MPC100 BURR-BROWN | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 15

Technical content

©1991 Burr-Brown Corporation PDS-1133F Printed in U.S.A. March, 1995 MPC100 Wide Bandwidth 4 x 1 VIDEO MULTIPLEXER The MPC100 consists of four identical monolithic inte- grated open-loop buffer amplifiers, which are con- nected internally at the output. The unidirectional trans- mission path consists of bipolar complementary buffers, which offer extremely high output-to-input isolation. The MPC100 multiplexer enables one of the four input channels to connect to the output. The output of the multiplexer is in a high-impedance state when no chan- nel is selected. When one channel is selected with a digital “1” at the corresponding SEL-input, the compo- nent acts as a buffer with high input impedance and low output impedance. The wide bandwidth of over 250MHz at 1.4Vp-p signal level, high linearity and low distortion, and low input voltage noise of 4nV/√Hz make this crosspoint switch suitable for RF and video applications. All performance is specified with ±5V supply voltage, which reduces power consumption in comparison with ±15V designs. The multiplexer is available in space- saving SO-14 and DIP packages. Both are designed and specified for operation over the industrial tem- perature range (–40°C to +85°C.)

FEATURES

l BANDWIDTH: 250MHz (1.4Vp-p) l LOW INTERCHANNEL CROSSTALK: ≤60dB (30MHz, DIP); ≤70dB (30MHz, SO) l LOW SWITCHING TRANSIENTS: +2.5/–1.2mV l LOW DIFFERENTIAL GAIN/PHASE ERRORS: 0.05%, 0.01° l LOW QUIESCENT CURRENT: One Channel Selected: ±4.6mA No Channel Selected: ±230µA

APPLICATIONS

l VIDEO ROUTING AND MULTIPLEXING (CROSSPOINTS) l RADAR SYSTEMS l DATA ACQUISITION l INFORMATION TERMINALS l SATELLITE OR RADIO LINK IF ROUTING

DESCRIPTION

The MPC100 is a very wide bandwidth 4-to-1 channel video signal multiplexer which can be used in a wide variety of applications. MPC100 is designed for wide-bandwidth systems, including high-definition television and broadcast equipment. Although it is primarily used to route video signals, the harmonic and dynamic attributes of the MPC100 make it appropriate for other analog signal routing applications such as radar, communica- tions, computer graphics, and data acquisition sys- tems. MPC100 MPC100 International Airport Industrial Park • Mailing Address: PO Box 11400, Tucson, AZ 85734 • Street Address: 6730 S. Tucson Blvd., Tucson, AZ 85706 • Tel: (520) 746-1111 • Twx: 910-952-1111 Internet: http://www.burr-brown.com/ • FAXLine: (800) 548-6133 (US/Canada Only) • Cable: BBRCORP • Telex: 066-6491 • FAX: (520) 889-1510 • Immediate Product Info: (800) 548-6132 SEL 1 SEL 2 SEL 3 SEL 4 VOUT 0 0 0 0 HI-Z

