MPU-6500

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InvenSense Inc. 1745 Technology Drive, San Jose, CA 95110 U.S.A. Tel: +1 (408) 988-7339 Fax: +1 (408) 988-8104 Website: www.invensense.com Document Number: PS-MPU-6500A-01 Revision: 1.0 Release Date: 09/18/2013 1 of 48 MPU-6500 Product Specification Revision 1.0

MPU-6500 Product Specification Document Number: PS-MPU-6500A-01 Revision: 1.0 Release Date: 09/18/2013 2 of 48 TABLE OF CONTENTS

MPU-6500 Product Specification Document Number: PS-MPU-6500A-01 Revision: 1.0 Release Date: 09/18/2013 3 of 48

MPU-6500 Product Specification Document Number: PS-MPU-6500A-01 Revision: 1.0 Release Date: 09/18/2013 5 of 48 Table of Tables

MPU-6500 Product Specification Document Number: PS-MPU-6500A-01 Revision: 1.0 Release Date: 09/18/2013 6 of 48

1 Document Information

1.1 Revision History

09/18/2013 1.0 Initial Release

MPU-6500 Product Specification Document Number: PS-MPU-6500A-01 Revision: 1.0 Release Date: 09/18/2013 7 of 48

1.2 Purpose and Scope

This document is a preliminary product specificatio n, providing a description, specifications, and des ign related information on the MPU-6500™ MotionTracking device. The device is housed in a small 3x3x0.90mm QFN package. Specifications are subject to change without notice . Final specifications will be updated based upon characterization of production silicon. For referen ces to register map and descriptions of individual registers, please refer to the MPU-6500 Register Map and Regis ter Descriptions document.

1.3 Product Overview

The MPU-6500 is a 6-axis MotionTracking device that combines a 3-axis gyroscope, 3-axis accelerometer, and a Digital Motion Processor™ (DMP) all in a smal l 3x3x0.9mm package. It also features a 4096-byte FIFO that can lower the traffic on the serial bus i nterface, and reduce power consumption by allowing the system processor to burst read sensor data and then go into a low-power mode. With its dedicated I sensor bus, the MPU-6500 directly accepts inputs fr om external I 2C devices. MPU-6500, with its 6-axis integration, on-chip DMP, and run-time calibration firmware, enables manufacturers to eliminate the co stly and complex selection, qualification, and system le vel integration of discrete devices, guaranteeing o ptimal motion performance for consumers. MPU-6500 is also designed to interface with multiple non-inertial d igital sensors, such as pressure sensors, on its auxiliary I 2C port. The gyroscope has a programmable full-scale range o f ±250, ±500, ±1000, and ±2000 degrees/sec and very low rate noise at 0.01 dps/ √Hz. The accelerometer has a user-programmable accel erometer full-scale range of ±2 g, ±4 g, ±8 g, and ±16 g. Factory-calibrated initial sensitivity of both se nsors reduces production-line calibration requirements. Other industry-leading features include on-chip 16- bit ADCs, programmable digital filters, a precision clock with 1% drift from -40° C to 85° C, an embedded tempe rature sensor, and programmable interrupts. The device features I 2C and SPI serial interfaces, a VDD operating range of 1.71 to 3.6V, and a separate digital IO supply, VDDIO from 1.71V to 3.6V. Communication with all registers of the device is p erformed using either I 2C at 400kHz or SPI at 1MHz. For applications requiring faster communications, the s ensor and interrupt registers may be read using SPI at 20MHz. By leveraging its patented and volume-proven CMOS-M EMS fabrication platform, which integrates MEMS wafers with companion CMOS electronics through wafe r-level bonding, InvenSense has driven the package size down to a footprint and thickness of 3x3x0.90m m (24-pin QFN), to provide a very small yet high performance low cost package. The device provides high robustness by supporting 10,000 g shock reliability.

1.4 Applications

• TouchAnywhere ™ technology (for “no touch” UI Application Control /Navigation)
• MotionCommand ™ technology (for Gesture Short-cuts)
• Motion-enabled game and application framework
• Location based services, points of interest, and d ead reckoning
• Handset and portable gaming
• Motion-based game controllers
• 3D remote controls for Internet connected DTVs and set top boxes, 3D mice
• Wearable sensors for health, fitness and sports

MPU-6500 Product Specification Document Number: PS-MPU-6500A-01 Revision: 1.0 Release Date: 09/18/2013 8 of 48

2 Features

2.1 Gyroscope Features

The triple-axis MEMS gyroscope in the MPU-6500 includes a wide range of features:

• Digital-output X-, Y-, and Z-axis angular rate sen sors (gyroscopes) with a user-programmable full- scale range of ±250, ±500, ±1000, and ±2000° /sec and integrated 16-bit ADCs
• Digitally-programmable low-pass filter
• Gyroscope operating current: 3.2mA
• Factory calibrated sensitivity scale factor
• Self-test

2.2 Accelerometer Features

The triple-axis MEMS accelerometer in MPU-6500 incl udes a wide range of features:

• Digital-output X-, Y-, and Z-axis accelerometer wi th a programmable full scale range of ±2 g, ±4 g, ±8 g and ±16 g and integrated 16-bit ADCs
• Accelerometer normal operating current: 450µA
• Low power accelerometer mode current: 6.37µA at 0. 98Hz, 17.75µA at 31.25Hz
• User-programmable interrupts
• Wake-on-motion interrupt for low power operation o f applications processor
• Self-test

2.3 Additional Features

The MPU-6500 includes the following additional features:

• Auxiliary master I 2C bus for reading data from external sensors (e.g. magnetometer)
• 3.4mA operating current when all 6 motion sensing axes are active
• VDD supply voltage range of 1.8 – 3.3V ± 5%
• VDDIO reference voltage of 1.8 – 3.3V ± 5% for aux iliary I2C devices
• Smallest and thinnest QFN package for portable dev ices: 3x3x0.9mm
• Minimal cross-axis sensitivity between the acceler ometer and gyroscope axes
• 4096 byte FIFO buffer enables the applications pro cessor to read the data in bursts
• Digital-output temperature sensor
• User-programmable digital filters for gyroscope, a ccelerometer, and temp sensor
• 10,000 g shock tolerant
• 400kHz Fast Mode I 2C for communicating with all registers
• 1MHz SPI serial interface for communicating with a ll registers
• 20MHz SPI serial interface for reading sensor and interrupt registers
• MEMS structure hermetically sealed and bonded at w afer level
• RoHS and Green compliant

2.4 MotionProcessing

• Internal Digital Motion Processing™ (DMP™) engine supports advanced MotionProcessing and low power functions such as gesture recognition using programmable interrupts
• In addition to the angular rate, this device optio nally outputs the angular position (angle).
• Low-power pedometer functionality allows the host processor to sleep while the DMP maintains the step count.

MPU-6500 Product Specification Document Number: PS-MPU-6500A-01 Revision: 1.0 Release Date: 09/18/2013 9 of 48

3 Electrical Characteristics

3.1 Gyroscope Specifications

Typical Operating Circuit of section 4.2, VDD = 1.8V, VDDIO = 1.8V, T A=25° C, unless otherwise noted. PARAMETER CONDITIONS MIN TYP MAX UNITS NOTES GYROSCOPE SENSITIVITY Full-Scale Range FS_SEL=0 ±250 º/s 3 FS_SEL=1 ±500 º/s 3 FS_SEL=2 ±1000 º/s 3 FS_SEL=3 ±2000 º/s 3 Gyroscope ADC Word Length 16 bits 3 Sensitivity Scale Factor FS_SEL=0 131 LSB/(º/s) 3 FS_SEL=1 65.5 LSB/(º/s) 3 FS_SEL=2 32.8 LSB/(º/s) 3 FS_SEL=3 16.4 LSB/(º/s) 3 Sensitivity Scale Factor Tolerance 25° C ±3 % 2 Sensitivity Scale Factor Variation Over Temperature Nonlinearity Best fit straight line; 25° C ±0.1 % 1 Cross-Axis Sensitivity ±2 % 1 ZERO-RATE OUTPUT (ZRO) Initial ZRO Tolerance 25° C ±5 º/s 2 ZRO Variation Over Temperature -40° C to +85° C ±0.2 4 º/s/° C 1 GYROSCOPE NOISE PERFORMANCE (FS_SEL=0) Total RMS Noise DLPFCFG=2 (92 Hz) 0.1 º/s-rms 2 Rate Noise Spectral Density 0.01 º/s/ √Hz 4 GYROSCOPE MECHANICAL FREQUENCIES 25 27 29 KHz 2 LOW PASS FILTER RESPONSE Programmable Range 5 250 Hz 3 GYROSCOPE START-UP TIME From Sleep mode 35 ms 1 OUTPUT DATA RATE Programmable, Normal (Filtered) mode 4 8000 Hz 1 Table 1: Gyroscope Specifications Notes: 1. Derived from validation or characterization of p arts, not guaranteed in production. 2. Tested in production. 3. Guaranteed by design. 4. Calculated from Total RMS Noise. Please refer to the following document for informat ion on Self-Test: MPU-6500 Accelerometer and Gyroscope Self-Test Implementation; AN-MPU-6500A-02

MPU-6500 Product Specification Document Number: PS-MPU-6500A-01 Revision: 1.0 Release Date: 09/18/2013 10 of 48

3.2 Accelerometer Specifications

Typical Operating Circuit of section 4.2, VDD = 1.8V, VDDIO = 1.8V, T A=25° C, unless otherwise noted. PARAMETER CONDITIONS MIN TYP MAX UNITS NOTES ACCELEROMETER SENSITIVITY Full-Scale Range AFS_SEL=0 ±2 g 3 AFS_SEL=1 ±4 g 3 AFS_SEL=2 ±8 g 3 AFS_SEL=3 ±16 g 3 ADC Word Length Output in two’s complement format 16 bits 3 Sensitivity Scale Factor AFS_SEL=0 16,384 LSB/ g 3 AFS_SEL=1 8,192 LSB/ g 3 AFS_SEL=2 4,096 LSB/ g 3 AFS_SEL=3 2,048 LSB/ g 3 Initial Tolerance Component-level ±3 % 2 Sensitivity Change vs. Temperature -40° C to +85° C AFS_SEL=0 Component-level ±0.026 %/° C 1 Nonlinearity Best Fit Straight Line ±0.5 % 1 Cross-Axis Sensitivity ±2 % 1 ZERO-G OUTPUT Initial Tolerance Component-level, all axes ±60 m g 2 Zero-G Level Change vs. Temperature -40° C to +85° C, Board-level X and Y axes ±0.64 m g/° C 1 Z axis ±1 m g/° C 1 NOISE PERFORMANCE Power Spectral Density Low noise mode 300 µg/√Hz 4 LOW PASS FILTER RESPONSE Programmable Range 5 260 Hz 3 INTELLIGENCE FUNCTION INCREMENT 4 m g/LSB 3 ACCELEROMETER STARTUP TIME From Sleep mode 20 ms 1 From Cold Start, 1ms V DD ramp 30 ms 1 OUTPUT DATA RATE Low power (duty-cycled) 0.24 500 Hz

1 Duty-cycled, over temp ±15 %

Low noise (active) 4 4000 Hz Table 2: Accelerometer Specifications Notes: 1. Derived from validation or characterization of p arts, not guaranteed in production. 2. Tested in production. 3. Guaranteed by design. 4. Calculated from Total RMS Noise. Please refer to the following document for informat ion on Self-Test: MPU-6500 Accelerometer and Gyroscope Self-Test Implementation; AN-MPU-6500A-02

MPU-6500 Product Specification Document Number: PS-MPU-6500A-01 Revision: 1.0 Release Date: 09/18/2013 11 of 48

3.3 Electrical Specifications

3.3.1 D.C. Electrical Characteristics Typical Operating Circuit of section 4.2, VDD = 1.8V, VDDIO = 1.8V, T A=25° C, unless otherwise noted. PARAMETER CONDITIONS MIN TYP MAX Units Notes SUPPLY VOLTAGES VDD 1.71 1.8 3.45 V 1 VDDIO 1.71 1.8 3.45 V 1 SUPPLY CURRENTS Normal Mode 6-axis 3.4 mA 1 3-axis Gyroscope 3.2 mA 1 3-Axis Accelerometer, 4kHz ODR 450 µA 1 Accelerometer Low Power Mode 0.98 Hz update rate 7.27 µA 1,2 31.25 Hz update rate 18.65 µA 1,2 Standby Mode 1.6 mA 1 Full-Chip Sleep Mode 6 µA 1 TEMPERATURE RANGE Specified Temperature Range Performance parameters are not applicable beyond Specified Temperature Range -40 +85 ° C 1 Table 3: D.C. Electrical Characteristics Notes: 1. Derived from validation or characterization of p arts, not guaranteed in production. 2. Accelerometer Low Power Mode supports the follow ing output data rates (ODRs): 0.24, 0.49, 0.98, calculated as: a. Supply Current in µA = 6.9 + Update Rate * 0.376

MPU-6500 Product Specification Document Number: PS-MPU-6500A-01 Revision: 1.0 Release Date: 09/18/2013 12 of 48 3.3.2 A.C. Electrical Characteristics Typical Operating Circuit of section 4.2, VDD = 1.8V, VDDIO = 1.8V, T A=25° C, unless otherwise noted. Parameter Conditions MIN TYP MAX Units NOTES SUPPLIES Supply Ramp Time Monotonic ramp. Ramp rate is 10% to 90% of the final value 0.1 100 ms TEMPERATURE SENSOR Operating Range Ambient -40 85 ° C 1 Sensitivity Untrimmed 333.87 LSB/° C Room Temp Offset 21° C 0 LSB Power-On RESET Supply Ramp Time (T RAMP ) Valid power-on RESET 0.01 20 100 ms 1 Start-up time for register read/write From power-up 11 100 ms 1 I2C ADDRESS AD0 = 0 AD0 = 1 1101000 1101001 DIGITAL INPUTS (FSYNC, AD0, SCLK, SDI, CS) VIH , High Level Input Voltage 0.7*VDDIO V 1 VIL , Low Level Input Voltage 0.3*VDDIO V CI, Input Capacitance < 10 pF DIGITAL OUTPUT (SDO, INT) VOH , High Level Output Voltage R LOAD =1M Ω; 0.9*VDDIO V VOL1 , LOW-Level Output Voltage R LOAD =1M Ω; 0.1*VDDIO V VOL.INT1 , INT Low-Level Output Voltage OPEN=1, 0.3mA sink Current 0.1 V Output Leakage Current OPEN=1 100 nA tINT , INT Pulse Width LATCH_INT_EN=0 50 µs I2C I/O (SCL, SDA) VIL , LOW Level Input Voltage -0.5V 0.3*VDDIO V VIH , HIGH-Level Input Voltage 0.7*VDDIO VDDIO + 0.5V V Vhys , Hysteresis 0.1*VDDIO V VOL , LOW-Level Output Voltage 3mA sink current 0 0.4 V IOL , LOW-Level Output Current VOL =0.4V VOL =0.6V 3 6 mA mA Output Leakage Current 100 nA tof , Output Fall Time from V IHmax to V ILmax C b bus capacitance in pf 20+0.1C b 250 ns AUXILLIARY I/O (AUX_CL, AUX_DA) VIL , LOW-Level Input Voltage -0.5V 0.3*VDDIO V VIH , HIGH-Level Input Voltage 0.7* VDDIO VDDIO + 0.5V V Vhys , Hysteresis 0.1* VDDIO V VOL1 , LOW-Level Output Voltage VDDIO > 2V; 1mA sink current 0 0.4 V

MPU-6500 Product Specification Document Number: PS-MPU-6500A-01 Revision: 1.0 Release Date: 09/18/2013 13 of 48 Parameter Conditions MIN TYP MAX Units NOTES VOL3 , LOW-Level Output Voltage VDDIO < 2V; 1mA sink current 0 0.2* VDDIO V IOL , LOW-Level Output Current VOL = 0.4V VOL = 0.6V mA mA Output Leakage Current 100 nA tof , Output Fall Time from V IHmax to V ILmax C b bus capacitance in pF 20+0.1C b 250 ns INTERNAL CLOCK SOURCE Sample Rate Fchoice=0,1,2 SMPLRT_DIV=0 32 kHz 2 Fchoice=3; DLPFCFG=0 or 7 SMPLRT_DIV=0 8 kHz 2 Fchoice=3; DLPFCFG=1,2,3,4,5,6; SMPLRT_DIV=0 1 kHz 2 Clock Frequency Initial Tolerance CLK_SEL=0, 6; 25° C -2 +2 % 1 Frequency Variation over Temperature CLK_SEL=0,6 -10 +10 % 1 CLK_SEL=1,2,3,4,5 ±1 % 1 Table 4: A.C. Electrical Characteristics Notes: 1. Derived from validation or characterization of p arts, not guaranteed in production. 2. Guaranteed by design.

MPU-6500 Product Specification Document Number: PS-MPU-6500A-01 Revision: 1.0 Release Date: 09/18/2013 14 of 48

3.3.3 Other Electrical Specifications

Typical Operating Circuit of section 4.2, VDD = 1.8V, VDDIO = 1.8V, T A=25° C, unless otherwise noted. PARAMETER CONDITIONS MIN TYP MAX Units Notes SERIAL INTERFACE SPI Operating Frequency, All Registers Read/Write Low Speed Characterization 100 ±10% kHz 1 High Speed Characterization 1 ±10% MHz 1 SPI Operating Frequency, Sensor and Interrupt Registers Read Only 20 ±10% MHz 1 I2C Operating Frequency All registers, Fast-mode 400 kHz 1 All registers, Standard-mode 100 kHz 1 Table 5: Other Electrical Specifications Notes: 1. Derived from validation or characterization of p arts, not guaranteed in production.

MPU-6500 Product Specification Document Number: PS-MPU-6500A-01 Revision: 1.0 Release Date: 09/18/2013 15 of 48

3.4 I2C Timing Characterization

Typical Operating Circuit of section 4.2, VDD = 1.8V, VDDIO = 1.8V, T A=25° C, unless otherwise noted. Parameters Conditions Min Typical Max Units Notes I2C TIMING I 2C FAST-MODE 1 fSCL , SCL Clock Frequency 400 kHz 2 tHD.STA , (Repeated) START Condition Hold Time 0.6 µs 2 tLOW , SCL Low Period 1.3 µs 2 tHIGH , SCL High Period 0.6 µs 2 tSU.STA , Repeated START Condition Setup Time 0.6 µs 2 tHD.DAT , SDA Data Hold Time 0 µs 2 tSU.DAT , SDA Data Setup Time 100 ns 2 tr, SDA and SCL Rise Time C b bus cap. from 10 to 400pF 20+0.1C b 300 ns 2 tf, SDA and SCL Fall Time C b bus cap. from 10 to 400pF 20+0.1C b 300 ns 2 tSU.STO , STOP Condition Setup Time 0.6 µs 2 tBUF , Bus Free Time Between STOP and START Condition 1.3 µs 2 Cb, Capacitive Load for each Bus Line < 400 pF 2 tVD.DAT , Data Valid Time 0.9 µs 2 tVD.ACK , Data Valid Acknowledge Time 0.9 µs 2 Table 6: I2C Timing Characteristics Notes: 1. Timing Characteristics apply to both Primary and Auxiliary I2C Bus 2. Based on characterization of 5 parts over temperature and voltage as mounted on evaluation board or in sockets Figure 1: I2C Bus Timing Diagram

MPU-6500 Product Specification Document Number: PS-MPU-6500A-01 Revision: 1.0 Release Date: 09/18/2013 16 of 48

3.5 SPI Timing Characterization

Typical Operating Circuit of section 4.2, VDD = 1.8V, VDDIO = 1.8V, T A=25° C, unless otherwise noted. Parameters Conditions Min Typical Max Units Notes SPI TIMING fSCLK , SCLK Clock Frequency 1 MHz 1 tLOW , SCLK Low Period 400 ns 1 tHIGH , SCLK High Period 400 ns 1 tSU.CS , CS Setup Time 8 ns 1 tHD.CS , CS Hold Time 500 ns 1 tSU.SDI , SDI Setup Time 11 ns 1 tHD.SDI , SDI Hold Time 7 ns 1 tVD.SDO , SDO Valid Time C load = 20pF 100 ns 1 tHD.SDO , SDO Hold Time C load = 20pF 4 ns 1 tDIS.SDO , SDO Output Disable Time 50 ns 1 Table 7: SPI Timing Characteristics Notes: 1. Based on characterization of 5 parts over temperature and voltage as mounted on evaluation board or in sockets Figure 2: SPI Bus Timing Diagram 3.5.1 fSCLK = 20MHz Parameters Conditions Min Typical Max Units Notes SPI TIMING fSCLK , SCLK Clock Frequency 0.9 20 MHz 1 tLOW , SCLK Low Period - - ns tHIGH , SCLK High Period - - ns tSU.CS , CS Setup Time 1 ns 1 tHD.CS , CS Hold Time 1 ns 1

MPU-6500 Product Specification Document Number: PS-MPU-6500A-01 Revision: 1.0 Release Date: 09/18/2013 17 of 48 tSU.SDI , SDI Setup Time 0 ns 1 tHD.SDI , SDI Hold Time 1 ns 1 tVD.SDO , SDO Valid Time C load = 20pF 25 ns 1 tDIS.SDO , SDO Output Disable Time 25 ns 1 Table 8: fCLK = 20MHz Notes: 1. Based on characterization of 5 parts over temperature and voltage as mounted on evaluation board or in sockets

MPU-6500 Product Specification Document Number: PS-MPU-6500A-01 Revision: 1.0 Release Date: 09/18/2013 18 of 48

3.6 Absolute Maximum Ratings

Stress above those listed as “Absolute Maximum Rati ngs” may cause permanent damage to the device. These are stress ratings only and functional operat ion of the device at these conditions is not implie d. Exposure to the absolute maximum ratings conditions for extended periods may affect device reliability. Parameter Rating Supply Voltage, VDD -0.5V to +4V Supply Voltage, VDDIO -0.5V to +4V REGOUT -0.5V to 2V Input Voltage Level (AUX_DA, AD0, FSYNC, INT, SCL, SDA) -0.5V to VDD + 0.5V Acceleration (Any Axis, unpowered) 10,000g for 0.2ms Operating Temperature Range -40° C to +105° C Storage Temperature Range -40° C to +125° C Electrostatic Discharge (ESD) Protection 2kV (HBM); 250V (MM) Latch-up JEDEC Class II (2),125° C, ±100mA Table 9: Absolute Maximum Ratings

MPU-6500 Product Specification Document Number: PS-MPU-6500A-01 Revision: 1.0 Release Date: 09/18/2013 19 of 48

4 Applications Information

4.1 Pin Out Diagram and Signal Description

Pin Number Pin Name Pin Description

7 AUX_CL I2C Master serial clock, for connecting to external sensors

8 VDDIO Digital I/O supply voltage

9 AD0 / SDO I2C Slave Address LSB (AD0); SPI serial data output (SDO)

10 REGOUT Regulator filter capacitor connection

11 FSYNC Frame synchronization digital input. Connect to GND if unused.

12 INT

Interrupt digital output (totem pole or open-drain) Note: The Interrupt line should be connected to a pin on the Application Processor (AP) that can bring the AP out of suspend mode.

13 VDD Power supply voltage and Digital I/O supply voltage

18 GND Power supply ground

19 RESV Reserved. Do not connect. 20 RESV Reserved. Connect to GND.

21 AUX_DA I2C master serial data, for connecting to external sensors

22 nCS Chip select (SPI mode only)

23 SCL / SCLK I 2C serial clock (SCL); SPI serial clock (SCLK)

24 SDA / SDI I 2C serial data (SDA); SPI serial data input (SDI)

1 – 6, 14 - 17 NC No Connect pins. Do not connect. Table 10: Signal Descriptions AUX_CL VDDIO SDO / AD0 REGOUT FSYNC INT GND SCL / SCLK nCS RESV VDD SDA / SDI NC AUX_DA RESV NC NC NC NC NC NC NC NC NC MPU-6500 6 13 Figure 3: Pin out Diagram for MPU-6500 3.0x3.0x0.9m m QFN

MPU-6500 Product Specification Document Number: PS-MPU-6500A-01 Revision: 1.0 Release Date: 09/18/2013 20 of 48

4.2 Typical Operating Circuit

AUX_CL VDDIO SDO / AD0 REGOUT FSYNC INT GND SCL / SCLK nCS RESV VDD SDA / SDI NC 1.8 – 3.3VDC C2, 0.1 µ F C3, 10 nF 1.8 – 3.3VDC SCL VDDIO SDA AUX_DA AD0 C1, 0.1 µ F RESV NC NC NC NC NC NC NC NC NC MPU-6500 6 13 AUX_CL VDDIO SDO / AD0 REGOUT FSYNC INT GND SCL / SCLK nCS RESV VDD SDA / SDI NC 1.8 – 3.3VDC C2, 0.1 µ F C3, 10 nF 1.8 – 3.3VDC SCLK SDI AUX_DA SD0 C1, 0.1 µ F RESV NC NC NC NC NC NC NC NC NC MPU-6500 6 13 nCS (a) (b) Figure 4: MPU-6500 QFN Application Schematic. (a) I 2C operation, (b) SPI operation.

4.3 Bill of Materials for External Components

Component Label Specification Quantity Regulator Filter Capacitor C1 Ceramic, X7R, 0.1µF ± 10%, 2V 1 VDD Bypass Capacitor C2 Ceramic, X7R, 0.1µF ±10%, 4 V 1 VDDIO Bypass Capacitor C3 Ceramic, X7R, 10nF ±10%, 4V 1 Table 11: Bill of Materials

MPU-6500 Product Specification Document Number: PS-MPU-6500A-01 Revision: 1.0 Release Date: 09/18/2013 21 of 48

4.4 Block Diagram

(DMP) FSYNC Slave I2C and SPI Serial Interface Master I2C Serial Interface Serial Interface Bypass Mux AUX_CL AUX_DA INT Interrupt Status Register VDD Bias & LDOs GND REGOUT Z Accel Y Accel X Accel ADC ADC ADC ADC X Gyro Signal Conditioning FIFO User & Config Registers Sensor Registers Self test Self test Self test Self test Self test Self test Figure 5: MPU-6500 Block Diagram Note: The Interrupt line should be connected to a p in on the Application Processor (AP) that can bring the AP out of suspend mode.

