MPX2053 FREESCALE | Alldatasheet

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Technical content

Features

• Temperature Compensated Over 0 °C to +85°C • Easy-to-Use Chip Carrier Package Options • Ratiometric to Supply Voltage • Differential and Gauge Options Application Examples • Pump/Motor Controllers • Robotics • Level Indicators • Medical Diagnostics • Pressure Switching • Non-Invasive Blood Pressure Measurement

ORDERING INFORMATION

No. MPX Series Order No. Packing Options Device Marking SMALL OUTLINE PACKAGE (MPXV2053G SERIES) Ported Elements Gauge, Side Port, SMT

1369 MPXV2053GP Trays MPXV2053G

Dual Port, SMT

1351 MPXV2053DP Trays MPXV2053G

UNIBODY PACKAGE (MPX2053 SERIES) Basic Element Differential 344 MPX2053D — MPX2053D Ported Elements Differential, Dual Port 344C MPX2053DP — MPX2053DP Gauge 344B MPX2053GP — MPX2053GP Gauge, Axial PC Mount 344F MPX2053GSX — MPX2053D Gauge, Vacuum 344D MPX2053GVP — MPX2053GVP MPX2053 MPXV2053G SERIES SMALL OUTLINE PACKAGE PIN NUMBERS

1 GND(1) 5 N/C

3 VS 7 N/C

4 –VOUT 8 N/C 1. Pin 1 in noted by the notch in the lead. 0 TO 50 kPA (0 TO 7.25 psi) 40 mV FULL SCALE SPAN (TYPICAL) SMALL OUTLINE PACKAGES MPXV2053GP CASE 1369-01 MPXV2053DP CASE 1351-01 UNIBODY PACKAGE PIN NUMBERS

1 GND(1)

  1. Pin 1 in noted by the notch in the lead. 3 VS 2 +VOUT 4 –VOUT UNIBODY PACKAGES MPX2053GVP CASE 344D-01 MPX2053GSX CASE 344F-01 MPX2053GP CASE 344B-01 MPX2053DP CASE 344C-01 MPX2053GP CASE 344-15

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Figure 1. Temperature Compensated and Calibrated vacuum side (P2) relative to the pressure side (P1). the stand-alone pressure sensor chip. Table 1. Maximum Ratings(1)

  1. Exposure beyond the specified limits may c ause permanent damage or degradation to the device.

Table 2. Operating Characteristics (VS = 10 VDC, TA = 25°C unless otherwise noted, P1 > P2)

  1. 1.0 kPa (kiloPascal) equals 0.145 psi.
  2. Device is ratiometric within this spec ified excitation range. Operating the device above the specified excitation range may induce additional

error due to device self-heating.

  1. Full Scale Span (V FSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
  2. Offset (V OFF) is defined as the output voltage at the minimum rated pressure.
  3. Accuracy (error budget) consists of the following:

• Linearity: Output deviation from a straight line relations hip with pressure over the specified pressure range. and from the minimum or maximum operating temperature points, with zero differential pressure applied. or maximum rated pressure, at 25°C. • TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C. • TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0° to 85°C, relative to 25°C.

  1. Response Time is defined as the time form the incremental change in the output to go from 10% to 90% of its final value when subjected to

a specified step change in pressure.

  1. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.

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Figure 2. Output vs. Pressure Differential very small and are shown under Operating Characteristics. Figure 3. Unibody Package: Cross Sectional Diagram (Not to Scale) pressure signal to be transmitted to the silicon diaphragm. calculations required are burdensome. calculations are more straightforward for the user. Figure 4. Linearity Specification Comparison

differential pressure applied, P1 > P2. Table 3. Pressure (P1) Side Delineation

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NOTES: DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. CONTROLLING DIMENSION: INCH. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). MAM0.136 (0.005) T 1234PIN 1 R N L G F D 4 PL SEATING PLANE -T- C M J B -A- DAMBAR TRIM ZONE: F THIS IS INCLUDED WITHIN DIM. "F" 8 PL 1 23 4 Y Z STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPL Y 4. - OUTPUT STYLE 2: PIN 1. V CC 2. - SUPPL Y 3. + SUPPL Y 4. GROUND STYLE 3: PIN 1. GND 2. -VOUT 3. VS 4. +VOUT DIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.595 0.630 15.11 16.00 B 0.514 0.534 13.06 13.56 C 0.200 0.220 5.08 5.59 D 0.016 0.020 0.41 0.51 F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC J 0.014 0.016 0.36 0.40 L 0.695 0.725 17.65 18.42 M 30˚ NOM 30˚ NOM N 0.475 0.495 12.07 12.57 R 0.430 0.450 10.92 11.43 Y 0.048 0.052 1.22 1.32 Z 0.106 0.118 2.68 3.00 CASE 344-15 ISSUE AA UNIBODY PACKAGE NOTES: DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. D 4 PL F U H L PORT #1 POSITIVE PRESSURE (P1) PIN 1 -A- -Q- S K G -P- SQM0.25 (0.010) T SSM0.13 (0.005) Q ST 12 34 SEATING PLANE B N R C J -T- STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPL Y 4. - OUTPUT DIM MIN MAX MIN MAX MILLIMETERSINCHES A 1.145 1.175 29.08 29.85 B 0.685 0.715 17.40 18.16 C 0.305 0.325 7.75 8.26 D 0.016 0.020 0.41 0.51 F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC H 0.182 0.194 4.62 4.93 J 0.014 0.016 0.36 0.41 K 0.695 0.725 17.65 18.42 L 0.290 0.300 7.37 7.62 N 0.420 0.440 10.67 11.18 P 0.153 0.159 3.89 4.04 Q 0.153 0.159 3.89 4.04 R 0.230 0.250 5.84 6.35 S U 0.910 BSC 23.11 BSC 0.220 0.240 5.59 6.10 CASE 344B-01 ISSUE B UNIBODY PACKAGE

NOTES: DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. PORT #2 PORT #1 PORT #2 VACUUM (P2) (P1) SEATING PLANE SEATING PLANE K S W H L U F G D 4 PL PORT #1 POSITIVE PRESSURE -Q- 12 4 3PIN 1 -P- SSM0.13 (0.005) Q ST B N J C V R -A- STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPL Y 4. - OUTPUT DIM MIN MAX MIN MAX MILLIMETERSINCHES A 1.145 1.175 29.08 29.85 B 0.685 0.715 17.40 18.16 C 0.405 0.435 10.29 11.05 D 0.016 0.020 0.41 0.51 F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC H 0.182 0.194 4.62 4.93 J 0.014 0.016 0.36 0.41 K 0.695 0.725 17.65 18.42 L 0.290 0.300 7.37 7.62 N 0.420 0.440 10.67 11.18 P 0.153 0.159 3.89 4.04 Q 0.153 0.159 3.89 4.04 R 0.063 0.083 1.60 2.11 S U 0.910 BSC 23.11 BSC V 0.248 0.278 6.30 7.06 W 0.310 0.330 7.87 8.38 0.220 0.240 5.59 6.10 CASE 344C-01 ISSUE B UNIBODY PACKAGE NOTES: DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. CONTROLLING DIMENSION: INCH. D 4 PL F U L HPORT #2 VACUUM (P2) POSITIVE PRESSURE (P1) PIN 1 -A- -Q- S K G-P- SQM0.25 (0.010) T SSM0.13 (0.005) Q ST 12 34 SEATING PLANE B N R C J -T- STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPL Y 4. - OUTPUT DIM MIN MAX MIN MAX MILLIMETERSINCHES A 1.145 1.175 29.08 29.85 B 0.685 0.715 17.40 18.16 C 0.305 0.325 7.75 8.26 D 0.016 0.020 0.41 0.51 F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC H 0.182 0.194 4.62 4.93 J 0.014 0.016 0.36 0.41 K 0.695 0.725 17.65 18.42 L 0.290 0.300 7.37 7.62 N 0.420 0.440 10.67 11.18 P 0.153 0.159 3.89 4.04 Q 0.153 0.158 3.89 4.04 R 0.230 0.250 5.84 6.35 S U 0.910 BSC 23.11 BSC 0.220 0.240 5.59 6.10 CASE 344D-01 ISSUE B UNIBODY PACKAGE

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NOTES: DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. E C J V -T- PORT #1 POSITIVE PRESSURE (P1) PIN 1

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-P- G K MQM0.25 (0.010) T U A F S N B SPM0.13 (0.005) Q ST -Q- R 4321 DIM MIN MAX MIN MAX MILLIMETERSINCHES A 1.080 1.120 27.43 28.45 B 0.740 0.760 18.80 19.30 C 0.630 0.650 16.00 16.51 D 0.016 0.020 0.41 0.51 E 0.160 0.180 4.06 4.57 F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC J 0.014 0.016 0.36 0.41 K N 0.070 0.080 1.78 2.03 P 0.150 0.160 3.81 4.06 Q 0.150 0.160 3.81 4.06 R 0.440 0.460 11.18 11.68 S 0.695 0.725 17.65 18.42 U 0.840 0.860 21.34 21.84 V 0.182 0.194 4.62 4.92 0.220 0.240 5.59 6.10 STYLE 1: PIN 1. GROUND 2. V (+) OUT 3. V SUPPL Y 4. V (-) OUT CASE 344F-01 ISSUE B UNIBODY PACKAGE

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Freescale Semiconductor 11 CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE PAGE 1 OF 2

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