MMT05B230T3_06 ONSEMI | Alldatasheet
Document overview
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Technical content
Features
- High Surge Current Capability: 50 A 10 x 1000 /C0109sec, for Controlled Temperature Environments
- The MMT05B230T3 Series is used to help equipment meet various regulatory requirements including: Bellcore 1089, ITU K.20 & K.21, IEC 950, UL 1459 & 1950 and FCC Part 68
- Bidirectional Protection in a Single Device
- Little Change of V oltage Limit with Transient Amplitude or Rate
- Freedom from Wearout Mechanisms Present in Non−Semiconductor Devices
- Fail−Safe, Shorts When Overstressed, Preventing Continued Unprotected Operation
- Surface Mount Technology (SMT)
- Indicates UL Registered − File #E210057
- Pb−Free Packages are Available MAXIMUM RATINGS (TJ = 25°C unless otherwise noted) Rating Symbol Value Unit Off−State Voltage − Maximum MMT05B230T3 MMT05B260T3 MMT05B310T3 VDM /C0034170 /C0034200 /C0034270 V Maximum Pulse Surge Short Circuit Current Non−Repetitive Double Exponential Decay Waveform (Notes 1 and 2) (−25°C Initial Temperature) 8 x 20 /C0109sec 10 x 160 /C0109sec 10 x 560 /C0109sec 10 x 1000 /C0109sec IPPS1 IPPS2 IPPS3 IPPS4 /C0034150 /C0034100 /C003470 /C003450 A(pk) Maximum Non−Repetitive Rate of Change of On−State Current Double Exponential Waveform, R = 1.0, L = 1.5 /C0109H, C = 1.67 /C0109F, Ipk = 110A di/dt /C0034150 A//C0109s Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Allow cooling before testing second polarity. 2. Measured under pulse conditions to reduce heating. BIDIRECTIONAL TSPD
50 AMPERE SURGE
Preferred devices are recommended choices for future use and best overall value. MT1 MT2 SMB (No Polarity) (Essentially JEDEC DO−214AA) CASE 403C ( ) RPBx = Device Code x = G or J Y = Year WW = Work Week /C0071 = Pb−Free Package MARKING DIAGRAMS AYWW RPBx /C0071 /C0071 http://onsemi.com See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet.
ORDERING INFORMATION
MMT05B230T3, MMT05B260T3, MMT05B310T3 http://onsemi.com THERMAL CHARACTERISTICS Characteristic Symbol Max Unit Operating Temperature Range Blocking or Conducting State TJ1 −40 to +125 °C Overload Junction Temperature − Maximum Conducting State Only TJ2 +175 °C Instantaneous Peak Power Dissipation (Ipk = 50 A, 10x1000 /C0109sec @ 25°C) PPK 2000 W Maximum Lead Temperature for Soldering Purposes 1/8″ from Case for 10 Seconds TL 260 °C ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted) Devices are bidirectional. All electrical parameters apply to forward and reverse polarities. Characteristics Symbol Min Typ Max Unit Breakover Voltage (Both polarities) (dv/dt = 100 V//C0109s, ISC = 1.0 A, Vdc = 1000 V) MMT05B230T3 MMT05B260T3 MMT05B310T3 (+65°C) MMT05B230T3 MMT05B260T3 MMT05B310T3 V(BO) 265 320 365 280 340 400 V Breakover Voltage (Both polarities) (f = 60 Hz, ISC = 1.0 A(rms), VOC = 1000 V(rms), MMT05B230T3 RI = 1.0 k/C0087, t = 0.5 cycle) (Note 3) MMT05B260T3 MMT05B310T3 (+65°C) MMT05B230T3 MMT05B260T3 MMT05B310T3 V(BO) 265 320 365 280 340 400 V Breakover Voltage Temperature Coefficient dV(BO)/dTJ − 0.08 − %/°C Breakdown Voltage (I(BR) = 1.0 mA) Both polarities MMT05B230T3 MMT05B260T3 MMT05B310T3 V(BR) 190 240 280 V Off State Current (VD1 = 50 V) Both polarities Off State Current (VD2 = VDM) Both polarities ID1 ID2 2.0 5.0 /C0109A On−State Voltage (IT = 1.0 A) (PW ≤ 300 /C0109s, Duty Cycle ≤ 2%) (Note 3) VT − 1.53 3.0 V Breakover Current (f = 60 Hz, VDM = 1000 V(rms), RS = 1.0 k/C0087) − Both polarities IBO − 230 − mA Holding Current (Both polarities) (Note 3) VS = 500 V; IT (Initiating Current) = /C00341.0 A IH 150 340 − mA Critical Rate of Rise of Off−State Voltage (Linear waveform, VD = Rated VBR, TJ = 25°C) dv/dt 2000 − − V//C0109s Capacitance (f = 1.0 MHz, 50 Vdc, 1.0 V rms Signal) Capacitance (f = 1.0 MHz, 2.0 Vdc, 15 mV rms Signal) CO − pF 3. Measured under pulse conditions to reduce heating.
MMT05B230T3, MMT05B260T3, MMT05B310T3 http://onsemi.com TELECOM EQUIPMENTOUTSIDE PLANT TIP RING GND TELECOM EQUIPMENTOUTSIDE PLANT TIP RING GND PPTC* PPTC* HEAT COIL HEAT COIL *Polymeric PTC (positive temperature coefficient) overcurrent protection device Device Package Shipping† MMT05B230T3 SMB 2500 / Tape & Reel MMT05B230T3G SMB (Pb−Free) MMT05B260T3 SMB MMT05B260T3G SMB (Pb−Free) MMT05B310T3 SMB MMT05B310T3G SMB (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
MMT05B230T3, MMT05B260T3, MMT05B310T3 http://onsemi.com PACKAGE DIMENSIONS SMB (No Polarity) (Essentially JEDEC DO−214AA) CASE 403C−01 ISSUE A 0.085 2.159 0.108 2.743 0.089 2.261 mm inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* A S D B JPK C H NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P. DIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.160 0.180 4.06 4.57 B 0.130 0.150 3.30 3.81 C 0.075 0.095 1.90 2.41 D 0.077 0.083 1.96 2.11 H 0.0020 0.0060 0.051 0.152 J 0.006 0.012 0.15 0.30 K 0.030 0.050 0.76 1.27 P 0.020 REF 0.51 REF S 0.205 0.220 5.21 5.59 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 MMT05B230T3/D LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative