MMG2401NR2 FREESCALE | Alldatasheet
Document overview
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- PDF pages: 12
Technical content
- 26.5 dBm P1dB @ 2450 MHz
- Power Gain: 27.5 dB Typ (@ f = 2450 MHz, Class AB)
- High Gain, High Efficiency and High Linearity
- EVM = 3% Typ @ Pout = +19 dBM, 14% PAE
- RoHS Compliant
- In Tape and Reel. R2 Suffix = 1,500 Units per 12 mm, 7 inch Reel.
Table 1. Maximum Ratings Table 2. Thermal Characteristics Table 3. ESD Protection Characteristics Table 4. Moisture Sensitivity Level © Freescale Semiconductor, Inc., 2006. All rights reserved.
Table 5. Electrical Characteristics (TA = 25°C unless otherwise noted.) VCC = 3.3 Vdc, VBIAS = 3 Vdc, ICQ = 83 mA, f = 2450 MHz
Table 6. Functional Pin Description
Description
VB1 1 Base power supply for first stage amplifier. RFIN 2, 3 RF input for the power amplifier. This pin is DC-shorted to GND and AC-coupled to the transistor base of the first stage. VBIAS 4 Detector bias voltage supply. VREF 5 Detector output voltage reference. Vout - VREF is useful for tracking detector performance over temperature. VOUT 6 Detector output voltage. VCC2 7 Collector power supply for second stage amplifier. RFOUT 8, 9 RF output for the power amplifier. This pin is DC-coupled and requires a DC-blocking series capacitor. VB2 10 Base power supply for second stage amplifier. NC 11 Not connected. VCC1 12 Collector power supply for first stage amplifier. GND Backside Center Metal The center metal base of the QFN 3x3 package provides both DC and RF ground as well as heat sink contact for the power amplifier. Figure 1. Pin Connections
Figure 2. MMG2401NR2 Test Circuit Schematic Table 7. MMG2401NR2 Test Circuit Component Designations and Values
Figure 3. MMG2401NR2 Test Circuit Component Layout no impact on form, fit or function of the current product.
Figure 14. MMG2401NR2 Specific Mechanical Outline Information
- DIMENSION b APPLIES TO PLATED TERMINAL AND IS
- N IS THE NUMBER OF TERMINALS (12).
Ny IS THE NUMBER OF TERMINALS IN Y−DIRECTION.
- ALL DIMENSIONS ARE IN MILLIMETERS.
3.00 BSC
B A 0.1 C C0.1 PIN 1 INDEX AREA EXPOSED DIE ATTACH PAD 10 12 0.10 8X 0.5 12X9 DETAIL G M M 1.55 1.25 1.55 1.25 0.30 0.18 12X DETAIL M DETAIL N PIN 1 INDEX 0.75 0.50 CA B VIEW M - M M NOTES: 1. ALL DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. THE COMPLETE JEDEC DESIGNATOR FOR THIS PACKAGE IS: HF−PQFP−N. 4. FOR ANVIL SINGULATED QFN PACKAGES, MAXIMUM DRAFT ANGLED IS 12 . 5. PACKAGE WARPAGE MAX 0.05 MM. 6. CORNER CHAMFER MAY NOT BE PRESENT. DIMENSIONS OF OPTIONAL FEATURES ARE FOR REFERENCE ONLY. 7. CORNER LEADS CAN BE USED FOR THERMAL OR GROUND AND ARE TIED TO THE DIE ATTACH PAD. THESE LEADS ARE NOT INCLUDED IN THE LEAD COUNT. 8. COPLANARITY APPLIES TO LEAD, CORNER LEADS, AND DIE ATTACH PAD. 9. THIS DIMENSION APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.20 MM AND 0.25 MM FROM TERMINAL TIP . /C0095 CASE 1483-01 ISSUE A QFN 3x3 Page 1 of 3
PREFERRED CORNER CONFIGURATION DETAIL N CORNER CONFIGURATION /C0095(45 ) (0.25) (0.25) 0.60 0.24 0.60 0.24 CASE 1483-01 ISSUE A QFN 3x3 DETAIL G VIEW ROTATED 90 CW 1.0 0.8 /C0095 1.00 0.75 0.05
0.00 SEATING
C 0.1 0.05 C C Page 2 of 3
/C0095(45 ) DETAIL M PREFERRED BACKSIDE PIN 1 INDEX 0.65 0.30 TIE BAR MARK OPTION7 PIN 1 ID 4X 0.23 0.13 (0.35) DETAIL M BACKSIDE PIN 1 INDEX OPTION DETAIL S DETAIL M BACKSIDE PIN 1 INDEX OPTION (0.45) PIN 1 ID R0.2 DETAIL S BACKSIDE PIN 1 INDEX 0.217 0.137 (0.25) 0.217 0.137 (0.1) (0.25) Page 3 of 3
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