MAX3238E_15 TI1 | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 22
Technical content
www.ti.com
FEATURES
APPLICATIONS
C1– DIN1 DIN2 DIN3 ROUT1 ROUT2 DIN4 ROUT3 C2+ GND C2− DOUT1 DOUT2 DOUT3 RIN1 RIN2 DOUT4 RIN3 DOUT5 FORCEON FORCEOFF C1+ V CC C1− DIN1 DIN2 DIN3 ROUT1 ROUT2 DIN4 ROUT3 DIN5 ROUT1B INVALID DB, DW, OR PW PACKAGE (TOP VIEW) RHB PACKAGE (TOP VIEW) C2– GND C2+ C1+ V CC NC DOUT5 FORCEON FORCEOFF INVALID NC ROUT1B DIN5 NC 3132 30 29 28 27 26 25 109 11 12 13 14 15 16 DESCRIPTION/ORDERING INFORMATION MAX3238E 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH 15-kV ESD (HBM) PROTECTION SLLS710A FEBRUARY 2006 REVISED APRIL 2006 RS-232 Bus-Pin ESD Protection Exceeds kV Using Human-Body Model (HBM) Meets or Exceeds the Requirements of TIA/EIA-232-F and ITU v.28 Standards Operates With 3-V to 5.5-V V CC Supply Operates up to 400 kbit/s Five Drivers and Three Receivers Auto-Powerdown Plus Feature Enables Flexible Power-Down Mode Low Standby Current µ A Typical External Capacitors 0.1 µ F Accepts 5-V Logic Input With 3.3-V Supply Always-Active Noninverting Receiver Output (ROUT1B) Alternative High-Speed Pin-Compatible Device Mbit/s) for SNx5C3238 ESD Protection for RS-232 Interface Pins kV Human-Body Model (HBM) kV IEC61000-4-2, Contact Discharge kV IEC61000-4-2, Air-Gap Discharge Battery-Powered Systems PDAs Notebooks Subnotebooks Laptops Palmtop PCs Hand-Held Equipment Modems Printers The MAX3238E consists of five line drivers, three line receivers, and a dual charge-pump circuit with 15-kV ESD (HBM) protection on the driver output (DOUT) and receiver input (RIN) terminals. The device meets the requirements of TIA/EIA-232-F and provides the electrical interface between notebook and subnotebook computer applications. The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V supply. In addition, the device includes an always-active noninverting output (ROUT1B), which allows down. This device operates at data signaling rates up to 250 kbit/s and a maximum of 30-V/ µ s driver output slew rate. Please be aware that an important notice concerning availability, standard warranty, and use in critical sheet. PRODUCTION DATA information is current as of publication date. Copyright 2006, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
www.ti.com DESCRIPTION/ORDERING INFORMATION (CONTINUED) MAX3238E 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH 15-kV ESD (HBM) PROTECTION SLLS710A FEBRUARY 2006 REVISED APRIL 2006 Flexible control options for power management are featured when the serial port and driver inputs are inactive. The auto-powerdown plus feature functions when FORCEON is low and FORCEOFF is high. During this mode of operation, if the device does not sense valid signal transitions on all receiver and driver inputs for approximately the built-in charge pump and drivers are powered down, reducing the supply current to µ By disconnecting the serial port or placing the peripheral drivers off, auto-powerdown plus occurs if there is no activity in the logic levels for the driver inputs. Auto-powerdown plus can be disabled when FORCEON and FORCEOFF are high. With auto-powerdown plus enabled, the device activates automatically when a valid signal is applied to any receiver or driver input. INVALID is high (valid data) if any receiver input voltage is greater than 2.7 V or less than 2.7 or has been between 0.3 V and 0.3 V for less than µ INVALID is low (invalid data) if all receiver input voltages are between 0.3 V and 0.3 V for more than µ Refer to Figure for receiver input levels. ORDERING INFORMATION T A PACKAGE (1) ORDERABLE PART NUMBER TOP-SIDE MARKING Tube of MAX3238ECDB SSOP DB MAX3238EC Reel of 2000 MAX3238ECDBR Tube of MAX3238ECPW C to C TSSOP PW MP238EC Reel of 2000 MAX3238ECPWR SOIC DW Reel of 2000 MAX3238ECDWR MAX3238EC QFN RHB Reel of 2000 MAX3238ECRHBR Preview Tube of MAX3238EIDB SSOP DB MAX3238EI Reel of 2000 MAX3238EIDBR Tube of MAX3238EIPW C to C TSSOP PW MP238EI Reel of 2000 MAX3238EIPWR SOIC DW Reel of 2000 MAX3238ICDWR MAX3238EI QFN RHB Reel of 2000 MAX3238EIRHBR Preview (1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Submit Documentation Feedback
www.ti.com MAX3238E 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH 15-kV ESD (HBM) PROTECTION SLLS710A FEBRUARY 2006 REVISED APRIL 2006 FUNCTION TABLES abc Each Driver (1) INPUTS OUTPUT DRIVER STATUS TIME ELAPSED SINCE LAST DOUT DIN FORCEON FORCEOFF RIN OR DIN TRANSITION X X L X Z Powered off L H H X H Normal operation with auto-powerdown plus disabled H H H X L L L H <30 s H Normal operation with auto-powerdown plus enabled H L H <30 s L L L H >30 s Z Powered off by auto-powerdown plus feature H L H >30 s Z (1) H high level, L low level, X irrelevant, Z high impedance Each Receiver (1) INPUTS OUTPUTS RECEIVER STATUS TIME ELAPSED SINCE LAST ROUT2 AND RIN1 RIN2 RIN3 FORCEOFF ROUT1B RIN OR DIN TRANSITION ROUT3 L X L X L Z Powered off while ROUT1B is active H X L X H Z L L H <30 s L H L H H <30 s L L Normal operation with H L H <30 s H H auto-powerdown plus disabled/enabled H H H <30 s H L Open Open H <30 s L H (1) H high level, L low level, X irrelevant, Z high impedance (off), Open input disconnected or connected driver off Submit Documentation Feedback
www.ti.com DIN3 DIN2 DIN1 DOUT3 DOUT2 DOUT1 Auto-powerdown Plus INVALID RIN1 RIN2 RIN3 FORCEOFF FORCEON ROUT1 ROUT1B ROUT2 ROUT3 DIN4 DOUT4 19 10 DIN5 DOUT517 12 MAX3238E 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH 15-kV ESD (HBM) PROTECTION SLLS710A FEBRUARY 2006 REVISED APRIL 2006 LOGIC DIAGRAM (POSITIVE LOGIC) Submit Documentation Feedback
www.ti.com Absolute Maximum Ratings (1) Recommended Operating Conditions (1) Electrical Characteristics (1) MAX3238E 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH 15-kV ESD (HBM) PROTECTION SLLS710A FEBRUARY 2006 REVISED APRIL 2006 over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT V CC Supply voltage range (2) 0.3 V Positive-output supply voltage range (2) 0.3 V V Negative-output supply voltage range (2) 0.3 V V Supply voltage difference (2) V Driver FORCEOFF FORCEON) 0.3 V I Input voltage range V Receiver Driver 13.2 13.2 V O Output voltage range V Receiver INVALID 0.3 V CC 0.3 DB package DW package θ JA Package thermal impedance (3) (4) C/W PW package RHB package TBD T J Operating virtual junction temperature 150 C T stg Storage temperature range 150 C (1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are with respect to network GND. (3) Maximum power dissipation is a function of T J (max), θ JA and T A The maximum allowable power dissipation at any allowable ambient temperature is P D J (max) T A θ JA Operating at the absolute maximum T J of 150 C can affect reliability. (4) The package thermal impedance is calculated in accordance with JESD 51-7. See Figure MIN NOM MAX UNIT V CC 3.3 V 3.3 3.6 Supply voltage V V CC V 4.5 5.5 V CC 3.3 V 5.5 DIN, FORCEOFF V IH Driver and control high-level input voltage V FORCEON V CC V 2.4 5.5 V IL Driver and control low-level input voltage DIN, FORCEOFF FORCEON 0.8 V V I Receiver input voltage V MAX3238EC T A Operating free-air temperature C MAX3238EI (1) Testing supply conditions are 0.1 µ F at V CC 3.3 V 0.15 0.22 µ F at V CC 3.3 V 0.3 and 0.047 µ F and 0.33 µ F at V CC V 0.5 over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure PARAMETER TEST CONDITIONS MIN TYP (2) MAX UNIT I I Input leakage current FORCEOFF FORCEON 0.01 µ A Auto-powerdown plus No load, 0.5 mA disabled FORCEOFF and FORCEON at V CC Supply current Powered off No load, FORCEOFF at GND I CC A No load, FORCEOFF at V CC µ A Auto-powerdown plus FORCEON at GND, enabled All RIN are open or grounded (1) Testing supply conditions are 0.1 µ F at V CC 3.3 V 0.15 0.22 µ F at V CC 3.3 V 0.3 and 0.047 µ F and 0.33 µ F at V CC V 0.5 (2) All typical values are at V CC 3.3 V or V CC and T A Submit Documentation Feedback
