MMFT2955E ONSEMI | Alldatasheet
Document overview
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Technical content
Features
- Silicon Gate for Fast Switching Speeds
- The SOT−223 Package can be Soldered Using Wave or Reflow
- The Formed Leads Absorb Thermal Stress During Soldering, Eliminating the Possibility of Damage to the Die
- Pb−Free Package is Available MAXIMUM RATINGS (TA = 25°C unless otherwise noted) Rating Symbol Value Unit Drain−to−Source Voltage VDS 60 Vdc Gate−to−Source Voltage − Continuous VGS ±15 Drain Current − Continuous Drain Current − Pulsed ID IDM 1.2 4.8 Adc Total Power Dissipation @ TA = 25°C Derate above 25°C PD (Note 1) 0.8 6.4 W mW/°C Operating and Storage Temperature Range TJ, Tstg −65 to 150 °C Single Pulse Drain−to−Source Avalanche Energy − Starting TJ = 25°C (VDD = 25 V, VGS = 10 V, Peak IL= 1.2 A, L = 0.2 mH, RG = 25 /C0087) EAS 108 mJ THERMAL CHARACTERISTICS Thermal Resistance, Junction−to−Ambient (surface mounted) R/C0113JA 156 °C/W Maximum Temperature for Soldering Purposes, Time in Solder Bath TL 260 S Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Power rating when mounted on FR−4 glass epoxy printed circuit board using recommended footprint.
1 AMPERE, 60 VOLTS
RDS(on) = 300 m/C0087 Device Package Shipping †
ORDERING INFORMATION
MMFT2955ET1 SOT −223 1000 Tape & Reel MMFT2955ET3 SOT −223 4000 Tape & Reel D S G P−Channel Preferred devices are recommended choices for future use and best overall value. http://onsemi.com MMFT2955ET1G SOT −223 (Pb−Free)
1000 Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. TO−261AA CASE 318E STYLE 3 A = Assembly Location Y = Year W = Work Week /C0071 = Pb−Free Package 2955E = Device Code MARKING DIAGRAM AND PIN ASSIGNMENT Source Drain Gate
4 Drain
(Note: Microdot may be in either location) AYW 2955E /C0071 /C0071
- Switching characteristics are independent of operating junction temperature.
- Pulse Test: Pulse Width ≤300 /C0109s, Duty Cycle ≤2%.
Figure 1. On Region Characteristics Figure 2. Gate−Threshold Voltage Variation
10 V 8 V
Figure 8. Thermal Response
0.05 R/C0113JA(t) = r(t) R/C0113JA
are present. Full or half−bridge PWM DC motor controllers are common applications requiring CSOA data. package, and circuit impedances. Maximum device stress occurs during trr as the diode goes from conduction to reverse blocking. source−drain diode current just prior to the onset of commutation. VR is specified at 80% rated BVDSS to ensure that the CSOA stress is maximized as IS decays from IRM to zero. RGS should be minimized during commutation. TJ has only a second order effect on CSOA. attained with dIS/dt of 400 A//C0109s. Figure 9. Commutating Waveforms Figure 10. Commutating Safe Operating
0.25 IRM
http://onsemi.com PACKAGE DIMENSIONS SOT−223 (TO−261) CASE 318E−04 ISSUE L D E b e 12 3 0.08 (0003) A C NOTES: /Em/figure1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. /Em/figure2. CONTROLLING DIMENSION: INCH. 1.5 0.059 /C0466mm inches/C0467SCALE 6:1 3.8 0.15 2.0 0.079 6.3 0.2482.3 0.091 2.3 0.091 2.0 0.079 SOLDERING FOOTPRINT* HE DIM A MIN NOM MAX MIN MILLIMETERS 1.50 1.63 1.75 0.060 INCHES A1 0.02 0.06 0.10 0.001 b 0.60 0.75 0.89 0.024 b1 2.90 3.06 3.20 0.115 c 0.24 0.29 0.35 0.009 D 6.30 6.50 6.70 0.249 E 3.30 3.50 3.70 0.130 e 2.20 2.30 2.40 0.087 0.85 0.94 1.05 0.033 0.064 0.068 0.002 0.004 0.030 0.035 0.121 0.126 0.012 0.014 0.256 0.263 0.138 0.145 0.091 0.094 0.037 0.041 NOM MAX L1 1.50 1.75 2.00 0.060 6.70 7.00 7.30 0.264 0.069 0.078 0.276 0.287 HE − − 0° 10° 0° 10°/C0113 /C0113 STYLE 3: PIN 1. GATE 2. DRAIN 3. SOURCE 4. DRAIN *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 MMFT2955E/D LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative