MMJT9410 ONSEMI | Alldatasheet

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Technical content

Features

  • Collector −Emitter Sustaining V oltage − VCEO(sus) = 30 Vdc (Min) @ IC = 10 mAdc
  • High DC Current Gain − hFE = 85 (Min) @ IC = 0.8 Adc = 60 (Min) @ IC = 3.0 Adc
  • Low Collector −Emitter Saturation V oltage − VCE(sat) = 0.2 Vdc (Max) @ IC = 1.2 Adc = 0.45 Vdc (Max) @ IC = 3.0 Adc
  • SOT−223 Surface Mount Packaging
  • Epoxy Meets UL 94 V−0 @ 0.125 in
  • ESD Ratings: Human Body Model, 3B; > 8000 V Machine Model, C; > 400 V
  • Pb−Free Package is Available MAXIMUM RATINGS Rating Symbol Value Unit Collector −Emitter Voltage VCEO 30 Vdc Collector −Base Voltage VCB 45 Vdc Emitter −Base Voltage VEB ± 6.0 Vdc Base Current − Continuous IB 1.0 Adc Collector Current − Continuous − Peak IC 3.0 5.0 Adc Total Power Dissipation @ TC = 25°C Derate above 25°C Total PD @ TA = 25°C mounted on 1” sq. (645 sq. mm) Collector pad on FR−4 bd material Total P D @ TA = 25°C mounted on 0.012” sq. (7.6 sq. mm) Collector pad on FR−4 bd material PD 3.0 1.7 0.75 W mW/°C W Operating and Storage Junction Temperature Range TJ, Tstg −55 to +150 THERMAL CHARACTERISTICS Characteristic Symbol Max Unit Thermal Resistance, Junction−to−Case R/C0113JC 42 °C/W Thermal Resistance, Junction−to−Ambient on 1” sq. (645 sq. mm) Collector pad on FR−4 bd material R/C0113JA 75 °C/W Thermal Resistance, Junction−to−Ambient on 0.012” sq. (7.6 sq. mm) Collector pad on FR−4 bd material R/C0113JA 165 °C/W Maximum Lead Temperature for Soldering Purposes, 1/8” from case for 5 seconds TL 260 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. http://onsemi.com Schematic C 2,4 B 1 E 3 Top View Pinout C CEB 123 POWER BJT IC = 3.0 AMPERES BVCEO = 30 VOLTS VCE(sat) = 0.2 VOLTS Preferred devices are recommended choices for future use and best overall value. Device Package Shipping †

ORDERING INFORMATION

MMJT9410 SOT−223 1000 / Tape & Ree l MMJT9410G SOT−223 (Pb−Free) 1000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. SOT−223 (TO−261) CASE 318E STYLE 1 MARKING DIAGRAM AYW 9410/C0071 /C0071 A = Assembly Location Y = Year W = Work Week 9410 = Device Code /C0071= Pb−Free Package (Note: Microdot may be in either location)

  1. Pulse Test: Pulse Width ≤ 300 /C0109s, Duty Cycle ≤ 2%.

Figure 1. Collector Saturation Region Figure 2. Collector Saturation Region

Figure 9. Current−Gain Bandwidth Product Figure 10. Active Region Safe Operating Area Figure 11. Power Derating dissipation than the curves indicate. Figure 12. At high case temperatures, thermal limitations the limitations imposed by secondary breakdown. Figure 12. Thermal Response

0.01 R/C0113JA(t) = r(t) /C0113JA

http://onsemi.com PACKAGE DIMENSIONS SOT−223 (TO−261) CASE 318E−04 ISSUE L *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* STYLE 1: PIN 1. BASE 2. COLLECTOR 3. EMITTER 4. COLLECTOR 1.5 0.059 /C0466mm inches/C0467SCALE 6:1 3.8 0.15 2.0 0.079 6.3 0.2482.3 0.091 2.3 0.091 2.0 0.079 D E b e 12 3 0.08 (0003) A C NOTES: /Em/figure1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. /Em/figure2. CONTROLLING DIMENSION: INCH. HE DIM A MIN NOM MAX MIN MILLIMETERS 1.50 1.63 1.75 0.060 INCHES A1 0.02 0.06 0.10 0.001 b 0.60 0.75 0.89 0.024 b1 2.90 3.06 3.20 0.115 c 0.24 0.29 0.35 0.009 D 6.30 6.50 6.70 0.249 E 3.30 3.50 3.70 0.130 e 2.20 2.30 2.40 0.087 0.85 0.94 1.05 0.033 0.064 0.068 0.002 0.004 0.030 0.035 0.121 0.126 0.012 0.014 0.256 0.263 0.138 0.145 0.091 0.094 0.037 0.041 NOM MAX L1 1.50 1.75 2.00 0.060 6.70 7.00 7.30 0.264 0.069 0.078 0.276 0.287 HE − − 0° 10° 0° 10° /C0113 /C0113 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. MMJT9410/D PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative