MAX3386E TI | Alldatasheet

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C1− C1+ TOP VIEW DOUT2 RIN1 DIN2 DIN1 C2−

10 ROUT1ROUT2

www.ti.com SLLS659B –MAY 2006–REVISED MARCH 2011 RS-232TRANSCEIVER WITHSPLITSUPPLYPINFORLOGICSIDE Check forSamples: MAX3386E 1FEATURES

  • VL Pin forCompatibilityWith Mixed-Voltage Systems Down to2.5V on Logic Side
  • Enhanced ESD Protectionon RIN Inputsand DOUT Outputs – ±15-kV Human-Body Model – ±15-kV IEC 61000-4-2,Air-GapDischarge – ±8-kV IEC 61000-4-2,ContactDischarge
  • Low 300-μA Supply Current
  • Specified250-kbps Data Rate
  • 1-μA Low-Power Shutdown
  • Meets EIA/TIA-232SpecificationsDown to3 V

APPLICATIONS

  • Hand-Held Equipment
  • PDAs
  • CellPhones
  • Battery-PoweredEquipment
  • Data Cables DESCRIPTION/ORDERING INFORMATION The MAX3386E isa three-driverand two-receiverRS-232 interfacedevice,withsplitsupplypinsformixed-signal operations.AllRS-232 inputsand outputsare protectedto±15 kV usingtheIEC 61000-4-2Air-GapDischarge method,±8 kV usingtheIEC 61000-4-2ContactDischargemethod,and ±15 kV usingtheHuman-Body Model. The chargepump requiresonlyfoursmall0.1-μF capacitorsforoperationfroma 3.3-Vsupply.The MAX3386E is capableofrunningatdataratesup to250 kbps,whilemaintainingRS-232-compliantoutputlevels. The MAX3386E has a uniqueVL pinthatallowsoperationinmixed-logicvoltagesystems.Both driverin(DIN) and receiverout(ROUT) logiclevelsarepinprogrammablethroughtheVL pin.The MAX3386E isavailableina space-savingthinshrinksmall-outlinepackage (TSSOP).

ORDERING INFORMATION

TA PACKAGE (1)(2) ORDERABLE PART NUMBER TOP-SIDE MARKING TSSOP – PW MAX3386ECPWR MP386EC 0°C to70°C SOIC – DW MAX3386ECDW MAX3386EC TSSOP – PW MAX3386EIPWR MP386EI –40°C to85°C SOIC – DW MAX3386EIDW MAX3386EI (1) Package drawings,standardpackingquantities,thermaldata,symbolization,and PCB designguidelinesareavailableat www.ti.com/sc/package. (2) Forthemost currentpackage and orderinginformation,see thePackage OptionAddendum attheend ofthisdocument,orsee theTI websiteatwww.ti.com. Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsofTexas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 2006–2011,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.

SLLS659B –MAY 2006–REVISED MARCH 2011 www.ti.com Table1.TRUTH TABLE (SHUTDOWN FUNCTION) DRIVERPWRDWN RECEIVER OUTPUTS CHARGE PUMPOUTPUTS L High-Z High-Z Inactive H Active Active Active FUNCTIONAL BLOCK DIAGRAM TERMINAL FUNCTIONS TERMINAL

DESCRIPTION

NAME NO. C1+ 1 Positiveterminalofthevoltage-doublercharge-pumpcapacitor V+ 2 5.5-Vsupplygeneratedby thechargepump C1 – 3 Negativeterminalofthevoltage-doublercharge-pumpcapacitor C2+ 4 Positiveterminaloftheinvertingcharge-pumpcapacitor C2 – 5 Negativeterminaloftheinvertingcharge-pumpcapacitor V– 6 –5.5-Vsupplygeneratedby thechargepump DIN1 7 DIN2 8 Driverinputs DIN3 9 ROUT2 10 Receiveroutputs.Swing between 0 and VL.ROUT1 11 VL 12 Logic-levelsupply.AllCMOS inputsand outputsarereferencedtothissupply. RIN2 13 RS-232 receiverinputsRIN1 14 DOUT3 15 DOUT2 16 RS-232 driveroutputs DOUT1 17 GND 18 Ground