4.5 Overview

The MPU-6500 is comprised of the following key bloc ks and functions:

• Three-axis MEMS rate gyroscope sensor with 16-bit ADCs and signal conditioning
• Three-axis MEMS accelerometer sensor with 16-bit A DCs and signal conditioning
• Digital Motion Processor (DMP) engine
• Primary I 2C and SPI serial communications interfaces
• Auxiliary I 2C serial interface
• Self-Test
• Clocking
• Sensor Data Registers
• FIFO
• Interrupts
• Digital-Output Temperature Sensor
• Bias and LDOs
• Charge Pump
• Standard Power Modes

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4.6 Three-Axis MEMS Gyroscope with 16-bit ADCs and Signal Conditioning

The MPU-6500 consists of three independent vibrator y MEMS rate gyroscopes, which detect rotation about the X-, Y-, and Z- Axes. When the gyros are rotate d about any of the sense axes, the Coriolis Effect causes a vibration that is detected by a capacitive pickof f. The resulting signal is amplified, demodulated, and filtered to produce a voltage that is proportional to the an gular rate. This voltage is digitized using indivi dual on-chip 16-bit Analog-to-Digital Converters (ADCs) to sampl e each axis. The full-scale range of the gyro sens ors may be digitally programmed to ±250, ±500, ±1000, o r ±2000 degrees per second (dps). The ADC sample rate is programmable from 8,000 samples per second, down to 3.9 samples per second, and user-selectabl e low-pass filters enable a wide range of cut-off frequencies.

4.7 Three-Axis MEMS Accelerometer with 16-bit ADCs and Signal Conditioning

The MPU-6500’s 3-Axis accelerometer uses separate p roof masses for each axis. Acceleration along a particular axis induces displacement on the corresp onding proof mass, and capacitive sensors detect th e displacement differentially. The MPU-6500’s archite cture reduces the accelerometers’ susceptibility to fabrication variations as well as to thermal drift. When the device is placed on a flat surface, it wi ll measure 0g on the X- and Y-axes and +1 g on the Z-axis. The accelerometers’ scale factor is calibrated at the factory and is nominally independent of supply voltage. Eac h sensor has a dedicated sigma-delta ADC for provid ing digital outputs. The full scale range of the digital output can be adjusted to ±2 g, ±4 g, ±8 g, or ±16 g.

4.8 Digital Motion Processor

The embedded Digital Motion Processor (DMP) within the MPU-6500 offloads computation of motion processing algorithms from the host processor. The DMP acquires data from accelerometers, gyroscopes, and additional 3 rd party sensors such as magnetometers, and processes the data. The resulting data can be read from the FIFO. The DMP has access to one of th e MPU’s external pins, which can be used for generating interrupts. The purpose of the DMP is to offload both timing re quirements and processing power from the host processor. Typically, motion processing algorithms should be run at a high rate, often around 200Hz, i n order to provide accurate results with low latency. This is required even if the application updates at a mu ch lower rate; for example, a low power user interface may u pdate as slowly as 5Hz, but the motion processing s hould still run at 200Hz. The DMP can be used to minimize power, simplify timing, simplify the software architecture, and save valuable MIPS on the host processor for use in applications. The DMP supports the following functionality:

• Low Power Quaternion (3-Axis Gyroscope)
• Screen Orientation (A low-power implementation of Android’s screen rotation algorithm)
• Pedometer (InvenSense implementation)

4.9 Primary I2C and SPI Serial Communications Inter faces

The MPU-6500 communicates to a system processor usi ng either a SPI or an I 2C serial interface. The MPU- 6500 always acts as a slave when communicating to t he system processor. The LSB of the of the I 2C slave address is set by pin 9 (AD0).

4.9.1 MPU-6500 Solution Using I2C Interface

In the figure below, the system processor is an I 2C master to the MPU-6500. In addition, the MPU-6500 is an I2C master to the optional external compass sensor. T he MPU-6500 has limited capabilities as an I 2C Master, and depends on the system processor to mana ge the initial configuration of any auxiliary senso rs.

MPU-6500 Product Specification Document Number: PS-MPU-6500A-01 Revision: 1.0 Release Date: 09/18/2013 23 of 48 The MPU-6500 has an interface bypass multiplexer, w hich connects the system processor I 2C bus pins 23 and 24 (SDA and SCL) directly to the auxiliary sensor I 2C bus pins 6 and 7 (AUX_DA and AUX_CL). Once the auxiliary sensors have been configured by the system processor, the interface bypass multiple xer should be disabled so that the MPU-6500 auxiliary I 2C master can take control of the sensor I 2C bus and gather data from the auxiliary sensors. For further information regarding I 2C master control, please refer to section 6. MPU-6500 AD0 SCL SDA/SDI Digital Motion Processor (DMP) Sensor Master I 2C Serial Interface AUX_CL AUX_DA Interrupt Status Register INT VDD Bias & LDOs GND REGOUT FIFO User & Config Registers Sensor Register Factory Calibration Slave I 2C or SPI Serial Interface Compass SCL SDA System Processor Interface Bypass Mux SCL SDA VDD or GND I2C Processor Bus: for reading all sensor data from MPU and for configuring external sensors (i.e. compass in this example ) Interface bypass mux allows direct configuration of compass by system processor Optional Sensor I 2C Bus: for configuring and reading from external sensors Figure 6: MPU-6500 Solution Using I 2C Interface Note: The Interrupt line should be connected to a p in on the Application Processor (AP) that can bring the AP out of suspend mode.

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4.9.2 MPU-6500 Solution Using SPI Interface

In the figure below, the system processor is an SPI master to the MPU-6500. Pins 8, 9, 23, and 24 are used to support the CS, SDO, SCLK, and SDI signals for S PI communications. Because these SPI pins are shared with the I 2C slave pins (9, 23 and 24), the system processor c annot access the auxiliary I 2C bus through the interface bypass multiplexer, which con nects the processor I 2C interface pins to the sensor I 2C interface pins. Since the MPU-6500 has limited capa bilities as an I 2C Master, and depends on the system processor to manage the initial configuration of an y auxiliary sensors, another method must be used fo r programming the sensors on the auxiliary sensor I 2C bus pins 6 and 7 (AUX_DA and AUX_CL). When using SPI communications between the MPU-6500 and the system processor, configuration of devices on the auxiliary I 2C sensor bus can be achieved by using I 2C Slaves 0-4 to perform read and write transactions on any device and register on the auxi liary I 2C bus. The I 2C Slave 4 interface can be used to perform only single byte read and write transaction s. Once the external sensors have been configured, the MPU-6500 can perform single or multi-byte reads usi ng the sensor I 2C bus. The read results from the Slave 0-3 controllers can be written to the FIFO buffer as well as to the external sensor registers. For further information regarding the control of th e MPU-6500’s auxiliary I 2C interface, please refer to the MPU-6500 Register Map and Register Descriptions doc ument. MPU-6500 SDO SCLK SDI Digital Motion Processor (DMP) Sensor Master I 2C Serial Interface Interrupt Status Register INT FIFO Config Register Sensor Register Factory Calibration nCS Slave I 2C or SPI Serial Interface System Processor Interface Bypass Mux SDI SCLK SDO nCS Processor SPI Bus: for reading all data from MPU and for configuring MPU and external sensors AUX_CL AUX_DA Compass SCL SDA Optional I2C Master performs read and write transactions on Sensor I 2C bus. Sensor I 2C Bus: for configuring and reading data from external sensors VDD Bias & LDOs GND REGOUT Figure 7: MPU-6500 Solution Using SPI Interface Note: The Interrupt line should be connected to a p in on the Application Processor (AP) that can bring the AP out of suspend mode.

4.10 Auxiliary I2C Serial Interface

The MPU-6500 has an auxiliary I 2C bus for communicating to an off-chip 3-Axis digit al output magnetometer or other sensors. This bus has two operating modes:

• I 2C Master Mode: The MPU-6500 acts as a master to any external sensors connected to the auxiliary I2C bus
• Pass-Through Mode: The MPU-6500 directly connects the primary and auxiliary I 2C buses together, allowing the system processor to directly communica te with any external sensors.

MPU-6500 Product Specification Document Number: PS-MPU-6500A-01 Revision: 1.0 Release Date: 09/18/2013 25 of 48 Auxiliary I2C Bus Modes of Operation:

• I 2C Master Mode: Allows the MPU-6500 to directly acc ess the data registers of external digital sensors, such as a magnetometer. In this mode, the MPU-6500 directly obtains data from auxiliary sensors without intervention from the system applic ations processor. For example, In I 2C Master mode, the MPU-6500 can be configured to pe rform burst reads, returning the following data from a magnetometer: /square4 X magnetometer data (2 bytes) /square4 Y magnetometer data (2 bytes) /square4 Z magnetometer data (2 bytes) The I 2C Master can be configured to read up to 24 bytes f rom up to 4 auxiliary sensors. A fifth sensor can be configured to work single byte read/write mo de.
• Pass-Through Mode: Allows an external system proce ssor to act as master and directly communicate to the external sensors connected to th e auxiliary I 2C bus pins (AUX_DA and AUX_CL). In this mode, the auxiliary I 2C bus control logic (3 rd party sensor interface block) of the MPU-6500 is disabled, and the auxiliary I 2C pins AUX_DA and AUX_CL (Pins 6 and 7) are connected to the main I 2C bus (Pins 23 and 24) through analog switches internally. Pass-Through mode is useful for configuring the ext ernal sensors, or for keeping the MPU-6500 in a low-power mode when only the external sensors are u sed. In this mode the system processor can still access MPU-6500 data through the I2C interface.

