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Technical content
- All specifications are subject to change without notice. Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. Chip Beads For signal line MMZ series Type: Issue date: MMZ0402 0402[01005 inch]* MMZ0603 0603[0201 inch] MMZ1005 1005[0402 inch] MMZ1608 1608[0603 inch] MMZ2012 2012[0805 inch] MMZ0603-E 0603[0201 inch] MMZ1005-E 1005[0402 inch] * Dimensions Code JIS[EIA] March 2013
All specifications are subject to change without notice. (1/28) 002-01 / 20130301 / e9412_mmz Chip Beads For Signal Line MMZ Series MMZ0402
FEATURES
It is super small size(L0.4W0.2T0.2mm). It prevents radiated noise from high-speed signal lines. Maintain impedance to high frequency band. Because it adopts silver in internal electrode, it is low DC resistance. Because it is not generate of cross talk with closed magnetic cir- cuit structural design, high density assembly is possible. It is a product conforming to RoHS directive.
APPLICATIONS
Removal of signal line noises of cellular phones, portable audio players, various modules, etc. PRODUCT IDENTIFICATION (1) Series name (2) Dimensions LW (3) Type name (4) Impedance 121:120 at 100MHz (5) Characteristic type (6) Packaging style T: Taping (7) TDK internal code HANDLING AND PRECAUTIONS Before soldering, be sure to preheat components. The preheat- ing temperature should be set so that the temperature difference between the solder temperature and product temperature does not exceed 150°C. After mounting components onto the printed circuit board, do not apply stress through board bending or mishandling. Do not expose the inductors to stray magnetic fields. Avoid static electricity discharge during handling. SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD PATTERN SPECIFICATIONS PACKAGING STYLE AND QUANTITIES RECOMMENDED SOLDERING CONDITION REFLOW SOLDERING
ELECTRICAL CHARACTERISTICS
Test equipment: E4991A or equivalent Test tool: 16197 or equivalent Test temperature: 25±10°C Conformity to RoHS Directive MMZ 0402 S 121 C T Operating temperature range –55 to +125°C Storage temperature range –55 to +125°C(After mount) Packaging style Quantity Taping 20000 pieces/reel Part No. Impedance ()[100MHz] DC resistance ()max. Rated current (mA)max. MMZ0402S100C 10±5 0.10 500 MMZ0402S700C 70±25% 0.45 260 MMZ0402S121C 120±25% 0.70 210 MMZ0402S151C 150±25% 0.70 200 0.2±0.02 0.4±0.02 Dimensions in mm 0.2 0.15 to 0.20.15 to 0.2 0.18 to 0.2 Natural cooling 10s max. Preheating 60 to 120s Soldering 30 to 60s 230˚C 250 to 260˚C 180˚C 150˚C Time(s) Please contact our Sales office when your application is considered the following: The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.) Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
All specifications are subject to change without notice. (2/28) 002-01 / 20130301 / e9412_mmz TYPICAL ELECTRICAL CHARACTERISTICS Z FREQUENCY CHARACTERISTICS(DIFFERS ACCORDING TO SERIES) MMZ0402S SERIES Z, X, R vs. FREQUENCY CHARACTERISTICS MMZ0402S100C MMZ0402S700C MMZ0402S121C MMZ0402S151C PACKAGING STYLES REEL DIMENSIONS TAPE DIMENSIONS 100001000100101 Frequency(MHz) 300 250 150 200 100 Impedance(Ω) MMZ0402S151C MMZ0402S121C MMZ0402S700C MMZ0402S100C 100001000100101 Impedance(Ω) Frequency(MHz) 100 120 140 160 Z R X 100001000100101 Impedance(Ω) Frequency(MHz) Z R X 100001000100101 Frequency(MHz) 250 150 200 100 Impedance(Ω) Z R X 100001000100101 Impedance(Ω) Frequency(MHz) Z R X100 150 100 300 250 1.0 ø180±2.0 2.0±0.5 ø13±0.2 ø21±0.8 ø60min. 14.4max. Dimensions in mm 8.4 +2.0 –0.0 8.0±0.2 3.5±0.05 0.46±0.04 1.75±0.1 2.0±0.05 2.0± 0.05 Sprocket hole Cavity1.5 +0.1 –0.0 160min. Taping 200min. 300min.Drawing direction Dimensions in mm
All specifications are subject to change without notice. (3/28) 002-01 / 20130301 / e9412_mmz Chip Beads For Signal Line MMZ Series MMZ0603 This is a multilayered chip bead product with dimensions of L0.6W0.3T0.3mm. The product is magnetically shielded, allowing high density mounting. We refined the rules for internal conductor design to reduce floating capacity between conductors, which in turn has contributed to a dramatic improvement in high frequency characteristics. We have also been able to expand and reinforce the EMI suppression in the GHz range. It is a product conforming to RoHS directive. Removal of signal line noises of cellular phones, portable audio players, various modules, DSCs, portable game machines, etc. PRODUCT IDENTIFICATION (1) Series name (2) Dimensions LW (3) Type name (4) Impedance 121:120 at 100MHz (5) Characteristic type (6) Packaging style T:Taping (7) TDK internal code HANDLING AND PRECAUTIONS Before soldering, be sure to preheat components. The preheat- ing temperature should be set so that the temperature difference between the solder temperature and product temperature does not exceed 150°C. After mounting components onto the printed circuit board, do not apply stress through board bending or mishandling. Do not expose the inductors to stray magnetic fields. Avoid static electricity discharge during handling. When hand soldering, apply the soldering iron to the printed cir- cuit board only. Temperature of the iron tip should not exceed 350°C. Soldering time should not exceed 3 seconds. MATERIAL CHARACTERISTICS S material: Standard type that features impedance characteristics similar to those of a typical ferrite core. For signal line applications in which the blocking region is near 100MHz. Impedance values selected for effec- tiveness at 40 to 300MHz. Y material: High frequency range type intended for the 100MHz region and above. For signal line applications in which the signal fre- quency is far from the cutoff frequency. Impedance val- ues selected for effectiveness at 80 to 400MHz. D material: For applications calling for low insertion loss at low fre- quencies and sharply increasing impedance at high frequencies. Designed for high impedance at high fre- quencies (300MHz to 1GHz) for signal line applica- tions. F material: This new product inherits the characteristic of our D- material, namely its sharp impedance rise time, and its impedance peak frequency has been shifted higher into range. The product offers excellent noise suppres- sion from 600MHz to as high as in the GHz range. TYPICAL MATERIAL CHARACTERISTICS Conformity to RoHS Directive MMZ 0603 S 121 C T 200 400 600 800 1000 1200 1400 1600 1800 2000 10 100 1000 Frequency(MHz) Impedance(Ω) S D F Y Please contact our Sales office when your application is considered the following: The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.) Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
