MPL115A2 NXP
Document overview
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Technical content
Miniature I2C digital barometer, 50 to 115 kPa Rev. 10 — 10 October 2017 Data sheet: technical data
1 General description
The MPL115A2 is an absolute pressure sensor with a digital I2C output targeting low cost applications. A miniature 5 x 3 x 1.2 mm LGA package is ideally suited for the space constrained requirements of portable electronic devices. Low current consumptions of 5 μA during Active mode and 1 μA during Shutdown (Sleep) mode are essential when focusing on low-power applications. The wide operating temperature range spans from – 40 °C to +105 °C to fit demanding environmental conditions. The MPL115A2 employs a MEMS pressure sensor with a conditioning IC to provide accurate pressure measurements from 50 to 115 kPa. An integrated ADC converts pressure and temperature sensor readings to digitized outputs via a I2C port. Factory calibration data is stored internally in an on-board ROM. Utilizing the raw sensor output and calibration data, the host microcontroller executes a compensation algorithm to render Compensated Absolute Pressure with ±1 kPa accuracy. The MPL115A2 pressure sensor’s small form factor, low power capability, precision, and digital output optimize it for barometric measurement applications.
2 Features
- Digitized pressure and temperature information together with programmed calibration coefficients for host micro use.
- Factory calibrated
- 50 kPa to 115 kPa absolute pressure
- ±1 kPa accuracy
- 2.375 V to 5.5 V supply
- Integrated ADC
- I2C Interface (operates up to 400 kHz)
- 7-bit I2C address = 60h
- Monotonic pressure and temperature data outputs
- Surface mount RoHS compliant package
3 Applications
- Barometry (portable and desktop)
- Altimeters
- Weather stations
- Hard-disk drives (HDD)
- Industrial equipment
- Health monitoring
- Air control systems
4 Ordering information
Table 1. Ordering information
4.1 Ordering options
Table 2. Ordering options
5 Block diagram
Figure 1. Block diagram of MPL115A2
6 Pinning information
6.1 Pinning
Figure 2. Pin configuration
6.2 Pin description
Table 3. Pin description 1 VDD Power Supply Connection: VDD range is 2.375 V to 5.5 V. 2 CAP 1 μF connected to ground.
3 GND Ground
4 SHDN
all communications pins (RST, SCL, SDA) are high impedance. Connect to VDD for normal operation. 5 RST Reset: Connect to ground to disable I2C communications.
6 NC No connection
7 SDA[1] Serial data I/O line
8 SCL[1] Serial clock input. [1] Use 4.7 kΩ pullup resistors for I2C communication.
7 Handling and Board Mount Recommendations
7.1 Methods of Handling
NXP Semiconductors MPL115A2 Miniature I2C digital barometer, 50 to 115 kPa Data sheet: technical data Rev. 10 — 10 October 2017 device. Multiple vacuum ports within the nozzle may be required to effectively handle the device and prevent shifting during movement to placement position. Vacuum pressure required to adequately support the component should be approximately 25 inches Hg (85 kPa). This level is typical of in-house vacuum supply. Pickup nozzles are available in various sizes and configurations to suit a variety of component geometries. To select the nozzle best suited for the specific application, it is recommended that the customer consult their pick and place equipment supplier to determine the correct nozzle. In some cases it may be necessary to fabricate a special nozzle depending on the equipment and speed of operation. Tweezers or other mechanical forms of handling that have a sharp point are not recommended since they can inadvertently be inserted into the vent hole of the device. This can lead to a puncture of the MEMS element that will render the device inoperable.
7.2 Board Mount Recommendations
Components can be mounted using solder paste stencil, screen printed or dispensed onto the PCB pads prior to placement of the component. The volume of solder paste applied to the PCB is normally sufficient to secure the component during transport to the subsequent reflow soldering process. Use of adhesives to secure the component is not recommended, but where necessary can be applied to the underside of the device. Solder pastes are available in variety of metal compositions, particle size and flux types. The solder paste consists of metals and flux required for a reliable connection between the component lead and the PCB pad. Flux aids the removal of oxides that may be present on PCB pads and prevents further oxidation from occurring during the solder process. The use of a No-Clean (NC) flux is recommended for exposed cavity components. Using pressure spray, wire brush, or other methods of cleaning is not recommended since it can puncture the MEMS device and render it unusable. If cleaning of the pcb is performed, Water Soluble (WS) flux can be used. However, it is recommended the component cavity is protected by adhesive Kapton tape, vinyl cap or other means prior to the cleaning process. This covering will prevent damage to the MEMS device, contamination, and foreign materials from being introduced into device cavity as result of cleaning processes. Ultrasonic cleaning is not recommended as the frequencies can damage wire bond interconnections and the MEMS device.
8 Functional description
Figure 3. Sequence flow chart The MPL115A interfaces to a host (or system) microcontroller in the user’s application. are cleared. The device then enters standby mode. usually stored in the host microcontoller local memory but can be re-read at any time. result is placed into the Pressure and Temperature ADC output registers. Table 10). The device then enters standby mode.
measurement with a vacuum as a reference. step to obtain the next pressure reading or it may go to the Shutdown step. will be reset, losing any previous ADC output values. transitioning to the data Conversion step. Table 4. Device memory map
8.1 Pressure, temperature and coefficient bit-width specifications
Table 5. Pressure, temperature and compensation coefficient specifications Note: Negative coefficients are coded in 2’s complement notation.
8.2 Compensation
NXP Semiconductors MPL115A2 Miniature I2C digital barometer, 50 to 115 kPa Data sheet: technical data Rev. 10 — 10 October 2017 (1) Where: Padc is the 10-bit pressure ADC output of the MPL115A Tadc is the 10-bit temperature ADC output of the MPL115A a0 is the pressure offset coefficient b1 is the pressure sensitivity coefficient b2 is the temperature coefficient of offset (TCO) c12 is the temperature coefficient of sensitivity (TCS) Pcomp will produce a value of 0 with an input pressure of 50 kPa and will produce a full- scale value of 1023 with an input pressure of 115 kPa. (2)
8.3 Evaluation sequence, arithmetic circuits
The following is an example of the calculation for Pcomp, the compensated pressure output. Input values are in bold. c12x2 = c12 * Tadc a1 = b1 + c12x2 a1x1 = a1 * Padc y1 = a0 + a1x1 a2x2 = b2 * Tadc Pcomp = y1 + a2x2 This can be calculated as a succession of Multiply Accumulates (MACs) operations of the form y = a + b * x: a b x X The polynomial can be evaluated (Equation 1) as a sequence of 3 MACs:
Please refer to NXP application note AN3785 for more detailed notes on implementation.
8.4 I2C device read/write operations
Conversions, are controlled by writing to the appropriate memory address location.
- For I2C the 7-bit device address (from Table 2) has a read/write toggle bit, where the least significant bit is ‘1’ for read operations or ‘0’ for write operations. The Device Address is C0h for a Write and the Device Address is C1h for a Read.
- The most significant bit in the Command tables below is not used and is don't care (X). In examples given it’s set to ‘0’. Refer to Sensor I2C Setup and FAQ Application Note AN4481 for more information on I2C communication between the sensor and host controller.
Table 6. I2C write commands Table 7. I2C write command description to D conversion. Select temperature input. Perform A to D conversion.
Table 8. I2C read command description the commands for the interaction is given as an example to operate the MPL115A2. reading is given in floating point notation. Figure 4. I2C read coefficient datagram
NXP Semiconductors MPL115A2 Miniature I2C digital barometer, 50 to 115 kPa Data sheet: technical data Rev. 10 — 10 October 2017
8.5 Example of pressure compensated calculation in floating-point
a0 coefficient = 2009.75 b1 coefficient = -2.37585 b2 coefficient = -0.92047 c12 coefficient = 0.000790 Pressure = 410 ADC counts Temperature = 507 ADC counts Pressure compensation Using the evaluation sequence The evaluation sequence is located in Section 8.3. c12x2 = c12 * Tadc = 0.000790 * 507 = 0.40053 a1 = b1 + c12x2 = -2.37585 + 0.40053 = -1.97532 a1x1 = a1 * Padc = -1.97532 * 410 = -809.8812 y1 = a0 + a1x1 = 2009.75 + (-809.8812) = 1199.8688 a2x2 = b2 * Tadc = -0.92047 * 507 = -466.67829 PComp = y1 + a2x2 = 1199.8688 + (-466.67829) = 733.19051
9 Maximum ratings
Table 9. Maximum ratings
10 Mechanical and electrical characteristics
Table 10. Mechanical and electrical characteristics
2 Supply Current IDD
3 Range 50 — 115 kPa
5 Accuracy –20 ºC to 85 ºC — — ±1 kPa
7 Conversion Time
8 Wakeup Time tw Time between leaving Shutdown
issue a command or read data.