www.ti.com DRIVER SECTION Switching Characteristics (1) ESD Protection MAX3238E 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH 15-kV ESD (HBM) PROTECTION SLLS710A FEBRUARY 2006 REVISED APRIL 2006 xxx Electrical Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure PARAMETER TEST CONDITIONS MIN TYP (2) MAX UNIT V OH High-level output voltage All DOUT at R L k Ω to GND 5.4 V V OL Low-level output voltage All DOUT at R L k Ω to GND 5.4 V I IH High-level input current V I V CC 0.01 µ A I IL Low-level input current V I at GND 0.01 µ A V CC 3.6 V O V I OS Short-circuit output current (3) mA V CC 5.5 V O V 100 r o Output resistance V CC V+, and V V O V 300 10M Ω V O V CC V to 3.6 V I OZ Output leakage current FORCEOFF GND µ A V O V CC 4.5 V to 5.5 V (1) Testing supply conditions are 0.1 µ F at V CC 3.3 V 0.15 0.22 µ F at V CC 3.3 V 0.3 and 0.047 µ F and 0.33 µ F at V CC V 0.5 (2) All typical values are at V CC 3.3 V or V CC and T A (3) Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one output should be shorted at a time. over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure PARAMETER TEST CONDITIONS MIN TYP (2) MAX UNIT C L 1000 pF, R L k Ω Maximum data rate 250 400 kbit/s One DOUT switching, See Figure C L 150 pF to 2500 pF, R L k Ω to k Ω t sk(p) Pulse skew (3) 100 ns See Figure C L 150 pF to 1000 pF Slew rate, transition region V CC 3.3 SR(tr) µ s (see Figure R L k Ω to k Ω C L 150 pF to 2500 pF (1) Testing supply conditions are 0.1 µ F at V CC 3.3 V 0.15 0.22 µ F at V CC 3.3 V 0.3 and 0.047 µ F and 0.33 µ F at V CC V 0.5 (2) All typical values are at V CC 3.3 V or V CC and T A (3) Pulse skew is defined as PLH t PHL of each channel of the same device. PARAMETER TEST CONDITIONS TYP UNIT HBM DOUT IEC 61000-4-2, Air-Gap Discharge kV IEC 61000-4-2, Contact Discharge Submit Documentation Feedback
www.ti.com RECEIVER SECTION Switching Characteristics (1) ESD Protection MAX3238E 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH 15-kV ESD (HBM) PROTECTION SLLS710A FEBRUARY 2006 REVISED APRIL 2006 xxx Electrical Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure PARAMETER TEST CONDITIONS MIN TYP (2) MAX UNIT V OH High-level output voltage I OH mA V CC 0.6 V CC 0.1 V V OL Low-level output voltage I OL 1.6 mA 0.4 V V CC 3.3 V 1.5 2.4 V IT+ Positive-going input threshold voltage V V CC V 1.8 2.4 V CC 3.3 V 0.6 1.2 V IT Negative-going input threshold voltage V V CC V 0.8 1.5 V hys Input hysteresis IT+ V IT 0.3 V I OZ Output leakage current (except ROUT1B) FORCEOFF V 0.05 µ A r i Input resistance V I V to V k Ω (1) Testing supply conditions are 0.1 µ F at V CC 3.3 V 0.15 0.22 µ F at V CC 3.3 V 0.3 and 0.047 µ F and 0.33 µ F at V CC V 0.5 (2) All typical values are at V CC 3.3 V or V CC and T A over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS TYP (2) UNIT t PLH Propagation delay time, low- to high-level output C L 150 pF, See Figure 150 ns t PHL Propagation delay time, high- to low-level output C L 150 pF, See Figure 150 ns t en Output enable time C L 150 pF, R L k Ω See Figure 200 ns t dis Output disable time C L 150 pF, R L k Ω See Figure 200 ns t sk(p) Pulse skew (3) See Figure ns (1) Testing supply conditions are 0.1 µ F at V CC 3.3 V 0.15 0.22 µ F at V CC 3.3 V 0.3 and 0.047 µ F and 0.33 µ F at V CC V 0.5 (2) All typical values are at V CC 3.3 V or V CC and T A (3) Pulse skew is defined as PLH t PHL of each channel of the same device. PARAMETER TEST CONDITIONS TYP UNIT HBM RIN IEC 61000-4-2, Air-Gap Discharge kV IEC 61000-4-2, Contact Discharge Submit Documentation Feedback
www.ti.com AUTO-POWERDOWN PLUS SECTION Switching Characteristics MAX3238E 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH 15-kV ESD (HBM) PROTECTION SLLS710A FEBRUARY 2006 REVISED APRIL 2006 xxx Electrical Characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure PARAMETER TEST CONDITIONS MIN MAX UNIT Receiver input threshold V T+(valid) FORCEON GND, FORCEOFF V CC 2.7 V for INVALID high-level output voltage Receiver input threshold V T (valid) FORCEON GND, FORCEOFF V CC 2.7 V for INVALID high-level output voltage Receiver input threshold V T(invalid) FORCEON GND, FORCEOFF V CC 0.3 0.3 V for INVALID low-level output voltage I OH mA, FORCEON GND, V OH INVALID high-level output voltage V CC 0.6 V FORCEOFF V CC I OL 1.6 mA, FORCEON GND, V OL INVALID low-level output voltage 0.4 V FORCEOFF V CC over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure PARAMETER MIN TYP (1) MAX UNIT t valid Propagation delay time, low- to high-level output 0.1 µ s t invalid Propagation delay time, high- to low-level output µ s t en Supply enable time µ s t dis Receiver or driver edge to auto-powerdown plus s (1) All typical values are at V CC 3.3 V or V CC and T A Submit Documentation Feedback
www.ti.com PARAMETER MEASUREMENT INFORMATION 50 Ω TEST CIRCUIT VOLTAGE WAVEFORMS −3 V−3 V
3 V3 V
(see Note B) RL 3 V FORCEOFF RS-232 Output tTHLCL (see Note A) SR(tr) 6 V t THL or tTLH 50 Ω TEST CIRCUIT VOLTAGE WAVEFORMS 0 V 3 V Output Input VOL VOH tPLH Generator (see Note B) RL 3 V FORCEOFF RS-232 Output tPHLCL (see Note A) 50% 50% 1.5 V 1.5 V TEST CIRCUIT VOLTAGE WAVEFORMS 50 Ω −3 V 3 V Output Input VOL VOH tPHLGenerator (see Note B) tPLH Output CL (see Note A)
3 V or 0 V
1.5 V 1.5 V 50% 50% MAX3238E 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH 15-kV ESD (HBM) PROTECTION SLLS710A FEBRUARY 2006 REVISED APRIL 2006 C L includes probe and jig capacitance. The pulse generator has the following characteristics: PRR 250 kbit/s, Z O Ω 50% duty cycle, t r ns, t f ns. Figure Driver Slew Rate C L includes probe and jig capacitance. The pulse generator has the following characteristics: PRR 250 kbit/s, Z O Ω 50% duty cycle, t r ns, t f ns. Figure Driver Pulse Skew C L includes probe and jig capacitance. The pulse generator has the following characteristics: Z O Ω 50% duty cycle, t r ns, t f ns. Figure Receiver Propagation Delay Times Submit Documentation Feedback
www.ti.com TEST CIRCUIT 50 ΩGenerator (see Note B) (see Note A) Output VOLTAGE WAVEFORMS Output VOL VOH 3 V 0 V 0.3 V Output Input 0.3 V 1.5 V 1.5 V 50% tPHZ (S1 at GND) tPLZ (S1 at VCC) 50% tPZL (S1 at VCC) MAX3238E 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH 15-kV ESD (HBM) PROTECTION SLLS710A FEBRUARY 2006 REVISED APRIL 2006 PARAMETER MEASUREMENT INFORMATION (continued) C L includes probe and jig capacitance. The pulse generator has the following characteristics: Z O Ω 50% duty cycle, t r ns, t f ns. t PLZ and t PHZ are the same as t dis t PZL and t PZH are the same as t en Figure Receiver Enable and Disable Times Submit Documentation Feedback
www.ti.com TEST CIRCUIT 50 ΩGenerator (see Note B) FORCEOFF ROUT FORCEON Auto- powerdown Plus INVALID DOUTDIN CL = 30 pF (see Note A) 2.7 V −2.7 V 0.3 V −0.3 V 0 V Valid RS-232 Level, INVALID High Indeterminate Indeterminate If Signal Remains Within This Region For More Than 30 µs, INVALID Is Low† Valid RS-232 Level, INVALID High † Auto-powerdown plus disables drivers and reduces supply current to 1 µA. NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 5 kbit/s, ZO = 50 Ω , 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. −2.7 V Receiver Input −3 V 3 V
2.7 Vtvalid
3 V to 5 V
50%50% 0 V 0 V 0 V 50% 50% Driver Input ≈ 5.5 V Driver Output ≈ −5.5 V Supply Voltages tdis ten tdis ten V+ −0.3 V V− +0.3 V Voltage Waveforms and Timing Diagrams tinvalid MAX3238E 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH 15-kV ESD (HBM) PROTECTION SLLS710A FEBRUARY 2006 REVISED APRIL 2006 PARAMETER MEASUREMENT INFORMATION (continued) Figure INVALID Propagation-Delay Times and Supply-Enabling Time Submit Documentation Feedback
www.ti.com APPLICATION INFORMATION VCC C1 C2, C3, and C4 3.3 V ± 0.15 V 3.3 V ± 0.3 V 5 V ± 0.5 V 3 V to 5.5 V 0.1 µF 0.22 µF 0.047 µF 0.22 µF 0.1 µF 0.22 µF 0.33 µF 1 µF VCC vs CAPACITOR VALUES Auto- powerdown Plus − + CBYPASS = 0.1 µF C2+ GND C2− C1+ VCC C1− DIN1 DIN2 DIN3 ROUT1 ROUT2 DIN4 ROUT3 DIN5 ROUT1B INVALID DOUT1 DOUT2 DOUT3 RIN1 RIN2 DOUT4 RIN3 DOUT5 FORCEON FORCEOFF 5 kΩ 5 kΩ 5 kΩ ² C3 can be connected to VCC or GND. NOTES: A. Resistor values shown are nominal. B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be connected as shown. C3† Logic I/Os RS-232 Port MAX3238E 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH 15-kV ESD (HBM) PROTECTION SLLS710A FEBRUARY 2006 REVISED APRIL 2006 Figure Typical Operating Circuit and Capacitor Values Submit Documentation Feedback
www.ti.com 10-Jun-2014 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples MAX3238ECDB ACTIVE SSOP DB 28 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 MAX3238EC MAX3238ECDBR ACTIVE SSOP DB 28 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 MAX3238EC MAX3238ECDWR ACTIVE SOIC DW 28 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 MAX3238EC MAX3238ECPW ACTIVE TSSOP PW 28 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 MP238EC MAX3238ECPWR ACTIVE TSSOP PW 28 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 MP238EC MAX3238EIDB ACTIVE SSOP DB 28 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 MAX3238EI MAX3238EIDBG4 ACTIVE SSOP DB 28 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 MAX3238EI MAX3238EIDBR ACTIVE SSOP DB 28 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 MAX3238EI MAX3238EIDW ACTIVE SOIC DW 28 20 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 MAX3238EI MAX3238EIDWR ACTIVE SOIC DW 28 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 MAX3238EI MAX3238EIPW ACTIVE TSSOP PW 28 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 MP238EI MAX3238EIPWG4 ACTIVE TSSOP PW 28 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 MP238EI MAX3238EIPWR ACTIVE TSSOP PW 28 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 MP238EI MAX3238EIPWRG4 ACTIVE TSSOP PW 28 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 MP238EI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
www.ti.com 10-Jun-2014 Addendum-Page 2 (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 5-Feb-2013 Pack Materials-Page 1
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) MAX3238ECDBR SSOP DB 28 2000 367.0 367.0 38.0 MAX3238ECDWR SOIC DW 28 1000 367.0 367.0 55.0 MAX3238ECPWR TSSOP PW 28 2000 367.0 367.0 38.0 MAX3238EIDBR SSOP DB 28 2000 367.0 367.0 38.0 MAX3238EIDWR SOIC DW 28 1000 367.0 367.0 55.0 MAX3238EIPWR TSSOP PW 28 2000 367.0 367.0 38.0 PACKAGE MATERIALS INFORMATION www.ti.com 5-Feb-2013 Pack Materials-Page 2
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 4040065 /E 12/01
28 PINS SHOWN
8,20 7,40 0,55 0,95 0,25 12,90 12,30 10,50 8,50 Seating Plane 9,907,90 10,50 9,90 0,38 5,60 5,00 0,22 A 2016 6,506,50 0,05 MIN 5,905,90 DIM A MAX A MIN PINS ** 2,00 MAX 6,90 7,50 0,65 M0,15 0°–/C02578° 0,10 0,09 0,25 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-150
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic”are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2015, Texas Instruments Incorporated