MMBZ5V6ALT1 ONSEMI | Alldatasheet

Document overview

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Technical content

Features

  • Pb−Free Packages are Available
  • SOT−23 Package Allows Either Two Separate Unidirectional Configurations or a Single Bidirectional Configuration
  • Working Peak Reverse V oltage Range − 3 V to 26 V
  • Standard Zener Breakdown V oltage Range − 5.6 V to 33 V
  • Peak Power − 24 or 40 Watts @ 1.0 ms (Unidirectional), per Figure 5 Waveform
  • ESD Rating of Class N (exceeding 16 kV) per the Human Body Model
  • Maximum Clamping V oltage @ Peak Pulse Current
  • Low Leakage < 5.0 A
  • Flammability Rating UL 94 V−O Mechanical Characteristics CASE: V oid-free, transfer-molded, thermosetting plastic case FINISH: Corrosion resistant finish, easily solderable MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds Package designed for optimal automated board assembly Small package size for high density applications Available in 8 mm Tape and Reel Use the Device Number to order the 7 inch/3,000 unit reel. Replace the “T1” with “T3” in the Device Number to order the 13 inch/10,000 unit reel. Preferred devices are recommended choices for future use and best overall value. SOT−23 CASE 318 STYLE 12 xxx MARKING DIAGRAM xxx = Device Code M = Date Code M See specific marking information in the device marking column of the table on page 3 of this data sheet. DEVICE MARKING INFORMATION http://onsemi.com See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet.

ORDERING INFORMATION

http://onsemi.com MAXIMUM RATINGS Rating Symbol Value Unit Peak Power Dissipation @ 1.0 ms (Note 1) MMBZ5V6ALT1 thru MMBZ10VALT1 @ T L ≤ 25°C MMBZ12VALT1 thru MMBZ33VALT1 Ppk 24 Watts Total Power Dissipation on FR−5 Board (Note 2) @ TA = 25°C Derate above 25°C °PD ° 225 1.8 °mW ° mW/ °C Thermal Resistance Junction−to−Ambient R JA 556 °C/W Total Power Dissipation on Alumina Substrate (Note 3) @ TA = 25°C Derate above 25°C °PD ° 300 2.4 °mW mW/ °C Thermal Resistance Junction−to−Ambient R JA 417 °C/W Junction and Storage Temperature Range TJ, Tstg − 55 to +150 °C Lead Solder Temperature − Maximum (10 Second Duration) TL 260 °C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. Non−repetitive current pulse per Figure 5 and derate above T A = 25°C per Figure 6. *Other voltages may be available upon request. Device Package Shipping† MMBZ5V6ALT1 SOT−23 3000 Tape & Reel MMBZ5V6ALT1G SOT−23 (Pb−Free)

3000 Tape & Reel

MMBZ5V6ALT3 SOT−23 10,000 Tape & Reel MMBZ5V6ALT3G SOT−23 (Pb−Free) 10,000 Tape & Reel MMBZ6VxALT1 SOT−23 3000 Tape & Reel MMBZ6VxALT1G SOT−23 (Pb−Free) MMBZ6VxALT3 SOT−23 10,000 Tape & Reel MMBZ6VxALT3G SOT−23 (Pb−Free) 10,000 Tape & Reel MMBZ9V1ALT1 SOT−23 3000 Tape & Reel MMBZ9V1ALT1G SOT−23 (Pb−Free) MMBZ9V1ALT3 SOT−23 10,000 Tape & Reel MMBZ9V1ALT13G SOT−23 (Pb−Free) 10,000 Tape & Reel MMBZxxVALT1 SOT−23 3000 Tape & Reel MMBZxxVALT1G SOT−23 (Pb−Free) MMBZxxVALT3 SOT−23 10,000 Tape & Reel MMBZxxVALT3G SOT−23 (Pb−Free) 10,000 Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.

Uni−Directional TVS IPP IF V I IRIT VRWMVC VBR VF MMBZ5V6ALT1 Series http://onsemi.com

ELECTRICAL CHARACTERISTICS

(TA = 25°C unless otherwise noted) UNIDIRECTIONAL (Circuit tied to Pins 1 and 3 or 2 and 3) Symbol Parameter IPP Maximum Reverse Peak Pulse Current VC Clamping Voltage @ IPP VRWM Working Peak Reverse Voltage IR Maximum Reverse Leakage Current @ VRWM VBR Breakdown Voltage @ IT IT Test Current VBR Maximum Temperature Coefficient of VBR IF Forward Current VF Forward Voltage @ IF ZZT Maximum Zener Impedance @ IZT IZK Reverse Current ZZK Maximum Zener Impedance @ IZK ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) UNIDIRECTIONAL (Circuit tied to Pins 1 and 3 or Pins 2 and 3) (VF = 0.9 V Max @ IF = 10 mA) 24 WATTS Breakdown Voltage Max Zener Impedance (Note 5) VC @ IPP (Note 6) Device VRWM IR @ VRWM VBR (Note 4) (V) @ IT ZZT @ IZT ZZK @ IZK VC IPP VBR Device Device Marking Volts A Min Nom Max mA mA V A mV/ C (VF = 0.9 V Max @ IF = 10 mA) 40 WATTS IR @ Breakdown Voltage VC @ IPP (Note 6) Device VRWM IR @ VRWM VBR (Note 4) (V) @ IT VC IPP VBR Device Device Marking Volts nA Min Nom Max mA V A mV/ C 4. VBR measured at pulse test current IT at an ambient temperature of 25°C. 5. ZZT and ZZK are measured by dividing the AC voltage drop across the device by the AC current applied. The specified limits are for IZ(AC) = 0.1 IZ(DC), with the AC frequency = 1.0 kHz. 6. Surge current waveform per Figure 5 and derate per Figure 6

http://onsemi.com TYPICAL COMMON ANODE APPLICATIONS A quad junction common anode design in a SOT−23 package protects four separate lines using only one package. This adds flexibility and creativity to PCB design especially when board space is at a premium. Two simplified examples of TVS applications are illustrated below. MMBZ5V6ALT1 THRU MMBZ33VALT1 KEYBOARD TERMINAL PRINTER ETC. FUNCTIONAL DECODERI/O A MMBZ5V6ALT1 THRU MMBZ33VALT1 GND Computer Interface Protection B C D Microprocessor Protection I/O RAM ROM CLOCK CPU CONTROL BUS ADDRESS BUS DATA BUS GND VGG VDD MMBZ5V6ALT1 THRU MMBZ33VALT1

http://onsemi.com PACKAGE DIMENSIONS SOT−23 (TO−236) CASE 318−09 ISSUE AH *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* mm inchesSCALE 10:1 0.8 0.031 0.9 0.035 0.95 0.0370.95 0.037 2.0 0.079 STYLE 12: PIN 1. CATHODE 2. CATHODE 3. ANODE DIM A MIN MAX MIN MAX MILLIMETERS 0.1102 0.1197 2.80 3.04 INCHES B 0.0472 0.0551 1.20 1.40 C 0.0385 0.0498 0.99 1.26 D 0.0140 0.0200 0.36 0.50 G 0.0670 0.0826 1.70 2.10 H 0.0040 0.0098 0.10 0.25 J 0.0034 0.0070 0.085 0.177 K 0.0180 0.0236 0.45 0.60 L 0.0350 0.0401 0.89 1.02 S 0.0830 0.0984 2.10 2.50 V 0.0177 0.0236 0.45 0.60 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. MAXIUMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. 318−01, −02, AND −06 OBSOLETE, NEW STANDARD 318−09. A L BS V G D H C K J

http://onsemi.com ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone : 81−3−5773−3850 MMBZ5V6ALT1/D LITERATURE FULFILLMENT : Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone : 480−829−7710 or 800−344−3860 Toll Free USA/Canada Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative.