MP3V5004G FREESCALE | Alldatasheet

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Technical content

Features

  • Temperature Compensated over 10 ° to 60°C
  • Available in Gauge Surface Mount (SMT) or Through-Hole (DIP) Configurations
  • Durable Thermopl astic (PPS) Package Typical Applications
  • Washing Machine Water Level
  • Ideally Suited for Mi croprocessor or Microcontroller-Based Systems ORDERING INFORMATION(1) 1. MP3V5004G series pressure sensors are available with a pressure port. Three packing options are offered for the surface mount configuration. Device Type Case No. MPXV Series Order No. Packing Options Device Marking Through- Hole 482C MP3V5004GC7U Rails MP3V5004G Surface Mount 482A MP3V5004GC6U Rails MP3V5004G 482A MP3V5004GC6T1 Tape & Reel MP3V5004G

1351 MP3V5004DP Trays MP3V5004G

1368 MP3V5004GVP Trays MP3V5004G

1369 MP3V5004GP Trays MP3V5004G

PIN NUMBERS(1) 1. Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead.

1 N/C 5 N/C

2 VS 6 N/C

3 GND 7 N/C

4 VOUT 8 N/C

0 TO 3.92 kPA (0 TO 400 mm H2O) 0.6 TO 3.0 V OUTPUT SMALL OUTLINE PACKAGES MP3V5004GC7U CASE 482C-03 THROUGH-HOLE SMALL OUTLINE PACKAGES MP3V5004GVP CASE 1368-01 MP3V5004GP CASE 1369-01 MP3V5004GC6U CASE 482A-01 MP3V5004DP CASE 1351-01 SURFACE MOUNT

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Figure 1. Fully Integrated Pressure Sensor Schematic Table 1. Maximum Ratings(1)

  1. Exposure beyond the specified limits may c ause permanent damage or degradation to the device.

Table 2. Operating Characteristics (VS = 3.0 VDC, TA = 25°C unless otherwise noted, P1 > P2)

  1. Device is ratiometric within this specified excitation range.
  2. Span is defined as the algebraic difference between the output voltage at specified pressure and the output voltage at the minimum rated
  3. Offset (V off) is defined as the output voltage at the minimum rated pressure.
  4. Accuracy (error budget) consists of the following:
  • Linearity: Output deviation from a straight line relations hip with pressure over the specified pressure range.
  • Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied.
  • Pressure Hysteresis: Output deviation at any pressure within t he specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25°C.
  • Offset Stability: Output deviation, after 1000 temperature cycles, –30 to 100 °C, and 1.5 million pressure cycles, with minimum rated pressure applied.
  • TcSpan: Output deviation over the temperature range of 10 to 60 °C, relative to 25°C.
  • TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 10 to 60 °C, relative to 25°C.
  • Variation from Nominal: The variation from nominal val ues, for Offset or Full Scale Span, as a percent of VFSS, at 25°C. VOFF 0.45 0.6 0.75 V Sensitivity V/P — 0.6 5.9 — V/kPa mV/mm H2O Accuracy(4) (5) 0 to 100 mm H 2O (10 to 60°C) 100 to 400 mm H2O (10 to 60°C) 5. Auto Zero at Factory Installation: Due to the sensitivity of the MP3V5004G, external mechanical stresses and mounting position can affect the zero pressure output reading. Autozeroing is defined as storing the zero pressure output reading and subtracting this from the device's output during normal operations. Reference AN1636 for specific information. The specified accuracy assumes a maximum temperature change of ± 5°C between autozero and measurement. ±1.5 ±2.5 %VFSS %VFSS VOUT VS Sensing Element GND Thin Film Temperature Compensation and Calibration Circuitry Gain Stage #2 and Ground Reference Shift Circuitry Pins 1, 5, 6, 7, and 8 are NO CONNECTS for small outline package device.

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operate with positive differential pressure applied, P1 > P2. shorting between solder pads. Figure 5. SOP Footprint (Case 482)

0.060 TYP 8X

0.100 TYP 8X

H SEATING PLANE -T- W C M J K V DIM MIN MAX MIN MAX MILLIMETERSINCHES A 10.540.4250.415 10.79 B 10.540.4250.415 10.79 C 12.700.5200.500 13.21 D 0.960.0420.038 1.07 G 0.100 BSC 2.54 BSC H 0.002 0.010 0.05 0.25 J 0.009 0.011 0.23 0.28 K 0.061 0.071 1.55 1.80 M 0˚ 7˚ 0˚ 7˚ N 0.444 0.448 11.28 11.38 S 0.709 0.725 18.01 18.41 V 0.245 0.255 6.22 6.48 W 0.115 0.125 2.92 3.17 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT .S D 8 PL G SBM0.25 (0.010) A T -A- -B-N S CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE SURFACE MOUNT

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0.100 BSC 2.54 BSC DIM A B C D G J K M N S V W MIN 0.415 0.415 0.500 0.026 0.009 0.100 0.444 0.540 0.245 0.115 MAX 0.425 0.425 0.520 0.034 0.011 0.120 15˚ 0.448 0.560 0.255 0.125 MIN 10.54 10.54 12.70 0.66 0.23 2.54 11.28 13.72 6.22 2.92 MAX 10.79 10.79 13.21 0.864 0.28 3.05 15˚ 11.38 14.22 6.48 3.17 PIN 1 IDENTIFIER K SEATING PLANE-T- W DETAIL X S G -A- -B-N C V M J D 8 PL SBM0.25 (0.010) A ST DETAIL X NOTES: DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. MAXIMUM MOLD PROTRUSION 0.15 (0.006). ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL. CASE 482C-03 ISSUE B SMALL OUTLINE PACKAGE THROUGH-HOLE

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Freescale Semiconductor 11 MP3V5004G PACKAGE DIMENSIONS CASE 1368-01 ISSUE B SMALL OUTLINE PACKAGE SURFACE MOUNT PAGE 3 OF 3

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Freescale Semiconductor 13 MP3V5004G PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE

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