MMDT3904 LUGUANG | Alldatasheet

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Technical content

Dual NPN Small Signal Surface Mount Transistor

FEATURES

z Epitaxial planar die construction. z Ideal for low power amplification and switching. z Ultra-small surface mount package z Also available in lead free version.

APPLICATIONS

z General switching and amplification SOT-363

ORDERING INFORMATION

N o . M a r k i n g P a c k a g e C o d e MMDT3904 K6N SOT-363 MAXIMUM RATING @ Ta=25℃ unless otherwise specified SYMBOL PARAMETER VALUE UNIT VCBO collector-base voltage 60 V VCEO collector-emitter voltage 40 V VEBO emitter-base voltage 6 V IC collector current -continuous 0.2 A Ptot total power dissipation 0.2 W RθJA Thermal Resistance, Junction to Ambient 625 ℃/W Tstg storage temperature 150 °C Tj junction temperature -55 to +150 °C MMDT3904 http://www.lgesem i.com mail:lge@lgesemi.comRevision:20170701-P1

ELECTRICAL CHARACTERISTICS @ Ta=25℃ unless otherwise specified SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT V(BR)CBO Collector-base breakdown voltage I C=10μA,IE=0 60 V V(BR)CEO Collector-emitter breakdown voltage I C=1mA,IB=0 40 V V(BR)EBO Emitter-base breakdown voltage I E=10μA,IC=0 5 V ICEX collector cut-off current VCE=30V,VEB(OFF)=3.0V - 50 nA IBL Base cut-off current VCE=30V,VEB(OFF)=3.0V - 50 nA hFE DC current gain VCE =1V,IC= 0.1mA VCE =1V,IC =1mA VCE =1V,IC =10mA VCE =1V,IC =50mA VCE =1V,IC =100mA 100 300 IC =10mA,IB =1mA - 200 mV VCE(sat) collector-emitter saturation voltage IC =50mA,IB =5mA - 300 mV IC =10mA,IB =1mA 650 850 mV VBE(sat) base-emitter saturation voltage IC =50mA, IB =5mA - 950 mV Cobo Output capacitance IE =0, VCB =5V, f =1MHz - 4 pF Cibo Input capacitance IC=0, VEB =0.5V, f =1MHz - 8 pF fT transition frequency IC=10mA,VCE=20V,f=100MHz 300 - MHz NF noise figure IC=0.1mA,VCE =5V,RS=1kΩ, f = 1kHz - 5 dB td delay time - 35 ns tr rise time VCC=3V,VBE(off)=-0.5V IC=10mA IB1=1mA - 35 ns ts storage time - 200 ns tf fall time VCC=3V,IC=10mA IB1=IB2=1mA - 50 ns TYPICAL CHARACTERISTICS @ Ta=25℃ unless otherwise specified http://www.lgesem i.com mail:lge@lgesemi.comRevision:20170701-P1 MMDT3904

http://www.lgesem i.com mail:lge@lgesemi.comRevision:20170701-P1 MMDT3904

Plastic surface mounted package SOT-363 SOLDERING FOOTPRINT Unit : mm PACKAG E INFORMATION SOT-363 Dim Min Max A 2.00 2.20 B 1.15 1.35 C 0.95 Typical D 0.25 Typical E 0.25 0.40 G 0.60 0.70 H 0.02 0.10 J 0.10 Typical K 2.2 2.4 All Dimensions in mm Device Package Shipping MMDT3904 SOT-363 3000/Tape&Reel 0.50 0.40 1.90 0.650.65 A B C D E G K J H http://www.lgesem i.com mail:lge@lgesemi.comRevision:20170701-P1 MMDT3904