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1Motorola TMOS Power MOSFET Transistor Device Data /C0068/C0101/C0115/C0105/C0103/C0110/C0101/C0114/C0039/C0115 /C0068/C0097/C0116/C0097 /C0083/C0104/C0101/C0101/C0116 Medium Power Surface Mount Products /C0084/C0077/C0079/C0083 /C0068/C0117/C0097/C0108 /C0078/C0045/C0067/C0104/C0097/C0110/C0110/C0101/C0108 /C0070/C0105/C0101/C0108/C0100 /C0069/C0102/C0102/C0101/C0099/C0116 /C0084/C0114/C0097/C0110/C0115/C0105/C0115/C0116/C0111/C0114 MiniMOS devices are an advanced series of power MOSFET s which utilize Motorola’s High Cell Density HDTMO S process. These miniature surface mount MOSFET s feature ultra low RDS(on) and true logic level performance. They are capable of withstanding high energy in the avalanche and commutation modes and the drain–to–source diode has a very low reverse recovery time. MiniMOS devices are designed for use in low voltage, high speed switching applications where power efficiency is important. Typical applications are dc–dc converters, and power management in portable and battery powered products such as computers, printers, cellular and cordless phones. They can also be used for low voltage motor controls in mass storage products such as disk drives and tape drives. The avalanche energy is specified to eliminate the guesswork in designs where inductive loads are switched and offer additional safety margin against unexpected voltage transients.

  • Ultra Low RDS(on) Provides Higher Efficiency and Extends Battery Life
  • Logic Level Gate Drive — Can Be Driven by Logic ICs
  • Miniature SO–8 Surface Mount Package — Saves Board Space
  • Diode Is Characterized for Use In Bridge Circuits
  • Diode Exhibits High Speed, With Soft Recovery
  • IDSS Specified at Elevated Temperature
  • Mounting Information for SO–8 Package Provided
  • Avalanche Energy Specified MAXIMUM RATINGS (TJ = 25°C unless otherwise noted) Rating Symbol Value Unit Drain–to–Source Voltage VDSS 40 Vdc Drain–to–Gate Voltage (RGS = 1.0 MΩ ) VDGR 40 Vdc Gate–to–Source Voltage — Continuous VGS ± 20 Vdc Drain Current — Continuous @ TA = 25°C (1) Drain Current — Continuous @ TA = 70°C (1) Drain Current — Pulsed Drain Current (4) ID ID IDM 3.4 3.0 Adc Apk Total Power Dissipation @ TA = 25°C (1) Linear Derating Factor (1) PD 2.0 Watts mW/ °C Total Power Dissipation @ TA = 25°C (2) Linear Derating Factor (2) PD 1.39 11.11 Watts mW/ °C Operating and Storage T emperature Range TJ, Tstg – 55 to 150 °C Single Pulse Drain–to–Source Avalanche Energy — Starting TJ = 25°C (VDD = 25 Vdc, VGS = 10 Vdc, Peak IL = 9.0 Apk, L = 4.0 mH, VDS = 40 Vdc) EAS 162 mJ THERMAL RESISTANCE Rating Symbol Typ. Max. Unit Thermal Resistance — Junction to Ambient, PCB Mount (1) — Junction to Ambient, PCB Mount (2) R θJA R θJA 62.5 °C/W (1)When mounted on 1 inch square FR–4 or G–10 board (VGS = 10 V, @ 10 Seconds) (2)When mounted on minimum recommended FR–4 or G–10 board (VGS = 10 V, @ Steady State) DEVICE MARKING ORDERING INFORMATION D3N04H Device Reel Size Tape Width Quantity D3N04H MMDF3N04HDR2 13″ 12 mm embossed tape 2500 units Designer’s Data for “Worst Case” Conditions— The Designer’s Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit curves — representing boundaries on device characteristics— are given to facilitate “worst case” design. Preferred devices are Motorola recommended choices for future use and best overall value. HDTMOS, MiniMOS, and Designer’s are trademarks of Motorola, Inc. TMOS is a registered trademark of Motorola, Inc. Micro–8 is a registered trademark of International Rectifier. Thermal Clad is a trademark of the Berquist Company. REV 1 /C0077/C0079/C0084/C0079/C0082/C0079/C0076/C0065 SEMICONDUCTOR TECHNICAL DATA Order this document by MMDF3N04HD/D  Motorola, Inc. 1996 /C0077/C0077/C0068/C0070/C0051/C0078/C0048/C0052/C0072/C0068 DUAL TMOS POWER MOSFET