9 SCL Clock Frequency fSCL — — 400 kHz
NXP Semiconductors MPL115A2 Miniature I2C digital barometer, 50 to 115 kPa Data sheet: technical data Rev. 10 — 10 October 2017 Ref Parameters Symbol Conditions Min Typ Max Units I2C Outputs: SDA
12 Data Setup Time tSU Setup time from command receipt to
0 — 0.4 s I2C Addressing MPL115A2 uses 7-bit addressing, does not acknowledge the general call address 0000000. Slave address has been set to 60h or 1100000.
NXP Semiconductors MPL115A2 Miniature I2C digital barometer, 50 to 115 kPa Data sheet: technical data Rev. 10 — 10 October 2017
Figure 7. Package outline SOT1769-1 (TSON8)
12 Packing information
Figure 8. LGA (3 x 5) embossed carrier tape dimensions Figure 9. Device orientation in chip carrier
NXP Semiconductors MPL115A2 Miniature I2C digital barometer, 50 to 115 kPa Data sheet: technical data Rev. 10 — 10 October 2017
13 Soldering
- Use SAC solder alloy, i.e., Sn-Ag-Cu, with a melting point of about 217 °C. It is 2. Reflow
- Ramp up rate: 2 to 3 °C/s.
- Preheat flat (soak): 110 to 130 s.
- Reflow peak temperature: 250 °C to 260 °C (depends on exact SAC alloy composition).
- Time above 217°C: 40 to 90s (depends on board type, thermal mass of the board/ quantities in the reflow).
- Ramp down: 5 to 6 °C/s.
- Using an inert reflow environment (with O2 level about 5 to 15 ppm). Note: The stress level and signal offset of the device also depends on the board type, board core material, board thickness and metal finishing of the board. Please refer to NXP application note AN3150, Soldering Recommendations for Pressure Sensor Devices for any additional information.
14 Soldering/landing pad information
The LGA package is compliant with the RoHS standard. It is recommended to use a no- clean solder paste to reduce cleaning exposure to high pressure and chemical agents that can damage or reduce life span of the Pressure sensing element.
Figure 10. Recommended PCB landing pattern
Table 11. Revision history
- Legal texts have been adapted to the new company name where appropriate.
- Removed the first paragraph of Section 7.
- Added Section 7.1 and Section 7.2 in Section 7 "Handling and Board Mount Recommendations"
- Updated Figure 7. No technical changes. MPL115A2 v.9 10/2012 Technical data — MPL115A2 v.8 MPL115A2 v.8 06/2012 Technical data — —
NXP Semiconductors MPL115A2 Miniature I2C digital barometer, 50 to 115 kPa Data sheet: technical data Rev. 10 — 10 October 2017
16 Legal information
16.1 Data sheet status
Document status[1][2] Product status[3] Definition [short] Data sheet: product preview Development This document contains certain information on a product under development. NXP reserves the right to change or discontinue this product without notice. [short] Data sheet: advance information Qualification This document contains information on a new product. Specifications and information herein are subject to change without notice. [short] Data sheet: technical data Production This document contains the product specification. NXP Semiconductors reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term 'short data sheet' is explained in section "Definitions". [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a technical data data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the technical data data sheet.
16.3 Disclaimers
Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to
NXP Semiconductors MPL115A2 Miniature I2C digital barometer, 50 to 115 kPa Data sheet: technical data Rev. 10 — 10 October 2017 applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non- automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions.
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. NXP — is a trademark of NXP B.V.
NXP Semiconductors MPL115A2 Miniature I2C digital barometer, 50 to 115 kPa Data sheet: technical data Rev. 10 — 10 October 2017 Tables Tab. 5. Pressure, temperature and compensation Figures Fig. 8. LGA (3 x 5) embossed carrier tape
NXP Semiconductors MPL115A2 Miniature I2C digital barometer, 50 to 115 kPa Please be aware that important notices concerning this document and the product(s) described herein, have been included in section 'Legal information'. © NXP B.V. 2017. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 10 October 2017 Document identifier: MPL115A2