MPX2010_08 FREESCALE | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 17
Technical content
Features
- Temperature Compensated over 0 °C to +85°C
- Ratiometric to Supply Voltage
- Differential and Gauge Options
- Available in Easy-to-Use Tape & Reel
ORDERING INFORMATION
No. # of Ports Pressure Type Device MarkingNone Single Dual Gauge Differential Absolute Small Outline Package (MPXV2010 Series) MPXV2010GP Tray 1369 • • MPXV2010GP MPXV2010DP Tray 1351 • • MPXV2010DP Unibody Package (MPX2010 Series) MPX2010D Tray 344
- • MPX2010D MPX2010DP Tray 344C • • MPX2010DP MPX2010GP Tray 344B • • MPX2010GP MPX2010GS Tray 344E • • MPX2010D MPX2010GSX Tray 344F • • MPX2010D MPXM2010D Rail 1320 • • MPXM2010D MPXM2010DT1 Tape and Reel 1320 • • MPXM2010D MPXM2010GS Rail 1320A • • MPXM2010GS MPXM2010GST1 Tape and Reel 1320A • • MPXM2010GS MPX2010 Series 0 to 10 kPa (0 to 1.45 psi) 25 mV Full Scale (Typical) Application Examples
- Respiratory Diagnostics
- Air Movement Control
- Controllers
- Pressure Switching UNIBODY PACKAGES SMALL OUTLINE PACKAGES MPXV2010GP CASE 1369-01 MPXV2010DP CASE 1351-01 MPX2010D CASE 344-15 MPX2010GP CASE 344B-01 MPX2010DP CASE 344C-01 MPX2010GS CASE 344E-01 MPX2010GSX CASE 344F-01 MPXM2010D/DT1 CASE 1320-02 MPXM2010GS/GST1 CASE 1320A-02 MPAK PACKAGES
2 Freescale Semiconductor
Table 1. Operating Characteristics (VS = 10 VDC, TA = 25°C unless otherwise noted, P1 > P2)
- 1.0 kPa (kiloPascal) equals 0.145 psi.
- Device is ratiometric within this specified excitation range. Operating the device at a different range may induce additional error due to device
- Full Scale Span (V FSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
- Offset (V OFF) is defined as the output voltage at the minimum rated pressure.
- Response Time is defined as the time for the incremental c hange in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
- Offset stability is the product's output deviation when subjec ted to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
4 Freescale Semiconductor
Figure 2. shows the output characteristics of the MPX2010 differential pressure and is essentially a straight line. very small and are shown under Operating Characteristics. calibration and temperature compensation. Figure 3. illustrates the differential/gauge die in the basic pressure signal to be transmitted to the silicon diaphragm. information regarding media compatibility in your application. calculations required are burdensome. calculations are more straightforward for the user. Figure 2. Output vs. Pressure Differential Figure 3. Unibody Package: Cross Sectional Diagram Figure 4. Linearity Specification Comparison
Table 3. Pressure (P1) Side Delineation
6 Freescale Semiconductor
NOTES: DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. CONTROLLING DIMENSION: INCH. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). MAM0.136 (0.005) T 1234PIN 1 R N L G F D 4 PL SEATING PLANE -T- C M J B -A- DAMBAR TRIM ZONE: F THIS IS INCLUDED WITHIN DIM. "F" 8 PL 1 23 4 Y Z STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPL Y 4. - OUTPUT STYLE 2: PIN 1. V CC 2. - SUPPL Y 3. + SUPPL Y 4. GROUND STYLE 3: PIN 1. GND 2. -VOUT 3. VS 4. +VOUT DIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.595 0.630 15.11 16.00 B 0.514 0.534 13.06 13.56 C 0.200 0.220 5.08 5.59 D 0.016 0.020 0.41 0.51 F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC J 0.014 0.016 0.36 0.40 L 0.695 0.725 17.65 18.42 M 30˚ NOM 30˚ NOM N 0.475 0.495 12.07 12.57 R 0.430 0.450 10.92 11.43 Y 0.048 0.052 1.22 1.32 Z 0.106 0.118 2.68 3.00 CASE 344-15 ISSUE AA UNIBODY PACKAGE NOTES: DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. D 4 PL F U H L PORT #1 POSITIVE PRESSURE (P1) PIN 1 -A- -Q- S K G -P- SQM0.25 (0.010) T SSM0.13 (0.005) Q ST 12 34 SEATING PLANE B N R C J -T- STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPL Y 4. - OUTPUT DIM MIN MAX MIN MAX MILLIMETERSINCHES A 1.145 1.175 29.08 29.85 B 0.685 0.715 17.40 18.16 C 0.305 0.325 7.75 8.26 D 0.016 0.020 0.41 0.51 F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC H 0.182 0.194 4.62 4.93 J 0.014 0.016 0.36 0.41 K 0.695 0.725 17.65 18.42 L 0.290 0.300 7.37 7.62 N 0.420 0.440 10.67 11.18 P 0.153 0.159 3.89 4.04 Q 0.153 0.159 3.89 4.04 R 0.230 0.250 5.84 6.35 S U 0.910 BSC 23.11 BSC 0.220 0.240 5.59 6.10 CASE 344B-01 ISSUE B UNIBODY PACKAGE
NOTES: DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. PORT #2 PORT #1 PORT #2 VACUUM (P2) (P1) SEATING PLANE SEATING PLANE K S W H L U F G D 4 PL PORT #1 POSITIVE PRESSURE -Q- 12 4 3PIN 1 -P- SSM0.13 (0.005) Q ST B N J C V R -A- STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPL Y 4. - OUTPUT DIM MIN MAX MIN MAX MILLIMETERSINCHES A 1.145 1.175 29.08 29.85 B 0.685 0.715 17.40 18.16 C 0.405 0.435 10.29 11.05 D 0.016 0.020 0.41 0.51 F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC H 0.182 0.194 4.62 4.93 J 0.014 0.016 0.36 0.41 K 0.695 0.725 17.65 18.42 L 0.290 0.300 7.37 7.62 N 0.420 0.440 10.67 11.18 P 0.153 0.159 3.89 4.04 Q 0.153 0.159 3.89 4.04 R 0.063 0.083 1.60 2.11 S U 0.910 BSC 23.11 BSC V 0.248 0.278 6.30 7.06 W 0.310 0.330 7.87 8.38 0.220 0.240 5.59 6.10
8 Freescale Semiconductor
NOTES: DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. E C J V -T- PORT #1 POSITIVE PRESSURE (P1) PIN 1
4 PLD
-P- G K MQM0.25 (0.010) T U A F S N B SPM0.13 (0.005) Q ST -Q- R 4321 DIM MIN MAX MIN MAX MILLIMETERSINCHES A 1.080 1.120 27.43 28.45 B 0.740 0.760 18.80 19.30 C 0.630 0.650 16.00 16.51 D 0.016 0.020 0.41 0.51 E 0.160 0.180 4.06 4.57 F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC J 0.014 0.016 0.36 0.41 K N 0.070 0.080 1.78 2.03 P 0.150 0.160 3.81 4.06 Q 0.150 0.160 3.81 4.06 R 0.440 0.460 11.18 11.68 S 0.695 0.725 17.65 18.42 U 0.840 0.860 21.34 21.84 V 0.182 0.194 4.62 4.92 0.220 0.240 5.59 6.10 STYLE 1: PIN 1. GROUND 2. V (+) OUT 3. V SUPPL Y 4. V (-) OUT
10 Freescale Semiconductor
Freescale Semiconductor 11 Pressure PACKAGE DIMENSIONS CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE PAGE 1 OF 2
12 Freescale Semiconductor
Freescale Semiconductor 13 Pressure PACKAGE DIMENSIONS CASE 1320-02 ISSUE B MPAK
14 Freescale Semiconductor
Freescale Semiconductor 15 Pressure PACKAGE DIMENSIONS CASE 1320A-02 ISSUE A MPAK PIN 4 PIN 1
16 Freescale Semiconductor
Rev. 13 How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516
2100 East Elliot Road
Tempe, Arizona 85284 1-800-521-6274 or +1-480-768-2130 www.freescale.com/support Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7
81829 Muenchen, Germany
+44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) www.freescale.com/support Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064 Japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com Asia/Pacific: Freescale Semiconductor China Ltd. Exchange Building 23F No. 118 Jianguo Road Chaoyang District Beijing 100022 China +86 010 5879 8000 support.asia@freescale.com For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1-800-441-2447 or +1-303-675-2140 Fax: +1-303-675-2150 LDCForFreescaleSemiconductor@hibbertgroup.com Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”, must be validated for each customer application by customer’s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2008. All rights reserved.