MMM5062

MMM5062 FREESCALE | Alldatasheet

Document overview

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• PDF pages: 22

Technical content

Features

• 2.6V to 5.5V supply voltage
• Fully-integrated MOSFET switches
• Adjustable output voltage option down to 0.7V
• Output load current up to 10A
• Full sequencing and tracking capability
• Power-On Reset
• Efficiency >95% across a broad load range
• Operating frequency programmable: 400kHz to 2MHz
• Ultra-fast transient response
• 100% maximum duty cycle
• Micropower shutdown
• Thermal-shutdown and cu rrent-limit protection
• Available in a 32-pin 5mm x 5mm MLF ® package
• −40°C to +125°C junction temperature range

Applications

• High-power density point-of-load conversion
• Base stations, Servers and Routers
• Blu-ray players, DVD Recorders
• Computer Peripherals
• FPGAs, DSP, and low-voltage ASIC power Typical Application MIC22950 10A Synchronous DC-DC Converter Efficiency vs. Load Current 100 02468 1 0 LOAD CURRENT (A ) EFFICIENCY (%) VIN = 5V VOUT = 3.3V TA = 25°C Sequencing and Tracking

Micrel, Inc. MIC22950 February 2010 2 M9999-021910-B

Ordering Information

Part Number Nominal Output Volt age Temperature Range Package Lead Finish MIC22950YML Adjustable −40° to +125°C 32-Pin 5mm x 5mm MLF® Lead Free Note: MLF is a GREEN RoHS-compliant package. Lead finish is NiPdAu. Mold compound is Halogen Free. Pin Configuration 32-Pin 5mm x 5mm MLF® (ML) Pin Description Pin Number Pin Name Pin Function 1,2,7,8,17,23,24 PVIN Power Su pply Voltage (Input): Requires bypass capacitor to PGND.

3 EN/DLY

Enable/ delay (Input): This pin has a 1.24V band gap reference. When the pin is pulled higher that this the part will start up. Below this voltage the device is in its low quiescent current mode. The pin has a 1µA current source pull-up to VIN. By adding a capacitor to this pin, a delay may be generated. The enable function will not operate with an input voltage lower than UVLO. 4 DELAY Delay (Input): A capacitor sets the internal delay timer. Timer delays power-on reset (POR) at power-up and power-down. 5 RC Ramp Control (Input): Capacitor-to-ground from this pin determines slew rate of output voltage during start-up. This can be used for tracking capability as well as soft start. RC pin cannot be left floating. Use a minimum capacitor value of 120pF or larger.

6 POR/PG Power-On-Reset (Output): Open-drain output device indicates when the output is out of

regulation and is active after the delay set by the DELAY pin. 9,10,15,16,25,26, 31,32 PGND Power Ground (Power): Power Ground. 11,12,13,14,27, 28,29,30 SW Switch (Output): Internal power MOSFET output switches. 18 SGND Signal Ground (Signal): Signal Ground. 19 CF Frequency Set (Input): Adjustabl e Frequency with external capacitor. 20 FB Feedback (Input): Input to the error amplifier, connect to the external resistor divider network to set the output voltage.

21 COMP Compensation pin (Input): Place a RC-to-SGND to compensate the device, see applications

section. 22 SVIN Signal Power Supply Voltage (Input ): Requires bypass capacitor-to-SGND. EP GND Center Tab (Power): Must make a full connection to a GND plane for full output power to be realized.

Micrel, Inc. MIC22950 February 2010 3 M9999-021910-B Absolute Maximum Ratings(1) Operating Ratings(2) Thermal Resistance Electrical Characteristics(3) TA = 25°C with VIN = VEN = 3.3V; VOUT = 1.8V, unless otherwise specified. Bold values indicate –40°C ≤ TJ ≤ +125°C. Parameter Condition Min. Typ. Max. Units Supply Voltage Range 2.6 5.5 V VIN Turn On Voltage Threshold (V IN Rising) 2.35 2.5 2.6 V UVLO Hysteresis 260 mV Quiescent Current (PWM Mode) V EN = >1.34V; VFB = 1.1*VNOM (not switching) 1 2 mA Shutdown Current V EN = 0V 5 10 µA [Adjustable] Feedback Voltage ± 2% (over temperature) 0.686 0.714 V FB pin input current 1 nA Current Limit V FB = 0.9*VNOM 10 16.5 21 A Output Voltage Line Regulation V OUT 1.8V; VIN = 2.6 to 5.5V, ILOAD = 100mA 0.2 % Output Voltage Load Regulation 100mA < I LOAD < 10A, Vin = 3.3V 0.2 % Maximum Duty Cycle VFB ≤ 0.5V 100 % Switch ON-Resistance PFET Switch ON-Resistance NFET ISW = 1000mA VFB=0.5V ISW = -1000mA VFB=0.9V 11 8 mΩ mΩ Oscillator Frequency CF = 390pF 325 510 610 kHz EN/DLY threshold voltage 1.14 1.24 1.34 V EN/DLY source current V IN = 2.6 to VIN = 5.5V 0.6 1 1.8 µA RC Pin IRAMP Ramp Control Current 0.6 1 1.8 µA Power On Reset IPG(LEAK) V PORH = 5.5V; POR = High 1 µA µA Output Logic-Low Voltage (undervoltage condition), IPOR = 5mA 77 mV Power On Reset VPG(LO) Hysteresis 2 % Power On Reset VPG Threshold, % of V OUT below nominal 7.5 10 12.5 % Over-temperature Shutdown 160 °C Over-temperature Shutdown Hysteresis 20 °C Notes: 1. Exceeding the absolute maximum rating may damage the device. 2. The device is not guaranteed to function outside its operating rating. 3. Specification for packaged product only.

Micrel, Inc. MIC22950 February 2010 4 M9999-021910-B Typical Characteristics Shutdown Current vs. Input Voltage 23456 INPUT VOLTAGE (V) SHUTDOWN CURRENT (µA) Shutdown Current vs. Temperature -40 -20 0 20 40 60 80 100 120 TEMPERATURE (°C) INPUT CURRENT (µA) Operating Current (no SW) vs. Input Voltage 0.2 0.4 0.6 0.8 1.2 23456 INPUT VOLTAGE (V) OPERATING CURRENT (mA) Input Current (no SW) vs. Temperature 0.74 0.76 0.78 0.8 0.82 0.84 0.86 0.88 0.9 - 4 0 - 2 00 2 04 06 08 0 1 0 0 1 2 0 TEMPERATURE (°C) INPUT CURRENT (mA) Reference Voltage vs. Input Voltage 0.692 0.694 0.696 0.698 0.7 0.702 0.704 0.706 0.708 23456 INPUT VOLTAGE (V) REFERENCE VOLTAGE (V) Reference Voltage vs. Temperature 0.692 0.694 0.696 0.698 0.7 0.702 0.704 0.706 0.708 -40 -20 0 20 40 60 80 100 120 TEMPERATURE (°C) REFERENCE VOLTAGE (V) Enable Threshold vs. Input Voltage 1.22 1.225 1.23 1.235 1.24 1.245 1.25 1.255 1.26 2.5 3 3.5 4 4.5 5 5.5 INPUT VOLTAGE (V) ENABLE VOLTAGE (V) Enable Threshold vs. Temperature 1.22 1.225 1.23 1.235 1.24 1.245 1.25 1.255 1.26 -40 -20 0 20 40 60 80 100 120 TEMPERATURE (°C) ENABLE VOLTAGE (V) Switching Frequency vs. Temperature 300 350 400 450 500 550 600 650 -40 -20 0 20 40 60 80 100 120 TEMPERATURE (°C) FREQUENCY (kHz) VIN = 3.3V TA = 25°C TA = 25°C TA = 25°C Enable (ON) TA = 25°C Enable (ON) VIN = 3.3V CF = 390pF

