MP2HFTUMN-80000-2

401-0578-00 DELKINDEVICES | Alldatasheet

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M.2 2280 Industrial PCIe SSD 401- 0578-00 Rev. A © 2022 | Delkin Devices Inc. 1 M.2 2280 PCIe Industrial Solid State Drive Engineering Specification Document Number: 401-0578-00 Revision: A

M.2 2280 Industrial PCIe SSD 401- 0578-00 Rev. A © 2022 | Delkin Devices Inc. 2 Product Overview  Capacity ￭ 128GB up to 2TB  Form Factor ￭ M.2 2280 S2- M  PCIe Interface ￭ NVMe PCIe Gen 3 x 4  Compliance ￭ NVMe 1.3d ￭ PCI Express Base 3.1  Flash Interface ￭ Flash type: 3D TLC  Performance1 ￭ Read: up to 2450 MB/s ￭ Write: up to 1900 MB/s  Reliability ￭ Mean Time Between Failure (MTBF) More than 2,000,000 hrs ￭ Uncorrectable Bit Error Rate (UBER) < 1 sector per 1016 bits read  DWPD ≥ 0.4  ECC Performance ￭ LDPC/ RAID ECC ￭ Low density parity check code (>120bit/K Bytes)  Power Consumption3  Power supply of M.2 SSD: DC+3.3V±5%  Active Write (Typ.) < 4,000 mW  Active Read (Typ.) < 4,000 mW  Idle mode: < 1,500 mW  RoHS compliant  Features Support List: ￭ Dynamic SLC Cache ￭ Support AES/TCG OPAL Note3  Secure Erase  Bad Block Management  TRIM  SMART  Temperature Range2 ￭ Operation: -40°C ~ 85°C ￭ Storage: -40°C ~ 85°C Notes: 1. Refer to Chapter 2 for more details. 2. Temperature is measured by SMART temperature. Active airflow is recommended within the system for maintaining proper device operating temperature on heavier workloads. 3. Supported by a separate firmware version.

M.2 2280 Industrial PCIe SSD 401- 0578-00 Rev. A © 2022 | Delkin Devices Inc. 3 TABLE OF CONTENTS

M.2 2280 Industrial PCIe SSD 401- 0578-00 Rev. A © 2022 | Delkin Devices Inc. 4 LIST OF FIGURES LIST OF TABLES

M.2 2280 Industrial PCIe SSD 401- 0578-00 Rev. A © 2022 | Delkin Devices Inc. 5 1. INTRODUCTION 1.1. General Description Delkin Devices’ M.2 2280 Industrial 3D TLC Solid State Drive (SSD) delivers all advantages of flash disk technology with PCIe Gen3 x4 interface and is fully compliant with the standard Next Generation Form Factor (NGFF) or M.2 . The Delkin M.2 is available in capacity range of 128G B to 2TB and can reach up to 2450 MB/s read, and 1900 MB/s write. 1.2. Product Block Diagram Figure 1-1 Product Block Diagram 1.3. Advanced Technology and Features 1.3.1. Error Correction Code (ECC) Flash memory cells will deteriorate with use, which might generate random bit errors in the stored data. Thus, Delkin’s M.2 2280 SSD applies the LDPC (Low Density Parity Check) of ECC algorithm, which can detect and correct during the read process, ensuring data has been read correctly, as well as protect data from corruption.. 1.3.2. Wear Leveling NAND flash devices can only undergo a limited number of program/erase cycles, and in most cases, the flash media are not used evenly. If some areas are updated more frequently than others, the lifetime of the device would be reduced significantly. Thus, Wear Leveling is applied to extend the Flash Controller PCIe Power PCIe Signal Front Side Flash Flash Flash

M.2 2280 Industrial PCIe SSD 401- 0578-00 Rev. A © 2022 | Delkin Devices Inc. 6 lifespan of NAND flash by evenly distributing write and erase cycles across the media. Delkin utilizes advanced We ar Leveling algorithm s, which can efficiently distribute flash usage through the whole flash media area. Moreover, by implementing both dynamic and static Wear Leveling algorithms, the life expectancy of the NAND flash is greatly improved. 1.3.3. Bad Block Management Bad blocks are blocks that include one or more invalid bits, and their reliability is not guaranteed. Blocks that are identified and marked as bad by the manufacturer are referred to as “Initial Bad Blocks”. Bad blocks that are developed during usage of the flash are named “Later Bad Blocks”. Delkin implements an efficient bad block management algorithm to detect the factory-produced bad blocks and manages any bad blocks that appear with use. This practice further prevents data being stored into bad blocks and improves data reliability. 1.3.4. TRIM TRIM is a feature which helps improve the read/write performance and speed of solid- state drives (SSD). Unlike hard disk drives (HDD), SSDs are not able to overwrite existing data, so the available space gradually becomes smaller with each use. With the TRIM c ommand, the operating system can inform the SSD which blocks of data are no longer in use and can be removed permanently. Thus, the SSD will perform an erase action, which prevents unused data from occupying blocks. 1.3.5. SMART SMART, an acronym for Self-Monitoring, Analysis and Reporting Technology, is an open standard that allows a drive to automatically detect its health and report potential failures. When a failure is recorded by SMART, users can choose to replace the drive to prevent unexpected outage or data loss. Moreover, SMART can inform users of impending failures while there is still time to perform proactive actions, such as copy data to another device. 1.3.6. Dynamic SLC Cache Delkin’s firmware design currently adopts dynamic caching to deliver better performance and consumer user experience.. 1.3.7. Thermal Throttling The purpose of thermal throttling is to prevent any components in a SSD from over -heating during read and write operations. Delkin’s Controller is designed with an on -die thermal sensor, and can

M.2 2280 Industrial PCIe SSD 401-0 578-00 Rev. A © 2022 | Delkin Devices Inc. 7 provide different levels of throttling to achieve protection efficiently and proactively via SMART reading. 1.4. Advanced Device Security Features 1.4.1. Secure Erase Secure Erase is a standar d NVME format command and will write “0xFF” to fully wipe all the data on hard drives and SSDs. When this command is issued, the SSD controller will erase its storage blocks and return to its factory default settings. 1.5. SSD Lifetime Management 1.5.1. Terabytes Written (TBW) TBW (Terabytes Written) is a measurement of SSDs’ expected lifespan, which represents the amount of data written to the device. To calculate the TBW of a SSD, the following equation is applied: TBW = [(NAND Endurance) x (SSD Capacity) x (WLE)] / WAF NAND Endurance: NAND endurance refers to the P/E (Program/Erase) cycle rating of NAND flash, per the manufacturer’s specification. SSD Capacity: The SSD capacity is the specific capacity in total of a SSD. WLE: Wear Leveling Efficiency (WLE) represents the ratio of the average amount of erases on all the blocks to the erases on any block at maximum. WAF: Write Amplification Factor ( WAF) is a numerical value representing the ratio between the amount of data that a SSD controller writes to the flash and the amount of data that the host’s flash controller writes. A better WAF, which is near 1, guarantees better endurance and lower frequency of data written to flash memory.

M.2 2280 Industrial PCIe SSD 401-0 578-00 Rev. A © 2022 | Delkin Devices Inc. 8 2. PRODUCT SPECIFICATIONS  Capacity ￭ From 128GB up to 2TB  Electrical/Physical Interface ￭ PCIe Interface  Compliant with NVMe 1.3d  PCIe Express Base Ver 3.1  PCIe Gen 3 x 4 lane & backward compatible to PCIe Gen 2 and Gen 1  ECC Scheme ￭ LDPC (Low Density Parity Check) of ECC algorithm  Supports SMART and TRIM commands  Performance Capacity Sequential Performance (Up to) CrystalDiskMark Read (MB/s) Write (MB/s) 128GB 1150 550 256GB 2300 1100 512GB 2400 1800 1TB 2450 1900 2TB 2450 1900 [Notes] 1. Performance may differ according to flash configuration, use condition, environment and platform. 2. Tested with CrystalDiskMark 6.0, QD32T1, 1GB range. 3. Performance specification is under Thermal Throttling inactivated. 4. Operating System: Windows 10 Professional (x64), Version 1809 5. Measurement environment: Room temperature: 20~25℃, humidity: 40~60%RH, DC+3.3V condition.

