MMBZ15VAL TI | Alldatasheet
Document overview
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Technical content
MMBZxxVAL Dual Channel Zener Diode
1 Features
- IEC 61000-4-2 ESD protection: – ±30kV contact discharge – ±30kV air-gap discharge
- IEC 61643-321 surge protection: – Up to 1.7A (10/1000µs)
- Low leakage current: 50nA (max)
- Temperature range: –55°C to +150°C
- Leaded packages used for automatic optical inspection (AOI)
2 Applications
- Overvoltage protectection
- CAN/LIN transient suppression
- Dual channel unidirectional or single channel bidirectional
3 Description
The MMBZxxVAL is a dual channel unidirectional or single channel bidirectional ESD in common anode configuration. The device's relatively low capacitance and low leakage features enable use in higher speed applications. The MMBZxxVAL is packaged in the SOT-23, providing two channels of robust transient protection in one space-efficient form factor.
Package Information
PART NUMBER PACKAGE(1) PACKAGE SIZE(2) MMBZxxVAL DBZ (SOT-23, 3) 2.92mm × 2.37mm (1) For more information, see Section 8. (2) The package size (length × width) is a nominal value and includes pins, where applicable. 1 2 Functional Block Diagram MMBZ15VAL, MMBZ27VAL SLVSJ23 – JUNE 2025 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.
8 Mechanical, Packaging, and Orderable Information....6 MMBZ15VAL, MMBZ27VAL SLVSJ23 – JUNE 2025 www.ti.com
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4 Pin Configuration and Functions
Figure 4-1. DBZ Package, 3-Pin SOT-23 (Top View) Table 4-1. Pin Functions PIN NO. DESCRIPTION
1 Cathode of Diode 1
2 Cathode of Diode 2
3 Common Anode
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5 Specifications
5.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1) MIN MAX UNIT Peak pulse MMBZ15VAL - IEC 61643-321 Power (tp = 10/1000µs) at 25°C 35 W Peak pulse MMBZ15VAL - IEC 61643-321 Current (tp = 10/1000µs) at 25°C 1.7 A Peak pulse MMBZ27VAL - IEC 61643-321 Power (tp = 10/1000µs) at 25°C 35 W Peak pulse MMBZ27VAL - IEC 61643-321 Current (tp = 10/1000µs) at 25°C 0.9 A Ptot Total Power Dissipation (Tamb ≤ 25 °C) 500 mW TA Operating free-air temperature -55 150 °C Tstg Storage temperature -65 155 °C (1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
5.2 ESD Ratings - JEDEC Specification
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/ JEDEC JS-001 ± 2500 V Charged device model (CDM), per JEDEC specification JS-002 ± 1000
5.3 ESD Ratings - IEC Specification
V(ESD) Electrostatic discharge IEC 61000-4-2 Contact Discharge, all pins ±30000 V IEC 61000-4-2 Air-gap Discharge, all pins ±30000
5.4 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT TA Operating free-air temperature -55 150 °C
5.5 Thermal Information
THERMAL METRIC (1) MMBZxxVAL UNITDBZ ( SOT-23)
3 PINS
RθJA Junction-to-ambient thermal resistance 186.4 °C/W RθJC(top) Junction-to-case (top) thermal resistance 127.5 °C/W RθJB Junction-to-board thermal resistance 74.1 °C/W ΨJT Junction-to-top characterization parameter 46.7 °C/W ΨJB Junction-to-board characterization parameter 73.8 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note. MMBZ15VAL, MMBZ27VAL SLVSJ23 – JUNE 2025 www.ti.com
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5.6 Electrical Characteristics
VRWM VBR (V) at IT V Clamp (1) (2) VC (V) at IPP Reverse Leakage Current IR (nA) at VRWM Temperature Coefficient SZ (mV/C) at IT Capacitance CD (pF) Volts MIN TYP MAX IT (mA) MAX IPP (A) MAX TYP IT (mA) MAX MMBZ15VAL 12 14.3 15 15.8 1 20 1.7 50 11 1 105 MMBZ27VAL 22 25.65 27 28.35 1 39 0.9 50 23 1 73 (1) Device stressed with 10/1000μs exponential decay waveform according to IEC 61643-321 (2) Measured from pin 1 or pin 2 to pin 3
5.7 Typical Characteristics
T e m p e r a t u r e ( C ) Leakage Current (nA) - 7 5 - 5 0 - 2 5 0 2 5 5 0 7 5 1 0 0 1 2 5 1 5 0 1 0 1 5 2 0 2 5 M M B Z 1 5 V A L M M B Z 2 7 V A L Figure 5-1. Leakage Current vs Temperature T e m p e r a t u r e ( C ) Breakdown Voltage (V) - 7 5 - 5 0 - 2 5 0 2 5 5 0 7 5 1 0 0 1 2 5 1 5 0 1 0 1 5 2 0 2 5 3 0 3 5 M M B Z 1 5 V A L M M B Z 2 7 V A L Figure 5-2. Breakdown Voltage vs Temperature A m b i e n t T e m p e r a t u r e ( C ) Peak Pulse Power (PPP) or Current (IPP) and Derating in Percentage (%) 0 2 5 5 0 7 5 1 0 0 1 2 5 1 5 0 1 7 5 2 0 4 0 6 0 8 0 1 0 0 1 2 0 Figure 5-3. Peak Pulse Power Derating Curve www.ti.com MMBZ15VAL, MMBZ27VAL SLVSJ23 – JUNE 2025 Copyright © 2025 Texas Instruments Incorporated Submit Document Feedback 5
6 Device and Documentation Support
TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device, generate code, and develop solutions are listed below.
6.1 Documentation Support
6.1.1 Related Documentation
For related documentation, see the following:
- Texas Instruments, ESD Layout Guide application reports
- Texas Instruments, Generic ESD Evaluation Module user's guide
- Texas Instruments, Picking ESD Diodes for Ultra High-Speed Data Lines application reports
- Texas Instruments, Reading and Understanding an ESD Protection data sheet
6.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on Notifications to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.
6.3 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.
6.4 Trademarks
TI E2E™ is a trademark of Texas Instruments. All trademarks are the property of their respective owners.
6.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
6.6 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.
7 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version. DATE REVISION NOTES June 2025 * Initial Release
8 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. MMBZ15VAL, MMBZ27VAL SLVSJ23 – JUNE 2025 www.ti.com
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www.ti.com 14-Aug-2025 PACKAGING INFORMATION Orderable part number Status (1) Material type (2) Package | Pins Package qty | Carrier RoHS (3) Lead finish/ Ball material (4) MSL rating/ Peak reflow (5) Op temp (°C) Part marking (6) MMBZ15VALDBZR Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -55 to 150 3Q3G MMBZ27VALDBZR Active Production SOT-23 (DBZ) | 3 3000 | LARGE T&R Yes SN Level-1-260C-UNLIM -55 to 150 3MZG (1) Status: For more details on status, see our product life cycle. (2) Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance, reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind. (3) RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition. (4) Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. (5) MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown. Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board. (6) Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part. Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two combined represent the entire part marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF MMBZ15VAL, MMBZ27VAL :
- Automotive : MMBZ15VAL-Q1 , MMBZ27VAL-Q1 Addendum-Page 1
www.ti.com 14-Aug-2025 NOTE: Qualified Version Definitions:
- Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 2
PACKAGE MATERIALS INFORMATION www.ti.com 15-Aug-2025 TAPE AND REEL INFORMATION Reel Width (W1) REEL DIMENSIONS A0B0K0WDimension designed to accommodate the component lengthDimension designed to accommodate the component thicknessOverall width of the carrier tapePitch between successive cavity centersDimension designed to accommodate the component width TAPE DIMENSIONSK0 P1B0WA0Cavity QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Pocket QuadrantsSprocket HolesQ1Q1Q2Q2Q3Q3Q4Q4User Direction of Feed P1ReelDiameter *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION www.ti.com 15-Aug-2025 TAPE AND REEL BOX DIMENSIONS Width (mm) W LH *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) MMBZ15VALDBZR SOT-23 DBZ 3 3000 210.0 185.0 35.0 MMBZ27VALDBZR SOT-23 DBZ 3 3000 210.0 185.0 35.0 Pack Materials-Page 2
www.ti.com PACKAGE OUTLINE C 0.20
0.08 TYP
0.25 2.64 2.10
1.12 MAX
0.10
0.01 TYP
3X 0.5 0.3 0.6
0.2 TYP
1.9 0.95 0 -8 TYP 4X 0 -15 4X 4 -15 A 3.04 2.80 B1.4 1.2 (0.95) (0.15) (0.125) SOT-23 - 1.12 mm max heightDBZ0003A SMALL OUTLINE TRANSISTOR 4214838/F 08/2024 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Reference JEDEC registration TO-236, except minimum foot length. 4. Support pin may differ or may not be present. 5. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.25mm per side
0.2 C A B
0.1 C SCALE 4.000
www.ti.com EXAMPLE BOARD LAYOUT
0.07 MAX
0.07 MIN
3X (1.3) 3X (0.6) (2.1) 2X (0.95) (R0.05) TYP 4214838/F 08/2024 SOT-23 - 1.12 mm max heightDBZ0003A SMALL OUTLINE TRANSISTOR NOTES: (continued) 5. Publication IPC-7351 may have alternate designs. 6. Solder mask tolerances between and around signal pads can vary based on board fabrication site. SYMM LAND PATTERN EXAMPLE SCALE:15X PKG SOLDER MASK OPENING METAL UNDER SOLDER MASK SOLDER MASK DEFINED METALSOLDER MASK OPENING NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DETAILS
www.ti.com EXAMPLE STENCIL DESIGN (2.1) 2X(0.95) 3X (1.3) 3X (0.6) (R0.05) TYP SOT-23 - 1.12 mm max heightDBZ0003A SMALL OUTLINE TRANSISTOR 4214838/F 08/2024 NOTES: (continued) 7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 8. Board assembly site may have different recommendations for stencil design. SOLDER PASTE EXAMPLE BASED ON 0.125 THICK STENCIL SCALE:15X SYMM PKG
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