MPI2520 EATON | Alldatasheet

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Technical content

Product description:

  • Halogen free, lead free, RoHS compliant
  • 125°C maximum total temperature operation
  • 2.7 x 2.2 x 1.0 / 1.2mm maximum surface mount package
  • Magnetically shielded, low EMI
  • Inductance range from 0.47µH to 10.0µH
  • Current range from 1.1 to 4.8 amps Applications:
  • Mobile/smart phones
  • Handheld/mobile equipment
  • Digital cameras
  • Media players
  • GPS
  • MP3 Players
  • Tablets/e-readers Environmental data:
  • Storage temperature range (Component): -40°C to +125°C
  • Operating temperature range: -40°C to +125°C (ambient + self-temperature rise)
  • Solder reflow temperature: J-STD-020D compliant Packaging:
  • Supplied in tape and reel packaging, 3000 parts per 7” diameter reel MPI2520 High Current, Low Profile, Miniat ure Power Inductors Technical Data 10199 Effective January 2014 HALOGEN HFFREEPb Discontinued, Effective September 15, 2016 or until inventory is depleted. Recommended replacement MPI25-V2

www.eaton.com/elx Technical Data 10199 Effective January 2014 MPI2520 High Current, Low Profile Miniature Power Inductors Product specifications Part Number5 OCL1 (μH)±20% Irms (Amps) Isat (Amps) DCR (mΩ) @ 25°C typical DCR (mΩ) @ 25°C max K-Factor4 R0 —1.0mm Height MPI2520R0-R47-R 0.47 4.1 4.4 28 34 2887 MPI2520R0-1R0-R 0.9 3.2 3.2 50 60 1925 MPI2520R0-1R5-R 1.5 2.4 2.6 80 96 1444 MPI2520R0-2R2-R 2.2 2.2 2.4 103 124 1283 MPI2520R0-3R3-R 3.3 1.6 1.6 190 228 1050 MPI2520R0-4R7-R 4.7 1.4 1.4 240 288 825 R1 - 1.2mm Height MPI2520R1-R47-R 0.47 4.5 4.8 20 24 2310 MPI2520R1-1R0-R 1.0 3.7 4.0 35 42 1925 MPI2520R1-1R5-R 1.5 2.9 3.4 55 66 1444 MPI2520R1-2R2-R 2.2 2.3 2.7 75 90 1255 MPI2520R1-3R3-R 3.3 1.8 2.4 105 126 962 MPI2520R1-4R7-R 4.7 1.6 1.9 150 180 825 MPI2520R1-5R6-R 5.6 1.5 1.5 200 240 679 MPI2520R1-6R8-R 6.8 1.3 1.3 300 360 679 MPI2520R1-100-R 10.0 1.1 1.2 390 468 525 1. Open Circuit Inductance (OCL) Test Parameters: 1MHz, 0.1Vrms, 0.0Adc, 25°C 2. Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 125°C under worst case operating conditions verified in the end application. 3. Isat: Peak current for approximately 30% rolloff at +25°C 4. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ∆I. Bp-p:(Gauss), K: (K-factor from table), L: (Inductance in µH), ∆I (Peak to peak ripple current in Amps). 5. Part Number Definition: MPI2520Rx-yyy-R - MPI2520Rx = Product code and size - yyy = Inductance value in µH, R = decimal point, if no R is present then third character = number of zeros. - “-R” suffix = RoHS compliant Discontinued, Effective September 15, 2016 or until inventory is depleted. Recommended replacement MPI25-V1 Discontinued, Effective September 15, 2016 or until inventory is depleted. Recommended replacement MPI25-V2

www.eaton.com/elx MPI2520 High Current, Low Profile Miniature P ower Inductors Technical Data 10199 Effective January 2014 Dimensions - mm Packaging information - mm Discontinued, Effective September 15, 2016 or until inventory is depleted. Recommended replacement MPI25-V2

www.eaton.com/elx Technical Data 10199 Effective January 2014 MPI2520 High Current, Low Profile Miniature Power Inductors T emperature rise vs. total loss Core loss Temperature Rise (°C) Total Loss (W) MPI2520R0 MPI2520R1 Discontinued, Effective September 15, 2016 or until inventory is depleted. Recommended replacement MPI25-V2

www.eaton.com/elx MPI2520 High Current, Low Profile Miniature Power Inductors Technical Data 10199 Effective January 2014 Inductance characteristics 0.00 0.10 0.20 0.30 0.40 0.50 Inductnace (µH) Idc (Amps) MPI2520R0-R47-R 0.00 0.40 0.80 1.20 1.60 2.00 00 .5 11 .5 22 .5 33 .5 4 Inductnace (µH) Idc (Amps) MPI2520R0-1R0-R MPI2520R0-1R5-R 0.00 0.80 1.60 2.40 3.20 4.00 4.80 5.60 00 .5 11 .5 22 .5 3 Inductnace (µH) Idc (Amps) MPI2520R0-2R2-R MPI2520R0-3R3-R MPI2520R0-4R7-R 0.00 0.10 0.20 0.30 0.40 0.50 01234567 Inductnace (µH) Idc (Amps) MPI2520R1-R47-R Discontinued, Effective September 15, 2016 or until inventory is depleted. Recommended replacement MPI25-V2

www.eaton.com/elx Technical Data 10199 Effective January 2014 MPI2520 High Current, Low Profile Miniature Power Inductors Inductance characteristics 0.00 0.40 0.80 1.20 1.60 Inductnace (µH) Idc (Amps) MPI2520R1-1R0-R MPI2520R1-1R5-R 0.00 0.80 1.60 2.40 3.20 4.00 4.80 00 .5 11 .5 22 .5 3 Inductnace (µH) Idc (Amps) MPI2520R1-2R2-R MPI2520R1-3R3-R MPI2520R1-4R7-R 0.00 1.00 2.00 3.00 4.00 5.00 6.00 7.00 8.00 9.00 10.00 11.00 00 .4 0.81 .2 1. Inductnace (µH) Idc (Amps) MPI2520R1-5R6-R MPI2520R1-6R8-R MPI2520R1-100-R Discontinued, Effective September 15, 2016 or until inventory is depleted. Recommended replacement MPI25-V2

www.eaton.com/elx Eaton is a registered trademark. All other trademarks are property of their respective owners. Eaton Electronics Division

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Cleveland, OH 44122 United States www.eaton.com/elx © 2014 Eaton All Rights Reserved Publication No. 10199 — BU-SB131200 January 2014 MPI2520 High Current, Low Profile Miniature Power Inductors Technical Data 10199 Effective January 2014 Temperature t tP ts TC -5°C Time 25°C to Peak Time 25°C Tsmin Tsmax TL TP Preheat A Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Table 1 - Standard SnPb Solder (Tc) Volume Volume Packagem m3 mm3 Thickness <350 > _350 <2.5mm 235°C 220°C Table 2 - Lead (Pb) Free Solder (Tc) Volume Volume Volume Packagem m3 mm3 mm3 Thickness <350 350 - 2000 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C Reference JDEC J-STD-020D Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak • Temperature min.( Tsmin) 100°C 150°C

  • Temperature max. (Tsmax) 150°C 200°C
  • Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate Tsmax to Tp 3°C/ Second Max. 3°C/ Second Max. Liquidous temperature (TL) 183°C 217°C Time at liquidous (tL) 60-150 Seconds 60-150 Seconds Peak package body temperature (TP)* Table 1T able 2 Time (tp) within 5 °C of the specified classification temperature (T c) 20 Seconds 30 Seconds** Average ramp-down rate (Tp to Tsmax) 6°C/ Second Max. 6°C/ Second Max. Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (T p) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Solder reflow profile Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company . Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Discontinued, Effective September 15, 2016 or until inventory is depleted. Recommended replacement MPI25-V2