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www.ti.com SLLS659B –MAY 2006–REVISED MARCH 2011 TERMINAL FUNCTIONS (continued) TERMINAL NAME NO. VCC 19 3-V to5.5-Vsupplyvoltage Powerdown input PWRDWN 20 L = Powerdown H = Normal operation AbsoluteMaximum Ratings(1) overoperatingfree-airtemperaturerange(unlessotherwisenoted) MIN MAX UNIT VCC toGND –0.3 6 V VL toGND –0.3 VCC + 0.3 V V+ toGND –0.3 7 V V– toGND 0.3 –7 V V+ + |V–|(2) 13 V DIN,PWRDWN toGND –0.3 6 VI Inputvoltage V RIN toGND ±25 DOUT toGND ±13.2 VO Outputvoltage V ROUT –0.3 VL + 0.3 Short-circuitdurationDOUT toGND Continuous TA = 70°C, 20-pinTSSOPContinuouspower dissipation 559 mW(derate7 mW/ °C above 70°C) TJ Junctiontemperature 150 °C Tstg Storagetemperaturerange –65 150 °C Lead temperature(soldering,10 s) 300 °C (1) Stressesbeyond thoselistedunder“absolutemaximum ratings” may cause permanentdamage tothedevice.These arestressratings only,and functionaloperationofthedeviceattheseorany otherconditionsbeyond thoseindicatedintheoperationalsectionsofthe specificationsisnotimplied.Exposuretoabsolutemaximum ratingconditionsforextendedperiodsmay affectdevicereliability. (2) V+ and V– can have maximum magnitudesof7 V,buttheirabsolutedifferencecannotexceed 13 V. Recommended OperatingConditions MIN MAX UNIT VCC Supplyvoltage 3 5.5 V VL Supplyvoltage 2.25 VCC V VL = 3 V or5.5V 0.8 Inputlogicthresholdlow DIN,PWRDWN V VL = 2.3V 0.6 VL = 5.5V 2.4 Inputlogicthresholdhigh DIN,PWRDWN VL = 3 V 2.0 V VL = 2.7V 1.4 MAX3386ECPWR 0 70 Operatingtemperature °C MAX3386EIPWR –40 85 Receiverinputvoltage –25 25 V ElectricalCharacteristics overoperatingfree-airtemperaturerange,VCC = VL = 3 V to5.5V,C1 –C4 = 0.1μF (testedat3.3V ± 10%),C1 = 0.047μF, C2 –C4 = 0.33μF (testedat5 V ± 10%) (unlessotherwisenoted) PARAMETER TEST CONDITIONS MIN TYP (1) MAX UNIT DC Characteristics(VCC = 3.3V or 5 V,TA = 25°C) Powerdown supplycurrent PWRDWN = GND, AllinputsatVCC orGND 1 10 μA (1) TypicalvaluesareatVCC = VL = 3.3V,TA = 25°C. Copyright© 2006–2011,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLink(s):MAX3386E

SLLS659B –MAY 2006–REVISED MARCH 2011 www.ti.com ElectricalCharacteristics(continued) overoperatingfree-airtemperaturerange,VCC = VL = 3 V to5.5V,C1 –C4 = 0.1μF (testedat3.3V ± 10%),C1 = 0.047μF, C2 –C4 = 0.33μF (testedat5 V ± 10%) (unlessotherwisenoted) PARAMETER TEST CONDITIONS MIN TYP (1) MAX UNIT Supplycurrent PWRDWN = VCC ,No load 0.3 1 mA ESD Protection PARAMETER TEST CONDITIONS TYP UNIT Human-Body Model ±15 RIN,DOUT IEC 61000-4-2Air-GapDischarge ±15 kV IEC 61000-4-2ContactDischarge ±8