4.11 Self-Test

Please refer to the register map document for more details on self-test. Self-test allows for the testing of the mechanical and electrical portions of the sensors. The self-te st for each measurement axis can be activated by means of the g yroscope and accelerometer self-test registers (registers 13 to 16). When the self-test is activated, the electronics ca use the sensors to be actuated and produce an outpu t signal. The output signal is used to observe the self-test response. The self-test response is defined as follows: Self-test response = Sensor output with self-test enabled – Sensor output without self-test enabled The self-test response for each gyroscope axis is d efined in the gyroscope specification table, while that for each accelerometer axis is defined in the accelerom eter specification table. When the value of the self-test response is within the specified min/max limits of the product specifi cation, the part has passed self-test. When the self-test response exceeds the min/max values, the part is de emed to have failed self-test. It is recommended to use InvenSense MotionApps software for executing self-t est.

4.12 Clocking

The MPU-6500 has a flexible clocking scheme, allowi ng a variety of internal clock sources to be used f or the internal synchronous circuitry. This synchronous ci rcuitry includes the signal conditioning and ADCs, the DMP, and various control circuits and registers. A n on-chip PLL provides flexibility in the allowable inputs for generating this clock. Allowable internal sources for generating the internal clock are:

• An internal relaxation oscillator
• Any of the X, Y, or Z gyros (MEMS oscillators with a variation of ±1% over temperature)

MPU-6500 Product Specification Document Number: PS-MPU-6500A-01 Revision: 1.0 Release Date: 09/18/2013 26 of 48 Selection of the source for generating the internal synchronous clock depends on the requirements for power consumption and clock accuracy. These requirements will most likely vary by mode of operation. For example, in one mode, where the biggest concern is power consumption, the user may wish to operate the Digital Motion Processor of the MPU-6500 to process accelerometer data, while keeping the gyros off. I n this case, the internal relaxation oscillator is a good clock choice. However, in another mode, where the gyros are active, selecting the gyros as the clock source provides for a more accurate clock source. Clock accuracy is important, since timing errors di rectly affect the distance and angle calculations p erformed by the Digital Motion Processor (and by extension, by any processor). There are also start-up conditions to consider. Whe n the MPU-6500 first starts up, the device uses its internal clock until programmed to operate from ano ther source. This allows the user, for example, to wait for the MEMS oscillators to stabilize before they are selected as the clock source.

4.13 Sensor Data Registers

The sensor data registers contain the latest gyro, accelerometer, auxiliary sensor, and temperature measurement data. They are read-only registers, an d are accessed via the serial interface. Data from these registers may be read anytime.

4.14 FIFO

The MPU-6500 contains a 4096-byte FIFO register tha t is accessible via the Serial Interface. The FIFO configuration register determines which data is wri tten into the FIFO. Possible choices include gyro d ata, accelerometer data, temperature readings, auxiliary sensor readings, and FSYNC input. A FIFO counter keeps track of how many bytes of valid data are con tained in the FIFO. The FIFO register supports burs t reads. The interrupt function may be used to determine when new data is available. For further information regarding the FIFO, please refer to the MPU-6500 Register Map and Register Descriptions document.

4.15 Interrupts

Interrupt functionality is configured via the Inter rupt Configuration register. Items that are configu rable include the INT pin configuration, the interrupt latching a nd clearing method, and triggers for the interrupt. Items that can trigger an interrupt are (1) Clock generator lo cked to new reference oscillator (used when switchi ng clock sources); (2) new data is available to be read (fro m the FIFO and Data registers); (3) accelerometer e vent interrupts; and (4) the MPU-6500 did not receive an acknowledge from an auxiliary sensor on the second ary I 2C bus. The interrupt status can be read from the Interrupt Status register. For further information regarding interrupts, pleas e refer to the MPU-6500 Register Map and Register Descriptions document.

4.16 Digital-Output Temperature Sensor

An on-chip temperature sensor and ADC are used to m easure the MPU-6500 die temperature. The readings from the ADC can be read from the FIFO or the Sensor Data registers.

MPU-6500 Product Specification Document Number: PS-MPU-6500A-01 Revision: 1.0 Release Date: 09/18/2013 27 of 48

4.17 Bias and LDOs

The bias and LDO section generates the internal sup ply and the reference voltages and currents require d by the MPU-6500. Its two inputs are an unregulated VDD and a VDDIO logic reference supply voltage. The LDO output is bypassed by a capacitor at REGOUT. Fo r further details on the capacitor, please refer to the Bill of Materials for External Components.

4.18 Charge Pump

An on-chip charge pump generates the high voltage r equired for the MEMS oscillators.

4.19 Standard Power Modes

The following table lists the user-accessible power modes for MPU-6500. Mode Name Gyro Accel DMP

1 Sleep Mode Off Off Off

2 Standby Mode Drive On Off Off

3 Low-Power Accelerometer Mode Off Duty-Cycled Off

4 Low-Noise Accelerometer Mode Off On Off

5 Gyroscope Mode On Off On or Off

6 6-Axis Mode On On On or Off Table 12: Standard Power Modes for MPU-6500 Notes: 1. Power consumption for individual modes can be fo und in section 3.3.1.

MPU-6500 Product Specification Document Number: PS-MPU-6500A-01 Revision: 1.0 Release Date: 09/18/2013 28 of 48

5 Programmable Interrupts

The MPU-6500 has a programmable interrupt system wh ich can generate an interrupt signal on the INT pin . Status flags indicate the source of an interrupt. Interrupt sources may be enabled and disabled indivi dually. Interrupt Name Module Motion Detection Motion FIFO Overflow FIFO Data Ready Sensor Registers I2C Master errors: Lost Arbitration, NACKs I2C Master I2C Slave 4 I2C Master Table 13: Table of Interrupt Sources For information regarding the interrupt enable/disa ble registers and flag registers, please refer to t he MPU- 6500 Register Map and Register Descriptions documen t. Some interrupt sources are explained below.

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5.1 Wake-on-Motion Interrupt

The MPU-6500 provides motion detection capability. A qualifying motion sample is one where the high passed sample from any axis has an absolute value e xceeding a user-programmable threshold. The following flowchart explains how to configure the W ake-on-Motion Interrupt. For further details on ind ividual registers, please refer to the MPU-6500 Registers Map and Registers Description document. Figure 8: Wake-on-Motion Interrupt Configuration Configuration Wake-on-Motion Interrupt using low power Accelmode Make Sure Accelis running:

• In PWR_MGMT_1 (0x6B) make CYCLE =0, SLEEP = 0 and STANDBY = 0
• In PWR_MGMT_2 (0x6C) set DIS_XA, DIS_YA, DIS_ZA = 0 and DIS_XG, DIS_YG, DIS_ZG = 1 Set AccelLPF setting to 184 Hz Bandwidth:
• In ACCEL_CONFIG 2 (0x1D) set ACCEL_FCHOICE_B = 0 and A_DLPFCFG[2:0]=1(b001) Enable Motion Interrupt:
• In INT_ENABLE (0x38), set the whole register to 0x40 to enable motion interrupt only. Enable AccelHardware Intelligence:
• In MOT_DETECT_CTRL (0x69), set ACCEL_INTEL_EN = 1 a nd ACCEL_INTEL_MODE = 1 Set Motion Threshold:
• In WOM_THR (0x1F), set the WOM_Threshold[7:0] to 1~255 LSBs (0~1020mg) Set Frequency of Wake-up:
• In LP_ACCEL_ODR (0x1E), set Lposc_clksel[3:0] = 0.2 4Hz ~ 500Hz Enable Cycle Mode (AccelLow Power Mode):
• In PWR_MGMT_1 (0x6B) make CYCLE =1 Motion Interrupt Configuration Completed

MPU-6500 Product Specification Document Number: PS-MPU-6500A-01 Revision: 1.0 Release Date: 09/18/2013 30 of 48

6 Digital Interface

6.1 I2C and SPI Serial Interfaces

The internal registers and memory of the MPU-6500 c an be accessed using either I 2C at 400 kHz or SPI at 1MHz. SPI operates in four-wire mode. Pin Number Pin Name Pin Description 6 VDDIO Digital I/O supply voltage.

7 AD0 / SDO I 2C Slave Address LSB (AD0); SPI serial data output (SDO)

21 SCL / SCLK I 2C serial clock (SCL); SPI serial clock (SCLK)

22 SDA / SDI I 2C serial data (SDA); SPI serial data input (SDI)

Table 14: Serial Interface Note: To prevent switching into I 2C mode when using SPI, the I 2C interface should be disabled by setting the I2C_IF_DIS configuration bit. Setting this bit should be perf ormed immediately after waiting for the time specified by the “Start-Up Time for Register Read/W rite” in Section 6.3. For further information regarding the I2C_IF_DIS bit, please refer to the MPU-6500 Register Map and Register Descriptions document.

6.2 I2C Interface

I 2C is a two-wire interface comprised of the signals serial data (SDA) and serial clock (SCL). In genera l, the lines are open-drain and bi-directional. In a gener alized I 2C interface implementation, attached devices can be a master or a slave. The master device puts the slave address on the bus, and the slave device with the matching address acknowledges the master. The MPU-6500 always operates as a slave device when communicating to the system processor, which thus acts as the master. SDA and SCL lines typically nee d pull-up resistors to VDD. The maximum bus speed i s 400 kHz. The slave address of the MPU-6500 is b110100X which is 7 bits long. The LSB bit of the 7 bit address i s determined by the logic level on pin AD0. This allo ws two MPU-6500s to be connected to the same I 2C bus. When used in this configuration, the address of the one of the devices should be b1101000 (pin AD0 is logic low) and the address of the other should be b1101001 (pin AD0 is logic high).

6.3 I2C Communications Protocol

START (S) and STOP (P) Conditions Communication on the I 2C bus starts when the master puts the START conditi on (S) on the bus, which is defined as a HIGH-to-LOW transition of the SDA line while SCL line is HIGH (see figure below). The bus is considered to be busy until the master puts a STOP condition (P) on the bus, which is defined as a LOW to HIGH transition on the SDA line while SCL is HIGH (see figure below). Additionally, the bus remains busy if a repeated START (Sr) is generated instead of a STOP condition.

MPU-6500 Product Specification Document Number: PS-MPU-6500A-01 Revision: 1.0 Release Date: 09/18/2013 32 of 48 Communications After beginning communications with the START condi tion (S), the master sends a 7-bit slave address followed by an 8 th bit, the read/write bit. The read/write bit indica tes whether the master is receiving data from or is writing to the slave device. Then, the master releases the SDA line and waits for the acknowledg e signal (ACK) from the slave device. Each byte tran sferred must be followed by an acknowledge bit. To acknowledge, the slave device pulls the SDA line LO W and keeps it LOW for the high period of the SCL l ine. Data transmission is always terminated by the maste r with a STOP condition (P), thus freeing the communications line. However, the master can gener ate a repeated START condition (Sr), and address another slave without first generating a STOP condi tion (P). A LOW to HIGH transition on the SDA line while SCL is HIGH defines the stop condition. All SDA cha nges should take place when SCL is low, with the exception of start and stop conditions. SDA START condition SCL ADDRESS R/W ACK DATA ACK DATA ACK STOP condition S P 1 – 7 8 9 1 – 7 8 9 1 – 7 8 9 Figure 11: Complete I 2C Data Transfer To write the internal MPU-6500 registers, the maste r transmits the start condition (S), followed by th e I address and the write bit (0). At the 9 th clock cycle (when the clock is high), the MPU-6500 acknowledges the transfer. Then the master puts the register address (RA) on the bus. After the MPU-6500 acknowledges t he reception of the register address, the master puts the register data onto the bus. This is followed by the ACK signal, and data transfer may be concluded by the s top condition (P). To write multiple bytes after th e last ACK signal, the master can continue outputting data rather than transmitting a stop signal. In this ca se, the MPU-6500 automatically increments the register addr ess and loads the data to the appropriate register. The following figures show single and two-byte write sequences. Single-Byte Write Sequence Burst Write Sequence Master S AD+W RA DATA P Slave ACK ACK ACK Master S AD+W RA DATA DATA P Slave ACK ACK ACK ACK

MPU-6500 Product Specification Document Number: PS-MPU-6500A-01 Revision: 1.0 Release Date: 09/18/2013 33 of 48 To read the internal MPU-6500 registers, the master sends a start condition, followed by the I 2C address and a write bit, and then the register address that is going to be read. Upon receiving the ACK signal fro m the MPU-6500, the master transmits a start signal follo wed by the slave address and read bit. As a result, the MPU-6500 sends an ACK signal and the data. The comm unication ends with a not acknowledge (NACK) signal and a stop bit from master. The NACK conditi on is defined such that the SDA line remains high a t the 9th clock cycle. The following figures show single and two-byte read sequences. Single-Byte Read Sequence Burst Read Sequence 6.4 I 2C Terms Signal Description S Start Condition: SDA goes from high to low while SCL is high AD Slave I 2C address W Write bit (0) R Read bit (1) ACK Acknowledge: SDA line is low while the SCL line is high at the 9th clock cycle NACK Not-Acknowledge: SDA line stays high at the 9 th clock cycle RA MPU-6500 internal register address DATA Transmit or received data P Stop condition: SDA going from low to high while SCL is high Table 15: I2C Terms Master S AD+W RA S AD+R NACK P Slave ACK ACK ACK DATA Master S AD+W RA S AD+R ACK NACK P Slave ACK ACK ACK DATA DATA

MPU-6500 Product Specification Document Number: PS-MPU-6500A-01 Revision: 1.0 Release Date: 09/18/2013 34 of 48

6.5 SPI Interface

SPI is a 4-wire synchronous serial interface that u ses two control lines and two data lines. The MPU-6 500 always operates as a Slave device during standard M aster-Slave SPI operation. With respect to the Master, the Serial Clock output (SCLK), the Serial Data Output (SDO) and the Seria l Data Input (SDI) are shared among the Slave devices . Each SPI slave device requires its own Chip Selec t (CS) line from the master. CS goes low (active) at the start of transmission a nd goes back high (inactive) at the end. Only one C S line is active at a time, ensuring that only one slave i s selected at any given time. The CS lines of the n on- selected slave devices are held high, causing their SDO lines to remain in a high-impedance (high-z) s tate so that they do not interfere with any active devices. SPI Operational Features 1. Data is delivered MSB first and LSB last 2. Data is latched on the rising edge of SCLK 3. Data should be transitioned on the falling edge of SCLK 4. The maximum frequency of SCLK is 1MHz 5. SPI read and write operations are completed in 1 6 or more clock cycles (two or more bytes). The first byte contains the SPI Address, and the follow ing byte(s) contain(s) the SPI data. The first bit of the first byte contains the Read/Write bit a nd indicates the Read (1) or Write (0) operation. The following 7 bits contain the Register Address. In cases of multiple-byte Read/Writes, data is two or more bytes: SPI Address format MSB LSB R/W A6 A5 A4 A3 A2 A1 A0 SPI Data format MSB LSB D7 D6 D5 D4 D3 D2 D1 D0 6. Supports Single or Burst Read/Writes. Figure 12 Typical SPI Master / Slave Configuration SPI Master SPI Slave 1 SPI Slave 2 /CS1 /CS2 SCLK SDI SDO /CS SCLK SDI SDO /CS

MPU-6500 Product Specification Document Number: PS-MPU-6500A-01 Revision: 1.0 Release Date: 09/18/2013 35 of 48

7 Serial Interface Considerations

7.1 MPU-6500 Supported Interfaces

2C communications on both its primary (microprocesso r) serial interface and its auxiliary interface. . The MPU-6500’s I/O logic levels are set to be VDDIO. The figure below depicts a sample circuit of MPU-65 00 with a third party magnetometer attached to the auxiliary I2C bus. It shows the relevant logic levels and volta ge connections. Note: Actual configuration will depend on the auxiliary sensors used. MPU-6500 3rd Party Magnetometer SDA AUX_CL SCL AUX_DA VDD_IO VDD SA0 INT 2 INT 1 System Processor IO SYSTEM BUS VDDIO VDDIO VDDIO VDD VDDIO (0V -VDDIO) SCL SDA INT FSYNC VDDIO AD0 (0V -VDDIO) (0V -VDDIO) (0V -VDDIO) (0V - VDDIO) (0V -VDDIO) (0V -VDDIO) (0V -VDDIO) (0V -VDDIO) (0V, VDDIO) (0V, VDDIO) CS (0V, VDDIO) VDD_IO Figure 13: I/O Levels and Connections Note: The Interrupt line should be connected to a p in on the Application Processor (AP) that can bring the AP out of suspend mode.

MPU-6500 Product Specification Document Number: PS-MPU-6500A-01 Revision: 1.0 Release Date: 09/18/2013 36 of 48

8 Assembly

This section provides general guidelines for assemb ling InvenSense Micro Electro-Mechanical Systems (MEMS) gyros packaged in Quad Flat No leads package (QFN) surface mount integrated circuits.