1000 I N 1

0100 I N 2

0010 I N 3

0001 I N 4

At VCC = ±5V, RL = 10kΩ , RSOURCE = 50Ω , and TA = +25°C, unless otherwise noted. The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant any BURR-BROWN product for use in life support devices and/or systems. MPC100AP, AU PARAMETER CONDITIONS MIN TYP MAX UNITS DC CHARACTERISTICS INPUT OFFSET VOLTAGE R IN = 0, RSOURCE = 0 Initial +10 ±30 mV vs Temperature ±30 µV/°C vs Supply (Tracking) V CC = ±4.5V to ±5.5V –40 –80 dB vs Supply (Non-tracking) V CC = +4.5V to +5.5V –50 dB vs Supply (Non-tracking) V CC = –4.5V to –5.5V –50 dB Initial Matching Between the Four Channels ±3m V INPUT BIAS CURRENT Initial +4 ±10 µA vs Temperature 20 nA/ °C vs Supply (Tracking) V CC = ±4.5V to ±5.5V ±380 nA/V vs Supply (Non-tracking) V CC = +4.5V to +5.5V +1.0 µA/V vs Supply (Non-tracking) V CC = –4.5V to –5.5V –11.0 µA/V INPUT IMPEDANCE Resistance Channel On 0.88 M Ω Capacitance Channel On 1.0 pF Capacitance Channel Off 1.0 pF INPUT NOISE Voltage Noise Density f B = 20kHz to 10MHz 4.0 nV/ √Hz Signal-to-Noise Ratio S/N = 0.7/V N • √5MHz 98 dB INPUT VOLTAGE RANGE Gain Error ≤ 10% ±4.2 V TRANSFER CHARACTERISTICS Voltage Gain R L = 1kΩ , VIN = ±2V 0.982 V/V R L = 10kΩ , VIN = ±2.8V 0.98 0.992 V/V CHANNEL SELECTION INPUTS Logic 1 Voltage +2.0 V CC V Logic 0 Voltage 0 +0.8 V Logic 1 Current V SEL = 5.0V 100 150 µA Logic 0 Current V SEL = 0.8V 0.002 5 µA SWITCHING CHARACTERISTICS VI = –0.3V to +0.7V, f = 5MHz SEL to Channel ON Time 90% Point of V O = 1Vp-p 0.25 µs SEL to Channel OFF Time 10% Point of V O = 1Vp-p 0.25 µs Switching Transient, Positive Measured While Switching +2.5 mV Switching Transient, Negative Between Two Grounded Channels –1.2 mV OUTPUT Voltage V IN = ±3V, RL = 5kΩ± 2.8 ±2.98 V Resistance One Channel Selected 11 Ω Resistance No Channel Selected 900 M Ω Capacitance No Channel Selected 1.5 pF POWER SUPPLY Rated Voltage ±5V Derated Performance ±4.5 ±5.5 V Quiescent Current One Channel Selected ±4.6 ±5m A No Channel Selected ±230 ±350 µA TEMPERATURE RANGE Operating, AP, AU –40 +85 °C Storage, AP, AU –40 +125 °C Thermal Resistance, θJA AP, AU 90 °C/W

At VCC = ±5V, RL = 10kΩ , RSOURCE = 50Ω , and TA = +25°C, unless otherwise noted. MPC100AP, AU PARAMETER CONDITIONS MIN TYP MAX UNITS AC CHARACTERISTICS FREQUENCY DOMAIN LARGE SIGNAL BANDWIDTH (–3dB) VO = 5.0Vp-p, COUT = 1pF 70 MHz VO = 2.8Vp-p, COUT = 1pF 140 MHz VO = 1.4Vp-p, COUT = 1pF 250 MHz SMALL SIGNAL BANDWIDTH VO = 0.2Vp-p, COUT = 1pF 450 MHz GROUP DELAY TIME 450 ps DIFFERENTIAL GAIN f = 4.43MHz, VIN = 0.3Vp-p VDC = 0 to 0.7V 0.05 % VDC = 0 to 1.4V 0.06 % DIFFERENTIAL PHASE f = 4.43MHz, VIN = 0.3Vp-p VDC = 0 to 0.7V 0.01 Degrees VDC = 0 to 1.4V 0.02 Degrees GAIN FLATNESS PEAKING V O = 0.2Vp-p, DC to 30MHz 0.04 dB VO = 0.2Vp-p, DC to 100MHz 0.05 dB HARMONIC DISTORTION f = 30MHz, VO = 1.4Vp-p, RL = 1kΩ Second Harmonic –53 dBc Third Harmonic –67 dBc CROSSTALK VI = 1.4Vp-p, Figures 4 and 8 MPC100AP All Hostile f = 5MHz, –82 dB f = 30MHz, –60 dB Off Isolation f = 5MHz, –70 dB f = 30MHz, –71 dB MPC100AU All Hostile f = 5MHz, –78 dB f = 30MHz, –70 dB Off Isolation f = 5MHz, –75 dB f = 30MHz –76 dB TIME DOMAIN RISE TIME VO = 1.4Vp-p, Step 10% to 90% C OUT = 1pF, ROUT = 22Ω 3.3 ns SLEW RATE VO = 2Vp-p C OUT = 1pF 650 V/ µs C OUT = 22pF 460 V/ µs C OUT = 47pF 320 V/ µs

IN1-IN4 Four analog input channels GND Analog input shielding grounds, connect to system ground SEL 1 - SEL4 Channel selection inputs VOUT Analog output; tracks selected channel –VCC Negative supply voltage; typical –5VDC +VCC Positive supply voltage; typical +5VDC FUNCTIONAL DESCRIPTION Top View DIP/SO-14 DB1 DB2 DB3 DB4 IN1 GND IN2 GND IN3 GND IN4 SEL 1 SEL 2 –VCC VOUT +V CC SEL 3 SEL 4 MPC100 ABSOLUTE MAXIMUM RATINGS NOTE: (1) Inputs are internally diode-clamped to ±VCC . ELECTROSTATIC DISCHARGE SENSITIVITY Electrostatic discharge can cause damage ranging from per- formance degradation to complete device failure. Burr-Brown Corporation recommends that all integrated circuits be handled and stored using appropriate ESD protection methods. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet published speci- fications. PACKAGE/ORDERING INFORMATION PACKAGE TEMPERATURE DRAWING PRODUCT RANGE PACKAGE NUMBER (1) MPC100AP –40 °C to +85°C 14-Pin Plastic DIP 010 MPC100AU –40 °C to +85°C SO-14 Surface Mount 235 NOTE: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix C of Burr-Brown IC Data Book.

