MMBD6050 BILIN | Alldatasheet
Document overview
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Technical content
Surface mount switching diode MMBD6050 C 1 3 1 w w w . g m i c r o e l e c . c o m R e v . B 1
FEATURES
z High conductance. z Fast switching. z Surface mount package ideally suited for automatic insertion.
APPLICATIONS
z For general purpose and switching application. SOT-23
ORDERING INFORMATION
Type No. Marking Package Code M M B D 6 0 5 0 5 A S O T - 2 3 MAXIMUM RATING @ Ta=25℃ unless otherwise specified Characteristic Symbol Limits Unit Continuous Reverse Voltage VR 70 V Forward current IF 200 mA Peak suge forward Current IFSM 500 A Power Dissipation Pd 300 mW Thermal resistance , Junction-to-Ambient RθJA 417 ℃/W Operating Junction Temperature Range Tj 150 ℃ Storage Temperature Range TSTG -55 to +150 ℃ ELECTRICAL CHARACTERISTICS @ Ta=25℃ unless otherwise specified Characteristic Symbol Mi n MAX UNIT Test Condition Reverse Breakdown Voltage V (BR)R 70 V I R= 100μA Forward Voltage V F 0.55 0.85 0.7
1.1 V IF=1mA
IF=100mA Reverse Leakage Current I R 0.1 μA V R=50V Total Capacitance C tot 2.5 pF V R=0V,f=1MHz Reverse Recovery Time t rr 4 ns I F=IR=10mA Irr=1mA Pb Lead-free
Surface mount switching diode MMBD6050 C 1 3 1 w w w . g m i c r o e l e c . c o m R e v . B 2 TYPICAL CHARACTERISTICS @ Ta=25℃ unless otherwise specified
Surface mount switching diode MMBD6050 C 1 3 1 w w w . g m i c r o e l e c . c o m R e v . B 3 PACKAGE OUTLINE Plastic surface mounted package SOT-23 SOLDERING FOOTPRINT Unit : mm
PACKAGE INFORMATION
A 2.70 3.10 B 1.10 1.50 C 1.0 Typical D 0.4 Typical E 0.35 0.48 G 1.80 2.00 H 0.02 0.1 J 0.1 Typical K 2.20 2.60 All Dimensions in mm Device Package Shipping MMBD6050 SOT-23 3000/Tape&Reel A B C D E J H K G 0.90 0.80 2.00 0.95 0.95