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Technical content

Features

  • 2.5% maximum error over 0 °C to 85 °C
  • Ideally suited for microprocessor or microcontroller-based systems
  • Temperature compensated over -40 °C to +125 °C
  • Patented silicon shea r stress strain gauge
  • Durable thermoplastic ( PPS) surface mount package
  • Ideal for automotive and non-automotive applications Application examples
  • Pump/motor control
  • Robotics
  • Level detectors
  • Medical diagnostics
  • Pressure switching
  • Blood pressure measurement

Ordering Information

Part number Shipping Package # of Ports Pressure type Device markingNone Single Dual Gauge Differential Absolute MP3V5050VC6U Rail 98ASB17757C • • MP3V5050V MP3V5050V Small outline package MP3V5050V Case 98ASB17757C Top view Pinout Pin 1 identification: notch DNC DNC DNC DNC DNC VS GND VOUT

3 Freescale Semiconductor, Inc. Related Documentation The MP3V5050V device features and operations are described in a variety of reference manuals, user guides, and application notes. To find the most-current versions of these documents: 1. Go to the Freescale homepage at: http://www.freescale.com/ 2. In the Keyword search box at the top of the page, enter the device number MP3V5050V. 3. In the Refine Your Result pane on the left, click on the Documentation link.

Contents

1 General Description

1.1 Block diagram

Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. Figure 1. Fully integrated pressure sensor block diagram

1.2 Pinout

Figure 2. Device pinout (top view) Table 1. Pin functions 1 DNC Do not connect to external circuitry or gr ound. Pin 1 is notated by the notch in the lead.

3 GND Ground

5 DNC Do not connect to external circuitry or ground. 6 DNC Do not connect to external circuitry or ground. 7 DNC Do not connect to external circuitry or ground. 8 DNC Do not connect to external circuitry or ground.

6 Freescale Semiconductor, Inc.

2 Mechanical and Electr ical Specifications

2.1 Maximum ratings

2.2 Operating characteristics

Table 2. Maximum ratings(1) 1.Exposure beyond the specified limits may cause permanent damage or degradation to the device. Table 3. Operating characteristics (VS = 3.0 VDC, TA = 25 °C unless otherwise noted, P1 > P2) 1.Device is ratiometric within this specified excitation range. 2.Full-scale output (VFSO) is defined as the output voltage at the maximum or full-rated pressure. Linearity: Output deviation from a stra ight line relationship with pressure over the specified pressure range. and from the minimum or maximum operating temperature points, with zero differential pressure applied. or maximum rated pressure at 25 °C. TcSpan: Output deviation over the temperature range of 0 °C to 85 °C, relative to 25 °C. TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0 °C to 85 °C, relative to 25 °C.

  1. Response time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a

specified step change in pressure. 6.Warm-up time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 7.Offset stability is the product's output deviation when subjected to 1000 hours of pulsed pressure, temperature cycling with bias test. 8.Offset (VOFF) is defined as the output voltage at the minimum rated pressure.

3 On-chip Temperature Comp ensation and Calibration

Figure 3 illustrates the differential/gauge sensing chip in the basic chip carrier. microprocessor or microcontroller. Proper decoupling of the power supply is recommended. operation over 0 °C to 85 °C temperature range. The output will saturate outside of the rated pressure range. performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. where the output will be the full-scale voltage listed in Table 3. Figure 3. Cross-sectional diagram SOP (not-to-scale) Figure 4. Recommended power supply decoupling and output filtering

Figure 8. Pressure error band

10 Freescale Semiconductor, Inc.

4 Package Information

4.1 Minimum recommended footprint for surface mounted applications

mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts. Figure 9. SOP footprint

0.060 TYP 8X

0.100 TYP 8X

0.100 TYP

Freescale Semiconductor, Inc. 11

4.2 Package dimensions

This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ASB17757C.pdf. Case 98ASB17757C, small outline package DIM MIN MAX MIN MAX MILLIMETERSINCHES A 10.540.4250.415 10.79 B 10.540.4250.415 10.79 C 12.700.5200.500 13.21 D 0.960.0420.038 1.07 G 0.100 BSC 2.54 BSC H 0.002 0.010 0.05 0.25 J 0.009 0.011 0.23 0.28 K 0.061 0.071 1.55 1.80 M 0 7 0 7 N 0.444 0.448 11.28 11.38 S 0.709 0.725 18.01 18.41 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. S D G 8 PL SBM0.25 (0.010) A ST –A– –B– C M J K PIN 1 IDENTIFIER H SEATING PLANE –T– N V W V 0.245 0.255 6.22 6.48 W 0.115 0.125 2.92 3.17

12 Freescale Semiconductor, Inc.

5 Revision History

Table 4. Revision history

  • Updated format.
  • Deleted part number MP3V5050VC6T1.
  • Added vacuum pressure information to section 3.

Document Number: MP3V5050V Rev. 3.0 Information in this document is provided solely to enable system and software implementers to use Freescale products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. Freescale reserves the right to make changes without further notice to any products herein. Freescale makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including “typicals,” must be validated for each customer application by customer’s technical experts. Freescale does not convey any license under its patent rights nor the rights of others. Freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: freescale.com/salestermsandconditions. How to Reach Us: Home Page: freescale.com Web Support: freescale.com/support Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., respective owners. © 2008, 2010, 2015 Freescale Semiconductor, Inc.