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Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 14

Technical content

Features

  • Improved accuracy at high temperature
  • Available in super small outline package
  • 1.5% maximum error over 0 °C to 85 °C
  • Ideally suited for microprocessor or microcontroller-based systems
  • Temperature compensated from -40 °C to +125 °C
  • Durable thermoplastic ( PPS) surface mount package Typical applications
  • Aviation altimeters
  • Industrial controls
  • Engine control/manifold absolute pressure (MAP)
  • Weather station and weather reporting device barometers

Ordering information

Part number Shipping Package # of Ports Pressure type Device markingNone Single Dual Gauge Differential Absolute Small Outline Package (MP3H6115A series) MP3H6115A6U Rail 98ARH99066A • • MP3H6115A MP3H6115A6T1 Tape and Reel 98ARH99066A • • MP3H6115A MP3H6115AC6T1 Tape and Reel 98ARH99089A • • MP3H6115A MP3H6115A Super small outline package MP3H6115AC6T1 Case 98ARH99089A Top view Pinout Pin 1 identification, chamfered corner. DNC DNC DNC DNC DNC VS GND VOUT MP3H6115A6U/6T1 Case 98ARH99066A

2 Freescale Semiconductor, Inc. Related Documentation The MP3H6115A device features and operations are described in a variety of reference manuals, user guides, and application notes. To find the most-current versions of these documents: 1. Go to the Freescale homepage at: http://www.freescale.com/ 2. In the Keyword search box at the top of the page, enter the device number MP3H6115A. 3. In the Refine Your Result pane on the left, click on the Documentation link.

Contents

1 General Description

1.1 Block diagram

Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. Figure 1. Integrated pressure sensor schematic

1.2 Pinout

Figure 2. Device pinout (top view) Table 1. Pin functions 1 DNC Do not connect to external circuitry or ground. Pin 1 is notated by chamfered corner.

3 GND Ground

5 DNC Do not connect to external circuitry or ground. 6 DNC Do not connect to external circuitry or ground. 7 DNC Do not connect to external circuitry or ground. 8 DNC Do not connect to external circuitry or ground. Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground.

4 Freescale Semiconductor, Inc.

2 Mechanical and Electr ical Specifications

2.1 Maximum ratings

2.2 Operating characteristics

Table 2. Maximum ratings(1) 1.Exposure beyond the specified limits may cause permanent damage or degradation to the device. 2.Maximum output current is controlled by effective impedance from VOUT to GND or VOUT to VS in the application circuit. Table 3. Operating characteristics (VS = 3.0 Vdc, TA = 25 °C unless otherwise noted, P1 > P2.) 1.Device is ratiometric within this specified excitation range. 2.Offset (Voff) is defined as the output voltage at the minimum rated pressure. 3.Full-scale output (VFSO) is defined as the output voltage at the maximum or full-rated pressure. specified step change in pressure. 6.Warm-up time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 7.Offset stability is the product's output deviation when subjected to 1000 cycles of pulsed pressure, temperature cycling with bias test.

3 On-chip Temperature Comp ensation and Calibration

Figure 3 illustrates the absolute sensing chip in the basic super small outline chip carrier (case 98ARH99066A). Figure 4 shows a typical application circuit (output source current operation). operation over 0 to 85 °C temperature range. The output will saturate outside of the rated pressure range. performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. Figure 3. Cross-sectional diagram (not to scale) Figure 4. Recommended power supply decoupling and output filtering

51 K47 pF

4 Package Information

4.1 Minimum recommended footprint for surface mounted applications

mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts. Figure 9. SSOP footprint

0.027 TYP 8X

0.053 TYP 8X

8 Freescale Semiconductor, Inc.

4.2 Package Dimensions

This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ARH99066A.pdf. Case 98ARH99066A, small outline package, surface mount

Freescale Semiconductor, Inc. 9 Case 98ARH99066A, small outline package, surface mount

10 Freescale Semiconductor, Inc. Case 98ARH99066A, small outline package, surface mount

Freescale Semiconductor, Inc. 11 This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ARH99089A.pdf. Case 98ARH99089A, small outline package, surface mount

12 Freescale Semiconductor, Inc. Case 98ARH99089A, small outline package, surface mount

5 Revision History

Table 4. Revision history 5.1 05/2012 • Updated Package Drawing 98ARH99066A was Rev. F, updated to Rev. H. 6 02/2014 • Removed non-ported part numbers, MP3H6115A6U and MP3H6115A6T1 and any references to the device. Removed package outline. Updated Package Drawing 98ARH99089A was Rev. D, updated to Rev. G. 6.1 06/2015 • Added non-ported option back into document.

  • Updated format.

Document Number: MP3H6115A Rev. 6.1 Information in this document is provided solely to enable system and software implementers to use Freescale products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. Freescale reserves the right to make changes without further notice to any products herein. Freescale makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including “typicals,” must be validated for each customer application by customer’s technical experts. Freescale does not convey any license under its patent rights nor the rights of others. Freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: freescale.com/salestermsandconditions. How to Reach Us: Home Page: freescale.com Web Support: freescale.com/support Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., respective owners. © 2006-2015 Freescale Semiconductor, Inc.