MPX5010_09 FREESCALE | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 23

Technical content

Features

  • 5.0% Maximum Error over 0 ° to 85°C
  • Ideally Suited for Mi croprocessor or Microcontroller-Based Systems
  • Durable Epoxy Unibody and Thermoplastic (PPS) Surface Mount Package
  • Temperature Compensated over -40 ° to +125°C
  • Patented Silicon Shear Stress Strain Gauge
  • Available in Differential and Gauge Configurations
  • Available in Surface Mount (SMT) or Through-hole (DIP) Configurations

ORDERING INFORMATION

Device Name Case No. # of Ports Pressure Type Device MarkingNone Single Dual Gauge Differential Absolute Unibody Package (MPX5010 Series) MPX5010DP 867C • • MPX5010DP MPX5010GP 867B • • MPX5010GP MPX5010GS 867E • • MPX5010D MPX5010GSX 867F • • MPX5010D Small Outline Package (MPXV5010 Series) MPXV5010DP 1351 • • MPXV5010DP MPXV5010G6U 482 • • MPXV5010G MPXV5010GC6T1 482A • • MPXV5010G MPXV5010GC6U 482A • • MPXV5010G MPXV5010GC7U 482C • • MPXV5010G MPXV5010GP 1369 • • MPXV5010GP Small Outline Package (Media Resistant Gel) (MPVZ5010 Series) MPVZ5010G6U 482 • • MPVZ5010G MPVZ5010G6T1 482 • • MPVZ5010G MPVZ5010G7U 482B • • MPVZ5010G MPVZ5010GW6U 1735 • • MZ5010GW MPVZ5010GW7U 1560 • • MZ5010GW MPX5010 Series 0 to 10 kPa (0 to 1.45 psi) (0 to 1019.78 mm H2O) 0.2 to 4.7 V Output MPXV5010 MPVZ5010 Application Examples

  • Hospital Beds
  • H V A C
  • Respiratory Systems
  • Process Control
  • Washing Machine Water Level Measurement (Reference AN1950)
  • Ideally Suited for Microprocessor or Microcontroller-Based Systems
  • Appliance Liquid Level and Pressure Measurement

2 Freescale Semiconductor

SMALL OUTLINE PACKAGES THROUGH-HOLE SMALL OUTLINE PACKAGES SURFACE MOUNT MPXV5010G6U, MPVZ5010G6U/T1 CASE 482-01 J MPVZ5010G7U CASE 482B-03 MPVZ5010GW6U CASE 1735-01 MPVZ5010GW7U CASE 1560-02

Table 1. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in

  1. Device is ratiometric within this specified excitation range.
  2. Offset (V off) is defined as the output voltage at the minimum rated pressure.
  3. Full Scale Output (V FSO) is defined as the output voltage at the maximum or full rated pressure.
  4. Full Scale Span (V FSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
  5. Accuracy (error budget) c onsists of the following:

Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. from the minimum or maximum operating temperature points, with zero differential pressure applied. maximum rated pressure, at 25°C. TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C. TcOffset:Output deviation with minimum rated pressure applied, over the temperature range of 0° to 85°C, relative to 25°C.

  1. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a

specified step change in pressure.

  1. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.
  2. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.

4 Freescale Semiconductor

Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. Figure 1. Fully Integrated Pressure Sensor Schematic Table 2. Maximum Ratings(1)

  1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.

6 Freescale Semiconductor

Nominal Transfer Value: Vout = VS x (0.09 x P + 0.04) ± (Pressure Error x Temp. Factor x 0.09 x VS) VS = 5.0 V ± 0.25 Vdc Transfer Function Temp Multiplier –40 3 0 to 85 1 +125 3 Temperature in °C 4.0 3.0 2.0 0.0 1.0 –40 –20 0 20 40 60 14012010080 Temperature Error Factor NOTE: The Temperature Multiplier is a linear response from 0° to –40°C and from 85° to 125°C. Temperature Error Band Pressure Error (Max) Pressure Error Band 0 to 10 (kPa) ±0.5 (kPa) Pressure (kPa) 0.5 0.4 0.2 –0.3 –0.4 –0.5 0 123456 7 890 0.3 0.1 –0.2 –0.1 Pressure Error (kPa)

shorting between solder pads. Figure 5. SOP Footprint (Case 482)

0.060 TYP 8X

0.100 TYP 8X

8 Freescale Semiconductor

S D 8 PL G SBM0.25 (0.010) A ST -A- -B- N C M J K PIN 1 IDENTIFIER H SEATING PLANE -T- DIM MIN MAX MIN MAX MILLIMETERSINCHES A 10.540.4250.415 10.79 B 10.540.4250.415 10.79 C 5.380.2300.212 5.84 D 0.960.0420.038 1.07 G 0.100 BSC 2.54 BSC H 0.002 0.010 0.05 0.25 J 0.009 0.011 0.23 0.28 K 0.061 0.071 1.55 1.80 M 0˚ 7˚ 0˚ 7˚ N 0.405 0.415 10.29 10.54 S 0.709 0.725 18.01 18.41 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT . DIM MIN MAX MIN MAX MILLIMETERSINCHES A 10.540.4250.415 10.79 B 10.540.4250.415 10.79 C 12.700.5200.500 13.21 D 0.960.0420.038 1.07 G 0.100 BSC 2.54 BSC H 0.002 0.010 0.05 0.25 J 0.009 0.011 0.23 0.28 K 0.061 0.071 1.55 1.80 M 0 7 0 7 N 0.444 0.448 11.28 11.38 S 0.709 0.725 18.01 18.41 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 /C0095 TYPICAL DRAFT. /C0095/C0095 /C0095/C0095 S D G 8 PL SBM0.25 (0.010) A ST –A– –B– C M J K PIN 1 IDENTIFIER H SEATING PLANE –T– N V W V 0.245 0.255 6.22 6.48 W 0.115 0.125 2.92 3.17

0.100 BSC 2.54 BSC DIM A B C D G J K M N S MIN 0.415 0.415 0.210 0.026 0.009 0.100 0.405 0.540 MAX 0.425 0.425 0.220 0.034 0.011 0.120 15˚ 0.415 0.560 MIN 10.54 10.54 5.33 0.66 0.23 2.54 10.29 13.72 MAX 10.79 10.79 5.59 0.864 0.28 3.05 15˚ 10.54 14.22 PIN 1 IDENTIFIER K SEATING PLANE-T- DETAIL X S G -A- -B- C M J N D 8 PL SBM0.25 (0.010) A ST DETAIL X NOTES: DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. MAXIMUM MOLD PROTRUSION 0.15 (0.006). ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL. DIM MIN MAX MIN MAX MILLIMETERSINCHES A 10.540.4250.415 10.79 B 10.540.4250.415 10.79 C 12.700.5200.500 13.21 D 0.660.0340.026 0.864 G 0.100 BSC 2.54 BSC J 0.009 0.011 0.23 0.28 K 0.100 0.120 2.54 3.05 M 0 15 0 15 N 0.444 0.448 11.28 11.38 S 0.540 0.560 13.72 14.22 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 /C0095 TYPICAL DRAFT. 6. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL. /C0095/C0095 /C0095/C0095PIN 1 K SEATING PLANE–T– S G –A– –B– C N V W M J V 0.245 0.255 6.22 6.48 W 0.115 0.125 2.92 3.17 IDENTIFIER D 8 PL SBM0.25 (0.010) A ST DETAIL X DETAIL X

10 Freescale Semiconductor

STYLE 1: PIN 1. VOUT 2. GROUND 3. VCC 4. V1 5. V2 6. VEX PIN 1 F G N L R C B M J S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION –A– IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630). –A– 123456