All specifications are subject to change without notice. (4/28) 002-01 / 20130301 / e9412_mmz SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD PATTERN SPECIFICATIONS PACKAGING STYLE AND QUANTITIES RECOMMENDED SOLDERING CONDITION REFLOW SOLDERING Test equipment: E4991A or equivalent Test tool: 16197 or equivalent Test temperature: 25±10°C TYPICAL ELECTRICAL CHARACTERISTICS Z FREQUENCY CHARACTERISTICS(DIFFERS ACCORDING TO SERIES) MMZ0603S SERIES MMZ0603Y SERIES MMZ0603D SERIES MMZ0603F SERIES Operating temperature range –55 to +125°C Storage temperature range –55 to +125°C(After mount) Packaging style Quantity Taping 15000 pieces/reel 0.3±0.03 0.6±0.03 0.1min. 0.3±0.03 Weight: 0.3mg Dimensions in mm 0.30 0.250.25 0.30 Natural cooling 10s max. Preheating 60 to 120s Soldering 30 to 60s 230˚C 250 to 260˚C 180˚C 150˚C Time(s) Part No. Impedance ()[100MHz] DC resistance ()max. Rated current (mA)max. MMZ0603S100C 10±5 0.09 500 MMZ0603S800C 80±25% 0.30 200 MMZ0603S121C 120±25% 0.45 200 MMZ0603S241C 240±25% 0.57 200 MMZ0603S471C 470±25% 1.30 100 MMZ0603S601C 600±25% 1.45 100 MMZ0603S102H 1000±25% 1.25 200 MMZ0603Y750C 75±25% 0.35 300 MMZ0603Y121C 120±25% 0.39 200 MMZ0603Y241C 240±25% 0.80 200 MMZ0603Y471C 470±25% 1.40 200 MMZ0603Y601C 600±25% 1.50 200 MMZ0603D330C 33±25% 0.70 200 MMZ0603D470C 47±25% 0.70 200 MMZ0603D560C 56±25% 0.95 100 MMZ0603D800C 80±25% 1.25 100 MMZ0603D121C 120±25% 1.40 100 MMZ0603F100C 10±5 0.50 200 MMZ0603F220C 22±25% 1.00 200 MMZ0603F330C 33±25% 1.30 150 200 400 600 800 1000 100001000100101 Frequency(MHz) Impedance(Ω) MMZ0603Y601C MMZ0603Y471C MMZ0603Y241C MMZ0603Y121C MMZ0603Y750C 100001000100101 Frequency(MHz) Impedance(Ω) 200 400 800 600 1000 1200 1400 MMZ0603S601C MMZ0603S102H MMZ0603S471C MMZ0603S241C MMZ0603S121C MMZ0603S800C MMZ0603S100C 100001000100101 Frequency(MHz) Impedance(Ω) 200 400 600 800 1000 MMZ0603D800C MMZ0603D121C MMZ0603D560C MMZ0603D330C MMZ0603D470C 100001000100101 Frequency(MHz) Impedance(Ω) 200 400 600 800 1000 1200 MMZ0603F330C MMZ0603F220C MMZ0603F100C
All specifications are subject to change without notice. (5/28) 002-01 / 20130301 / e9412_mmz TYPICAL ELECTRICAL CHARACTERISTICS Z, X, R vs. FREQUENCY CHARACTERISTICS MMZ0603S100C MMZ0603S800C MMZ0603S121C MMZ0603S241C MMZ0603S471C MMZ0603S601C MMZ0603S102H MMZ0603Y750C MMZ0603Y121C MMZ0603Y241C MMZ0603Y471C MMZ0603Y601C 01 10 100 1000 10000 Frequency(MHz) Impedance(Ω) 100 120 140 160 Z X R 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z X R 01 10 100 1000 10000 Frequency(MHz) Impedance(Ω) 100 150 200 250 Z X R 800 600 400 200 01 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z X R 1000 800 600 400 200 01 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z X R 450 400 350 300 250 200 150 100 01 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z X R 100 150 200 250Impedance(Ω) 1 10 100 1000 10000 Frequency(MHz) Z X R 01 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z X R 200 100 120 140 160 180 01 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z X R 200 400 600 800 1000 1200 1400 1 10 100 1000 10000 Frequency(MHz) 200 400 600 800 1000Impedance(Ω) Z X R 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) 100 200 300 400 500 600 700 800 900 Z X R 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) 100 200 300 400 500 600 Z X R
All specifications are subject to change without notice. (6/28) 002-01 / 20130301 / e9412_mmz TYPICAL ELECTRICAL CHARACTERISTICS Z, X, R vs. FREQUENCY CHARACTERISTICS MMZ0603D330C MMZ0603D470C MMZ0603D560C MMZ0603D800C MMZ0603D121C MMZ0603F100C MMZ0603F220C MMZ0603F330C PACKAGING STYLES REEL DIMENSIONS TAPE DIMENSIONS 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) 100 200 300 400 500 600 700 Z X R 1 10 100 1000 10000 Frequency(MHz) 100 200 300 400 500Impedance(Ω) Z X R 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z X R 100 150 200 250 300 350 400 450 500 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z X R 100 150 200 250 300 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) 100 200 300 400 500 600 700 800 900 Z X R 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z X R 100 200 300 400 500 600 700 800 900 1000 1 10 100 1000 10000 Frequency(MHz) 100 200 300 400 500 600 700Impedance(Ω) Z X R 1 10 100 1000 10000 Frequency(MHz) 200 400 600 800 1000 1200Impedance(Ω) Z X R 1.0 ø180±2.0 2.0±0.5 ø13±0.2 ø21±0.8 ø60min. 14.4max. Dimensions in mm 8.4 +2.0 –0.0 8.0±0.3 3.5±0.05 1.75±0.1 4.0±0.1 2.0±0.05 2.0± 0.05 Sprocket hole Cavity1.5 +0.1 –0.0 0.5max. 0.38± 0.05 0.68±0.05 160min. Taping 200min. 300min.Drawing direction Dimensions in mm
All specifications are subject to change without notice. (7/28) 002-01 / 20130301 / e9412_mmz Chip Beads For Signal Line MMZ Series MMZ1005 Size standardized for use by automatic assembly equipment. No preferred orientation. Electroplated terminal electrodes accommodate reflow soldering. High reliability due to an entirely monolithic structure. Closed magnetic circuit structure allows high-density installation while preventing crosstalk between circuits. Low DC resistance structure of electrode prevents wasteful electric power consumption. It is a product conforming to RoHS directive. Removal of signal line noises of cellular phones, PCs, note PCs, TVs, TV tuners, STBs, audio players, DVDs, DSCs, DVCs, game machines, digital photo frames, car navigation system, PNDs, etc. PRODUCT IDENTIFICATION (1) Series name (2) Dimensions LW (3) Type name (4) Impedance 121:120 at 100MHz (5) Characteristic type (6) Packaging style T:Taping (7) TDK internal code HANDLING AND PRECAUTIONS Before soldering, be sure to preheat components. The preheat- ing temperature should be set so that the temperature difference between the solder temperature and product temperature does not exceed 150°C. After mounting components onto the printed circuit board, do not apply stress through board bending or mishandling. Do not expose the inductors to stray magnetic fields. Avoid static electricity discharge during handling. When hand soldering, apply the soldering iron to the printed cir- cuit board only. Temperature of the iron tip should not exceed 350°C. Soldering time should not exceed 3 seconds. MATERIAL CHARACTERISTICS B material: This type is perfectly suited for fast digital signals. By equalizing R components and X components that beads possess at a frequency of 5MHz, it is able to suppress overshooting, undershooting and ringing of fast digital signals. S material: Standard type that features impedance characteristics similar to those of a typical ferrite core. For signal line applications in which the blocking region is near 100MHz. Impedance values selected for effec- tiveness at 40 to 300MHz. Y material: High frequency range type intended for the 100MHz region and above. For signal line applications in which the signal fre- quency is far from the cutoff frequency. Impedance val- ues selected for effectiveness at 80 to 400MHz. D material: For applications calling for low insertion loss at low fre- quencies and sharply increasing impedance at high frequencies. Designed for high impedance at high fre- quencies (300MHz to 1GHz) for signal line applica- tions. F material: This new product inherits the characteristic of our D- material, namely its sharp impedance rise time, and its impedance peak frequency has been shifted higher into range. The product offers excellent noise suppres- sion from 600MHz to as high as in the GHz range. TYPICAL MATERIAL CHARACTERISTICS Conformity to RoHS Directive MMZ 1005 S 121 C T B S D Y 200 400 600 800 1000 1200 1400 1600 1800 2000 10 100 1000 Frequency(MHz) Impedance(Ω) F Please contact our Sales office when your application is considered the following: The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.) Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
All specifications are subject to change without notice. (8/28) 002-01 / 20130301 / e9412_mmz SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD PATTERN SPECIFICATIONS PACKAGING STYLE AND QUANTITIES RECOMMENDED SOLDERING CONDITION REFLOW SOLDERING ELECTRICAL CHARCTERISTICS Test equipment: E4991A or equivalent Test tool: 16192A or equivalent Test temperature: 25±10°C TYPICAL ELECTRICAL CHARACTERISTICS Z FREQUENCY CHARACTERISTICS(DIFFERS ACCORDING TO SERIES) MMZ1005B SERIES MMZ1005S SERIES MMZ1005Y SERIES MMZ1005D SERIES MMZ1005F SERIES Operating temperature range –55 to +125°C Storage temperature range –55 to +125°C(After mount) Packaging style Quantity Taping 10000 pieces/reel 0.1min. 0.5±0.05 1±0.05 0.5±0.05 0.40.5 0.5 0.5 Weight: 1mg Dimensions in mm Natural cooling 10s max. Preheating 60 to 120s Soldering 30 to 60s 230˚C 250 to 260˚C 180˚C 150˚C Time(s) Part No. Impedance ()[100MHz] DC resistance ()max. Rated current (mA)max. MMZ1005B800C 80±25% 0.19 450 MMZ1005B121C 120±25% 0.25 400 MMZ1005B601C 600±25% 0.85 200 MMZ1005S800C 80±25% 0.12 500 MMZ1005S121C 120±25% 0.22 500 MMZ1005S241C 240±25% 0.28 400 MMZ1005S601C 600±25% 0.52 300 MMZ1005S102C 1000±25% 0.75 200 MMZ1005Y400C 40±25% 0.10 550 MMZ1005Y800C 80±25% 0.17 450 MMZ1005Y121C 120±25% 0.18 400 MMZ1005Y241C 240±25% 0.26 300 MMZ1005Y301C 300±25% 0.38 250 MMZ1005Y471C 470±25% 0.47 250 MMZ1005Y601C 600±25% 0.54 250 MMZ1005Y102C 1000±25% 0.70 200 MMZ1005Y152C 1500±25% 1.00 100 MMZ1005D100C 10±5 0.10 500 MMZ1005D220C 22±25% 0.17 400 MMZ1005D330C 33±25% 0.24 400 MMZ1005D680C 68±25% 0.38 400 MMZ1005D121C 120±25% 0.60 350 MMZ1005D241C 240±25% 0.90 200 MMZ1005F330C 33±25% 0.50 200 MMZ1005F470C 47±25% 0.60 100 MMZ1005F560C 56±25% 0.70 100 100001000100101 Frequency(MHz) Impedance(Ω) 200 400 600 800 1000 1200 1400 1600 1800 MMZ1005Y152C MMZ1005Y102C MMZ1005Y601C MMZ1005Y471C MMZ1005Y301C MMZ1005Y241C MMZ1005Y121C MMZ1005Y800C MMZ1005Y400C 100001000100101 Frequency(MHz) Impedance(Ω) 100 200 300 400 500 600 700 800 MMZ1005B601C MMZ1005B121C MMZ1005B800C 100001000100101 Frequency(MHz) Impedance(Ω) 200 400 600 800 1000 1200 1400 MMZ1005S102C MMZ1005S601C MMZ1005S241C MMZ1005S121C MMZ1005S800C 100001000100101 Frequency(MHz) Impedance(Ω) 500 1000 1500 2000 2500 3000 MMZ1005D241C MMZ1005D121C MMZ1005D680C MMZ1005D330C MMZ1005D220C MMZ1005D100C 100001000100101 Frequency(MHz) Impedance(Ω) 200 400 600 800 1000 1200 MMZ1005F560C MMZ1005F470C MMZ1005F330C
All specifications are subject to change without notice. (9/28) 002-01 / 20130301 / e9412_mmz TYPICAL ELECTRICAL CHARACTERISTICS Z, X, R vs. FREQUENCY CHARACTERISTICS MMZ1005B800C MMZ1005B121C MMZ1005B601C MMZ1005S800C MMZ1005S121C MMZ1005S241C MMZ1005S601C MMZ1005S102C MMZ1005Y400C MMZ1005Y800C MMZ1005Y121C 800 700 600 500 400 300 200 100 01 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z R X 120 100 01 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z R X 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) 100 120 140 160 180 Z R X 400 350 300 250 200 150 100 01 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z R X 01 10 100 1000 10000 Frequency(MHz) Impedance(Ω) 100 120 140 160 Z R X 01 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z R X 100 150 200 250 01 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z R X100 200 300 400 500 600 700 800 900 01 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z X R 200 400 600 800 1000 1200 1400 01 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z R X50 100 150 200 250 01 10 100 1000 10000 Frequency(MHz) Impedance(Ω) 100 120 140 160 Z R X 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z R X
All specifications are subject to change without notice. (10/28) 002-01 / 20130301 / e9412_mmz TYPICAL ELECTRICAL CHARACTERISTICS Z, X, R vs. FREQUENCY CHARACTERISTICS MMZ1005Y241C MMZ1005Y301C MMZ1005Y471C MMZ1005Y601C MMZ1005Y102C MMZ1005Y152C MMZ1005D100C MMZ1005D220C MMZ1005D330C MMZ1005D680C MMZ1005D121C MMZ1005D241C 800 700 600 500 400 300 200 100 01 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z R X 01 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z R X 100 200 300 400 500 600 01 10 100 1000 10000 Frequency(MHz) Impedance(Ω) 100 200 300 400 500 Z R X 1800 1600 1400 1200 1000 800 600 400 200 01 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z R X 200 400 600 800 1000 1200 1400 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z R X 01 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z R X200 400 600 800 1000 1200 01 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z R X 100 150 200 250 300 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) 100 150 200 R X Z 01 10 100 1000 10000 Frequency(MHz) Impedance(Ω) R X Z 3000 2500 2000 1500 1000 500 01 10 100 1000 10000 Frequency(MHz) Z, X, R(Ω) R X Z 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) 200 400 600 800 1000 R X Z 100 200 300 400 500 600 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z R X
All specifications are subject to change without notice. (11/28) 002-01 / 20130301 / e9412_mmz TYPICAL ELECTRICAL CHARACTERISTICS Z, X, R vs. FREQUENCY CHARACTERISTICS MMZ1005F330C MMZ1005F470C MMZ1005F560C PACKAGING STYLES REEL DIMENSIONS TAPE DIMENSIONS 1200 1000 800 600 400 200 01 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z X R 1000 900 800 700 600 500 400 300 200 100 01 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z X R 01 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z XR 100 200 300 400 500 600 700 1.0 ø180±2.0 2.0±0.5 ø13±0.2 ø21±0.8 ø60min. 14.4max. Dimensions in mm 8.4 +2.0 –0.0 1.15±0.1 0.8max. 0.65± 0.1 8.0±0.3 3.5±0.05 1.75±0.1 4.0±0.1 2.0±0.05 2.0± 0.05 Sprocket hole Cavity1.5 +0.1 –0.0 160min. Taping 200min. 300min.Drawing direction Dimensions in mm
All specifications are subject to change without notice. (12/28) 002-01 / 20130301 / e9412_mmz Chip Beads For Signal Line MMZ Series MMZ1608 Chip bead(impeder), MMZ series offers 8 construction materials. Size standardized for use by automatic assembly equipment. No preferred orientation. Either flow or reflow soldering methods can be used due to electroplating of the terminal electrodes. High reliability due to an entirely monolithic structure. Closed magnetic circuit structure allows high-density installation while preventing crosstalk between circuits. Low DC resistance structure of electrode prevents wasteful electric power consumption. The products contain no lead and also support lead-free soldering. It is a product conforming to RoHS directive. Removal of signal line noises of cellular phones, PCs, note PCs, TVs, TV tuners, STBs, audio players, DVDs, DSCs, DVCs, game machines, digital photo frames, car navigation system, PNDs, etc. PRODUCT IDENTIFICATION (1) Series name (2) Dimensions LW (3) Type name (4) Impedance 121:120 at 100MHz (5) Characteristic type (6) Packaging style T:Taping (7) TDK internal code HANDLING AND PRECAUTIONS Before soldering, be sure to preheat components. The preheat- ing temperature should be set so that the temperature difference between the solder temperature and product temperature does not exceed 150°C. After mounting components onto the printed circuit board, do not apply stress through board bending or mishandling. Do not expose the inductors to stray magnetic fields. Avoid static electricity discharge during handling. When hand soldering, apply the soldering iron to the printed cir- cuit board only. Temperature of the iron tip should not exceed 350°C. Soldering time should not exceed 3 seconds. SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD PATTERN SPECIFICATIONS PACKAGING STYLE AND QUANTITIES RECOMMENDED SOLDERING CONDITION REFLOW SOLDERING Conformity to RoHS Directive MMZ 1608 R 121 A T Operating temperature range –55 to +125°C Storage temperature range –55 to +125°C(After mount) Packaging style Quantity Taping 4000 pieces/reel 0.8±0.15T 0.3±0.2 1.6±0.15 0.80.6 0.6 0.8 Dimensions in mm Thickness(T) Weight 0.6±0.15mm 0.8±0.15mm 3mg 4mg Natural cooling 10s max. Preheating 60 to 120s Soldering 30 to 60s 230˚C 250 to 260˚C 180˚C 150˚C Time(s) Please contact our Sales office when your application is considered the following: The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.) Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
All specifications are subject to change without notice. (13/28) 002-01 / 20130301 / e9412_mmz MATERIAL CHARACTERISTICS B material: This type is perfectly suited for fast digital signals. By equalizing R components and X components that beads possess at a frequency of 5MHz, it is able to suppress overshooting, undershooting and ringing of fast digital signals. R material: For wide frequency applications calling for broad impedance characteristics. For digital signal line applications calling requiring good waveform integrity. Impedance values selected for effectiveness at 10 to 200MHz. S material: Standard type that features impedance characteristics similar to those of a typical ferrite core. For signal line applications in which the blocking region is near 100MHz. Impedance values selected for effectiveness at 40 to 300MHz. Y material: High frequency range type intended for the 100MHz region and above. For signal line applications in which the signal frequency is far from the cutoff frequency. Impedance values selected for effectiveness at 80 to 400MHz. A material: This high-impedance product is based on the impedance frequency characteristics of our Y -material. The product offers excellent impedance characteristics, which is greater than 2500, in the vicinity of 100MHz range (MMZ1608A252B). Q material:For high-band applications designed for 100MHz and above. Impedance values selected for effectiveness at 100 to 800MHz. D material: For applications calling for low insertion loss at low frequencies and sharply increasing impedance at high frequencies. Designed for high impedance at high frequencies (300MHz to 1GHz) for signal line applications. F material: This new product inherits the characteristic of our D-material, namely its sharp impedance rise time, and its impedance peak frequency has been shifted higher into range. The product offers excellent noise suppression from 600MHz to as high as in the GHz range. TYPICAL MATERIAL CHARACTERISTICS Test equipment: E4991A or equivalent Test tool: 16192A or equivalent Test temperature: 25±10°C 500 1000 1500 2000 2500 10 100 1000 Frequency(MHz) Impedance(Ω) B R S A Y Q D F Part No. Impedance () [100MHz] DC resistance ()max. Rated current (mA)max. Product’s thickness T(mm) MMZ1608B121C 120±25% 0.15 600 0.6 MMZ1608B221C 220±25% 0.25 500 0.6 MMZ1608B301C 300±25% 0.25 500 0.6 MMZ1608B471C 470±25% 0.30 500 0.6 MMZ1608B601C 600±25% 0.40 500 0.6 MMZ1608B102C 1000±25% 0.60 300 0.8 MMZ1608R150A 15±25% 0.05 1500 0.8 MMZ1608R300A 30±25% 0.05 1500 0.8 MMZ1608R600A 