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Technical content

Features

  • SOT−23 Package Allows Either Two Separate Unidirectional Configurations or a Single Bidirectional Configuration
  • Standard Zener Breakdown V oltage Range − 15.2 V to 16.80 V
  • Peak Power − 40 W @ 1.0 ms (Unidirectional), per Figure 5 Waveform
  • ESD Rating: − Class 3B (> 16 kV) per the Human Body Model − Class C (> 400 V) per the Machine Model
  • ESD Rating of IEC61000−4−2 Level 4, ±30 kV Contact Discharge
  • Maximum Clamping V oltage @ Peak Pulse Current
  • Low Leakage < 5.0 /C0109A
  • Flammability Rating UL 94 V−0
  • SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable
  • This is a Pb−Free Device Mechanical Characteristics CASE: V oid-free, transfer-molded, thermosetting plastic case FINISH: Corrosion resistant finish, easily solderable MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds Package designed for optimal automated board assembly Small package size for high density applications Available in 8 mm Tape and Reel Use the Device Number to order the 7 inch/3,000 unit reel. Replace the “T1” with “T3” in the Device Number to order the 13 inch/10,000 unit reel. SOT−23 CASE 318 STYLE 12 CATHODE 1

3 ANODE

See specific marking information in the device marking column of the table on page 2 of this data sheet. DEVICE MARKING INFORMATION http://onsemi.com See detailed ordering and shipping information on page 2 of this data sheet.

ORDERING INFORMATION

/C0071 XXX = Specific Device Code M = Date Code /C0071 = Pb−Free Package (Note: Microdot may be in either location)

MMBZ16V, SZMMBZ16V http://onsemi.com MAXIMUM RATINGS Rating Symbol Value Unit Peak Power Dissipation @ 1.0 ms (Note 1) Ppk 40 W Total Power Dissipation on FR−5 Board (Note 2) @ TA = 25°C Derate above 25°C °PD° 225 1.8 mW° mW/°C Thermal Resistance Junction−to−Ambient R/C0113JA 556 °C/W Total Power Dissipation on Alumina Substrate (Note 3) @ TA = 25°C Derate above 25°C °PD° 300 2.4 °mW mW/°C Thermal Resistance Junction−to−Ambient R/C0113JA 417 °C/W Junction and Storage Temperature Range TJ, Tstg − 55 to +150 °C Lead Solder Temperature − Maximum (10 Second Duration) TL 260 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Non−repetitive current pulse per Figure 5 and derate above T A = 25°C per Figure 6. *Other voltages may be available upon request. Device Marking Package Shipping† MMBZ16VALT1G 16A SOT−23 (Pb−Free) 3,000 / Tape & Reel SZMMBZ16VALT1G* 16A MMBZ16VTALT1G 16T SZMMBZ16VTALT1G* 16T †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable.

MMBZ16V, SZMMBZ16V http://onsemi.com

ELECTRICAL CHARACTERISTICS

(TA = 25°C unless otherwise noted) UNIDIRECTIONAL (Circuit tied to Pins 1 and 3 or 2 and 3) Symbol Parameter IPP Maximum Reverse Peak Pulse Current VC Clamping Voltage @ IPP VRWM Working Peak Reverse Voltage IR Maximum Reverse Leakage Current @ VRWM VBR Breakdown Voltage @ IT IT Test Current /C0081VBR Maximum Temperature Coefficient of VBR IF Forward Current VF Forward Voltage @ IF ZZT Maximum Zener Impedance @ IZT IZK Reverse Current ZZK Maximum Zener Impedance @ IZK Uni−Directional TVS IPP IF V I IRIT VRWMVC VBR VF ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) UNIDIRECTIONAL (Circuit tied to Pins 1 and 3 or Pins 2 and 3) (VF = 0.9 V Max @ IF = 10 mA) (5% Tolerance) 40 WATTS Device* Device Marking VRWM IR @ VRWM Breakdown Voltage VC @ IPP (Note 5) /C0081VBRVBR (Note 4) (V) @ IT VC IPP Volts nA Min Nom Max mA V A mV//C0053C (VF = 0.9 V Max @ IF = 10 mA) (2% Tolerance) 40 WATTS Device* Device Marking VRWM IR @ VRWM Breakdown Voltage VC @ IPP (Note 5) /C0081VBRVBR (Note 4) (V) @ IT VC IPP Volts nA Min Nom Max mA V A mV//C0053C Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 4. V BR measured at pulse test current IT at an ambient temperature of 25°C. 5. Surge current waveform per Figure 5 and derate per Figure 6 * Include SZ-prefix devices where applicable.

MMBZ16V, SZMMBZ16V http://onsemi.com TYPICAL COMMON ANODE APPLICATIONS A dual junction common anode design in a SOT−23 package protects two separate lines using only one package. This adds flexibility and creativity to PCB design especially when board space is at a premium. Two simplified examples of TVS applications are illustrated below. KEYBOARD TERMINAL PRINTER ETC. FUNCTIONAL DECODERI/O A SZMMBZ16VALT1G Thru SZMMBZ16VTALT1G GND Computer Interface Protection B C D Microprocessor Protection I/O RAM ROM CLOCK CPU CONTROL BUS ADDRESS BUS DATA BUS GND VGG VDD SZMMBZ16VALT1G Thru SZMMBZ16VTALT1G SZMMBZ16VALT1G Thru SZMMBZ16VTALT1G

MMBZ16V, SZMMBZ16V http://onsemi.com PACKAGE DIMENSIONS SOT−23 (TO−236) CASE 318−08 ISSUE AP /C0466mm inches/C0467SCALE 10:1 0.8 0.031 0.9 0.035 0.95 0.0370.95 0.037 2.0 0.079 SOLDERING FOOTPRINT STYLE 12: PIN 1. CATHODE 2. CATHODE 3. ANODE *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. D NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. VIEW C L 0.25 /C0113 e E E b A SEE VIEW C DIM A MIN NOM MAX MIN MILLIMETERS 0.89 1.00 1.11 0.035 INCHES A1 0.01 0.06 0.10 0.001 b 0.37 0.44 0.50 0.015 c 0.09 0.13 0.18 0.003 D 2.80 2.90 3.04 0.110 E 1.20 1.30 1.40 0.047 e 1.78 1.90 2.04 0.070 L 0.10 0.20 0.30 0.004 0.040 0.044 0.002 0.004 0.018 0.020 0.005 0.007 0.114 0.120 0.051 0.055 0.075 0.081 0.008 0.012 NOM MAX H c ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a numb er of patents, trademarks, reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 MMBZ16VAL/D LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative