MPXV5004_09 FREESCALE | Alldatasheet

Document overview

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  • PDF pages: 22

Technical content

Features

  • 1.5% Maximum Error for 0 to 100 mm H 2O over +10° to +60°C with Auto Zero
  • 2.5% Maximum Error for 100 to 400 mm H 2O over +10° to +60°C with Auto Zero
  • 6.25% Maximum Error for 0 to 400 mm H 2O over +10° to +60°C without Auto Zero
  • Temperature Compensated over 10 ° to 60°C
  • Available in Gauge Surface Mount (SMT) or Through-Hole (DIP) Configurations
  • Durable Thermopl astic (PPS) Package

ORDERING INFORMATION

No. # of Ports Pressure Type Device MarkingNone Single Dual Gauge Differential Absolute Small Outline Package (MPXV5004 Series) MPXV5004DP 1351 • • MPXV5004DP MPXV5004GC6T1 482A • • MPXV5004G MPXV5004GC6U 482A • • MPXV5004G MPXV5004GC7U 482C • • MPXV5004G MPXV5004GP 1369 • • MPXV5004GP MPXV5004GPT1 1369 • • MPXV5004GP MPXV5004GVP 1368 • • MPXV5004GVP Small Outline Package (Media Resistant Gel) (MPVZ5004 Series) MPVZ5004G6T1 482 • • MPVZ5004G MPVZ5004G6U 482 • • MPVZ5004G MPVZ5004G7U 482B • • MPVZ5004G MPVZ5004GC6U 482A • • MPVZ5004G MPVZ5004GW6U 1735 • • MZ5004GW MPVZ5004GW7U 1560 • • MZ5004GW MPXV5004 Series 0 to 3.92 kPa (0 to 400 mm H2O) 1.0 to 4.9 V Output MPVZ5004 Application Examples

  • Washing Machine Water Level
  • Ideally Suited for Microprocessor or Microcontroller-Based Systems
  • Appliance Liquid Level and Pressure Measurement
  • Respiratory Equipment

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SMALL OUTLINE PACKAGES THROUGH-HOLE SMALL OUTLINE PACKAGES SURFACE MOUNT MPXV5004GC7U CASE 482C-03 MPXV5004GVP CASE 1368-01 MPXV5004GP/GPT1 CASE 1369-01 MPXV5004G6U/6T1, MPVZ5004GC6U CASE 482A-01 MPXV5004DP CASE 1351-01 MPVZ5004G6U/6T1 CASE 482-01 MPVZ5004GW7U CASE 1560-02 MPVZ5004G7U CASE 482B-03 MPVZ5004GW6U CASE 1735-01

Table 1. Operating Characteristics (VS = 5.0 VDC, TA = 25°C unless otherwise noted, P1 > P2)

  1. Device is ratiometric within this specified excitation range.
  2. Span is defined as the algebraic difference between the output voltage at specified pressure and the output voltage at the minimum rated
  3. Offset (V off) is defined as the output voltage at the minimum rated pressure.
  4. Accuracy (error budget) consists of the following:

Linearity:Output deviation from a straight line relationship with pressure over the specified pressure range. from the minimum or maximum operating temperature points, with zero differential pressure applied. maximum rated pressure, at 25°C. TcSpan:Output deviation over the temperature range of 10 to 60°C, relative to 25°C. TcOffset:Output deviation with minimum rated pressure applied, over the temperature range of 10 to 60°C, relative to 25°C. Variation from Nominal:The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C.

  1. Auto Zero at Factory Installation: Due to the sensitivity of the MPVZ5004G, external mechanical stresses and mounting position can affect

change of ±5°C between autozero and measurement.

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Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. Figure 1. Integrated Pressure Sensor Schematic onto a single monolithic chip. the pressure signal to be transmitted to the silicon diaphragm. media tolerance in your application. the power supply is recommended. saturate outside of the specified pressure range. Figure 2. Cross-Sectional Diagram (Not to Scale) Table 2. Maximum Ratings

  1. Exposure beyond the specified limits may c ause permanent damage or degradation to the device.

for small outline package device.