3.4 AMPERES

40 VOLTS

R DS(on) = 0.080 OHM Motorola Preferred Device D S G Source–1 1 Top View Gate–1 Source–2 Gate–2 Drain–1 Drain–1 Drain–2 Drain–2 CASE 751–05, Style 14 SO–8

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2 Motorola TMOS Power MOSFET Transistor Device Data

ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted) Characteristic Symbol Min Typ Max Unit OFF CHARACTERISTICS Drain–to–Source Breakdown Voltage (Cpk ≥ 2.0) (1) (3) (VGS = 0 Vdc, ID = 0.25 mAdc) Temperature Coefficient (Positive) V(BR)DSS 4.3 Vdc mV/°C Zero Gate Voltage Drain Current (VDS = 40 Vdc, VGS = 0 Vdc) (VDS = 40 Vdc, VGS = 0 Vdc, TJ = 125°C) IDSS 0.015 0.15 2.5 µAdc Gate–Body Leakage Current (VGS = ± 20 Vdc, VDS = 0) IGSS — 0.013 500 nAdc ON CHARACTERISTICS (1) Gate Threshold Voltage (Cpk ≥ 2.0) (1) (3) (VDS = VGS , ID = 0.25 mAdc) Threshold T emperature Coefficient (Negative) VGS(th) 1.0 2.0 4.9 3.0 Vdc mV/°C Static Drain–to–Source On–Resistance (Cpk ≥ 2.0) (1) (3) (VGS = 10 Vdc, ID = 3.4 Adc) (VGS = 4.5 Vdc, ID = 1.7 Adc) R DS(on) 100 m Ω Forward Transconductance (VDS = 3.0 Vdc, ID = 1.7 Adc) (1) gFS 2.0 4.5 — Mhos DYNAMIC CHARACTERISTICS Input Capacitance (VDS = 32 Vdc, VGS = 0 Vdc, f = 1.0 MHz) C iss — 450 900 pF Output Capacitance (VDS = 32 Vdc, VGS = 0 Vdc, f = 1.0 MHz) C oss — 130 230 Transfer Capacitance f = 1.0 MHz) C rss — 32 96 SWITCHING CHARACTERISTICS (2) Turn–On Delay Time (VDD = 20 Vdc, ID = 3.4 Adc, VGS = 10 Vdc, RG = 6 Ω ) (1) td(on) — 9.0 18 ns Rise Time (VDD = 20 Vdc, ID = 3.4 Adc, VGS = 10 Vdc, RG = 6 Ω ) (1) tr — 15 30 Turn–Off Delay Time (VDD = 20 Vdc, ID = 3.4 Adc, VGS = 10 Vdc, RG = 6 Ω ) (1) td(off) — 28 56 Fall Time tf — 19 38 Turn–On Delay Time (VDD = 20 Vdc, ID = 1.7 Adc, VGS = 4.5 Vdc, RG = 6 Ω ) (1) td(on) — 13 26 ns Rise Time (VDD = 20 Vdc, ID = 1.7 Adc, VGS = 4.5 Vdc, RG = 6 Ω ) (1) tr — 77 144 Turn–Off Delay Time (VDD = 20 Vdc, ID = 1.7 Adc, VGS = 4.5 Vdc, RG = 6 Ω ) (1) td(off) — 17 34 Fall Time tf — 20 40 Gate Charge (VDS = 40 Vdc, ID = 3.4 Adc, VGS = 10 Vdc) (1) Q T — 13.9 28 nC (VDS = 40 Vdc, ID = 3.4 Adc, VGS = 10 Vdc) (1) Q 1 — 2.1 —(VDS = 40 Vdc, ID = 3.4 Adc, VGS = 10 Vdc) (1) Q 2 — 3.7 — Q 3 — 5.4 — SOURCE–DRAIN DIODE CHARACTERISTICS Forward On–Voltage (IS = 3.4 Adc, VGS = 0 Vdc) (1) (IS = 3.4 Adc, VGS = 0 Vdc, TJ = 125°C) VSD 0.87 0.8 1.5 Vdc Reverse Recovery Time (IS = 3.4 Adc, VGS = 0 Vdc, dIS/dt = 100 A/µs) (1) trr — 27 — ns (IS = 3.4 Adc, VGS = 0 Vdc, dIS/dt = 100 A/µs) (1) ta — 20 —dIS/dt = 100 A/µs) (1) tb — 7.0 — Reverse Recovery Storage Charge Q RR — 0.03 — µC (1) Pulse Test: Pulse Width ≤/n636861720000000000000000300 µs, Duty Cycle ≤ 2%. (2)Switching characteristics are independent of operating junction temperature. (3) Reflects typical values. C pk = Max limit – Typ 3 x SIGMA (4)Repetitive rating; pulse width limited by maximum junction temperature.

