MAX3232E_07 TI | Alldatasheet
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D, DB, DW, OR PW PACKAGE (TOP VIEW) C1+ C1− C2+ C2− DOUT2 RIN2 VCC GND DOUT1 RIN1 ROUT1 DIN1 DIN2 ROUT2 DESCRIPTION/ORDERING INFORMATION MAX3232E 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH 15-kV IEC ESD PROTECTION SLLS664A AUGUST 2005 REVISED APRIL 2007 Battery-Powered Systems ESD Protection for RS-232 Bus Pins PDAs kV (HBM) Notebooks kV (IEC61000-4-2, Contact Discharge) Laptops kV (IEC61000-4-2, Air-Gap Discharge) Palmtop PCs Meets or Exceeds the Requirements of Hand-Held Equipment TIA/EIA-232-F and ITU v.28 Standards Operates With 3-V to 5.5-V V CC Supply Operates up to 250 kbit/s Two Drivers and Two Receivers Low Supply Current 300 µ A Typ External Capacitors 0.1 µ F Accepts 5-V Logic Input With 3.3-V Supply Pin Compatible to Alternative High-Speed Device Mbit/s) SNx5C3232 ORDERING INFORMATION T A PACKAGE (1) (2) ORDERABLE PART NUMBER TOP-SIDE MARKING Tube of MAX3232ECD SOIC D MAX3232EC Reel of 2500 MAX3232ECDR Tube of MAX3232ECDW SOIC DW MAX3232EC Reel of 2000 MAX3232ECDWR C to C Tube of MAX3232ECDB SSOP DB MP232EC Reel of 2000 MAX3232ECDBR Tube of MAX3232ECPW TSSOP PW MP232EC Reel of 2000 MAX3232ECPWR Tube of MAX3232EID SOIC D MAX3232EI Reel of 2500 MAX3232EIDR Tube of MAX3232EIDW SOIC DW MAX3232EI Reel of 2000 MAX3232EIDWR C to C Tube of MAX3232EIDB SSOP DB MP232EI Reel of 2000 MAX3232EIDBR Tube of MAX3232EIPW TSSOP PW MP232EI Reel of 2000 MAX3232EIPWR (1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. (2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com Please be aware that an important notice concerning availability, standard warranty, and use in critical sheet. PRODUCTION DATA information is current as of publication date. Copyright 2005 2007, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
www.ti.com DESCRIPTION/ORDERING INFORMATION (CONTINUED) DIN1 DOUT1 RIN1ROUT1 DIN2 DOUT2 RIN2ROUT2 MAX3232E 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH 15-kV IEC ESD PROTECTION SLLS664A AUGUST 2005 REVISED APRIL 2007 The MAX3232E device consists of two line drivers, two line receivers, and a dual charge-pump circuit with 15-kV IEC ESD protection pin to pin (serial-port connection pins, including GND). The device meets the requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the serial-port connector. The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V supply. The devices operate at data signaling rates up to 250 kbit/s and a maximum of 30-V/ µ s driver output slew rate. FUNCTION TABLES ABC EACH DRIVER (1) INPUT OUTPUT DIN DOUT L H H L (1) H high level, L low level EACH RECEIVER (1) INPUT OUTPUT RIN ROUT L H H L Open H (1) H high level, L low level, Open input disconnected or connected driver off LOGIC DIAGRAM (POSITIVE LOGIC) Submit Documentation Feedback
www.ti.com Absolute Maximum Ratings (1) Recommended Operating Conditions (1) Electrical Characteristics (1) MAX3232E 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH 15-kV IEC ESD PROTECTION SLLS664A AUGUST 2005 REVISED APRIL 2007 over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT V CC Supply voltage range (2) 0.3 V V Positive output supply voltage range (2) 0.3 V V Negative output supply voltage range (2) 0.3 V V Supply voltage difference (2) V V Drivers 0.3 V V I Input voltage range Receivers V Drivers 13.2 13.2 V V O Output voltage range Receivers 0.3 V CC 0.3 V D package DB package θ JA Package thermal impedance (3) (4) C/W DW package PW package 108 T J Operating virtual junction temperature 150 C T stg Storage