MPX2053_08 FREESCALE | Alldatasheet

Document overview

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  • PDF pages: 19

Technical content

Features

  • Temperature Compensated Over 0 °C to +85°C
  • Easy-to-Use Chip Carrier Package Options
  • Ratiometric to Supply Voltage
  • Gauge Ported and Non Ported Options
  • Available in Easy-to-Use Tape & Reel
  • Differential and Gauge Pressure Options

ORDERING INFORMATION

Device Name Case No. # of Ports Pressure Type Device MarkingNone Single Dual Gauge Differential Absolute Small Outline Package (MPXV2053G Series) MPXV2053GP 1369 • • MPXV2053GP MPXV2053DP 1351 • • MPXV2053DP MPXV2053GVP 1368 • • MPXV2053GV Unibody Package (MPX2053 Series) MPX2053D 344 • • MPX2053D MPX2053DP 344C • • MPX2053DP MPX2053GP 344B • • MPX2053GP MPXM2053D 1320 • • MPXM2053D MPXM2053DT1 1320 • • MPXM2053D MPXM2053GS 1320A • • MPXM2053GS MPXM2053GST1 1320A • • MPXM2053GS MPX2053 Series 0 to 50 kPa (0 to 7.25 psi) 40 mV Full Scale (Typical) Application Examples

  • Pump/Motor Control
  • Robotics
  • Level Detectors
  • Medical Diagnostics
  • Pressure Switching
  • Blood Pressure Measurement

Table 1. Operating Characteristics (VS = 10 VDC, TA = 25°C unless otherwise noted, P1 > P2)

  1. 1.0 kPa (kiloPascal) equals 0.145 psi.
  2. Device is ratiometric within this s pecified excitation range. Operating the device above the specified excitation range may induce additional

error due to device self-heating.

  1. Full Scale Span (V FSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
  2. Offset (V off) is defined as the output voltage at the minimum rated pressure.
  3. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a

specified step change in pressure.

  1. Offset stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.

Table 2. Maximum Ratings(1)

  1. Exposure beyond the specified limits may c ause permanent damage or degradation to the device.

6 Freescale Semiconductor

NOTES: DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. CONTROLLING DIMENSION: INCH. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). MAM0.136 (0.005) T 1234PIN 1 R N L G F D 4 PL SEATING PLANE -T- C M J B -A- DAMBAR TRIM ZONE: F THIS IS INCLUDED WITHIN DIM. "F" 8 PL 1 23 4 Y Z STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPL Y 4. - OUTPUT STYLE 2: PIN 1. V CC 2. - SUPPL Y 3. + SUPPL Y 4. GROUND STYLE 3: PIN 1. GND 2. -VOUT 3. VS 4. +VOUT DIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.595 0.630 15.11 16.00 B 0.514 0.534 13.06 13.56 C 0.200 0.220 5.08 5.59 D 0.016 0.020 0.41 0.51 F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC J 0.014 0.016 0.36 0.40 L 0.695 0.725 17.65 18.42 M 30˚ NOM 30˚ NOM N 0.475 0.495 12.07 12.57 R 0.430 0.450 10.92 11.43 Y 0.048 0.052 1.22 1.32 Z 0.106 0.118 2.68 3.00 CASE 344-15 ISSUE AA UNIBODY PACKAGE NOTES: DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. D 4 PL F U H L PORT #1 POSITIVE PRESSURE (P1) PIN 1 -A- -Q- S K G -P- SQM0.25 (0.010) T SSM0.13 (0.005) Q ST 12 34 SEATING PLANE B N R C J -T- STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPL Y 4. - OUTPUT DIM MIN MAX MIN MAX MILLIMETERSINCHES A 1.145 1.175 29.08 29.85 B 0.685 0.715 17.40 18.16 C 0.305 0.325 7.75 8.26 D 0.016 0.020 0.41 0.51 F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC H 0.182 0.194 4.62 4.93 J 0.014 0.016 0.36 0.41 K 0.695 0.725 17.65 18.42 L 0.290 0.300 7.37 7.62 N 0.420 0.440 10.67 11.18 P 0.153 0.159 3.89 4.04 Q 0.153 0.159 3.89 4.04 R 0.230 0.250 5.84 6.35 S U 0.910 BSC 23.11 BSC 0.220 0.240 5.59 6.10 CASE 344B-01 ISSUE B UNIBODY PACKAGE

NOTES: DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. PORT #2 PORT #1 PORT #2 VACUUM (P2) (P1) SEATING PLANE SEATING PLANE K S W H L U F G D 4 PL PORT #1 POSITIVE PRESSURE -Q- 12 4 3PIN 1 -P- SSM0.13 (0.005) Q ST B N J C V R -A- STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPL Y 4. - OUTPUT DIM MIN MAX MIN MAX MILLIMETERSINCHES A 1.145 1.175 29.08 29.85 B 0.685 0.715 17.40 18.16 C 0.405 0.435 10.29 11.05 D 0.016 0.020 0.41 0.51 F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC H 0.182 0.194 4.62 4.93 J 0.014 0.016 0.36 0.41 K 0.695 0.725 17.65 18.42 L 0.290 0.300 7.37 7.62 N 0.420 0.440 10.67 11.18 P 0.153 0.159 3.89 4.04 Q 0.153 0.159 3.89 4.04 R 0.063 0.083 1.60 2.11 S U 0.910 BSC 23.11 BSC V 0.248 0.278 6.30 7.06 W 0.310 0.330 7.87 8.38 0.220 0.240 5.59 6.10 CASE 344C-01 ISSUE B UNIBODY PACKAGE

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Freescale Semiconductor 10 CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE PAGE 1 OF 2

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Freescale Semiconductor 12 PACKAGE DIMENSIONS CASE 1320-02 ISSUE B PAGE 1 OF 2

Freescale Semiconductor 13 PACKAGE DIMENSIONS CASE 1320-02 ISSUE B PAGE 2 OF 2

Freescale Semiconductor 14 PACKAGE DIMENSIONS CASE 1320A-02 ISSUE A PIN 4 PIN 1 PAGE 1 OF 2

Freescale Semiconductor 15 PACKAGE DIMENSIONS CASE 1320A-02 ISSUE A PAGE 2 OF 2

Freescale Semiconductor 16 PACKAGE DIMENSIONS CASE 1368-01 ISSUE B SMALL OUTLINE PACKAGE SURFACE MOUNT

Freescale Semiconductor 17 PACKAGE DIMENSIONS CASE 1368-01 ISSUE B SMALL OUTLINE PACKAGE SURFACE MOUNT

Freescale Semiconductor 18 PACKAGE DIMENSIONS CASE 1368-01 ISSUE B SMALL OUTLINE PACKAGE SURFACE MOUNT

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