MMG3006NT1_08 FREESCALE | Alldatasheet

Document overview

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Technical content

Features

  • Frequency: 400-2400 MHz
  • P1dB: 33 dBm @ 900 MHz
  • Small-Signal Gain: 17.5 dB @ 900 MHz
  • Third Order Output Intercept Point: 49 dBm @ 900 MHz
  • Single 5 Volt Supply
  • Internally Input Prematched to 50 Ohms
  • RoHS Compliant
  • In Tape and Reel. T1 Suffix = 1,000 Units per 12 mm, 13 inch Reel. 400-2400 MHz, 17.5 dB 33 dBm InGaP HBT MMG3006NT1 CASE 1898-01 QFN 4x4 PLASTIC

Table 1. Typical Performance (1) Table 2. Maximum Ratings

  1. For reliable operation, the junction temperature should not

Table 3. Thermal Characteristics (VDC = 5 Vdc, IDC = 850 mA, TC = 25°C) Select Documentation/Application Notes - AN1955. © Freescale Semiconductor, Inc., 2008. All rights reserved.

Table 4. Electrical Characteristics (VDC = 5 Vdc, 900 MHz, TC = 25°C, 50 ohm system, in Freescale Application Circuit)

  1. For reliable operation, the junction temperature should not exceed 150 °C.

Table 5. Functional Pin Description

Description

VBA 1 Bias voltage supply. RFin 2, 3, 4 RF input for the power amplifier. This pin is DC-coupled and requires a DC-blocking series capacitor. RFout/ VCC 9, 10, 11, 12 RF output for the power amplifier. This pin is DC-coupled and requires a DC-blocking series capacitor. VCC 16 Collector voltage supply. GND Backside Center Metal The center metal base of the QFN package provides both DC and RF ground as well as heat sink contact for the power amplifier. Table 6. ESD Protection Characteristics Table 7. Moisture Sensitivity Level Figure 1. Pin Connections

50 OHM TYPICAL CHARACTERISTICS

Figure 2. Collector Current versus Bias Voltage Figure 3. MTTF versus Junction Temperature

50 OHM APPLICATION CIRCUIT: 900 MHz

Figure 4. 50 Ohm Test Circuit Schematic Table 8. 50 Ohm Test Circuit Component Designations and Values

Figure 5. 50 Ohm Test Circuit Component Layout

50 OHM TYPICAL CHARACTERISTICS: 900 MHz

Figure 6. Small-Signal Gain (S21) versus Figure 7. Input Return Loss (S11) versus Figure 8. Output Return Loss (S22) versus Figure 9. P1dB versus Frequency Figure 10. Third Order Output Intercept

1 MHz Tone Spacing

Figure 11. Noise Figure versus Frequency

Figure 12. IS-95 Adjacent Channel Power Ratio Figure 13. IS-95 Adjacent Channel Power Ratio

50 OHM APPLICATION CIRCUIT: 1960 MHz

Figure 14. 50 Ohm Test Circuit Schematic Table 9. 50 Ohm Test Circuit Component Designations and Values

Figure 15. 50 Ohm Test Circuit Component Layout

50 OHM TYPICAL CHARACTERISTICS: 1960 MHz

Figure 16. Small-Signal Gain (S21) versus Figure 17. Input Return Loss (S11) versus Figure 18. Output Return Loss (S22) versus Figure 19. P1dB versus Frequency Figure 20. Third Order Output Intercept Figure 21. Noise Figure versus Frequency

Figure 22. IS-95 Adjacent Channel Power Ratio Figure 23. IS-95 Adjacent Channel Power Ratio Figure 24. Single-Carrier W-CDMA Adjacent

50 OHM APPLICATION CIRCUIT: 2140 MHz

Figure 25. 50 Ohm Test Circuit Schematic Table 10. 50 Ohm Test Circuit Component Designations and Values

Figure 26. 50 Ohm Test Circuit Component Layout

50 OHM TYPICAL CHARACTERISTICS: 2140 MHz

Figure 27. Small-Signal Gain (S21) versus Figure 28. Input Return Loss (S11) versus Figure 29. Output Return Loss (S22) versus Figure 30. P1dB versus Frequency Figure 31. Third Order Output Intercept Figure 32. Noise Figure versus Frequency

Figure 33. IS-95 Adjacent Channel Power Ratio Figure 34. IS-95 Adjacent Channel Power Ratio Figure 35. Single-Carrier W-CDMA Adjacent

Table 11. Common Emitter S-Parameters (V DC = 5 Vdc, IDC = 850 mA, TC = 25/C0053C, 50 Ohm System)

Table 11. Common Emitter S-Parameters (V DC = 5 Vdc, IDC = 850 mA, TC = 25/C0053C, 50 Ohm System) (continued)

Figure 36. Recommended Mounting Configuration

  1. THERMAL AND RF GROUNDING CONSIDERATIONS SHOULD BE
  2. DEPENDING ON PCB DESIGN RULES, AS MANY VIAS AS

METAL GROUND LANDING PATTERN.

  1. REFER TO FREESCALE APPLICATION NOTE AN2467 FOR

ADDITIONAL PQFN PCB GUIDELINES.

Refer to the following documents to aid your design process. Application Notes

  • AN1955: Thermal Measurement Methodology of RF Power Amplifiers
  • AN3100: General Purpose Amplifier Biasing

REVISION HISTORY

The following table summarizes revisions to this document. Revision Date Description 0 Jan. 2008 • Initial Release of Data Sheet 1 Mar. 2008 • Corrected Table 7. Moisture Sensitivity Level Rating from 3 to 1, p. 3

  • Corrected S-Parameter table frequency column label to read “MHz” versus “GHz”, p. 17, 18 2 Mar. 2008 • Corrected Tape and Reel information from 330 mm to 12 mm, p. 1
  • Corrected Figs. 24, 35, Single-Carrier W-CDMA Adjacent Channel Power Ratio versus Output Power y-axis (ACPR) unit of measure to dBc, p. 12, 16

Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”, must be validated for each customer application by customer’s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. Freescale/C0116 and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. © Freescale Semiconductor, Inc. 2008. All rights reserved. How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516

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