MMA6260Q MOTOROLA | Alldatasheet
Document overview
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Technical content
Features
- High Sensitivity
- Low Noise
- Low Power
- 2.7 V to 3.6 V Operation
- 6mm x 6mm x 1.98 mm QFN
- Integral Signal Conditioning with Low Pass Filter
- Linear Output
- Ratiometric Performance
- S e l f - T e s t
- Robust Design, High Shocks Survivability Typical Applications
- Tilt Monitoring
- Position & Motion Sensing
- Freefall Detection
- Impact Monitoring
- Appliance Control
- Vibration Monitoring and Recording
- Smart Portable Electronics
ORDERING INFORMATION
Response IDD Case No. Package MMA6260Q 50 Hz 1.2 mA 1477-01 QFN-16, Tube MMA6260QR2 50 Hz 1.2 mA 1477-01 QFN-16,Tape & Reel MMA6261Q 300 Hz 1.2 mA 1477-01 QFN-16, Tube MMA6261QR2 300 Hz 1.2 mA 1477-01 QFN-16,Tape & Reel MMA6262Q 150 Hz 2.2 mA 1477-01 QFN-16,Tube MMA6262QR2 150 Hz 2.2 mA 1477-01 QFN-16,Tape & Reel MMA6263Q 900 Hz 2.2 mA 1477-01 QFN-16, Tube MMA6263QR2 900 Hz 2.2 mA 1477-01 QFN-16,Tape & Reel MMA6260Q Series: X-Y AXIS SENSITIVITY MICROMACHINED ACCELEROMETER ±1.5 g Bottom View N/C N/C VDD VSS N/C N/C N/C N/C N/C N/C N/C N/C 16 15 14 756 8 ST XOUT YOUT N/C Pin Assignment MMA6260Q MMA6261Q MMA6262Q MMA6263Q
16 LEAD QFN
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Figure 1. Simplified Accelerometer Functional Block Diagram can alter the performance or cause failure of the chip. discharges which may be detrimental to its performance.
- Dropped onto concrete surface from any axis.
Unless otherwise noted: -20°C < TA < 85°C, 3.0 V < VDD < 3.6 V, Acceleration = 0g, Loaded output1 Characteristic Symbol Min Typ Max Unit Operating Range2 Supply Voltage3 VDD 2.7 3.3 3.6 V Supply Current MMA6260Q, MMA6261Q IDD —1 . 2 1 . 5 m A MMA6262Q, MMA6263Q IDD —2 . 2 3 . 0 m A Operating Temperature Range TA -20 — +85 °C Acceleration Range gFS —1 . 5 — g Output Signal Zero g (TA = 25°C, VDD = 3.3 V)4 VOFF 1.485 1.65 1.815 V Zero g VOFF, TA — 2.0 — mg/°C Sensitivity (TA = 25°C, VDD = 3.3 V) S 740 800 860 mV/g Sensitivity S, TA — 0.015 — %/°C Bandwidth Response MMA6260Q f _3dB —5 0 — H z MMA6261Q f_3dB —3 0 0 — H z MMA6262Q f_3dB —1 5 0 — H z MMA6263Q f_3dB —9 0 0 — H z Nonlinearity NLOUT -1.0 — +1.0 % FSO Noise MMA6260Q RMS (0.1 Hz – 1 kHz) nRMS —1 . 8 — m V r m s MMA6261Q RMS (0.1 Hz – 1 kHz) nRMS —3 . 5 — MMA6262Q RMS (0.1 Hz – 1 kHz) nRMS —1 . 3 — MMA6263Q RMS (0.1 Hz – 1 kHz) nRMS —2 . 5 — Power Spectral Density RMS (0.1 Hz – 1 kHz) MMA6260Q, MMA6261Q n PSD —3 0 0 — u g / √Hz MMA6262Q, MMA6263Q nPSD —2 0 0 — Self-Test Output Response VST 0.9 VDD — VDD V Input Low VIL —— 0.3 VDD V Input High VIH 0.7 VDD — VDD V Pull-Down Resistance5 RPO 43 57 71 k Ω Response Time6 tST —2 . 0 — m s Output Stage Performance Full-Scale Output Range (IOUT = 200 µA) V FSO VSS +0.25 — VDD -0.25 V Capacitive Load Drive7 CL ——1 0 0 p F Output Impedance ZO —5 03 0 0 Ω Power-Up Response Time MMA6260Q tRESPONSE —1 4 — m s MMA6261Q tRESPONSE —2 . 0 — m s MMA6262Q tRESPONSE —4 . 0 — m s MMA6263Q tRESPONSE —0 . 7 — m s Mechanical Characteristics Transverse Sensitivity8 VZX, YX, ZY -5.0 — +5.0 % FSO Notes: 1. For a loaded output, the measurements are observed after an RC filter consisting of a 1.0 kΩ resistor and a 0.1 µF capacitor to ground. 2. These limits define the range of operation for which the part will meet specification. 3. Within the supply range of 2.7 and 3.6 V, the device operates as a fully calibrated linear accelerometer. Beyond these supply limits the device may operate as a linear device but is not guaranteed to be in calibration. 4. The device can measure both + and - acceleration. With no input acceleration the output is at midsupply. For positive acceleration the output will increase above V DD/2. For negative acceleration, the output will decrease below VDD/2. 5. The digital input pin has an internal pull-down resistance to prevent inadvertent self-test initiation due to external board level leakages. 6. Time for the output to reach 90% of its final value after a self-test is initiate. 7. Preserves phase margin (60°) to guarantee output amplifier stability. 8. A measure of the device’s ability to reject an acceleration applied 90° from the true axis of sensitivity.
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micromachined integrated-circuit accelerometer. position by subjecting the system to an acceleration (Figure 2). Figure 2. Simplified Transducer Physical Model pacitors) to set the cut-off frequency. static force (Fe = 1/2 AV2/d2) causes the center plate to deflect. the accelerometer are functioning. Self-test is disabled when EEPROM parity error occurs.
Figure 3. Pinout Description Figure 4. Accelerometer with Recommended Connection Figure 5. Recommend PCB Layout for Interfacing
- Use 0.1 µF capacitor on V DD to decouple the power
- Physical coupling distance of the accelerometer to the
microcontroller should be minimal.
- Flag underneath package is connected to ground.
- Place a ground plane beneath the accelerometer to
of the open ended terminals shown in Figure 5.
- Use an RC filter with 1.0 k Ω and 0.1 µF on the outputs of
switched capacitor filter circuit).
- PCB layout of power and ground should not couple power
- Accelerometer and microcontroller should not be a high
- A/D sampling rate and any external power supply
Description
1, 5 - 7, 13, 16 N/C No internal connection. Leave unconnected. 14 Y OUT Output voltage of the accelerometer. Y Direction. 15 X OUT Output voltage of the accelerometer. X Direction. 3V DD Power supply input. 4V SS The power supply ground. 2, 8 - 11 N/C Used for factory trim. Leave unconnected.
12 ST Logic input pin used to initiate
self-test. BASIC CONNECTIONS Top View N/C N/C VDD VSS N/C N/C N/C N/C N/C N/C N/C N/C 16 15 14 756 8 ST XOUT YOUT N/C MMA6260Q Series ST VDD VSS 0.1 µF VDD 0.1 µF 0.1 µF Logic Input XOUT YOUT 1 kΩ 1 kΩ A/D IN VRH VSS VDD ST YOUT VSS VDD 0.1 µF1 kΩ 0.1 µF 0.1 µF POWER SUPPLY 0.1 µF A/D INXOUT 0.1 µF1 kΩ MICROCONTROLLER ACCELEROMETER C C C R R C C
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Direction of Earth's gravity field.* * When positioned as shown, the Earth's gravity will result in a positive 1g output Top View XOUT @ 0g = 1.65V YOUT @ -1g = 0.85V XOUT @ -1g = 0.85V YOUT @ 0g = 1.65V XOUT @ 0g = 1.65V YOUT @ +1g = 2.45V XOUT @ +1g = 2.45V YOUT @ 0g = 1.65V DYNAMIC ACCELERATION STATIC ACCELERATION 16-Pin QFN Package +X -X 56 8 16 15 14 13 Top View
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packag- es must be the correct size to ensure proper solder con- nection interface between the board and the package. With the correct fo otprint, the packag es will self-align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads. CASE 1477-01 ISSUE O NOTES: ALL DIMENSIONS ARE IN MILLIMETERS. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. THIS DIMENSION APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.25MM AND 0.30MM FROM TERMINAL TIP. THIS DIMENSION REPRESENTS TERMINAL FULL BACK FROM PACKAGE EDGE UP TO 0.1MM IS ACCEPTABLE. COPLANARITY APPLIES TO THE EXPOSED HEAT SLUG AS WELL AS THE TERMINAL. RADIUS ON TERMINAL IS OPTIONAL. (45˚)16X 0.1 DETAIL M PIN 1 INDEX AREA B C0.15 C0.15 G M M (0.203) C0.1 C0.08 C SEATING PLANE DETAIL G VIEW ROTATED 90˚ CLOCKWISE (1) (0.5) (0.102) 1.98+0.1 EXPOSED DIE ATTACH PAD 12X M0.1 C M0.05 C A B 16X 0.63 0.43 C0.1 A B VIEW M-M DETAIL M PIN 1 INDEX C0.1 A B 16X 0.60 0.40 4.24 4.04 4.24 4.04 0.5 Pin 1 ID (non metallic) 1 4 12 9 5 8 16 13 Solder areas 0.50 0.55 1.00 4.25 6.0 6.0 Pin 1 ID (non metallic) 1 4 12 9 5 8 16 13 Solder areas 0.50 0.55 1.00 4.25 6.0 6.0
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