MP34DT01-M STMICROELECTRONICS | Alldatasheet

Document overview

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Technical content

Datasheet sections

  • 1 Pin description
  • 2 Acoustic and electrical specifications
  • 2.1 Acoustic and electrical characteristics
  • 2.2 Frequency response
  • 2.3 Timing characteristics
  • 3 Application recommendations
  • 4 Sensing element
  • 5 Absolute maximum ratings
  • 6 Functionality
  • 6.1 L/R channel selection
  • 7 Package mechanical data
  • 8 Carrier tape mechanical specifications
  • 9 Process recommendations
  • 10 Revision history

Features

  • Single supply voltage
  • Low power consumption
  • 120 dBSPL acoustic overload point
  • 61 dB signal-to-noise ratio
  • Omnidirectional sensitivity
  • – 26 dBFS sensitivity
  • PDM output
  • HCLGA package – Top-port design – SMD-compliant – EMI-shielded – ECOPACK ® , RoHS, and “Green” compliant

Applications

  • Mobile terminals
  • Laptop and notebook computers
  • Portable media players
  • VoIP
  • Speech recognition
  • A/V eLearning devices
  • Gaming and virtual reality input devices
  • Digital still and video cameras
  • Antitheft systems

Description

The MP34DT01-M is an ultra-compact, low- power, omnidirectional, digital MEMS microphone built with a capacitive sensing element and an IC interface. The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process dedicated to produce audio sensors. The IC interface is manufactured using a CMOS process that allows designing a dedicated circuit able to provide a digital signal externally in PDM format. The MP34DT01-M has an acoustic overload point of 120 dBSPL with a 61 dB signal-to-noise ratio and –26 dBFS sensitivity. The MP34DT01-M is available in a top-port, SMD- compliant, EMI-shielded package and is guaranteed to operate over an extended temperature range from -40 °C to +85 °C. HCLGA (3 x 4 x 1.06 4LD) Table 1. Device summary

1 Pin description

Figure 1. Pin connections Table 2. Pin description

1 Vdd Power supply

2 LR Left/Right channel selection

3 CLK Synchronization input clock

4 DOUT Left/Right PDM data output

2 Acoustic and electrical specifications

2.1 Acoustic and electrical characteristics

T = 25 °C, unless otherwise noted. Table 3. Acoustic and electrical characteristics

  1. Typical specifications are not guaranteed.
  2. Input clock in static mode.

1 Pa 61 dB

  1. Time from the first clock edge to valid output data.

Table 4. Distortion specifications

2.2 Frequency response

Figure 2. Typical frequency response normalized at 1 kHz

2.3 Timing characteristics

Figure 3. Timing waveforms Table 5. Timing characteristics

3 Application recommendations

Figure 4. MP34DT01-M electrical connections (Top view) Figure 5. MP34DT01-M electrical connections for stereo configuration (Top view)

Power supply decoupling capacitors (100 nF ceramic, 10 µF ceramic) should be placed as near as possible to pin 1 of the device (common design practice). The L/R pin must be connected to Vdd or GND (refer to Table 5 ).

MP34DT01-M Sensing element

4 Sensing element

The sensing element shall mean the acoustic sensor consisting of a conductive movable plate and a fixed plate placed in a tiny silicon chip. This sensor transducers the sound pressure into the changes of coupled capacity between those two plates. Omron Corporation supplies this element for STMicroelectronics.

5 Absolute maximum ratings

Table 6. Absolute maximum ratings permanent damage to the part.

6 Functionality

6.1 L/R channel selection

L/R pin must be connected to Vdd or GND. Table 7. L/R channel selection

7 Package mechanical data

specifications, grade definitions and product status are available at: www.st.com . ECOPACK ® is an ST trademark. is qualified for soldering heat resistance according to JEDEC J-STD-020. Landing pattern and soldering recommendations are available at www.st.com . Figure 6. Recommended soldering profile limits Table 8. Recommended soldering profile limits

Figure 7. HCLGA (3 x 4 x 1.06 mm) 4-lead package outline device is subjected to thermal process. Table 9. HCLGA (3 x 4 x 1.06 mm) mechanical data

8 Carrier tape mechanical specifications

Figure 8. Carrier tape without microphone-top view Figure 9. Carrier tape with microphone-top view

9 Process recommendations

package, sound inlet). Picker tolerance shall be considered as well. coordinates for the picking. – Device alignment before picking is highly recommended. Figure 10. Recommended picking area

2.27 Pocket Size Clearance

Table 10. Document revision history