MP7523 EXAR | Alldatasheet

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Technical content

Rev. 3.00 1996 EXAR Corporation, 48720 Kato Road, Fremont, CA 94538 (510) 668-7000 (510) 668-7010

FEATURES

  • Full Four-Quadrant Multiplying
  • Low Feedthrough: 1/2 LSB @ 200 kHz
  • Fast Settling: 100 ns (typ.)
  • Low Power Dissipation
  • Low Cost
  • 5 V/15 V Operation
  • Buffered Version: MP7524/XRD7524

15 V CMOS

Digital-to-Analog Converter

APPLICATIONS

  • Battery Operated Equipment
  • Low Power, Ratiometric A/D Converters
  • Digitally Controlled Gain Circuits
  • Digitally Controlled Attenuators
  • CRT Character Generation
  • Low Noise Audio Gain Control ...the analog plus companyTM January 1996-2 GENERAL DESCRIPTION The MP7523/XRD7523 is a low cost multiplying Digital-to- Analog Converter. The device uses an advanced thin-film-on- CMOS technology to provide 8-bit resolution with accuracy to 10-bits and very low power dissipation. The MP7523/XRD7523’s excellent multiplying characteris- tics and low cost allow it to be used in a wide ranging field of ap- plications such as: low noise audio gain control, CRT character generation, motor speed control, digitally controlled attenuators, etc. SIMPLIFIED BLOCK DIAGRAM R 2 to 3 Decoder MSB LSB 4R 4R 4R 4R 4R 4R 2R2R Switch Drivers & Switches

3 Segment D/A Converter with Termination to DGND

Logical “1” at Digital Input Steers Current to IOUT1 BIT 8 R = 10k BIT 1 R FB IOUT1 IOUT2 VREF VDD

Rev. 3.00

ORDERING INFORMATION

Range Part No. 1.8 1.8 1.8 1.8 –40 to +85°C –40 to +85°C –40 to +85°C –40 to +85°C INL (LSB) Gain Error (% FSR) DNL (LSB) SOP (EIAJ) XRD7523AIK-J SOP (EIAJ) XRD7523AIK-K SOIC (Jedec, 0.150”) XRD7523AID-J XRD7523AID-K SOIC (Jedec, 0.300”) MP7523JS MP7523KS 1.8 1.8 –40 to +85°C –40 to +85°C Plastic Dip MP7523JN Plastic Dip MP7523KN 1.8 1.8 –40 to +85°C –40 to +85°C SOIC (Jedec, 0.300”) SOIC (Jedec, 0.150”) PIN CONFIGURATIONS 16 pin SOIC (Jedec, 0.300”) 16 pin SOIC (Jedec, 0.150”) 16 pin SOP (EIAJ, 5.5 mm) N/C N/C BIT 8 (LSB) BIT 7 BIT 6 R FB VREF VDDGND (MSB) BIT 1 BIT 2 BIT 3 BIT 4 BIT 5 I OUT1 IOUT2 161 GND (MSB) BIT 1 BIT 2 BIT 3 BIT 4 BIT 5 N/C N/C BIT 8 (LSB) BIT 7 BIT 6 16 Pin PDIP (0.300”) R FB VREF VDD IOUT1 IOUT2 PIN OUT DEFINITIONS 1I OUT1 Current Output 1 2I OUT2 Current Output 2

3 GND Ground

4 BIT 1 Bit 1 (MSB)

5 BIT 2 Bit 2

6 BIT 3 Bit 3

7 BIT 4 Bit 4

8 BIT 5 Bit 5

PIN NO. NAME DESCRIPTION

9 BIT 6 Bit 6

10 BIT 7 Bit 7

11 BIT 8 Bit 8

12 N/C No Connection

13 N/C No Connection

15 V REF Reference Input Voltage

16 R FB Internal Feedback Resistor

PIN NO. NAME DESCRIPTION

Rev. 3.00

ELECTRICAL CHARACTERISTICS

(VDD = + 15 V, VREF = +10 V unless otherwise noted) 25°C Tmin to Tmax Parameter Symbol Min Typ Max Min Max Units Test Conditions/Comments STATIC PERFORMANCE 1 Resolution (All Grades) N 8 8 Bits Integral Non-Linearity INL LSB Best Fit Straight Line (Relative Accuracy) (Max INL – Min INL) / 2 J+ 1/2 + 1/2 K+ 1/4 + 1/4 Monotonicity Guaranteed over temp Differential Non-Linearity DNL LSB All grades monotonic over full J+ 1+ 1 temperature range. K+ 1+ 1 Gain Error GE + 1.5 + 1.8 % Using Internal R FB J Digital Inputs = VINH K Power Supply Rejection Ratio PSRR + 200 + 300 ppm/% |ΔGain/ΔVDD | ΔVDD = + 5% J Digital Inputs = VINH K Output Leakage Current (Pin 1) IOUT1 +50nA + 200nA nA Digital Inputs = V INL J K Output Leakage Current (Pin 2) IOUT2 +50nA + 200nA nA Digital Inputs = V INH J K REFERENCE INPUT Input Resistance R IN 5 20 5 20 k Ω VOUT1 = VOUT2 = 0 V DIGITAL INPUTS Logical “1” Voltage V IH 14.5 14.5 V Logical “0” Voltage V IL 0.5 0.5 V Input Leakage Current I LKG +1+ 1 µA ANALOG OUTPUTS Output Capacitance2 C OUT1 100 100 pF DAC Inputs all 1’s C OUT1 30 30 pF DAC Inputs all 0’s C OUT2 30 30 pF DAC Inputs all 1’s C OUT2 100 100 pF DAC Inputs all 0’s

