MP3V5050GP

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Document overview

Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
PDF pages: 15

Technical content

Features

2.5% maximum error over 0 °C to 85 °C
Ideally suited for microproce ssor or microcontroller-based systems
Temperature compensated over -40 °C to +125 °C
Patented silicon shea r stress strain gauge
Thermoplastic (PPS) s urface mount package
Multiple porting options for design flexibility
Barbed side ports for r obust tube connection Application examples
Pump/motor control
Robotics
Level detectors
Medical diagnostics
Pressure switching
Blood pressure measurement

Ordering information

Part number Shipping Package # of Ports Pressure Type Device markingNone Single Dual Gauge Differential Absolute MP3V5050DP Tray 98ASA99255D •• MP3V5050DP MP3V5050GP Tray 98ASA99303D •• MP3V5050GP MP3V5050GC6U Rail 98ASB17757C •• MP3V5050G MP3V5050GC6T1 Reel 98ASB17757C •• MP3V5050G MP3V5050 Small outline package MP3V5050GP Case 98ASA99303D MP3V5050GC6U/6T1 Case 98ASB17757C MP3V5050DP Case 98ASA99255D Pin 1 identification, VS VOUT GND DNC DNC DNC DNC DNC Top view Pinout notch

2 © NXP B.V. 2018. All rights reserved. Related Documentation The MP3V5050 device features and operations are described in a variety of reference manuals, user guides, and application notes. To find the most-current versions of these documents: 1. Go to the MP3V 5050 product page at http://www.nxp.com/MP3V5050 2. Click on the Docu mentation tab.

1 General Description

1.1 Block diagram

Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. Figure 1. Fully integrated pressure sensor block diagram

1.2 Pinout

Figure 2. Device pinout (top view) Table 1. Pin functions 1 DNC Do not connect to external c ircuitry or ground. Pin 1 is denoted by notch.

3 GND Ground

5 DNC Do not connect to exte rnal circuitry or ground. 6 DNC Do not connect to exte rnal circuitry or ground. 7 DNC Do not connect to exte rnal circuitry or ground. 8 DNC Do not connect to exte rnal circuitry or ground.

2 Mechanical and Electrical Specifications

2.1 Maximum ratings

2.2 Operating characteristics

Table 2. Maximum ratings(1) 1.Exposure beyond the specified limits may cause permanent damage or degradation to the device. Table 3. Operating characteristics (VS = 3.0 VDC, TA = 25 °C unless otherwise noted, P1 > P2. Decoupling circuit shown in 1.1.0 kPa (kilopascal) equals 0.145 psi. 2.Device is ratiometric within this specified excitation range. 3.Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4.Full-scale Output (VFSO) is defined as the output voltage at the maximum or full-rated pressure. Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. and from the minimum or maximum operating temperature points, with zero differential pressure applied. minimum or maximum rated pressure at 25 °C. TcSpan: Output deviation over the temperature range of 0 °C to 85 °C, relative to 25 °C. TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0 °C to 85 °C, relative to 25 °C. Variation from nominal: The variation from nominal values, for offset or full-scale span, as a percent of VFSS at 25 °C. specified step change in pressure. 8.Warm-up time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 9.Offset stability is the product's output deviation when subjected to 1000 hours of pulsed pressure, temperature cycling with bias test.

3 On-chip Temperature Compensation and Calibration

reliability. Contact the factory for information regarding media compatibility in your application. outside of the specified pressure range. microprocessor or microcontroller. Proper decoupling of the power supply is recommended. Figure 3. Output versus Pressure differential Figure 4. Cross-sectional diagram SOP (not to scale) Figure 5. Recommended power supply decoupling and output filtering

4 Package Information

4.1 Pressure source 1 (P1)/Pressure source 2 (P2) side identification

pressure sensor is designed to operate with positive differential pressure applied, P1 > P2.

4.2 Minimum recommended footprint for surface mounted applications

layer to avoid bridging and shorting between solder pads. Figure 9. SOP footprint (case 98ASB17757C) Table 4. Pressure source 1 (P1)/Pressure source 2 (P2) side identification table MP3V5050DP 98ASA99255D P1 is identified as the top-side port, abo ve the leads.

0.060 TYP 8X

0.100 TYP 8X

4.3 Package dimensions

This drawing is located at http://cache.nxp.com/files/shared/doc/package_info/98ASB17757C.pdf. Case 98ASB17757C, small outline package PAGE 1 OF 2

5 Revision History

Table 5. Revision history

Replaced two occurrences of “,Äì” with “–20” and “–40” on the “Temperature in °C” axis in Figure 7.
Replaced three occurrences of “,Äì” with “-1.0”, “-2.0”, and “-3.0” on the “Pressure Error (kPa)” axis in Figure 8.
Revised “¬±1.25 (kPa” to “±1.25 (kPa)” for “Error (Max)” in Figure 8. 1.3 11/2017
Corrected device marking column for MP3V5050DP and MP3V5050GP in Ordering Information table.
Corrected package numbers for devices MP3V5050GP and MP3V5050GC6U/6T1 in Ordering Information table and in illustration block.
Updated case 98ASB17757C with current drawing. 1.2 06/2017
Revised the case numbers for MP3V5050GP and MP3V5050GC6U/6T1.
Revised the package column of the ordering information table.
Updated “Freescale” references to “NXP.” 1.1 09/2015 • Updated format.
Updated package drawings with current version.

Document Number: MP3V5050 Rev. 1.4 Information in this document is provided solely to enable system and software implementers to use NXP products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. NXP reserves the right to make changes without further notice to any products herein. NXP makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does NXP assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in NXP data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including “typicals,” must be validated for each customer application by customer’s technical experts. NXP does not convey any license under its patent rights nor the rights of others. NXP sells products pursuant to standard terms and conditions of sale, which can be found at the following address: nxp.com/salestermsandconditions. How to Reach Us: Home Page: nxp.com Web Support: nxp.com/support product or service names are the property of their respective owners. © 2008, 2009, 2015, 2017, 2018 NXP B.V. All rights reserved.

Product Information

MP3V5050GP specifications and overview.

Summary

MP3V5050, 0 to 50 kPa, Differential, and Gauge Pressure Sensor Rev. 1.4, 12/2018

Description