MMG3007NT1_08 FREESCALE | Alldatasheet
Document overview
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- PDF pages: 15
Technical content
Features
- Frequency: 0 to 6000 MHz
- P1dB: 16 dBm @ 900 MHz
- Small-Signal Gain: 19 dB @ 900 MHz
- Third Order Output Intercept Point: 30 dBm @ 900 MHz
- Single 5 Volt Supply
- Internally Matched to 50 Ohms
- Low Cost SOT-89 Surface Mount Package
- RoHS Compliant
- In Tape and Reel. T1 Suffix = 1000 Units per 12 mm, 7 inch Reel. CASE 1514-02, STYLE 1 SOT-89 PLASTIC 1 2 3
Table 1. Typical Performance (1) Table 2. Maximum Ratings
- For reliable operation, the junction temperature should not
Table 3. Thermal Characteristics (VCC = 5 Vdc, ICC = 47 mA, TC = 25°C) Select Documentation/Application Notes - AN1955. © Freescale Semiconductor, Inc., 2005-2008. All rights reserved.
Table 4. Electrical Characteristics (VCC = 5 Vdc, 900 MHz, TC = 25°C, 50 ohm system, in Freescale Application Circuit)
- For reliable operation, the junction temperature should not exceed 150 °C.
Table 5. Functional Pin Description
1 RFin
2 Ground
3 RFout/DC Supply
Table 6. ESD Protection Characteristics Table 7. Moisture Sensitivity Level Figure 1. Functional Diagram
50 OHM TYPICAL CHARACTERISTICS
Figure 2. Small-Signal Gain (S21) versus Figure 3. Input/Output Return Loss versus Figure 4. Small-Signal Gain versus Output
1960 MHz
14 VCC = 5 Vdc
Figure 5. P1dB versus Frequency Figure 6. Collector Current versus Collector Figure 7. Third Order Output Intercept Point
1 MHz Tone Spacing
900 MHz
2600 MHz
3500 MHz
2140 MHz
Figure 8. Third Order Output Intercept Point Figure 9. Third Order Output Intercept Point Figure 10. Third Order Intermodulation versus Figure 11. MTTF versus Junction Temperature Figure 12. Noise Figure versus Frequency Figure 13. Single-Carrier W-CDMA Adjacent
50 OHM APPLICATION CIRCUIT: 40-300 MHz
Figure 14. 50 Ohm Test Circuit Schematic Figure 15. S21, S11 and S22 versus Frequency Figure 16. 50 Ohm Test Circuit Component Layout Table 8. 50 Ohm Test Circuit Component Designations and Values
50 OHM APPLICATION CIRCUIT: 300-3600 MHz
Figure 17. 50 Ohm Test Circuit Schematic Figure 18. S21, S11 and S22 versus Frequency Figure 19. 50 Ohm Test Circuit Component Layout Table 9. 50 Ohm Test Circuit Component Designations and Values
Table 10. Common Emitter S-Parameters (VCC = 5 Vdc, ICC = 47 mA, TC = 25°C, 50 Ohm System)
Table 10. Common Emitter S-Parameters (VCC = 5 Vdc, ICC = 47 mA, TC = 25°C, 50 Ohm System) (continued)
Figure 20. Recommended Mounting Configuration
- THERMAL AND RF GROUNDING CONSIDERATIONS SHOULD BE
- DEPENDING ON PCB DESIGN RULES, AS MANY VIAS AS
POSSIBLE SHOULD BE PLACED ON THE LANDING PATTERN.
- IF VIAS CANNOT BE PLACED ON THE LANDING PATTERN, THEN
- RECOMMENDED VIA PATTERN SHOWN HAS 0.381 x 0.762 MM
Refer to the following documents to aid your design process. Application Notes
- AN1955: Thermal Measurement Methodology of RF Power Amplifiers
- AN3100: General Purpose Amplifier Biasing
REVISION HISTORY
The following table summarizes revisions to this document. Revision Date Description 3 Mar. 2007 • Corrected and updated Part Numbers in Tables 8 and 9, Component Designations and Values, to RoHS compliant part numbers, p. 6, 7 4 July 2007 • Replaced Case Outline 1514-01 with 1514-02, Issue D, p. 1, 11-13. Case updated to add missing dimension for Pin 1 and Pin 3. 5 Mar. 2008 • Removed Footnote 2, Continuous voltage and current applied to device, from Table 2, Maximum Ratings, p. 1
- Corrected Fig. 13, Single-Carrier W-CDMA Adjacent Channel Power Ratio versus Output Power y-axis (ACPR) unit of measure to dBc, p. 5
- Corrected S-Parameter table frequency column label to read MHz versus GHz and corrected frequency values from GHz to MHz, p. 8, 9
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