6 PLD

PLANE –T– MAM0.136 (0.005) T DIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.595 0.630 15.11 16.00 B 0.514 0.534 13.06 13.56 C 0.200 0.220 5.08 5.59 D 0.027 0.033 0.68 0.84 F 0.048 0.064 1.22 1.63 G 0.100 BSC 2.54 BSC J 0.014 0.016 0.36 0.40 L 0.695 0.725 17.65 18.42 M 30 NOM 30 NOM N 0.475 0.495 12.07 12.57 R 0.430 0.450 10.92 11.43 S 0.090 0.105 2.29 2.66 /C0095/C0095 STYLE 3: PIN 1. OPEN 2. GROUND 3. +VOUT 4. +VSUPPLY 5. –VOUT 6. OPEN STYLE 2: PIN 1. OPEN 2. GROUND 3. –VOUT 4. VSUPPLY 5. +VOUT 6. OPEN POSITIVE PRESSURE (P1) C E V J PORT #1 POSITIVE PRESSURE (P1) -T- -P- MQM0.25 (0.010) T D 6 PL F G K PIN 1 U A B R S N -Q- SPM0.13 (0.005) Q ST 65 4321 STYLE 1: PIN 1. VOUT 2. GROUND 3. V CC 4. V1 5. V2 6. V EX MILLIMETERSINCHES 0.100 BSC 2.54 BSC DIM A B C D E F G J K N P Q R S U V MIN 1.080 0.740 0.630 0.027 0.160 0.048 0.014 0.070 0.150 0.150 0.440 0.695 0.840 0.182 0.220 MAX 1.120 0.760 0.650 0.033 0.180 0.064 0.016 0.080 0.160 0.160 0.460 0.725 0.860 0.194 0.240 MIN 27.43 18.80 16.00 0.68 4.06 1.22 0.36 1.78 3.81 3.81 11.18 17.65 21.34 4.62 5.59 MAX 28.45 19.30 16.51 0.84 4.57 1.63 0.41 2.03 4.06 4.06 11.68 18.42 21.84 4.93 6.10 NOTES: DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH.

Freescale Semiconductor 11 Pressure PACKAGE DIMENSIONS CASE 867B-04 ISSUE G UNIBODY PACKAGE PAGE 1 OF 2

12 Freescale Semiconductor

Freescale Semiconductor 13 Pressure PACKAGE DIMENSIONS CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE PAGE 1 OF 2

14 Freescale Semiconductor

Freescale Semiconductor 15 Pressure PACKAGE DIMENSIONS CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE PAGE 1 OF 2

16 Freescale Semiconductor

Freescale Semiconductor 17 Pressure PACKAGE DIMENSIONS 1560-03 ISSUE C SMALL OUTLINE PACKAGE PAGE 1 OF 3

18 Freescale Semiconductor

Freescale Semiconductor 19 Pressure PACKAGE DIMENSIONS CASE 1560-03 ISSUE D SMALL OUTLINE PACKAGE PAGE 3 OF 3

20 Freescale Semiconductor

Freescale Semiconductor 21 Pressure PACKAGE DIMENSIONS CASE 1735-02 ISSUE B SMALL OUTLINE PACKAGE PAGE 2 OF 3

22 Freescale Semiconductor

Rev. 12 How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516

2100 East Elliot Road

Tempe, Arizona 85284 1-800-521-6274 or +1-480-768-2130 www.freescale.com/support Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7

81829 Muenchen, Germany

+44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) www.freescale.com/support Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064 Japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com Asia/Pacific: Freescale Semiconductor China Ltd. Exchange Building 23F No. 118 Jianguo Road Chaoyang District Beijing 100022 China +86 010 5879 8000 support.asia@freescale.com For Literature Requests Only: Freescale Semiconductor Literature Distribution Center 1-800-441-2447 or +1-303-675-2140 Fax: +1-303-675-2150 LDCForFreescaleSemiconductor@hibbertgroup.com Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”, must be validated for each customer application by customer’s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2009. All rights reserved.