MMPQ2222A ONSEMI | Alldatasheet

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© Semiconductor Components Industries, LLC, 2006 August, 2006 − Rev. 2 Publication Order Number: MMPQ2222A/D MMPQ2222A Preferred Device Quad General Purpose Transistor NPN Silicon MAXIMUM RATINGS Rating Symbol Value Unit Collector−Emitter Voltage VCEO 40 Vdc Collector−Base Voltage VCB 75 Vdc Emitter−Base Voltage VEB 5.0 Vdc Collector Current − Continuous IC 500 mAdc Four Transistors Equal Power Total Power Dissipation @ TA = 25°C Derate above 25°C PD 1.0 8.0 Watts mW/°C Total Power Dissipation @ TC = 25°C Derate above 25°C PD 2.4 19.2 Watts mW/°C Operating and Storage Junction Temperature Range TJ, Tstg −55 to +150 °C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. SO−16 CASE 751B STYLE 4 MARKING DIAGRAM Preferred devices are recommended choices for future use and best overall value. Device Package Shipping

ORDERING INFORMATION

MMPQ2222A SO −16 48 Units/Rail MMPQ2222A AWLYWW MMPQ2222A = Specif- ic Device Code A = As- sembly Location WL = Wafer Lot Y = Year WW = Work Week http://onsemi.com

http://onsemi.com ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Characteristic Symbol Min Typ Max Unit OFF CHARACTERISTICS Collector−Emitter Breakdown Voltage (Note 1) (IC = 10 mAdc, IB = 0) V(BR)CEO 40 − − Vdc Collector−Base Breakdown Voltage (IC = 10 /C0109Adc, IE = 0) V(BR)CBO 75 − − Vdc Emitter−Base Breakdown Voltage (IB = 10 /C0109Adc, IC = 0) V(BR)EBO 5.0 Vdc Collector Cutoff Current (VCB = 50 Vdc, IE = 0) (VCB = 60 Vdc, IE = 0) ICBO nAdc Emitter Cutoff Current (VEB = 3.0 Vdc, IC = 0) IEBO − − 100 nAdc ON CHARACTERISTICS DC Current Gain (Note 1) (IC = 100 /C0109A, VCE = 10 V) (IC = 1.0 mA, VCE = 10 V) (IC = 10 mA, VCE = 10 V) (IC = 150 mA, VCE = 10 V) (IC = 500 mA, VCE = 10 V) (IC = 150 mA, VCE = 1.0 V) hFE 100 300 Collector−Emitter Saturation Voltage (Note 1) (IC = 150 mAdc, IB = 15 mAdc) (IC = 500 mAdc, IB = 50 mAdc) VCE(sat) 0.3 1.0 Vdc Base−Emitter Saturation Voltage (Note 1) (IC = 150 mAdc, IB = 15 mAdc) (IC = 500 mAdc, IB = 50 mAdc) VBE(sat) 1.2 2.0 Vdc DYNAMIC CHARACTERISTICS Current−Gain − Bandwidth Product (Note 1) (IC = 20 mAdc, VCE = 20 Vdc, f = 100 MHz) fT 200 350 − MHz Output Capacitance (VCB = 10 Vdc, IE = 0, f = 1.0 MHz) Cob − 4.5 − pF Input Capacitance (VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz) Cib − 17 − pF SWITCHING CHARACTERISTICS Turn−On Time (VCC = 30 Vdc, VBE(off) = −0.5 Vdc, IC = 150 mAdc, IB1 = 15 mAdc) ton − 25 − ns Turn−Off Time (VCC = 30 Vdc, IC = 150 mAdc, IB1 = IB2 = 15 mAdc) toff − 250 − ns 1. Pulse Test: Pulse Width ≤ 300 /C0109s, Duty Cycle ≤ 2%.

Figure 11. “On” Voltages

0.2 V, VOLTAGE (VOLTS)

Figure 12. Temperature Coefficients

http://onsemi.com PACKAGE DIMENSIONS NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 16 9 SEATING PLANE F JM R X 45/C0095 G

8 PLP−B−

−A− M0.25 (0.010) B S −T− D K C 16 PL SBM0.25 (0.010) A ST DIM MIN MAX MIN MAX INCHESMILLIMETERS A 9.80 10.00 0.386 0.393 B 3.80 4.00 0.150 0.157 C 1.35 1.75 0.054 0.068 D 0.35 0.49 0.014 0.019 F 0.40 1.25 0.016 0.049 G 1.27 BSC 0.050 BSC J 0.19 0.25 0.008 0.009 K 0.10 0.25 0.004 0.009 M 0 7 0 7 P 5.80 6.20 0.229 0.244 R 0.25 0.50 0.010 0.019 /C0095/C0095/C0095/C0095 SO−16 CASE 751B−05 ISSUE J STYLE 4: PIN 1. COLLECTOR, DYE #1 2. COLLECTOR, #1 3. COLLECTOR, #2 4. COLLECTOR, #2 5. COLLECTOR, #3 6. COLLECTOR, #3 7. COLLECTOR, #4 8. COLLECTOR, #4 9. BASE, #4 10. EMITTER, #4 11. BASE, #3 12. EMITTER, #3 13. BASE, #2 14. EMITTER, #2 15. BASE, #1 16. EMITTER, #1 mm inches 0.060 1.52 0.275 7.0 0.024 0.6 0.050 1.270 0.155 4.0 SOLDERING FOOTPRINT ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 MMPQ2222A/D LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative