ionization Type with On–Chip FET Input Comparator
Piezoelectric Horn Driver
Guard Outputs on Both Sides of Detect Input
Input–Production Diodes on the Detect Input
Low–Battery Trip Point, Internally Set, can be Altered Via External Resistor
Detect Threshold, Internally Set, can be Altered Via External Resistor
Pulse Testing for Low Battery Uses LED for Battery Loading
Comparator Outputs for Detect and Low Battery
Internal Reverse Battery Protection
Supports NFPA 72, ANSi 53.41, and ISO 8201 Audible Emergency Evacuation Signals MAXIMUM RATINGS* (Voltages referenced to VSS ) Rating Symbol Value Unit DC Supply Voltage VDD /C00420.5 to + 15 V Input Voltage, All Inputs Except Pin 8 Vin /C00420.25 to VDD + 0.25 V DC Current Drain per Input Pin, Except Pin 15 = 1 mA I 10 mA DC Current Drain per Output Pin I 30 mA Operating Temperature Range TA /C004210 to + 60 °C Storage Temperature Range Tstg /C004255 to + 125 °C Reverse Battery Time tRB 5.0 s * Maximum Ratings are those values beyond which damage to the device may occur. This device contains circuitry to protect the inputs against damage due to high static voltages or electric fields; however, it is advised that normal precautions be taken to avoid application of any voltage higher than maximum rated voltages to this high impedance circuit. For proper operation it is recommended that Vin and Vout be constrained to the range VSS /C0118 (Vin or Vout) /C0118VDD . /C0077/C0079/C0084/C0079/C0082/C0079/C0076/C0065 SEMICONDUCTOR TECHNICAL DATA /C0077/C0067/C0049/C0052/C0053/C0048/C0049/C0055 P SUFFIX PLASTIC DIP CASE 648–08 PIN ASSIGNMENT (16 PIN DIP) Detect Comp. Out N/C Low V Set Low V Comp. Out LED VDD Timing Resistor Feedback Guard Hi–Z Detect Input Guard Lo–Z Sensitivity Set Osc Capacitor Silver Brass VSS

iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0067/C0049/C0052/C0053/C0048/C0049/C0055 4–55Motorola Sensor Device Data www.motorola.com/semiconductors RECOMMENDED OPERATING CONDITIONS (Voltages referenced to VSS ) Parameter Symbol Value Unit Supply Voltage VDD 9.0 V Timing Capacitor — 0.1 µF Timing Resistor — 8.2 M Ω Battery Load (Resistor or LED) — 10 mA ELECTRICAL CHARACTERISTICS (Voltages referenced to VSS , TA = 25°C) Characteristic Symbol VDD Vdc Min Typ Max Unit Operating Voltage VDD — 6.0 — 12 V Output Voltage Piezoelectric Horn Drivers (IOH = /C004216 mA) Comparators (IOH = /C004230 µA) Piezoelectric Horn Drivers (IOL = +16 mA) Comparators (IOL = +30 µA) VOH VOL 7.2 9.0 7.2 9.0 6.3 8.5 8.8 0.1 0.9 0.5 V V Output Voltage — LED Driver, IOL = 10 mA VOL 7.2 — — 3.0 V Output Impedance, Active Guard Pin 14 Pin 16 Lo–Z Hi–Z 9.0 9.0 1000 kΩ Operating Current (Rbias = 8.2 MΩ ) IDD 9.0 12.0 3.2 7.0 10.0 µA Input Current — Detect (40% R.H.) Iin 9.0 — — /C00341.0 pA Input Current, Pin 8 Iin 9.0 — — /C00340.1 µA Input Current @ 50°C, Pin 15 Iin — — — /C00346.0 pA Internal Set Voltage Low Battery Sensitivity Vlow Vset 9.0 7.2 7.8 V %V DD Hysteresis vhys 9.0 75 100 150 mV Offset Voltage (measured at Vin = VDD/2) Active Guard Detect Comparator VOS 9.0 9.0 /C0034100 /C003450 mV Input Voltage Range, Pin 8 Vin — VSS /C004210 — VDD + 10 V Input Capacitance C in — — 5.0 — pF Common Mode Voltage Range, Pin 15 Vcm — 0.6 — VDD /C00422 V # Data labelled “Typ’’ is not to be used for design purposes but is intended as an indication of the IC’s potential performance. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

Freescale Semiconductor, Inc.

has internal diode protection against static damage. strobe, chip current rises to approximately 50 µA. *NOTE: Component values may change depending on type of piezoelectric horn used. Freescale Semiconductor, Inc.

Figure 6. MC145017 Timing Diagram

Horn modulation is self–completing. When going from smoke to no smoke, the alarm condition will terminate only when horn is off.
Comparators are strobed once per cycle (1.65 sec for no smoke, 40 msec for smoke).

Figure 7. Horn Modulation

0.5 SEC

Freescale Semiconductor, Inc.

4–60 Motorola Sensor Device Datawww.motorola.com/semiconductors Low–Power CMOS /C0073/C0111/C0110/C0105/C0122/C0097/C0116/C0105/C0111/C0110 /C0083/C0109/C0111/C0107/C0101 /C0068/C0101/C0116/C0101/C0099/C0116/C0111/C0114 /C0073/C0067 /C0119/C0105/C0116/C0104 /C0073/C0110/C0116/C0101/C0114/C0099/C0111/C0110/C0110/C0101/C0099/C0116 /C0097/C0110/C0100 /C0084/C0101/C0109/C0112/C0111/C0114/C0097/C0108 /C0072/C0111/C0114/C0110 /C0068/C0114/C0105/C0118/C0101/C0114 The MC145018, when used with an ionization chamber and a small number of external components, will detect smoke. When smoke is sensed, an alarm is sounded via an external piezoelectric transducer and internal drivers. This circuit is designed to operate in smoke detector systems that comply with UL217 and UL268 specifications.