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www.ti.com SLLS659B –MAY 2006–REVISED MARCH 2011 RECEIVER SECTION ElectricalCharacteristics overoperatingfree-airtemperaturerange,VCC = VL = 3 V to5.5V,C1 –C4 = 0.1μF (testedat3.3V ± 10%),C1 = 0.047μF, C2 –C4 = 0.33μF (testedat5 V ± 10%),TA = TMIN toTMAX (unlessotherwisenoted) PARAMETER TEST CONDITIONS MIN TYP (1) MAX UNIT Ioff Outputleakagecurrent ROUT, receiversdisabled ±0.05 ±10 μA VOL Outputvoltagelow IOUT = 1.6mA 0.4 V VOH Outputvoltagehigh IOUT = –1 mA VL – 0.6 VL – 0.1 V VL = 5 V 0.8 1.2 VIT– Inputthresholdlow TA = 25°C V VL = 3.3V 0.6 1.5 VL = 5 V 1.8 2.4 VIT+ Inputthresholdhigh TA = 25°C V VL = 3.3V 1.5 2.4 Vhys Inputhysteresis 0.5 V Inputresistance TA = 25°C 3 5 7 kΩ (1) TypicalvaluesareatVCC = VL = 3.3V,TA = 25°C SwitchingCharacteristics overoperatingfree-airtemperaturerange,VCC = VL = 3 V to5.5V,C1 –C4 = 0.1μF (testedat3.3V ± 10%),C1 = 0.047μF, C2 –C4 = 0.33μF (testedat5 V ± 10%),TA = TMIN toTMAX (unlessotherwisenoted) PARAMETER TEST CONDITIONS TYP (1) UNIT tPHL 0.15 Receiverpropagationdelay Receiverinputtoreceiveroutput,C L = 150 pF μs tPLH 0.15 tPHL – tPLH Receiverskew 50 ns ten Receiveroutputenabletime From PWRDWN 200 ns tdis Receiveroutputdisabletime From PWRDWN 200 ns (1) TypicalvaluesareatVCC = VL = 3.3V,TA = 25°C. Copyright© 2006–2011,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLink(s):MAX3386E

SLLS659B –MAY 2006–REVISED MARCH 2011 www.ti.com DRIVER SECTION ElectricalCharacteristics overoperatingfree-airtemperaturerange,VCC = VL = 3 V to5.5V,C1 –C4 = 0.1μF (testedat3.3V ± 10%),C1 = 0.047μF, C2 –C4 = 0.33μF (testedat5 V ± 10%),TA = TMIN toTMAX (unlessotherwisenoted) PARAMETER TEST CONDITIONS MIN TYP (1) MAX UNIT VOH Outputvoltageswing Alldriveroutputsloadedwith3 kΩ toground ±5 ±5.4 V ro Outputresistance VCC = V+ = V– = 0,Driveroutput= ±2 V 300 10M Ω IOS Outputshort-circuitcurrent VT_OUT = 0 ±60 mA VT_OUT = ±12 V,Driverdisabled,IOZ Outputleakagecurrent ±25 μAVCC = 0 or3 V to5.5V Driverinputhysteresis 0.5 V Inputleakagecurrent DIN,PWRDWN ±0.01 ±1 μA (1) TypicalvaluesareatVCC = VL = 3.3V,TA = 25°C Timing Requirements overoperatingfree-airtemperaturerange,VCC = VL = 3 V to5.5V,C1 –C4 = 0.1μF (testedat3.3V ± 10%),C1 = 0.047μF, C2 –C4 = 0.33μF (testedat5 V ± 10%),TA = TMIN toTMAX (unlessotherwisenoted) PARAMETER MIN TYP (1) MAX UNIT Maximum datarate R L = 3 kΩ,C L = 1000 pF,One driverswitching 250 kbps Time-to-exitpowerdown |VT_OUT |> 3.7V 100 μs |tPHL – tPLH | Driverskew (2) 100 ns VCC = 3.3V, C L = 150 pF to1000 pF 6 30 TA = 25°C,Transition-region R L = 3 kΩ to7 kΩ, V/μsslewrate C L = 150 pF to2500 pF 4 30Measured from3 V to–3 V or–3 V to3 V (1) TypicalvaluesareatVCC = VL = 3.3V,TA = 25°C. (2) Driverskew ismeasured atthedriverzerocrosspoint. ESD Protection PARAMETER TEST CONDITIONS TYP UNIT Human-Body Model ±15 RIN,DOUT IEC 61000-4-2Air-GapDischarge ±15 kV IEC 61000-4-2ContactDischarge ±8

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C2−5 C2+4 C1−3 C1+1 RIN1 14 DOUT2 16 DOUT1 17 V− 6 V+ 2V CC V L 3.3 V DOUT3 15 TTL/CMOS Outputs 5kΩ 5kΩ 0.1µF 0.1 µF 20 19 12 0.1/C0109F 0.1/C0109F PWRDWN DIN2 DIN3 C BYPASS VL VL MAX3386E www.ti.com SLLS659B –MAY 2006–REVISED MARCH 2011

APPLICATION INFORMATION

Copyright© 2006–2011,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLink(s):MAX3386E

−3 V−3 V

3 V3 V

1.5 V1.5 V Output Input VOL VOH tTLH Generator (see Note B) R L RS-232 Output tTHL C L (see Note A) SR(tr)/C00436 V tTHL or tTLH 3 V PWRDWN NOTES: A. C L includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 W , 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. 50 W TEST CIRCUIT VOLT AGE W AVEFORMS 0 V 3 V Output Input VOL VOH tPLH Generator (see Note B) R L 3 V PWRDWN RS-232 Output tPHLC L (see Note A) NOTES: A. C L includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 W , 50% duty cycle, tr ≤/charBnZrBnZrBnZrBnZrBnZrBnZrBnZrBnZr10 ns, tf ≤ 10 ns. 50% 50% 1.5 V 1.5 V TEST CIRCUIT VOLT AGE W AVEFORMS 50 W 50%50% −3 V 3 V 1.5 V1.5 V Output Input VOL VOH tPHL Generator (see Note B) tPLH Output PWRDWN 3 V C L (see Note A) NOTES: A. C L includes probe and jig capacitance. B. The pulse generator has the following characteristics: ZO = 50 W , 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. MAX3386E SLLS659B –MAY 2006–REVISED MARCH 2011 www.ti.com PARAMETER MEASUREMENT INFORMATION Figure1. DriverSlew Rate Figure2. DriverPulse Skew Figure3. ReceiverPropagationDelay Times

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50 WGenerator

(see Note B)

3 V or 0 V

(S1 at GND) tPLZ (S1 at VCC ) tPHZ S1 at GND) tPZL (S1 at VCC ) 1.5 V1.5 V 3 V 0 V 50% 0.3 V Output Input 50% 0.3 V PWRDWN R L VCC GND C L (see Note A) Output NOTES: A. C L includes probe and jig capacitance. B. The pulse generator has the following characteristics: ZO = 50 W , 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. MAX3386E www.ti.com SLLS659B –MAY 2006–REVISED MARCH 2011 PARAMETER MEASUREMENT INFORMATION Figure4. ReceiverEnable and DisableTimes Copyright© 2006–2011,Texas InstrumentsIncorporated SubmitDocumentationFeedback 9 ProductFolderLink(s):MAX3386E