M.2 2280 Industrial PCIe SSD 401-0 578-00 Rev. A © 2022 | Delkin Devices Inc. 9  Endurance - TBW (Terabytes Written) Capacity TBW 128GB 110 256GB 240 512GB 520 1TB 1120 2TB 2400 NOTES: 1. TBW is measured by JEDEC Client 219A workload and calculated with PE count = 3000. 2. TBW may differ according to flash configuration and platform configuration. 3. DWPD is calculated based on 5-year lifetime. 4. DWPD (Drive Write Per Day) = TBW/ (365 x 5 years x User Capacity) = TBW (TB*103)/[365 x 5 years x User Capacity(=GB*1000)] 5. The SSD supports trim function. If Operation System does not support trim command, performance and TBW will be affected. (Like certain Windows OS, Linux kernel version before 2.6.33, other OS please reference each own user manual) 6. The endurance of SSD could be estimated based on user behavior, NAND endurance cycles, and write amplification factor.  Part Numbers M.2 2280 Industrial TLC SSD Industrial Temperature (-40 to 85°C) Capacity Part Number 128GB MP1HFTTMN-80000-2 256GB MP2HFTUMN-80000-2 512GB MP5HFTVMN-80000-2 1TB MP1TFTVMN-80000-2 2TB MP2TFTWMN-80000-2

M.2 2280 Industrial PCIe SSD 401- 0578-00 Rev. A © 2022 | Delkin Devices Inc. 10 3. ENVIRONMENTAL SPECIFICATIONS 3.1. Environmental Conditions 3.1.1. Temperature and Humidity  Temperature:  Storage: -40°C to 85°C  Operational: -40°C to 85°C  Humidity:  RH 95% under 55°C (operational) 3.1.2. Shock & Vibration  Shock Specification  1500G, 0.5ms duration  Vibration Specification  20Hz ~80Hz/1.52mm displacement  80Hz~2000Hz / 20G Acceleration 3.1.3. Electrostatic Discharge (ESD)  +/- 4KV 3.1.4. EMI Compliance

• EN 55032, CISPR 32(CE)
• AS/NZS CISPR 32(CE)
• ANSI C63.4 (FCC)
• VCCI-CISPR 32 (VCCI)
• CNS 13438 (BSMI) 3.2. MTBF MTBF, an acronym for Mean Time Between Failures, is a measure of a device’s reliability. Its value represents the average time between a repair and the next failure. The measure is typically in units of hours. The higher the MTBF value, the higher the reliability of the device.

M.2 2280 Industrial PCIe SSD 401- 0578-00 Rev. A © 2022 | Delkin Devices Inc. 11 3.3. Certification & Compliance

• RoHS WARNING: This product may contain chemicals known to the State of California to cause cancer, birth defects, or other reproductive harm. For more information go to www.p65warnings.ca.gov.

M.2 2280 Industrial PCIe SSD 401-0 578-00 Rev. A © 2022 | Delkin Devices Inc. 12 4. ELECTRICAL SPECIFICATIONS 4.1. Supply Voltage Table 4-1 Supply Voltage Parameter Rating Operating Voltage 3.3V DC,+/- 5% Rise Time (Max/min) 100ms / 0.1ms Fall Time (Max/min) 5s / 1ms Min. Off Time1 1s NOTE: 1.Minimum time between power removed from SSD (Vcc < 100 mV) and power re-applied to the drive. 2. Ensure the voltage of each power domain in SSD has enough time to discharge less than 0.1V. 3. Rise Time during from 10% to 90% of 3.3V. 4. Fall Time during from 90% to 10% of 3.3V. 4.2. Power Consumption Table 4-2 Power Consumption Capacity Read (Max) Write (Max) 128GB 2000 1600 256GB 3000 2200 512GB 3100 3000 1TB 3300 3200 2TB 3500 3400 Unit: mW NOTES: measure power consumption during sequential Read [1/5]~[5/5] or sequential Write [1/5]~[5/5] 2. The measured power voltage of SSD is 3.3V. 3. Power consumption may differ according to flash configuration, use condition, environment and platform configuration. 4. Measurement environment: Room temperature: 20~25℃, humidity: 40~60%RH..

M.2 2280 Industrial PCIe SSD 401-0 578-00 Rev. A © 2022 | Delkin Devices Inc. 13 5. INTERFACE 5.1. Pin Assignment and Descriptions Table 5-1 defines the signal assignment of the internal NGFF connector for SSD usage, described in the PCI Express M.2 Specification, version 1.0 of the PCI-SIG. Table 5-1 Pin Assignment and Descriptions for M.2 Pin # PCIe Pin Description

1 GND CONFIG_3 = GND

2 3.3V 3.3V source

3 GND Ground

4 3.3V 3.3V source 5 PETn3 PCIe TX Differential signal defined by the PCI Express M.2 spec

6 N/C No Connect

7 PETp3 PCIe TX Differential signal defined by the PCI Express M.2 spec

8 N/C No Connect

9 GND Ground

10 LED1#

Open drain, active low signal. These signals are used to allow the add-in card to provide status indicators via LED devices that will be provided by the system. 11 PERn3 PCIe RX Differential signal defined by the PCI Express M.2 spec 12 3.3V 3.3V source 13 PERp3 PCIe RX Differential signal defined by the PCI Express M.2 spec 14 3.3V 3.3V source

15 GND Ground

16 3.3V 3.3V source 17 PETn2 PCIe RX Differential signal defined by the PCI Express M.2 spec 18 3.3V 3.3V source 19 PETp2 PCIe RX Differential signal defined by the PCI Express M.2 spec

20 N/C No Connect

21 GND Ground

22 N/C No Connect

23 PERn2 PCIe RX Differential signal defined by the PCI Express M.2 spec

24 N/C No Connect

25 PERp2 PCIe RX Differential signal defined by the PCI Express M.2 spec

26 N/C No Connect

27 GND Ground

M.2 2280 Industrial PCIe SSD 401- 0578-00 Rev. A © 2022 | Delkin Devices Inc. 14

28 N/C No Connect

29 PETn1 PCIe RX Differential signal defined by the PCI Express M.2 spec

30 N/C No Connect

31 PETp1 PCIe RX Differential signal defined by the PCI Express M.2 spec

32 N/C No Connect

33 GND Ground

34 N/C No Connect

35 PERn1 PCIe RX Differential signal defined by the PCI Express M.2 spec

36 N/C No Connect

37 PERp1 PCIe RX Differential signal defined by the PCI Express M.2 spec

38 N/C No Connect

39 GND Ground

40 SMB_CLK (I/O)(0/1.8V) SMBus Clock; Open Drain with pull-up on platform 41 PETn0 PCIe TX Differential signal defined by the PCI Express M.2 spec 42 SMB_DATA (I/O)(0/1.8V) SMBus Data; Open Drain with pull-up on platform. 43 PETp0 PCIe TX Differential signal defined by the PCI Express M.2 spec ALERT#(O) (0/1.8V) Alert notification to master; Open Drain with pull-up on platform; Active low.

45 GND Ground

46 N/C No connect

47 PERn0 PCIe RX Differential signal defined by the PCI Express M.2 spec

48 N/C No connect

49 PERp0 PCIe RX Differential signal defined by the PCI Express M.2 spec PERST#(I)(0/3.3V) PE-Reset is a functional reset to the card as defined by the PCIe Mini CEM specification.

51 GND Ground

CLKREQ#(I/O)(0/3.3V) Clock Request is a reference clock request signal as defined by the PCIe Mini CEM specification; Also used by L1 PM Sub-states. REFCLKn PCIe Reference Clock signals (100 MHz) defined by the PCI Express M.2 spec. PEWAKE#(I/O)(0/3.3V) PCIe PME Wake. Open Drain with pull up on platform; Active Low. REFCLKp PCIe Reference Clock signals (100 MHz) defined by the PCI Express M.2 spec.

56 Reserved for MFG Data

Manufacturing Data line. Used for SSD manufacturing only. Not used in normal operation. Pins should be left N/C in platform Socket.

M.2 2280 Industrial PCIe SSD 401-0 578-00 Rev. A © 2022 | Delkin Devices Inc. 15

57 GND Ground

58 Reserved for MFG Clock

Manufacturing Clock line. Used for SSD manufacturing only. Not used in normal operation. Pins should be left N/C in platform Socket.

59 Module Key M Module Key

60 Module Key M Module Key

61 Module Key M Module Key

62 Module Key M Module Key

63 Module Key M Module Key

64 Module Key M Module Key

65 Module Key M Module Key

66 Module Key M Module Key

67 N/C No Connect

SUSCLK (I) (0/3.3V) (I)(0/3.3V) 32.768 kHz clock supply input that is provided by the platform chipset to reduce power and cost for the module.

69 NC CONFIG_1 = No connect

70 3.3V 3.3V source

71 GND Ground

72 3.3V 3.3V source

73 GND Ground

74 3.3V 3.3V source

75 GND CONFIG_2 = Ground

1. SUPPORTED COMMANDS 6.1. NVMe Command List Table 6-1 Admin Commands Opcode O/M Command D escription 00h M Delete I/O Submission Queue 01h M Create I/O Submission Queue 02h M Get Log Page 04h M Delete I/O Completion Queue

M.2 2280 Industrial PCIe SSD 401-0 578-00 Rev. A © 2022 | Delkin Devices Inc. 16 05h M Create I/O Completion Queue 06h M Identify 08h M Abort 09h M Set Features 0Ah M Get Features 0Ch M Asynchronous Event Request 0Dh - Namespace Management 10h O Firmware Activate 11h O Firmware Image Download 14h O Device Self-test 15h - Namespace Attachment 18h O Keep Alive Table 6-2 Admin Commands – NVM Command Set Specific Op Code Command Description 80h Format NVM 81h Security Send 82h Security Receive 84h Sanitize Table 6-3 NVM Commands Op Code Command Description 00h Flush 01h Write 02h Read 04h Write Uncorrectable 05h Compare 08h Write Zeroes 09h Dataset Management

M.2 2280 Industrial PCIe SSD 401-0 578-00 Rev. A © 2022 | Delkin Devices Inc. 17 6.2. Identify Device Data The following table details the sector data returned by the IDENTIFY DEVICE command. Table 6-4 Controller Data Structure Identification Bytes O/M Description Default Value 01:00 M PCI Vendor ID (VID) 0x1987 03:02 M PCI Subsystem Vendor ID (SSVID) 0x1987 23:04 M Serial Number (SN) SN 63:24 M Model Number (MN) Model Number 71:64 M Firmware Revision (FR) FW Name

72 M Recommended Arbitration Burst (RAB) 0x01

75:73 M IEEE OUI Identifier (IEEE) Assigned by IEEE/RAC

76 O Controller Multi-Path I/O and Namespace Sharing Capabilities

(CMIC) 0x00

77 M Maximum Data Transfer Size (MDTS) 0x06

79:78 M Controller ID (CNTLID) 0x1 83:80 M Version (VER) 0x00010300 87:84 M RTD3 Resume Latency (RTD3R) 0x124F80 91:88 M RTD3 Entry Latency (RTD3E) 0x2191C0 95:92 M Optional Asynchronous Events Supported (OAES) 0x00000000 99:96 M Controller Attributes (CTRATT) 0x0 111:100 - Reserved 0x00 127:112 O FRU Globally Unique Identifier (FGUID) 0x00 239:128 - Reserved 0x00 255:240 - Refer to the NVMe Management Interface Specification for definition 257:256 M Optional Admin Command Support (OACS) 0x0017

258 M Abort Command Limit (ACL) 0x00

259 M Asynchronous Event Request Limit (AERL) 0x03

260 M Firmware Updates (FRMW) 0x12

261 M Log Page Attributes (LPA) 0x0A

262 M Error Log Page Entries (ELPE) 0x0F

263 M Number of Power States Support (NPSS) 0x00

264 M Admin Vendor Specific Command Configuration (AVSCC) 0x01

265 O Autonomous Power State Transition Attributes (APSTA) 0x00

267:266 M Warning Composite Temperature Threshold (WCTEMP) 0x166 269:268 M Critical Composite Temperature Threshold (CCTEMP) 0x170 271:270 O Maximum Time for Firmware Activation (MTFA) 0x64

M.2 2280 Industrial PCIe SSD 401- 0578-00 Rev. A © 2022 | Delkin Devices Inc. 18 275:272 O Host Memory Buffer Preferred Size (HMPRE) 0x00000000(HMB off)Depend on Disk Size(HMB on) 279:276 O Host Memory Buffer Minimum Size (HMMIN) 0x00000000(HMB off)Depend on Disk Size(HMB on) 295:280 O Total NVM Capacity (TNVMCAP) non-zero 311:296 O Unallocated NVM Capacity (UNVMCAP) 0 315:312 O Replay Protected Memory Block Support (RPMBS) 0x1F1F0002 317:316 O Extended Device Self-test Time (EDSTT) 0x001E

