MPVZ5010G FREESCALE | Alldatasheet
Document overview
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Technical content
Features
5.0% Maximum Error over 0 ° to 85°C Temperature Compensated over -40 ° to +125°C Durable Thermopl astic (PPS) Package Available in Surface Mount (SMT) or Through-hole (DIP) Configurations Application Examples Washing Machine Water Level Measurement (Reference AN1950) Ideally Suited for Mi croprocessor or Microcontroller-Based Systems Appliance Liquid Level and Pressure Measurement Respiratory Equipment
ORDERING INFORMATION
No. MPVZ Series Order No. Packing Options Device Marking Surface Mount 1735-01 MPVZ5010GW6U Rails MZ5010GW Through-Hole 1560-02 MPVZ5010GW7U Rails MZ5010GW Surface Mount 482-01 MPVZ5010G6U Rails MZ5010G Surface Mount 482-01 MPVZ5010G6T1 Tape & Reel MZ5010G Through-Hole 482B-03 MPVZ5010G7U Rails MZ5010G MPVZ5010G SERIES PIN NUMBERS(1) 1. Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead.
1 N/C 5 N/C
2 VS 6 N/C
3 GND 7 N/C
4 VOUT 8 N/C
0 to 10 kPA (0 to 1019.78 mm H2O) 0.2 to 4.7 V OUTPUT SMALL OUTLINE PACKAGE SURFACE MOUNT SMALL OUTLINE PACKAGE THROUGH-HOLE J MPVZ5010GW6U CASE 1735-01 MPVZ5010G6U/T1 CASE 482-01 MPVZ5010G7U CASE 482B-03 MPVZ5010GW7U CASE 1560-02
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Figure 1. Fully Integrated Pressure Sensor Schematic Table 1. Maximum Ratings(1)
- Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Table 2. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in
- 1.0 kPa (kiloPascal) equals 0.145 psi.
- Device is ratiometric within this specified excitation range.
- Offset (V off) is defined as the output voltage at the minimum rated pressure.
- Full Scale Output (V FSO) is defined as the output voltage at the maximum or full rated pressure.
- Full Scale Span (V FSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
- Accuracy (error budget) c onsists of the following:
Linearity: Output deviation from a straight line relations hip with pressure over the specified pressure range. and from the minimum or maximum operating temperature points, with zero differential pressure applied. minimum or maximum rated pressure, at 25°C. TcSpan: Output deviation over the temperature range of 0 ° to 85°C, relative to 25°C. TcOffset: Output deviation with minimum rated pr essure applied, over the temperature range of 0° to 85°C, relative to 25°C. Variation from Nominal: T he variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C.
- Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
- Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.
- Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
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onto a single monolithic chip. information regarding media compatibility in your application. power supply is recommended. output will saturate outside of the specified pressure range. Figure 2. Cross-Sectional Diagram SOP Figure 3. Recommended Power Supply Decoupling Figure 4. Output versus Pressure Differential
Nominal Transfer Value: Vout = VS x (0.09 x P + 0.04) ± (Pressure Error x Temp. Factor x 0.09 x VS) VS = 5.0 V ± 0.25 Vdc P = kPa Transfer Function (MPVZ5010G) MPVZ5010G SERIES Temp Multiplier 40 3 0 to 85 1 +125 3 Temperature in °C 4.0 3.0 2.0 0.0 1.0 40 20 0 20 40 60 14012010080 Temperature Error Factor NOTE: The Temperature Multiplier is a linear response from 0° to 40°C and from 85° to 125°C. Temperature Error Band Pressure Error (Max) Pressure Error Band 0 to 10 (kPa) ±0.5 (kPa) Pressure (kPa) 0.5 0.4 0.2 0.3 0.4 0.5 0 123456 7 890 0.3 0.1 0.2 0.1 Pressure Error (kPa)
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shorting between solder pads. Figure 5. SOP Footprint (Case 482)
0.060 TYP 8X
0.100 TYP 8X
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Freescale Semiconductor 11 PACKAGE DIMENSIONS CASE 1560-02 ISSUE C SMALL OUTLINE PACKAGE PAGE 2 OF 3
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Freescale Semiconductor 13 PACKAGE DIMENSIONS CASE 482-01 ISSUE O SMALL OUTLINE PACKAGE CASE 482B-03 ISSUE B SMALL OUTLINE PACKAGE S D 8 PL G SBM0.25 (0.010) A ST -A- -B- N C M J K PIN 1 IDENTIFIER H SEATING PLANE -T- DIM MIN MAX MIN MAX MILLIMETERSINCHES A 10.540.4250.415 10.79 B 10.540.4250.415 10.79 C 5.380.2300.212 5.84 D 0.960.0420.038 1.07 G 0.100 BSC 2.54 BSC H 0.002 0.010 0.05 0.25 J 0.009 0.011 0.23 0.28 K 0.061 0.071 1.55 1.80 M 0˚ 7˚ 0˚ 7˚ N 0.405 0.415 10.29 10.54 S 0.709 0.725 18.01 18.41 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT . MILLIMETERSINCHES 0.100 BSC 2.54 BSC DIM A B C D G J K M N S MIN 0.415 0.415 0.210 0.026 0.009 0.100 0.405 0.540 MAX 0.425 0.425 0.220 0.034 0.011 0.120 15˚ 0.415 0.560 MIN 10.54 10.54 5.33 0.66 0.23 2.54 10.29 13.72 MAX 10.79 10.79 5.59 0.864 0.28 3.05 15˚ 10.54 14.22 PIN 1 IDENTIFIER K SEATING PLANE-T- DETAIL X S G -A- -B- C M J N D 8 PL SBM0.25 (0.010) A ST DETAIL X NOTES: DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. MAXIMUM MOLD PROTRUSION 0.15 (0.006). ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL.
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