MP34DB02 STMICROELECTRONICS | Alldatasheet

Document overview

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Technical content

Datasheet sections

  • 1 Pin description
  • 2 Acoustic and electrical specifications
  • 2.1 Acoustic and electrical characteristics
  • 2.2 Timing characteristics
  • 2.3 Frequency response
  • 3 Sensing element
  • 4 Absolute maximum ratings
  • 5 Functionality
  • 5.1 L/R channel selection
  • 6 Application recommendations
  • 7 Package information
  • 7.1 Soldering information
  • 7.2 RHLGA package information
  • 8 Revision history

Features

  • Single supply voltage
  • Low power consumption
  • 120 dBSPL acoustic overload point
  • 62.6 dB signal-to-noise ratio
  • Omnidirectional sensitivity
  • –26 dBFS sensitivity
  • PDM single-bit output with option for stereo configuration
  • RHLGA package − Bottom-port design − SMD-compliant − EMI-shielded − ECOPACK®, RoHS and “Green” compliant

Applications

  • Mobile terminals
  • Laptop and notebook computers
  • Portable media players
  • VoIP
  • Speech recognition
  • A/V eLearning devices
  • Gaming and virtual reality input devices
  • Digital still and video cameras
  • Antitheft systems

Description

The MP34DB02 is an ultra-compact, low-power, omnidirectional, digital MEMS microphone built with a capacitive sensing element and an IC interface with stereo operation capability. The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process dedicated to produce audio sensors. The IC interface is manufactured using a CMOS process that allows designing a dedicated circuit able to provide a digital signal externally in PDM format. The MP34DB02 has an acoustic overload point of 120 dBSPL with a best-on-the-market 62.6 dB signal-to-noise ratio and -26 dBFS sensitivity. The MP34DB02 is available in a bottom-port, SMD-compliant, EMI-shielded package and is guaranteed to operate over an extended temperature range from -40 °C to +85 °C. Table 1: Device summary Part number Temp. range [°C] Package Packing MP34DB02TR -40 to +85 RHLGA 4 LD (3x4x1) mm Tape and reel

1 Pin description

Figure 1: Pin connections Table 2: Pin description Pin number Pin name Function

1 CLK Synchronization input clock

2 LR Left/right channel selection

3 Vdd Power supply

4 DOUT Left/right PDM data output

5 (ground ring) GND 0 V supply

Acoustic and electrical specifications MP34DB02

2 Acoustic and electrical specifications

2.1 Acoustic and electrical characteristics

The values listed in the table below are specified for Vdd = 1.8 V, Clock = 2.4 MHz, T = 25 °C, unless otherwise noted. Table 3: Acoustic and electrical characteristics Sym. Parameter Test condition Min. Typ. (1) Max. Unit Vdd Supply voltage 1.64 1.8 3.6 V Idd Current consumption in normal mode Mean value (2) 0.65 mA IddPdn Current consumption in power-down mode (3) µA Scc Short-circuit current 10 mA AOP Acoustic overload point 120 dBSPL So Sensitivity at 1 kHz, 1 Pa -29 -26 -23 dBFS SNR Signal-to-noise ratio A-weighted at 1 kHz, 1 Pa 62.6 dB PSR Power supply rejection 100 mVpp square wave @ 217 Hz, A-weighted -86 dBFS Clock Input clock frequency (4) 1 2.4 3.25 MHz TWK Wake-up time (5) guaranteed by design 10 ms Top Operating temperature range -40 +85 °C Notes: (1)Typical specifications are not guaranteed. (2)No load on DOUT line. (3)Input clock in static mode. (4)Duty cycle: min = 40% max = 60% (5)Time from the first clock edge to valid output data. Table 4: Distortion specifications Parameter Test condition Value Distortion 100 dBSPL (50 Hz - 4 kHz) < 1% THD + N Distortion 115 dBSPL (1 kHz) < 5% THD + N

MP34DB02 Acoustic and electrical specifications

2.2 Timing characteristics

Table 5: Timing characteristics Parameter Description Min Max Unit fCLK Clock frequency for normal mode 1 3.25 MHz fPD Clock frequency for power-down mode

0.23 MHz

TCLK Clock period for normal mode 308 1000 ns TR,EN Data enabled on DATA line, L/R pin = 1 18 (1) 30(1) ns TR,DIS Data disabled on DATA line, L/R pin = 1 16(1) ns TL,EN Data enabled on DATA line, L/R pin = 0 18(1) 30(1) ns TL,DIS Data disabled on DATA line, L/R pin = 0 16(1) ns Notes: (1)From design simulations Figure 2: Timing waveforms

Acoustic and electrical specifications MP34DB02

2.3 Frequency response

Figure 3: Frequency response

3 Sensing element

The sensing element shall mean the acoustic sensor consisting of a conductive movable plate and a fixed plate placed in a tiny silicon chip. This sensor transduces the sound pressure into the changes of coupled capacity between those two plates. Omron Corporation supplies this element for STMicroelectronics.

4 Absolute maximum ratings

Stresses above those listed as “absolute maximum ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device under these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Table 6: Absolute maximum ratings Symbol Ratings Maximum value Unit Vdd Supply voltage -0.3 to 6 V Vin Input voltage on any control pin -0.3 to Vdd +0.3 V TSTG Storage temperature range -40 to +125 °C ESD Electrostatic discharge protection 2 (HBM) kV

5 Functionality

5.1 L/R channel selection

The L/R digital pad lets the user select the DOUT signal pattern as explained in Table 7: "L/R channel selection". The L/R pin must be connected to Vdd or GND. Table 7: L/R channel selection L/R CLK low CLK high GND Data valid High impedance Vdd High impedance Data valid

6 Application recommendations

Figure 4: MP34DB02 electrical connections Figure 5: MP34DB02 electrical connections for stereo configuration Power supply decoupling capacitors (100 nF ceramic, 10 µF ceramic) should be placed as near as possible to pin 3 of the device (common design practice). The L/R pin must be connected to Vdd or GND (refer to Table 7: "L/R channel selection" ). C ODE C Vdd 10 µF 100nF L/R DOUT 2 3

5 Top view

10 µF Vdd

7 Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.

7.1 Soldering information

The RHLGA (3 x 4 x 1) mm package is also compliant with the RoHS and “Green” standards and is qualified for soldering heat resistance according to JEDEC J-STD-020. Landing pattern and soldering recommendations are available at www.st.com. Figure 6: Recommended soldering profile limits Table 8: Recommended soldering profile limits Desription Parameter Pb free Average ramp rate TL to TP 3 °C/sec max Preheat Minimum temperature Maximum temperature Time (TSMIN to TSMAX) TSMIN TSMAX tS 150 °C 200 °C 60 sec to 120 sec Ramp-up rate TSMAX to TL Time maintained above liquidus temperature Liquidus temperature tL TL 60 sec to 150 sec 217 °C Peak temperature TP 260 °C max Time within 5 °C of actual peak temperature 20 sec to 40 sec Ramp-down rate 6 °C/sec max Time 25 °C (t25 °C) to peak temperature 8 minutes max

7.2 RHLGA package information

Figure 7: RHLGA 4LD 3x4 mm (metal cap) 0.25 mm port hole package outline Table 9: RHLGA 4LD 3x4 mm (metal cap) 0.25 mm port hole package mechanical data Symbol mm. Min. Typ. Max. A1 0.900 1.000 1.100 A2 0.200 0.250 0.300 D1 3.900 4.000 4.100 D2 0.900 1.000 1.100 D3 1.000 1.100 1.200 D4 3.610 3.700 3.790 R1 0.200 0.250 0.300 0.280 0.250 E1 2.900 3.000 3.100 E2 1.300 1.500 1.700 E4 2.610 2.700 2.790 L1 0.650 0.700 0.750 L2 0.850 0.900 0.950 N1 1.000 1.050 1.100 N2 0.400 0.450 0.500 T1 0.350 0.400 0.450 T2 0.550 0.600 0.650 G1 3.050 3.100 3.150 G2 3.750 3.800 3.850 G3 2.050 2.100 2.150 TOP VIEW BOTTOM VIEW d K G2G1 1L N1 G7 G8 2XG6 G5xG5 Pin 1 Indicator d K j KD j KE M D2 D3 E D 8413120_A

mm. Min. Typ. Max. G4 2.750 2.800 2.850 G5 0.250 0.300 0.350 G6 0.050 0.100 0.150 G7 0.500 0.550 0.600 G8 0.800 0.850 0.900 M 0.100 K 0.050

8 Revision history

Table 10: Document revision history Date Revision Changes 21-Mar-2014 1 Initial release 28-Apr-2016 2 Updated Table 1: "Device summary" Updated PSR in Table 3: "Acoustic and electrical characteristics"