MMBZ15VALT1

MMBZ5V6ALT1 MOTOROLA | Alldatasheet

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MOTOROLAMMBZ5V6ALT1 MMBZ6V2ALT1 MMBZ15VALT1 MMBZ20VALT1 /C0053/C0046/C0054/C0044 /C0054/C0046/C0050 /C0049/C0053 /C0038 /C0050/C0048 /C0086/C0111/C0108/C0116 /C0083/C0079/C0084/C0045/C0050/C0051 /C0068/C0117/C0097/C0108 /C0077/C0111/C0110/C0111/C0108/C0105/C0116/C0104/C0105/C0099 /C0067/C0111/C0109/C0109/C0111/C0110 /C0065/C0110/C0111/C0100/C0101 /C0090/C0101/C0110/C0101/C0114/C0115 Transient Voltage Suppressors for ESD Protection These dual monolithic silicon zener diodes are designed for applications requiring transient overvoltage protection capability. They are intended for use in voltage and ESD sensitive equipment such as computers, printers, business machines, communication systems, medical equipment and other applications. Their dual junction common anode design protects two separate lines using only one package. These devices are ideal for situations where board space is at a premium. Specification Features:

• SOT–23 Package Allows Either Two Separate Unidirectional Configurations or a Single Bidirectional Configuration
• Peak Power — 24 or 40 Watts @ 1.0 ms (Unidirectional), per Figure 5 Waveform
• Maximum Clamping Voltage @ Peak Pulse Current
• Low Leakage < 5.0 µA
• ESD Rating of Class N (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:
• Void Free, Transfer–Molded, Thermosetting Plastic Case
• Corrosion Resistant Finish, Easily Solderable
• Package Designed for Optimal Automated Board Assembly
• Small Package Size for High Density Applications
• Available in 8 mm Tape and Reel Use the Device Number to order the 7 inch/3,000 unit reel. Replace the “T1” with “T3” in the Device Number to order the 13 inch/10,000 unit reel. THERMAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Characteristic Symbol Value Unit Peak Power Dissipation @ 1.0 ms (1) MMBZ5V6ALT1, MMBZ6V2ALT1 @ T A ≤ 25°C MMBZ15VALT1, MMBZ20VALT1 Ppk 24 Watts Total Power Dissipation on FR–5 Board (2) @ TA = 25°C Derate above 25°C °PD ° 225 1.8 °mW ° mW/ °C Thermal Resistance Junction to Ambient R θJA 556 °C/W Total Power Dissipation on Alumina Substrate (3) @ TA = 25°C Derate above 25°C °PD ° 300 2.4 °mW mW/ °C Thermal Resistance Junction to Ambient R θJA 417 °C/W Junction and Storage T emperature Range TJ Tstg – 55 to +150 °C Lead Solder Temperature — Maximum (10 Second Duration) TL 260 °C (1)Non–repetitive current pulse per Figure 5 and derate above TA = 25°C per Figure 6. (2) FR–5 = 1.0 x 0.75 x 0.62 in. *Other voltages may be available upon request Thermal Clad is a trademark of the Bergquist Company Preferred devices are Motorola recommended choices for future use and best overall value. /C0077/C0079/C0084/C0079/C0082/C0079/C0076/C0065 SEMICONDUCTOR TECHNICAL DATA Order this document by MMBZ5V6ALT1/D  Motorola, Inc. 1996 Rev 1 /C0077/C0077/C0066/C0090/C0053/C0086/C0054/C0065/C0076/C0084/C0049 /C0077/C0077/C0066/C0090/C0054/C0086/C0050/C0065/C0076/C0084/C0049 /C0077/C0077/C0066/C0090/C0049/C0053/C0086/C0065/C0076/C0084/C0049 /C0077/C0077/C0066/C0090/C0050/C0048/C0086/C0065/C0076/C0084/C0049 SOT–23 COMMON ANODE DUAL ZENER OVERVOLTAGE TRANSIENT SUPPRESSORS 24 & 40 WATTS PEAK POWER CASE 318–08 STYLE 12 LOW PROFILE SOT–23 PLASTIC PIN 1. CATHODE 2. CATHODE 3. ANODE Motorola Preferred Devices /C0042

(3) VZ/VBR measured at pulse test current IT at an ambient temperature of 25°C. (4)Surge current waveform per Figure 5 and derate per Figure 6. (5)IZ(AC) = 0.1 IZ(DC), with AC frequency = 1 kHz. Figure 1. Typical Breakdown Voltage Figure 2. Typical Leakage Current

