MMBD1010LT1 ONSEMI | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 7
Technical content
© Semiconductor Components Industries, LLC, 2006 August, 2006 − Rev. 2
1 Publication Order Number:
Part of the GreenLine ™ Portfolio of devices with energy−conserving traits. This switching diode has the following features:
- Very Low Leakage (≤ 500 pA) promotes extended battery life by decreasing energy waste. Guaranteed leakage limit is for each diode in the pair contingent upon the other diode being in a non−forward−biased condition.
- Offered in four Surface Mount package types
- Available in 8 mm Tape and Reel in quantities of 3,000
Applications
- ESD Protection
- Reverse Polarity Protection
- Steering Logic
- Medium−Speed Switching MAXIMUM RATINGS Rating Symbol Value Unit Continuous Reverse Voltage VR 30 Vdc Peak Forward Current IF 200 mAdc Peak Forward Surge Current IFM (surge) 500 mA DEVICE MARKING MMBD1010LT1 = A5 MMBD2010T1 = DP MMBD3010T1 = XS THERMAL CHARACTERISTICS Characteristic Symbol Max Unit Total Device Dissipation FR-4 Board (1) TA = 25°C MMBD1010LT1, MMBD3010T1 MMBD2010T1 Derate above 25°C MMBD1010LT1, MMBD3010T1 MMBD2010T1 PD 225 150 1.8 1.2 mW mW/°C Thermal Resistance Junction to Ambient MMBD1010LT1, MMBD3010T1 MMBD2010T1 RθJA 556 833 °C/W Junction and Storage Temperature TJ, Tstg −55 to +150 °C (1) Device mounted on a FR-4 glass epoxy printed circuit board using the minimum recommended footprint. Preferred devices are Motorola recommended choices for future use and best overall value. http://onsemi.com CASE 318-08, STYLE 9 SOT-23 (TO-236AB) MMBD1010LT1 CASE 419-02, STYLE 5 SC−70/SOT−323 MMBD2010T1 CASE 318D-04, STYLE 3 SC−59 MMBD3010T1 CATHODE ANODE ANODE
in a non−forward−biased condition. Figure 1. Recovery Time Equivalent Test Circuit Notes: 1. A 2.0 kΩ variable resistor adjusted for a Forward Current (IF) of 10 mA. Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA.
http://onsemi.com MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process. mm inches 2.5-3.0 0.039 1.0 0.094 0.8 0.098-0.118 2.4 0.031 0.95 0.037 0.95 0.037 SOT−23 mm inches 0.037 0.95 0.037 0.95 0.079 2.0 0.035 0.9 0.031 0.8 SC−59 mm inches 0.035 0.9 0.075 0.7 1.9 0.028 0.65 0.025 0.65 0.025 SC−70/SOT−323 SOD −123 ÉÉÉÉ ÉÉÉÉ ÉÉÉÉ ÉÉÉÉ ÉÉÉÉ ÉÉÉÉ ÉÉÉÉ ÉÉÉÉ mm inches 0.91 0.036 1.22 0.048 2.36 0.093 4.19 0.165 POWER DISSIPATION FOR A SURFACE MOUNT DEVICE The power dissipation for a surface mount device is a function of the drain/collector pad size. These can vary from the minimum pad size for soldering to a pad size given for maximum power dissipati on. Power dissipation for a surface mount device is determined by T J(max) , the maximum rated junction temperature of the die, R θJA, the thermal resistance from the device junction to ambient, and the operating temperature, T A. Using the values provided on the data sheet, PD can be calculated as follows: PD = TJ(max) − TA RθJA The values for the equation are found in the maximum ratings table on the data sheet. Substituting these values into the equation for an ambient temperature T A of 25 °C, one can calculate the power dissipation of the device. For example, for a SOT−23 device, PD is calculated as follows. PD = 150°C − 25°C 556°C/W = 225 milliwatts The 556°C/W for the SOT−23 package assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 250 milliwatts. There are other alternatives to achieving higher power dissipation from the surface mount packages. One is to increase the area of the drain/collector pad. By increasing the area of the drain/collector pad, the power dissipation can be increased. Although the power dissipation can almost be doubled with this method, area is taken up on the printed circuit board which can defeat the purpose of using surface mount technology. Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal Clad ™. Using a board material such as Thermal Clad, an aluminum core board, the power dissipation can be doubled using the same footprint.
http://onsemi.com SOLDERING PRECAUTIONS The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected.