Micrel, Inc. MIC22950 February 2010 5 M9999-021910-B Typical Characteristics (Continued) Switching Frequency vs. Input Voltage 300 350 400 450 500 550 600 650 2 . 533 . 544 . 555 . 5 INPUT VOLTAGE (V) FREQUENCY (kHz) Input Voltage UVLO vs. Temperature 2.2 2.3 2.4 2.5 2.6 2.7 2.8 -40 -20 0 20 40 60 80 100 120 TEMPETATURE (°C) INPUT VOLTAGE (V) RDSon vs. Temperature -40 -20 0 20 40 60 80 100 120 TEMPETATURE (°C) RDSon (mΩ) RDSon vs. Input Voltage 23456 INPUT VOLTAGE (V) RDSon (mΩ) Output Voltage vs. RC Voltage 200 400 600 800 1000 1200 1400 1600 1800 2000 0 200 400 600 800 1000 RC VOLTAGE (mV) OUTPUT VOLTAGE (mV) Efficiency vs. Load Current (VOUT=1.2V) 100 02468 1 0 LOA D CURRENT (A ) EFFICIENCY (%) Efficiency vs. Load Current (VOUT=1.8V) 100 02468 1 0 LOA D CURRENT (A) EFFICIENCY (%) Efficiency vs. Load Current (VOUT=3.3V) 100 02468 1 0 LOAD CURRENT (A) EFFICIENCY (%) VIN = (ON) VIN = (OFF) RDSON (P-Channel) RDSON (N-Channel) RDSON (P-Channel) RDSON (N-Channel) TCASE = 25°C VOUT(NOM) = 1.8V VIN = 3.6V VIN = 5V VIN = 2.6V TCASE = 25°C VIN = 3.6V VIN = 5V VIN = 2.6V TCASE = 25°C VIN = 5V TCASE = 25°C CF = 390pF

Micrel, Inc. MIC22950 February 2010 6 M9999-021910-B Bode Plots

Micrel, Inc. MIC22950 February 2010 7 M9999-021910-B Functional Characteristics

Micrel, Inc. MIC22950 February 2010 8 M9999-021910-B Functional Block Diagram

Micrel, Inc. MIC22950 February 2010 9 M9999-021910-B Functional Description PVIN, SVIN PVIN is the input supply to the internal 11m Ω P-Channel Power MOSFET. This should be connected externally to the SVIN pin. The supply voltage range is from 2.6V to 5.5V. A 22µF ceramic is recommended for bypassing each PVIN supply and 10µF capacitor for SVIN pin. EN/DLY This pin is internally fed with a 1µA current source to SVIN. A delayed turn on is implemented by adding a capacitor to this pin. The delay is proportional to the capacitor value. The internal circuits are held off until EN/DLY reaches the enable threshold of 1.24V. RC RC pin allows the slew rate of the output voltage to be programmed by the addition of a capacitor from RC pin to ground. RC pin is internally fed with a 1µA current source and V OUT slew rate is proportional to the capacitor and the 1µA source. The RC pin cannot be left floating. Use a minimum capacitor value of 120pF or longer. DELAY Adding a capacitor to this pin allows the delay of the POR signal. When V OUT reaches 90% of its nominal voltage, the DELAY pin current source (1µA) starts to charge the external capacitor. At 1.24V, POR is asserted high. COMP The MIC22950 uses an internal-compensation network containing a fixed-frequency zero (phase-lead response) and pole (phase-lag response) which allows the external compensation network to be much simplified for stability. The addition of a single capacitor and resistor will add the necessary pole and zero for voltage-mode loop stability using low-value, low-ESR ceramic capacitors. FB The FB pin provides the control path to control the output. A resistor divider connecting the feedback to the output is used to adjust the desired output voltage. Refer to the feedback section in Applications Information of this data sheet for more detail. POR/PG This is an open drain output. A 47k resistor can be used for a pull-up to this pin. POR/PG is asserted high when output voltage reaches 90% of nominal set voltage and after the delay set by C DELAY. POR/PG is asserted low without delay when enable is set low or when the output goes below the −10% threshold. For a power-good (PG) function, the delay can be set to a minimum. This can be done by removing the DELAY pin capacitor. CF This pin allows the setting of the switching frequency. A 200µA source current charges the capacitor on this pin up to a voltage of 1V. At this point, CF pin capacitor is then discharged with an internal N-Channel MOSFET marking the end of the switching period. The capacitor should be connected very close to the IC and grounded directly to the SGND pin. SW This is the connection to the source of the internal P- channel MOSFET and drain of the N-Channel MOSFET. This is a high-frequency, high-power connection; therefore, traces should be kept as short and as wide as practical. SGND Internal signal ground for all low-power sections. PGND Internal ground connection to the source of the internal N-Channel MOSFETs.

Micrel, Inc. MIC22950 February 2010 10 M9999-021910-B

Application Information

The MIC22950 is a 10A synchronous stepdown regulator IC with a programmable 400kHz to 2MHz switching frequency. The control loop is a voltage-mode PWM control scheme. Other features include tracking and sequencing control for controlling multiple output power systems with POR/PG output. Component Selection Input Capacitor A minimum 22µF ceramic capacitor (preferable) is recommended on each of the PVIN pins for bypassing. X5R or X7R dielectrics are recommended for the input capacitor. Do not use Y5V dielectrics, aside from losing most of their capacitance over temperature and voltage, they also become resistive at high frequencies. This reduces their ability to localize high-frequency noise. Output Capacitor The MIC22950 was designed spec ifically for the use of ceramic output capacitors. It is designed to work with 100µF output capacitor. This output capacitor can be increased to improve transi ent performance. Since the MIC22950 is voltage mode control loop, it relies on the inductor and output capacitor for compensation. For this reason, do not use excessively large output capacitors. The output capacitor requires either an X7R or X5R dielectric. Do not use Y5V and Z5U dielectric capacitors, aside from the undesirable effe ct of their wide variation in capacitance over temperature, become resistive at high frequencies. Using Y5V or Z5U capacitors can cause instability in the MIC22950. Inductor Selection Inductor selection will be determined by the following (not necessarily in the order of importance):

• Inductance
• Rated current value
• Size requirements
• DC resistance (DCR) The MIC22950 is designed for use with a 0.39µH to 2.2µH inductor. Maximum current ratings of the inductor are generally given in two methods: permissible DC current and saturation current. Permissible DC current can be rated either for a 40°C temperature rise or a 10% loss in inductance. Ensure that the inductor selected can handle the maximum operating current. When the saturation current is specified, make sure that there is enough margin that the peak current will not saturate the inductor. The ripple can add as much as 2A to the output current level. The RMS rating should be chosen to be equal or greater than the current limit of the MIC22950 to prevent overheating in a f ault condition. For best electrical performance, the inductor should be placed very close to the SW nodes of the IC. For this reason, the heat of the inductor is somewhat coupled to the IC, which offers some level of protection if the inductor gets too hot. It is important to test all operating limits before settling on the final inductor choice. The size requirements refer to the area and height requirements that are necessary to fit a particular design. Please refer to the inductor dimensions on their datasheet. DC resistance is also impo rtant. While DCR is typically inversely proportional to size, DCR can represent a significant efficiency loss. Refer to the Efficiency Considerations section for a more detailed description. EN/DLY Capacitor EN/DLY sources 1µA out of the IC to allow a start-up delay to be implemented. The delay time is simply the time it takes 1µA to charge C EN/DLY to 1.24V. Therefore: EN/DLY DLY 101 C1.24T −× Efficiency Considerations Efficiency is defined as the amount of useful output power, divided by the amount of power consumed: Efficiency % = 100IV IV ININ OUTOUT ×⎟⎟ Maintaining high efficiency serves two purposes. It reduces power dissipation in the power supply, reducing the need for heat sinks and thermal-design considerations and it reduces consumption of current for battery-powered applications. Reduced current draw from a battery increases the devices operating time, critical in hand held devices. There are mainly two loss terms in switching converters: Static losses and switching losses. Static losses are simply the power losses due to V.I or I 2R. For example, power is dissipated in the high-side switch during the on cycle. Power loss is equal to the high-side MOSFET RDS (ON) multiplied by the RMS Switch Current squared (ISW 2). During the off cycle, the low-side N-Channel MOSFET conducts, also dissipating power. Similarly, the inductor’s DCR and capacitor’s ESR also contribute to the I 2R losses. Device operating current also reduces efficiency by the product of the quiescent (operating) current and the supply voltage. The current required to

Micrel, Inc. MIC22950 February 2010 12 M9999-021910-B The tradeoff between changing these values is that with a larger inductor, there is a reduced peak-to-peak current which yields a greater efficiency at lighter loads. A larger output capacitor w ill improve transient response by providing a larger hold up reservoir of energy to the output. The integration of one pole-zero pair within the control loop greatly simplifies compensation. The optimum values for C COMP (in series with a 1k resistor) are shown below: CÆ LÈ 10-22µF 47-100µF 120-470µF 0.39 - 0.47µH NA 10*-20pF † 25-47pF 0.56 – 1.0µH 10 ‡-15pF* 22 †-39pF 56-100pF 1.2 – 2.2µH 10-22pF 22-68pF NA † VOUT > 1V; * VOUT > 1.4V; ‡ VOUT > 1.8V Feedback The MIC22950 provides a feedback pin to adjust the output voltage to the desired level. This pin connects internally to an error amplifier. The error amplifier then compares the voltage at the feedback to the internal 0.7V reference voltage and adjusts the output voltage to maintain regulation. To calculate the resistor divider network for the desired output is as follows: ⎛ − V R1R2 REF OUT Where V REF is 0.7V and V OUT is the desired output voltage. A 10k Ω or lower resistor value from the output to the feedback is reco mmended since large feedback resistor values increase the impedance at the feedback pin, making the feedback node more susceptible to noise pick-up. A small decoupling capacitor (22pF – 100pF) across the lower resistor can reduce noise pick- up by providing a low impedance path to ground. PWM Operation The MIC22950 is a voltage-mode, pulse-width modulation (PWM) controller. By controlling the ratio of on-to-off time, or duty cycle, a regulated DC output voltage is achieved. As load or supply voltage changes, so does the duty cycle to maintain a constant output voltage. In cases where the input supply runs into a dropout condition, the MIC2 2950 will run at 100% duty cycle. The MIC22950 provides switching frequency at 400kHz to 2MHz with synchronous internal MOSFETs. The internal MOSFETs include a high-side 11m Ω P-Channel MOSFET from the input supply to the switch pin and an 8mΩ N-Channel MOSFET from the switch pin-to-ground. Since the low-side N-Channel MOSFET provides the current during the off cycle, a freewheeling Schottky diode from the switch node-to-ground is not required. PWM control provides fixed-frequency operation. By maintaining a constant switching frequency, predictable fundamental and harmonic frequencies are achieved. Other methods of regulation, such as burst and skip modes, have frequency spectrums that change with load that can interfere with sensitive communication equipment. CF Pin Each switching cycle begins immediately following the discharge of the CF pin capacitor. From this point, a current source of 200µA flows from CF pin into the external capacitor connected to the CF pin. This creates a linear voltage ramp rising towards a threshold voltage of 1V. When this capacitor reaches the 1V threshold, it triggers the end of the switching cycle by discharging CF pin to ground via an internal N-Channel; at which point, the next cycle begins. The actual switching frequency can be approximated by using the following equation which accounts for internal delays and capacitance: ⎛ +⋅+ CF PINCF RAMPDELAY SW I CCVT Where: F SW = Switching Frequency TDELAY = CF pin Discharge time ~ 85ns VRAMP = Voltage ramp amplitude ~ 0.9V CCF = External CF capacitor = 68pF to 560pF CPIN = Internal Pin capacitance ~ 15pF ICF = CF current source = 200µA

Figure 3. Switching Frequency vs. CF Capacitance pin reaches 1V are utilized internally. connecting multiple voltage regulators together. nominal, POR/PG is asserted low immediately. metric voltage tracking at startup.

1. Externally driven from a voltage source
2. Externally attached capacitor sets output ramp

100% of the nominal set voltage. MIC22950’s to achieve these requirements.

Micrel, Inc. MIC22950 February 2010 14 M9999-021910-B Sequencing Window Sequencing CRC1 = CRC2 = 0nF,CDELAY1 = 3.3nF, CDELAY2 = 0nF Delayed Sequencing C RC1 = CRC2 = 0nF, CDELAY1 = 3.3nF, CDELAY2 = 6.8nF

Micrel, Inc. MIC22950 February 2010 15 M9999-021910-B Normal Tracking CCR1 = 3.3nF, CRC2 = 0nF, CDELAY1 = CDELAY2 = 3.3nF R1 = 1.1k, R2 = 698, R3 = 505, R4 = 698 Ratio Metric Tracking C CR1 = 3.3nF, CRC2 = 0nF, CDELAY1 = CDELAY2 = 3.3nF R1 = 1.1k, R2 = 698, R3 = 505, R4 = 698

switch; the second is over- temperature shutdown. account for a relatively small inaccuracy. Figure 4. Current Limit Detail is the thermal resistance of the ground plane to ambient. TA is the Operating Ambient temperature. Table 1. Power Dissipation (W) for 10A Output This is below our maximum of 125oC.