318 O Device Self-test Options (DSTO 0x01

319 M Firmware Update Granularity

(FWUG) 0x4 321:320 M Keep Alive Support (KAS) 0x0001 323:322 O Host Controlled Thermal Management Attributes (HCTMA) 325:324 O Minimum Thermal Management Temperature (MNTMT) 0x111 327:326 O Maximum Thermal Management Temperature (MXTMT) 0x166 331:328 O Sanitize Capabilities (SANICAP) 0x7 511:316 - Reserved 0 NVM Command Set Attributes

512 M Submission Queue Entry Size (SQES) 0x66

513 M Completion Queue Entry Size (CQES) 0x44

515:514 M Maximum Outstanding Commands (MAXCMD 0 519:516 M Number of Namespaces (NN) 0x00000001 521:520 M Optional NVM Command Support (ONCS) 0x5E 523:522 M Fused Operation Support (FUSES) 0

524 M Format NVM Attributes (FNA) 0x5

525 M Volatile Write Cache (VWC) 0x01

527:526 M Atomic Write Unit Normal (AWUN) 0x00FF 529:528 M Atomic Write Unit Power Fail (AWUPF) 0x0000

530 M NVM Vendor Specific Command Configuration (NVSCC) 0x01

531 M Reserved 0x00

533:532 O Atomic Compare & Write Unit (ACWU) 0x0000 535:534 M Reserved 0x0000

M.2 2280 Industrial PCIe SSD 401-0 578-00 Rev. A © 2022 | Delkin Devices Inc. 19 539:536 O SGL Support (SGLS) 0x00000000 767:540 M Reserved 0x0 IO Command Set Attributes 2047:704 M Reserved 0x0 2048:2079 M Power State 0 Descriptor 0x0081031600401C5200 000000000002580000025 800000316 2111:2080 O Power State 1 Descriptor 0x0081031600401C5201 010101000002580000025 800000316 2143:2112 O Power State 2 Descriptor 0x0081031600401C5202 020202000002580000025 800000316 2175:2144 O Power State 3 Descriptor 0x0081031600401C5203 030303000003E8000003 E8030003E8 2207:2176 O Power State 4 Descriptor 0x0081031600401C5224 040404000186A0000013 8803000032 … - (N/A) 0 3071:3040 O Power State 31 Descriptor 0 Vendor Specific 4095:3072 O Vendor Specific (VS) Reserved Table 6-5 Identify Namespace Data Structure & NVM Command Set Specific Bytes O/M Description Default Value 7:0 M Namespace Size (NSZE) 15:8 M Namespace Capacity (NCAP) 23:16 M Namespace Utilization (NUSE)