- Always preheat the device.
- The delta temperature between the preheat and soldering should be 100°C or less.*
- When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference should be a maximum of 10°C.
- The soldering temperature and time should not exceed 260°C for more than 10 seconds.
- When shifting from preheating to soldering, the maximum temperature gradient should be 5°C or less.
- After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress.
- Mechanical stress or shock should not be applied during cooling * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device. SOLDER STENCIL GUIDELINES Prior to placing surface mount components onto a printed circuit board, solder paste must be applied to the pads. A solder stencil is required to screen the optimum amount of solder paste onto the footprint. The stencil is made of brass or stainless steel with a typical thickness of 0.008 inches. The stencil opening size for the surface mounted package should be the same as the pad size on the printed circuit board, i.e., a 1:1 registration.
Tin Lead Silver with a melting point between 177 −189°C. components on the board are then heated by conduction. than the adjacent solder joints.
40 TO 80 SECONDS
Figure 2. Typical Solder Heating Profile
http://onsemi.com PACKAGE DIMENSIONS CASE 318−08 ISSUE AF SOT−23 (TO−236AB) STYLE 9: PIN 1. ANODE 2. ANODE 3. CATHODE D JK L A C B S H GV 1 2 DIM A MIN MAX MIN MAX MILLIMETERS 0.1102 0.1197 2.80 3.04 INCHES B 0.0472 0.0551 1.20 1.40 C 0.0350 0.0440 0.89 1.11 D 0.0150 0.0200 0.37 0.50 G 0.0701 0.0807 1.78 2.04 H 0.0005 0.0040 0.013 0.100 J 0.0034 0.0070 0.085 0.177 K 0.0140 0.0285 0.35 0.69 L 0.0350 0.0401 0.89 1.02 S 0.0830 0.1039 2.10 2.64 V 0.0177 0.0236 0.45 0.60 NOTES: /Em/figure1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. /Em/figure2. CONTROLLING DIMENSION: INCH. /Em/figure3. MAXIUMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. CASE 419−02 ISSUE H SC−70/SOT−323 STYLE 5: PIN 1. ANODE 2. ANODE 3. CATHODE C R N A L D G V S B H J K NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.071 0.087 1.80 2.20 B 0.045 0.053 1.15 1.35 C 0.035 0.049 0.90 1.25 D 0.012 0.016 0.30 0.40 G 0.047 0.055 1.20 1.40 H 0.000 0.004 0.00 0.10 J 0.004 0.010 0.10 0.25 K 0.017 REF 0.425 REF L 0.026 BSC 0.650 BSC N 0.028 REF 0.700 REF R 0.031 0.039 0.80 1.00 S 0.079 0.087 2.00 2.20 V 0.012 0.016 0.30 0.40 0.05 (0.002) CASE 318D−04 ISSUE F SC−59 STYLE 3: PIN 1. ANODE 2. ANODE 3. CATHODE S G H D C B L A J K DIM A MIN MAX MIN MAX INCHES 2.70 3.10 0.1063 0.1220 MILLIMETERS B 1.30 1.70 0.0512 0.0669 C 1.00 1.30 0.0394 0.0511 D 0.35 0.50 0.0138 0.0196 G 1.70 2.10 0.0670 0.0826 H 0.013 0.100 0.0005 0.0040 J 0.09 0.18 0.0034 0.0070 K 0.20 0.60 0.0079 0.0236 L 1.25 1.65 0.0493 0.0649 S 2.50 3.00 0.0985 0.1181 NOTES: /Em/figure1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. /Em/figure2. CONTROLLING DIMENSION: MILLIMETER.
http://onsemi.com ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5773−3850 MMBD1010LT1/D LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative GreenLine is a trademark of Motorola, Inc.