60±25% 0.10 800 0.8 MMZ1608R121A 120±25% 0.18 500 0.8 MMZ1608R301A 300±25% 0.25 500 0.8 MMZ1608R471A 470±25% 0.30 500 0.8 MMZ1608R601A 600±25% 0.40 500 0.8 MMZ1608R102A 1000±25% 0.50 400 0.8 MMZ1608S400A 40±25% 0.10 600 0.8 MMZ1608S800A 80±25% 0.15 500 0.8 MMZ1608S121A 120±25% 0.15 500 0.8 MMZ1608S181A 180±25% 0.20 500 0.8 MMZ1608S221A 220±25% 0.20 500 0.8 MMZ1608S301A 300±25% 0.30 500 0.8 MMZ1608S471A 470±25% 0.30 500 0.8 MMZ1608S601A 600±25% 0.35 500 0.8 MMZ1608S102A 1000±25% 0.50 400 0.8 MMZ1608S202A 2000±25% 0.90 200 0.8 MMZ1608Y150B 15±25% 0.05 1500 0.8 MMZ1608Y300B 30±25% 0.05 1500 0.8 MMZ1608Y600B 60±25% 0.15 500 0.8 MMZ1608Y121B 120±25% 0.20 500 0.8 MMZ1608Y221B 220±25% 0.30 500 0.8 MMZ1608Y301B 300±25% 0.30 500 0.8 MMZ1608Y471B 470±25% 0.35 500 0.8 MMZ1608Y601B 600±25% 0.40 500 0.8 MMZ1608Y751B 750±25% 0.45 500 0.8 MMZ1608Y102B 1000±25% 0.50 400 0.8 MMZ1608Y152B 1500±25% 0.60 300 0.8 MMZ1608A182B 1800±25% 0.80 200 0.8 MMZ1608A222B 2200±25% 0.80 200 0.8 MMZ1608A252B 2500±25% 0.80 200 0.8 MMZ1608Q121B 120±25% 0.30 500 0.8 MMZ1608Q221B 220±25% 0.40 500 0.8 MMZ1608Q331B 330±25% 0.50 400 0.8 MMZ1608Q471B 470±25% 0.70 300 0.8 MMZ1608Q601B 600±25% 0.80 200 0.8 MMZ1608Q102B 1000±25% 1.00 200 0.8 MMZ1608D050C 5±2 0.05 700 0.8 MMZ1608D100C 10±5 0.10 500 0.6 MMZ1608D220C 22±25% 0.20 500 0.6 MMZ1608D500C 50±25% 0.25 500 0.6 MMZ1608D800C 80±25% 0.30 500 0.6 MMZ1608D800B 80±25% 0.30 500 0.8 MMZ1608D121C 120±25% 0.30 400 0.6 MMZ1608D121B 120±25% 0.30 400 0.8 MMZ1608D241C 240±25% 0.60 300 0.8 MMZ1608D301B 300±25% 0.70 300 0.8 MMZ1608F030B 3typ. 0.05 700 0.8 MMZ1608F470B 47±25% 0.40 500 0.8 MMZ1608F750B 75±25% 0.55 300 0.8 MMZ1608F121B 120±25% 0.75 200 0.8
All specifications are subject to change without notice. (14/28) 002-01 / 20130301 / e9412_mmz TYPICAL ELECTRICAL CHARACTERISTICS Z, X, R vs. FREQUENCY CHARACTERISTICS MMZ1608B121C MMZ1608B221C MMZ1608B301C MMZ1608B471C MMZ1608B601C MMZ1608B102C MMZ1608R150A MMZ1608R300A MMZ1608R600A MMZ1608R121A MMZ1608R301A MMZ1608R471A 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z R X 100 120 140 160 01 10 100 1000 10000 Frequency(MHz) Impedance(Ω) 100 150 200 250 300 350 Z R X 100 150 200 250 300 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z R X 700 600 500 400 300 200 100 01 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z R X 100 200 300 400 500 600 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z R X 200 400 600 800 1000 1200 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z R X 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z R X 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z R X 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z R X 01 10 100 1000 10000 Frequency(MHz) Impedance(Ω) 100 120 140 Z R X 01 10 100 1000 10000 Frequency(MHz) Impedance(Ω) 100 150 200 250 300 350 Z R X 100 200 300 400 500 600 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z R X
All specifications are subject to change without notice. (15/28) 002-01 / 20130301 / e9412_mmz TYPICAL ELECTRICAL CHARACTERISTICS Z, X, R vs. FREQUENCY CHARACTERISTICS MMZ1608R601A MMZ1608R102A MMZ1608S400A MMZ1608S800A MMZ1608S121A MMZ1608S181A MMZ1608S221A MMZ1608S301A MMZ1608S471A MMZ1608S601A MMZ1608S102A MMZ1608S202A 1 10 100 1000 10000 Frequency(MHz) 1200 1000 800 600 400 200 Impedance(Ω) Z R X 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z R X 01 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z R X 100 200 300 400 500 600 700 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) 100 120 140 160 180 Z R X 10 100 1000 10000 Frequency(MHz) Impedance(Ω) 100 150 200 250 300 RZ X 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z R X 100 120 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) 100 150 200 250 300 350 400 450 Z R X 100 150 200 250 300 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z R X 100 200 300 400 500 600 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z R X 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) 100 200 300 400 500 600 700 X Z R 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) 200 400 600 800 1000 1200 1400 Z R X 01 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z R X500 1000 1500 2000 2500 3000
All specifications are subject to change without notice. (16/28) 002-01 / 20130301 / e9412_mmz TYPICAL ELECTRICAL CHARACTERISTICS Z, X, R vs. FREQUENCY CHARACTERISTICS MMZ1608Y150B MMZ1608Y300B MMZ1608Y600B MMZ1608Y121B MMZ1608Y221B MMZ1608Y301B MMZ1608Y471B MMZ1608Y601B MMZ1608Y751B MMZ1608Y102B MMZ1608Y152B 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z R X 120 100 01 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z R X 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z R X 100 200 300 400 500 600 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z R X 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z R X 100 150 200 250 100 150 200 250 300 350 400 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z R X 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) 100 200 300 400 500 600 700 800 900 Z R X 100 200 300 400 500 600 700 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z R X 200 400 600 800 1000 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z R X 01 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z R X 200 400 600 800 1000 1200 1400 1600 1800 200 400 600 800 1000 1200 1400 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z R X
All specifications are subject to change without notice. (17/28) 002-01 / 20130301 / e9412_mmz TYPICAL ELECTRICAL CHARACTERISTICS Z, X, R vs. FREQUENCY CHARACTERISTICS MMZ1608A182B MMZ1608A222B MMZ1608A252B MMZ1608Q121B MMZ1608Q221B MMZ1608Q331B MMZ1608Q471B MMZ1608Q601B MMZ1608Q102B MMZ1608D050C MMZ1608D100C MMZ1608D220C 01 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z R X 500 1000 1500 2000 2500 3000 500 1000 1500 2000 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z R X 500 1000 1500 2000 2500 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z R X 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z R X 100 200 300 400 500 600 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) 100 150 200 250 300 350 Z R X 100 200 300 400 500 600 700 800 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z R X 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z R X 500 1000 1500 2000 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z R X 200 400 600 800 1000 1200 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z R X 200 400 600 800 1000 1200 1400 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z R X20 100 120 140 160 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z R X 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z R X
All specifications are subject to change without notice. (18/28) 002-01 / 20130301 / e9412_mmz TYPICAL ELECTRICAL CHARACTERISTICS Z, X, R vs. FREQUENCY CHARACTERISTICS MMZ1608D500C MMZ1608D800C MMZ1608D800B MMZ1608D121C MMZ1608D121B MMZ1608D241C MMZ1608D301B MMZ1608F030B MMZ1608F470B MMZ1608F750B MMZ1608F121B 600 200 100 300 400 500 01 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z R X 1 10 100 1000 10000 Frequency(MHz) 400 200 100 300 Impedance(Ω) Z R X 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) 100 200 300 400 500 600 Z R X 800 700 600 500 400 300 200 100 01 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z R X 1 10 100 1000 10000 Frequency(MHz) 800 700 600 500 400 300 200 100 Impedance(Ω) Z X R 1200 1000 800 600 400 200 Impedance(Ω) 1 10 100 1000 10000 Frequency(MHz) Z X R 1 10 100 1000 10000 Frequency(MHz) 3000 2500 2000 1500 1000 500 Impedance(Ω) Z X R 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z R X 01 10 100 1000 10000 Frequency(MHz) Impedance(Ω) 100 200 300 400 500 600 700 800 900 Z R X 500 1000 1500 2000 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z R X 0 1000 2000 3000 4000 5000 6000 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z R X
All specifications are subject to change without notice. (19/28) 002-01 / 20130301 / e9412_mmz PACKAGING STYLES REEL DIMENSIONS TAPE DIMENSIONS 1.0 ø180±2.0 2.0±0.5 ø13±0.2 ø21±0.8 ø60min. 14.4max. Dimensions in mm 8.4 +2.0 –0.0 8.0±0.3 3.5±0.05 1.9±0.2 1.75±0.1 2.0±0.05 1.5 +0.1 –0.0Sprocket hole Cavity 160min. Taping 200min. 300min.Drawing direction Dimensions in mm
All specifications are subject to change without notice. (20/28) 002-01 / 20130301 / e9412_mmz Chip Beads For Signal Line MMZ Series MMZ2012 Chip bead(impeder), MMZ series offers 4 construction materials. Size standardized for use by automatic assembly equipment. No preferred orientation. Either flow or reflow soldering methods can be used due to electroplating of the terminal electrodes. High reliability due to an entirely monolithic structure. Closed magnetic circuit structure allows high-density installation while preventing crosstalk between circuits. Low DC resistance structure of electrode prevents wasteful electric power consumption. The products contain no lead and also support lead-free soldering. It is a product conforming to RoHS directive. Removal of signal line noises of cellular phones, PCs, note PCs, TVs, TV tuners, STBs, audio players, DVDs, DSCs, DVCs, game machines, digital photo frames, car navigation system, PNDs, etc. PRODUCT IDENTIFICATION (1) Series name (2) Dimensions LW (3) Type name (4) Impedance 121:120 at 100MHz (5) Characteristic type (6) Packaging style T:Taping (7) TDK internal code HANDLING AND PRECAUTIONS Before soldering, be sure to preheat components. The preheat- ing temperature should be set so that the temperature difference between the solder temperature and product temperature does not exceed 150°C. After mounting components onto the printed circuit board, do not apply stress through board bending or mishandling. Do not expose the inductors to stray magnetic fields. Avoid static electricity discharge during handling. When hand soldering, apply the soldering iron to the printed cir- cuit board only. Temperature of the iron tip should not exceed 350°C. Soldering time should not exceed 3 seconds. MATERIAL CHARACTERISTICS R material: For wide frequency applications calling for broad impedance characteristics. For digital signal line applications calling requiring good waveform integrity. Impedance values selected for effectiveness at 10 to 200MHz. S material: Standard type that features impedance characteristics similar to those of a typical ferrite core. For signal line applications in which the blocking region is near 100MHz. Impedance values selected for effec- tiveness at 40 to 300MHz. Y material: High frequency range type intended for the 100MHz region and above. For signal line applications in which the signal fre- quency is far from the cutoff frequency. Impedance val- ues selected for effectiveness at 80 to 400MHz. D material: For applications calling for low insertion loss at low fre- quencies and sharply increasing impedance at high frequencies. Designed for high impedance at high fre- quencies (200 to 500MHz) for signal line applications. TYPICAL MATERIAL CHARACTERISTICS Conformity to RoHS Directive MMZ 2012 R 121 A T 500 1000 1500 2000 2500 10 100 1000 Frequency(MHz) Impedance(Ω) R S D Y Please contact our Sales office when your application is considered the following: The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.) Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
All specifications are subject to change without notice. (21/28) 002-01 / 20130301 / e9412_mmz SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD PATTERN SPECIFICATIONS PACKAGING STYLE AND QUANTITIES RECOMMENDED SOLDERING CONDITION REFLOW SOLDERING Test equipment: E4991A or equivalent Test tool: 16192A or equivalent Test temperature: 25±10°C TYPICAL ELECTRICAL CHARACTERISTICS Z, X, R vs. FREQUENCY CHARACTERISTICS MMZ2012R150A MMZ2012R300A MMZ2012R600A MMZ2012R121A MMZ2012R301A MMZ2012R601A Operating temperature range –55 to +125°C Storage temperature range –55 to +125°C(After mount) Packaging style Quantity Taping 4000 pieces/reel 0.5±0.3 1.25±0.20.85±0.2 Weight: 8mg Dimensions in mm 2±0.2 10.8 0.8 1.2 Natural cooling 10s max. Preheating 60 to 120s Soldering 30 to 60s 230˚C 250 to 260˚C 180˚C 150˚C Time(s) Part No. Impedance ()[100MHz] DC resistance ()max. Rated current (mA)max. MMZ2012R150A 15±25% 0.05 1500 MMZ2012R300A 30±25% 0.05 1500 MMZ2012R600A 60±25% 0.10 1000 MMZ2012R121A 120±25% 0.12 800 MMZ2012R301A 300±25% 0.15 600 MMZ2012R601A 600±25% 0.20 500 MMZ2012R102A 1000±25% 0.30 500 MMZ2012S400A 40±25% 0.10 1000 MMZ2012S800A 80±25% 0.10 800 MMZ2012S121A 120±25% 0.15 800 MMZ2012S181A 180±25% 0.15 600 MMZ2012S301A 300±25% 0.20 600 MMZ2012S601A 600±25% 0.30 500 MMZ2012S102A 1000±25% 0.35 500 MMZ2012Y150B 15±25% 0.05 1500 MMZ2012Y300B 30±25% 0.05 1500 MMZ2012Y600B 60±25% 0.10 1000 MMZ2012Y121B 120±25% 0.12 800 MMZ2012Y301B 300±25% 0.15 600 MMZ2012Y601B 600±25% 0.20 500 MMZ2012Y102B 1000±25% 0.30 500 MMZ2012Y152B 1500±25% 0.40 500 MMZ2012Y202B 2000±25% 0.50 400 MMZ2012D800B 80±25% 0.30 500 MMZ2012D121B 120±25% 0.30 500 MMZ2012D301B 300±25% 0.50 400 X Z R 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) X Z R 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) X Z R 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) X Z R 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) 100 120 140 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) X Z R 100 150 200 250 300 350 1 10 100 1000 Frequency(MHz) Impedance(Ω) X Z R 100 200 300 400 500 600 700 10000