4 Motorola TMOS Power MOSFET Transistor Device Data

by recognizing that the power MOSFET is charge controlled. by current from the generator. and Q2 and VGSP are read from the gate charge curve. on–state when calculating td(off). voltage at the source which reduces the gate drive current. tion of drain current, the mathematical solution is complex. sure and, consequently, is not specified. Figure 7. Capacitance Variation

6 Motorola TMOS Power MOSFET Transistor Device Data

Figure 11. Reverse Recovery Time (trr) Figure 12. Maximum Rated Forward Biased Figure 13. Maximum Avalanche Energy versus

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8 Motorola TMOS Power MOSFET Transistor Device Data

INFORMATION FOR USING THE SO–8 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self–align when subjected to a solder reflow process. mm inches 0.041 1.04 0.208 5.28 0.015 0.38 0.0256 0.65 0.126 3.20 SO–8 POWER DISSIPATION The power dissipation of the SO–8 is a function of the input pad size. This can vary from the minimum pad size for soldering to the pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by T J(max), the maximum rated junction temperature of the die, RθJA, the thermal resistance from the device junction to ambient; and the operating temperature, TA. Using the values provided on the data sheet for the SO–8 package, PD can be calculated as follows: PD = TJ(max) – TA R θJA The values for the equation are found in the maximum ratings table on the data sheet. Substituting these values into the equation for an ambient temperature TA of 25°C, one can calculate the power dissipation of the device which in this case is 2.0 Watts. PD = 150°C – 25°C 62.5°C/W = 2.0 Watts The 62.5°C/W for the SO–8 package assumes the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 2.0 Watts using the footprint shown. Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal Clad . Using board material such as Thermal Clad, the power dissipation can be doubled using the same footprint. SOLDERING PRECAUTIONS The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected.

  • Always preheat the device.
  • The delta temperature between the preheat and soldering should be 100°C or less.*
  • When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference shall be a maximum of 10°C.
  • The soldering temperature and time shall not exceed 260°C for more than 10 seconds.
  • When shifting from preheating to soldering, the maximum temperature gradient shall be 5°C or less.
  • After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress.
  • Mechanical stress or shock should not be applied during cooling. * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device.

vary among soldering systems, but it is a good starting point. efficiently, then distributes this energy to the components. up to 30 degrees cooler than the adjacent solder joints.

40 TO 80 SECONDS

Figure 16. Typical Solder Heating Profile

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10 Motorola TMOS Power MOSFET Transistor Device Data

CASE 751–05 SO–8 ISSUE M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. SEATING PLANE 1 4 C K 4X P A0.25 (0.010)M T B S S 0.25 (0.010)M B M 8X D R M J X 45 /C0095 /C0095 F –A– –B– –T– DIM MIN MAX MIN MAX INCHESMILLIMETERS A 4.80 5.00 0.189 0.196 B 3.80 4.00 0.150 0.157 C 1.35 1.75 0.054 0.068 D 0.35 0.49 0.014 0.019 F 0.40 1.25 0.016 0.049 G 1.27 BSC 0.050 BSC J 0.18 0.25 0.007 0.009 K 0.10 0.25 0.004 0.009 M 0 7 0 7 P 5.80 6.20 0.229 0.244 R 0.25 0.50 0.010 0.019 /C0095/C0095 /C0095/C0095 STYLE 14: PIN 1. N–SOURCE 2. N–GATE 3. P–SOURCE 4. P–GATE 5. P–DRAIN 6. P–DRAIN 7. N–DRAIN 8. N–DRAIN Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. How to reach us: USA/EUROPE/Locations Not Listed: Motorola Literature Distribution;JAPAN : Nippon Motorola Ltd.; T atsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center, P .O. Box 20912; Phoenix, Arizona 85036. 1–800–441–2447 or 602–303–5454 3–14–2 T atsumi Koto–Ku, Tokyo 135, Japan. 03–81–3521–8315 INTERNET : http://Design–NET .com 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 MMDF3N04HD/D /C0042/C0077/C0077/C0068/C0070/C0051/C0078/C0048/C0052/C0072/C0068/C0047/C0068/C0042