Ionization Type with On–Chip FET Input Comparator
Piezoelectric Horn Driver
Guard Outputs on Both Sides of Detect Input
Input–Protection Diodes on the Detect Input
Low–Battery Trip Point, Internally Set, can be Altered Via External Resistor
Detect Threshold, Internally Set, can be Altered Via External Resistor
Pulse Testing for Low Battery Uses LED for Battery Loading
Comparator Output for Detect
Internal Reverse Battery Protection
Strobe Output for External Trim Resistors
I/O Pin Allows Up to 40 Units to be Connected for Common Signaling
Supports NFPA 72, ANSi 53.41, and ISO 8201 Audible Emergency Evacuation Signals
Power–On Reset Places IC in Standby Mode MAXIMUM RATINGS* (Voltages referenced to VSS ) Rating Symbol Value Unit DC Supply Voltage VDD /C00420.5 to + 15 V Input Voltage, All Inputs Except Pin 8 Vin /C00420.25 to VDD + 0.25 V DC Current Drain per Input Pin, Except Pin 15 = 1 mA I 10 mA DC Current Drain per Output Pin I 30 mA Operating Temperature Range TA /C004210 to + 60 °C Storage Temperature Range Tstg /C004255 to + 125 °C Reverse Battery Time tRB 5.0 s * Maximum Ratings are those values beyond which damage to the device may occur. This device contains circuitry to protect the inputs against damage due to high static voltages or electric fields; however, it is advised that normal precautions be taken to avoid application of any voltage higher than maximum rated voltages to this high impedance circuit. For proper operation it is recommended that Vin and Vout be constrained to the range VSS /C0118 (Vin or Vout) /C0118VDD . /C0077/C0079/C0084/C0079/C0082/C0079/C0076/C0065 SEMICONDUCTOR TECHNICAL DATA /C0077/C0067/C0049/C0052/C0053/C0048/C0049/C0056 P SUFFIX PLASTIC DIP CASE 648–08 PIN ASSIGNMENT (16 PIN DIP) Detect Comp. Out I/O Low V Set Strobe Out LED VDD Timing Resistor Feedback Guard Hi–Z Detect Input Guard Lo–Z Sensitivity Set Osc Capacitor Silver Brass VSS

iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

/C0077/C0067/C0049/C0052/C0053/C0048/C0049/C0056 4–61Motorola Sensor Device Data www.motorola.com/semiconductors RECOMMENDED OPERATING CONDITIONS (Voltages referenced to VSS ) Parameter Symbol Value Unit Supply Voltage VDD 9.0 V Timing Capacitor — 0.1 µF Timing Resistor — 8.2 M Ω Battery Load (Resistor or LED) — 10 mA ELECTRICAL CHARACTERISTICS (Voltages referenced to VSS , TA = 25°C) Characteristic Symbol VDD Vdc Min Typ Max Unit Operating Voltage VDD — 6.0 — 12 V Output Voltage Piezoelectric Horn Drivers (IOH = /C004216 mA) Comparators (IOH = /C004230 µA) Piezoelectric Horn Drivers (IOL = + 16 mA) Comparators (IOL = +30 µA) VOH VOL 7.2 9.0 7.2 9.0 6.3 8.5 8.8 0.1 0.9 0.5 V V Output Voltage — LED Driver, IOL = 10 mA VOL 7.2 — — 3.0 V Output Impedance, Active Guard Pin 14 Pin 16 Lo–Z Hi–Z 9.0 9.0 1000 kΩ Operating Current (Rbias = 8.2 MΩ ) IDD 9.0 12.0 5.0 9.0 12.0 µA Input Current — Detect (40% R.H.) Iin 9.0 — — /C00341.0 pA Input Current, Pin 8 Iin 9.0 — — /C00340.1 µA Input Current @ 50°C, Pin 15 Iin — — — /C00346.0 pA Internal Set Voltage Low Battery Sensitivity Vlow Vset 9.0 7.2 7.8 V %V DD Hysteresis vhys 9.0 75 100 150 mV Offset Voltage (measured at Vin = VDD/2) Active Guard Detect Comparator VOS 9.0 9.0 /C0034100 /C003450 mV Input Voltage Range, Pin 8 Vin — VSS /C004210 — VDD + 10 V Input Capacitance C in — — 5.0 — pF Common Mode Voltage Range, Pin 15 Vcm — 0.6 — VDD /C00422 V I/O Current, Pin 2 Input, VIH = VDD /C00422 Output, VOH = VDD /C00422 IIH IOH /C00424.0 100 /C004216 µA mA # Data labelled “Typ’’ is not to be used for design purposes but is intended as an indication of the IC’s potential performance. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

15 DETECT

Freescale Semiconductor, Inc.

has internal diode protection against static damage. constantly shows smoke/no smoke. Pin 1 = VDD for smoke. rises to approximately 50 µA. Freescale Semiconductor, Inc.

Figure 6. MC145018 Timing Diagram

Horn modulation is self–completing. When going from smoke to no smoke, the alarm condition will terminate only when horn is off.
Comparators are strobed once per cycle (1.65 sec for no smoke, 40 msec for smoke).
For timing under remote conditions, refer to MC14468 data sheet.

Freescale Semiconductor, Inc.

that includes the pin numbers referenced in this document. Figure 1. Alarm IC Concept Figure 2. MC14600 Block Diagram Freescale Semiconductor, Inc.

/C0065/C0078/C0049/C0054/C0057/C0048 4–69Motorola Sensor Device Data www.motorola.com/semiconductors Motorola’s pressure sensors can also provide the input to the MC14600. The MPX5000 series includes a wide variety of compensated and integrated pressure sensors with different pressure ranges, packaging and measurement options. One possible sensor is the MPXV5010. The output of the MPXV5010 can be fed directly into the input of the MC14600 (pin 15). If the latch described above is used with a pressure sensor resistors may be required at the output of the MPXV5010 to scale the output voltage (See Figure 8). This is because the output voltage for pressure sensors in the MPX5000 series under no pressure is 0.2 V, which may be be- low the lowered alarm threshold. (See previous section.) Figure 8. Pressure Detection Circuit VDD OUTPUT TO PIN 15 (ALARM DETECT INPUT) MPXV5010 CONCLUSION The MC14600 offers a simple solution for use in a wide vari- ety of alarm applications. With a high impedance input pin it can be connected to many types of sensor devices. For sen- sor inputs that require a latched alarm condition there are sev- eral simple ways to add this option to the MC14600. It has the feature of not having a predetermined alarm threshold which gives it the flexibility of being set to any level as required by the application. The MC14600 has an internal horn driver that can drive a three leaded piezo horn with the addition of two resis- tors and one capacitor. The MC14600 integrates the features desired in alarm devices into a small and simple package that is still flexible enough for all types of alarm applications. Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

4–72 Motorola Sensor Device Datawww.motorola.com/semiconductors Package Outline Dimensions CASE 648–08 ISSUE R CASE 751G–04 ISSUE D NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. STYLE 1: PIN 1. CATHODE 2. CATHODE 3. CATHODE 4. CATHODE 5. CATHODE 6. CATHODE 7. CATHODE 8. CATHODE 9. ANODE 10. ANODE 11. ANODE 12. ANODE 13. ANODE 14. ANODE 15. ANODE 16. ANODE STYLE 2: PIN 1. COMMON DRAIN 2. COMMON DRAIN 3. COMMON DRAIN 4. COMMON DRAIN 5. COMMON DRAIN 6. COMMON DRAIN 7. COMMON DRAIN 8. COMMON DRAIN 9. GATE 10. SOURCE 11. GATE 12. SOURCE 13. GATE 14. SOURCE 15. GATE 16. SOURCE –A– B F C S H G D J L M 16 PL SEATING 916 K PLANE–T– MAM0.25 (0.010) T DIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.740 0.770 18.80 19.55 B 0.250 0.270 6.35 6.85 C 0.145 0.175 3.69 4.44 D 0.015 0.021 0.39 0.53 F 0.040 0.70 1.02 1.77 G 0.100 BSC 2.54 BSC H 0.050 BSC 1.27 BSC J 0.008 0.015 0.21 0.38 K 0.110 0.130 2.80 3.30 L 0.295 0.305 7.50 7.74 M 0 10 0 10 S 0.020 0.040 0.51 1.01 /C0095/C0095/C0095/C0095 NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 3. DATUMS A AND B TO BE DETERMINED AT THE PLANE WHERE THE BOTTOM OF THE LEADS EXIT THE PLASTIC BODY. 4. THIS DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSION OR GATE BURRS. MOLD FLASH, PROTRUSION OR GATE BURRS SHALL NOT EXCEED 0.15mm PER SIDE. THIS DIMENSION IS DETERMINED AT THE PLANE WHERE THE BOTTOM OF THE LEADS EXIT THE PLASTIC BODY. 5. THIS DIMENSION DOES NOT INCLUDE INTER–LEAD FLASH OR PROTRUSIONS. INTER–LEAD FLASH AND PROTRUSIONS SHALL NOT EXCEED 0.25mm PER SIDE. THIS DIMENSION IS DETERMINED AT THE PLANE WHERE THE BOTTOM OF THE LEADS EXIT THE PLASTIC BODY. 6. THIS DIMENSION DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL NOT CAUSE THE LEAD WIDTH TO EXCEED 0.62mm. 1 16 SEATING PLANE 0.75X45/C0095 M0.25 B 0.4916X BM0.25 A T 10.55 10.05 10.45 10.15 A 7.6 7.4 B PIN 1 INDEX PIN’S NUMBER AA 0.25 1.0 0.4 0 0.32 0.23 SECTION A–A 0.35 2.65 2.35 0.25 0.10 6 T 16X 0.1 T 1.27 14X Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

5–1Motorola Sensor Device Data www.motorola.com/semiconductors /C0065/C0108/C0112/C0104/C0097/C0110/C0117/C0109/C0101/C0114/C0105/C0099 /C0068/C0101/C0118/C0105/C0099/C0101 /C0073/C0110/C0100/C0101/C0120 Section Five Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