Micrel, Inc. MIC22950 February 2010 17 M9999-021910-B MIC22950 Schematic

Micrel, Inc. MIC22950 February 2010 18 M9999-021910-B Bill of Materials Item Part Number Manufacturer Description Qty. GRM21BR60J226ME39L muRata (1) C2012X5R0J226K TDK (2) C1, C2, C3, C4 08056D226MAT2A AVX (3) Capacitor, 22µF, 6.3V, X5R, 0805 4 GRM188R60J106ME47D muRata C1608X5R0J106K TDK C5 06036D106MAT2A AVX Capacitor, 10µF, 6.3V, X5R 0603 1 VJ0603Y390KXXMB Vitramon (4) 06033A390FAT2A AVX C6 C1608C0G1H390J TDK Capacitor, 39pF, 25V, X7R, 0603 1 VJ0603Y101KXAAT Vitramon 06025A101KAT2A AVX C7 C1608C0G1H101J TDK Ceramic Capacitor, 100pF, 50V, 0603 1 VJ0603Y391KXAAT Vitramon 06035A391JAT2A AVX C8 C1608C0G1H391J TDK Ceramic Capacitor, 390pF, 50V, 0603 1 GRM31CR60J476ME19L muRata C3216X5R0J476M TDK C9, C10 12066D476MAT2A AVX Capacitor, 47µF, 6.3V, 1206 2 C11 C13 VJ0603Y102KXXMB Vitramon Ceramic Capacitor, 1nf, 50V, 0603 2 C14 VJ0603Y103KXXMB Vitramon Ceramic Capacitor, 10nf, 50V, 0603 1 06035A121JAT2A AVX C1608COG1H121J TDK C12 GRM1885C1H121JA01D muRata Capacitor, 120pF, 50V, COG, 0603 CIN EEE-FPA122UAP Panasonic (5) 1200uF, 10V, 10x10.2-Case 1 L1 CDEP105ME-1R2MC Sumida (6) 1.2µH, 21A , Inductor 1 R1 CRCW06031101FRT1 Vishay Dale (4) Resistor, 1.1k, 1%, 0603 1 R2 CRCW0603698RFRT1 Vishay Dale Resistor, 698 Ω, 1%, 0603 1 R3 CRCW06032002FRT1 Vishay Dale Resistor, 20k, 1%, 0603 1 R4 CRCW06034752FRT1 Vishay Dale Resistor, 47.5k 1%, 0603 1 R5 CRCW06031003FRT1 Vishay Dale Resistor, 100k 1%, 0603 1 2N7002E(SOT-23) Vishay Corp CMDPM7002A Central Semiconductor (7) Signal MOSFET-SOT-236 1 U1 MIC22950YML Micrel 8) 10A Integrated Switch Synchronous Buck Regulator with Frequency Programmable to 2MHz 1 Notes: 1. muRata: www.murata.com 2. TDK: www.tdk.com 3. AVX: www.avx.com 4. Vishay: www.vishay.com 5. Panasonic: www.panasonic.com 6. Sumida: www.sumida.com 7. Central Semiconductor: www.centralsemi.com 8. Micrel, Inc.: www.micrel.com

Micrel, Inc. MIC22950 February 2010 19 M9999-021910-B PCB Layout Recommendation Top Assembly Middle Layer 1

Micrel, Inc. MIC22950 February 2010 20 M9999-021910-B PCB Layout Recommendation (Continued) Middle Layer 2 Top Layer

Micrel, Inc. MIC22950 February 2010 21 M9999-021910-B

Package Information

32-Pin 5mm x 5mm MLF® (ML)

Micrel, Inc. MIC22950 February 2010 22 M9999-021910-B Recommended Land Pattern for 32-Pin 5mm x 5mm MLF® Red circle indicates Thermal Via. Size should be 300 – 350mm in diameter, 1.00mm pitch, and it should be connected to GND plane for maximum thermal performance. Green rectangle (with shaded area) indicates Solder Stencil Opening on exposed pad area. Size should be 0.87 x 0.87mm in size, 1.07mm pitch. MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA TEL +1 (408) 944-0800 FAX +1 (408) 474-1000 WEB http://www.micrel.com The information furnished by Micrel in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use. Micrel reserves the right to change circuitry and specifications at any time without notification to the customer. Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser’s use or sale of Micrel Products for use in life support appliances, devices or systems is a Purchaser’s own risk and Purchaser agrees to fully indemnify Micrel for any damages resulting from such use or sale. © 2009 Micrel, Incorporated.