24 M Namespace Features (NSFEAT) 0x0

25 M Number of LBA Formats (NLBAF) 0x1

26 M Formatted LBA Size (FLBAS)

27 M Metadata Capabilities (MC) 0x0

28 M End-to-end Data Protection Capabilities (DPC) 0x0

29 M End-to-end Data Protection Type Settings (DPS) 0x0

30 O Namespace Multi-path I/O and Namespace Sharing Capabilities (NMIC) 0x0

M.2 2280 Industrial PCIe SSD 401- 0578-00 Rev. A © 2022 | Delkin Devices Inc. 20

31 O Reservation Capabilities (RESCAP) 0x0

32 O Format Progress Indicator (FPI) 0x0

33 O Deallocate Logical Block Features (DLFEAT) 0x8

35:34 O Namespace Atomic Write Unit Normal (NAWUN) 0xFF 37:36 O Namespace Atomic Write Unit Power Fail (NAWUPF) 0x0 39:38 O Namespace Atomic Compare & Write Unit (NAWWU) 0x0 41:40 O Namespace Atomic Boundary Size Normal (NABSN) 0xFF 43:42 O Namespace Atomic Boundary Offset (NABO) 0x0 45:44 O Namespace Atomic Boundary Size Power Fail (NABSPF) 0x0 47:46 O Namespace Atomic Optimal IO Boundary (NOIOB) 0x0 63:48 O NVM Capacity (NVMCAP) - 103:64 - Reserved 0x0 119:104 O Namespace Globally Unique Identifier (NGUID) - 127:120 O IEEE Extended Unique Identifier (EUI64) - 131:128 M LBA Format 0 Support (LBAF0) 0x1090000 135:132 O LBA Format 1 Support (LBAF1) 0xC0000 139:136 O LBA Format 2 Support (LBAF2) 0x0 143:140 O LBA Format 3 Support (LBAF3) 0x0 147:144 O LBA Format 4 Support (LBAF4) 0x0 151:148 O LBA Format 5 Support (LBAF5) 0x0 155:152 O LBA Format 6 Support (LBAF6) 0x0 159:156 O LBA Format 7 Support (LBAF7) 0x0 163:160 O LBA Format 8 Support (LBAF8) 0x0 167:164 O LBA Format 9 Support (LBAF9) 0x0 171:168 O LBA Format 10 Support (LBAF10) 0x0 175:172 O LBA Format 11 Support (LBAF11) 0x0 179:176 O LBA Format 12 Support (LBAF12) 0x0 183:180 O LBA Format 13 Support (LBAF13) 0x0 187:184 O LBA Format 14 Support (LBAF14) 0x0 191:188 O LBA Format 15 Support (LBAF15) 0x0 383:192 - Reserved 0x00 4095:384 O Vendor Specific (VS) 0x00

M.2 2280 Industrial PCIe SSD 401-0 578-00 Rev. A © 2022 | Delkin Devices Inc. 21 Table 6-6 List of Identify Namespace Data Structure for Each Capacity Capacity (GB) Byte[7:0]: Namespace Size (NSZE)

128 EE7C2B0h

2048 EE7752B0h

6.3. SMART Attributes Table 6-7 SMART Attributes (Log Identifier 02h) Bytes Index Bytes Description [0] 1 Critical Warning: Error occurred if value of the bits are not zero [2:1] 2 Composite Temperature: Flash temp value will be detected on-board thermal sensor(Unit: K) [3] 1 Available Spare: Remaining spare capacity available. (Unit: %) [4] 1 Available Spare Threshold: Spare capacity threshold. (Unit: %) [5] 1 Percentage Used: Average of the Flash's block erase count / NAND EOL erase count (Unit: %) [31:6] 26 Reserved [47:32] 16 Data Units Read (in LBAs): Contains the number of 512byte data units the host has read from the controller. This value is reported in thousands (i.e, a value of 1 corresponds to 1000 units of 512 bytes read). [63:48] 16 Data Units Written (in LBAs): Contains the number of 512byte data units the host has written from the controller. This value is reported in thousands (i.e, a value of 1 corresponds to 1000 units of 512 bytes written). [79:64] 16 Host Read Commands: The number of read commands completed by the controller. [95:80] 16 Host Write Commands: The number of read commands completed by the controller. [111:96] 16 Controller Busy Time: The amount of time the controller is busy with I/O commands.

M.2 2280 Industrial PCIe SSD 401- 0578-00 Rev. A © 2022 | Delkin Devices Inc. 22 [127:112] 16 Power Cycles: Normal power on/off cycles count [143:128] 16 Power On Hours (Unit: hour) [159:144] 16 Unsafe Shutdowns: Abnormal power on/off cycles count [175:160] 16 Media and Data Integrity Errors: The number of occurrences where the controller detected an unrecovered data integrity error. [191:176] 16 Number of Error Information Log Entries: The number of Error Information log entries over the life of the controller. [195:192] 4 Warning Composite Temperature Time: The amount of time that temp. over warning threshold 85°C) but less than critical threshold (95°C). (Unit: min) [199:196] 4 Critical Composite Temperature Time: The amount of time that temp. over critical threshold (95°C). (Unit: min) [201:200] 2 Temperature Sensor 1 (Current Temperature) (Unit: K) [511:216] 2 Reserved

M.2 2280 Industrial PCIe SSD 401- 0578-00 Rev. A © 2022 | Delkin Devices Inc. 23 7. PHYSICAL DIMENSIONS Dimension: 80mm (L) x 22mm (W)

M.2 2280 Industrial PCIe SSD 401- 0578-00 Rev. A © 2022 | Delkin Devices Inc. 24