5–2 Motorola Sensor Device Datawww.motorola.com/semiconductors Alphanumeric Device Index /C0077/C0067/C0049/C0052/C0052/C0054/C0055/C0044 /C0052/C0045/C0050/C0044 /C0052/C0045/C0051 /C0077/C0067/C0049/C0052/C0052/C0054/C0056/C0044 /C0052/C0045/C0050/C0044 /C0052/C0045/C0057 /C0077/C0067/C0049/C0052/C0053/C0048/C0049/C0048/C0044 /C0052/C0045/C0050/C0044 /C0052/C0045/C0050/C0052 /C0077/C0067/C0049/C0052/C0053/C0048/C0049/C0049/C0044 /C0052/C0045/C0050/C0044 /C0052/C0045/C0051/C0052 /C0077/C0067/C0049/C0052/C0053/C0048/C0049/C0050/C0044 /C0052/C0045/C0050/C0044 /C0052/C0045/C0052/C0052 /C0077/C0067/C0049/C0052/C0053/C0048/C0049/C0055/C0044 /C0052/C0045/C0050/C0044 /C0052/C0045/C0053/C0052 /C0077/C0067/C0049/C0052/C0053/C0048/C0049/C0056/C0044 /C0052/C0045/C0050/C0044 /C0052/C0045/C0054/C0048 /C0077/C0067/C0049/C0052/C0053/C0055/C0056/C0044 /C0052/C0045/C0050/C0044 /C0052/C0045/C0049/C0053 /C0077/C0067/C0049/C0052/C0054/C0048/C0048/C0044 /C0052/C0045/C0050/C0044 /C0052/C0045/C0049/C0057 /C0077/C0077/C0065/C0049/C0050/C0048/C0048/C0068/C0044 /C0050/C0045/C0050/C0044 /C0050/C0045/C0053 /C0077/C0077/C0065/C0049/C0050/C0048/C0049/C0080 /C0044 /C0050/C0045/C0050/C0044 /C0050/C0045/C0049/C0050 /C0077/C0077/C0065/C0049/C0050/C0050/C0048/C0068/C0044 /C0050/C0045/C0050/C0044 /C0050/C0045/C0049/C0056 /C0077/C0077/C0065/C0049/C0050/C0053/C0048/C0068/C0044 /C0050/C0045/C0050/C0044 /C0050/C0045/C0050/C0052 /C0077/C0077/C0065/C0049/C0050/C0054/C0048/C0068/C0044 /C0050/C0045/C0050/C0044 /C0050/C0045/C0051/C0048 /C0077/C0077/C0065/C0049/C0050/C0055/C0048/C0068/C0044 /C0050/C0045/C0050/C0044 /C0050/C0045/C0051/C0054 /C0077/C0077/C0065/C0050/C0050/C0048/C0048/C0087 /C0044 /C0050/C0045/C0050/C0044 /C0050/C0045/C0049/C0050 /C0077/C0077/C0065/C0050/C0050/C0048/C0049/C0068/C0044 /C0050/C0045/C0050/C0044 /C0050/C0045/C0052/C0050 /C0077/C0077/C0065/C0050/C0050/C0048/C0050/C0068/C0044 /C0050/C0045/C0050/C0044 /C0050/C0045/C0052/C0056 /C0077/C0077/C0065/C0051/C0050/C0048/C0049/C0068/C0044 /C0050/C0045/C0050/C0044 /C0050/C0045/C0053/C0053 /C0077/C0080/C0088/C0049/C0048/C0044 /C0051/C0045/C0049/C0053 /C0077/C0080/C0088/C0049/C0048/C0068/C0044 /C0051/C0045/C0049/C0056 /C0077/C0080/C0088/C0049/C0048/C0068/C0080 /C0044 /C0051/C0045/C0049/C0056 /C0077/C0080/C0088/C0049/C0048/C0071/C0080 /C0044 /C0051/C0045/C0049/C0056 /C0077/C0080/C0088/C0049/C0048/C0071/C0083/C0044 /C0051/C0045/C0049/C0056 /C0077/C0080/C0088/C0049/C0050/C0044 /C0051/C0045/C0049/C0057 /C0077/C0080/C0088/C0049/C0050/C0068/C0044 /C0051/C0045/C0050/C0050 /C0077/C0080/C0088/C0049/C0050/C0068/C0080 /C0044 /C0051/C0045/C0050/C0050 /C0077/C0080/C0088/C0049/C0050/C0071/C0080 /C0044 /C0051/C0045/C0050/C0050 /C0077/C0080/C0088/C0050/C0048/C0049/C0048/C0044 /C0051/C0045/C0050/C0051 /C0077/C0080/C0088/C0050/C0048/C0049/C0048/C0068/C0044 /C0051/C0045/C0050/C0054 /C0077/C0080/C0088/C0050/C0048/C0049/C0048/C0068/C0080 /C0044 /C0051/C0045/C0050/C0054 /C0077/C0080/C0088/C0050/C0048/C0049/C0048/C0071/C0080 /C0044 /C0051/C0045/C0050/C0054 /C0077/C0080/C0088/C0050/C0048/C0049/C0048/C0071/C0083/C0044 /C0051/C0045/C0050/C0054 /C0077/C0080/C0088/C0050/C0048/C0049/C0048/C0071/C0083/C0088/C0044 /C0051/C0045/C0050/C0054 /C0077/C0080/C0088/C0050/C0048/C0053/C0048/C0044 /C0051/C0045/C0050/C0055 /C0077/C0080/C0088/C0050/C0048/C0053/C0048/C0068/C0044 /C0051/C0045/C0051/C0048 /C0077/C0080/C0088/C0050/C0048/C0053/C0048/C0068/C0080 /C0044 /C0051/C0045/C0051/C0048 /C0077/C0080/C0088/C0050/C0048/C0053/C0048/C0071/C0080 /C0044 /C0051/C0045/C0051/C0048 /C0077/C0080/C0088/C0050/C0048/C0053/C0048/C0071/C0083/C0088/C0044 /C0051/C0045/C0051/C0048 /C0077/C0080/C0088/C0050/C0048/C0053/C0051/C0044 /C0051/C0045/C0051/C0049 /C0077/C0080/C0088/C0050/C0048/C0053/C0051/C0068/C0044 /C0051/C0045/C0051/C0052 /C0077/C0080/C0088/C0050/C0048/C0053/C0051/C0068/C0080 /C0044 /C0051/C0045/C0051/C0052 /C0077/C0080/C0088/C0050/C0048/C0053/C0051/C0071/C0080 /C0044 /C0051/C0045/C0051/C0052 /C0077/C0080/C0088/C0050/C0048/C0053/C0051/C0071/C0083/C0088/C0044 /C0051/C0045/C0051/C0052 /C0077/C0080/C0088/C0050/C0048/C0053/C0051/C0071/C0086/C0080 /C0044 /C0051/C0045/C0051/C0052 /C0077/C0080/C0088/C0050/C0049/C0048/C0048/C0044 /C0051/C0045/C0051/C0053 /C0077/C0080/C0088/C0050/C0049/C0048/C0048/C0065/C0044 /C0051/C0045/C0051/C0056 /C0077/C0080/C0088/C0050/C0049/C0048/C0048/C0065/C0080 /C0044 /C0051/C0045/C0051/C0056 /C0077/C0080/C0088/C0050/C0049/C0048/C0048/C0065/C0083/C0088/C0044 /C0051/C0045/C0051/C0056 /C0077/C0080/C0088/C0050/C0049/C0048/C0048/C0068/C0044 /C0051/C0045/C0051/C0056 /C0077/C0080/C0088/C0050/C0049/C0048/C0048/C0068/C0080 /C0044 /C0051/C0045/C0051/C0056 /C0077/C0080/C0088/C0050/C0049/C0048/C0048/C0071/C0080 /C0044 /C0051/C0045/C0051/C0056 /C0077/C0080/C0088/C0050/C0049/C0048/C0048/C0071/C0083/C0088/C0044 /C0051/C0045/C0051/C0056 /C0077/C0080/C0088/C0050/C0049/C0048/C0050/C0044 /C0051/C0045/C0051/C0057 /C0077/C0080/C0088/C0050/C0049/C0048/C0050/C0065/C0044 /C0051/C0045/C0052/C0050 /C0077/C0080/C0088/C0050/C0049/C0048/C0050/C0065/C0080 /C0044 /C0051/C0045/C0052/C0050 /C0077/C0080/C0088/C0050/C0049/C0048/C0050/C0065/C0083/C0088/C0044 /C0051/C0045/C0052/C0050 /C0077/C0080/C0088/C0050/C0049/C0048/C0050/C0068/C0044 /C0051/C0045/C0052/C0050 /C0077/C0080/C0088/C0050/C0049/C0048/C0050/C0068/C0080 /C0044 /C0051/C0045/C0052/C0050 /C0077/C0080/C0088/C0050/C0049/C0048/C0050/C0071/C0080 /C0044 /C0051/C0045/C0052/C0050 /C0077/C0080/C0088/C0050/C0049/C0048/C0050/C0071/C0083/C0088/C0044 /C0051/C0045/C0052/C0050 /C0077/C0080/C0088/C0050/C0049/C0048/C0050/C0071/C0086/C0080 /C0044 /C0051/C0045/C0052/C0050 /C0077/C0080/C0088/C0050/C0050/C0048/C0048/C0044 /C0051/C0045/C0052/C0051 /C0077/C0080/C0088/C0050/C0050/C0048/C0048/C0065/C0044 /C0051/C0045/C0052/C0054 /C0077/C0080/C0088/C0050/C0050/C0048/C0048/C0065/C0080 /C0044 /C0051/C0045/C0052/C0054 /C0077/C0080/C0088/C0050/C0050/C0048/C0048/C0068/C0044 /C0051/C0045/C0052/C0054 /C0077/C0080/C0088/C0050/C0050/C0048/C0048/C0068/C0080 /C0044 /C0051/C0045/C0052/C0054 /C0077/C0080/C0088/C0050/C0050/C0048/C0048/C0071/C0080 /C0044 /C0051/C0045/C0052/C0054 /C0077/C0080/C0088/C0050/C0050/C0048/C0048/C0071/C0086/C0080 /C0044 /C0051/C0045/C0052/C0054 /C0077/C0080/C0088/C0050/C0050/C0048/C0050/C0044 /C0051/C0045/C0052/C0055 /C0077/C0080/C0088/C0050/C0050/C0048/C0050/C0065/C0044 /C0051/C0045/C0053/C0048 /C0077/C0080/C0088/C0050/C0050/C0048/C0050/C0065/C0080 /C0044 /C0051/C0045/C0053/C0048 /C0077/C0080/C0088/C0050/C0050/C0048/C0050/C0065/C0083/C0088/C0044 /C0051/C0045/C0053/C0048 /C0077/C0080/C0088/C0050/C0050/C0048/C0050/C0068/C0044 /C0051/C0045/C0053/C0048 /C0077/C0080/C0088/C0050/C0050/C0048/C0050/C0068/C0080 /C0044 /C0051/C0045/C0053/C0048 /C0077/C0080/C0088/C0050/C0050/C0048/C0050/C0071/C0080 /C0044 /C0051/C0045/C0053/C0048 /C0077/C0080/C0088/C0050/C0050/C0048/C0050/C0071/C0083/C0088/C0044 /C0051/C0045/C0053/C0048 /C0077/C0080/C0088/C0050/C0050/C0048/C0050/C0071/C0086/C0080 /C0044 /C0051/C0045/C0053/C0048 /C0077/C0080/C0088/C0050/C0051/C0048/C0048/C0068/C0084/C0049/C0044 /C0051/C0045/C0053/C0049 /C0077/C0080/C0088/C0050/C0051/C0048/C0049/C0068/C0084/C0049/C0044 /C0051/C0045/C0053/C0049 /C0077/C0080/C0088/C0052/C0048/C0056/C0048/C0068/C0044 /C0051/C0045/C0053/C0052 /C0077/C0080/C0088/C0052/C0049/C0048/C0048/C0044 /C0051/C0045/C0053/C0057 /C0077/C0080/C0088/C0052/C0049/C0048/C0048/C0065/C0044 /C0051/C0045/C0054/C0051/C0044 /C0051/C0045/C0054/C0052/C0044 /C0051/C0045/C0054/C0056 /C0077/C0080/C0088/C0052/C0049/C0048/C0048/C0065/C0080 /C0044 /C0051/C0045/C0054/C0051/C0044 /C0051/C0045/C0054/C0056 /C0077/C0080/C0088/C0052/C0049/C0048/C0048/C0065/C0083/C0044 /C0051/C0045/C0054/C0051/C0044 /C0051/C0045/C0054/C0056 /C0077/C0080/C0088/C0052/C0049/C0048/C0048/C0065/C0083/C0088/C0044 /C0051/C0045/C0054/C0051 /C0077/C0080/C0088/C0052/C0049/C0048/C0049/C0065/C0044 /C0051/C0045/C0055/C0048/C0044 /C0051/C0045/C0055/C0052 /C0077/C0080/C0088/C0052/C0049/C0048/C0053/C0065/C0044 /C0051/C0045/C0055/C0053 /C0077/C0080/C0088/C0052/C0049/C0049/C0053/C0065/C0044 /C0051/C0045/C0055/C0057 /C0077/C0080/C0088/C0052/C0050/C0048/C0048/C0065/C0044 /C0051/C0045/C0056/C0052 /C0077/C0080/C0088/C0052/C0050/C0053/C0048/C0065/C0044 /C0051/C0045/C0056/C0056 /C0077/C0080/C0088/C0052/C0050/C0053/C0048/C0068/C0044 /C0051/C0045/C0057/C0051 /C0077/C0080/C0088/C0053/C0048/C0049/C0048/C0044 /C0051/C0045/C0057/C0055 /C0077/C0080/C0088/C0053/C0048/C0049/C0048/C0068/C0044 /C0051/C0045/C0049/C0048/C0049 /C0077/C0080/C0088/C0053/C0048/C0049/C0048/C0068/C0080 /C0044 /C0051/C0045/C0049/C0048/C0049 /C0077/C0080/C0088/C0053/C0048/C0049/C0048/C0071/C0054/C0085/C0044 /C0051/C0045/C0049/C0048/C0049 /C0077/C0080/C0088/C0053/C0048/C0049/C0048/C0071/C0055/C0085/C0044 /C0051/C0045/C0049/C0048/C0049 /C0077/C0080/C0088/C0053/C0048/C0049/C0048/C0071/C0080 /C0044 /C0051/C0045/C0049/C0048/C0049 /C0077/C0080/C0088/C0053/C0048/C0049/C0048/C0071/C0083/C0044 /C0051/C0045/C0049/C0048/C0049 /C0077/C0080/C0088/C0053/C0048/C0049/C0048/C0071/C0083/C0088/C0044 /C0051/C0045/C0049/C0048/C0049 /C0077/C0080/C0088/C0053/C0048/C0053/C0048/C0044 /C0051/C0045/C0049/C0048/C0051 /C0077/C0080/C0088/C0053/C0048/C0053/C0048/C0068/C0044 /C0051/C0045/C0049/C0048/C0055 /C0077/C0080/C0088/C0053/C0048/C0053/C0048/C0068/C0080 /C0044 /C0051/C0045/C0049/C0048/C0055 /C0077/C0080/C0088/C0053/C0048/C0053/C0048/C0071/C0080 /C0044 /C0051/C0045/C0049/C0048/C0055 /C0077/C0080/C0088/C0053/C0049/C0048/C0048/C0044 /C0051/C0045/C0049/C0048/C0056 /C0077/C0080/C0088/C0053/C0049/C0048/C0048/C0065/C0044 /C0051/C0045/C0049/C0049/C0051 /C0077/C0080/C0088/C0053/C0049/C0048/C0048/C0065/C0080 /C0044 /C0051/C0045/C0049/C0049/C0051 /C0077/C0080/C0088/C0053/C0049/C0048/C0048/C0068/C0044 /C0051/C0045/C0049/C0049/C0051 /C0077/C0080/C0088/C0053/C0049/C0048/C0048/C0068/C0080 /C0044 /C0051/C0045/C0049/C0049/C0051 /C0077/C0080/C0088/C0053/C0049/C0048/C0048/C0071/C0080 /C0044 /C0051/C0045/C0049/C0049/C0051 /C0077/C0080/C0088/C0053/C0049/C0048/C0048/C0071/C0083/C0088/C0044 /C0051/C0045/C0049/C0049/C0051 /C0077/C0080/C0088/C0053/C0051/C0044 /C0051/C0045/C0049/C0049/C0052 /C0077/C0080/C0088/C0053/C0051/C0068/C0044 /C0051/C0045/C0049/C0049/C0055 /C0077/C0080/C0088/C0053/C0051/C0068/C0080 /C0044 /C0051/C0045/C0049/C0049/C0055 /C0077/C0080/C0088/C0053/C0051/C0071/C0080 /C0044 /C0051/C0045/C0049/C0049/C0055 /C0077/C0080/C0088/C0053/C0053/C0048/C0048/C0044 /C0051/C0045/C0049/C0049/C0056 /C0077/C0080/C0088/C0053/C0053/C0048/C0048/C0068/C0044 /C0051/C0045/C0049/C0050/C0049 /C0077/C0080/C0088/C0053/C0053/C0048/C0048/C0068/C0080 /C0044 /C0051/C0045/C0049/C0050/C0049 /C0077/C0080/C0088/C0053/C0055/C0048/C0048/C0044 /C0051/C0045/C0049/C0050/C0050 /C0077/C0080/C0088/C0053/C0055/C0048/C0048/C0065/C0044 /C0051/C0045/C0049/C0050/C0053 /C0077/C0080/C0088/C0053/C0055/C0048/C0048/C0065/C0080 /C0044 /C0051/C0045/C0049/C0050/C0053 Freescale Sem iconductor, I Freescale Semiconductor, Inc. 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5–3Motorola Sensor Device Data www.motorola.com/semiconductors /C0077/C0080/C0088/C0053/C0055/C0048/C0048/C0065/C0083/C0044 /C0051/C0045/C0049/C0050/C0053 /C0077/C0080/C0088/C0053/C0055/C0048/C0048/C0068/C0044 /C0051/C0045/C0049/C0050/C0053 /C0077/C0080/C0088/C0053/C0055/C0048/C0048/C0068/C0080 /C0044 /C0051/C0045/C0049/C0050/C0053 /C0077/C0080/C0088/C0053/C0055/C0048/C0048/C0071/C0080 /C0044 /C0051/C0045/C0049/C0050/C0053 /C0077/C0080/C0088/C0053/C0055/C0048/C0048/C0071/C0083/C0044 /C0051/C0045/C0049/C0050/C0053 /C0077/C0080/C0088/C0053/C0057/C0057/C0057/C0068/C0044 /C0051/C0045/C0049/C0050/C0054/C0044 /C0051/C0045/C0049/C0050/C0057 /C0077/C0080/C0088/C0065/C0052/C0049/C0048/C0048/C0065/C0044 /C0051/C0045/C0054/C0052 /C0077/C0080/C0088/C0065/C0052/C0049/C0048/C0048/C0065/C0054/C0085/C0047/C0084/C0049/C0044 /C0051/C0045/C0054/C0056 /C0077/C0080/C0088/C0065/C0052/C0049/C0048/C0048/C0065/C0067/C0054/C0085/C0044 /C0051/C0045/C0054/C0056 /C0077/C0080/C0088/C0065/C0052/C0049/C0048/C0049/C0065/C0044 /C0051/C0045/C0055/C0048 /C0077/C0080/C0088/C0065/C0052/C0049/C0048/C0049/C0065/C0067/C0054/C0085/C0044 /C0051/C0045/C0055/C0052 /C0077/C0080/C0088/C0065/C0052/C0049/C0049/C0053/C0065/C0044 /C0051/C0045/C0055/C0057 /C0077/C0080/C0088/C0065/C0052/C0050/C0053/C0048/C0065/C0044 /C0051/C0045/C0056/C0056 /C0077/C0080/C0088/C0065/C0054/C0049/C0049/C0053/C0065/C0044 /C0051/C0045/C0049/C0051/C0048 /C0077/C0080/C0088/C0065/C0054/C0049/C0049/C0053/C0065/C0054/C0084/C0049/C0044 /C0051/C0045/C0049/C0051/C0051 /C0077/C0080/C0088/C0065/C0054/C0049/C0049/C0053/C0065/C0054/C0085/C0044 /C0051/C0045/C0049/C0051/C0051 /C0077/C0080/C0088/C0065/C0054/C0049/C0049/C0053/C0065/C0067/C0054/C0084/C0049/C0044 /C0051/C0045/C0049/C0051/C0051 /C0077/C0080/C0088/C0065/C0054/C0049/C0049/C0053/C0065/C0067/C0054/C0085/C0044 /C0051/C0045/C0049/C0051/C0051 /C0077/C0080/C0088/C0065/C0090/C0052/C0049/C0048/C0048/C0065/C0044 /C0051/C0045/C0049/C0051/C0053 /C0077/C0080/C0088/C0065/C0090/C0052/C0049/C0048/C0048/C0065/C0054/C0084/C0049/C0044 /C0051/C0045/C0049/C0051/C0056 /C0077/C0080/C0088/C0065/C0090/C0052/C0049/C0048/C0048/C0065/C0054/C0085/C0044 /C0051/C0045/C0049/C0051/C0056 /C0077/C0080/C0088/C0065/C0090/C0052/C0049/C0048/C0048/C0065/C0067/C0054/C0084/C0049/C0044 /C0051/C0045/C0049/C0051/C0056 /C0077/C0080/C0088/C0065/C0090/C0052/C0049/C0048/C0048/C0065/C0067/C0054/C0085/C0044 /C0051/C0045/C0049/C0051/C0056 /C0077/C0080/C0088/C0065/C0090/C0052/C0049/C0049/C0053/C0065/C0044 /C0051/C0045/C0049/C0052/C0048 /C0077/C0080/C0088/C0065/C0090/C0052/C0049/C0049/C0053/C0065/C0054/C0084/C0049/C0044 /C0051/C0045/C0049/C0052/C0051 /C0077/C0080/C0088/C0065/C0090/C0052/C0049/C0049/C0053/C0065/C0054/C0085/C0044 /C0051/C0045/C0049/C0052/C0051 /C0077/C0080/C0088/C0065/C0090/C0052/C0049/C0049/C0053/C0065/C0067/C0054/C0084/C0049/C0044 /C0051/C0045/C0049/C0052/C0051 /C0077/C0080/C0088/C0065/C0090/C0052/C0049/C0049/C0053/C0065/C0067/C0054/C0085/C0044 /C0051/C0045/C0049/C0052/C0051 /C0077/C0080/C0088/C0065/C0090/C0054/C0049/C0049/C0053/C0065/C0044 /C0051/C0045/C0049/C0052/C0053 /C0077/C0080/C0088/C0065/C0090/C0054/C0049/C0049/C0053/C0065/C0054/C0084/C0049/C0044 /C0051/C0045/C0049/C0052/C0056 /C0077/C0080/C0088/C0065/C0090/C0054/C0049/C0049/C0053/C0065/C0054/C0085/C0044 /C0051/C0045/C0049/C0052/C0056 /C0077/C0080/C0088/C0065/C0090/C0054/C0049/C0049/C0053/C0065/C0067/C0054/C0084/C0049/C0044 /C0051/C0045/C0049/C0052/C0056 /C0077/C0080/C0088/C0065/C0090/C0054/C0049/C0049/C0053/C0065/C0067/C0054/C0085/C0044 /C0051/C0045/C0049/C0052/C0056 /C0077/C0080/C0088/C0067/C0050/C0048/C0049/C0049/C0068/C0084/C0049/C0044 /C0051/C0045/C0049/C0053/C0048 /C0077/C0080/C0088/C0067/C0050/C0048/C0049/C0050/C0068/C0084/C0049/C0044 /C0051/C0045/C0049/C0053/C0048 /C0077/C0080/C0088/C0072/C0054/C0049/C0048/C0049/C0065/C0044 /C0051/C0045/C0055/C0048 /C0077/C0080/C0088/C0072/C0054/C0049/C0048/C0049/C0065/C0054/C0084/C0049/C0044 /C0051/C0045/C0055/C0052 /C0077/C0080/C0088/C0072/C0054/C0049/C0048/C0049/C0065/C0054/C0085/C0044 /C0051/C0045/C0055/C0052 /C0077/C0080/C0088/C0072/C0054/C0049/C0049/C0053/C0065/C0044 /C0051/C0045/C0049/C0051/C0048 /C0077/C0080/C0088/C0072/C0054/C0049/C0049/C0053/C0065/C0054/C0084/C0049/C0044 /C0051/C0045/C0049/C0051/C0051 /C0077/C0080/C0088/C0072/C0054/C0049/C0049/C0053/C0065/C0054/C0085/C0044 /C0051/C0045/C0049/C0051/C0051 /C0077/C0080/C0088/C0072/C0054/C0049/C0049/C0053/C0065/C0067/C0054/C0084/C0049/C0044 /C0051/C0045/C0049/C0051/C0051 /C0077/C0080/C0088/C0072/C0054/C0049/C0049/C0053/C0065/C0067/C0054/C0085/C0044 /C0051/C0045/C0049/C0051/C0051 /C0077/C0080/C0088/C0072/C0054/C0051/C0048/C0048/C0065/C0044 /C0051/C0045/C0049/C0053/C0051 /C0077/C0080/C0088/C0072/C0054/C0051/C0048/C0048/C0065/C0054/C0084/C0049/C0044 /C0051/C0045/C0049/C0053/C0054 /C0077/C0080/C0088/C0072/C0054/C0051/C0048/C0048/C0065/C0054/C0085/C0044 /C0051/C0045/C0049/C0053/C0054 /C0077/C0080/C0088/C0072/C0054/C0051/C0048/C0048/C0065/C0067/C0054/C0084/C0049/C0044 /C0051/C0045/C0049/C0053/C0054 /C0077/C0080/C0088/C0077/C0050/C0048/C0049/C0048/C0044 /C0051/C0045/C0049/C0053/C0056 /C0077/C0080/C0088/C0077/C0050/C0048/C0049/C0048/C0068/C0044 /C0051/C0045/C0049/C0054/C0048 /C0077/C0080/C0088/C0077/C0050/C0048/C0049/C0048/C0068/C0084/C0049/C0044 /C0051/C0045/C0049/C0054/C0048 /C0077/C0080/C0088/C0077/C0050/C0048/C0049/C0048/C0071/C0083/C0044 /C0051/C0045/C0049/C0054/C0048 /C0077/C0080/C0088/C0077/C0050/C0048/C0049/C0048/C0071/C0083/C0084/C0049/C0044 /C0051/C0045/C0049/C0054/C0048 /C0077/C0080/C0088/C0077/C0050/C0048/C0053/C0051/C0044 /C0051/C0045/C0049/C0054/C0049 /C0077/C0080/C0088/C0077/C0050/C0048/C0053/C0051/C0068/C0044 /C0051/C0045/C0049/C0054/C0051 /C0077/C0080/C0088/C0077/C0050/C0048/C0053/C0051/C0068/C0084/C0049/C0044 /C0051/C0045/C0049/C0054/C0051 /C0077/C0080/C0088/C0077/C0050/C0048/C0053/C0051/C0071/C0083/C0044 /C0051/C0045/C0049/C0054/C0051 /C0077/C0080/C0088/C0077/C0050/C0048/C0053/C0051/C0071/C0083/C0084/C0049/C0044 /C0051/C0045/C0049/C0054/C0051 /C0077/C0080/C0088/C0077/C0050/C0049/C0048/C0050/C0044 /C0051/C0045/C0049/C0054/C0052 /C0077/C0080/C0088/C0077/C0050/C0049/C0048/C0050/C0065/C0044 /C0051/C0045/C0049/C0054/C0054 /C0077/C0080/C0088/C0077/C0050/C0049/C0048/C0050/C0065/C0083/C0044 /C0051/C0045/C0049/C0054/C0054 /C0077/C0080/C0088/C0077/C0050/C0049/C0048/C0050/C0065/C0083/C0084/C0049/C0044 /C0051/C0045/C0049/C0054/C0054 /C0077/C0080/C0088/C0077/C0050/C0049/C0048/C0050/C0065/C0084/C0049/C0044 /C0051/C0045/C0049/C0054/C0054 /C0077/C0080/C0088/C0077/C0050/C0049/C0048/C0050/C0068/C0044 /C0051/C0045/C0049/C0054/C0054 /C0077/C0080/C0088/C0077/C0050/C0049/C0048/C0050/C0068/C0084/C0049/C0044 /C0051/C0045/C0049/C0054/C0054 /C0077/C0080/C0088/C0077/C0050/C0049/C0048/C0050/C0071/C0083/C0044 /C0051/C0045/C0049/C0054/C0054 /C0077/C0080/C0088/C0077/C0050/C0049/C0048/C0050/C0071/C0083/C0084/C0049/C0044 /C0051/C0045/C0049/C0054/C0054 /C0077/C0080/C0088/C0077/C0050/C0050/C0048/C0050/C0044 /C0051/C0045/C0049/C0054/C0055 /C0077/C0080/C0088/C0077/C0050/C0050/C0048/C0050/C0065/C0044 /C0051/C0045/C0049/C0054/C0057 /C0077/C0080/C0088/C0077/C0050/C0050/C0048/C0050/C0065/C0083/C0044 /C0051/C0045/C0049/C0054/C0057 /C0077/C0080/C0088/C0077/C0050/C0050/C0048/C0050/C0065/C0083/C0084/C0049/C0044 /C0051/C0045/C0049/C0054/C0057 /C0077/C0080/C0088/C0077/C0050/C0050/C0048/C0050/C0065/C0084/C0049/C0044 /C0051/C0045/C0049/C0054/C0057 /C0077/C0080/C0088/C0077/C0050/C0050/C0048/C0050/C0068/C0044 /C0051/C0045/C0049/C0054/C0057 /C0077/C0080/C0088/C0077/C0050/C0050/C0048/C0050/C0068/C0084/C0049/C0044 /C0051/C0045/C0049/C0054/C0057 /C0077/C0080/C0088/C0077/C0050/C0050/C0048/C0050/C0071/C0083/C0044 /C0051/C0045/C0049/C0054/C0057 /C0077/C0080/C0088/C0077/C0050/C0050/C0048/C0050/C0071/C0083/C0084/C0049/C0044 /C0051/C0045/C0049/C0054/C0057 /C0077/C0080/C0088/C0086/C0049/C0048/C0071/C0067/C0044 /C0051/C0045/C0049/C0053 /C0077/C0080/C0088/C0086/C0049/C0048/C0071/C0067/C0054/C0084/C0049/C0044 /C0051/C0045/C0049/C0056 /C0077/C0080/C0088/C0086/C0049/C0048/C0071/C0067/C0054/C0085/C0044 /C0051/C0045/C0049/C0056 /C0077/C0080/C0088/C0086/C0049/C0048/C0071/C0067/C0055/C0085/C0044 /C0051/C0045/C0049/C0056 /C0077/C0080/C0088/C0086/C0050/C0048/C0049/C0048/C0068/C0080 /C0044 /C0051/C0045/C0050/C0054 /C0077/C0080/C0088/C0086/C0050/C0048/C0049/C0048/C0071/C0044 /C0051/C0045/C0050/C0051 /C0077/C0080/C0088/C0086/C0050/C0048/C0049/C0048/C0071/C0080 /C0044 /C0051/C0045/C0050/C0054 /C0077/C0080/C0088/C0086/C0050/C0048/C0053/C0051/C0068/C0080 /C0044 /C0051/C0045/C0051/C0052 /C0077/C0080/C0088/C0086/C0050/C0048/C0053/C0051/C0071/C0044 /C0051/C0045/C0051/C0049 /C0077/C0080/C0088/C0086/C0050/C0048/C0053/C0051/C0071/C0080 /C0044 /C0051/C0045/C0051/C0052 /C0077/C0080/C0088/C0086/C0050/C0049/C0048/C0050/C0068/C0080 /C0044 /C0051/C0045/C0052/C0050 /C0077/C0080/C0088/C0086/C0050/C0049/C0048/C0050/C0071/C0044 /C0051/C0045/C0051/C0057 /C0077/C0080/C0088/C0086/C0050/C0049/C0048/C0050/C0071/C0080 /C0044 /C0051/C0045/C0052/C0050 /C0077/C0080/C0088/C0086/C0050/C0050/C0048/C0050/C0068/C0080 /C0044 /C0051/C0045/C0053/C0048 /C0077/C0080/C0088/C0086/C0050/C0050/C0048/C0050/C0071/C0044 /C0051/C0045/C0052/C0055 /C0077/C0080/C0088/C0086/C0050/C0050/C0048/C0050/C0071/C0080 /C0044 /C0051/C0045/C0053/C0048 /C0077/C0080/C0088/C0086/C0052/C0048/C0048/C0054/C0068/C0080 /C0044 /C0051/C0045/C0049/C0055/C0051 /C0077/C0080/C0088/C0086/C0052/C0048/C0048/C0054/C0071/C0044 /C0051/C0045/C0049/C0055/C0048 /C0077/C0080/C0088/C0086/C0052/C0048/C0048/C0054/C0071/C0054/C0085/C0047/C0084/C0049/C0044 /C0051/C0045/C0049/C0055/C0051 /C0077/C0080/C0088/C0086/C0052/C0048/C0048/C0054/C0071/C0055/C0085/C0044 /C0051/C0045/C0049/C0055/C0051 /C0077/C0080/C0088/C0086/C0052/C0048/C0048/C0054/C0071/C0067/C0054/C0085/C0047/C0084/C0049/C0044 /C0051/C0045/C0049/C0055/C0051 /C0077/C0080/C0088/C0086/C0052/C0048/C0048/C0054/C0071/C0067/C0055/C0085/C0044 /C0051/C0045/C0049/C0055/C0051 /C0077/C0080/C0088/C0086/C0052/C0048/C0048/C0054/C0071/C0080 /C0044 /C0051/C0045/C0049/C0055/C0051 /C0077/C0080/C0088/C0086/C0052/C0049/C0049/C0053/C0086 /C0044 /C0051/C0045/C0049/C0055/C0052 /C0077/C0080/C0088/C0086/C0052/C0049/C0049/C0053/C0086/C0054/C0084/C0049/C0044 /C0051/C0045/C0049/C0055/C0055 /C0077/C0080/C0088/C0086/C0052/C0049/C0049/C0053/C0086/C0054/C0085/C0044 /C0051/C0045/C0049/C0055/C0055 /C0077/C0080/C0088/C0086/C0052/C0049/C0049/C0053/C0086/C0067/C0054/C0085/C0044 /C0051/C0045/C0049/C0055/C0055 /C0077/C0080/C0088/C0086/C0053/C0048/C0048/C0052/C0068/C0080 /C0044 /C0051/C0045/C0049/C0056/C0050 /C0077/C0080/C0088/C0086/C0053/C0048/C0048/C0052/C0071/C0044 /C0051/C0045/C0049/C0055/C0057 /C0077/C0080/C0088/C0086/C0053/C0048/C0048/C0052/C0071/C0054/C0085/C0047/C0084/C0049/C0044 /C0051/C0045/C0049/C0056/C0050 /C0077/C0080/C0088/C0086/C0053/C0048/C0048/C0052/C0071/C0055/C0085/C0044 /C0051/C0045/C0049/C0056/C0050 /C0077/C0080/C0088/C0086/C0053/C0048/C0048/C0052/C0071/C0067/C0054/C0085/C0047/C0084/C0049/C0044 /C0051/C0045/C0049/C0056/C0050 /C0077/C0080/C0088/C0086/C0053/C0048/C0048/C0052/C0071/C0067/C0055/C0085/C0044 /C0051/C0045/C0049/C0056/C0050 /C0077/C0080/C0088/C0086/C0053/C0048/C0048/C0052/C0071/C0080 /C0044 /C0051/C0045/C0049/C0056/C0050 /C0077/C0080/C0088/C0086/C0053/C0048/C0048/C0052/C0071/C0086/C0080 /C0044 /C0051/C0045/C0049/C0056/C0050 /C0077/C0080/C0088/C0086/C0053/C0048/C0049/C0048/C0068/C0080 /C0044 /C0051/C0045/C0049/C0048/C0049 /C0077/C0080/C0088/C0086/C0053/C0048/C0049/C0048/C0071/C0044 /C0051/C0045/C0057/C0055 /C0077/C0080/C0088/C0086/C0053/C0048/C0049/C0048/C0071/C0054/C0085/C0044 /C0051/C0045/C0049/C0048/C0049 /C0077/C0080/C0088/C0086/C0053/C0048/C0049/C0048/C0071/C0055/C0085/C0044 /C0051/C0045/C0049/C0048/C0049 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/C0077/C0080/C0088/C0086/C0054/C0049/C0049/C0053/C0086/C0067/C0054/C0085/C0044 /C0051/C0045/C0049/C0056/C0051 Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

5–4 Motorola Sensor Device Datawww.motorola.com/semiconductors Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

HOW TO REACH US: USA/EUROPE/LOCATIONS NOT LISTED: Motorola Literature Distribution P.O. Box 5405, Denver, Colorado 80217 1-800-441-2447 or 480-768-2130 JAPAN: Motorola Japan Ltd. SPS, Technical Information Center 3-20-1, Minami-Azabu Minato-ku Tokyo 106-8573, Japan 81-3-3440-3569 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd. Silicon Harbour Centre

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Tai Po, N.T. Hong Kong 852-26668334 HOME PAGE: http://motorola.com/semiconductors DL200/D, REV 5 Information in this document is provided solely to enable system and software implementers to use Motorola products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. MOTOROLA and the Stylized M Logo are registered in the US Patent and Trademark Office. All other product or service names are the property of their respective owners.  Motorola Inc. 2003 Freescale Sem iconductor, I Freescale Semiconductor, Inc. For More Information On This Product, Go to: www.freescale.com nc...

Product Information

MPX2102A specifications and overview.

Summary

Sensor

Description

Sensor

Source title MPX2102A Datasheet(PDF) - Motorola, Inc

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