temperature range 150 C (1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are with respect to network GND. (3) Maximum power dissipation is a function of T J (max), θ JA and T A The maximum allowable power dissipation at any allowable ambient temperature is P D J (max) T A θ JA Operating at the absolute maximum T J of 150 C can affect reliability. (4) The package thermal impedance is calculated in accordance with JESD 51-7. See Figure MIN NO MAX UNIT M V CC 3.3 V 3.3 3.6 Supply voltage V V CC V 4.5 5.5 V CC 3.3 V 5.5 V IH Driver high-level input voltage DIN V V CC V 2.4 5.5 V IL Driver low-level input voltage DIN 0.8 V V I Receiver input voltage V MAX3232EC T A Operating free-air temperature C MAX3232EI (1) Test conditions are 0.1 µ F at V CC 3.3 V 0.3 0.047 µ 0.33 µ F at V CC V 0.5 over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure PARAMETER TEST CONDITIONS MIN TYP (2) MAX UNIT I CC Supply current No load, V CC 3.3 V or V 0.3 mA (1) Test conditions are 0.1 µ F at V CC 3.3 V 0.3 0.047 µ 0.33 µ F at V CC V 0.5 (2) All typical values are at V CC 3.3 V or V CC and T A Submit Documentation Feedback
www.ti.com DRIVER SECTION Electrical Characteristics (1) Switching Characteristics (1) MAX3232E 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH 15-kV IEC ESD PROTECTION SLLS664A AUGUST 2005 REVISED APRIL 2007 over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure PARAMETER TEST CONDITIONS MIN TYP (2) MAX UNIT V OH High-level output voltage DOUT at R L k Ω to GND, DIN GND 5.4 V V OL Low-level output voltage DOUT at R L k Ω to GND, DIN V CC 5.4 V I IH High-level input current V I V CC 0.01 µ A I IL Low-level input current V I at GND 0.01 µ A V CC 3.6 V O V I OS (3) Short-circuit output current mA V CC 5.5 V O V r O Output resistance V CC V+, and V V O V 300 10M Ω (1) Test conditions are 0.1 µ F at V CC 3.3 V 0.3 0.047 µ 0.33 µ F at V CC V 0.5 (2) All typical values are at V CC 3.3 V or V CC and T A (3) Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one output should be shorted at a time. over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure PARAMETER TEST CONDITIONS MIN TYP (2) MAX UNIT C L 1000 pF, R L k Ω Maximum data rate 150 250 kbit/s One DOUT switching, See Figure C L 150 pF to 2500 pF, R L k Ω to k Ω t sk(p) Pulse skew (3) 300 ns See Figure C L 150 pF to 1000 pF Slew rate, transition region R L k Ω to k Ω SR(tr) µ s (see Figure V CC 3.3 V C L 150 pF to 2500 pF (1) Test conditions are 0.1 µ F at V CC 3.3 V 0.3 0.047 µ 0.33 µ F at V CC V 0.5 (2) All typical values are at V CC 3.3 V or V CC and T A (3) Pulse skew is defined as PLH t PHL of each channel of the same device. Submit Documentation Feedback
www.ti.com RECEIVER SECTION Electrical Characteristics (1) Switching Characteristics (1) MAX3232E 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH 15-kV IEC ESD PROTECTION SLLS664A AUGUST 2005 REVISED APRIL 2007 over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure PARAMETER TEST CONDITIONS MIN TYP (2) MAX UNIT V OH High-level output voltage I OH mA V CC 0.6 V CC 0.1 V V OL Low-level output voltage I OL 1.6 mA 0.4 V V CC 3.3 V 1.5 2.4 V IT+ Positive-going input threshold voltage V V CC V 1.8 2.4 V CC 3.3 V 0.6 1.2 V IT Negative-going input threshold voltage V V CC V 0.8 1.5 V hys Input hysteresis IT+ V IT 0.3 V r i Input resistance V I V to V k Ω (1) Test conditions are 0.1 µ F at V CC 3.3 V 0.3 0.047 µ 0.33 µ F at V CC V 0.5 (2) All typical values are at V CC 3.3 V or V CC and T A over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure PARAMETER TEST CONDITIONS TYP (2) UNIT t PLH Propagation delay time, low- to high-level output 300 ns C L 150 pF t PHL Propagation delay time, high- to low-level output 300 ns t sk(p) Pulse skew (3) 300 ns (1) Test conditions are 0.1 µ F at V CC 3.3 V 0.3 0.047 µ 0.33 µ F at V CC V 0.5 (2) All typical values are at V CC 3.3 V or V CC and T A (3) Pulse skew is defined as PLH t PHL of each channel of the same device. Submit Documentation Feedback
www.ti.com PARAMETER MEASUREMENT INFORMATION 50 W TEST CIRCUIT VOLT AGE W AVEFORMS 0 V 3 V Output Input VOL VOH tTLH Generator (see Note B) R L RS-232 Output tTHLC L (see Note A) SR(tr)/C00436 V tTHL or tTLH NOTES: A. C L includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 W , 50% duty cycle, tr ≤/charBnZrBnZrBnZrBnZrBnZrBnZrBnZrBnZr10 ns, tf ≤ 10 ns. 1.5 V 1.5 V 3 V −3 V 3 V −3 V TEST CIRCUIT VOLT AGE W AVEFORMS 0 V 3 V Output Input VOL VOH tPLHtPHL 50% 50% NOTES: A. C L includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 W , 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. 1.5 V 1.5 V 50 W Generator (see Note B) R L RS-232 Output C L (see Note A) TEST CIRCUIT VOLT AGE W AVEFORMS 50 W 50%50% −3 V 3 V 1.5 V1.5 V Output Input VOL VOH tPHL Generator (see Note B) tPLH Output C L (see Note A) NOTES: A. C L includes probe and jig capacitance. B. The pulse generator has the following characteristics: ZO = 50 W , 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. MAX3232E 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH 15-kV IEC ESD PROTECTION SLLS664A AUGUST 2005 REVISED APRIL 2007 Figure Driver Slew Rate Figure Driver Pulse Skew Figure Receiver Propagation Delay Times Submit Documentation Feedback
www.ti.com APPLICATION INFORMATION ROUT2 DIN2 RIN1 DIN1 −C3 VCC C2+ C1+ GND C1− ROUT1 C2− C BYPASS = 0.1mF RIN2 C4 + VCC C1 C2, C3, C4 3.3 V ± 0.3 V 5 V ± 0.5 V 3 V to 5.5 V 0.1 mF 0.047 mF 0.1 mF 0.1 mF 0.33 mF 0.47 mF VCC vs CAPACITOR V ALUES DOUT1 DOUT2 ² C3 can be connected to VCC or GND. NOTES: A. Resistor values shown are nominal. B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be connected as shown. 5 kW 5 kW MAX3232E 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH 15-kV IEC ESD PROTECTION SLLS664A AUGUST 2005 REVISED APRIL 2007 Figure Typical Operating Circuit and Capacitor Values Submit Documentation Feedback
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Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) MAX3232ECD ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3232ECDB ACTIVE SSOP DB 16 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3232ECDBE4 ACTIVE SSOP DB 16 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3232ECDBR ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3232ECDBRE4 ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3232ECDE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3232ECDG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3232ECDR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3232ECDRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3232ECDRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3232ECDW ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3232ECDWR ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3232ECPW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3232ECPWE4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3232ECPWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3232ECPWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3232EID ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3232EIDB ACTIVE SSOP DB 16 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3232EIDBE4 ACTIVE SSOP DB 16 80 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3232EIDBR ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3232EIDBRE4 ACTIVE SSOP DB 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3232EIDE4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3232EIDG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3232EIDR ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3232EIDRE4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM PACKAGE OPTION ADDENDUM www.ti.com 23-Apr-2007 Addendum-Page 1
Orderable Device Status(1) Package Type Package Drawing Pins Package Qty Eco Plan(2) Lead/Ball FinishMSL Peak Temp (3) MAX3232EIDRG4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3232EIDW ACTIVE SOIC DW 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3232EIDWR ACTIVE SOIC DW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3232EIPW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3232EIPWE4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3232EIPWG4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3232EIPWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3232EIPWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM MAX3232EIPWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (1)The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2)Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontentfor the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS):TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br):TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. PACKAGE OPTION ADDENDUM www.ti.com 23-Apr-2007 Addendum-Page 2
PACKAGE MATERIALS INFORMATION www.ti.com 30-Apr-2007 Pack Materials-Page 1
Device Package Pins Site Reel Diameter (mm) Reel Width (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W (mm) Pin1 Quadrant MAX3232ECDBR DB 16 MLA 330 16 8.2 6.6 2.5 12 16 Q1 MAX3232ECDR D 16 MLA 330 16 6.5 10.3 12.1 2 16 Q1 MAX3232ECDWR DW 16 TAI 330 16 10.75 10.7 2.7 12 16 Q1 MAX3232ECPWR PW 16 MLA 330 12 7.0 5.6 1.6 8 12 Q1 MAX3232EIDBR DB 16 MLA 330 16 8.2 6.6 2.5 12 16 Q1 MAX3232EIDR D 16 MLA 330 16 6.5 10.3 12.1 2 16 Q1 MAX3232EIDWR DW 16 TAI 330 16 10.75 10.7 2.7 12 16 Q1 MAX3232EIPWR PW 16 MLA 330 12 7.0 5.6 1.6 8 12 Q1 TAPE AND REEL BOX INFORMATION Device Package Pins Site Length (mm) Width (mm) Height (mm) MAX3232ECDBR DB 16 MLA 333.2 333.2 28.58 MAX3232ECDR D 16 MLA 333.2 333.2 28.58 MAX3232ECDWR DW 16 TAI 346.0 346.0 33.0 MAX3232ECPWR PW 16 MLA 338.1 340.5 20.64 MAX3232EIDBR DB 16 MLA 333.2 333.2 28.58 MAX3232EIDR D 16 MLA 333.2 333.2 28.58 MAX3232EIDWR DW 16 TAI 346.0 346.0 33.0 MAX3232EIPWR PW 16 MLA 338.1 340.5 20.64 PACKAGE MATERIALS INFORMATION www.ti.com 30-Apr-2007 Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION www.ti.com 30-Apr-2007 Pack Materials-Page 3
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 4040065 /E 12/01
28 PINS SHOWN
8,20 7,40 0,55 0,95 0,25 12,90 12,30 10,50 8,50 Seating Plane 9,907,90 10,50 9,90 0,38 5,60 5,00 0,22 A 2016 6,506,50 0,05 MIN 5,905,90 DIM A MAX A MIN PINS ** 2,00 MAX 6,90 7,50 0,65 M0,15 0°–/C02578° 0,10 0,09 0,25 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-150
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,65 M0,10 0,10 0,25 0,50 0,75 0,15 NOM Gage Plane 9,80 9,60 7,90 7,70 2016 6,60 6,40 4040064/F 01/97 0,30 6,60 6,20 0,19 4,30 4,50 0,15 A 1,20 MAX 5,10 4,90 3,10 2,90 A MAX A MIN DIM PINS ** 0,05 4,90 5,10 Seating Plane 0°–8° NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. D. Falls within JEDEC MO-153
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