SLLS659B –MAY 2006–REVISED MARCH 2011 www.ti.com

REVISION HISTORY

Changes from RevisionA (November 2008)toRevisionB Page

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www.ti.com 23-May-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) MAX3386ECDWR Active Production SOIC (DW) | 20 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM 0 to 70 MAX3386EC MAX3386ECDWR.A Active Production SOIC (DW) | 20 2000 | LARGE T&R Yes NIPDAU Level-1-260C-UNLIM -40 to 85 MAX3386EC MAX3386ECPW Obsolete Production TSSOP (PW) | 20 - - Call TI Call TI 0 to 70 MP386EC MAX3386ECPWR Obsolete Production TSSOP (PW) | 20 - - Call TI Call TI 0 to 70 MP386EC MAX3386EIDW Obsolete Production SOIC (DW) | 20 - - Call TI Call TI -40 to 85 MAX3386EI MAX3386EIDWR Obsolete Production SOIC (DW) | 20 - - Call TI Call TI -40 to 85 MAX3386EI MAX3386EIPW Obsolete Production TSSOP (PW) | 20 - - Call TI Call TI -40 to 85 MP386EI MAX3386EIPWR Obsolete Production TSSOP (PW) | 20 - - Call TI Call TI -40 to 85 MP386EI (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1

www.ti.com 23-May-2025 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 3-May-2024 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 3-May-2024 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) MAX3386ECDWR SOIC DW 20 2000 367.0 367.0 45.0 Pack Materials-Page 2

www.ti.com PACKAGE OUTLINE C TYP10.63 9.97

2.65 MAX

18X 1.27 20X 0.51 0.31 11.43 TYP0.33 0.10 0 - 8 0.3 0.1 0.25 GAGE PLANE 1.27 0.40 A NOTE 3 13.0 12.6 B 7.6 7.4 4220724/A 05/2016 SOIC - 2.65 mm max heightDW0020A SOIC NOTES: 1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.43 mm per side. 5. Reference JEDEC registration MS-013. 1 20

0.25 C A B

0.1 C SEE DETAIL A DETAIL A TYPICAL SCALE 1.200

www.ti.com EXAMPLE BOARD LAYOUT (9.3)

0.07 MAX

0.07 MIN

20X (2) 20X (0.6) 18X (1.27) (R ) TYP 0.05 4220724/A 05/2016 SOIC - 2.65 mm max heightDW0020A SOIC SYMM SYMM LAND PATTERN EXAMPLE SCALE:6X 10 11 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. METALSOLDER MASK OPENING NON SOLDER MASK DEFINED SOLDER MASK DETAILS SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED

www.ti.com EXAMPLE STENCIL DESIGN (9.3) 18X (1.27) 20X (0.6) 20X (2) 4220724/A 05/2016 SOIC - 2.65 mm max heightDW0020A SOIC NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SYMM SYMM 10 11 SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:6X

www.ti.com PACKAGE OUTLINE C 18X 0.65 5.85 20X 0.30 0.19 TYP6.6 6.2

1.2 MAX

0.15 0.05 0.25 GAGE PLANE -80 B NOTE 4 4.5 4.3 A NOTE 3 6.6 6.4 0.75 0.50 (0.15) TYP TSSOP - 1.2 mm max heightPW0020A SMALL OUTLINE PACKAGE 4220206/A 02/2017

0.1 C A B

0.1 C NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO-153. SEATING PLANE A 20 DETAIL A TYPICAL SCALE 2.500

www.ti.com EXAMPLE BOARD LAYOUT

0.05 MAX

0.05 MIN

20X (1.5) 20X (0.45) 18X (0.65) (5.8) (R0.05) TYP TSSOP - 1.2 mm max heightPW0020A SMALL OUTLINE PACKAGE 4220206/A 02/2017 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 10X SYMM SYMM 10 11 15.000 METALSOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK OPENING EXPOSED METALEXPOSED METAL SOLDER MASK DETAILS NON-SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED

www.ti.com EXAMPLE STENCIL DESIGN 20X (1.5) 20X (0.45) 18X (0.65) (5.8) (R0.05) TYP TSSOP - 1.2 mm max heightPW0020A SMALL OUTLINE PACKAGE 4220206/A 02/2017 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE: 10X SYMM SYMM 10 11

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