MPX5050_09 FREESCALE | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 18
Technical content
Features
- 2.5% Maximum Error over 0 ° to 85°C
- Ideally suited for Mi croprocessor or Microcontroller-Based Systems
- Temperature Compensated Over -40 ° to +125°C
- Patented Silicon Shear Stress Strain Gauge
- Durable Epoxy Unibody Element
- Easy-to-Use Chip Carrier Option
ORDERING INFORMATION
No. # of Ports Pressure Type Device MarkingNone Single Dual Gauge Differential Absolute Unibody Package (MPX5050 Series) MPX5050D 867 • • MPX5050D MPX5050DP 867C • • MPX5050DP MPX5050GP 867B • • MPX5050GP MPX5050GP1 867B • • MPX5050GP Small Outline Package (MPXV5050 Series) MPXV5050GP 1369 • • MPXV5050GP MPXV5050DP 1351 • • MPXV5050DP MPXV5050GC6U 482A • • MPXV5050G MPXV5050GC6T1 482A • • MPXV5050G Small Outline Package (Media Resistant Gel) (MPVZ5050 Series) MPVZ5050GW7U 1560 • • MZ5050GW MPX5050 Series 0 to 50 kPa (0 to 7.25 psi) 0.2 to 4.7 V Output MPXV5050 MPVZ5050
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Table 1. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in
- 1.0 kPa (kiloPascal) equals 0.145 psi.
2.Device is ratiometric within this specified excitation range. 3.Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4.Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. from the minimum or maximum operating temperature points, with zero differential pressure applied. maximum rated pressure at 25°C. TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C. TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative to 25°C. Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS at 25°C. specified step change in pressure. 8.Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. 9.Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
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Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. Figure 1. Fully Integrated Pressure Sensor Schematic Table 2. Maximum Ratings(1) 1.Exposure beyond the specified limits may cause permanent damage or degradation to the device.
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PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing fluorosilicone gel which protects the die from harsh media. The MPX pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below: Nominal Transfer Value: Vout = VS (P x 0.018 + 0.04) ± (Pressure Error x Temp. Factor x 0.018 x VS) VS = 5.0 V ± 0.25 Vdc Transfer Function Temp Multiplier –40 3 0 to 85 1 +125 3Temperature in °C 4.0 3.0 2.0 0.0 1.0 –40 –20 0 20 40 60 14012010080 Temperature Error Factor NOTE: The Temperature Multiplier is a linear response from 0° to –40°C and from 85° to 125°C. Temperature Error Band Pressure Error (Max) Pressure Error Band 0 to 50 (kPa) ±1.25 (kPa) Error Limits for Pressure Pressure (in kPa) 3.0 2.0 1.0 –1.0 –2.0 –3.0 0.0 01 02 0 3 0 4 0 5 0 60 Pressure Error (kPa) Part Number Case Type Pressure (P1) Side Identifier MPX5050D 867 Stainless Steel Cap MPX5050DP 867C Side with Part Marking MPX5050GP 867B Side with Port Attached MPXV5050GP 1369 Side with Port Attached MPXV5050DP 1351 Side with Part Marking MPXV5050GC6U/T1 482S Vertical Port Attached
A 10.540.4250.415 10.79 B 10.540.4250.415 10.79 C 12.700.5200.500 13.21 D 0.960.0420.038 1.07 G 0.100 BSC 2.54 BSC H 0.002 0.010 0.05 0.25 J 0.009 0.011 0.23 0.28 K 0.061 0.071 1.55 1.80 M 0 7 0 7 N 0.444 0.448 11.28 11.38 S 0.709 0.725 18.01 18.41 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 /C0095 TYPICAL DRAFT. /C0095/C0095 /C0095/C0095 S D G 8 PL SBM0.25 (0.010) A ST –A– –B– C M J K PIN 1 IDENTIFIER H SEATING PLANE –T– N V W V 0.245 0.255 6.22 6.48 W 0.115 0.125 2.92 3.17 PIN 1 F G N L R 123456
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MAM0.136 (0.005) T POSITIVE PRESSURE (P1) C B M J S -A- STYLE 1: PIN 1. VOUT 2. GROUND 3. VCC 4. V1 5. V2 6. VEX STYLE 3: PIN 1. OPEN 2. GROUND 3. +VOUT 4. +VSUPPL Y 5. -VOUT 6. OPEN STYLE 2: PIN 1. OPEN 2. GROUND 3. -VOUT 4. VSUPPL Y 5. +VOUT 6. OPEN MAX MILLIMETERSINCHES 16.00 13.56 5.59 0.84 1.63 0.100 BSC 2.54 BSC 0.40 18.42 30˚ NOM 30˚ NOM 12.57 11.43 DIM A B C D F G J L M N R S MIN 0.595 0.514 0.200 0.027 0.048 0.014 0.695 0.475 0.430 0.090 MAX 0.630 0.534 0.220 0.033 0.064 0.016 0.725 0.495 0.450 0.105 MIN 15.11 13.06 5.08 0.68 1.22 0.36 17.65 12.07 10.92 2.29 2.66 NOTES: DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630).
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NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. STYLE 1: PIN 1. V OUT2. GROUND 3. V CC4. V1 5. V2 6. V EX R X 123 45 6 DIM MIN MAX MIN MAX MILLIMETERSINCHES A 1.145 1.175 29.08 29.85 B 0.685 0.715 17.40 18.16 C 0.405 0.435 10.29 11.05 D 0.027 0.033 0.68 0.84 F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC J 0.014 0.016 0.36 0.41 K 0.695 0.725 17.65 18.42 L 0.290 0.300 7.37 7.62 N 0.420 0.440 10.67 11.18 P 0.153 0.159 3.89 4.04 Q 0.153 0.159 3.89 4.04 R 0.063 0.083 1.60 2.11 S U 0.910 BSC 23.11 BSC V 0.182 0.194 4.62 4.93 W 0.310 0.330 7.87 8.38 X 0.248 0.278 6.30 7.06 PORT #2 VACUUM (P2) PORT #1 POSITIVE PORT #1 PIN 1 PORT #2 POSITIVE VACUUM PRESSURE SEATING PLANE SEATING PLANE –T– –T– P G C J N B F D W V L U 6 PL S K –Q– –A–MQM0.25 (0.010) T MAM0.13 (0.005) PRESSURE (P1) 0.220 0.240 5.59 6.10 (P1) (P2)
Freescale Semiconductor 11 Pressure PACKAGE DIMENSIONS CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE PAGE 1 OF 2
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Freescale Semiconductor 13 Pressure PACKAGE DIMENSIONS CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE PAGE 1 OF 2
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Freescale Semiconductor 15 Pressure PACKAGE DIMENSIONS CASE 1560-03 ISSUE D SMALL OUTLINE PACKAGE PAGE 1 OF 3
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Freescale Semiconductor 17 Pressure PACKAGE DIMENSIONS CASE 1560-03 ISSUE D SMALL OUTLINE PACKAGE PAGE 3 OF 3
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