TYPICAL PERFORMANCE CURVES At VCC = ±5V, RLOAD = 10kΩ , RSOURCE = 50Ω , and TA = +25°C, unless otherwise noted. –40 –20 0 20 60 80 100 Temperature (°C) Voltage (mV) OFFSET VOLTAGE vs TEMPERATURE 40 –40 –20 0 20 60 80 100 Temperature (°C) Bias Current (µA) INPUT BIAS CURRENT vs TEMPERATURE 10k 100k 1M 10M 100M 1G Frequency (Hz) 100 1.0M 100k 10k Input Impedance (Ω ) INPUT IMPEDANCE vs FREQUENCY 10k 100k 1M 10M 100M 1G Frequency (Hz) 100 Output Impedance (Ω ) OUTPUT IMPEDANCE vs FREQUENCY –40 –20 0 20 60 80 100 Temperature (°C) Supply Current (mA) TOTAL QUIESCENT CURRENT vs TEMPERATURE One Channel Selected –40 –20 0 20 60 80 100 Temperature (°C) 300 250 200 150 100 Supply Current (µA) TOTAL QUIESCENT CURRENT vs TEMPERATURE No Channel Selected

TYPICAL PERFORMANCE CURVES (CONT) At VCC = ±5V, RLOAD = 10kΩ , RSOURCE = 50Ω , and TA = +25°C, unless otherwise noted. +0.7V SWITCHING ENVELOPE (Video Signal) Time (µs) Output Voltage (V) –0.3V SMALL SIGNAL PULSE RESPONSE Time (ns) Output Voltage (40mV/Div) C OUT = 1pF, tRISE = tFALL = 2ns (Generator) VI = 0.2Vp-p 0 — Input Voltage (V) Output Voltage (V) TRANSFER FUNCTION – 5 – 4 – 3 – 2 – 1 012345 100 1k 100k 1M 10M 100M Frequency (Hz) 0.1 100 Voltage Noise (nV/ Hz) INPUT VOLTAGE NOISE SPECTRAL DENSITY 10k 0 20 40 60 80 100 120 140 160 180 200 Time (ns) Output Voltage (mV) SWITCHING TRANSIENTS (Channel To Channel) Without bandwidth limiting lowpass filter. SEL2 SEL1 0 20 40 60 80 100 120 140 160 180 200 Time (ns) Output Voltage (mV) SWITCHING TRANSIENTS (Channel To Channel) SEL2 SEL1 36MHz Low pass filter acc. Eureka Rec. EU95-PG03 in the signal path.

TYPICAL PERFORMANCE CURVES (CONT) At VCC = ±5VDC, RLOAD = 10kΩ , RSOURCE = 50Ω , and TA = +25°C, unless otherwise noted. Time (ns) C OUT = 1pF, tRISE = tFALL = 5ns (Generator) VI = 5Vp-p LARGE SIGNAL PULSE RESPONSE Output Voltage (1V/Div) 0 — SMALL SIGNAL PULSE RESPONSE Time (ns) Output Voltage (40mV/Div) C OUT = 47pF, tRISE = tFALL = 2ns (Generator) VI = 0.2Vp-p 0 — Time (ns) C OUT = 47pF, tRISE = tFALL = 5ns (Generator) VI = 5Vp-p LARGE SIGNAL PULSE RESPONSE Output Voltage (1V/Div) 0 — –10 –15 –20 –25 Frequency (Hz) Gain (dB) 1M 10M 100M 1G dB BANDWIDTH vs C OUT WITH RECOMMENDED R OUT 1pF 10pF 22pF 33pF 47pF R OUT 1p 0 Ω 500MHz f–3dBC OUT 10p 22 Ω 340MHz 22p 33p 47p 15Ω 12Ω 10Ω 250MHz 215MHz 130MHz GAIN FLATNESS 0.5 0.4 0.3 0.2 0.1 –0.1 –0.2 –0.3 –0.4 Frequency (Hz) Output (dB) 1M 10M 100M 1G –0.5 C OUT = 22pF, ROUT = 15Ω R IN = 150Ω , RO1 = 1kΩ 300k 0.2Vp-p GROUP DELAY TIME vs FREQUENCY Frequency (Hz) 1M 10M 100M 500M Delay Time (ns) 2.5 1.5 0.5 –0.5 –1.5 –2.5 DUT R I 150Ω R OUT 50Ω VI Out Group Delay Time VOUT = 300mV PO

