MMBD2835_17 BILIN | Alldatasheet
Document overview
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Technical content
Surface mount switching diode MMBD2835/MMBD2836 C 0 6 6 www.gmesemi.com R e v . B 1
FEATURES
High speed switching: t rr=4.0ns(max) Low capacitance: C T=2.5pF(typ.)
APPLICATIONS
Small signal switching SOT-23
ORDERING INFORMATION
T y p e N o . M a r k i n g P a c k a g e C o d e M M B D 2 8 3 5 A 3 SOT-23 M M B D 2 8 3 6 A 4 1 S O T - 2 3 MAXIMUM RATING @ Ta=25℃ unless otherwise specified Parameter Symbol Limits Unit MMBD2835 MMBD2836 Non-Repetitive Peak reverse voltage VRM 35 75 V DC Reverse Voltage VR 30 50 V Average rectified output Current Io 100 mA Power Dissipation Pd 300 mW Thermal Resistance,Junction to Ambient RθJA 417 ℃/W Junction temperature TJ 150 ℃ Storage temperature TSTG -55 to +150 ℃ Pb Lead-free
Surface mount switching diode MMBD2835/MMBD2836 C 0 6 6 www.gmesemi.com R e v . B 2 ELECTRICAL CHARACTERISTICS @ Ta=25℃ unless otherwise specified Parameter Symbol Min. Typ. Max. Unit Conditions Reverse Breandown Voltage V(BR) 35 IR=100uA MMBD2835 V(BR) 75 IR=100uA MMBD2836 Forward voltage VF1 0.72 1.0 V I R=10mA VF2 0.88 1.0 V I R=50mA VF3 1.0 1.2 V I F=100mA Reverse current IR 0.1 μA V R=30V MMBD2835 IR 0.1 μA V R=50V MMBD2836 Capacitance between terminals CT 4 pF V R=0,f=1MHz Reverse Recovery Time trr 2.5 4 ns IF=10mA,VR=6VIrr=0.1*IR, RL=100Ω TYPICAL CHARACTERISTICS @ Ta=25℃ unless otherwise specified
Surface mount switching diode MMBD2835/MMBD2836 C 0 6 6 www.gmesemi.com R e v . B 3 PACKAGE OUTLINE Plastic surface mounted package SOT-23 SOLDERING FOOTPRINT Unit : mm
PACKAGE INFORMATION
MMBD2835/MMBD2836 SOT-23 3000/Tape&Reel SOT-23 Dim Min Max A 2.70 3.10 B 1.10 1.50 C 1.0 Typical D 0.4 Typical E 0.35 0.48 G 1.80 2.00 H 0.02 0.1 J 0.1 Typical K 2.20 2.60 All Dimensions in mm A B C D E J H K G 0.90 0.80 2.00 0.95 0.95