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shorting between solder pads. Figure 6. SOP Footprint (Case 482)

0.060 TYP 8X

0.100 TYP 8X

S D 8 PL G SBM0.25 (0.010) A ST -A- -B- N C M J K PIN 1 IDENTIFIER H SEATING PLANE -T- DIM MIN MAX MIN MAX MILLIMETERSINCHES A 10.540.4250.415 10.79 B 10.540.4250.415 10.79 C 5.380.2300.212 5.84 D 0.960.0420.038 1.07 G 0.100 BSC 2.54 BSC H 0.002 0.010 0.05 0.25 J 0.009 0.011 0.23 0.28 K 0.061 0.071 1.55 1.80 M 0˚ 7˚ 0˚ 7˚ N 0.405 0.415 10.29 10.54 S 0.709 0.725 18.01 18.41 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT . PIN 1 IDENTIFIER H SEATING PLANE -T- W C M J K V DIM MIN MAX MIN MAX MILLIMETERSINCHES A 10.540.4250.415 10.79 B 10.540.4250.415 10.79 C 12.700.5200.500 13.21 D 0.960.0420.038 1.07 G 0.100 BSC 2.54 BSC H 0.002 0.010 0.05 0.25 J 0.009 0.011 0.23 0.28 K 0.061 0.071 1.55 1.80 M 0˚ 7˚ 0˚ 7˚ N 0.444 0.448 11.28 11.38 S 0.709 0.725 18.01 18.41 V 0.245 0.255 6.22 6.48 W 0.115 0.125 2.92 3.17 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT .S D 8 PL G SBM0.25 (0.010) A T -A- -B-N S

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A 10.540.4250.415 10.79 B 10.540.4250.415 10.79 C 5.330.2200.210 5.59 D 0.660.0340.026 0.864 G 0.100 BSC 2.54 BSC J 0.009 0.011 0.23 0.28 K 0.100 0.120 2.54 3.05 M 0 15 0 15 N 0.405 0.415 10.29 10.54 S 0.540 0.560 13.72 14.22 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 /C0095 TYPICAL DRAFT. 6. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL. /C0095/C0095 /C0095/C0095 PIN 1 IDENTIFIER K SEATING PLANE–T– S G –A– –B– C M J N D 8 PL SBM0.25 (0.010) A ST DETAIL X DETAIL X MILLIMETERSINCHES 0.100 BSC 2.54 BSC DIM A B C D G J K M N S V W MIN 0.415 0.415 0.500 0.026 0.009 0.100 0.444 0.540 0.245 0.115 MAX 0.425 0.425 0.520 0.034 0.011 0.120 15˚ 0.448 0.560 0.255 0.125 MIN 10.54 10.54 12.70 0.66 0.23 2.54 11.28 13.72 6.22 2.92 MAX 10.79 10.79 13.21 0.864 0.28 3.05 15˚ 11.38 14.22 6.48 3.17 PIN 1 IDENTIFIER K SEATING PLANE-T- W DETAIL X S G -A- -B-N C V M J D 8 PL SBM0.25 (0.010) A ST DETAIL X NOTES: DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. MAXIMUM MOLD PROTRUSION 0.15 (0.006). ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL.

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Freescale Semiconductor 11 Pressure PACKAGE DIMENSIONS CASE 1368-01 ISSUE B SMALL OUTLINE PACKAGE SURFACE MOUNT PAGE 1 OF 3

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Freescale Semiconductor 13 Pressure PACKAGE DIMENSIONS CASE 1368-01 ISSUE B SMALL OUTLINE PACKAGE SURFACE MOUNT PAGE 3 OF 3

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Freescale Semiconductor 15 Pressure PACKAGE DIMENSIONS CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE PAGE 2 OF 2

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Freescale Semiconductor 17 Pressure PACKAGE DIMENSIONS CASE 1560-03 ISSUE D SMALL OUTLINE PACKAGE PAGE 2 OF 3

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Freescale Semiconductor 19 Pressure PACKAGE DIMENSIONS CASE 1735-02 ISSUE B SMALL OUTLINE PACKAGE PAGE 1 OF 3

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Freescale Semiconductor 21 Pressure PACKAGE DIMENSIONS CASE 1735-02 ISSUE B SMALL OUTLINE PACKAGE PAGE 3 OF 3

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