MMP7066-11 MA-COM | Alldatasheet

Document overview

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Technical content

Features

 Low Series Resistance  Low Junction Capacitance  I-Layer Thickness: W = 40 µm  RoHS* Compliant

Description

The MMP7066 -11 silicon PIN diode is an unpackaged die suitable for use in attenuator, switch or high-power limiter applications. It is manufactured using a proven diode manufacturing process for high reliability and uniformity. The very low thermal resistance (typically less than 20ºC/W) of this device enables it to reliably handle large RF power levels. The low series resistance and the junction capacitance of the diode combine to produce excellent isolation and insertion loss.

Ordering Information

MMP7066-11 400 piece waffle pack * Restrictions on Hazardous Substances, European Union Directive 2011/65/EU. Electrical Specifications: TA = +25°C Parameter Test Conditions Units Min. Typ. Max. Voltage Rating IR = 10 µA V 500 — — Forward Voltage IF = 100 mA V — — 1.1 Series Resistance1 IF = 1 mA, 100 MHz IF = 10 mA, 100 MHz IF = 100 mA, 100 MHz Ω — — 15.0 5.0 1.2 Junction Capacitance VR = 100 V, 1 MHz pF — — 0.1 Minority Carrier Lifetime IF = 10 mA, IR = 6 mA, 50% Recovery µs — 1.5 — I Layer Thickness — µm — 40 — 1. Measured using the HP 4291 Impedance Analyzer. CS11

Rev. V1 MMP7066-11 2 2 MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support Absolute Maximum Ratings Parameter Absolute Maximum Forward DC Current 150 mA Reverse DC Voltage 500 V Thermal Resistance Junction to Case = 25°C/W Junction Temperature +175°C Operating Temperature -65°C to +150°C Storage Temperature -65°C to +150°C Assembly Temperature +285°C, t = 10 s Assembly Instructions Die attach of MMP7066 -11 silicon PIN diode chips may be accomplished with conductive epoxy or a eutectic solder such as Au(80%)/Sn(20%). Electrical connection to the anode may be made with a Au wire or ribbon, utilizing thermo compression or ther- mosonic bonding. Care should be exercised to not employ excessive pressure or ultrasonic energy while wire/ribbon bonding to avoid physical damage to the die. Handling Procedures Please observe the following precautions to avoid damage: Static Sensitivity These electronic devices are sensitive to electrostatic discharge (ESD) and can be damaged by static electricity. Proper ESD control techniques should be used when handling these Class 1A (HBM) devices. Environmental Capabilities This diode is capable of meeting the environmental requirements of MIL-STD-750. Outline Drawing - CS11 Dimension Min. Nom. Max. A 0.016 0.018 0.020 B 0.016 0.018 0.020 C 0.006 0.010 0.012 D — 0.010 — Dimensions (inches)

Rev. V1 MMP7066-11 3 3 MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support MACOM Technology Solutions Inc. All rights reserved. Information in this document is provided in connection with MACOM Technology Solutions Inc ("MACOM") products. These materials are provided by MACOM as a service to its customers and may be used for informational purposes only. Except as provided in MACOM's Terms and Conditions of Sale for such products or in any separate agreement related to this document, MACOM assumes no liability whatsoever. MACOM assumes no responsibility for errors or omissions in these materials. MACOM may make changes to specifications and product descriptions at any time, without notice. MACOM makes no commitment to update the information and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to its specifications and product descriptions. No license, express or implied, by estoppels or otherwise, to any intellectual property rights is granted by this document. THESE MATERIALS ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, RELATING TO SALE AND/OR USE OF MACOM PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, CONSEQUENTIAL OR INCIDENTAL DAMAGES, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. MACOM FURTHER DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. MACOM SHALL NOT BE LIABLE FOR ANY SPECIAL, INDIRECT, INCIDENTAL, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS, WHICH MAY RESULT FROM THE USE OF THESE MATERIALS. MACOM products are not intended for use in medical, lifesaving or life sustaining applications. MACOM customers using or selling MACOM products for use in such applications do so at their own risk and agree to fully indemnify MACOM for any damages resulting from such improper use or sale.