MP33AB01 STMICROELECTRONICS | Alldatasheet

Document overview

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  • PDF pages: 13

Technical content

Datasheet sections

  • 1 Pin description
  • 2 Acoustic and electrical specificat ions
  • 2.1 Acoustic and electrical characteristics
  • 2.2 Frequency response
  • 3 Absolute maximum ratings
  • 4 Application recommendations
  • 5 Package mechanical data
  • 6 Revision history

Features

 Single supply voltage  Low power consumption  Omnidirectional sensitivity  High signal-to-noise ratio  High bandwidth  Package compliant with reflow soldering

Description

The MP33AB01 is a compact, low-power microphone built with a low-profile sensing element. The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process to produce audio sensors. The MP33AB01 has an acoustic overload point of 125 dBSPL with a 63 dB signal-to-noise ratio. The MP33AB01 is available in a package compliant with reflow soldering and is guaranteed to operate over an extended temperature range from -30 °C to +100 °C. RHLGA 3.76 x 2.95 x 1.0 mm Table 1. Device summary

1 Pin description

Figure 1. Pin connections Table 2. Pin description

1 Output Analog output

2 GND 0 V supply

3 GND 0 V supply

4 Vdd Power supply

5 GND 0 V supply

6 GND 0 V supply

2 Acoustic and electrical specifications

2.1 Acoustic and elect rical characteristics

The values listed in the table below are specified for Vdd = 2.2 V unless otherwise noted. Table 3. Acoustic and electrical characteristics

  1. Typical specifications are not guaranteed.

Table 4. Distortion specifications at 1 kHz

2.2 Frequency response

Figure 2. Typical frequency response normalized at 1 kHz

3 Absolute maximum ratings

Table 5. Absolute maximum ratings permanent damage to the part.

4 Application recommendations

Figure 3. MP33AB01 electrical connections and external component values of about 20 kit is recommended to use a C1 > 1 µF.

5 Package mechanical data

specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. standards and is qualified for soldering heat resistance according to JEDEC J-STD-020. Land pattern and soldering recommendations are available at www.st.com. Figure 4. Recommended soldering profile limits Table 6. Recommended soldering profile limits

Figure 5. RHLGA 3.76 mm x 2.95 mm x 1.0 mm package outline Table 7. RHLGA 3.76 mm x 2.95 mm x 1.0 mm package dimensions

Figure 6. Device footprint and PCB land pattern Table 7. RHLGA 3.76 mm x 2.95 mm x 1.0 mm package dimensions (continued)

Figure 7. Recommended stencil openings

6 Revision history

Table 8. Document revision history