Rev. 3.00 25°C NOTES: Specifications are subject to change without notice ELECTRICAL CHARACTERISTICS (CON’T) Tmin to Tmax Parameter Symbol Min Typ Max Min Max Units Test Conditions/Comments POWER SUPPLY Functional Voltage Range2 VDD 5 16 5 16 V Supply Current I DD 1.6 1.6 mA All digital inputs = 0 V or all = 15 V 1 Full Scale Range (FSR) is 10V. 2 Guaranteed but not production tested. 3 Digital input levels should not go below ground or exceed the positive supply voltage, otherwise damage may occur. 4 Specified values guarantee functionality. Refer to other parameters for accuracy. ABSOLUTE MAXIMUM RATINGS (T A = +25°C unless otherwise noted)1, 2 Digital Input Voltage to GND GND –0.5 to VDD +0.5 V Lead Temperature (Soldering, 10 seconds) +300°C. Package Power Dissipation Rating to 75°C NOTES: 1 Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation at or above this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. 2 Any input pin which can see a value outside the absolute maximum ratings should be protected by Schottky diode clamps (HP5082-2835) from input pin to the supplies. APPLICATION NOTES Refer to Section 8 in the 1995 Data Acquisition Products databook for Applications Information

Rev. 3.00

16 LEAD PLASTIC DUAL-IN-LINE

(300 MIL PDIP) D e B 1 A 1 E A L B Seating Plane SYMBOL MIN MAX MIN MAX INCHES A 0.145 0.210 3.68 5.33 A1 0.015 0.070 0.38 1.78 A2 0.115 0.195 2.92 4.95 B 0.014 0.024 0.36 0.56 B1 0.030 0.070 0.76 1.78 C 0.008 0.014 0.20 0.38 D 0.745 0.840 18.92 21.34 E 0.300 0.325 7.62 8.26 E 1 0.240 0.280 6.10 7.11 e 0.100 BSC 2.54 BSC eB 0.310 0.430 7.87 10.92 L 0.115 0.160 2.92 4.06 α 0° 15° 0° 15° MILLIMETERS α eB A 2 C

Rev. 3.00 SYMBOL MIN MAX MIN MAX A 0.053 0.069 1.35 1.75 A1 0.004 0.010 0.10 0.25 B 0.013 0.020 0.33 0.51 C 0.007 0.010 0.19 0.25 D 0.386 0.394 9.80 10.00 E 0.150 0.157 3.80 4.00 e 0.050 BSC 1.27 BSC H 0.228 0.244 5.80 6.20 L 0.016 0.050 0.40 1.27 α 0° 8° 0° 8° INCHES MILLIMETERS

16 LEAD SMALL OUTLINE

(150 MIL JEDEC SOIC) e 16 9 D E H B A L C A 1 Seating Plane α

Rev. 3.00 SYMBOL MIN MAX MIN MAX A 0.093 0.104 2.35 2.65 A1 0.004 0.012 0.10 0.30 B 0.013 0.020 0.33 0.51 C 0.009 0.013 0.23 0.32 D 0.398 0.413 10.10 10.50 E 0.291 0.299 7.40 7.60 e 0.050 BSC 1.27 BSC H 0.394 0.419 10.00 10.65 L 0.016 0.050 0.40 1.27 α 0 ° 8° 0° 8° INCHES MILLIMETERS (300 MIL JEDEC SOIC) e 16 9 D E H B A L C A 1 Seating Plane α

Rev. 3.00

16 LEAD EIAJ SMALL OUTLINE

(5.5 mm EIAJ SOP) e 16 9 D E H B A L C A 1 Seating Plane α A 2 SYMBOL MIN MAX MIN MAX A 1.80 2.40 0.071 0.095 A1 0.02 0.20 0.001 0.008 A2 1.80 2.20 0.079 0.087 B 0.30 0.50 0.012 0.020 C 0.13 0.20 0.005 0.008 D 9.9 10.5 0.390 0.414 E 5.30 5.70 0.209 0.224 e 1.27 BSC 0.050 BSC H 7.80 8.20 0.307 0.323 L 0.30 0.90 0.012 0.035 α 0° 15° 0° 15° INCHESMILLIMETERS Pin 1 Indexer

Rev. 3.00 Notes

Rev. 3.00 Notes

Rev. 3.00 Notes

Rev. 3.00 NOTICE EXAR Corporation reserves the right to make changes to the products contained in this publication in order to im- prove design, performance or reliability. EXAR Corporation assumes no responsibility for the use of any circuits de- scribed herein, conveys no license under any patent or other right, and makes no representation that the circuits are free of patent infringement. Charts and schedules contained here in are only for illustration purposes and may vary depending upon a user’s specific application. While the information in this publication has been carefully checked; no responsibility, however, is assumed for inaccuracies. EXAR Corporation does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless EXAR Corporation receives, in writing, assurances to its satisfaction that: (a) the risk of injury or damage has been minimized; (b) the user assumes all such risks; (c) potential liability of EXAR Corporation is adequately protected under the circum- stances. Copyright EXAR Corporation Datasheet December 1996 Reproduction, in part or whole, without the prior written consent of EXAR Corporation is prohibited.