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Technical content

Features

  • 3mm x 5mm x 1.0mm LGA-14 Package
  • Low Current Consumption: 400 μA
  • Sleep Mode: 3 μA
  • Low Voltage Operation: 2.2 V – 3.6 V
  • High Sensitivity (800 mV/g @ 1.5g)
  • Selectable Sensitivity (±1.5g, ±6g)
  • Fast Turn On Time (0.5 ms Enable Response Time)
  • Self Test for Freefall Detect Diagnosis
  • 0g-Detect for Freefall Protection
  • Signal Conditioning with Low Pass Filter
  • Robust Design, High Shocks Survivability
  • RoHS Compliant
  • Environmentally Preferred Product
  • Low Cost Typical Applications
  • 3D Gaming: Tilt and Motion Sensing, Event Recorder
  • HDD MP3 Player: Freefall Detection
  • Laptop PC: Freefall Detection, Anti-Theft
  • Cell Phone: Image Stability, Text Scroll, Motion Dialing, eCompass
  • Pedometer: Motion Sensing
  • PDA: Text Scroll
  • Navigation and Dead Reckonin g: eCompass Tilt Compensation
  • Robotics: Motion Sensing

ORDERING INFORMATION

MMA7361LCT –40 to +85°C 1977-01 LGA-14 Tray MMA7361LCR1 –40 to +85°C 1977-01 LGA-14 7” Tape & Reel MMA7361LCR2 –40 to +85°C 1977-01 LGA-14 13” Tape & Reel MMA7361LC MMA7361LC: XYZ AXIS ACCELEROMETER ±1.5g, ±6g

14 LEAD

Figure 1. Pin Connections

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Figure 2. Simplified Accelerometer Functional Block Diagram

2000 V ESD protection circuitry, extra precaution must be

may be detrimental to its performance. Table 1. Maximum Ratings

  1. Dropped onto concrete surface from any axis.

Table 2. Operating Characteristics

0.7 VDD

  1. For a loaded output, the measurements are observed after an RC filter consisting of an internal 32 kΩ resistor and an external 3.3 nF capacitor

the minimum to filter out internal clock noise.

  1. These limits define the range of operation for which the part will meet specification.
  2. Within the supply range of 2.2 and 3.6 V, the device operates as a fully calibrated linear accelerometer. Beyond these supply limits the device

may operate as a linear device but is not guaranteed to be in calibration.

  1. This value is measured with g-Select in 1.5g mode.
  2. The device can measure both + and – acceleration. With no input acceleration the output is at midsupply. For positive acceleration the output

DD/2. For negative acceleration, the output will decrease below VDD/2.

  1. For optimal 0g offset performance, adhere to AN3484 and AN3447
  2. The response time between 10% of full scale V

DD input voltage and 90% of the final operating output voltage.

  1. The response time between 10% of full scale Sleep Mode input voltage and 90% of the final operating output voltage.
  2. The response time between 10% of the full scale self test input voltage and 90% of the self test output voltage.
  3. A measure of the device’s ability to reject an acceleration applied 90° from the true axis of sensitivity.

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integrated-circuit accelerometer. is a measure of acceleration. proportional to acceleration. Figure 3. Simplified Transducer Physical Model accelerometer at any time before or after installation. sections of the accelerometer are functioning. pull-down to keep it at that sensitivity (800 mV/g). in the analog to digital conversion process. Table 3. g-Select Pin Description

Figure 4. Pinout Description Figure 5. Accelerometer with Recommended Figure 6. Recommended PCB Layout for Interfacing

  1. Use 0.1 µF capacitor on VDD to decouple the power
  2. Physical coupling distance of the accelerometer to

the microcontroller should be minimal.

  1. Place a ground plane beneath the accelerometer to

all of the open ended terminals shown in Figure 6.

  1. Use a 3.3 nF capacitor on the outputs of the

switched capacitor filter circuit).

  1. PCB layout of power and ground should not couple
  2. Accelerometer and microcontroller should not be a
  3. A/D sampling rate and any external power supply

frequency). This will prevent aliasing errors. the measurement input impedance. Table 4. Pin Descriptions

1 N/C No internal connection

5 V SS Power Supply Ground

8 NC No internal connection

11 N/C Unused for factory trim

12 N/C Unused for factory trim

13 Self Test Input pin to initiate Self Test

14 N/C Unused for factory trim

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XOUT @ 0g = 1.65 V YOUT @ +1g = 2.45 V ZOUT @ 0g = 1.65 V XOUT @ +1g = 2.45 V YOUT @ 0g = 1.65 V ZOUT @ 0g = 1.65 V XOUT @ -1g = 0.85 V YOUT @ 0g = 1.65 V ZOUT @0 g=1 . 6 5V XOUT @ 0g = 1.65 V YOUT @ -1g = 0.85 V ZOUT @ 0g = 1.65 V Direction of Earth's gravity field.* Top View XOUT @ 0g = 1.65 V YOUT @ 0g = 1.65 V ZOUT @ -1g =0.85 V XOUT @ 0g = 1.65 V YOUT @ 0g = 1.65 V ZOUT @ +1g = 2.45 V Top Top Bottom Bottom 1 2 3 4 5 6 8 9 10 11 12 13 1 2 3 4 5 6 8 9 10 11 12 13 13 12 11 10 9 8 123456 14 7 1 2 3 4 5 6 8 9 10 11 12 13 Top View Side View+Y +X +Z-X -Z Top Bottom : Arrow indicates direction of package movement.14-Pin LGA Package 1 2 3 4 5 6 8 9 10 11 12 13 DYNAMIC ACCELERATION STATIC ACCELERATION * When positioned as shown, the Earth’s gravity will result in a positive 1g output.

Figure 7. MMA7361LC Temperature Coefficient of Offset (TCO) and

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MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS PCB Mounting Recommendations MEMS based sensors are sensitive to Printed Circuit Board (PCB) reflow processes. For optimal zero-g offset after PCB mounting, care must be taken to PCB layout and reflow conditions. Reference application note AN3484 for best practices to minimize the zero-g offset shift after PCB mounting. Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self-align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads. 6x2 12x1 14x0.9 14x0.6 10x0.8 1 13

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