All specifications are subject to change without notice. (22/28) 002-01 / 20130301 / e9412_mmz TYPICAL ELECTRICAL CHARACTERISTICS Z, X, R vs. FREQUENCY CHARACTERISTICS MMZ2012R102A MMZ2012S400A MMZ2012S800A MMZ2012S121A MMZ2012S181A MMZ2012S301A MMZ2012S601A MMZ2012S102A MMZ2012Y150B MMZ2012Y300B MMZ2012Y600B MMZ2012Y121B 200 400 600 800 1000 1200 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) X Z R 1 10 100 1000 Frequency(MHz) Impedance(Ω) X Z R 10000 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) X Z R 100 120 140 Impedance(Ω) 100 120 140 160 180 1 10 100 1000 Frequency(MHz) 10000 X Z R 1 10 100 1000 Frequency(MHz) Impedance(Ω) 100 150 200 250 300 10000 X Z R 1 10 100 1000 Frequency(MHz) Impedance(Ω) 100 150 200 250 300 350 400 450 10000 X Z R 1 10 100 1000 Frequency(MHz) Impedance(Ω) 0 10000 X Z R 100 200 300 400 500 600 700 1 10 100 1000 Frequency(MHz) Impedance(Ω) 0 10000 X Z R 200 400 600 800 1000 1200 1 10 100 1000 Frequency(MHz) Impedance(Ω) 0 10000 X Z R 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) X Z R 120 100 01 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z R X 100 150 200 1 10 100 1000 Frequency(MHz) Impedance(Ω) 10000 X Z R
All specifications are subject to change without notice. (23/28) 002-01 / 20130301 / e9412_mmz TYPICAL ELECTRICAL CHARACTERISTICS Z, X, R vs. FREQUENCY CHARACTERISTICS MMZ2012Y301B MMZ2012Y601B MMZ2012Y102B MMZ2012Y152B MMZ2012Y202B MMZ2012D800B MMZ2012D121B MMZ2012D301B PACKAGING STYLES REEL DIMENSIONS TAPE DIMENSIONS 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) 100 200 300 400 500 600 X Z R 800 700 600 500 400 300 200 100 01 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z X R 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) X Z R 200 400 600 800 1000 1200 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) 200 400 600 800 1000 1200 1400 1600 1800 X Z R 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) X Z R 500 1000 1500 2000 2500 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) X Z R100 200 300 400 500 600 700 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) 200 400 600 800 1000 1200 X Z R 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) 500 1000 1500 2000 2500 3000 3500 4000 4500 X ZR 1.0 ø180±2.0 2.0±0.5 ø13±0.2 ø21±0.8 ø60min. 14.4max. Dimensions in mm 8.4 +2.0 –0.0 8.0±0.3 3.5±0.05 1.75±0.1 2.0±0.05 1.5 +0.1 –0.0Sprocket hole Cavity 2.3±0.2 1.5±0.2 160min. Taping 200min. 300min.Drawing direction Dimensions in mm
All specifications are subject to change without notice. (24/28) 002-01 / 20130301 / e9412_mmz Chip Beads For Signal Line MMZ Series MMZ0603-E This is a multilayered chip bead product with dimensions of L0.6W0.3T0.3mm. Compared with the existing MMZ0603 type, this new product has broad-band impedance values for higher frequency ranges. The product is magnetically shielded, allowing high density mounting. We refined the rules for internal conductor design to reduce floating capacity between conductors, which in turn has contributed to a dramatic improvement in high frequency characteristics. We have also been able to expand and reinforce the EMI suppression in the GHz range. It is a product conforming to RoHS directive. Removal of signal line noises of cellular phones, portable audio players, various modules, DSCs, portable game machines, etc. PRODUCT IDENTIFICATION (1) Series name (2) Dimensions LW (3) Type name (4) Impedance 102:1000 at 100MHz (5) Characteristic type (6) Packaging style T:Taping (7) TDK internal code HANDLING AND PRECAUTIONS Before soldering, be sure to preheat components. The preheat- ing temperature should be set so that the temperature difference between the solder temperature and product temperature does not exceed 150°C. After mounting components onto the printed circuit board, do not apply stress through board bending or mishandling. Do not expose the inductors to stray magnetic fields. Avoid static electricity discharge during handling. When hand soldering, apply the soldering iron to the printed cir- cuit board only. Temperature of the iron tip should not exceed 350°C. Soldering time should not exceed 3 seconds. SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD PATTERN SPECIFICATIONS PACKAGING STYLE AND QUANTITIES RECOMMENDED SOLDERING CONDITION REFLOW SOLDERING Test equipment: E4991A or equivalent Test tool: 16197 or equivalent Test temperature: 25±10°C Conformity to RoHS Directive MMZ 0603 S 102 E T Operating temperature range –55 to +125°C Storage temperature range –55 to +125°C(After mount) Packaging style Quantity Taping 15000 pieces/reel Part No. Impedance() DC resistance ()max. Rated current (mA)max.[100MHz] [1GHz] MMZ0603S601E 600±25% 1000±40% 1.60 150 MMZ0603S102E 1000±25% 1800±40% 2.60 125 0.3±0.03 0.6±0.03 0.1min. 0.3±0.03 Weight: 0.3mg Dimensions in mm 0.30 0.250.25 0.30 Natural cooling 10s max. Preheating 60 to 120s Soldering 30 to 60s 230˚C 250 to 260˚C 180˚C 150˚C Time(s) Please contact our Sales office when your application is considered the following: The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.) Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
All specifications are subject to change without notice. (25/28) 002-01 / 20130301 / e9412_mmz TYPICAL ELECTRICAL CHARACTERISTICS Z FREQUENCY CHARACTERISTICS(DIFFERS ACCORDING TO SERIES) MMZ0603S-E SERIES TYPICAL ELECTRICAL CHARACTERISTICS Z, X, R vs. FREQUENCY CHARACTERISTICS MMZ0603S601E MMZ0603S102E PACKAGING STYLES REEL DIMENSIONS TAPE DIMENSIONS 10001001 Frequency(MHz) Impedance(Ω) 200 400 600 800 1000 2000 1200 1400 1600 1800 MMZ0603S102E MMZ0603S601E 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z X R 200 400 600 800 1000 2000 1200 1400 1600 1800 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z X R 200 400 600 800 1000 1200 1.0 ø180±2.0 2.0±0.5 ø13±0.2 ø21±0.8 ø60min. 14.4max. Dimensions in mm 8.4 +2.0 –0.0 8.0±0.3 3.5±0.05 1.75±0.1 4.0±0.1 2.0±0.05 2.0± 0.05 Sprocket hole Cavity1.5 +0.1 –0.0 0.5max. 0.38± 0.05 0.68±0.05 160min. Taping 200min. 300min.Drawing direction Dimensions in mm
All specifications are subject to change without notice. (26/28) 002-01 / 20130301 / e9412_mmz Chip Beads For Signal Line MMZ Series MMZ1005-E Compared with the existing MMZ1005 type, this new product has broad-band impedance values for higher frequency ranges. Size standardized for use by automatic assembly equipment. No preferred orientation. Electroplated terminal electrodes accommodate reflow soldering. High reliability due to an entirely monolithic structure. Closed magnetic circuit structure allows high-density installation while preventing crosstalk between circuits. Low DC resistance structure of electrode prevents wasteful electric power consumption. It is a product conforming to RoHS directive. Removal of signal line noises of cellular phones, PCs, note PCs, TVs, TV tuners, STBs, audio players, DVDs, DSCs, DVCs, game machines, digital photo frames, car navigation system, PNDs, etc. SPECIFICATIONS SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD PATTERN ELECTRICAL CHARACTERISTICS Test equipment: E4991A or equivalent Test tool: 16192A or equivalent Test temperature: 25±10°C PRODUCT IDENTIFICATION (1) Series name (2) Dimensions LW (3) Type name (4) Impedance 601:600 at 100MHz (5) Characteristic type (6) Packaging style T:Taping (7) TDK internal code PACKAGING STYLE AND QUANTITIES HANDLING AND PRECAUTIONS Before soldering, be sure to preheat components. The preheat- ing temperature should be set so that the temperature difference between the solder temperature and product temperature does not exceed 150°C. After mounting components onto the printed circuit board, do not apply stress through board bending or mishandling. Do not expose the inductors to stray magnetic fields. Avoid static electricity discharge during handling. When hand soldering, apply the soldering iron to the printed cir- cuit board only. Temperature of the iron tip should not exceed 350°C. Soldering time should not exceed 3 seconds. RECOMMENDED SOLDERING CONDITION REFLOW SOLDERING Conformity to RoHS Directive Operating temperature range –55 to +125°C Storage temperature range –55 to +125°C(After mount) Part No. Impedance() DC resistance ()max. Rated current (mA)max.[100MHz] [1GHz] MMZ1005S601E 600±25% 1000±40% 0.65 300 MMZ1005S102E 1000±25% 1400±40% 1.00 250 MMZ1005S182E 1800±25% 1800±40% 1.50 200 MMZ1005A601E 600±25% 1400±40% 0.80 300 MMZ1005A102E 1000±25% 2000±40% 1.20 250 MMZ1005A152E 1500±25% 2300±40% 1.60 230 MMZ1005A182E 1800±25% 2700±40% 2.10 200 MMZ1005A222E 2200±25% 3000±40% 2.20 150 MMZ1005D121E 120±25% 1000±40% 0.70 300 MMZ1005D221E 220±25% 1700±40% 1.00 250 MMZ1005F470E 47±25% 800±40% 0.70 300 MMZ1005F750E 75±25% 1500±40% 1.00 250 MMZ1005F121E 120±25% 2300±40% 1.50 200 0.1min. 0.5±0.05 1±0.05 0.5±0.05 0.40.5 0.5 0.5 Weight: 1mg Dimensions in mm MMZ 1005 S 601 E T Packaging style Quantity Taping 10000 pieces/reel Natural cooling 10s max. Preheating 60 to 120s Soldering 30 to 60s 230˚C 250 to 260˚C 180˚C 150˚C Time(s) Please contact our Sales office when your application is considered the following: The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.) Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
All specifications are subject to change without notice. (27/28) 002-01 / 20130301 / e9412_mmz TYPICAL ELECTRICAL CHARACTERISTICS Z FREQUENCY CHARACTERISTICS(DIFFERS ACCORDING TO SERIES) MMZ1005S-E SERIES MMZ1005A-E SERIES MMZ1005D-E SERIES MMZ1005F-E SERIES Z, X, R vs. FREQUENCY CHARACTERISTICS MMZ1005S601E MMZ1005S102E MMZ1005S182E MMZ1005A601E MMZ1005A102E MMZ1005A152E 100001000100101 Frequency(MHz) Impedance(Ω) 500 1000 1500 2000 2500 3000 MMZ1005S182E MMZ1005S102E MMZ1005S601E 100001000100101 Frequency(MHz) Impedance(Ω) 500 1000 1500 2000 2500 3000 3500 4000 4500 5000 MMZ1005A222E MMZ1005A182E MMZ1005A152E MMZ1005A601E MMZ1005A102E 100001000100101 Frequency(MHz) Impedance(Ω) 200 400 600 800 1000 1200 1400 1600 1800 2000 MMZ1005D221E MMZ1005D121E 100001000100101 Frequency(MHz) 500 1000 1500 2000 2500 3000Impedance(Ω) MMZ1005F121E MMZ1005F750E MMZ1005F470E 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) 200 400 600 800 1000 Z R X 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z R X 200 400 600 800 1000 1200 1400 1600 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) 500 1000 1500 2000 3000 2500 Z R X 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) 500 1000 1500 2000 2500 3000 Z R X 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z R X 200 400 600 800 1000 1200 1400 1600 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) 500 1000 1500 2000 2500 Z R X
All specifications are subject to change without notice. (28/28) 002-01 / 20130301 / e9412_mmz TYPICAL ELECTRICAL CHARACTERISTICS Z, X, R vs. FREQUENCY CHARACTERISTICS MMZ1005A182E MMZ1005A222E MMZ1005D121E MMZ1005D221E MMZ1005F470E MMZ1005F750E MMZ1005F121E PACKAGING STYLES REEL DIMENSIONS TAPE DIMENSIONS 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) 500 1000 1500 2000 3500 3000 2500 Z R X 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) 500 1000 1500 2000 4500 3500 3000 4000 2500 Z R X 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) Z R X 500 1000 1500 2000 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) 200 400 600 800 1000 1200 Z R X 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) 500 1000 1500 2000 2500 3000 Z R X 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) 200 400 600 800 1000 1200 Z R X 1 10 100 1000 10000 Frequency(MHz) Impedance(Ω) 200 400 600 800 1000 1200 1400 1600 1800 Z R X 1.0 ø180±2.0 2.0±0.5 ø13±0.2 ø21±0.8 ø60min. 14.4max. Dimensions in mm 8.4 +2.0 –0.0 1.15±0.1 0.8max. 0.65± 0.1 8.0±0.3 3.5±0.05 1.75±0.1 4.0±0.1 2.0±0.05 2.0± 0.05 Sprocket hole Cavity1.5 +0.1 –0.0 160min. Taping 200min. 300min.Drawing direction Dimensions in mm