TYPICAL PERFORMANCE CURVES (CONT) At VCC = ±5V, RLOAD = 10kΩ , RSOURCE = 50Ω , and TA = +25°C, unless otherwise noted. 30MHz HARMONIC DISTORTION 10dB/Div Harmonic Distortion (dB) Frequency (Hz) VOUT = 2.8Vp-p, RL = 1kΩ , COUT = 1pF 30MHz HARMONIC DISTORTION 10dB/Div Harmonic Distortion (dB) Frequency (Hz) VOUT = 2.8Vp-p, RL = 10kΩ , COUT = 1pF dB –10 –15 –20 –25 Output (dBm) BANDWIDTH vs OUTPUT VOLTAGE 1.4Vp-p 0.6Vp-p 0.2Vp-p 5Vp-p 2.8Vp-p R IN = 150Ω C OUT = 1pF, ROUT = 0Ω Frequency (Hz) 1M 10M 100M 1G300k dB –10 –15 –20 –25 Output (dBm) BANDWIDTH vs R LOAD Frequency (Hz) 300k 10M 100M 1G R L = 500Ω = 1kΩ = 10kΩ C OUT = 22pF, ROUT = 15Ω, VO = 2.8Vp-p dB –10 –15 –20 –25 Output (dBm) BANDWIDTH MATCHING (DB1...DB4) C OUT = 22pF, ROUT = 15Ω Frequency (Hz) 1M 10M 100M 1G 2.8Vp-p 300k

are unlikely to cause permanent damage. limited to 10mA or less whenever possible. porates on-chip ESD protection diodes as shown in Figure 1. internally connected to all pins. FIGURE 1. Internal ESD Protection. MPC100s together to form switch multi-channel matrices. lection monitoring for the user, and lowers transient peaks. the overall system bandwidth. time, but it interferes only minimally with the input signals.

The transient peaks remain less than +2.5mV and –1.2mV. the output must be clamped during the switching dead time. less overshooting or DC settling transients. following tips are offered as suggestions, not as absolutes. high-speed components when they are used incorrectly.

  • Bypass power supplies very close to the device pins. Use tantalum chip capacitors (approximately 2.2µF), a parallel 470pF ceramic chip capacitor may be added if desired. Surface-mount types are recommended due to their low lead inductance.
  • PC board traces for signal and power lines should be wide to reduce impedance or inductance.
  • Make short and low inductance traces. The entire physical circuit layout should be as small as possible.
  • Use a low-impedance ground plane on the component side to ensure that low-impedance ground is available through- out the layout. Grounded traces between the input traces are essential to achieve high interchannel crosstalk rejec- tion. Refer to the suggested layout shown in Figure 6.
  • Do not extend the ground plane under high-impedance nodes sensitive to stray capacitances, such as the buffer’s input terminals.
  • Sockets are not recommended because they add signifi- cant inductance and parasitic capacitance. If sockets are required, use zero-profile solderless sockets.
  • Use low-inductance and surface-mounted components to achieve the best AC-performance.
  • A resistor (100Ω to 200Ω ) in series with the input of the buffers may help to reduce peaking. Place the resistor as close as possible to the pin.
  • Plug-in prototype boards and wire-wrap boards will not function well. A clean layout using RF techniques is essential. IN2 +V CC = +5V VOUT (3) DB2 (11) –VCC = –5V (10) (12) (13) SEL 2 DB1 (14) (1) (2) IN GND SEL 1 DB3 (9) (5) (6) IN3 GND SEL 3 (4) GND DB4 (8) (7) IN4 SEL 1 NOTE: DB = Diamond Buffer

FIGURE 2. Simplified Circuit Diagram.

FIGURE 6. Video Distribution Field.

FIGURE 7. Digital Gain Control. FIGURE 8. High Speed Data Acquisition System.

3 Out

12 Bit

FIGURE 9. Distribution Field for High Resolution Graphic Cards, Cameras.