8.1 Orientation of Axes

The diagram below shows the orientation of the axes of sensitivity and the polarity of rotation. Note the pin 1 identifier (•) in the figure. MPU-6500 Figure 14: Orientation of Axes of Sensitivity and P olarity of Rotation

MPU-6500 Product Specification Document Number: PS-MPU-6500A-01 Revision: 1.0 Release Date: 09/18/2013 37 of 48

8.2 Package Dimensions

24 Lead QFN (3x3x0.9) mm NiPdAu Lead-frame finish DIMENSIONS IN MILLIMETERS SYMBOLS DESCRIPTION MIN NOM MAX A Package thickness 0.85 0.90 0.95 A1 Lead finger (pad) seating height 0.00 0.02 0.05 b Lead finger (pad) width 0.15 0.20 0.25 c Lead frame (pad) height --- 0.20 REF --- D Package width 2.90 3.00 3.10 D2 Exposed pad width 1.65 1.70 1.75 E Package length 2.90 3.00 3.10 E2 Exposed pad length 1.49 1.54 1.59 e Lead finger-finger (pad-pad) pitch --- 0.40 --- f (e -b) Lead-lead (Pad-Pad) space 0.15 0.20 0.25 K Lead (pad) to Exposed Pad Space --- 0.35 REF --- L Lead (pad) length 0.25 0.30 0.35 R Lead (pad) corner radius 0.075 REF --- R’ Corner lead (pad) outer radius 0.10 0.11 0.12 R’’ Corner lead (pad) inner radius 0.10 0.11 0.12 s Corner lead-lead (pad-pad) spacing --- 0.25 REF --- h Corner lead dimension 0.22 w Corner lead dimension 0.12 y Lead Conformality 0.00 --- 0.075 h w

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8.3 PCB Design Guidelines

Recommendation: Design the PCB pad layout with Non- Solder Mask Defined pads (NSMD), rather than Solder Mask Defined (SMD) pads. NSMD pads have seve ral advantages over SMD pads. NSMD pads provide a tighter tolerance on copper etching, prov ide a larger copper pad area, and allow the solder to anchor to the edges of the copper pads to improve s older joint reliability. Design the PCB pad land si zes to match the component pad sizes listed in the package dimensions. Set the solder mask aperture to a minimum of 0.05 mm larger than the component solder pad per edge with blocked areas, or with individua lly outlined pads as shown below. Blocked Areas – Solder Mask Individually Outlined Pads – Solder Mask

8.4 Assembly Precautions

8.4.1 Gyroscope Surface Mount Guidelines

InvenSense MEMS Gyros sense rate of rotation. In ad dition, gyroscopes sense mechanical stress coming from the printed circuit board (PCB). This PCB stress can be minimized by adhering to certain design rules: When using MEMS gyroscope components in plastic pac kages, PCB mounting and assembly can cause package stress. This package stress in turn can aff ect the output offset and its value over a wide ran ge of temperatures. This stress is caused by the mismatch between the Coefficient of Linear Thermal Expansio n (CTE) of the package material and the PCB. Care mus t be taken to avoid package stress due to mounting. Traces connected to pads should be as symmetric as possible. Maximizing symmetry and balance for pad connection will help component self-alignment and w ill lead to better control of solder paste reductio n after reflow. Any material used in the surface mount assembly pro cess of the MEMS gyroscope should be free of restricted RoHS elements or compounds. Pb-free sold ers should be used for assembly. SOLDER MASK EXTENT PACKAGE OUTLINE PACKAGE OUTLINE SOLDER MASK EXTENT 0.05 ≤ 0.05 ≤ 0.05 ≤ 0.05 ≤ ≤0.05 ≤0.05

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8.4.2 Exposed Die Pad Precautions

The MPU-6500 has very low active and standby curren t consumption. There is no electrical connection between the exposed die pad and the internal CMOS c ircuits. The exposed die pad is not required for he at- sinking, and should not be soldered to the PCB. Und erfill is also not recommended. Soldering or adding underfill to the e-pad can induce performance changes due to package thermo-mechanical stress.

8.4.3 Trace Routing

Routing traces or vias under the gyro package such that they run under the exposed die pad is prohibit ed. Routed active signals may harmonically couple with the gyro MEMS devices, compromising gyro response. The gyro drive frequency is 25 to 29 KHz. To avoid harmonic coupling don’t route active signals in non - shielded signal planes directly below, or above the gyro package. Note: For best performance, design a ground plane under the e-pad to reduce PCB signal n oise from the board on which the gyro device is mounted. If the gyro device is stacked under anothe r PCB board, design a ground plane directly above t he gyro device to shield active signals from the PCB board mounted above.

8.4.4 Component Placement

Do not place large insertion components such as key board or similar buttons, connectors, or shielding boxes at a distance of less than 6 mm from the MEMS gyro. Maintain generally accepted industry design practi ces for component placement near the MPU-6500 to preven t noise coupling and thermo-mechanical stress.

8.4.5 PCB Mounting and Cross-Axis Sensitivity

Orientation errors of the gyroscope and acceleromet er mounted to the printed circuit board can cause c ross- axis sensitivity in which one gyro sense axis or ac cel responds to rotation or acceleration about an orthogonal axis. For example, the X-gyro sense axis may respond to rotation about the Y or Z axes. The orientation mounting errors are illustrated in the figure below. Package Gyro & Accel Axes ( ) Relative to PCB Axes ( ) with Orientation Errors ( Θ and Φ) MPU-6500 Φ Θ X Y Z

MPU-6500 Product Specification Document Number: PS-MPU-6500A-01 Revision: 1.0 Release Date: 09/18/2013 40 of 48 The table below shows the cross-axis sensitivity as a percentage of the gyroscope or accelerometer’s sensitivity for a given orientation error, respectively. Cross-Axis Sensitivity vs. Orientation Error Orientation Error (θ or Φ) Cross -Axis Sensitivity (sin θ or sin Φ) 0.0º 0.00% 0.5º 0.87% 1.0º 1.75% The specifications for cross-axis sensitivity in Se ction 3.1 and Section 3.2 include the effect of the die orientation error with respect to the package.

8.4.6 MEMS Handling Instructions

MEMS (Micro Electro-Mechanical Systems) are a time- proven, robust technology used in hundreds of millions of consumer, automotive and industrial pro ducts. MEMS devices consist of microscopic moving mechanical structures. They differ from conventiona l IC products, even though they can be found in sim ilar packages. Therefore, MEMS devices require different handling precautions than conventional ICs prior t o mounting onto printed circuit boards (PCBs). The MPU-6500 has been qualified to a shock tolerance of 10,000 g. InvenSense packages its gyroscopes as it deems proper for protection against normal handl ing and shipping. It recommends the following handl ing precautions to prevent potential damage.

• Do not drop individually packaged gyroscopes, or t rays of gyroscopes onto hard surfaces. Components placed in trays could be subject to g-forces in excess of 10,000 g if dropped.
• Printed circuit boards that incorporate mounted gy roscopes should not be separated by manually snapping apart. This could also create g-forces in excess of 10,000 g.
• Do not clean MEMS gyroscopes in ultrasonic baths. Ultrasonic baths can induce MEMS damage if the bath energy causes excessive drive motion through r esonant frequency coupling.

8.4.7 ESD Considerations

Establish and use ESD-safe handling precautions whe n unpacking and handling ESD-sensitive devices.

• Store ESD sensitive devices in ESD safe containers until ready for use, such as the original moisture sealed bags, until ready for assembly.
• Restrict all device handling to ESD protected work areas that measure less than 200V static charge. Ensure that all workstations and personnel are properly grounded to prevent ESD.

8.4.8 Reflow Specification

Qualification Reflow: The MPU-6500 was qualified in accordance with IPC/ JEDEC J-STD-020D.1. This standard classifies proper packaging, storage and h andling in order to avoid subsequent thermal and mechanical damage during the solder reflow attachme nt phase of PCB assembly. The qualification preconditioning process specifies a sequence consisting of a bake cycle, a moisture soak cycle (in a temperature humidity oven), and three c onsecutive solder reflow cycles, followed by functi onal device testing.

MPU-6500 Product Specification Document Number: PS-MPU-6500A-01 Revision: 1.0 Release Date: 09/18/2013 41 of 48 The peak solder reflow classification temperature r equirement for package qualification is (260 +5/-0° C) for lead-free soldering of components measuring less th an 1.6 mm in thickness. The qualification profile and a table explaining the set-points are shown below: Temperature Set Points Corresponding to Reflow Prof ile Above Step Setting CONSTRAINTS Temp (° C) Time (sec) Max. Rate (° C/sec) A Troom 25 B TSmin 150 C TSmax 200 60 < t BC < 120 D TLiquidus 217 r (TLiquidus -TPmax) < 3 E TPmin [255° C, 260° C] 255 r (TLiquidus-TPmax) < 3 F TPmax [ 260° C, 265° C] 260 t AF < 480 r (TLiquidus -TPmax) < 3 G TPmin [255° C, 260° C] 255 10< t EG < 30 r (TPmax -TLiquidus) < 4 H TLiquidus 217 60 < t DH < 120 I Troom 25 Notes: Customers must never exceed the Classification temperature (T Pmax = 260° C). All temperatures refer to the topside of the QFN p ackage, as measured on the package body surface. Production Reflow: Check the recommendations of your solder manufactu rer. For optimum results, use lead-free solders that have lower specified tempera ture profiles (Tp max ~ 235° C). Also use lower ramp-up and ramp-down rates than those used in the qualificatio n profile. Never exceed the maximum conditions that we used for qualification, as these represent the maximum tolerable ratings for the device. Temperature [° C] Time [Seconds] SOLDER REFLOW PROFILE FOR QUALIFICATION LEAD-FREE IR/CONVECTION Preheat 60-120sec Tsmax Tsmin TLiquidus TPmin TPmax Liquidus 60-120sec 10-30sec Tramp-up ( < 3 C/sec) Tramp-down ( < 4 C/sec) Troom-Pmax (< 480sec) A B C D E F G H I

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8.5 Storage Specifications

The storage specification of the MPU-6500 conforms to IPC/JEDEC J-STD-020D.1 Moisture Sensitivity Leve l (MSL) 3. Calculated shelf-life in moisture-sealed bag 12 mon ths -- Storage conditions: <40° C and <90% RH After opening moisture-sealed bag 168 hours -- Stor age conditions: ambient ≤30° C at 60%RH

8.6 Package Marking Specification

Package Marking Specification

8.7 Tape & Reel Specification

(I) Measured from centerline of sprocket hole to centerline of pocket (II) Cummulative tolerance of 10 sprocket holes is ± 0.20 (III) Measured from centerline of sprocket hole to centerline of pocket ALL DIMENSIONS IN MILLIMETERS UNLESS OTHE RWISE STATED DETAIL “A” REF R 0.25 REF R 0.25 “A” A 0 3.30 ± 0.1 P 1 8.00 ± 0.1 2.00 ± 0.1 (I) P 2 K 0 1.10 ± 0.1 F (III) 5.50 ± 0.1 W 12.00 ± 0.3 4.00 ± 0.1 (II) P 0 1.55 ± 0.05 D 0 O 1.5 min . D 1 0.30 ± 0.05 T Y Y S ection Y -Y

MPU-6500 Product Specification Document Number: PS-MPU-6500A-01 Revision: 1.0 Release Date: 09/18/2013 43 of 48 Reel Outline Drawing Reel Dimensions and Package Size PACKAGE SIZE REEL (mm) L V W Z 3x3 330 102 12.8 2.3 Tape and Reel Specification – Package Orientation Label Reel Cover Tape (Anti-Static) Carrier Tape (Anti-Static) Terminal Tape User Direction of Feed INVENSENSE INVENSENSE INVENSENSE INVENSENSE Pin 1 Package Orientation InvenSense P b -f r e e c a te g o r y ( e 4 ) H F D E V IC E (1 P ): M P U -6 0 5 0 P O : H U B R E E L Q T Y (Q ): 5 0 0 0 L O T 1 (1 T ): Q 2 R 7 8 4 -F 1 D /C (D ): 1 1 1 8 Q T Y (Q ): 3 0 0 0 L O T 2 (1 T ): Q 3 V 2 1 5 -G 1 D /C (D ): 1 1 0 7 Q T Y (Q ): 2 0 0 0 R e e l D a te : 1 8 /0 5 /1 1 Q C S T A M P :

MPU-6500 Product Specification Document Number: PS-MPU-6500A-01 Revision: 1.0 Release Date: 09/18/2013 44 of 48 Reel Specifications Quantity Per Reel 5,000 Reels per Box 1 Boxes Per Carton (max) 5 Pcs/Carton (max) 25,000

8.8 Label

Barcode Label Location of Label on Reel InvenSense Pb-free category (e4) HF DEVICE (1P): MPU-6500 PO: HUB REEL QTY (Q): 5000 LOT1 (1T): Q2R994-F1 D/C (D): 1204 QTY (Q): 615 LOT2 (1T): Q3X785-G1 D/C (D): 1207 QTY (Q): 4385 Reel Date: 28/04/12 QC STAMP:

MPU-6500 Product Specification Document Number: PS-MPU-6500A-01 Revision: 1.0 Release Date: 09/18/2013 45 of 48

8.9 Packaging

REEL – with Barcode & Vacuum-Sealed Moisture MSL 3 Label Caution labels Barrier Bag with inner foam lining , MSL3, Caution, and Barcode Labels Caution Label ESD Label Moisture Sealed Reel Pizza Box Pizza Boxes Placed in Outer Shipper La bel Foam-lined Shipper Box

MPU-6500 Product Specification Document Number: PS-MPU-6500A-01 Revision: 1.0 Release Date: 09/18/2013 46 of 48

8.10 Representative Shipping Carton Label

INV. NO: 111013-99 SUPP PROD ID: MPU-6500 QTY: 5615 QTY: 0 QTY: 4385 QTY: 0 QTY: 5000 QTY: 0 QTY: 0 QTY: 0 Pb-free Category (e4) HF 1 3 From: InvenSense Taiwan, Ltd. 1F, 9 Prosperity 1st Road, Hsinchu Science Park, HsinChu City, 30078, Taiwan TEL: +886 3 6686999 FAX: +886 3 6686777 Ship To: Customer Name Street Address City, State, Country ZIP Attn: Buyer Name Phone: Buyer Phone Number LOT#: Q2R994-F1 LOT#: LOT#: Q3X785-G1 LOT#: 15000 4.05 Shipping Carton: OF LOT#: Q3Y196-02 LOT#: LOT#: LOT#: Total Quantity/Carton Weight: (KG)

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9 Reliability

9.1 Qualification Test Policy

InvenSense’s products complete a Qualification Test Plan before being released to production. The Qualification Test Plan for the MPU-6500 followed t he JESD47I Standards, “Stress-Test-Driven Qualifica tion of Integrated Circuits,” with the individual tests described below.

9.2 Qualification Test Plan

(HTOL/LFR) High Temperature Operating Life JEDEC JESD22- A108D, Dynamic, 3.63V biased, Tj>125° C [read-points 168, 500, 1000 hours] 3 77 (0/1) (HAST) Highly Accelerated Stress Test (1) JEDEC JESD22-A118A Condition A, 130° C, 85%RH, 33.3 psia. unbiased, [re ad- point 96 hours] 3 77 (0/1) (HTS) High Temperature Storage Life JEDEC JESD22-A103D, Cond. A, 125° C Non-Bias Bake [read-points 168, 500, 1000 hours] 77 (0/1) Device Component Level Tests TEST Method/Condition Lot Quantity Sample / Lot Acc / Reject Criteria (ESD-HBM) ESD-Human Body Model ANSI/ESDA/JEDEC JS-001-2012, (2KV) 1 3 (0/1) (ESD-MM) ESD-Machine Model JEDEC JESD22-A115C, (250V) 1 3 (0/1) (LU) Latch Up JEDEC JESD-78D Class II (2), 125° C; ±100mA 1 6 (0/1 ) (MS) Mechanical Shock JEDEC JESD22-B104C, Mil-Std-883, Method 2002.5, Cond. E, 10,000 g’s , 0.2ms, ±X, Y, Z – 6 directions, 5 times/direction (0/1) (VIB) Vibration JEDEC JESD22-B103B, Variable Frequency (random), Cond. B, 5-500Hz, X, Y, Z – 4 times/direction 3 5 (0/1) (TC) Temperature Cycling (1) JEDEC JESD22-A104D Condition G [-40° C to +125° C], Soak Mode 2 [5’], 1000 cycles 3 77 (0/1) (1) Tests are preceded by MSL3 Preconditioning in accordance with JEDEC JESD22-A113F

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10 Compliance

10.1 Environmental Co mpliance

The MPU-6500 is RoHS and Green compliant. The MPU-6500 is in full environmental compliance as evidenced in report HS-MPU-6500A, Materials Declaration Data Sheet.

10.2 DRC Compliance

The MPU-6500 uses materials that comply with DRC (D emocratic Republic of the Congo) Conflict-Free Smelter and Mines requirements. Compliance Declaration Disclaimer: InvenSense believes this compliance information to be correct but cannot guarantee accuracy or complet eness. Conformity documents for the above component constitutes are on file. In venSense subcontracts manufacturing and the information contained herein is based on data received from vendors and suppliers, which has not been validated by InvenSense Environmental Declaration Disclaimer: InvenSense believes this environmental information to be correct but cannot guarantee accuracy or comp leteness. Conformity documents for the above component constitutes are o n file. InvenSense subcontracts manufacturing and t he information contained herein is based on data received from vendors and suppliers, which has not been validated by InvenSense. This information furnished by InvenSense is believed to be accurate and reliable. However, no responsibility is assumed by InvenSense for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications are subject to change without notice. InvenSense reserves the righ t to make changes to this product, including its ci rcuits and software, in order to improve its design and/or performance, without prior notice. InvenSense makes no warranties, neither e xpressed nor implied, regarding the information and specifications contained in this document. InvenSense assumes no responsibility for any claims or damages arising from information contained in this document, or fro m the use of products and services detailed therein . This includes, but is not limited to, claims or damages based on the infringement of patents, copyrights, mask work and/or other intellectual property rights. Certain intellectual property owned by InvenSense a nd described in this document is patent protected. No license is granted by implication or otherwise under any patent or patent rights of InvenSense. This publication supersedes and replaces all information previously supplied. Trademarks that are registered trademarks are the property of their respective co mpanies. InvenSense sensors should not be used or sold in the development, storage, production or utilization of any conventional or mass-destructive weapons or for any other weapons or life threatening applications, as well as in any other life critical applications such as medical equipment, transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime prevention equipment. InvenSense® is a registered trademark of InvenSense, Inc. MPU TM , MPU-6500 TM , Digital Motion Processor ™ , DMP ™ , Motion Processing Unit™, MotionFusion™, MotionInterface™ , MotionTracking™ , and MotionApps™ are trademarks of InvenSense, Inc . ©2013 InvenSense, Inc. All rights reserved.