0.01 IR (nA)

MMBZ5V6AL T1 MMBZ6V2AL T1 MMBZ15V AL T1 MMBZ20V ALT1 TYPICAL COMMON ANODE APPLICATIONS A quad junction common anode design in a SOT–23 pack- age protects four separate lines using only one package. This adds flexibility and creativity to PCB design especially when board space is at a premium. Two simplified examples of TVS applications are illustrated below. MMBZ5V6ALT1 MMBZ6V2ALT1 MMBZ15VALT1 MMBZ20VALT1 KEYBOARD TERMINAL PRINTER ETC. FUNCTIONAL DECODERI/O A MMBZ5V6ALT1 MMBZ6V2ALT1 MMBZ15VALT1 MMBZ20VALT1 GND Computer Interface Protection B C D Microprocessor Protection I/O RAM ROM CLOCK CPU CONTROL BUS ADDRESS BUS DATA BUS GND VGG VDD MMBZ5V6ALT1 MMBZ6V2ALT1 MMBZ15VALT1 MMBZ20VALT1

MOTOROLAMMBZ5V6ALT1 MMBZ6V2ALT1 MMBZ15VALT1 MMBZ20VALT1 INFORMATION FOR USING THE SOT–23 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process. SOT–23 mm inches 0.037 0.95 0.037 0.95 0.079 2.0 0.035 0.9 0.031 0.8 SOT–23 POWER DISSIPATION The power dissipation of the SOT–23 is a function of the drain pad size. This can vary from the minimum pad size for soldering to a pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by TJ(max), the maximum rated junction temperature of the die, RθJA, the thermal resistance from the device junction to ambient, and the operating temperature, TA . Using the values provided on the data sheet for the SOT–23 package, PD can be calculated as follows: PD = TJ(max) – TA R θJA The values for the equation are found in the m aximum ratings table on the data sheet. Substituting these values into the equation for an ambient temperature TA of 25°C, one can calculate the power dissipation of the device which in this case is 225 milliwatts. PD = 150°C – 25°C 556°C/W = 225 milliwatts The 556°C/W for the SOT–23 package assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 225 milliwatts. There are other alternatives to achieving higher power dissipation from the SOT–23 package. Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal Clad . Using a board m aterial such as Thermal Clad, an aluminum core board, the power dissipation can be doubled using the same footprint. SOLDERING PRECAUTIONS The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected.

• Always preheat the device.
• The delta temperature between the preheat and soldering should be 100°C or less.*
• When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference shall be a maximum of 10°C.
• The soldering temperature and time shall not exceed 260°C for more than 10 seconds.
• When shifting from preheating to soldering, the maximum temperature gradient shall be 5°C or less.
• After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress.
• Mechanical stress or shock should not be applied during cooling. * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device.

MMBZ5V6ALT1 MMBZ6V2AL T1 MMBZ15V AL T1 MMBZ20V ALT1 OUTLINE DIMENSIONS CASE 318–08 ISSUE AE STYLE 12: PIN 1. CATHODE 2. CATHODE 3. ANODE D JK L A C B S H GV 1 2 DIM A MIN MAX MIN MAX MILLIMETERS 0.1102 0.1197 2.80 3.04 INCHES B 0.0472 0.0551 1.20 1.40 C 0.0350 0.0440 0.89 1.11 D 0.0150 0.0200 0.37 0.50 G 0.0701 0.0807 1.78 2.04 H 0.0005 0.0040 0.013 0.100 J 0.0034 0.0070 0.085 0.177 K 0.0140 0.0285 0.35 0.69 L 0.0350 0.0401 0.89 1.02 S 0.0830 0.1039 2.10 2.64 V 0.0177 0.0236 0.45 0.60 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. MAXIUMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters can and do vary in different applications. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. How to reach us: USA / EUROPE : Motorola Literature Distribution; JAPAN : Nippon Motorola Ltd.; T atsumi–SPD–JLDC, T oshikatsu Otsuki, P .O. Box 20912; Phoenix, Arizona 85036. 1–800–441–2447 6F Seibu–Butsuryu–Center, 3–14–2 T atsumi Koto–Ku, T okyo 135, Japan. 03–3521–8315 INTERNET : http://Design–NET .com 51 Ting Kok Road, T ai Po, N.T ., Hong Kong. 852–26629298 MMBZ5V6ALT1/D /C0042/C0077/C0077/C0066/C0090/C0053/C0086/C0054/C0065/C0076/C0084/C0049/C0047/C0068/C0042