MMA6260Q FREESCALE | Alldatasheet
Document overview
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Technical content
Features
High Sensitivity Low Noise Low Power 2.7 V to 3.6 V Operation 6mm x 6mm x 1.98mm QFN Integral Signal Conditioning with Low Pass Filter Linear Output Ratiometric Performance S e l f - T e s t Robust Design, High Shocks Survivability Typical Applications Tilt Monitoring Position & Motion Sensing Freefall Detection Impact Monitoring Appliance Control Vibration Monitoring and Recording Smart Portable Electronics
ORDERING INFORMATION
Response IDD Case No. Package MMA6260Q 50 Hz 1.2 mA 1477-02 QFN-16, Tube MMA6260QR2 50 Hz 1.2 mA 1477-02 QFN-16,Tape & Reel MMA6261Q 300 Hz 1.2 mA 1477-02 QFN-16, Tube MMA6261QR2 300 Hz 1.2 mA 1477-02 QFN-16,Tape & Reel MMA6262Q 150 Hz 2.2 mA 1477-02 QFN-16,Tube MMA6262QR2 150 Hz 2.2 mA 1477-02 QFN-16,Tape & Reel MMA6263Q 900 Hz 2.2 mA 1477-02 QFN-16, Tube MMA6263QR2 900 Hz 2.2 mA 1477-02 QFN-16,Tape & Reel MMA6260Q MMA6261Q MMA6262Q MMA6263Q MMA6260Q Series: X-Y AXIS SENSITIVITY MICROMACHINED ACCELEROMETER ±1.5 g 16-LEAD QFN CASE 1477-02 Top View Figure 1. Pin Connections
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detrimental to its performance. Figure 2. Simplified Accelerometer Functional Block Diagram Table 1. Maximum Ratings
- Dropped onto concrete surface from any axis.
Table 2. Operating Characteristics
- For a loaded output, the measurements are observed after an RC filter consisting of a 1.0 k Ω resistor and a 0.1 µF capacitor to ground.
- These limits define the range of operation fo r which the part will meet specification.
- Within the supply range of 2.7 and 3.6 V, the device operates as a fully calibrated linear accelerometer. Beyond these supply limits the device
may operate as a linear device but is not guaranteed to be in calibration.
- The device can measure both + and acceleration. With no input acceleration the output is at midsupply. For positive acceleration the output
will increase above VDD/2. For negative acceleration, the output will decrease below VDD/2.
- The digital input pin has an internal pul l-down resistance to prevent inadvertent self-test initiation due to external board level leakages.
- Time for the output to reach 90% of its final value after a self-test is initiated.
- Preserves phase margin (60°) to guarantee output amplifier stability.
- A measure of the devices ability to reject an acce leration applied 90° from the true axis of sensitivity.
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integrated-circuit accelerometer. is a measure of acceleration. proportional to acceleration. capacitors) to set the cut-off frequency. is applied across the self-test plate and the moveable plate. Self-test is disabled when EEPROM parity error occurs. in the analog to digital conversion process. Figure 3. Transducer Figure 4. Equivalent
Figure 4. Pinout Description Figure 5. Accelerometer with Recommended Figure 6. Recommend PCB Layout for Interfacing
- Use 0.1 µF capacitor on VDD to decouple the power
- Physical coupling distance of the accelerometer to the
microcontroller should be minimal.
- Flag underneath package is connected to ground.
- Place a ground plane beneath the accelerometer to
all of the open ended terminals shown in Figure 6.
- Use an RC filter with 1.0 kΩ and 0.1 µF on the outputs
switched capacitor filter circuit).
- PCB layout of power and ground should not couple
- Accelerometer and microcontroller should not be a
- A/D sampling rate and any external power supply
- PCB layout should not run traces or vias under the
1, 5 7, 13, 16 N/C No internal connection. 14 Y OUT Output voltage of the accelerometer. 15 X OUT Output voltage of the accelerometer. 4V SS The power supply ground. 2, 8 11 N/C Used for factory trim.
12 ST Logic input pin used to initiate
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Direction of Earths gravity field(1) XOUT @ 0g = 1.65 V YOUT @ -1g = 0.85 V XOUT @ -1g = 0.85 V YOUT @ 0g = 1.65 V XOUT @ +1g = 2.45 V YOUT @ 0g = 1.65 V 1. When positioned as shown, the Earths gravity will result in a positive 1g output. 1516 14 13 5678 Top View 16-Pin QFN Package XOUT @ 0g = 1.65 V YOUT @ +1g = 2.45 V Top View
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self-align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads. 0.50 6.0 Solder areasPin 1 ID (non metallic) 912 4.25 6.0 1.00 0.55 Flag Non-Solder areas
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