MML20211HT1 FREESCALE | Alldatasheet
Document overview
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Technical content
Features
Ultra Low Noise Figure: 0.65 dB @ 2140 MHz Frequency: 1400- -2800 MHz High Reverse Isolation: - -35 dB @ 2140 MHz P1dB: 21.3 dBm @ 2140 MHz Small- -Signal Gain: 18.6 dB @ 2140 MHz (adjustable externally) Third Order Output Intercept Point: 33 dBm @ 2140 MHz Active Bias Control (adjustable externally) Single 5 V Supply Supply Current: 60 mA 50 Ohm Operation (some external matching required) Cost- -effective 8- -pin, 2 mm DFN Surface Mount Plastic Package In Tape and Reel. T1 Suffix = 1,000 Units, 12 mm Tape Width, 7- -inch Reel. Table 1. Typical Performance
- VDD =5V d c ,TA =2 5C, 50 ohm system, application circuit
tuned for specified frequency.
- Noise figure value calculated with connector losses removed.
Table 2. Maximum Ratings Table 3. Thermal Characteristics Select Documentation/Application Notes - - AN1955. Freescale Semiconductor, Inc., 2011, 2014.All rights reserved.
Figure 1. Pin Connections
36 RFout
Table 4. Electrical Characteristics(VDD = 5 Vdc, 2140 MHz, TA =2 5C, 50 ohm system, in Freescale Application Circuit)
- Noise figure value calculated with connector losses removed.
- DC current measured with no RF signal applied.
Table 5. Functional Pin Description
1 RFin
2 RFin
3 RF Input Matching Termination
4 Bias Voltage DC Supply
5 RF Feedback
6 RFout/DC Supply
7 RFout/DC Supply
8 No Connection
Table 6. ESD Protection Characteristics Table 7. Moisture Sensitivity Level
50 OHM APPLICATION CIRCUIT: 2140 MHz
Figure 2. MML20211HT1 Test Circuit Schematic Table 8. MML20211HT1 Test Circuit Component Designations and Values
decoupling and grounding are employed. Figure 3. MML20211HT1 Test Circuit Component Layout
50 OHM TYPICAL CHARACTERISTICS: 2140 MHz
Figure 4. S11 versus Frequency versus Figure 5. S12 versus Frequency versus Figure 6. S21 versus Frequency versus Figure 7. S22 versus Frequency versus
Figure 8. Noise Figure versus Frequency Figure 9. Power Gain versus Output Power Figure 10. Third Order Output Intercept Point Figure 11. Third Order Output Intercept Point Figure 12. P1dB versus Frequency versus
1 MHz Tone Spacing
50 OHM APPLICATION CIRCUIT: 1800 MHz
Figure 13. MML20211HT1 Test Circuit Schematic Table 9. MML20211HT1 Test Circuit Component Designations and Values
decoupling and grounding are employed. Figure 14. MML20211HT1 Test Circuit Component Layout
50 OHM TYPICAL CHARACTERISTICS: 1800 MHz
Figure 15. S11 versus Frequency Figure 16. S12 versus Frequency Figure 17. S21 versus Frequency Figure 18. S22 versus Frequency
Figure 19. Noise Figure versus Frequency Figure 20. Third Order Output Intercept Point
50 OHM APPLICATION CIRCUIT: 2700 MHz
Figure 21. MML20211HT1 Test Circuit Schematic Table 10. MML20211HT1 Test Circuit Component Designations and Values Note: Component numbers C6 and R1 are labeled on board but not placed.
decoupling and grounding are employed. Figure 22. MML20211HT1 Test Circuit Component Layout Note: Component numbers C6* and R1* are labeled on board but not placed.
50 OHM TYPICAL CHARACTERISTICS: 2700 MHz
Figure 23. S11 versus Frequency Figure 24. S12 versus Frequency Figure 25. S21 versus Frequency Figure 26. S22 versus Frequency
Figure 27. Noise Figure versus Frequency Figure 28. Third Order Output Intercept Point
PRODUCT DOCUMENTATION, TOOLS AND SOFTWARE Refer to the following resources to aid your design process. Application Notes AN1955: Thermal Measurement Methodology of RF Power Amplifiers Software .s2p File Development Tools Printed Circuit Boards For Software and Tools, do a Part Number search at http://www.freescale.com, and select the “Part Number” link. Go to Software & Tools on the part’s Product Summary page to download the respective tool. FAILURE ANALYSIS At this time, because of the physical characteristics of the part, failure analysis is limited to electrical signature analysis. In cases where Freescale is contractually obligated to perform failure analysis (FA) services, full FA may be performed by third party vendors with moderate success. For updates contact your local Freescale Sales Office.
REVISION HISTORY
The following table summarizes revisions to this document. Revision Date Description 0 Aug. 2011 Initial Release of Data Sheet 1 Sept. 2014 Table 2, Maximum Ratings: updated Junction Temperature from 150C to 175C to reflect recent test results of the device, p. 1 Table 6, ESD Protection Characteristics: removed the word “Minimum” after the ESD class rating. ESD ratings are characterized during new product development but are not 100% tested during production. ESD ratings provided in the data sheet are intended to beused as a guideline when handling ESD sensitive devices, p. 2 Revised Failure Analysis information, p. 19
Information in this document is provided solely to enablesystem and software implementers to use Freescale products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. Freescale reserves the right to make changes without further notice to any products herein. Freescale makes no warranty, representation, or guarantee regarding the suitability of its products for any particularpurpose, nor does Freescale assume any liability arisingout of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including “typicals,” must be validated for each customer application by customer’s technical experts. Freescale does not convey any license under its patent rights nor the rights of others. Freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: freescale.com/SalesTermsandConditions. Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., respective owners. E 2011, 2014 Freescale Semiconductor, Inc. How to Reach Us: Home Page: freescale.com Web Support: freescale.com/support Document Number: MML20211H Rev. 1, 9/2014