MMPQ6700

MMPQ6700 FAIRCHILD | Alldatasheet

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 1997 Fairchild Semiconductor Corporation Quad NPN & PNP General Purpose Amplifier These complimentary devices can be used in switches with collector currents of 10 µA to 100 mA. These devices are best used when space is the primary consideration. Sourced from Process 23 & 66. See 2N3904 (NPN) & 2N3906 (PNP) for characteris- tics. *These ratings are limiting values above which the serviceability of any semiconductor device may be impaired. Absolute Maximum Ratings* TA = 25°C unless otherwise noted NOTES : 1) These ratings are based on a maximum junction temperature of 150 degrees C. 2) These are steady state limits. The factory should be consulted on applications involving pulsed or low duty cycle operations. Thermal Characteristics TA = 25°C unless otherwise noted Symbol Parameter Value Units VCEO Collector-Emitter Voltage 40 V VCBO Collector-Base Voltage 40 V VEBO Emitter-Base Voltage 5.0 V IC Collector Current - Continuous 200 mA TJ, Tstg Operating and Storage Junction Temperature Range -55 to +150 °C Symbol Characteristic Max Units MMPQ6700 PD Total Device Dissipation Derate above 25°C 1000 8.0 mW mW/ °C R θJA Thermal Resistance, Junction to Ambient Effective 4 Die Each Die 125 240 °C/W °C/W TRANSISTTRANSISTTRANSISTTRANSISTTRANSIST OR OR OR OR OR TYPETYPETYPETYPETYPE NPN PNP C 1 B1 E1 & C2 B2 E2 C 3 B3 E3 & C4 B4 E4

Quad NPN & PNP General Purpose Amplifier (continued) Electrical Characteristics TA = 25°C unless otherwise noted OFF CHARACTERISTICS Symbol Parameter Test C onditions Min Max Units V(BR)CEO Collector-Emitter Breakdown Voltage* IC = 10 mA, IB = 0 40 V V(BR)CBO Collector-Base Breakdown VoltageIC = 10 µA, IE = 0 40 V V(BR)EBO Emitter-Base Breakdown Voltage IE = 10 µA, IC = 0 5.0 V ICBO Collector-Cutoff Current V CB = 30 V, IE = 0 50 nA IEBO Emitter-Cutoff Current V EB = 4.0 V, IC = 0 50 nA ON CHARACTERISTICS* hFE DC Current Gain V CE = 1.0 V, IC = 0.1 mA VCE = 1.0 V, IC = 1.0 mA VCE = 1.0 V, IC = 10 mA VCE(sat) Collector-Emitter Saturation Voltage IC = 10 mA, IB = 1.0 mA 0.25 V VBE(sat) Base-Emitter Saturation Voltage IC = 10 mA, IB = 1.0 mA 0.90 V SMALL SIGNAL CHARACTERISTICS C ob Output Capacitance V CB = 5.0 V, f = 100 kHz 4.5 pF C ib Input Capacitance V BE = 0.5 V, f = 1.0 kHz 10 pF fT Current-Gain Bandwidth Product IC = 10 mA, VCE = 20 V, f = 100 MHz

200 MHz

*Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2.0%

SOIC(16lds) Packaging Configuration: Figure 1.0 Components SOIC(16lds) Tape Leader and Trailer Configuration: Figure 2.0 Cover Tape Carrier Tape Note/Comments Packaging Option SOIC (16lds) Packaging Information Standard (no flow code) L86Z Packaging type Reel Size TNR 13" Dia Rail/Tube Qty per Reel/Tube/Bag 2,500 45 Box Dimension (mm) 343x64x343 530x130x83 Max qty per Box 5,000 13,500 Weight per unit (gm) 0.1437 0.1437 Weight per Reel (kg) 0.7735 - F63TNR Label sample LOT: CBVK741B019 FSID: NDM3000 D/C1: D9842 QTY1: SPEC REV: SPEC: QTY: 2500 D/C2: QTY2: CPN: N/F: F (F63TNR)3 SOIC-16 Unit Orientation FD85AB NDM3001 FD85AB NDM3001 Pin 1 Static Dissipative Embossed Carrier Tape F63TNR Label Antistatic Cover Tape ESD Label ELECTROSTATI C SENSITIVE DEVICES DO NO T SHI P OR ST O RE N EAR STRO NG ELECTROSTATIC ELECTRO MAGN ET I C, MAG NETIC O R R ADIO ACTIVE F I EL D S TN R DA TE PT NUMB ER Customized Label Packaging Description: SOIC-16 parts are shipped in tape. The carrier tape is made from a dissipative (carbon filled) polycarbonate resin. The cover tape is a multilayer film (Heat Activated Adhesive in nature) primarily composed of polyester film, adhesive layer, sealant, and anti-static sprayed a gent. These reeled parts in standard option are shipped with 2,500 units per 13" or 330cm diameter reel. The reels are dark blue in color and is made of polystyrene plastic (anti- static coated). This and some other options are further described in the Packa ging Information table. These full reels are individually barcode labeled and placed inside a standard intermediate box (illustrated in fi gure 1.0) made of recyclable corrugated brown paper. One box contains two reels maximum. And these boxes are placed inside a barcode labeled shippin g box which comes in different sizes depending on the number of parts shipped. Leader Tape 1680mm minimum or 210 empt y pockets Trailer Tape 640mm minimum or 80 empt y pockets FD85AB NDM3001 FD85AB NDM3001 FD85AB NDM3001 SOIC-16 Tape and Reel Data and Package Dimensions October 1999, Rev. B

SOIC-16 Tape and Reel Data and Package Dimensions, continued July 1999, Rev. B P1A0 D1 F W E2B0 Tc Wc T Dimensions are in inches and millimeters Tape Size Reel Option Dim A Dim B Dim C Dim D Dim N Dim W1 Dim W2 Dim W3 (LSL-USL) 16mm 13" Dia 13.00 330 0.059 1.5 512 +0.020/-0.008 13 +0.5/-0.2 0.795 20.2 4.00 100 16.4 +2/0 0.882 22.4 0.626 – 0.764 15.9 – 19.4 13" Diameter Option Dim A Max W2 max Measured at Hub W1 Measured at Hub Notes: A0, B0, and K0 dimensions are determined with respect to the EIA/Jedec RS-481 rotational and lateral movement requirements (see sketches A, B, and C). 10 deg maximum component rotation 0.9mm maximum 0.9mm maximum Sketch C (Top View) Component lateral movement Typical component cavity center line 10 deg maximum Typical component center line Sketch B (Top View) Component Rotation Sketch A (Side or Front Sectional View) Component Rotation User Direction of Feed SOIC(16lds) Embossed Carrier Tape Configuration: Figure 3.0 SOIC(16lds) Reel Configuration: Figure 4.0 Dimensions are in millimeter Pkg type A0 B0 W D0 D1 E1 E2 F P1 P0 K0 T Wc Tc SOIC (16lds) (16mm) 6.60 +/-0.30 10.35 +/-0.25 16.0 +/-0.3 1.55 +/-0.05 1.60 +/-0.10 1.75 +/-0.10 14.25 min 7.50 +/-0.05 8.0 +/-0.1 4.0 +/-0.1 2.40 +/-0.40 0.450 +/-0.150 13.0 +/-0.3 0.06 +/-0.02 Dim D min Dim C B Min DETAIL AA See detail AA Dim A max Dim N

SOIC-16 (FS PKG Code S3) SOIC-16 Tape and Reel Data and Package Dimensions, continued October 1999, Rev. A1 1:1 Scale 1:1 on letter size paper Dimensions shown below are in: inches [millimeters] Part Weight per unit (gram): 0.1437

ACEx™ CoolFET™ CROSSVOLT™ E 2CMOS TM FACT™ FACT Quiet Series™ FAST FASTr™ GTO™ HiSeC™ The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Preliminary No Identification Needed Obsolete This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Formative or In Design First Production Full Production Not In Production DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. SyncFET™ TinyLogic™ UHC™ VCX™ ISOPLANAR™ MICROWIRE™ POP™ PowerTrench QFET™ QS™ Quiet Series™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 Rev. D